CN112809729A

CN112809729A - Arm clamping mechanism of wafer

Info

Publication number: CN112809729A
Application number: CN202110144325.7A
Authority: CN
Inventors: 钟敏
Original assignee: Shanghai Lieth Precision Equipment Co ltd
Current assignee: Shanghai Lieth Precision Equipment Co ltd
Priority date: 2021-02-02
Filing date: 2021-02-02
Publication date: 2021-05-18
Anticipated expiration: 2041-02-02
Also published as: CN112809729B

Abstract

The invention discloses an arm clamping mechanism of a wafer, which relates to the technical field of semiconductors and comprises a chassis, a mounting seat, driving mechanisms, clamping arms, a wafer buffer module and a first sliding block, wherein two clamping arms are symmetrically arranged on one side of the chassis, a wafer clamping groove is formed between the two clamping arms, the first sliding block is further arranged on one side of the chassis, a first sliding groove is formed in one end of each clamping arm, the first sliding block is arranged in the first sliding groove, the mounting seat is further arranged on one side of the chassis and positioned at the upper ends of the two clamping arms, the two driving mechanisms are arranged in the mounting seat, each driving mechanism can respectively drive one clamping arm to move along the length direction of the first sliding block, and the wafer buffer module is respectively arranged inside each clamping arm. According to the wafer clamping device, the action force in the horizontal direction of the wafer can be buffered in the process of clamping the wafer, and the phenomenon that the wafer is cracked due to the fact that the action force of the clamping arm on the wafer is too large can be prevented.

Description

Arm clamping mechanism of wafer

Technical Field

The invention relates to the technical field of semiconductors, in particular to an arm clamping mechanism for a wafer.

Background

In a conventional wafer defect inspection machine, a robot arm is often used to transfer a wafer (wafer), and the wafer is turned over to inspect whether the wafer is abnormal. For this reason, the robot arm needs to have high reliability.

Most of the existing mechanical arms adsorb and fix the wafer through vacuum, and the wafer is turned over by controlling the turning angle. However, the reliability of vacuum adsorption is difficult to be well guaranteed, and if vacuum loss or collision occurs, the wafer is easy to fall off, and wafer fragments, scratches and the like are caused.

Disclosure of Invention

The present invention is directed to a wafer arm clamping mechanism, which is used to solve the above-mentioned problems.

The technical scheme adopted by the invention is as follows:

the utility model provides an arm fixture of wafer, includes chassis, mount pad, actuating mechanism, centre gripping arm, wafer buffer module and first sliding block, wherein, one side on chassis is equipped with two symmetrically centre gripping arm, two form a wafer centre gripping groove between the centre gripping arm, one side on chassis still is equipped with first sliding block, each a first spout has been seted up respectively to the one end of centre gripping arm, first sliding block is located in the first spout, one side on chassis still is equipped with the mount pad, just the mount pad is located two the upper end of centre gripping arm, be equipped with two in the mount pad actuating mechanism, each actuating mechanism can drive one respectively the centre gripping arm is followed the length direction of first sliding block removes, each the inside of centre gripping arm is equipped with one respectively wafer buffer module.

Preferably, the clamping device further comprises second sliding blocks, one second sliding block is arranged on the upper side of one end of each clamping arm, a second sliding groove is formed in the lower end of the mounting seat, and each second sliding block is arranged in the second sliding groove.

Preferably, each of the clamping arms is provided with an installation groove, the installation groove is formed from one side of the clamping arm in the width direction to the other side of the clamping arm in the width direction, and the wafer buffering module is arranged in the installation groove.

Preferably, the wafer buffer device further comprises pins, the other end of each clamping arm is provided with one pin, each wafer buffer module is fixed in the mounting groove through the pin, and each wafer buffer module can rotate around one pin.

As a further preferred feature, each of the wafer buffer modules includes:

the rigid plate is arranged in the mounting groove, one end of the rigid plate is connected with the clamping arm through the pin, the interior of the rigid plate is of a hollow structure, and a notch is formed in one side, close to the wafer clamping groove, of the rigid plate;

the rubber is arranged inside the rigid plate, and one side of the rubber protrudes out of the notch;

and the other end of the rigid plate is connected with the inner wall of the mounting groove through the reset spring.

As further preferred, still include fixed block and solid fixed ring, wherein, one side of the other end of hard board is equipped with the fixed block, on the fixed block and on the mounting groove inner wall with fixed team just relative position is equipped with one respectively gu fixed ring, two are connected at reset spring's both ends gu fixed ring.

Preferably, one side of the rubber is provided with a clamping groove.

Preferably, the hard plate further comprises a limiting block, and the other side of the other end of the hard plate is provided with the limiting block.

