CN111215557A - IC chip pin processing equipment and processing method - Google Patents
IC chip pin processing equipment and processing method Download PDFInfo
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- CN111215557A CN111215557A CN202010100194.8A CN202010100194A CN111215557A CN 111215557 A CN111215557 A CN 111215557A CN 202010100194 A CN202010100194 A CN 202010100194A CN 111215557 A CN111215557 A CN 111215557A
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- 238000012545 processing Methods 0.000 title claims abstract description 33
- 238000003672 processing method Methods 0.000 title claims description 6
- 238000005452 bending Methods 0.000 claims abstract description 224
- 239000000463 material Substances 0.000 claims abstract description 147
- 238000005520 cutting process Methods 0.000 claims abstract description 107
- 238000000034 method Methods 0.000 claims abstract description 21
- 230000007246 mechanism Effects 0.000 claims description 89
- 238000003825 pressing Methods 0.000 claims description 53
- 238000007599 discharging Methods 0.000 claims description 6
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 4
- 238000005336 cracking Methods 0.000 abstract description 3
- 238000003754 machining Methods 0.000 abstract description 3
- 238000010008 shearing Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 241000567030 Ampulloclitocybe clavipes Species 0.000 description 1
- 206010043101 Talipes Diseases 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 201000011228 clubfoot Diseases 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
- B21F1/004—Bending wire other than coiling; Straightening wire by means of press-type tooling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F11/00—Cutting wire
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F23/00—Feeding wire in wire-working machines or apparatus
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Abstract
The invention relates to the technical field of electronic component processing. A pin processing device of an IC chip comprises a rack, and a feeding device, a material passing device, a material moving device, a pin cutting device, a pin bending device and a bending device which are arranged on the rack; the feeding device is connected with the material passing device, the material moving device is located above the material passing device, the pin cutting device, the pin bending device and the bending device are installed on the side of the material passing device, and the pin cutting device, the pin bending device and the bending device are sequentially arranged along the machining direction. The invention can complete the pin folding processing of the IC chip with a complex shape, and has good forming effect; for the large-amplitude bending process, in order to avoid cracking, the process is divided into two steps to be folded, and pins are flat.
Description
Technical Field
The invention relates to the technical field of electronic component processing, in particular to pin processing equipment for an IC chip.
Background
Before the IC chip leaves the factory, the pins of the IC chip need to be cut, twisted, bent and other processing processes, how to better realize the feeding of the IC chip, how to clamp the IC chip and perform the cutting and bending of the pins, how to discharge the processed capacitor, and because the specific conditions of each enterprise are different, how to design one set of electronic component processing equipment which meets the self conditions of the enterprise, thereby improving the production efficiency and the yield, and being the technical problem which needs to be solved by a structure development engineer.
The invention discloses a patent with the publication number of CN109954823A and the patent name of automatic pin shearing and bending equipment, which comprises a coil feeding platform, a coil feeding power assembly, a single IC chip cutting assembly, a clamping jaw air cylinder assembly, a pin shearing and bending positioning assembly, a pin shearing assembly and a bending assembly, wherein the coil feeding platform, the coil feeding power assembly, the single IC chip cutting assembly, the clamping jaw air cylinder assembly, the pin shearing and bending positioning assembly, the pin shearing assembly and the bending assembly are arranged on a workbench; the pin shearing assembly and the bending assembly are arranged at two ends above the positioning platform; the clamping jaw air cylinder assembly is used for grabbing the cut single IC chip to the positioning platform, the pin cutting and bending positioning assembly is used for positioning the cut single IC chip, and the pin cutting assembly and the bending assembly are used for respectively cutting and bending two ends of the cut single IC chip. The large batch production of this patent accords with each pin length IC chip that the in-service use needs, but the pin processing of chip is comparatively simple, and the pin is bent the discrepancy, complicated shape quality of bending is poor.
Disclosure of Invention
The invention aims to solve the problems that in the prior art, the pin bending and pin shearing processes in the pin processing of an IC chip are complex, the circulating materials are difficult to unify, the pin bending is different, and the bending quality of the complex shape is poor, and provides the pin processing equipment and the production method of the IC chip, which have the advantages of step bending, good forming effect, capability of greatly bending and flat pins.
For the purpose of the invention, the following technical scheme is adopted for realizing the purpose: a pin processing device of an IC chip comprises a rack, and a feeding device, a material passing device, a material moving device, a pin cutting device, a pin bending device and a bending device which are arranged on the rack; the feeding device is connected with the material passing device, the material moving device is positioned above the material passing device, the pin cutting device, the pin bending device and the bending device are arranged on the side of the material passing device, and the pin cutting device, the pin bending device and the bending device are sequentially arranged along the machining direction;
the feeding device is used for conveying a material belt loaded with the IC chips to feed and separating the chips individually; the feeding device is used for feeding the IC chips among all stations; the material moving device is used for driving an IC chip in the material passing device, the pin cutting device is used for cutting pins at one end of the IC chip, and the pin bending device is used for bending one end of the IC chip; the bending device is used for bending the other end of the IC chip by the terminal and bending the IC chip to form the IC chip.
