CN213497261U

CN213497261U - Laser processing wafer precision positioning material supporting frame structure

Info

Publication number: CN213497261U
Application number: CN202021701240.1U
Authority: CN
Inventors: 陶为银; 巩铁建
Original assignee: Henan General Intelligent Equipment Co Ltd
Current assignee: Henan General Intelligent Equipment Co Ltd
Priority date: 2020-08-16
Filing date: 2020-08-16
Publication date: 2021-06-22
Anticipated expiration: 2030-08-16

Abstract

The utility model provides a laser beam machining wafer precision positioning holds in palm work or material rest structure, include and set up the support work or material rest sucking disc that is used for adsorbing wafer tray on the support work or material rest transferring the position setting, hold in the palm the work or material rest sucking disc and can go up and down. The material supporting frame comprises a sucker frame body, at least 3 upward sucker rods are circumferentially arranged on the sucker frame body, and negative pressure suction nozzles are arranged on the sucker rods; the suction head rod is provided with a gas connector communicated with the negative pressure suction nozzle, and the gas connector is connected with a negative pressure source through a negative pressure pipe. A material supporting frame sucker connecting plate with one end extending outwards is fixed on the material supporting frame sucker, a material supporting frame screw mechanism driven by a servo motor is fixed on the machine frame, and a material supporting frame nut of the material supporting frame screw mechanism is fixed with the material supporting frame sucker connecting plate. The suction force of the material supporting frame sucker on the wafer tray enables the position of the wafer tray to be stable, and therefore accurate positioning is guaranteed.

Description

Laser processing wafer precision positioning material supporting frame structure

Technical Field

The utility model belongs to silicon wafer laser beam machining field, concretely relates to laser beam machining wafer precision positioning holds in palm work or material rest structure.

Background

During wafer laser processing, a wafer tray needs to be taken out of a wafer storage box by using a wafer clamping mechanism and is linearly moved to a transfer position. The wafer tray is adsorbed by the transfer sucker and rotates to be moved to the position above the processing transfer position, and the wafer vacuum sucker of the cutting platform is also moved to the processing transfer position and receives the wafer tray. The transfer position is used for temporarily storing unprocessed wafers to wait for transfer, and the transfer position is provided with a mechanism for supporting materials. One clamping plate of the wafer clamping mechanism is driven by the clamping cylinder to move. When the wafer clamping mechanism is loosened, one of the clamping plates is contacted with the wafer tray. Friction during removal can affect tray displacement. In the process that the wafer clamping mechanism puts the wafer tray to the transfer position, if the position of the wafer tray changes, the subsequent transfer position is influenced, and the processing precision is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model provides a laser beam machining wafer precision positioning holds in palm work or material rest structure.

The utility model discloses an aim at is realized with following mode, and laser beam machining wafer precision positioning holds in the palm work or material rest structure, include the support work or material rest that sets up in the position of transporting, set up the support work or material rest sucking disc that is used for adsorbing the wafer tray on the support work or material rest, hold in the palm the work or material rest sucking disc and can go up and down.

The material supporting frame comprises a sucker frame body, at least 3 upward sucker rods are circumferentially arranged on the sucker frame body, and negative pressure suction nozzles are arranged on the sucker rods; the suction head rod is provided with a gas connector communicated with the negative pressure suction nozzle, and the gas connector is connected with a negative pressure source through a negative pressure pipe.

The sucker frame body comprises a cross frame body, the tail end of the cross frame body is provided with a frame body connecting plate, and the lower end of the sucker rod is fixed on the frame body connecting plate; the support body connecting plate is provided with an adjusting groove, the cross support body is provided with a fixing hole, and the length of the cross support body extending out of the support body connecting plate is adjusted by adjusting the position of the fixing hole in the length direction in the fixing groove.

A material supporting frame sucker connecting plate with one end extending outwards is fixed on the material supporting frame sucker, a material supporting frame screw mechanism driven by a servo motor is fixed on the machine frame, and a material supporting frame nut of the material supporting frame screw mechanism is fixed with the material supporting frame sucker connecting plate.

A linear transfer displacement sensor is arranged at a position on the rack corresponding to the transfer position; and a linear transfer displacement detection strip is arranged at a corresponding position on the wafer clamping mechanism.