The technical scheme has the following advantages or beneficial effects:

according to the wafer clamping device, the driving mechanism drives the two clamping arms to clamp the wafer, and the wafer buffering module can buffer the acting force of the wafer in the horizontal direction in the process of clamping the wafer, so that the phenomenon that the wafer is cracked due to the fact that the acting force of the clamping arms on the wafer is too large can be prevented, meanwhile, the wafer can be protected, and the phenomenon that the clamping arms wear the outer edge of the wafer can be prevented.

Drawings

FIG. 1 is a schematic view of a wafer clamping mechanism of the present invention;

FIG. 2 is a schematic structural view of the base pan of the present invention;

FIG. 3 is a schematic view of the structure of the clamp arm of the present invention;

FIG. 4 is a schematic structural diagram of a wafer buffer module according to the present invention;

fig. 5 is a schematic view of the internal structure of the clamp arm in the present invention.

In the figure: 1. a chassis; 2. a mounting seat; 3. a clamp arm; 4. a wafer buffer module; 401. a hard plate; 402. rubber; 403. a return spring; 404. a fixed block; 405. a fixing ring; 406. a clamping groove; 407. a limiting block; 5. a first slider; 6. a wafer clamping groove; 7. a first chute; 8. a second slider; 9. a second chute; 10. mounting grooves; 11. a pin.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that, as the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. appear, their indicated orientations or positional relationships are based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" as appearing herein are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" should be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

FIG. 1 is a schematic view of a wafer clamping mechanism of the present invention; FIG. 2 is a schematic structural view of the base pan of the present invention; FIG. 3 is a schematic view of the structure of the clamp arm of the present invention; FIG. 4 is a schematic structural diagram of a wafer buffer module according to the present invention; fig. 5 is a schematic diagram of an internal structure of a clamping arm according to the present invention, please refer to fig. 1 to 5, which illustrate a preferred embodiment of a wafer arm clamping mechanism, including a chassis 1, a mounting seat 2, a driving mechanism, clamping arms 3, a wafer buffer module 4, and a first sliding block 5, wherein two clamping arms 3 are symmetrically disposed on one side of the chassis 1, a wafer clamping slot 6 is formed between the two clamping arms 3, the first sliding block 5 is further disposed on one side of the chassis 1, a first sliding slot 7 is respectively disposed on one end of each clamping arm 3, the first sliding block 5 is disposed in the first sliding slot 7, the mounting seat 2 is further disposed on one side of the chassis 1, the mounting seat 2 is disposed at the upper end of the two clamping arms 3, two driving mechanisms are disposed in the mounting seat 2, each driving mechanism can respectively drive one clamping arm 3 to move along the length direction of the first sliding block 5, a wafer buffer module 4 is disposed inside each of the holding arms 3. In this embodiment, the first sliding block 5 is matched with the first sliding groove 7 to fix the clamping arms 3, and the driving mechanism is used for driving the clamping arms 3 to move, so as to drive the two clamping arms 3 to clamp the wafer. The driving mechanism in this embodiment may adopt a linear motor to cooperate with the lead screw, and the linear motor drives the lead screw, so that the lead screw drives the clamping arm 3 to move. When the two clamping arms 3 clamp the wafer, the outer edge of the wafer can abut against the wafer buffer module 4, the wafer buffer module 4 can move on the clamping arms 3, the action force in the horizontal direction of the wafer can be buffered, the wafer fragmentation phenomenon caused by the overlarge clamping force of the two clamping arms 3 can be prevented, and meanwhile, the wafer buffer module 4 and the part of the wafer in contact are made of elastic materials, so that the abrasion phenomenon of the outer edge of the wafer can be prevented.

Further, as a preferred embodiment, the clamping device further includes second sliding blocks 8, the upper side of one end of each clamping arm 3 is provided with one second sliding block 8, the lower end of the mounting seat 2 is provided with a second sliding groove 9, and each second sliding block 8 is arranged in the second sliding groove 9. In this embodiment, as shown in fig. 1, the second sliding block 8 is matched with the second sliding groove 9, and the first sliding block 5 is matched with the second sliding groove 9, so that the stability of the clamping arm 3 in the moving process can be improved, and the situation of shaking of the clamping arm 3 can be prevented.

Further, as a preferred embodiment, each of the clamping arms 3 is provided with a mounting groove 10, the mounting groove 10 is formed from one side of the clamping arm 3 in the width direction to the other side of the clamping arm 3 in the width direction, and the wafer buffer module 4 is disposed in the mounting groove 10. In this embodiment, as shown in fig. 3, a certain distance is provided between the lower inner wall of the mounting groove 10 and the lower surface of the holding arm 3. As shown in fig. 3, the width direction of the clamp arm 3 is the Y-axis direction of the clamp arm 3.