Preferably, the feeding device comprises a base, a conveyor belt assembly, a material receiving plate, a lifting cylinder and a driving rod; the conveying belt assembly drives the belt through a motor to drive the chip material belt arranged on the belt to move; the material receiving plate is arranged at the end part of the base and is connected with the discharge end of the conveying belt assembly; the base is provided with a stop strip, the side of the base is provided with a sliding groove seat, the lifting plate is movably matched in the sliding groove seat, and the top end of the lifting plate is provided with a corresponding groove which is adapted to the contour of the IC chip; the lifting cylinder is fixedly arranged on the base, the telescopic end of the lifting cylinder is connected with a groove pair formed at one end of the driving rod, the other end of the driving rod is provided with a ball, and the middle part of the driving rod is provided with a round hole which is hinged on the base; the middle part of the lifting plate is provided with a rectangular hole, and the ball is positioned in the rectangular hole.
Preferably, the material passing device comprises a base, a material rail, a cover plate, a pressing block, a pressing assembly and a discharging inclined rail; the base is fixedly arranged on the rack, the material rails are arranged on the base, and the material rails consist of a plurality of sections of material rails with different shapes; a plurality of stations are arranged on the material rail, and are respectively a first cutting station, a prepressing station, a first pin bending station, a second cutting station and a bending station in sequence; the cover plate is fixed on the material rail, and the pressing block is connected on the cover plate; the pressing block corresponds to the second bending-leg station, a spring is arranged between the pressing block and the cover plate, and the spring lifts the pressing block upwards; the pressing assembly is arranged on the rack and corresponds to the second cutting station, and comprises a pressing cylinder, a lifting plate and a pressing head; the lifting plate is arranged on the telescopic end of the pressing cylinder, a flange is arranged on the side of the top of the lifting plate, the pressure head is positioned below the flange of the lifting plate, and the pressure head is connected to the cover plate at the second cutting station through a spring; the discharge inclined rail is obliquely arranged at the discharge end of the material rail.
Preferably, the material rails comprise a first material rail, a second material rail, a third material rail and a fourth material rail; the first material rail is provided with two horizontal pin placing parts, the middle part of the first material rail is provided with a vertical groove-shaped material pushing groove, and the first material rail is also provided with a chip placing part; a triangular bending part is arranged on the second material rail; two deep grooves are formed in the third material rail and used for the bent pins to move through; the middle part of the fourth material rail is provided with a groove, and the bent chip is placed in the groove.
Preferably, the material moving device comprises a support, a longitudinal moving cylinder, a transverse moving cylinder, a middle plate, a driving inserting strip, an installation rod and a second pressing assembly; the longitudinal moving cylinder is arranged on the support, the middle plate is movably connected to the support through a sliding rail, and the telescopic end of the longitudinal moving cylinder is connected with the middle plate; the mounting rod is movably connected to the middle plate through a sliding rail, the transverse moving cylinder is mounted on the middle plate, and the telescopic end of the transverse moving cylinder is connected with the mounting rod; a plurality of uniform driving cuttings are arranged, and rectangular grooves are formed in the lower end parts of the driving cuttings; the second pressing assembly is arranged on the support.
Preferably, the foot cutting device comprises a support plate, a sliding chute, a cutting cylinder, a cutter and a base plate; the sliding groove is arranged on the side of the support plate, the backing plate is fixedly arranged on the sliding groove, the cutter is matched in the sliding groove, the lower end of the cutter is provided with a cutting edge, and the cutting edge is tightly attached to the backing plate; the cutting cylinder is installed on the supporting plate, and the telescopic end of the cutting cylinder is connected with the cutter.
Preferably, the foot bending device comprises a small-amplitude bending mechanism, a folding mechanism and an edge cutting mechanism; the small-amplitude bending mechanism, the folding mechanism and the edge cutting mechanism are sequentially arranged in parallel, and the folding mechanism is provided with two groups; the small-amplitude bending mechanism is used for bending the pins of the IC chip upwards by a small amplitude, the folding mechanism is used for folding the pins in sequence, and the edge cutting mechanism is used for cutting the connecting ribs and the redundant rim charge.
Preferably, the small-amplitude bending mechanism comprises a vertical seat, a fixed block, a lifting block, a top plate, a pressing column and a first air cylinder; the vertical seat is fixedly arranged on the rack, the fixed block is arranged at the top of the vertical seat, and the bottom surface of the end part of the fixed block is provided with an arch part; the lifting block is movably connected to the vertical seat through a slide rail, the top plate is installed on the lifting block, the upper end of the top plate is also provided with a convex edge, and the fixed block and the top plate are staggered; the pressing column is connected to the top plate through a spring and is positioned on the side of the top plate; the first cylinder is arranged on the vertical seat, and the telescopic end of the first cylinder is connected with the lifting block; the folding mechanism comprises a base, a swivel base, a bending block and a second cylinder; the base is fixed below the rack, the swivel base is fixed above the rack, the fixed end of the second cylinder is hinged on the base, the telescopic end of the second cylinder is hinged with the bending block, balls are arranged on two sides of the bending block, the bending part of the bending block is arc-shaped, and a groove is formed in the arc surface; the bending part of the second bending block of the other group of folding mechanisms is planar; the rotating seat is provided with two concentric arc-shaped grooves, the edge of the rotating seat is provided with a fan-shaped notch, and two balls of the bending block are matched in the arc-shaped grooves; the edge cutting mechanism comprises a third cylinder, an inclined cutter, a moving groove and a charging barrel; the third cylinder is obliquely arranged on the rack, the beveling knife is movably matched in the moving groove, the beveling knife is connected with the telescopic end of the third cylinder, the blanking barrel is arranged on the rack, and the blanking barrel is aligned to the cutting part of the beveling knife.
