WO2024131469A1 - Material taking method, material taking apparatus, dicing machine, readable storage medium, and electronic device - Google Patents

Abstract

A material taking method, a material taking apparatus, a dicing machine, a readable storage medium, and an electronic device. The material taking method is used for the dicing machine, and the dicing machine comprises a material taking mechanism, a guide rail, and a stage, wherein the stage is located below the guide rail. The material taking method comprises: step S1, controlling a gripper of a material taking mechanism to be in a first state to grip a workpiece from an initial position, move in a first direction, and place the workpiece at a transition position of the guide rail, wherein the transition position is further than a target position of the guide rail in the first direction; and step S2, controlling the gripper to be in a second state, controlling the material taking mechanism to move in a second direction opposite to the first direction, and pushing the workpiece backwards to the target position from the transition position by means of a determination surface of the gripper in the second state, wherein when the workpiece is at the target position, the center of the workpiece directly faces the center of the stage. By optimizing a material taking process, the positional accuracy of transferring a workpiece to a position for processing can be ensured.

Description

Material taking method, material taking device, dicing machine, readable storage medium and electronic equipment

This application claims the priority of the Chinese patent application filed with the China Patent Office on December 20, 2022, with application number 202211640906.0, and invention name "Material taking method, material taking device, dicing machine, readable storage medium and electronic device", all contents of which are incorporated by reference in this application.

Technical Field

The present invention relates to the technical field of dicing machines, and in particular to a material taking method, a material taking device, a dicing machine, a readable storage medium and an electronic device.

Background technique

A dicing machine is a device that uses a blade or laser to cut workpieces with high precision. Taking a wafer as an example, when processing a wafer, it is necessary to remove the wafer and transfer it from the loading platform to the target position to facilitate subsequent transportation to the carrier.

In the related art, a material picking mechanism is provided on the dicing machine. The material picking mechanism generally adopts a clamping method to transfer the wafer from the loading table to the supporting table. It is found in actual applications that the position accuracy of the wafer after transfer cannot be guaranteed, that is, the position of the wafer finally placed on the supporting table is not accurate enough and there is a position deviation. This position deviation will make the subsequent processing accuracy of the wafer unable to be guaranteed, affecting the processing quality.

Summary of the invention

The purpose of the present invention is to provide a material picking method, a material picking device and a dicing machine, which can ensure the position accuracy of transferring the workpiece to the position to be processed by optimizing the material picking process, thereby providing a basis for ensuring the processing accuracy of subsequent workpieces.

Another object of the present invention is to provide a readable storage medium and an electronic device capable of executing or realizing the aforementioned material acquisition method.

In order to solve the above technical problems, an embodiment of the present invention provides a material taking method for a dicing machine, wherein the dicing machine comprises a material taking mechanism, a guide rail and a bearing platform, wherein the bearing platform is located below the guide rail, and the material taking method comprises:

Step S1, controlling the clamping jaws of the material picking mechanism to be in a first state, clamping the workpiece from an initial position and moving along a first direction, and placing the workpiece at a transition position of the guide rail; wherein, in the first direction, the transition position exceeds the target position of the guide rail;

Step S2, control the clamp to be in a second state, and control the material picking mechanism to move in a second direction opposite to the first direction, and push the workpiece back from the transition position to the target position through the determined surface of the clamp in the second state; wherein, when the workpiece is at the target position, the center of the workpiece is opposite to the center of the support platform.

In the material taking method as described above, the peripheral wall of the workpiece has a flat surface; the clamping jaw includes two clamping plates and a mounting seat, and the mounting seat connects the first ends of the two clamping plates;

When the clamp is in the first state, the two clamps are in a clamped state; when the clamp is in the second state, the two clamps are in an open state; the surface of the mounting base facing the second end of the clamp is a determining surface for pushing the workpiece; when the clamp pushes the workpiece back, the determining surface abuts against the planar portion.

In the material taking method as described above, there is a calibration relationship between the determined surface and the target position;

In the step S2, whether the workpiece has moved to the target position is determined by acquiring the distance between the determined surface and the target position.

In the material taking method as described above, the material taking mechanism is provided with a sensor, and the sensor is used to detect the state of the clamping claw;

In the step S1, if the sensor detects that the clamping jaws are in an empty clamping state, the material taking mechanism is controlled to stop moving and an alarm signal is issued.

The material taking method as described above, after step S2, further comprises:

Step S3, control the picking mechanism to move to the top of the workpiece, and control the adsorption component of the picking mechanism to adsorb the workpiece; control the guide rail to switch to the avoidance position; control the picking mechanism to drive the workpiece to move downward and place it on the supporting platform.

