CN113161245A - Multi-pin chip intelligent assembly system - Google Patents
Multi-pin chip intelligent assembly system Download PDFInfo
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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Abstract
The invention discloses an intelligent multi-pin chip assembly system, aiming at providing a system which can realize automatic installation of an IGBT module chip; and can effectively solve because of the length of the pin of the unqualified angle of the pin of the chip on the IGBT module and the chip does not conform to the installation requirement, and carry out the many pins chip intelligence assembly system of the problem of handling of doing over again. The IGBT module loading device comprises a rack, a tray, a rotary platform, a loading station, a detection station and a blanking station, wherein the tray is used for placing the IGBT module; the rotary platform is rotatably arranged on the rack, at least three chip positioning stations which are uniformly distributed in the circumferential direction of a rotating shaft of the rotary platform are arranged on the rotary platform, the feeding stations, the detection stations and the discharging stations are sequentially distributed around the rotary platform in the circumferential direction of the rotating shaft of the rotary platform, and the rotary driving executing mechanism is used for driving the rotary platform to rotate so that each chip positioning station sequentially passes through the feeding stations, the detection stations and the discharging stations.
Description
Technical Field
The invention relates to a chip assembly device, in particular to a multi-pin chip intelligent assembly system.
Background
The current IGBT module is provided with a plurality of chips, the chips are multi-pin chips, pins of the chips need to be cut and bent according to the installation requirement of the IGBT module, the length of the pins of the chips meets the installation requirement, and the pins of the chips are bent by 90 degrees to meet the installation requirement. After the pins of the chip are cut and bent, the chip is placed on a chip mounting position on the IGBT module. In the traditional chip installation of the IGBT module, a manual installation mode is adopted, so that the manual installation efficiency is low, and the labor cost is high; therefore, the chip installation of the current IGBT module generally adopts an automatic installation mode, namely, the chip is grabbed by a manipulator and placed on the chip installation position on the IGBT module, so that the automatic installation of the chip of the IGBT module is realized. At present, the automatic installation mode can realize the automatic installation of the chip of the IGBT module; however, after the automatic installation of the chip of the IGBT module is completed, the problem of reworking treatment due to the fact that the bending angle of the pins of the chip on the IGBT module is unqualified and the pins of some chips are not cut is often caused, and the length of the pins of the chip does not accord with the installation requirement.
Disclosure of Invention
The invention aims to provide a method for automatically installing an IGBT module chip; and can effectively solve because of the length of the pin of the unqualified angle of the pin of the chip on the IGBT module and the chip does not conform to the installation requirement, and carry out the many pins chip intelligence assembly system of the problem of handling of doing over again.
The technical scheme of the invention is as follows:
a multi-pin chip intelligent assembly system comprises a rack, a tray, a rotary platform, a loading station, a detection station and a blanking station, wherein the tray is used for placing an IGBT module; the rotary platform is rotationally arranged on the rack, the rack is provided with a rotary driving actuating mechanism for driving the rotary platform to rotate, the rotary platform is provided with at least three chip positioning stations which are uniformly distributed around the circumferential direction of a rotating shaft of the rotary platform, each chip positioning station comprises a chip positioning block and a clamping cylinder, the chip positioning block and the clamping cylinder are arranged on the upper surface of the rotary platform, and the clamping cylinder is used for clamping and positioning a chip placed on the chip positioning block;
the chip positioning device comprises a feeding station, a detection station and a discharging station, wherein the detection station and the discharging station are sequentially distributed around a rotating platform around the circumference of a rotating shaft of the rotating platform;
the feeding station comprises a feeding manipulator, and the feeding manipulator is used for carrying the chip to a chip positioning station rotating to the feeding station;
the detection station comprises a chip pin detection device, and the chip pin detection device is used for detecting the angle and the length of a pin of a chip on a chip positioning station rotating to the detection station;
the blanking station comprises a blanking manipulator, and the blanking manipulator is used for conveying the chip on the chip positioning station rotating to the blanking station to the IGBT module or to the unqualified bin.
The chip pin detection device comprises a lifting frame positioned above a rotary platform, a lifting cylinder used for lifting the lifting frame, a lower limiting block of the lifting frame positioned below the lifting frame and a plurality of detection components arranged on the lifting frame, wherein the detection components correspond to pins of a chip on a chip positioning station one by one, each detection component comprises a vertical guide sleeve arranged on the lifting frame, an angle detection rod arranged in the vertical guide sleeve in a sliding manner, a vertical detection through hole arranged in the angle detection rod and a length detection rod arranged in the vertical detection through hole in a sliding manner, a first limiting block is arranged on the outer side surface of the angle detection rod and abuts against the upper end of the vertical guide sleeve, a second limiting block is arranged on the outer side surface of the length detection rod and abuts against the upper end of the angle detection rod, the upper end of the length detection rod is positioned above the vertical detection through hole, and the lower end of the length detection rod is positioned in the vertical detection through hole,
when the chip on the chip positioning station rotates to the detection station, the lifting cylinder drives the lifting frame and each detection assembly to move downwards together until the lifting frame abuts against the lower limiting block of the lifting frame, and in the process, if the angle and the length of the pins of the chip on the chip positioning station meet the set requirements, the pins of the chip on the chip positioning station can be smoothly inserted into the corresponding vertical detection through holes, and the corresponding length detection rods are kept still;
if the angle of the pin in the pin of the chip on the chip positioning station does not meet the set requirement, the pin with the angle not meeting the set requirement is abutted against the lower end face of the corresponding angle detection rod, and the corresponding angle detection rod and the length detection rod are jacked up;
if the angle of the pin in the pin of the chip on the chip positioning station meets the set requirement, but the length of the pin exceeds the set requirement, the angle meets the set requirement, and the pin with the length exceeding the set requirement jacks up the corresponding length detection rod after being smoothly inserted into the corresponding vertical detection through hole.