Preferably, the bending device comprises a first right-angle bending mechanism, a second right-angle bending mechanism, a cutting mechanism and a chip body bending mechanism; the first right-angle bending mechanism, the second right-angle bending mechanism and the chip body bending mechanism have the same principle, and components in contact with the chip are arranged into three specific shapes to respectively complete first right-angle bending, second right-angle bending and chip body bending; and the first right-angle bending mechanism and the second right-angle bending mechanism are provided with clamping components for clamping the chip.
A pin processing method of an IC chip sequentially comprises the following steps:
chip feeding: the conveying belt assembly drives the material belt of the IC chip to move, the lifting cylinder drives the driving rod to rotate, the lifting plate is lifted, the IC chip is separated from the material belt by the upper end face of the lifting plate, and the separated chip is placed on the material receiving plate to enter the material passing device and is driven by the material moving device;
(II) bending and cutting pins at one end of the chip: firstly, the first cylinder drives the lifting block to extend upwards, the pressing column presses the pins, and then the top plate continuously rises to act together with the fixing block to bend the pins to a smaller extent; the pins are folded in two steps, the pins are bent by the second bending block through ninety degrees from top to bottom, the pins are bent by the bending block through ninety degrees from top to bottom, the pins are folded, specifically, the second cylinder is contracted to enable the bending block to move along the arc-shaped groove, and the ends of the bending block press the pins to be forced to be bent; finally, cutting redundant leftover materials, and driving a beveling cutter to extend out by a third cylinder to cut;
(III) bending and cutting the pin at the other end of the chip: the method comprises the following steps that firstly, a first right-angle bending mechanism bends pins at the end part of a chip by ninety degrees, then a second right-angle bending mechanism bends the pins by ninety degrees again, and then a cutting mechanism cuts the tail ends of the pins;
(IV) bending the chip body: the chip body on one side is fixed in the material passing device, and the chip body on the other side is bent through the chip body bending mechanism.
The pin processing equipment and the pin processing method of the IC chip adopting the technical scheme have the beneficial effects that:
1. the material passing device is provided with the multi-section combined material rail, the shape of the material rail is suitable for a specific process, the process of the IC chip is divided into a plurality of steps, the pin folding process with a complex shape can be completed, and the forming effect is good; the whole operation is completed on one material rail, the processing efficiency is high, and the IC chip does not need to be moved again; when the pin is bent and cut, the chip body is pressed through the pressing block and the pressing assembly, so that the chip body is prevented from shaking, and the production precision is improved.
2. The pin bending device can fold two parts of a pin by arranging a small-amplitude bending mechanism and a folding mechanism, can finish complicated shape bending, can be folded in two steps for avoiding cracking in a large-amplitude bending process, and is high in bending quality by arranging bending blocks with different profiles and a second bending block for bending; through the process of bending first and then cutting, the problems that a plurality of pins which are parallel to each other are different in bending amplitude and uneven are solved, and the flatness of the pins is improved.
Drawings
Fig. 1 is an exploded view of a pin processing apparatus of an IC chip according to an embodiment of the present invention.
Fig. 2 is an exploded view of the charging device.
Fig. 3 is an exploded view of the charging device.
Fig. 4 is a front view structural diagram of different material rails.
Fig. 5 is an exploded view of an embodiment of the present invention.
Fig. 6 is an exploded view of the transfer device.
Fig. 7 is an exploded view of the clubfoot device.
Fig. 8 is an exploded view of the bending apparatus.
FIG. 9 is a schematic diagram of an IC chip before and after processing.
Detailed Description
As shown in fig. 1, the pin processing equipment for the IC chip comprises a frame 1, and a feeding device 2, a material passing device 3, a material moving device 4, a pin cutting device 5, a pin bending device 6 and a bending device 7 which are arranged on the frame 1; the feeding device 2 is connected with the material passing device 3, the material moving device 4 is located above the material passing device 3, the pin cutting device 5, the pin bending device 6 and the bending device 7 are installed on the side of the material passing device 3, and the pin cutting device 5, the pin bending device 6 and the bending device 7 are sequentially arranged along the machining direction.
The feeding device 2 is used for conveying a material belt loaded with IC chips to feed and separating the chips individually; the feeding device 3 is used for feeding the IC chips among all stations; the material moving device 4 is used for driving the IC chip in the material passing device 3, the pin cutting device 5 is used for cutting pins at one end of the IC chip, and the pin bending device 6 is used for bending one end of the IC chip; the bending device 7 is used for bending the other end of the IC chip by a terminal and bending the IC chip to form the IC chip.
As shown in fig. 9, the IC chip comprises two chip bodies 100 and two leads 200 at two ends, the two chip bodies 100 are connected to each other, and the IC chip has three bending portions, namely a first bending portion 300, a second bending portion 400 and a third bending portion 500. IC chip pin processing requires processing of the original IC chip a in fig. 9 into the state of diagram b.