The utility model has the advantages that: the material supporting frame is provided with a material supporting frame sucker for absorbing the wafer tray. The material supporting frame sucker provides the wafer tray with the adsorption force, so that the position of the wafer tray is stable, and the position of the wafer tray cannot be changed even if friction force is generated between the upper clamping plate and the wafer tray when the lower clamping plate or the upper clamping plate moves, so that accurate positioning is guaranteed.

Drawings

FIG. 1 is a schematic view of a wafer processing apparatus including a carrier rail.

Fig. 2 is a top cross-sectional view (hiding a portion of the non-moving parts) of fig. 1.

Fig. 3 is a top cross-sectional view (hiding a portion of the non-moving parts) of fig. 1 at another elevational plane.

Fig. 4 is an enlarged view of the rotating transfer mechanism.

Fig. 5 is an enlarged view of a portion of the transfer chuck.

Fig. 6 is an enlarged schematic view of the wafer chucking mechanism 3.

Figure 7 is a simplified diagram of a wafer clamping mechanism (embodiment with clamping plate springs).

Fig. 8 is a schematic diagram of a wafer processing apparatus mechanism including a carrier having a carrier chuck.

FIG. 9 is a top view of the suction cup of the material holder of FIG. 8

Wherein, 1 is a frame, 2 is a wafer storage box, 3 is a wafer clamping mechanism, 30 is an upper clamping plate, 300 is a clamping separation blade, 301 is a clamping plate displacement sensor, 302 is a clamping cylinder avoiding groove, 31 is a lower clamping plate, 310 is a separation blade avoiding groove; 311, 32, 320, 33, 34, 36, 39, 4, 5, 50, 51, 54, 61, 62, 63, 64, 640, 641, 642, 643, 645, 65, 60, 36, linear transfer screw mechanism, linear transfer slide rail, 4, wafer tray, 5, 50, support frame, sucker, 51, support frame, sucker connection plate, 54, support frame, 61, 62, transfer connection, 63, 64, transfer sucker, 640, mount connection plate, 642, 643, negative pressure sucker, 645, adjustment groove, 65, transfer lift cylinder slide block; 66 transport lift cylinder guide rail, 67 transport displacement detection strip, 68 transport displacement sensor, 69 transport spacing post, 7 is cutting platform, 75 is wafer vacuum chuck, 11 is the linear transport displacement sensor, 12 is the linear transport displacement detection strip.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings and specific embodiments. In the present invention, unless otherwise explicitly specified or limited, the terms "connected," "fixed," "disposed," and the like are to be construed broadly, either as a fixed connection, a detachable connection, or an integral part; may be directly connected or indirectly connected through an intermediate, unless otherwise specifically limited. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features, or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

As shown in fig. 1-7, an apparatus for processing a wafer with a material supporting frame at a transfer position comprises a frame 1, wherein a mechanism for transferring a wafer tray 4 from a wafer storage box 2 on the frame 1 to the processing transfer position of a cutting platform 7 is arranged on the frame 1, and the apparatus comprises a linear transfer mechanism and a rotary transfer mechanism 6. A material supporting frame 5 capable of storing the wafer tray 4 is arranged at a transfer position below the linear transfer mechanism; the linear transfer mechanism converts the wafer tray 4 between a clamping position and a transfer position of the wafer storage box 2; the rotating transfer mechanism 6 enables the wafer tray to be switched between a transfer position and a processing transfer position on the cutting platform. A material supporting frame 5 is arranged between the linear transferring mechanism and the rotating transferring mechanism 6 to transfer the wafer tray 4.

Wherein, the straight line transfer mechanism includes wafer fixture 3 and drives the straight line actuating mechanism of centre gripping of 3 rectilinear movement of wafer fixture. The clamping linear driving mechanism is a linear transfer screw rod mechanism 36, and a clamping linear transfer slide rail 39 is arranged outside the linear transfer clamping screw rod mechanism 36.