When the multi-pin chip intelligent assembly system is used for installing the chip, the chip (the chip which completes pin cutting and bending) is firstly carried to a chip positioning station which rotates to a feeding station through a feeding manipulator; rotating the chip to a detection station through a rotating platform;
then, detecting the angle and the length of the pin of the chip on the chip positioning station from the rotation position to the detection position through the chip pin detection device, specifically, driving the lifting frame and each detection assembly to move downwards together by the lifting cylinder until the lifting frame abuts against the lower limiting block of the lifting frame, and in the process, if the pin of the chip on the chip positioning station can be smoothly inserted into the corresponding vertical detection through hole and the corresponding length detection rod is kept still, indicating that the angle and the length of the pin of the chip on the chip positioning station both meet the set requirements;
if the angle of the pin in the pin of the chip on the chip positioning station does not meet the set requirement, the pin with the angle not meeting the set requirement is abutted against the lower end face of the corresponding angle detection rod, and the corresponding angle detection rod and the length detection rod are jacked up; if the angle of the pin in the pin of the chip on the chip positioning station meets the set requirement, but the length of the pin exceeds the set requirement, the angle meets the set requirement, and the pin with the length exceeding the set requirement jacks up the corresponding length detection rod after being smoothly inserted into the corresponding vertical detection through hole; that is, as long as the length detection rod is jacked up, it indicates that at least one of the angles and the lengths of the pins of the chip on the chip positioning station is uneven and meets the set requirement; therefore, the pin angle and the pin length of the chip can be detected in the radial direction synchronously through the same detection assembly without step detection, so that the detection steps can be effectively simplified, and the detection efficiency is improved;
then, the chip is rotated to a blanking station through a rotary platform, and if the angle and the length of the pin of the chip on the chip positioning station detected in the detection station meet the set requirements, the chip on the chip positioning station rotated to the blanking station is conveyed to the IGBT module by a blanking manipulator; if the chip is not detected to be qualified, the blanking manipulator conveys the chip on the chip positioning station rotating to the blanking station to a unqualified bin; therefore, the automatic installation of the IGBT module chip can be realized; and the pin bending angle and the length of the chip are detected, and the chip with the pin bending angle and the length unqualified is kicked out, so that the problems that the pin bending angle of the chip on the IGBT module is unqualified, the length of the pin of the chip is not qualified for installation requirements, and rework processing is carried out can be effectively solved.
Preferably, the detection assembly further comprises a detection sensor arranged on the lifting frame, and the detection sensor is used for sensing the upper end position of the corresponding length detection rod. Therefore, the upper end position of the length detection rod can be sensed through the detection sensor, and if one detection sensor detects that the length detection rod is jacked up, it is indicated that at least one of the angles and the lengths of the pins of the chip on the chip positioning station is uneven and meets the set requirement, and the blanking manipulator can convey the chip to the unqualified bin instead.
Preferably, the outer edge of the lower end face of the angle detection rod is provided with an annular stop block extending outwards, and the lower end face of the annular stop block is flush with the lower end face of the angle detection rod. Therefore, when the angle deviation of the pin of the chip is large, the angle detection rod can be jacked up through the annular stop block.
Preferably, the chip pin detection device comprises a vertical guide rod arranged on the rack, a lifting frame guide sleeve matched with the vertical guide rod is arranged on the lifting frame, the lower limiting block of the lifting frame is arranged on the vertical guide rod, the lower limiting block of the lifting frame is located below the lifting frame guide sleeve, and the upper limiting block of the lifting frame is arranged on the vertical guide rod and above the lifting frame guide sleeve.
Preferably, the chip positioning block is provided with a chip positioning groove.
Preferably, the method further comprises the following steps: the tray is supported on the conveying track and conveyed through the conveying track; the tray keeps off and stops the device, and the tray keeps off and stops the device and includes that to block and set up and be used for going up and down to block the first lift final controlling element that stops in the frame, blocks and is used for keeping off the tray on stopping the transfer orbit.
Preferably, the lifting positioning device comprises a tray lifting column, a tray positioning block positioned above the conveying track and a second lifting execution device, wherein the second lifting execution device is used for lifting the tray lifting column, and jacking the tray stopped by the blocking piece and enabling the tray to abut against the tray positioning block.
Preferably, the chip pin shearing and bending device is further included and arranged on the rack, and the chip pin shearing and bending device is used for shearing and bending pins of the chip.
The invention has the beneficial effects that: the automatic installation of the IGBT module chip can be realized; and the problem of reworking treatment due to unqualified bending angle of the pins of the chip on the IGBT module and the fact that the length of the pins of the chip does not accord with the installation requirement can be effectively solved.
Drawings
Fig. 1 is a partial schematic structural diagram of a three-dimensional view angle of a multi-pin chip intelligent assembly system according to a first embodiment of the present invention.