Further, as a preferred embodiment, the wafer buffer module further includes pins 11, the other end of each of the holding arms 3 is respectively provided with a pin 11, each of the wafer buffer modules 4 is respectively fixed in the mounting groove 10 through the pin 11, and each of the wafer buffer modules 4 can rotate around a pin 11. In this embodiment, the wafer buffering module 4 can rotate in the mounting groove 10, and when the wafer buffering module 4 holds the wafer, the wafer buffering module 4 receives the acting force transmitted from the wafer, so that the wafer buffering module 4 rotates in the mounting groove 10. It is worth noting that the wafer buffer module 4 is always in contact with the wafer during the rotation.

Further, as a preferred embodiment, each wafer buffer module 4 includes:

the rigid plate 401 is arranged in the mounting groove 10, one end of the rigid plate 401 is connected with the clamping arm 3 through a pin 11, the interior of the rigid plate 401 is of a hollow structure, and a notch is formed in one side, close to the wafer clamping groove 6, of the rigid plate 401;

the rubber 402 is arranged inside the rigid plate 401, and one side of the rubber 402 protrudes out of the notch; one side of the rubber 402 in this embodiment is flush with or slightly protruding from the notch. A rigid plate 401 is used to mount the rubber 402.

And a return spring 403, and the other end of the rigid plate 401 is connected to the inner wall of the mounting groove 10 through a return spring 403. The return spring 403 is used to return the rigid plate 401, and when the wafer is dropped, the rigid plate 401 returns to the original position by the return spring 403.

Further, as a preferred embodiment, the fixing device further includes a fixing block 404 and a fixing ring 405, wherein the fixing block 404 is disposed on one side of the other end of the rigid plate 401, the fixing ring 405 is disposed on the fixing block 404 and the inner wall of the mounting groove 10 at positions opposite to the fixing member, respectively, and two ends of the return spring 403 are connected to the two fixing rings 405.

Further, as a preferred embodiment, a clamping groove 406 is formed on one side of the rubber 402. In this embodiment, the clamping groove 406 is configured to clamp the outer edge of the wafer, wherein the width of the clamping groove 406 is slightly smaller than the thickness of the outer edge of the wafer.

Further, as a preferred embodiment, the hard plate further includes a stop block 407, and the other side of the other end of the hard plate 401 is provided with the stop block 407. In this embodiment, stopper 407 is used for preventing that hard board 401 from to being close to 6 orientation salient in mounting groove 10 of wafer clamping groove, through setting up stopper 407, can make hard board 401 be close to one side of wafer clamping groove 6 and one side that mounting groove 10 is close to wafer clamping groove 6 flush, the centre gripping wafer of being convenient for.

While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.

Claims

1. The utility model provides an arm fixture of wafer, its characterized in that, includes chassis, mount pad, actuating mechanism, centre gripping arm, wafer buffer module and first sliding block, wherein, one side on chassis is equipped with two symmetrically centre gripping arm, two form a wafer centre gripping groove between the centre gripping arm, one side on chassis still is equipped with first sliding block, each a first spout has been seted up respectively to the one end of centre gripping arm, first sliding block is located in the first spout, one side on chassis still is equipped with the mount pad, just the mount pad is located two the upper end of centre gripping arm, be equipped with two in the mount pad actuating mechanism, each actuating mechanism can drive one respectively the centre gripping arm is followed the length direction of first spout removes, each the inside of centre gripping arm is equipped with one respectively wafer buffer module.

2. An arm holding mechanism for wafers as claimed in claim 1, further comprising second sliding blocks, wherein one of said second sliding blocks is disposed on an upper side of one end of each of said holding arms, and a second sliding groove is disposed on a lower end of said mounting seat, and each of said second sliding blocks is disposed in said second sliding groove.

3. The wafer arm clamping mechanism of claim 1, wherein each clamping arm is formed with a mounting slot extending from one side of the clamping arm in the width direction to the other side of the clamping arm in the width direction, and the wafer cushion module is disposed in the mounting slot.

4. The wafer arm clamping mechanism of claim 1, further comprising pins, wherein one pin is disposed at the other end of each clamping arm, each wafer cushion module is fixed in the mounting groove by the pins, and each wafer cushion module can rotate around one pin.

5. The wafer handling mechanism of claim 4, wherein each wafer buffer module comprises:

6. The wafer arm clamping mechanism as claimed in claim 5, further comprising a fixing block and a fixing ring, wherein the fixing block is disposed on one side of the other end of the rigid plate, the fixing ring is disposed on the fixing block and on the inner wall of the mounting groove at a position opposite to the fixing member, and two ends of the return spring are connected to the fixing rings.

7. The wafer handling mechanism of claim 5, wherein a clamping groove is formed on one side of the rubber.

8. An arm holding mechanism for a wafer as claimed in claim 5, further comprising a stopper, wherein the other side of the other end of the rigid plate is provided with the stopper.