As shown in fig. 2, the loading device 2 includes a base 21, a conveyor belt assembly 22, a material receiving plate 23, a lifting plate 24, a lifting cylinder 25 and a driving rod 26; the base 21 is fixedly arranged on the frame, the conveyer belt assembly 22 is arranged on the base 21, and the conveyer belt assembly 22 drives the belt through a motor to drive the chip material belt arranged on the belt to move; the material receiving plate 23 is arranged at the end part of the base 21, and the material receiving plate 23 is connected with the discharge end of the conveying belt assembly 22; the base 21 is provided with a barrier strip 212, the side of the base 21 is provided with a sliding groove seat 211, the lifting plate 24 is movably matched in the sliding groove seat 211, and the top end of the lifting plate 24 is provided with a corresponding groove which is adapted to the contour of the IC chip; the lifting cylinder 25 is fixedly arranged on the base 21, the telescopic end of the lifting cylinder 25 is connected with one end of the driving rod 26 in a groove pair mode, the other end of the driving rod 26 is provided with a ball, and the middle of the driving rod 26 is provided with a circular hole which is hinged on the base 21; the middle of the lifting plate 24 is provided with a rectangular hole, and the ball is positioned in the rectangular hole.
When the loading device 2 works, the conveyer belt assembly 22 drives the material belt of the IC chip to move, the lifting cylinder 25 drives the driving rod 26 to rotate, the lifting plate 24 is lifted, the IC chip is separated from the material belt by the upper end surface of the lifting plate 24, and the separated chip is placed on the material receiving plate 23.
As shown in fig. 3, the material passing device 3 includes a base 31, a material rail 32, a cover plate 33, a pressing block 34, a pressing assembly 35 and a discharging inclined rail 36; the base 31 is fixedly arranged on the frame, the material rail 32 is arranged on the base 31, and the material rail 32 is composed of a plurality of sections of material rails with different shapes and is suitable for different procedures; a plurality of stations are arranged on the material rail 32, and are a first cutting station 301, a prepressing station 302, a first bending station 303, a second bending station 304, a second cutting station 305 and a bending station 306 respectively; the cover plate 33 is fixed on the material rail 32, and the pressing block 34 is connected on the cover plate 33; the pressing block 34 corresponds to the second bending station 304 station, a spring is arranged between the pressing block 34 and the cover plate 33, and the spring lifts the pressing block 34 upwards; the pressing assembly 35 is mounted on the frame, corresponds to the second cutting station 305, and comprises a pressing cylinder 351, a lifting plate 352 and a pressing head 353; the lifting plate 352 is installed on the telescopic end of the pressing cylinder 351, a flange is arranged on the side of the top of the lifting plate 352, the pressure head 353 is positioned below the flange of the lifting plate 352, and the pressure head 353 is connected to the cover plate 33 at the second cutting station 305 through a spring; the discharge ramp 36 is mounted at an incline at the discharge end of the rail 32.
As shown in fig. 4, the material rail 32 includes a first material rail 331, a second material rail 332, a third material rail 333 and a fourth material rail 334; the first material rail 331 is provided with two horizontal pin placing parts 3312, the middle part of the first material rail 331 is provided with a vertical groove-shaped material pushing groove 3311, and the first material rail 331 is also provided with a chip placing part 3313; the second material rail 332 is provided with a triangular bending part 3321, and a pin at one end is pressed on an inclined part of the triangular bending part 3321 to realize bending; two deep grooves 3331 are formed in the third material rail 333, and the deep grooves 3331 are used for the bent pins to move through; a groove is formed in the middle of the fourth material rail 334, and the bent chip is placed in the groove.
When the material passing device 3 works, the IC chip is placed on the material rail 32, moves in the material rail 32 connected in sequence, and completes corresponding operations in sequence at the first cutting station 301, the pre-pressing station 302, the first bending station 303, the second bending station 304, the second cutting station 305 and the bending station 306, and the IC chip slides out at the tail end of the material rail 32 through the discharging inclined rail 36.
The material passing device 3 solves the problems that the IC chip bending and pin shearing processes are complex, and the circulating material passing is difficult to unify; by arranging the multi-section combined type material rail 32, the shape of the material rail is suitable for a specific process, the process of the IC chip is divided into a plurality of process steps, the pin folding process with a complex shape can be completed, and the forming effect is good; one material rail 32 completes all operations, the processing efficiency is high, and the IC chip does not need to be moved again; when the pin is bent and cut, the chip body is pressed through the pressing block 34 and the pressing assembly 35, so that the chip body is prevented from shaking, and the production precision is improved.
As shown in fig. 5, the material moving device 4 includes a support 41, a longitudinal moving cylinder 42, a transverse moving cylinder 43, an intermediate plate 44, a driving insert 45, a mounting rod 46 and a second pressing assembly 47; the longitudinal moving cylinder 42 is arranged on the support 41, the middle plate 44 is movably connected on the support 41 through a sliding rail, and the telescopic end of the longitudinal moving cylinder 42 is connected with the middle plate 44; the mounting rod 46 is movably connected to the middle plate 44 through a sliding rail, the transverse moving cylinder 43 is mounted on the middle plate 44, and the telescopic end of the transverse moving cylinder 43 is connected with the mounting rod 46; a plurality of uniform driving cuttings 45 are arranged, and rectangular grooves are formed in the lower end portions of the driving cuttings 45; the second pressing assembly 47 is disposed on the support 41.