Fig. 2 is a partial front view of a multi-pin chip intelligence assembly system in accordance with an embodiment of the present invention.
Fig. 3 is a partially enlarged view of a portion a in fig. 2.
Fig. 4 is a schematic diagram of a three-dimensional view of a multi-pin chip assembly system according to a second embodiment of the present invention.
Fig. 5 is a schematic structural diagram of a chip pin-shearing bending device according to a third embodiment of the present invention.
Fig. 6 is a partially enlarged view at B in fig. 5.
In the figure:
a tray 1.1;
a conveying track 1.2;
the tray stopping device 1.3, the blocking piece 1.31 and the first lifting executing device 1.32;
a tray positioning block 1.4;
an IGBT module 2, a chip 2.1 and a pin 2.11;
a scissor advancing and retreating mechanism 3.1, a first guide rail 3.11, a main sliding seat 3.12 and an advancing and retreating actuating mechanism 3.13;
the chip positioning device 3.2, the chip positioning clamping jaw 3.21, the clamping block 3.22 and the mounting bracket 3.23;
the chip pin shearing and bending one-step forming mechanism comprises a chip pin shearing and bending one-step forming mechanism 3.3, a second guide rail 3.31, an upper sliding seat 3.32, a translation executing mechanism 3.33, a pin shearing and bending cutter 3.34, a shearing edge 3.341, a bending part 3.342, a pin shearing blade 3.35, a bending baffle 3.36 and a cutter accommodating port 3.37;
the floating type gap eliminating device comprises a floating type gap eliminating device 3.4, a third guide rail 3.41, a floating slide seat 3.42, a floating column accommodating opening 3.43, a side wall inclined surface 3.44, a push plate 3.45, a supporting plane 3.46, a pushing inclined surface 3.47, a vertical guide sleeve 3.48, a floating column 3.49, a roller 3.410, a floating column inclined surface 3.411 and a floating column limiting block 3.412;
a rotating platform 4.1;
a chip positioning station 4.2, a chip positioning block 4.21 and a clamping cylinder 4.22;
a feeding station 4.3;
the device comprises a detection station 4.4, a lifting frame 4.41, a detection assembly 4.42, a vertical guide sleeve 4.421, an angle detection rod 4.422, a first limiting block 4.423, a length detection rod 4.424, a second limiting block 4.425, an annular stop 4.426, a lifting cylinder 4.43, a lifting frame lower limiting block 4.44, a vertical guide rod 4.45 and a lifting frame upper limiting block 4.46.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention are clearly explained and illustrated below with reference to the accompanying drawings, but the following embodiments are only preferred embodiments of the present invention, and not all embodiments. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative effort belong to the protection scope of the present invention.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present scheme, and are not construed as limiting the scheme of the present invention.
These and other aspects of embodiments of the invention will be apparent with reference to the following description and attached drawings. In the description and drawings, particular embodiments of the invention have been disclosed in detail as being indicative of some of the ways in which the principles of the embodiments of the invention may be practiced, but it is understood that the scope of the embodiments of the invention is not limited thereby. On the contrary, the embodiments of the invention include all changes, modifications and equivalents coming within the spirit and terms of the claims appended hereto.
In the description of the present invention, it is to be understood that the terms "thickness", "upper", "lower", "horizontal", "top", "bottom", "inner", "outer", "circumferential", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., and "several" means one or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The first embodiment is as follows: as shown in fig. 1 and 2, the multi-pin chip intelligent assembly system comprises a rack, a tray 1.1, a rotary platform 4.1, a feeding station 4.3, a detection station 4.4 and a discharging station.
The tray is used for placing IGBT module 2, is equipped with the locating pin of vertical distribution on the tray for the location IGBT module, and the IGBT module is placed on the tray, has the fabrication hole on the IGBT module, and this fabrication hole cooperates with the locating pin. In this embodiment, the tray is fixedly placed on the rack.
The rotary platform 4.1 is rotatably arranged on a frame, and the frame is provided with a rotary driving executing mechanism for driving the rotary platform to rotate. Four chip positioning stations 4.2 which are uniformly distributed in the circumferential direction around the rotating shaft of the rotating platform are arranged on the rotating platform. Each chip positioning station comprises a chip positioning block 4.21 and a clamping cylinder 4.22 which are arranged on the upper surface of the rotary platform. The clamping cylinder is used for clamping and positioning the chip placed on the chip positioning block. In this embodiment, the chip positioning block is provided with a chip positioning groove.
The material loading station, the detection station and the material unloading station are sequentially distributed around the rotary platform around the circumference of the rotary platform. The rotary driving executing mechanism is used for driving the rotary platform to rotate so that each chip positioning station sequentially passes through the feeding station, the detection station and the discharging station.
Material loading station 4.2 includes material loading manipulator, and material loading manipulator is used for carrying the chip rotatory to the chip location station of material loading station on, and in this embodiment, material loading manipulator absorbs the chip through the sucking disc, perhaps snatchs the chip through the clamping jaw.
The blanking station comprises a blanking manipulator, and the blanking manipulator is used for conveying the chip on the chip positioning station rotating to the blanking station to the specified position of the IGBT module or to the unqualified bin. In this embodiment, the chip is absorb through the sucking disc to the unloading manipulator, perhaps snatchs the chip through the clamping jaw.