According to the material taking method as described above, the guide rail comprises a first guide rail and a second guide rail, the first guide rail and the second guide rail are arranged in parallel, and the length direction of the first guide rail and the second guide rail is parallel to the first direction; the guide rail can be switched between a carrying position and an avoidance position, in which the distance between the first guide rail and the second guide rail is smaller than the outer diameter of the workpiece, and in the avoidance position, the distance between the first guide rail and the second guide rail is larger than the outer diameter of the workpiece;

In the step S1, the guide rail is in a carrying position.

In the material taking method as described above, the dicing machine includes a loading platform, and the loading platform is located at the initial position; before step S1, the following steps are further included:

Step S0: Control the loading platform to rise and fall in the vertical direction so that the workpiece placed on the loading platform The target workpiece in the workpiece box is at the same height as the support surface of the guide rail; wherein the workpiece box contains a plurality of workpieces arranged at intervals in the vertical direction.

The embodiment of the present invention further provides a material taking device for a dicing machine, wherein the dicing machine comprises a material taking mechanism, a guide rail and a bearing platform, wherein the bearing platform is located below the guide rail, and the material taking device comprises:

A first control module is used to control the clamping jaws of the material picking mechanism to be in a first state, to clamp the workpiece from an initial position and move along a first direction, and to place the workpiece at a transition position of the guide rail; wherein, in the first direction, the transition position exceeds the target position of the guide rail;

The second control module is used to control the clamp to be in a second state, and control the material picking mechanism to move in a second direction opposite to the first direction, and push the workpiece back from the transition position to the target position through the determined surface of the clamp in the second state; wherein, when the workpiece is located at the target position, the center of the workpiece is opposite to the center of the supporting platform.

An embodiment of the present invention further provides a dicing machine, comprising a material taking mechanism, a guide rail and a supporting platform, wherein the supporting platform is located below the guide rail, and is characterized in that the dicing machine also comprises the material taking device described above.

An embodiment of the present invention further provides a readable storage medium, on which a program or instruction is stored. When the program or instruction is executed by a processor, the steps of the material taking method as described in any one of the above items are implemented.

An embodiment of the present invention also provides an electronic device, including a processor, a memory, and a program or instruction stored in the memory and executable on the processor, wherein the program or instruction, when executed by the processor, implements the steps of the material extraction method as described in any one of the above items.

Compared with the existing material picking methods, in the solution provided by the present invention, the material picking mechanism is first controlled to move the workpiece to a transition position beyond the target position, and then the determination surface of the clamping jaws of the material picking mechanism is used to push the workpiece back to the target position, wherein the position of the determination surface of the clamping jaws can be known, and combined with its relative position relationship with the target position and the size of the workpiece, the accuracy of pushing the workpiece back to the target position can be ensured, thereby ensuring the accuracy of the workpiece at the position to be processed, and providing a basis for ensuring the processing accuracy of subsequent workpieces.

The material taking device, dicing machine, readable storage medium and electronic device provided by the present invention correspond to the above-mentioned material taking method, have the same technical effects, and will not be described in detail.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic diagram of a partial structure of a dicing machine in an embodiment provided by the present invention;

FIG2 is a schematic diagram showing the principle of the material taking method provided by the present invention;

FIG3 is a schematic structural diagram of the clamping jaws of the material taking mechanism in a specific embodiment;

FIG. 4 is a flow chart of an embodiment of the material taking method provided by the present invention.

Description of reference numerals:
The material taking mechanism 10, the clamping claw 11, the clamping plate 111, the mounting seat 112, the determining surface 1121, the adsorption component 12;
Guide rail 20, first guide rail 21, second guide rail 22;
The supporting platform 30, the loading platform 40, the workpiece box 41, the workpiece 411, and the plane portion 4111;
Target position A, initial position A1, transition position A2, first direction D1, second direction
D2.

Detailed ways

In the existing method of picking up workpieces by a dicing machine, the workpiece is directly clamped and placed at the target position by controlling the picking mechanism. After studying this picking method, it is found that although the moving distance of the clamping claw of the picking mechanism can be accurately controlled, the position of the clamping claw holding the workpiece each time has a certain deviation, resulting in the failure to accurately place the workpiece at the target position. In response to this problem, this paper improves and optimizes the workpiece picking method so that the workpiece can be accurately placed at the target position.