The wafer clamping mechanism 3 comprises a clamping connecting plate 34 arranged on the rack in a sliding manner, the upper end of the clamping connecting plate 34 is connected with the rack 1 in a sliding manner, and the lower end of the clamping connecting plate is connected with an upper clamping plate 30 and a clamping cylinder 32; wherein the piston head of the clamping cylinder 32 is connected to the lower clamping plate 31. A clamping plate spring 33 may be disposed between the upper clamping plate 30 and the lower clamping plate 31. The clamping plate spring 33 has one end fixed to the upper clamping plate 30 and the other end fixed to the lower clamping plate 31. The clamping force of the upper clamping plate 30 and the lower clamping plate 31 is adjusted by adjusting the elastic force of the clamping plate spring 33, and the buffering is provided in the clamping process, so that the wafer tray 4 is effectively protected.

Further, the method comprises the following steps: the rear end of the upper clamping plate 30 is provided with a clamping cylinder avoiding groove 302, the clamping cylinder 32 is arranged in the clamping cylinder avoiding groove 302, and the piston head of the clamping cylinder 32 is connected with the clamping cylinder sliding block 320, the clamping cylinder sliding block 320 and a guide rail on the outer surface of the clamping cylinder 32 to form a guide rail sliding block connecting pair. The lower clamping plate 31 is fixed to a clamping cylinder slide 32. The clamp cylinder slider 320 may be L-shaped. The front end part of the upper clamping plate 30 is provided with a downward clamping baffle 300, and a baffle avoiding groove 310 is arranged at the corresponding position of the lower clamping plate 31; the lower end of the holding flap 300 extends into the flap escape slot 310.

The clamping plate spring 33 may be disposed between the upper surface of the clamping cylinder slider 320 and the lower surface of the cylinder body of the clamping cylinder 32. Or between the upper and

lower clamping plates

30 and 31 on both sides of the clamping cylinder escape groove 302.

The clamping plate spring 33 is a tension spring, the clamping cylinder 32 is a double-acting cylinder, one end of the double-acting cylinder is selectively communicated with an air source or atmosphere, and the other end of the double-acting cylinder is directly communicated with the atmosphere. The clamp cylinder 32 is now able to extend for ventilation and requires external force to retract when ventilation is no longer required. During ventilation, the clamping cylinder 32 drives the lower clamping plate 31 to move downwards. When the ventilation is not performed, the tension spring pulls the lower clamping plate 31 back to reset. In a clamping state; the extension amount of the tension spring is larger than that of the lower clamping plate 31 corresponding to the gravity. At this time, the restoring force of the tension spring is greater than the gravity of the lower clamping plate 31, so that the lower clamping plate 31 and the upper clamping plate 30 press the wafer tray 4. A plurality of tension springs or a tension spring having a large elastic force may be provided to increase the elastic force thereof to clamp the wafer tray 4. The tension springs with different elastic forces can provide different clamping forces.

The clamp cylinder 32 may also be a single-acting cylinder. The single-acting cylinder is internally provided with a spring so that the single-acting cylinder can extend when in ventilation and automatically retract when not in ventilation. However, the cylinder is a standard component, the elasticity of the spring in the single-action cylinder is fixed, the restoring force is small and cannot be adjusted, and the clamping force capable of being applied is also fixed. After the standard cylinder with the required telescopic length is selected, the restoring elasticity of the built-in spring cannot accurately meet the requirement of the wafer clamping mechanism 3. And the clamping force required by the different gravity of the wafer trays 4 with different specifications is different, so that a mechanism for conveniently adjusting the elasticity is required. The clamp plate spring 33 needs to be provided even for the single-acting cylinder.

In order to detect whether the wafer tray is in place during clamping and prevent the phenomenon of empty clamping, the upper clamping plate 30 may also be provided with a clamping plate displacement sensor 301, and the lower clamping plate 31 is provided with a clamping plate displacement detection strip 311 matched with the upper clamping plate. Further, the method comprises the following steps: the clamping plate displacement sensor 301 is located at the side edge of the upper clamping plate 30, and one end of the clamping plate displacement detection strip 311 is fixed on the clamping cylinder slider 320.