As shown in fig. 1, 2 and 3, the detection station includes a chip pin detection device, and the chip pin detection device is used for detecting the angle and length of a pin of a chip on a chip positioning station rotating to the detection station. The chip pin detection device comprises a lifting frame 4.41 positioned above the rotary platform, a lifting cylinder 4.43 used for lifting the lifting frame, a lifting frame lower limiting block 4.44 positioned below the lifting frame and a plurality of detection components 4.42 arranged on the lifting frame. The detection components correspond to the pins of the chip on the chip positioning station one by one, and in the embodiment, the number of the pins of the chip is three. The detection assembly comprises a vertical guide sleeve 4.421 arranged on the lifting frame, an angle detection rod 4.422 arranged in the vertical guide sleeve in a sliding mode, a vertical detection through hole arranged in the angle detection rod and a length detection rod 4.424 arranged in the vertical detection through hole in a sliding mode. The lateral surface of angle detection pole is equipped with first stopper 4.423, and first stopper supports the upper end at vertical guide pin bushing. The lateral surface of length detection pole is equipped with second stopper 4.425, and the second stopper supports the upper end at angle detection pole. The upper end of the length detection rod is positioned above the vertical detection through hole, and the lower end of the length detection rod is positioned in the vertical detection through hole.
When the chip on the chip positioning station rotates to the detection station, the lifting cylinder drives the lifting frame and each detection assembly to move downwards together until the lifting frame abuts against the lower limiting block of the lifting frame, and in the process, if the angle and the length of the pins of the chip on the chip positioning station meet the set requirements, the pins of the chip on the chip positioning station can be smoothly inserted into the corresponding vertical detection through holes, and the corresponding length detection rods are kept still; in this embodiment, the angles of the pins of the chip are 90 degrees ± 1 degree, and the angles of the pins of the chip all meet the setting requirement.
If the angle of the pin in the pin of the chip on the chip positioning station does not meet the set requirement, the pin with the angle not meeting the set requirement is abutted against the lower end face of the corresponding angle detection rod, and the corresponding angle detection rod and the length detection rod are jacked up;
if the angle of the pin in the pin of the chip on the chip positioning station meets the set requirement, but the length of the pin exceeds the set requirement, the angle meets the set requirement, and the pin with the length exceeding the set requirement jacks up the corresponding length detection rod after being smoothly inserted into the corresponding vertical detection through hole.
When a chip is installed, a chip 2.1 (a chip which completes pin cutting and bending) is firstly carried to a chip positioning station which rotates to a feeding station through a feeding manipulator, the chip is horizontally placed on a chip positioning block and is positioned through a chip positioning groove, and pins 2.11 of the chip are vertically distributed (specifically, pins of the chip, of which the pin bending angles meet the requirements, on the chip positioning block are vertically distributed); then, the chip is rotated to a detection station through a rotating platform;
then, detecting the angle and the length of the pin of the chip on the chip positioning station from the rotation position to the detection position through the chip pin detection device, specifically, driving the lifting frame and each detection assembly to move downwards together by the lifting cylinder until the lifting frame abuts against the lower limiting block of the lifting frame, and in the process, if the pin of the chip on the chip positioning station can be smoothly inserted into the corresponding vertical detection through hole and the corresponding length detection rod is kept still, indicating that the angle and the length of the pin of the chip on the chip positioning station both meet the set requirements;
if the angle of the pin in the pin of the chip on the chip positioning station does not meet the set requirement, the pin with the angle not meeting the set requirement is abutted against the lower end face of the corresponding angle detection rod, and the corresponding angle detection rod and the length detection rod are jacked up; if the angle of the pin in the pin of the chip on the chip positioning station meets the set requirement, but the length of the pin exceeds the set requirement, the angle meets the set requirement, and the pin with the length exceeding the set requirement jacks up the corresponding length detection rod after being smoothly inserted into the corresponding vertical detection through hole; that is, as long as the length detection rod is jacked up, it indicates that at least one of the angles and the lengths of the pins of the chip on the chip positioning station is uneven and meets the set requirement; therefore, the pin angle and the pin length of the chip can be detected in the radial direction synchronously through the same detection assembly without step detection, so that the detection steps can be effectively simplified, and the detection efficiency is improved;
then, the chip is rotated to a blanking station through a rotary platform, and if the angle and the length of the pin of the chip on the chip positioning station detected in the detection station meet the set requirements, the chip on the chip positioning station rotated to the blanking station is conveyed to the IGBT module by a blanking manipulator; if the detection is not qualified, the blanking manipulator conveys the chip on the chip positioning station rotating to the blanking station to a unqualified bin (the frame is provided with the unqualified bin); therefore, the automatic installation of the IGBT module chip can be realized; and the pin bending angle and the length of the chip are detected, and the chip with the pin bending angle and the length unqualified is kicked out, so that the problems that the pin bending angle of the chip on the IGBT module is unqualified, the length of the pin of the chip is not qualified for installation requirements, and rework processing is carried out can be effectively solved.
Further, the detection assembly further comprises a detection sensor arranged on the lifting frame, and the detection sensor is used for sensing the upper end position of the corresponding length detection rod. Therefore, the upper end position of the length detection rod can be sensed through the detection sensor, and if one detection sensor detects that the length detection rod is jacked up, it is indicated that at least one of the angles and the lengths of the pins of the chip on the chip positioning station is uneven and meets the set requirement, and the blanking manipulator can convey the chip to the unqualified bin instead.
