CN212848319U - Wafer clamping in-place detection mechanism - Google Patents

Abstract

The utility model provides a wafer clamping in-place detection mechanism, which comprises a wafer clamping mechanism, wherein the wafer clamping mechanism comprises a clamping connecting plate, an upper clamping plate, a lower clamping plate and a clamping cylinder which are arranged on a frame in a sliding way; the piston end of the clamping cylinder is connected with the lower clamping plate, the cylinder body of the clamping cylinder and the upper clamping plate are fixed on the clamping connecting plate, and a clamping plate spring is arranged between the upper clamping plate and the lower clamping plate; when the upper clamping plate and the lower clamping plate are in a hollow state, the lower clamping plate is pulled back to be in contact with the upper clamping plate by the clamping plate spring; the upper clamping plate is provided with a clamping plate displacement sensor, and the lower clamping plate is provided with a clamping plate displacement detection strip matched with the lower clamping plate. The presence or absence of the wafer tray clamped therebetween can be detected, thereby preventing the phenomenon of empty clamping.

Description

Wafer clamping in-place detection mechanism

Technical Field

The utility model belongs to silicon wafer processing field, concretely relates to wafer centre gripping detection mechanism that targets in place.

Background

During wafer laser processing, a wafer tray needs to be taken out of a wafer storage box by using a wafer clamping mechanism and moved to a cutting platform for processing. The wafer clamping mechanism comprises an upper clamping plate and a lower clamping plate; the piston end of the clamping cylinder is connected with the lower clamping plate. The clamping cylinder drives the upper clamping plate and the lower clamping plate to clamp or loosen. During the clamping process, there may be a situation of being empty, such as a situation where no wafer tray is placed on the corresponding layer of the wafer storage box. A structure for determining whether the wafer chuck clamps the wafer tray is needed.

SUMMERY OF THE UTILITY MODEL

The utility model provides a wafer centre gripping detection mechanism that targets in place.

The purpose of the utility model is realized with the following mode: the wafer clamping in-place detection mechanism comprises a wafer clamping mechanism, wherein the wafer clamping mechanism comprises a clamping connecting plate, an upper clamping plate, a lower clamping plate and a clamping cylinder which are arranged on a rack in a sliding manner; the piston end of the clamping cylinder is connected with the lower clamping plate, the cylinder body of the clamping cylinder and the upper clamping plate are fixed on the clamping connecting plate, and a clamping plate spring is arranged between the upper clamping plate and the lower clamping plate; when the upper clamping plate and the lower clamping plate are in a hollow state, the lower clamping plate is pulled back to be in contact with the upper clamping plate by the clamping plate spring; the upper clamping plate is provided with a clamping plate displacement sensor, and the lower clamping plate is provided with a clamping plate displacement detection strip matched with the lower clamping plate.

The rear end of the upper clamping plate is provided with a clamping cylinder avoiding groove, the clamping cylinder is arranged in the clamping cylinder avoiding groove, and a piston head of the clamping cylinder is connected with a clamping cylinder sliding block, the clamping cylinder sliding block and a guide rail on the outer surface of the clamping cylinder to form a guide rail sliding block connecting pair; the lower clamping plate is fixed on the clamping cylinder slide block; the clamping plate displacement sensor is positioned on the side edge of the upper clamping plate, and one end of the clamping plate displacement detection strip is fixed on the clamping cylinder sliding block.

The clamping plate spring is a tension spring, and the clamping cylinder is a single-action cylinder; during ventilation, the clamping cylinder drives the lower clamping plate to move downwards; when the ventilation is not performed, the lower clamping plate is pulled back by the tension spring to reset.

The clamping plate spring is a tension spring, the clamping cylinder is a double-acting cylinder, one end of the clamping cylinder can be selectively communicated with an air source or atmosphere, and the other end of the clamping cylinder is directly communicated with the atmosphere; during ventilation, the clamping cylinder drives the lower clamping plate to move downwards; when the ventilation is not performed, the lower clamping plate is pulled back by the tension spring to reset.

The clamping plate displacement sensor is a photoelectric sensor.

The utility model has the advantages that: a clamping plate displacement sensor is arranged between the upper clamping plate and the lower clamping plate, so that whether a wafer tray is clamped or not can be detected, and the phenomenon of clamping empty is prevented.