When the upper clamping plate 30 and the lower clamping plate 31 are in a hollow state, the clamping plate spring 33 pulls the lower clamping plate 31 back, the elasticity of the clamping plate spring 33 ensures that the upper clamping plate 30 and the lower clamping plate 31 are contacted and have pressure, and at the moment, a clamping plate displacement detection strip 311 is inserted between the transmitting end and the receiving end of the clamping plate displacement sensor 301; when the clamping plate is not empty, the receiving end of the clamping plate displacement sensor 301 can receive the signal sent by the transmitting end. The clamping plate displacement sensor 301 may be a photo sensor.

The rotary transfer mechanism 6 comprises a transfer connecting body 60 which is rotatably arranged on the frame 1, and the transfer connecting body 60 is downwards connected with a transfer sucker 64 which can be lifted. Transport connector 60 both ends and set up respectively and transport lift cylinder 61, transport lift cylinder 61's lateral surface setting and transport lift cylinder guide rail 66, transport lift cylinder 61's fixed cylinder connecting plate 62 of transporting of piston head. The transfer cylinder connecting plate 62 fixes the transfer lifting cylinder slide block 65; the transfer lifting cylinder slide block 65 and the transfer lifting cylinder guide rail 66 form a guide rail pair. A cantilever 63 extends out of the outer side of the transfer lifting cylinder slide block 65, and a transfer sucker 64 is fixed on the cantilever 63. The transfer lifting cylinder 61 drives the transfer sucker 64 to lift, and the position where the piston head moves has certain deviation, so that the position of the transfer sucker 64 has certain error, and subsequent processing procedures are influenced. A transfer lifting cylinder guide rail 66 is arranged on the outer side surface of the transfer lifting cylinder 61, and a transfer sucker 64 is fixed together with a transfer lifting cylinder slide block 65 through a cantilever 63; the position of the transfer sucker in the lifting process is accurate through the guide rail pair structure. And two transfer lifting cylinders can make wafer tray 4 transport the position and transport the position with processing and exchange between, and wafer tray 4 after the processing is accomplished need not to remove from other route, can return to wafer storage box 2 on the original way, compact structure.

The transfer connector 60 is provided with a transfer displacement detection strip 67; two transfer displacement sensors 68 are disposed on the frame 1 along the rotation locus of the transfer displacement detection bar 67. When the transfer displacement detection strip 67 is moved from one transfer displacement sensor 68 to the other transfer displacement sensor 68, one of the transfer suction cups 64 moves from the transfer position to the processing transfer position, and the other transfer suction cup moves from the processing transfer position to the transfer position. The transfer displacement sensor 68 ensures that the transfer chuck 64 is accurately stopped at the transfer position and the processing transfer position. As for the middle obstacle avoidance position, the precision is not required, the operation can be realized only by rotating a certain angle from the transfer position or the machining transfer position, and the operation can be realized through a servo motor.

The transfer connector 60 is connected to the output of a transfer motor provided on the frame 1. Set up annular transportation spacing groove around the axis of transporting the motor output shaft in frame 1, set up the lower extreme in the transportation spacing groove and fixed with the transportation connector 60, the upper end passes the transportation spacing post 69 of transporting the spacing groove, and the angle of transporting the spacing groove is guaranteed to transport spacing post 69 and is rotated 180 degrees. The transfer limiting groove can be slightly larger than 180 degrees. When the transfer limiting column 69 is positioned at two ends of the transfer limiting groove, one of the two transfer suckers is positioned at the transfer position.

The transfer sucker 64 comprises a sucker frame body, at least 3 downward sucker rods 642 are circumferentially arranged on the sucker frame body, and a negative pressure sucker 643 is arranged on each sucker rod 642; the suction head rod 642 is provided with a gas connector communicated with the negative pressure suction nozzle, and the gas connector is connected with a negative pressure source through a negative pressure pipe. How the negative pressure is achieved in the transfer cup 64 is known in the art and will not be described in detail.

The sucking disc frame body comprises a cross frame body 640, a frame body connecting plate 641 is arranged at the tail end of the cross frame body 640, and the upper end of the sucking head rod 642 is fixed on the frame body connecting plate 641; the frame connecting plate 641 is provided with an adjusting groove 645, the cross frame 640 is provided with a fixing hole, and the length of the frame connecting plate 641 extending out of the cross frame 640 is adjusted by adjusting the position of the fixing hole in the length direction of the adjusting groove 645. The fixing hole may be a screw hole, a bolt is disposed in the fixing hole, and the frame body connecting plate 641 and the cross frame body 640 are fixed by pressing the upper surface of the connecting plate with a nut of the bolt.