Further, as shown in fig. 3, an outer edge of a lower end surface of the angle detection lever is provided with an annular stopper 4.426 extending outward, and a lower end surface of the annular stopper is flush with the lower end surface of the angle detection lever. Therefore, when the angle deviation of the pin of the chip is large, the angle detection rod can be jacked up through the annular stop block.
Further, as shown in fig. 3, the chip pin detection device comprises a vertical guide rod 4.45 arranged on the rack, a lifting frame guide sleeve matched with the vertical guide rod is arranged on the lifting frame, a lower limiting block of the lifting frame is arranged on the vertical guide rod, the lower limiting block of the lifting frame is positioned below the lifting frame guide sleeve, and an upper limiting block 4.46 of the lifting frame is arranged on the vertical guide rod and above the lifting frame guide sleeve. So, be favorable to improving the lift stability of crane.
In a second embodiment, the remaining structure of the present embodiment refers to the first embodiment, and the difference therebetween is that:
as shown in fig. 4, the multi-pin chip intelligent assembly system further includes a conveying track 1.2, a tray stopping device 1.3, and a lifting positioning device. In this embodiment, the pallet 1.1 is supported on and transported by the transport track. The tray stopping device comprises a stopping piece 1.31 and a first lifting execution device 1.32 which is arranged on the rack and used for lifting the stopping piece, wherein the stopping piece is used for stopping the tray on the conveying track. The lifting positioning device comprises a tray lifting column, a tray positioning block 1.4 positioned above the conveying track and a second lifting execution device. The tray lifting column is positioned below the tray. The second lifting executing device is used for lifting the tray lifting column, jacking the tray stopped by the blocking piece and enabling the tray to abut against the tray positioning block. The first lifting execution device and the second lifting execution device are both cylinders.
When the conveying track conveys the tray to the blocking piece, the tray is blocked and stopped by the blocking piece; at the moment, the lifting positioning device lifts the tray lifting column, the tray stopped by the blocking piece is jacked up and is abutted against the tray positioning block, so that the tray is separated from the conveying track and is fixed, and the position of the tray is influenced by the transmission of the conveying track; after the chip of the IGBT module is installed, the lifting positioning device controls the lifting column of the tray to descend, so that the tray is supported on the conveying track; then first lift final controlling element drives to block and keeps off the piece and descend, makes to block and is located the tray below to the tray is released, through carrying the track with the tray down transport.
In a third embodiment, the remaining structure of this embodiment refers to the first or second embodiment, and the difference is that:
as shown in fig. 5 and 6, the multi-pin chip intelligent assembling system further includes a chip pin-shearing bending device. The chip pin shearing and bending device is arranged on the rack and used for shearing and bending pins of the chip.
The chip pin shearing and bending device comprises a pin shearing advancing and retreating mechanism 3.1, a chip positioning device 3.2 and a chip pin shearing and bending one-step forming mechanism 3.3.
The foot-cutting advancing and retreating mechanism 3.1 comprises a first guide rail 3.11 arranged on the frame, a main sliding seat 3.12 sliding along the first guide rail and an advancing and retreating executing mechanism 3.13 arranged on the frame and used for driving the main sliding seat to move; in this embodiment, the first guide rails are horizontally arranged, and the advancing and retreating actuator is an air cylinder.
The chip positioning device 3.2 comprises a chip positioning clamping jaw 3.21 arranged on the main sliding seat, and the chip positioning clamping jaw is used for clamping and fixing a chip to be bent by a pin to be cut; in this embodiment, the main slide is provided with a mounting bracket 3.23, and the chip positioning clamping jaw is fixed on the mounting bracket. The chip positioning clamping jaw is a pneumatic finger, two clamping fingers of the pneumatic finger are respectively provided with a clamping block 3.22, and two opposite side surfaces of the clamping blocks on the two clamping fingers are respectively provided with a block elastic plate.
The chip pin shearing and bending one-step forming mechanism 3.3 comprises a pin shearing and bending cutter assembly, a second guide rail 3.31 arranged on the main sliding seat and parallel to the first guide rail, an upper sliding seat 3.32 sliding along the second guide rail and a translation executing mechanism 3.33 arranged on the machine frame and used for driving the upper sliding seat to move. In this embodiment, the translation actuator is a cylinder.
The pin-shearing bending cutter assembly comprises a pin-shearing bending cutter 3.34 arranged on the upper sliding seat, a pin-shearing blade 3.35 and a bending baffle 3.36 arranged on the machine frame. A cutter accommodating opening 3.37 is formed between the foot cutting blade and the bending baffle. The pin-shearing bending cutter comprises a shearing edge 3.341 matched with the pin-shearing blade and a bending part 3.342 matched with the bending baffle. The cutter holds mouthful and cuts foot bending cutter and distributes along main slide moving direction, and the opening of cutter holding mouthful is towards cutting the foot bending cutter.
The translation actuating mechanism is used for driving the upper sliding seat and the shearing foot bending cutter to move along the second guide rail and enabling the shearing foot bending cutter to move into the cutter accommodating port; cut the foot and bend the cutter and remove the intraoral in-process that holds to the cutter, cut the foot and bend the shearing sword of cutter and cooperate with cutting the foot blade earlier to the realization cuts the foot to the pin of chip, then cut the foot and bend the portion of bending of cutter and cooperate with the baffle of bending again, in order to realize bending the pin of chip.