In order to enable those skilled in the art to better understand the scheme of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

Please refer to Figures 1 to 4, Figure 1 is a schematic diagram of the partial structure of the dicing machine in the embodiment provided by the present invention; Figure 2 is a schematic diagram of the principle of the material picking method provided by the present invention; Figure 3 is a schematic diagram of the structure of the clamping jaws of the material picking mechanism in a specific embodiment; Figure 4 is a flow chart of an embodiment of the material picking method provided by the present invention.

The embodiment of the present invention provides a material taking method, which is applied to a dicing machine. The local structure of the dicing machine can be understood with reference to FIG. 1. The dicing machine includes a material taking mechanism 10, a guide rail 20 and a carrier 30; wherein the carrier 30 is located below the guide rail 20, and the carrier 30 is used to carry the workpiece. 411, to facilitate processing of the workpiece 411; the guide rail 20 is used to assist in supporting the workpiece 411 during the process of transferring the workpiece 411; the material taking mechanism 10 can move under program or instruction control to transfer the workpiece 411.

In this embodiment, the material taking method includes:

Step S1, control the clamping jaw 11 of the material picking mechanism 10 to be in the first state, clamp the workpiece 411 from the initial position A1 and move along the first direction D1, and place the workpiece 411 at the transition position A2 on the guide rail 20, wherein in the first direction D1, the transition position A2 exceeds the target position A of the guide rail 20.

In the orientation shown in Figure 2, the first direction D1 here refers to the direction from left to right; here, in the first direction D1, the transition position A2 exceeds the target position A of the guide rail 20, which means that the material picking mechanism 10 drives the workpiece 411 to move along the first direction D1 and passes through the target position A, and continues to move a certain distance to reach the transition position A2. In other words, the transition position A2 is far away from the initial position A1 relative to the target position A.

After the workpiece 411 is placed on the guide rail 20 , it is supported by the guide rail 20 .

In a specific application, when the material picking mechanism 10 drives the workpiece 411 to move along the first direction D1, the workpiece 411 can slide along the upper surface of the guide rail 20. Under the dual effects of the clamping of the clamp 11 and the support of the guide rail 20, the probability of losing the workpiece 411 can be reduced.

Step S2, control the jaws 11 of the picking mechanism 10 to be in the second state, and control the picking mechanism 10 to move along the second direction D2 opposite to the first direction D1, and push the workpiece 411 back from the transition position A2 to the target position A through the determined surface 1121 of the jaws 11 in the second state; wherein, when the workpiece 411 is located at the target position A, the center of the workpiece 411 is opposite to the center of the supporting platform 30. It can be understood that the target position A of the guide rail 20 is opposite to the supporting platform 30, so when the workpiece 411 is pushed back to the target position A, the workpiece 411 is opposite to the supporting platform 30.

The above-mentioned material picking method first controls the material picking mechanism 10 to move the workpiece 411 to a transition position A2 beyond the target position A, and then uses the determination surface 1121 of the clamping jaw 11 of the material picking mechanism 20 to push the workpiece 411 back to the target position A. The clamping jaw 11 has a determination surface 1121 in the second state, and the position of the determination surface 1121 can be accurately known. By contacting the edge of the workpiece 411 with the determination surface 1121 and pushing the workpiece 411 to move, the accuracy of the position movement of the workpiece 411 can be ensured, so that the workpiece 411 can be accurately moved to the target position A, so that the center of the workpiece 411 at the target position A is directly opposite to the center of the carrier 30, and when the workpiece 411 is subsequently transferred from the bottom to the carrier 30, it can be ensured that the workpiece 411 The accuracy of the position of the carrier 30 provides a basis for ensuring the subsequent processing accuracy of the workpiece 411 .

As shown in Figure 3, in this embodiment, the clamp 11 includes two clamps 111 and a mounting seat 112. The mounting seat 112 is connected to the first ends of the two clamps 111. In the orientation shown in Figure 3, the mounting seat 112 is connected to the right end of the clamp 111. In this way, the second ends of the two clamps 111 opposite to the first ends are open structures, and the workpiece 411 can be clamped through the opening.