When the material moving device 4 works, the longitudinal moving cylinder 42 and the transverse moving cylinder 43 act together to enable the working track of the driving cutting 45 to be rectangular, the driving cutting 45 descends and is sleeved on the chip to gradually push the chip to move.
As shown in fig. 6, the foot cutting device 5 comprises a support plate 51, a chute 52, a cutting cylinder 53, a cutter 54 and a backing plate 55; the sliding groove 52 is arranged on the side of the support plate 51, the backing plate 55 is fixedly arranged on the sliding groove 52, the cutter 54 is matched in the sliding groove 52, the lower end of the cutter 54 is provided with a cutting edge, and the cutting edge is tightly attached to the backing plate 55; the cutting cylinder 53 is arranged on the support plate 51, and the telescopic end of the cutting cylinder 53 is connected with the cutter 54.
As shown in fig. 7, the pin bending device 6 includes a small-width bending mechanism 61, a folding mechanism 62 and an edge cutting mechanism 63; the small-amplitude bending mechanism 61, the folding mechanism 62 and the edge cutting mechanism 63 are sequentially arranged side by side, and two groups of folding mechanisms 62 are arranged; the small-amplitude bending mechanism 61 is used for bending the pins of the IC chip upwards by a small amplitude, the folding mechanism 62 is used for sequentially folding the pins, and the edge cutting mechanism 63 is used for cutting the connecting ribs and the redundant rim charge.
The small-amplitude bending mechanism 61 comprises a vertical seat 611, a fixed block 612, a lifting block 613, a top plate 614, a pressing column 615 and a first air cylinder 616; the vertical seat 611 is fixedly arranged on the frame, the fixed block 612 is arranged at the top of the vertical seat 611, and the bottom surface of the end part of the fixed block 612 is provided with an arch part 6121; the lifting block 613 is movably connected to the vertical base 611 through a slide rail, the top plate 614 is mounted on the lifting block 613, the upper end of the top plate 614 is also provided with a rib 6141, and the fixed block 612 and the top plate 614 are staggered; the pressing column 615 is connected to the top plate 614 through a spring, and the pressing column 615 is located on the side of the top plate 614; the first cylinder 616 is installed on the vertical base 611, and the telescopic end of the first cylinder 616 is connected with the lifting block 613.
The folding mechanism 62 comprises a base 621, a rotary seat 622, a bending block 623 and a second air cylinder 624; the base 621 is fixed below the rack, the rotating seat 622 is fixed above the rack, the fixed end of the second air cylinder 624 is hinged on the base 621, the telescopic end of the second air cylinder 624 is hinged with the bending block 623, two sides of the bending block 623 are provided with balls 6231, the bending part of the bending block 623 has a certain arc shape, and a groove is formed in the arc surface; the bending part of the second bending block 625 of the other group of folding mechanisms 62 is planar, and the two groups of folding mechanisms 62 are provided with the bending blocks 623 and the second bending block 625 with different shapes so as to better adapt to the distributed bending process; the rotating seat 622 is provided with two concentric arc-shaped grooves 6221, the edge of the rotating seat 622 is provided with a fan-shaped notch 6222, and the two balls of the bending block 623 are matched in the arc-shaped grooves 6221.
The edge cutting mechanism 63 comprises a third cylinder 631, a beveling knife 632, a moving tank 633 and a blanking cylinder 634; the third cylinder 631 is obliquely installed on the frame, the oblique cutting knife 632 is movably engaged in the moving groove 633, the oblique cutting knife 632 is connected with the telescopic end of the third cylinder 631, the blanking cylinder 634 is installed on the frame, and the blanking cylinder 634 is aligned with the blade of the oblique cutting knife 632.
When the pin bending device 6 works, firstly, small-amplitude bending is carried out, the first air cylinder 616 drives the lifting block 613 to extend upwards, the pressing column 615 presses the pins firstly, and then the top plate 614 continuously rises to jointly act with the fixed block 612 to bend the pins by small amplitude; then, the pins are folded in two steps, the pins are bent by ninety degrees from top to bottom by the second bending block 625, the pins are bent by ninety degrees from top to bottom by the bending block 623, the folding is realized, specifically, the second cylinder 624 contracts, so that the bending block 623 moves along the arc-shaped groove 6221, and the ends of the bending block 623 press the pins to be bent forcibly; finally, redundant leftover materials are cut, and the inclined cutter 632 is driven by the third cylinder 631 to stretch out for cutting.
The pin bending device 6 solves the problems of uneven pin bending and poor bending quality of complex shapes, two parts of the pin can be folded by arranging the small-amplitude bending mechanism 61 and the folding mechanism 62, more complex shape bending can be completed, for a large-amplitude bending process, in order to avoid cracking, the pin can be folded by dividing the process into two steps, and the pin is provided with the bending block 623 and the second bending block 625 with different profiles for bending, so that the bending quality is high; through the process of bending first and then cutting, the problems that a plurality of pins which are parallel to each other are different in bending amplitude and uneven are solved, and the flatness of the pins is improved.