In this embodiment, cut foot advancing and retreating mechanism still includes the main slide stopper that sets up in the frame, and main slide stopper is located same one side of main slide with cutting the foot blade.
The specific work of the chip pin shearing and bending device of the IGBT module of this embodiment is as follows:
firstly, as shown in fig. 1 and 2, the forward and backward actuator drives the main slide seat and the chip positioning device to move to the cutting-pin bending cutter direction in place, and specifically, the forward and backward actuator drives the main slide seat and the chip positioning device to move to the cutting-pin bending cutter direction until the main slide seat abuts against the main slide seat limiting block; then, clamping and fixing the chip 2.1 to be subjected to pin shearing bending on a chip positioning clamping jaw, wherein the chips clamped and fixed on the chip positioning clamping jaw are vertically distributed, pins of the chips are also vertically distributed, and the pins of the chips extend towards the direction;
secondly, the translation executing mechanism drives the upper sliding seat and the shearing foot bending cutter to move along the second guide rail, and the shearing foot bending cutter moves into the cutter accommodating port; in the process that the pin shearing and bending cutter moves into the cutter accommodating port, the shearing edge of the pin shearing and bending cutter is matched with the pin shearing blade to shear the pins of the chip, and then the bending part of the pin shearing and bending cutter is matched with the bending baffle to bend the pins of the chip; and then at same station, the pin of chip is cut and is bent (the pin of chip is bent and is 90 degrees) to the realization in same process to effectively improve the efficiency that the chip was cut the pin and is bent the processing, once fix a position and accomplish the pin of chip and cut the pin and bend moreover, therefore can effectively solve because of cutting the pin and bending the chip positioning error of twice manufacturing procedure, and the problem that influences the size precision after the shaping of chip pin cut.
Further, as shown in fig. 1 and 2, the bending baffle is located above the foot-cutting blade, the end surface of the foot-cutting bending cutter facing the cutter accommodating opening forms a cutter inclined surface 3.343, the lower part of the cutter inclined surface inclines towards the cutter accommodating opening, the intersection part of the cutter inclined surface and the lower surface of the foot-cutting bending cutter forms the cutting edge, and the intersection part of the cutter inclined surface and the upper surface of the foot-cutting bending cutter forms the bending part. Therefore, the pin shearing and bending of the chip pin can be realized through the cutter inclined plane of the same pin shearing bending cutter, the cutter structure can be further simplified, and the pin shearing bending processing efficiency of the chip is improved.
The inclined angle of the cutter inclined plane is 85 degrees. The bending baffle is parallel to the pin shearing blade.
In this embodiment, one side of bending the cutter towards the pin scissors blade is equipped with the pin scissors cutting edge that cooperates with the shearing edge, bends towards the side of bending the cutter towards the pin scissors on the baffle and is located same vertical plane with the pin scissors cutting edge.
Further, as shown in fig. 1 and 2, the chip pin-shearing bending device of the IGBT module further includes a floating gap-eliminating device 3.4. The floating type gap eliminating device comprises a return spring, a third guide rail 3.41 which is arranged on the rack and is parallel to the first guide rail, a floating slide seat 3.42 which slides along the third guide rail, a floating column accommodating port 3.43 which is arranged on the floating slide seat and has a downward opening, a vertical guide sleeve 3.48 which is arranged on the rack and is positioned below the floating slide seat, a floating column 3.49 which slides up and down along the vertical guide sleeve, a roller 3.410 which is arranged at the lower end of the floating column and a push plate 3.45 which is positioned below the floating column. The bending baffle and the pin shearing blade are both fixed on the floating sliding seat. The push plate is fixed on the upper sliding seat, the upper surface of the push plate comprises a supporting plane 3.46 and a pushing inclined plane 3.47 which are matched with the roller, the supporting plane and the pushing inclined plane are distributed along the direction of the first guide rail, the supporting plane is parallel to the first guide rail, and the supporting plane is horizontally distributed. Be equipped with lateral wall inclined plane 3.44 on the lateral wall of unsteady post holding opening, the upper portion of unsteady post stretches into in the unsteady post holding opening, and the upper portion of unsteady post is equipped with the unsteady post inclined plane 3.411 with lateral wall inclined plane complex.
The floating sliding seat moves towards the direction far away from the shear pin bending cutter under the action of the return spring, and the side wall inclined plane abuts against the inclined plane of the floating column. In this embodiment, reset spring and cut foot bending cutter and lie in the same one side of unsteady slide, and reset spring's one end supports in the frame, and the other end supports on unsteady slide. The return spring is not shown in the figures.
In the process that the translation actuating mechanism drives the upper sliding seat to move towards the direction of the cutter accommodating opening, the pushing inclined plane is firstly contacted with the roller and pushes the floating column to move upwards along the vertical guide sleeve, the floating sliding seat, the bending baffle and the pin shearing blade move towards the pin shearing bending cutter direction through the cooperation of the inclined plane of the floating column and the inclined plane of the side wall, then the roller is supported on the supporting plane, the floating column is kept still in the process that the roller is supported on the supporting plane, and the floating sliding seat, the bending baffle and the pin shearing blade are also kept still.