Drawings

Fig. 1 is a schematic view of the position of a linear transfer mechanism of a wafer processing apparatus (hidden housing and partially unrelated components).

FIG. 2 is a schematic view of a wafer clamping mechanism (partially hidden parts).

Fig. 3 is an enlarged view of the upper and lower clamping plates.

FIG. 4 is a front side schematic view of the upper and lower clamping plates.

Figure 5 is a simplified cross-sectional view of the wafer clamping mechanism (with an embodiment of the clamping plate spring).

Fig. 6 is a schematic diagram of a clamping slide.

Wherein, 1 is the frame, 2 is the wafer storage box, 3 is the wafer fixture, 30 is last grip block, 300 is the centre gripping separation blade, 302 centre gripping cylinder dodges the groove, 31 is lower grip block, 310 is the separation blade dodges the groove, 311 centre gripping plate displacement detection strip, 32 is the centre gripping cylinder, 320 centre gripping cylinder slider, 33 centre gripping plate spring, 34 is the centre gripping connecting plate, 35 is the centre gripping slider, 350 slider displacement detection strip, 36 is the straight line and transports screw mechanism, 37 is the straight line and transports the slider, 370 slider displacement sensor, 38 is centre gripping slider reset spring, 39 centre gripping straight line transports the slide rail, 4 is wafer tray.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings and specific embodiments. In the present invention, unless otherwise explicitly specified or limited, the terms "connected," "fixed," "disposed," and the like are to be construed broadly, either as a fixed connection, a detachable connection, or an integral part; may be directly connected or indirectly connected through an intermediate, unless otherwise specifically limited. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features, or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Relational terms such as first, second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.

As shown in fig. 1-6, the wafer clamping in-place detection mechanism includes a wafer clamping mechanism 3 slidably disposed on the frame 1, the wafer clamping mechanism 3 includes an upper clamping plate 30, a lower clamping plate 31 and a clamping cylinder 32, and the clamping cylinder 32 is connected to the frame 1 and drives either the upper clamping plate 30 or the lower clamping plate 31 to move so as to clamp or release the wafer. A clamping plate spring 33 is provided between the upper clamping plate 30 and the lower clamping plate 31. The clamping plate spring 33 has one end fixed to the upper clamping plate 30 and the other end fixed to the lower clamping plate 31. The clamping force of the upper clamping plate 30 and the lower clamping plate 31 is adjusted by adjusting the elastic force of the clamping plate spring 33, and the buffering is provided in the clamping process, so that the wafer tray 4 is effectively protected.

The wafer clamping mechanism 3 further comprises a clamping connecting plate 34 arranged on the rack 1 in a sliding mode, the piston end of the clamping cylinder 32 is connected with the lower clamping plate 31, and the cylinder body of the clamping cylinder 32 is fixed on the clamping connecting plate 34; the upper clamping plate 30 is connected to the clamping web 34. The clamping plate spring 33 is arranged between the upper clamping plate 30 and the lower clamping plate 31 and is positioned behind the contact position of the wafer tray and the upper clamping plate 30 and the lower clamping plate 31. The upper and lower chucking plates 30 and 31 have front end portions for chucking the wafer tray 4 and rear end portions for disposing chucking plate springs 33. The distance between the rear ends of the upper and lower clamping plates 30 and 31 may be greater than the distance between the front ends, making it easier to install the clamping plate spring 33.

Furthermore, the rear end of the upper clamping plate 30 is also provided with a clamping cylinder avoiding groove 302, the clamping cylinder 32 is arranged in the clamping cylinder avoiding groove 302, and the piston head of the clamping cylinder 32 is connected with the clamping cylinder slider 320, the clamping cylinder slider 320 and the guide rail on the outer surface of the clamping cylinder 32 to form a guide rail slider connecting pair. The lower clamping plate 31 is fixed to a clamping cylinder slide 32. The clamp cylinder slider 320 may be L-shaped. The clamping plate spring 33 may be disposed between the upper surface of the clamping cylinder slider 320 and the lower surface of the cylinder body of the clamping cylinder 32. Or between the upper and lower clamping plates 30 and 31 on both sides of the clamping cylinder escape groove 302.