The material supporting frame 5 is arranged at a transfer position below the linear transfer mechanism on the rack 1, the material supporting frame 5 comprises two parallel material supporting guide rails 51, and the distance between the two material supporting guide rails 51 can be adjusted, so that the requirements of wafer trays 4 with different specifications are met. A proximity switch is arranged on the material supporting guide rail 51. A groove is arranged on the material supporting guide rail 51, the proximity switch is arranged in the groove, and the upper surface of the proximity switch is not higher than the upper surface of the material supporting guide rail 51. Thus, when the wafer tray 4 held by the wafer holding mechanism 3 reaches the proximity switch position, the proximity switch is turned on so that the wafer holding mechanism 3 does not move forward any more, and the wafer tray 4 is released to be placed on the two material holding rails 51. The wafer chuck 3 is then removed.

In other embodiments, the transfer position material supporting frame 5 is provided with an upward material supporting frame sucker, and a wafer tray is fixed through negative pressure adsorption. As shown in fig. 8-9: a laser processing wafer precision positioning material supporting frame structure comprises a material supporting frame 5 arranged at a transfer position. The material supporting frame 5 is provided with a material supporting frame sucker 50 for absorbing the wafer tray 4. The material supporting frame sucker 50 enables the position of the wafer tray 4 to be stable through the suction force of the negative pressure on the wafer tray 4, and even if friction force is generated between the upper clamping plate 30 or the lower clamping plate 31 and the wafer tray 4 when the upper clamping plate or the lower clamping plate moves, the position of the wafer tray 4 cannot be changed, so that accurate positioning is guaranteed. The carrier chuck 50 can be raised and lowered.

The structure of the carrier chuck 50 may be the same as the structure of the transfer chuck 64, but the difference is that the direction of the negative pressure suction nozzle 643 on the carrier chuck 50 is upward, and the carrier chuck is fixedly disposed on the frame below the transfer location. Namely: the material supporting frame sucker 50 comprises a sucker frame body, at least 3 upward sucker rods 642 are circumferentially arranged on the sucker frame body, and a negative pressure sucker 643 is arranged on each sucker rod 642; the suction head rod 642 is provided with a gas connector communicated with the negative pressure suction nozzle, and the gas connector is connected with a negative pressure source through a negative pressure pipe.

Furthermore, the sucker frame body comprises a cross frame body 640, a frame body connecting plate 641 is arranged at the tail end of the cross frame body 640, and the lower end of the sucker rod 642 is fixed on the frame body connecting plate 641; the frame connecting plate 641 is provided with an adjusting groove 645, the cross frame 640 is provided with a fixing hole, and the length of the frame connecting plate 641 extending out of the cross frame 640 is adjusted by adjusting the position of the fixing hole in the length direction of the adjusting groove 645. The fixing hole may be a screw hole, a bolt is disposed in the fixing hole, and the frame body connecting plate 641 and the cross frame body 640 are fixed by pressing the upper surface of the connecting plate with a nut of the bolt.

A material supporting frame sucker connecting plate 51 with one end extending outwards is fixed on the material supporting frame sucker 50, a material supporting frame screw mechanism 54 driven by a servo motor is fixed on the machine frame 1, and a material supporting frame nut of the material supporting frame screw mechanism 54 is fixed with the material supporting frame sucker connecting plate 51.

A linear transfer displacement sensor 11 is arranged at a position on the rack 1 corresponding to the transfer position; and a linear transfer displacement detection strip 12 is arranged at a corresponding position on the wafer clamping mechanism 3. When the linear transfer displacement detection strip 12 moves to the position of the linear transfer displacement sensor 11, the wafer clamping mechanism 3 reaches the transfer position and stops moving.