In order to ensure that the pins of the chip do not interfere with the bending baffle and the pin shearing blade in the process of vertically placing the chip on the chip positioning clamping jaw, after the chip is placed, clamped and fixed on the chip positioning clamping jaw, a certain gap needs to be reserved between the pins of the chip and the bending baffle and the pin shearing blade; moreover, because the pins of the chip can be bent at a small angle, the gap required to be reserved between the pins of the chip and the bending baffle and the pin shearing blade cannot be too small, and the gap is generally reserved for 1-2 mm; therefore, the chip can be smoothly placed, clamped and fixed on the chip positioning clamping jaw, and cannot interfere with the bending baffle and the pin shearing blade; but also a 1-2 mm gap is formed between the pin of the chip fixed on the chip positioning clamping jaw and the bending baffle and the pin cutting blade; due to the existence of the gap, in the process that the translation actuating mechanism drives the pin shearing and bending cutter to move into the cutter accommodating port, the shearing edge of the pin shearing and bending cutter firstly abuts against the pin of the chip until the pin of the chip abuts against the pin shearing cutter, and the pin of the chip is bent in the process, so that the size precision of the chip after pin shearing and bending forming is influenced; in order to solve the problem, the floating type gap eliminating device is arranged, so that the problem that the size precision of a chip after bending and forming of a chip pin is influenced due to the fact that the chip pin is bent in the pin cutting process under the condition that the chip can be placed smoothly, clamped and fixed on a chip positioning clamping jaw and cannot interfere with a bending baffle and a pin cutting blade is effectively solved, and the problem that the chip pin is bent in the pin cutting process due to the fact that a 1-2 mm gap exists between the pin of the chip fixed on the chip positioning clamping jaw and the bending baffle and the pin cutting blade is solved; in particular, the method comprises the following steps of,
in the scheme, after the chip is placed, clamped and fixed on the chip positioning clamping jaw, a gap is reserved between the pin of the chip and the bending baffle and between the pin of the chip and the pin cutting blade, so that the chip can be smoothly placed, clamped and fixed on the chip positioning clamping jaw and cannot interfere with the bending baffle and the pin cutting blade;
in the process that the translation actuating mechanism drives the pin shearing bending cutter to move into the cutter accommodating port, the pushing inclined plane is firstly contacted with the roller and pushes the floating column to move upwards along the vertical guide sleeve, so that the inclined plane of the floating column is abutted against the inclined plane of the side wall, and the floating sliding seat, the bending baffle and the pin shearing blade are pushed to move towards the pin shearing bending cutter, so that the bending baffle and the pin shearing blade are close to pins of a chip, then, the roller is supported on a supporting plane, and at the moment, gaps among the pins of the chip, the bending baffle and the pin shearing blade are eliminated or greatly reduced; meanwhile, the floating column is kept still, the floating slide seat, the bending baffle and the pin shearing blade are also kept still, and then the roller is kept supported on the supporting plane in the process that the translation executing mechanism is used for driving the upper slide seat and the pin shearing bending cutter to move along the second guide rail and enabling the pin shearing bending cutter to move into the cutter accommodating port; then, the shearing edge of the pin shearing and bending cutter is matched with the pin shearing blade to shear the pins of the chip, and then the bending part of the pin shearing and bending cutter is matched with the bending baffle to bend the pins of the chip; therefore, the problem that the size precision of the chip pin after bending and forming of the chip pin is influenced due to the fact that a 1-2 mm gap exists between the pin of the chip fixed on the chip positioning clamping jaw and the bending baffle and the pin cutting blade and the chip pin is bent in the pin cutting process is effectively solved under the condition that the chip can be smoothly placed, clamped and fixed on the chip positioning clamping jaw and cannot interfere with the bending baffle and the pin cutting blade.
Furthermore, a floating column limiting block 3.412 is arranged on the outer side face of the floating column and is positioned above the vertical guide sleeve. Therefore, the translation executing mechanism drives the upper sliding seat and the shearing foot bending cutter to move in the direction away from the cutter accommodating opening, and after the push plate is separated from the roller, the floating column moves downwards under the action of self weight until the floating column limiting block abuts against the vertical guide sleeve; meanwhile, the floating sliding seat moves away from the direction of the bending cutter of the shearing leg under the action of the reset spring.
Furthermore, the chip pin shearing and bending device of the IGBT module further comprises a feeding and discharging manipulator and a transfer platform. The loading and unloading manipulator is used for grabbing the chip (the chip with the pin to be sheared and bent). The loading and unloading manipulator grabs the chips (the chips are vertically distributed) to be bent by the pin shearing, places the chips to be bent by the pin shearing at the chip positioning clamping jaw, and clamps and fixes the chips to be bent by the pin shearing on the chip positioning clamping jaw so as to realize automatic loading of the chips; in a similar way, after the chip is bent by shearing the pins, the chip positioning clamping jaw is grabbed by the feeding and discharging manipulator (the chip after the bending of the pins is completed), the chip is taken away, the chip is placed on the transfer platform, the chip is flatly placed on the transfer platform, and the pins of the chip are vertically distributed. The feeding manipulator is used for carrying the chip on the transfer platform to a chip positioning station rotating to the feeding station.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and all simple modifications, alterations and equivalents of the above embodiments according to the technical spirit of the present invention are still within the protection scope of the technical solution of the present invention.
