CN217822727U

CN217822727U - Wafer manipulator

Info

Publication number: CN217822727U
Application number: CN202221342480.6U
Authority: CN
Inventors: 蔡跃祥; 李辉; 高炳程; 刘东辉; 李振果; 张堂令; 谢洪喜; 王永忠
Original assignee: Xiamen Hongtai Intelligent Manufacturing Co Ltd
Current assignee: Xiamen Hongtai Intelligent Manufacturing Co Ltd
Priority date: 2022-05-31
Filing date: 2022-05-31
Publication date: 2022-11-15
Anticipated expiration: 2032-05-31

Abstract

The utility model discloses a wafer manipulator, it relates to manipulator technical field, and it includes control base, supporting disk, two first linking arms, two second linking arms, two third linking arms, goes up the arm lock, lower arm lock, the supporting disk sets up on the control base, the one end setting of two first linking arms is on the supporting disk, and the one end of a second linking arm is respectively connected to the other end of two first linking arms, and the one end of two third linking arms is respectively connected to the other end of two second linking arms, and the arm lock is connected to one of them third linking arm, and the arm lock is down connected to another third linking arm, goes up the arm lock and sets up relatively from top to bottom with lower arm lock for press from both sides and get the wafer, the one end of going up the arm lock and lower arm lock all is convex structure. After the technical scheme is adopted, the utility model discloses can prevent to damage wafer, flexibility height.

Description

Wafer manipulator

Technical Field

The utility model relates to a manipulator technical field, concretely relates to wafer manipulator.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit device structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions.

The wafer is often required to be transported to various assembly lines in the processing process, and laser etching information is generally available on the wafer before or after the wafer is processed so as to distinguish the wafer, so that the wafer is required to be taken out for identification; however, in the conventional transportation taking and placing process, the wafer is generally taken out or placed down by hands, so that the efficiency is reduced due to fatigue caused by long-term work of workers, and the labor is not easy to control, so that the wafer is often easily damaged when the wafer is taken and placed.

In view of this, the present invention is designed to overcome many deficiencies and inconveniences caused by the above-mentioned process, and actively research, improve, try and develop the present invention.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a can prevent to damage wafer, the high wafer manipulator of flexibility to prior art's defect and not enough.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a wafer manipulator, its includes control base, supporting disk, two first linking arms, two second linking arms, two third linking arms, goes up the arm lock, lower arm lock, the supporting disk sets up on control base, the one end setting of two first linking arms is on the supporting disk, and the one end of a second linking arm is respectively connected to the other end of two first linking arms, and the one end of two third linking arms is respectively connected to the other end of two second linking arms, and one of them third linking arm is connected and is gone up the arm lock, and the arm lock is down connected to another third linking arm, goes up the arm lock and sets up relatively from top to bottom with lower arm lock for the wafer clamp is got, the one end of going up the arm lock and lower arm lock all is convex structure.

Further, a gap is formed between the upper clamping arm and the lower clamping arm.

Furthermore, stripes are arranged on the upper surfaces of one ends of the upper clamping arm and the lower clamping arm.

Further, first linking arm mobilizable setting is in on the supporting disk, second linking arm mobilizable is connected with first linking arm, third linking arm mobilizable is connected with the second linking arm.

And the sensor is arranged on the third connecting arm through the fixing support and used for detecting whether the wafer manipulator clamps the wafer.

Further, still include the truckle, the truckle setting is in the bottom of control base.

After the technical scheme is adopted, the utility model discloses a press from both sides the clamp that will go up arm lock and lower arm lock and hold and set up to convex structure, can reduce with the area of contact on wafer surface, prevent to damage the wafer, and because the wafer is circular structure, the laminating wafer that can be more when pressing from both sides when getting for press from both sides and get more stably, the flexibility is higher.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a schematic side view of the present invention.

Detailed Description

In order to further explain the technical solution of the present invention, the present invention is explained in detail by the specific embodiments below.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

Referring to fig. 1-2, the present invention discloses a wafer robot 15, which includes a control base 151, a support plate 152, two first connecting arms 153, two second connecting arms 154, two third connecting arms 155, an upper clamping arm 156, a lower clamping arm 157, a sensor 158, and casters (not shown).

When the wafer is placed, the back surface of the wafer faces downwards, and various circuit element structures related to the back surface of the wafer are not arranged on the back surface of the wafer.

The supporting plate 152 is disposed on the control base 151, one end of each of the two first connecting arms 153 is movably disposed on the supporting plate 152, the other end of each of the two first connecting arms 153 is connected to one end of a second connecting arm 154, the other end of each of the two second connecting arms 154 is connected to one end of each of two third connecting arms 155, one of the third connecting arms 155 is connected to one end of an upper clamping arm 156, the other third connecting arm 155 is connected to one end of a lower clamping arm 157, and the upper clamping arm 156 and the lower clamping arm 157 are disposed opposite to each other in a vertical direction for clamping a wafer.