In specific implementation, when an unprocessed wafer tray 4 needs to be clamped, the wafer storage box 2 arranged on the rack moves up and down to enable the wafer tray 4 needing to be processed to reach a clamping position. The controller or control system sends a signal to the wafer clamping mechanism 3 to clamp the wafer tray 4. When the linear transfer displacement detection strip 12 moves to the position of the linear transfer displacement sensor 11, the wafer clamping mechanism 3 reaches the transfer position. The control system receives the signal and stops the movement of the wafer holding mechanism 3. The material supporting frame screw mechanism 54 rotates to enable the material supporting frame sucker 50 to be tightly pressed and adsorbed with the lower surface of the wafer tray 4. The wafer holding mechanism releases the unprocessed wafer tray 4, and the carrier base plate 53 moves so that the surface of the wafer tray 4 does not contact the upper holding plate 30 and the lower holding plate 31. The wafer chuck 3 is then removed. And simultaneously the processed wafer tray on the wafer vacuum chuck 75 of the cutting platform moves to the processing transfer position. The transfer motor rotates to rotate the two transfer chucks 64 from the middle obstacle avoidance position to the positions above the wafer trays 64 at the transfer position and the processing transfer position, respectively. The transfer lift cylinder 61 is activated to move the transfer chuck downward until it contacts and adsorbs two wafer trays 64. The transfer chuck 64 is raised to the initial height and rotated by a predetermined angle to exchange the positions of its two wafer trays 4. The two transfer chucks 64 are lowered and lowered to place the corresponding wafer trays 4 on the carrier chuck 50 and the wafer vacuum chuck 75, respectively. The transfer motor rotates to move the transfer chuck 64 to the middle obstacle avoidance position. The wafer holding mechanism 3 holds and moves the processed wafer tray 4 into the wafer stocker 2. The wafer vacuum chuck 75 moves the unprocessed wafer chuck 4 under the laser mechanism for dicing.

In the above description: the clamping position is the position of the wafer tray 4 clamped by the wafer clamping mechanism 3 when the wafer storage box 2 starts to take the materials. The transfer position is a position where the wafer holding mechanism 3 holds the wafer tray 4 and waits for the transfer chuck 64 to suck after moving for a certain distance. The processing transfer position is a position where the wafer vacuum chuck 75 on the cutting table 7 receives the wafer tray 4 from the transfer chuck 64. Avoiding an obstacle in the middle: at a position between the transfer station and the processing transfer station, typically the intermediate position. In the attached drawing, A is a clamping position, B is a quasi-transport position, and C is a processing transport position.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features. When the technical solutions are contradictory or cannot be combined, the combination of the technical solutions should be considered to be absent, and is not within the protection scope of the present invention. Also, it will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the spirit of the principles of the invention.

Claims

1. Laser beam machining wafer precision positioning holds in palm work or material rest structure includes the work or material rest that holds in the palm that sets up in the transfer position, its characterized in that: the material supporting frame is provided with a material supporting frame sucker for adsorbing a wafer tray, and the material supporting frame sucker can lift.

2. The laser-machined wafer precision positioning carrier structure of claim 1, wherein: the material supporting frame comprises a sucker frame body, at least 3 upward sucker rods are circumferentially arranged on the sucker frame body, and negative pressure suction nozzles are arranged on the sucker rods; the suction head rod is provided with a gas connector communicated with the negative pressure suction nozzle, and the gas connector is connected with a negative pressure source through a negative pressure pipe.

3. The laser-machined wafer precision positioning carrier structure of claim 2, wherein: the sucker frame body comprises a cross frame body, the tail end of the cross frame body is provided with a frame body connecting plate, and the lower end of the sucker rod is fixed on the frame body connecting plate; the support body connecting plate is provided with an adjusting groove, the cross support body is provided with a fixing hole, and the length of the cross support body extending out of the support body connecting plate is adjusted by adjusting the position of the fixing hole in the length direction in the fixing groove.

4. The laser-machined wafer precision positioning holder structure as claimed in any one of claims 1 to 3, wherein: a material supporting frame sucker connecting plate with one end extending outwards is fixed on the material supporting frame sucker, a material supporting frame screw mechanism driven by a servo motor is fixed on the machine frame, and a material supporting frame nut of the material supporting frame screw mechanism is fixed with the material supporting frame sucker connecting plate.