The clamping plate spring 33 is a tension spring, the clamping cylinder 32 is a double-acting cylinder, one end of the double-acting cylinder is selectively communicated with an air source or atmosphere, and the other end of the double-acting cylinder is directly communicated with the atmosphere. The clamp cylinder 32 is now able to extend for ventilation and requires external force to retract when ventilation is no longer required. During ventilation, the clamping cylinder 32 drives the lower clamping plate 31 to move downwards. When the ventilation is not performed, the tension spring pulls the lower clamping plate 31 back to reset. In a clamping state; the extension amount of the tension spring is larger than that of the lower clamping plate 31 corresponding to the gravity. At this time, the restoring force of the tension spring is greater than the gravity of the lower clamping plate 31, so that the lower clamping plate 31 and the upper clamping plate 30 press the wafer tray 4. A plurality of tension springs or a tension spring having a large elastic force may be provided to increase the elastic force thereof to clamp the wafer tray 4. The tension springs with different elastic forces can provide different clamping forces.

The clamp cylinder 32 may also be a single-acting cylinder. The single-acting cylinder is internally provided with a spring so that the single-acting cylinder can extend when in ventilation and automatically retract when not in ventilation. However, the cylinder is a standard component, the elasticity of the spring in the single-action cylinder is fixed, the restoring force is small and cannot be adjusted, and the clamping force capable of being applied is also fixed. After the standard cylinder with the required telescopic length is selected, the restoring elasticity of the built-in spring cannot accurately meet the requirement of the wafer clamping mechanism 3. And the clamping force required by the different gravity of the wafer trays 4 with different specifications is different, so that a mechanism for conveniently adjusting the elasticity is required. Even with a single-acting cylinder, a clamp plate spring needs to be provided.

In order to detect whether the wafer tray is in place during clamping and prevent the phenomenon of empty clamping, the upper clamping plate 30 is provided with a clamping plate displacement sensor 301, and the lower clamping plate 31 is provided with a clamping plate displacement detection strip 311 matched with the upper clamping plate. Further, the method comprises the following steps: the clamping plate displacement sensor 301 is located at the side edge of the upper clamping plate 30, and one end of the clamping plate displacement detection strip 311 is fixed on the clamping cylinder slider 320.

When the upper clamping plate 30 and the lower clamping plate 31 are in a hollow state, the clamping plate spring 33 pulls the lower clamping plate 31 back, the elasticity of the clamping plate spring 33 ensures that the upper clamping plate 30 and the lower clamping plate 31 are contacted and have pressure, and at the moment, a clamping plate displacement detection strip 311 is inserted between the transmitting end and the receiving end of the clamping plate displacement sensor 301; when the clamping plate is not empty, the receiving end of the clamping plate displacement sensor 301 can receive the signal sent by the transmitting end. The clamping plate displacement sensor 301 may be a photo sensor.

The wafer clamping mechanism 3 is driven by the clamping linear driving mechanism to move linearly. The linear transfer mechanism comprises a wafer clamping mechanism 3 and a clamping linear driving mechanism. A buffer anti-pinch device is arranged between the moving part of the clamping linear driving mechanism and the wafer clamping mechanism 3.

The moving member of the gripping linear drive mechanism includes a linear transfer slider 37; the linear transfer slider 37 is provided with a clamping slider 35, and the clamping slider 35 can move along the moving direction of the linear transfer slider 37. A clamping slide block return spring 38 is arranged between the clamping slide block 35 and the linear transfer slide block 37; the length of the clamping slider return spring 38 is along the direction of movement of the clamping slider 35. If the wafer clamping mechanism 3 clamps the wafer tray 4, in the process that the moving part continues to move forwards, the wafer tray 4 clamped by the wafer clamping mechanism 3 touches the inner wall of the wafer storage box 2 or a limiting strip in the wafer storage box, and the wafer clamping mechanism 3 can not move any more. At this time, the moving member continues to move, and relative movement is generated between the moving member and the wafer holding mechanism 3. With the structure, after the wafer holding mechanism 3 holds the wafer tray 4, the wafer tray 4 held by the wafer holding mechanism and the wafer storage box 2 cannot collide with each other. When the clamping linear driving mechanism moves to enable the wafer tray 4 clamped by the wafer clamping mechanism 3 to leave the wafer storage box 2, the clamping slide block return spring 38 ensures that the wafer clamping mechanism 3 moves backwards to enable the moving part and the wafer clamping mechanism 3 to reset. In the concrete structure, set up the spring mounting groove in the centre gripping slider 35, centre gripping slider reset spring 38 sets up in the spring mounting groove, one end is fixed with centre gripping slider 35, and the other end links to each other with the part that slider 37 stretched into in the spring mounting groove is transported to the straight line.