One end of each of the upper clamp arm 156 and the lower clamp arm 157 is an arc-shaped structure, and the arc-shaped structures can reduce the contact surfaces between the upper clamp arm 156 and the wafer as well as between the lower clamp arm 157 and the wafer when the wafer is clamped, so as to avoid damage to the wafer; a gap is formed between the upper clamping arm 156 and the lower clamping arm 157, the upper clamping arm 156 is located above the lower clamping arm 157, a gap is formed between the upper clamping arm 156 and the lower clamping arm 157, and when a wafer is grabbed, the wafer is located at the gap.

Stripes a are also arranged on the upper surfaces of one ends of the upper clamping arm 156 and the lower clamping arm 157, and the lower surfaces of the upper clamping arm 156 and the lower clamping arm 157 are smooth; during clamping, the upper surface of the lower clamp arm 157 contacts with the back surface of the wafer, the lower surface of the upper clamp arm 156 contacts with the front surface of the wafer, and the stripe a can increase the friction between the back surface of the wafer and the upper surface of the lower clamp arm 157, so that the wafer is not easy to fall off from between the upper clamp arm 156 and the lower clamp arm 157.

One end of the first connecting arm 153 is movably disposed on the supporting plate 152, one end of the second connecting arm 154 is movably connected to the other end of the first connecting arm 153, and one end of the third connecting arm 155 is movably connected to the other end of the second connecting arm 154.

The first connecting arm 153, the second connecting arm 154 and the third connecting arm 155 are symmetrically arranged in pairs, and the angle and position between the connecting arms can be changed by the movable connecting mode, so that wafers at different positions can be clamped.

The sensor 158 is disposed on the third connecting arm 155 through a fixing bracket 159, and the sensor 158 is used for detecting whether the wafer is clamped on the wafer robot 15.

The truckle sets up the bottom of control base 151, the truckle can drive wafer manipulator 15 and remove, is provided with control assembly in the control base 151, and control assembly can control wafer manipulator 15, and wafer manipulator 15 can move to suitable position clamp and get the wafer.

The utility model discloses the theory of operation does: the control base 151 controls the trend of the wafer manipulator 15 and the expansion of each connecting arm, a movable connection mode is adopted among the first connecting arm 153, the second connecting arm 154 and the third connecting arm 155, so that the connecting arms can be matched with one another to extend, wafers at different positions can be clamped, the flexibility is higher, meanwhile, one ends of the upper clamping arm 156 and the lower clamping arm 157 for clamping the wafers are improved, one ends of the upper clamping arm 156 and the lower clamping arm 157 are both arc-shaped structures, the arc-shaped structures enable the contact surfaces of the upper clamping arm 156 and the lower clamping arm 157 with the wafers to be reduced when the wafers are clamped, the wafers are prevented from being damaged, a machine is adopted to replace manpower, and the efficiency can be improved.

The above description is only for the purpose of illustrating the technical solutions of the present invention and not for the purpose of limiting the same, and other modifications or equivalent replacements made by those of ordinary skill in the art to the technical solutions of the present invention should be covered within the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solutions of the present invention.

Claims

1. A wafer manipulator which characterized in that: the wafer clamping device comprises a control base, a supporting disk, two first connecting arms, two second connecting arms, two third connecting arms, an upper clamping arm and a lower clamping arm, wherein the supporting disk is arranged on the control base, one ends of the two first connecting arms are arranged on the supporting disk, the other ends of the two first connecting arms are respectively connected with one end of one second connecting arm, the other ends of the two second connecting arms are respectively connected with one ends of the two third connecting arms, one third connecting arm is connected with the upper clamping arm, the other third connecting arm is connected with the lower clamping arm, the upper clamping arm and the lower clamping arm are arranged up and down relatively and are used for clamping wafers, and one ends of the upper clamping arm and the lower clamping arm are both arc-shaped structures.

2. A wafer robot as claimed in claim 1, wherein: a gap is formed between the upper clamping arm and the lower clamping arm.

3. A wafer manipulator as claimed in claim 1, characterized by: and stripes are further arranged on the upper surfaces of one ends of the upper clamping arm and the lower clamping arm.

4. A wafer robot as claimed in claim 1, wherein: first linking arm mobilizable setting is in on the supporting disk, the mobilizable and first linking arm of second linking arm is connected, the mobilizable and second linking arm of third linking arm is connected.

5. A wafer manipulator as claimed in claim 1, characterized by: the sensor is arranged on the third connecting arm through the fixing support and used for detecting whether the wafer manipulator clamps the wafer or not.

6. A wafer robot as claimed in claim 1, wherein: still include the truckle, the truckle setting is in the bottom of control base.