Claims (9)
1. The multi-pin chip intelligent assembly system is characterized by comprising a rack, a tray, a rotary platform, a feeding station, a detection station and a discharging station, wherein the tray is used for placing an IGBT module; the rotary platform is rotationally arranged on the rack, the rack is provided with a rotary driving actuating mechanism for driving the rotary platform to rotate, the rotary platform is provided with at least three chip positioning stations which are uniformly distributed around the circumferential direction of a rotating shaft of the rotary platform, each chip positioning station comprises a chip positioning block and a clamping cylinder, the chip positioning block and the clamping cylinder are arranged on the upper surface of the rotary platform, and the clamping cylinder is used for clamping and positioning a chip placed on the chip positioning block;
the chip positioning device comprises a feeding station, a detection station and a discharging station, wherein the detection station and the discharging station are sequentially distributed around a rotating platform around the circumference of a rotating shaft of the rotating platform;
the feeding station comprises a feeding manipulator, and the feeding manipulator is used for carrying the chip to a chip positioning station rotating to the feeding station;
the detection station comprises a chip pin detection device, and the chip pin detection device is used for detecting the angle and the length of a pin of a chip on a chip positioning station rotating to the detection station;
the blanking station comprises a blanking manipulator, and the blanking manipulator is used for conveying the chip on the chip positioning station rotating to the blanking station to the IGBT module or to the unqualified bin.
2. The intelligent assembling system of multi-pin chip as claimed in claim 1, wherein the chip pin detecting device comprises a lifting frame above the rotary platform, a lifting cylinder for lifting the lifting frame, a lower limiting block of the lifting frame below the lifting frame, and a plurality of detecting components arranged on the lifting frame, the detecting components correspond to the pins of the chip on the chip positioning station one by one, the detecting components comprise a vertical guide sleeve arranged on the lifting frame, an angle detecting rod slidingly arranged in the vertical guide sleeve, a vertical detecting through hole arranged in the angle detecting rod, and a length detecting rod slidingly arranged in the vertical detecting through hole, the outer side surface of the angle detecting rod is provided with a first limiting block, the first limiting block abuts against the upper end of the vertical guide sleeve, the outer side surface of the length detecting rod is provided with a second limiting block, the second limiting block abuts against the upper end of the angle detecting rod, the upper end of the length detection rod is positioned above the vertical detection through hole, the lower end of the length detection rod is positioned in the vertical detection through hole,
when the chip on the chip positioning station rotates to the detection station, the lifting cylinder drives the lifting frame and each detection assembly to move downwards together until the lifting frame abuts against the lower limiting block of the lifting frame, and in the process, if the angle and the length of the pins of the chip on the chip positioning station meet the set requirements, the pins of the chip on the chip positioning station can be smoothly inserted into the corresponding vertical detection through holes, and the corresponding length detection rods are kept still;
if the angle of the pin in the pin of the chip on the chip positioning station does not meet the set requirement, the pin with the angle not meeting the set requirement is abutted against the lower end face of the corresponding angle detection rod, and the corresponding angle detection rod and the length detection rod are jacked up;
if the angle of the pin in the pin of the chip on the chip positioning station meets the set requirement, but the length of the pin exceeds the set requirement, the angle meets the set requirement, and the pin with the length exceeding the set requirement jacks up the corresponding length detection rod after being smoothly inserted into the corresponding vertical detection through hole.
3. The system of claim 2, wherein the testing assembly further comprises a testing sensor disposed on the lifting frame, the testing sensor being configured to sense an upper end position of the corresponding length testing rod.
4. The multi-pin chip intelligent assembly system according to claim 2 or 3, wherein the outer edge of the lower end surface of the angle detection rod is provided with an annular stop extending outwards, and the lower end surface of the annular stop is flush with the lower end surface of the angle detection rod.
5. The intelligent assembling system of multi-pin chips as claimed in claim 2 or 3, wherein the chip pin detection device comprises a vertical guide rod arranged on the frame, a lifting frame guide sleeve matched with the vertical guide rod is arranged on the lifting frame, the lower limiting block of the lifting frame is arranged on the vertical guide rod and is located below the lifting frame guide sleeve, and an upper limiting block of the lifting frame is further arranged on the vertical guide rod and above the lifting frame guide sleeve.
6. The system of claim 1, 2 or 3, wherein the chip positioning block is provided with a chip positioning groove.
7. A multi-pin chip smart provisioning system according to claim 1, 2 or 3, further comprising:
the tray is supported on the conveying track and conveyed through the conveying track;
the tray keeps off and stops the device, and the tray keeps off and stops the device and includes that to block and set up and be used for going up and down to block the first lift final controlling element that stops in the frame, blocks and is used for keeping off the tray on stopping the transfer orbit.
8. The clip installing apparatus of an IGBT module according to claim 7, further comprising a lifting positioning device, the lifting positioning device comprising a tray lifting column, a tray positioning block located above the conveying rail, and a second lifting actuator for lifting the tray lifting column, the tray stopped by the stopper being lifted and being abutted against the tray positioning block.
9. The multi-pin chip intelligent assembly system according to claim 1, 2 or 3, further comprising a chip pin shearing and bending device, wherein the chip pin shearing and bending device is arranged on the rack, and the chip pin shearing and bending device is used for shearing and bending pins of the chip.
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