As shown in fig. 8, the bending device 7 includes a first right-angle bending mechanism 71, a second right-angle bending mechanism 72, a cutting mechanism 73, and a chip body bending mechanism 74; the first right-angle bending mechanism 71, the second right-angle bending mechanism 72 and the chip body bending mechanism 74 are identical in principle, and components in contact with the chip are arranged into three specific shapes to respectively complete first right-angle bending, second right-angle bending and chip body bending. The first right-angle bending mechanism 71 and the second right-angle bending mechanism 72 are provided with a clamping assembly 75 for clamping a chip.
When the bending device 7 works, the first right-angle bending mechanism 71 bends the pins at the end part of the chip by ninety degrees, the second right-angle bending mechanism 72 bends the pins by ninety degrees again, the cutting mechanism 73 cuts the tail ends of the pins, and finally the body of the IC chip is bent.
A pin processing method of an IC chip adopts the pin processing equipment of the IC chip to operate, and the processing is carried out sequentially through the following steps:
chip feeding: the conveyor belt assembly 22 drives the material belt of the IC chip to move, the lifting cylinder 25 drives the driving rod 26 to rotate, the lifting plate 24 is lifted, the IC chip is separated from the material belt by the upper end face of the lifting plate 24, the separated chip is placed on the material receiving plate 23 to enter the material passing device 3 and is driven by the material moving device 4;
(II) bending and cutting pins at one end of the chip: firstly, the first air cylinder 616 drives the lifting block 613 to extend upwards, the pressing column 615 presses the pins firstly, and then the top plate 614 continuously rises to cooperate with the fixing block 612 to bend the pins to a smaller extent; then, the pins are folded in two steps, the pins are bent by ninety degrees from top to bottom by the second bending block 625, the pins are bent by ninety degrees from top to bottom by the bending block 623, the folding is realized, specifically, the second cylinder 624 contracts, so that the bending block 623 moves along the arc-shaped groove 6221, and the ends of the bending block 623 press the pins to be bent forcibly; finally, cutting the redundant leftover materials, wherein the third cylinder 631 drives the inclined cutter 632 to extend out for cutting;
(III) bending and cutting the pin at the other end of the chip: firstly, bending pins at the end part of a chip by ninety degrees by a first right-angle bending mechanism 71, then bending the pins by ninety degrees again by a second right-angle bending mechanism 72, and then cutting the tail ends of the pins by a cutting mechanism 73;
(IV) bending the chip body: the chip body on one side is fixed to the feeding device 3, and the chip body on the other side is bent by the chip body bending mechanism 74.
Claims (10)
1. The IC chip pin processing equipment is characterized by comprising a rack (1), and a feeding device (2), a material passing device (3), a material moving device (4), a pin cutting device (5), a pin bending device (6) and a bending device (7) which are arranged on the rack (1); the feeding device (2) is connected with the material passing device (3), the material moving device (4) is positioned above the material passing device (3), the pin cutting device (5), the pin bending device (6) and the bending device (7) are arranged on the side of the material passing device (3), and the pin cutting device (5), the pin bending device (6) and the bending device (7) are sequentially arranged along the processing direction;
the feeding device (2) is used for conveying a material belt loaded with IC chips to feed and separating the chips individually; the feeding device (3) is used for feeding the IC chips among all stations; the material moving device (4) is used for driving the IC chip in the material passing device (3), the pin cutting device (5) is used for cutting pins at one end of the IC chip, and the pin bending device (6) is used for bending one end of the IC chip; the bending device (7) is used for bending the other end of the IC chip by a terminal and bending the IC chip to form the IC chip.
2. The pin processing apparatus of an IC chip according to claim 1, wherein the loading device (2) comprises a base (21), a conveyor belt assembly (22), a receiving plate (23), a lifting plate (24), a lifting cylinder (25) and a driving rod (26); the chip material belt conveyor is characterized in that a base (21) is fixedly arranged on a rack, a conveyor belt assembly (22) is arranged on the base (21), and the conveyor belt assembly (22) drives a belt through a motor to drive a chip material belt arranged on the belt to move; the material receiving plate (23) is arranged at the end part of the base (21), and the material receiving plate (23) is connected with the discharge end of the conveying belt assembly (22); a stop strip (212) is arranged on the base (21), a sliding groove seat (211) is arranged on the side of the base (21), the lifting plate (24) is movably matched in the sliding groove seat (211), and a corresponding groove is arranged at the top end of the lifting plate (24) and is adapted to the contour of the IC chip; the lifting cylinder (25) is fixedly arranged on the base (21), the telescopic end of the lifting cylinder (25) is connected with one end of the driving rod (26) in a groove pair mode, the other end of the driving rod (26) is provided with a ball, and the middle of the driving rod (26) is provided with a round hole which is hinged to the base (21); a rectangular hole is formed in the middle of the lifting plate (24), and the ball is located in the rectangular hole.