Specifically, when the clamp 11 is in the aforementioned first state, the two clamps 111 are in a clamped state and can clamp the workpiece 411, that is, the edge of the workpiece 411 is located between the two clamps 111, and the two clamps 111 are in contact with the upper surface and the lower surface of the workpiece 411 respectively to clamp the workpiece 411; when the clamp 11 is in the aforementioned second state, the two clamps 111 are in an open state. At this time, although the edge of the workpiece 411 can still be located between the two clamps 111, because the clamps 111 are opened, the clamps 111 will not contact the workpiece 411 and cannot clamp the workpiece 411. When the clamp 11 is in the second state, the relative position of the clamp 11 and the workpiece 411 can be controlled so that the edge of the workpiece 411 abuts against the mounting seat 112. Even if the mounting seat 112 contacts the peripheral wall of the workpiece 411, when the material picking mechanism 10 is controlled to move along the second direction D2, the mounting seat 112 pushes the workpiece 411 to move along the guide rail 20.

The surface of the mounting seat 112 of the clamping jaw 11 facing the second end of the clamping plate 111 is a determining surface 1121 for pushing the workpiece 411 .

In combination with Figures 2 and 3, specifically, the peripheral wall of the workpiece 411 has a planar portion 4111, and when the jaws 11 clamp the workpiece 411, it clamps the position where the planar portion 4111 is located. Accordingly, when the jaws 11 are in the second state, the determined surface 1121 of the mounting seat 112 abuts against the planar portion 4111. As shown in Figure 3, the determined surface 1121 of the mounting seat 112 includes surface portions located on both sides of the clamping plate 111.

In one achievable manner, there is a calibration relationship between the determination surface 1121 of the clamp 11 and the target position A of the guide rail 20 . In the aforementioned step S2 , the distance between the determination surface 1121 and the target position A is obtained to determine whether the workpiece 411 has moved to the target position A.

Specifically, the relative positions of the guide rail 20 and the support platform 30 of the dicing machine are determined, and the target position A on the guide rail 20 facing the support platform 30 can also be determined. By controlling the driving part (such as the motor screw driving structure) that drives the material picking mechanism 10 to move, the position of the material picking mechanism 10 can be accurately determined. Correspondingly, the determination surface 1121 of the clamping jaw 11 of the material picking mechanism 10 can also be accurately determined, so that the distance between the determination surface 1121 of the clamping jaw 11 and the target position A can be known. Combined with the size of the workpiece 411, the distance between the center of the workpiece 411 and the target position A can be determined, that is, the horizontal distance L between the center of the workpiece 411 and the center of the support platform 30, so that the When the workpiece 411 is pushed to the target position A, the relative distance between the determining surface 1121 of the clamp 11 and the target position A is determined, and then the distance between the determining surface 1121 of the clamp 11 and the target position A is used to determine whether the workpiece 411 has moved to the target position.

In one feasible manner, a sensor (not shown in the figure) is provided on the picking mechanism 10, and the sensor is used to detect the state of the clamping jaw 11 of the picking mechanism 10; in the aforementioned step S1, that is, during the process of the picking mechanism 10 moving from the initial position A1 to the transition position A2, if the sensor detects that the clamping jaw 11 is in an empty clamping state, the picking mechanism 10 is controlled to stop moving and an alarm signal is issued.

In other words, in the process of the jaws 11 of the picking mechanism 10 clamping the workpiece 411 to move the workpiece 411 from the initial position A to the transition position A2, if the jaws 11 are in an empty clamping state, that is, there is no workpiece 411 clamped on the jaws 11, it indicates that the workpiece 411 has fallen from the jaws 11. The sensor can detect the empty clamping state and feed back the corresponding signal to the processor. After receiving the empty clamping signal, the processor controls the picking mechanism 10 to stop moving and sends an alarm signal to inform the staff that the equipment has an abnormality and needs to be dealt with in time to avoid causing greater losses.

In an achievable manner, after the aforementioned step S2, that is, after the workpiece 411 is moved to the target position A of the guide rail 20, the material picking method further includes:

Step S3, control the picking mechanism 10 to move above the workpiece 411, and control the adsorption component 12 of the picking mechanism 10 to adsorb the workpiece 411; control the guide rail 20 to switch to the avoidance position, and control the picking mechanism 10 to drive the workpiece 411 to move downward and place it on the supporting platform 30.

As mentioned above, the guide rail 20 is located above the support platform 30 , and the avoidance position of the guide rail 20 refers to a position that will not block the workpiece 411 from moving down to the support platform 30 , so as to avoid damaging the workpiece 411 or causing the position of the workpiece 411 to shift.

Among them, the adsorption component 12 of the material picking mechanism 10 includes at least one suction cup, which can be adsorbed on the upper surface of the workpiece 411 by vacuuming to adsorb and fix the workpiece 411, ensuring that the workpiece 411 will not fall off when the guide rail 20 switches to the avoidance position and moves the workpiece 411 down to the supporting platform 30.

