CN212874470U - IC chip suction nozzle - Google Patents
IC chip suction nozzle Download PDFInfo
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- CN212874470U CN212874470U CN202022108766.5U CN202022108766U CN212874470U CN 212874470 U CN212874470 U CN 212874470U CN 202022108766 U CN202022108766 U CN 202022108766U CN 212874470 U CN212874470 U CN 212874470U
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- suction nozzle
- lip
- nozzle body
- bottom plate
- chip
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Abstract
The utility model discloses a IC chip suction nozzle, adsorb the mouth including connecting piece, bottom plate, suction nozzle body and lip, the bottom plate is located on the connecting piece, the suction nozzle body is located on the bottom plate, the lip adsorbs the mouth and locates on the suction nozzle body, be equipped with vacuum channel in the connecting piece, be equipped with the water conservancy diversion passageway in the bottom plate, be equipped with the equal flow chamber in the suction nozzle body, water conservancy diversion passageway both ends respectively with vacuum channel with flow equalize the chamber intercommunication, the lip adsorbs the mouth and flow equalizes the chamber intercommunication, the lip adsorbs the mouth and forms half isolation cavity. The utility model relates to a IC chip processing technology field specifically is to provide a lip adsorption nozzle that special triangle-shaped hollow structure is adopted in cross-section, only with the IC chip suction nozzle of the very little area of IC chip surface contact when adsorbing.
Description
Technical Field
The utility model relates to a IC chip processing technology field specifically indicates an IC chip suction nozzle.
Background
The chip suction nozzle is used for adsorbing a chip and is matched with relevant movement to realize the movement of the chip. The traditional chip suction nozzle can be contacted with a large-area surface of a chip when adsorbing the chip, and the contact mode has the main problems that 1) the surface of the chip is easy to damage; 2) contamination of the chip surface can occur.
SUMMERY OF THE UTILITY MODEL
To the above situation, for overcoming prior art's defect, the utility model provides a lip adsorption nozzle that special triangle-shaped hollow structure is adopted in the cross-section, only with the IC chip suction nozzle of the very little area of IC chip surface contact when adsorbing.
The utility model adopts the following technical scheme: the utility model relates to a IC chip suction nozzle, adsorb the mouth including connecting piece, bottom plate, suction nozzle body and lip, the bottom plate is located on the connecting piece, the suction nozzle body is located on the bottom plate, the lip adsorbs the mouth and locates on the suction nozzle body, be equipped with vacuum channel in the connecting piece, be equipped with the water conservancy diversion passageway in the bottom plate, be equipped with the flow equalizing chamber in the suction nozzle body, water conservancy diversion passageway both ends communicate with vacuum channel and flow equalizing chamber respectively, the lip adsorbs the mouth and communicates with the flow equalizing chamber, the lip adsorbs the mouth and forms half isolation cavity.
Furthermore, the connecting piece is connected with external vacuum generator, and when vacuum generator worked, through taking out from the air and forming the negative pressure adsorption affinity in lip adsorption nozzle formed half isolation cavity, can adsorb the IC chip on lip adsorption nozzle, compare in traditional suction nozzle, lip adsorption nozzle and IC chip surface area of contact are littleer, and is extremely low to IC chip surface damage and pollution.
Furthermore, the cross section of the suction nozzle body is arranged in a triangular structure, and the lip-shaped adsorption nozzle is arranged at the top angle of the suction nozzle body.
Adopt above-mentioned structure the utility model discloses the beneficial effect who gains as follows: this scheme utilizes the special construction of lip adsorption nozzle to form half isolation cavity, forms the negative pressure adsorption affinity under the vacuum effect, can adsorb the IC chip on the lip adsorption nozzle, compares in traditional suction nozzle, and lip adsorption nozzle is littleer with IC chip surface area of contact, and is extremely low to IC chip surface damage and pollution.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic view of the overall structure of an IC chip suction nozzle of the present invention;
FIG. 2 is a front view of the IC chip suction nozzle of the present invention;
FIG. 3 is a side view of the IC chip suction nozzle of the present invention;
fig. 4 is a usage status diagram of the IC chip suction nozzle of the present invention.
The vacuum suction nozzle comprises a suction nozzle body, a connecting piece, a bottom plate, a base plate, a suction nozzle body, a lip-shaped suction nozzle, a vacuum channel, a flow guide channel, a flow equalizing cavity, a semi-isolation cavity and a vacuum channel, wherein the suction nozzle body comprises a connecting piece 1, a connecting piece 2, a bottom plate 3, a suction nozzle body 4, a lip-shaped suction nozzle 5, a.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments; based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
As shown in fig. 1-4, the utility model relates to a IC chip suction nozzle, adsorb mouth 4 including connecting piece 1, bottom plate 2, suction nozzle body 3 and lip, bottom plate 2 is located on the connecting piece 1, suction nozzle body 3 is located on bottom plate 2, lip adsorb mouth 4 is located on suction nozzle body 3, be equipped with vacuum channel 5 in the connecting piece 1, be equipped with water conservancy diversion passageway 6 in the bottom plate 2, be equipped with flow equalizing chamber 7 in the suction nozzle body 3, 6 both ends of water conservancy diversion passageway communicate with vacuum channel 5 and flow equalizing chamber 7 respectively, lip adsorb mouth 4 and flow equalizing chamber 7 intercommunication, lip adsorb mouth 4 forms half isolation cavity 8.
The connecting piece 1 is connected with an external vacuum generator and works when the vacuum generator works. The section of the suction nozzle body 3 is in a triangular structure, and the lip-shaped adsorption nozzle 4 is arranged at the vertex angle of the suction nozzle body 3.
When the vacuum generator works, negative pressure adsorption force is formed in the semi-isolation cavity 8 formed by the lip-shaped adsorption nozzle 4 through air pumping, and the IC chip can be adsorbed on the lip-shaped adsorption nozzle 4.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (3)
1. An IC chip suction nozzle, characterized in that: including connecting piece, bottom plate, suction nozzle body and lip absorption mouth, the bottom plate is located on the connecting piece, the suction nozzle body is located on the bottom plate, the lip absorption mouth is located on the suction nozzle body, be equipped with vacuum channel in the connecting piece, be equipped with the water conservancy diversion passageway in the bottom plate, be equipped with the flow equalizing chamber in the suction nozzle body, water conservancy diversion passageway both ends communicate with vacuum channel and flow equalizing chamber respectively, the lip absorption mouth communicates with the flow equalizing chamber, the lip absorption mouth forms half isolation cavity.
2. The IC chip suction nozzle according to claim 1, wherein: the connecting piece is connected with an external vacuum generator.
3. The IC chip suction nozzle according to claim 1, wherein: the suction nozzle body cross-section is the triangle-shaped structure setting, the apex angle department of suction nozzle body is located to the lip adsorption nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022108766.5U CN212874470U (en) | 2020-09-23 | 2020-09-23 | IC chip suction nozzle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022108766.5U CN212874470U (en) | 2020-09-23 | 2020-09-23 | IC chip suction nozzle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212874470U true CN212874470U (en) | 2021-04-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022108766.5U Active CN212874470U (en) | 2020-09-23 | 2020-09-23 | IC chip suction nozzle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212874470U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115849011A (en) * | 2023-01-04 | 2023-03-28 | 西安策士测试技术有限公司 | IC chip suction mechanism and suction method |
-
2020
- 2020-09-23 CN CN202022108766.5U patent/CN212874470U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115849011A (en) * | 2023-01-04 | 2023-03-28 | 西安策士测试技术有限公司 | IC chip suction mechanism and suction method |
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