3. The IC chip pin processing equipment according to claim 1, wherein the material passing device (3) comprises a base (31), a material rail (32), a cover plate (33), a pressing block (34), a pressing assembly (35) and a material discharging inclined rail (36); the base (31) is fixedly arranged on the rack, the material rails (32) are arranged on the base (31), and the material rails (32) are composed of a plurality of sections of material rails with different shapes; a plurality of stations are arranged on the material rail (32), and are respectively a first cutting station (301), a prepressing station (302), a first pin bending station (303), a second pin bending station (304), a second cutting station (305) and a bending station (306) in sequence; the cover plate (33) is fixed on the material rail (32), and the pressing block (34) is connected to the cover plate (33); the pressing block (34) corresponds to a second bending foot station (304), a spring is arranged between the pressing block (34) and the cover plate (33), and the spring lifts the pressing block (34) upwards; the pressing assembly (35) is installed on the rack and corresponds to the second cutting station (305), and the pressing assembly (35) comprises a pressing cylinder (351), a lifting plate (352) and a pressure head (353); the lifting plate (352) is installed on the telescopic end of the pressing cylinder (351), a flange is arranged on the side of the top of the lifting plate (352), the pressure head (353) is located below the flange of the lifting plate (352), and the pressure head (353) is connected to the cover plate (33) at the second cutting station (305) through a spring; the discharging inclined rail (36) is obliquely arranged at the discharging end of the material rail (32).
4. The apparatus of claim 1, wherein the material rail (32) comprises a first material rail (331), a second material rail (332), a third material rail (333), and a fourth material rail (334); the first material rail (331) is provided with two horizontal pin placing parts (3312), the middle part of the first material rail (331) is provided with a vertical groove-shaped material pushing groove (3311), and the first material rail (331) is also provided with a chip placing part (3313); a triangular bending part (3321) is arranged on the second material rail (332); two deep grooves (3331) are formed in the third material rail (333), and the deep grooves (3331) are used for the bent pins to move through; a groove is arranged in the middle of the fourth material rail (334), and the bent chip is placed in the groove.
5. The IC chip pin processing equipment according to claim 1, wherein the material moving device (4) comprises a support (41), a longitudinal moving cylinder (42), a transverse moving cylinder (43), an intermediate plate (44), a driving insert (45), a mounting rod (46) and a second pressing assembly (47); the longitudinal moving cylinder (42) is arranged on the support (41), the middle plate (44) is movably connected to the support (41) through a sliding rail, and the telescopic end of the longitudinal moving cylinder (42) is connected with the middle plate (44); the mounting rod (46) is movably connected to the middle plate (44) through a sliding rail, the transverse moving cylinder (43) is mounted on the middle plate (44), and the telescopic end of the transverse moving cylinder (43) is connected with the mounting rod (46); a plurality of uniform driving cuttings (45) are arranged, and rectangular grooves are formed in the lower end parts of the driving cuttings (45); the second pressing component (47) is arranged on the support (41).
6. The pin processing apparatus of the IC chip according to claim 1, wherein the pin cutting device (5) comprises a support plate (51), a chute (52), a cutting cylinder (53), a cutter (54) and a backing plate (55); the sliding groove (52) is arranged on the side of the support plate (51), the backing plate (55) is fixedly arranged on the sliding groove (52), the cutter (54) is matched in the sliding groove (52), the lower end of the cutter (54) is provided with a cutting edge, and the cutting edge is tightly attached to the backing plate (55); the cutting cylinder (53) is arranged on the support plate (51), and the telescopic end of the cutting cylinder (53) is connected with the cutter (54).
7. The pin processing apparatus of an IC chip according to claim 1, wherein the pin bending device (6) comprises a small-width bending mechanism (61), a folding mechanism (62) and an edge cutting mechanism (63); the small-amplitude bending mechanism (61), the folding mechanism (62) and the edge cutting mechanism (63) are sequentially arranged side by side, and two groups of folding mechanisms (62) are arranged; the small-amplitude bending mechanism (61) is used for bending the pins of the IC chip upwards by a small amplitude, the folding mechanism (62) is used for sequentially folding the pins, and the edge cutting mechanism (63) is used for cutting the connecting ribs and the redundant rim charge.
8. The apparatus for processing the pins of the IC chip according to claim 1, wherein the small-amplitude bending mechanism (61) comprises a vertical base (611), a fixed block (612), a lifting block (613), a top plate (614), a pressing column (615) and a first air cylinder (616); the vertical seat (611) is fixedly arranged on the rack, the fixed block (612) is arranged at the top of the vertical seat (611), and the bottom surface of the end part of the fixed block (612) is provided with an arch part (6121); the lifting block (613) is movably connected to the vertical base (611) through a sliding rail, the top plate (614) is installed on the lifting block (613), the upper end of the top plate (614) is also provided with a rib (6141), and the fixed block (612) and the top plate (614) are staggered; the pressing column (615) is connected to the top plate (614) through a spring, and the pressing column (615) is located on the side of the top plate (614); the first air cylinder (616) is arranged on the vertical seat (611), and the telescopic end of the first air cylinder (616) is connected with the lifting block (613); the folding mechanism (62) comprises a base (621), a rotary seat (622), a bending block (623) and a second air cylinder (624); the base (621) is fixed below the rack, the rotating seat (622) is fixed above the rack, the fixed end of the second air cylinder (624) is hinged to the base (621), the telescopic end of the second air cylinder (624) is hinged to the bending block (623), balls (6231) are arranged on two sides of the bending block (623), the bending part of the bending block (623) is arc-shaped, and a groove is formed in the arc surface; the bending part of the second bending block (625) of the other group of folding mechanisms (62) is planar; the rotating seat (622) is provided with two concentric arc-shaped grooves (6221), the edge of the rotating seat (622) is provided with a fan-shaped notch (6222), and two balls of the bending block (623) are matched in the arc-shaped grooves (6221); the edge cutting mechanism (63) comprises a third air cylinder (631), a beveling knife (632), a moving groove (633) and a blanking barrel (634); the third cylinder (631) is obliquely arranged on the frame, the oblique cutting knife (632) is movably matched in the moving groove (633), the oblique cutting knife (632) is connected with the telescopic end of the third cylinder (631), the charging barrel (634) is arranged on the frame, and the charging barrel (634) is aligned with the blade part of the oblique cutting knife (632).