As shown in FIG. 2 , in a specific application, the guide rail 20 includes a first guide rail 21 and a second guide rail 22. The first guide rail 21 and the second guide rail 22 are arranged in parallel, and the length direction of the two is parallel to the aforementioned first direction D1 or the second direction D2. The guide rail 20 can be cut between the load-bearing position and the aforementioned avoidance position. At the load-bearing position, the distance between the first guide rail 21 and the second guide rail 22 is smaller than the outer diameter of the workpiece 411. As shown in the guide rails indicated by the solid line in the figure, the workpiece 411 can be supported by the first guide rail 21 and the second guide rail 22. At the avoidance position, the distance between the first guide rail 21 and the second guide rail 22 is larger than the outer diameter of the workpiece 411. As shown by the dotted line in the figure, the workpiece 411 will not be hindered by the guide rail 20 when it moves from the height of the guide rail 20 to the carrying platform 30 .

It can be understood that in the aforementioned step S1 , the guide rail 20 is in the carrying position.

In a specific application, the position of the guide rail 20 can be switched by the first guide rail 21 and the second guide rail 22 moving toward or away from each other in a direction perpendicular to the first direction D1 or the second direction D2.

In one possible implementation, the dicing machine includes a loading table 40, which can be located at an initial position A1, and the material picking mechanism 10 clamps the target workpiece to be processed from the position of the loading table 40; specifically, a workpiece box 41 can be placed on the loading table 40, and a plurality of workpieces 411 arranged vertically at intervals are arranged in the workpiece box 41.

The material taking method further comprises, between step S1:

Step S0 , controlling the loading platform 40 to rise and fall in the vertical direction, so that the target workpiece in the workpiece box 41 placed on the loading platform 40 is at the same height position as the support surface of the guide rail 20 .

In this way, it is convenient for the material taking mechanism 10 to clamp the target workpiece. When the target workpiece is driven to move along the first direction D1, the target workpiece can be translated along the guide rail 20 to guide its position and support it.

In the above-mentioned implementations, the workpiece 411 may be a wafer or other workpiece to be processed.

In addition to the above-mentioned material taking method, an embodiment of the present invention further provides a material taking device, which is used for a dicing machine. The structure of the dicing machine is consistent with the above-mentioned description. The material taking device includes:

A first control module is used to control the clamping jaws 11 of the material picking mechanism 10 to be in a first state, that is, a state of clamping the workpiece 411, clamping the workpiece 411 from the initial position A1 and moving it along the first direction D1, and placing the workpiece 411 at a transition position A2 of the guide rail 20; wherein, in the first direction D1, the transition position A2 exceeds the target position A of the guide rail 20;

The second control module is used to control the clamp 11 to be in a second state, i.e., an open state, a state in which the workpiece 411 cannot be clamped, and to control the material picking mechanism 10 to move along a second direction D2 opposite to the first direction D1, and to push the workpiece 411 back from the transition position to the target position through the determined surface 1121 of the clamp 11 in the second state; wherein, when the workpiece 411 is at the target position, the center of the workpiece 411 is opposite to the center of the supporting platform 30.

In a possible implementation, the material picking device further includes a third control module and a fourth control module, wherein the third control module is used to control the material picking mechanism 10 to move to the top of the workpiece 411 and adsorb the workpiece 411, and is also used to control the material picking mechanism 10 to move the adsorbed workpiece 411 downward and place it on the support On the carrier 30 , the fourth control module is used to control the guide rail 20 to switch between the carrying position and the avoidance position.

The working process of the material taking device corresponds to the aforementioned material taking method, and will not be repeated here.

An embodiment of the present invention also provides a dicing machine, which includes a material picking mechanism 10, a guide rail 20 and a support platform 30, and may also include a loading platform 40. The structural arrangements and actions of these components are as described above and will not be repeated here. The dicing machine also includes the above-mentioned material picking device, which can use the above-mentioned material picking method to accurately transfer the workpiece 411 from the loading platform 40 to the support platform 30. The specific process corresponds to the above-mentioned material picking method and will not be repeated here.

An embodiment of the present invention further provides a readable storage medium, on which a program or instruction is stored. When the program or instruction is executed by a processor, the steps of the aforementioned material taking method can be implemented.

An embodiment of the present invention further provides an electronic device, including a processor and a memory, wherein the memory stores a program or instruction that can be run on the processor, and when the program or instruction is executed by the processor, the steps of the aforementioned material extraction method can be implemented.