A clamping slide displacement detection mechanism is arranged between the clamping slide 35 and the linear transfer slide 37; namely, the linear transfer slider 37 is provided with the slider displacement sensor 370, and the corresponding position on the clamping slider 35 is provided with the slider displacement detection strip 350. Or a slide block displacement sensor 370 is arranged on the clamping slide block 35, and a slide block displacement detection strip 350 is arranged at a corresponding position on the linear rotating slide block 37. The clamping slide displacement detection mechanism is used for detecting whether the moving part and the wafer clamping mechanism 3 move relatively or not. Thereby judging whether the wafer tray 4 which can be clamped exists in the wafer storage box 2 at the height corresponding to the upper clamping plate 30 and the lower clamping plate 31 of the wafer clamping mechanism 3.

The front end part of the upper clamping plate 30 is provided with a downward clamping baffle 300, and a baffle avoiding groove 310 is arranged at the corresponding position of the lower clamping plate 31; the lower end of the holding flap 300 extends into the flap escape slot 310. Or the front end part of the lower clamping plate 31 is upwards provided with a clamping baffle, and a baffle avoiding groove is arranged at the corresponding position of the upper clamping plate 30; the upper end of the clamping separation blade extends into the separation blade avoiding groove. The grip stoppers are preferably provided on both sides of the front end portion of the upper grip plate 30 or the lower grip plate 31. The clamping blade 300 may be used to position the clamping position of the wafer tray. At this time, the upper clamping plate 30 and the lower clamping plate 31 may be closed to clamp the tray wafer 4 until the slider displacement sensor 370 detects the presence of the slider displacement detection bar 350. The structure of the clamping block piece 300 ensures that the slider displacement sensor 370 not only can detect whether the wafer clamping mechanism 3 is clamped empty, but also can ensure that the rear end of the wafer tray 4 is in contact with the clamping block piece 300 under the non-clamping state, thereby ensuring the accurate front and rear positions of clamping.

The clamping linear driving mechanism is a linear transfer screw rod mechanism 36, and a clamping linear transfer slide rail 39 is arranged on the outer side of the linear transfer clamping screw rod mechanism 36; the linear transfer slide 37 is slidably disposed on the clamping linear transfer slide 39. The linear transfer slider 37 may be directly connected to the nut of the linear rotation screw mechanism. The section of the clamping linear transfer sliding rail 39 is not circular, and the moving process is more stable.

The slider displacement sensor 370 can detect whether the wafer tray 4 is in place in the front-rear direction. After the wafer tray is detected to be in place, the clamping cylinder 32 starts to act to clamp, and the clamping plate displacement sensor 301 can detect whether the upper position and the lower position of the lower clamping plate are in place or not and whether the wafer tray 4 is clamped together with the upper clamping plate 30 or not.

The wafer storage box 2 capable of moving up and down is arranged on the rack 1, a horizontal material supporting groove corresponding to the wafer tray 4 is arranged on two side walls of the wafer storage box 2, which are located in the insertion direction of the wafer tray 4, and the wafer tray can be placed in the horizontal material supporting groove. And limiting rods which can slide along the front and back directions of the horizontal material supporting groove are further arranged on the two side walls of the wafer material storage box 2, and the length of each limiting rod is approximately equal to the height of the wafer material storage box 2. The wafer tray 4 stops moving when moving to contact with the limit rod. The wafer tray 4 stores individual silicon wafers, and the wafer tray 4 is brought into contact with a jig or a chuck during wafer carrying and laser dicing. The wafer tray 4 comprises a circular metal disc, four straight edges are arranged on the circular metal disc, and the four straight edges are respectively located at four end points of the cross. One of the straight edges is a clamping end for clamping the wafer tray, and the other straight edge is arranged on the opposite side of the clamping end. The other two straight edges are contacted with the horizontal material supporting groove. The wafer cassette is generally configured as a rectangular parallelepiped. The center of the metal disc is provided with a center hole, the center hole is covered with a bearing layer, and the wafer is arranged on the bearing layer. The shapes and structures of the wafer tray 4 and the wafer magazine 2 are prior art and will not be described in detail.