The above is a detailed introduction to a material taking method, a material taking device, a dicing machine, a readable storage medium and an electronic device provided by the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims (11)

A material taking method is used for a dicing machine, the dicing machine comprises a material taking mechanism, a guide rail and a bearing platform, the bearing platform is located below the guide rail, and is characterized in that the material taking method comprises: Step S1, controlling the clamping jaws of the material picking mechanism to be in a first state, clamping the workpiece from an initial position and moving along a first direction, and placing the workpiece at a transition position of the guide rail; wherein, in the first direction, the transition position exceeds the target position of the guide rail; Step S2, control the clamp to be in a second state, and control the material picking mechanism to move in a second direction opposite to the first direction, and push the workpiece back from the transition position to the target position through the determined surface of the clamp in the second state; wherein, when the workpiece is at the target position, the center of the workpiece is opposite to the center of the support platform. The material taking method according to claim 1 is characterized in that the peripheral wall of the workpiece has a flat surface; the clamping jaw comprises two clamping plates and a mounting seat, and the mounting seat connects the first ends of the two clamping plates; When the clamp is in the first state, the two clamps are in a clamped state; when the clamp is in the second state, the two clamps are in an open state; the surface of the mounting base facing the second end of the clamp is a determining surface for pushing the workpiece; when the clamp pushes the workpiece back, the determining surface abuts against the planar portion. The material retrieving method according to claim 1, characterized in that there is a calibration relationship between the determined surface and the target position; In the step S2, whether the workpiece has moved to the target position is determined by acquiring the distance between the determined surface and the target position. The material taking method according to claim 1 is characterized in that a sensor is provided on the material taking mechanism, and the sensor is used to detect the state of the clamping claw; In the step S1, if the sensor detects that the clamping jaws are in an empty clamping state, the material taking mechanism is controlled to stop moving and an alarm signal is issued. The material taking method according to claim 1 is characterized in that, after step S2, it also includes: Step S3, control the picking mechanism to move to the top of the workpiece, and control the adsorption component of the picking mechanism to adsorb the workpiece; control the guide rail to switch to the avoidance position; control the picking mechanism to drive the workpiece to move downward and place it on the supporting platform. The material retrieving method according to claim 5 is characterized in that the guide rail comprises a first guide rail and a second guide rail, the first guide rail and the second guide rail are arranged in parallel, and the length direction of the first guide rail and the second guide rail is parallel to the first direction; the guide rail can be switched between a load-bearing position and a avoidance position, in which the distance between the first guide rail and the second guide rail is smaller than the outer diameter of the workpiece, and in the avoidance position, the distance between the first guide rail and the second guide rail is larger than the outer diameter of the workpiece; In the step S1, the guide rail is in a carrying position. The material taking method according to any one of claims 1 to 6 is characterized in that the dicing machine includes a loading platform, and the loading platform is located at the initial position; before step S1, it also includes: Step S0, controlling the loading platform to rise and fall in the vertical direction so that the target workpiece in the workpiece box placed on the loading platform is at the same height as the supporting surface of the guide rail; wherein the workpiece box contains a plurality of workpieces arranged in a vertical interval. A material taking device is used for a dicing machine, the dicing machine comprises a material taking mechanism, a guide rail and a bearing platform, the bearing platform is located below the guide rail, and is characterized in that the material taking device comprises: A first control module is used to control the clamping jaws of the material picking mechanism to be in a first state, to clamp the workpiece from an initial position and move along a first direction, and to place the workpiece at a transition position of the guide rail; wherein, in the first direction, the transition position exceeds the target position of the guide rail; The second control module is used to control the clamp to be in a second state, and control the material picking mechanism to move in a second direction opposite to the first direction, and push the workpiece back from the transition position to the target position through the determined surface of the clamp in the second state; wherein, when the workpiece is located at the target position, the center of the workpiece is opposite to the center of the supporting platform. A dicing machine comprises a material taking mechanism, a guide rail and a supporting platform, wherein the supporting platform is located below the guide rail, and is characterized in that the dicing machine also comprises the material taking device according to claim 8. A readable storage medium, characterized in that a program or instruction is stored on the readable storage medium, and when the program or instruction is executed by a processor, the steps of the material taking method as described in any one of claims 1 to 7 are implemented. An electronic device, characterized in that it includes a processor, a memory, and a program or instruction stored in the memory and executable on the processor, wherein the program or instruction, when executed by the processor, implements the steps of the material collection method as described in any one of claims 1 to 7.