In specific implementation, when the wafer tray 4 needs to be clamped, the wafer storage box 2 moves up and down to the wafer tray 4 to be processed to reach the clamping position. Wherein the clamping position is the position of the wafer tray 4 clamped by the wafer clamping mechanism 3 when the wafer storage box 2 starts to take the materials. The controller or control system sends a signal to the wafer clamping mechanism 3 to enable the clamping cylinder 32 to ventilate and drive the lower clamping plate 31 to move downwards, and the upper clamping plate 30 and the lower clamping plate 31 are opened. The wafer clamping mechanism 3 moves to the position where the wafer storage box 2 on the machine frame 1 is clamped by the accessories and stops moving. The clamping cylinder 32 is not vented any more, and the clamping plate spring 33 drives the lower clamping plate 31 to move upwards to clamp the wafer tray. The clamping force can be adjusted by replacing different clamping plate springs.

If the upper and lower clamping plates 30 and 31 are empty within a predetermined time from when the clamping cylinder 32 is no longer vented, a clamping plate displacement detection bar 311 is inserted between the emitting and receiving ends of the clamping plate displacement sensor 301. When the clamping plate is not empty, the receiving end of the clamping plate displacement sensor 301 can receive the signal sent by the transmitting end.

It should be noted that the terms "central," "lateral," "longitudinal," "front," "rear," "left," "right," "upper" and "lower," "vertical," "horizontal," "top," "bottom," "inner" and "outer" used in the description refer to the orientation or positional relationship as shown in the drawings, merely for the purpose of slogan to describe the patent, and do not indicate or imply that the referenced device or element must have a particular orientation, configuration, and operation in a particular orientation. Therefore, should not be construed as limiting the scope of the invention.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features. When the technical solutions are contradictory or cannot be combined, the combination of the technical solutions should be considered to be absent, and is not within the protection scope of the present invention. Also, it will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the spirit of the principles of the invention.

Claims (5)

1. The wafer clamping in-place detection mechanism comprises a wafer clamping mechanism, wherein the wafer clamping mechanism comprises a clamping connecting plate, an upper clamping plate, a lower clamping plate and a clamping cylinder which are arranged on a rack in a sliding manner; the piston end of centre gripping cylinder links to each other with lower grip block, and the cylinder body of centre gripping cylinder and last grip block are all fixed on the centre gripping connecting plate, its characterized in that: a clamping plate spring is arranged between the upper clamping plate and the lower clamping plate; when the upper clamping plate and the lower clamping plate are in a hollow state, the lower clamping plate is pulled back to be in contact with the upper clamping plate by the clamping plate spring; the upper clamping plate is provided with a clamping plate displacement sensor, and the lower clamping plate is provided with a clamping plate displacement detection strip matched with the lower clamping plate.

2. The wafer clamping in-place detection mechanism of claim 1, wherein: the rear end of the upper clamping plate is provided with a clamping cylinder avoiding groove, the clamping cylinder is arranged in the clamping cylinder avoiding groove, and a piston head of the clamping cylinder is connected with a clamping cylinder sliding block, a clamping cylinder sliding block and a guide rail on the outer surface of the clamping cylinder to form a guide rail sliding block connecting pair; the lower clamping plate is fixed on the clamping cylinder slide block; the clamping plate displacement sensor is positioned on the side edge of the upper clamping plate, and one end of the clamping plate displacement detection strip is fixed on the clamping cylinder sliding block.

3. The wafer clamping in-place detection mechanism of claim 2, wherein: the clamping plate spring is a tension spring, and the clamping cylinder is a single-action cylinder; during ventilation, the clamping cylinder drives the lower clamping plate to move downwards; when the ventilation is not performed, the lower clamping plate is pulled back to reset by the tension spring.

4. The wafer clamping in-place detection mechanism of claim 2, wherein: the clamping plate spring is a tension spring, the clamping cylinder is a double-acting cylinder, one end of the clamping cylinder can be selectively communicated with an air source or atmosphere, and the other end of the clamping cylinder is directly communicated with the atmosphere; during ventilation, the clamping cylinder drives the lower clamping plate to move downwards; when the ventilation is not performed, the lower clamping plate is pulled back to reset by the tension spring.

5. The wafer clamping in-place detection mechanism of claim 2, wherein: the clamping plate displacement sensor is a photoelectric sensor.

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