9. The apparatus for processing the pins of the IC chip according to claim 1, wherein the bending device (7) comprises a first right-angle bending mechanism (71), a second right-angle bending mechanism (72), a cutting mechanism (73) and a chip body bending mechanism (74); the first right-angle bending mechanism (71), the second right-angle bending mechanism (72) and the chip body bending mechanism (74) have the same principle, and components in contact with the chip are arranged into three specific shapes to respectively complete first right-angle bending, second right-angle bending and chip body bending; and the first right-angle bending mechanism (71) and the second right-angle bending mechanism (72) are provided with clamping assemblies (75) for clamping the chip.
10. A pin processing method of an IC chip is characterized by sequentially processing the following steps:
chip loading: the conveying belt assembly (22) drives a material belt of the IC chip to move, the lifting cylinder (25) drives the driving rod (26) to rotate, the lifting plate (24) is lifted, the IC chip is separated from the material belt by the upper end face of the lifting plate (24), the separated chip is placed on the material receiving plate (23) to enter the material passing device (3) and is driven by the material moving device (4);
bending and cutting pins at one end of the chip: firstly, a first air cylinder (616) drives a lifting block (613) to extend upwards, a pressing column (615) presses a pin at first, and then a top plate (614) continues to rise and cooperates with a fixing block (612) to bend the pin to a small extent; then the pins are folded in two steps, the pins are bent by ninety degrees from top to bottom by the second bending block (625), the pins are bent by ninety degrees from top to bottom by the bending block (623), the folding is realized, specifically, the pins are contracted by the second cylinder (624), the bending block (623) moves along the arc-shaped groove (6221), and the ends of the bending block (623) press the pins to be forced to bend; finally, cutting redundant leftover materials, and driving an inclined cutter (632) to extend out by a third air cylinder (631) to cut;
and (3) bending and cutting pins at the other end of the chip: the method comprises the following steps that firstly, pins at the end part of a chip are bent by ninety degrees through a first right-angle bending mechanism (71), then the pins are bent by ninety degrees again through a second right-angle bending mechanism (72), and then the tail ends of the pins are cut through a cutting mechanism (73);
bending the chip body: the chip body on one side is fixed in the material passing device (3), and the chip body on the other side is bent by a chip body bending mechanism (74).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010100194.8A CN111215557A (en) | 2020-02-18 | 2020-02-18 | IC chip pin processing equipment and processing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010100194.8A CN111215557A (en) | 2020-02-18 | 2020-02-18 | IC chip pin processing equipment and processing method |
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| CN111215557A true CN111215557A (en) | 2020-06-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010100194.8A Withdrawn CN111215557A (en) | 2020-02-18 | 2020-02-18 | IC chip pin processing equipment and processing method |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112296212A (en) * | 2020-10-30 | 2021-02-02 | 深圳市唯真电机发展有限公司 | A processing equipment for electronic device pins |
| CN113161245A (en) * | 2021-03-25 | 2021-07-23 | 杭州沃镭智能科技股份有限公司 | Multi-pin chip intelligent assembly system |
| CN116037810A (en) * | 2022-12-02 | 2023-05-02 | 山东航天电子技术研究所 | A device for forming and cutting feet of axial components |
| CN116237441A (en) * | 2023-02-09 | 2023-06-09 | 珠海格力新元电子有限公司 | Chip pin automatic folding mechanism |
| CN116460230A (en) * | 2023-04-06 | 2023-07-21 | 广州诺顶智能科技有限公司 | Chip pin shaping device capable of improving detection efficiency |
| CN117102385A (en) * | 2023-10-18 | 2023-11-24 | 宁波中车时代传感技术有限公司 | Chip pin bending equipment |
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| CN110648955A (en) * | 2019-08-28 | 2020-01-03 | 楼显华 | Production equipment and production method of crystal diode |
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| CN110648955A (en) * | 2019-08-28 | 2020-01-03 | 楼显华 | Production equipment and production method of crystal diode |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112296212A (en) * | 2020-10-30 | 2021-02-02 | 深圳市唯真电机发展有限公司 | A processing equipment for electronic device pins |
| CN113161245A (en) * | 2021-03-25 | 2021-07-23 | 杭州沃镭智能科技股份有限公司 | Multi-pin chip intelligent assembly system |
| CN113161245B (en) * | 2021-03-25 | 2024-06-18 | 杭州沃镭智能科技股份有限公司 | A multi-pin chip intelligent assembly system |
| CN116037810A (en) * | 2022-12-02 | 2023-05-02 | 山东航天电子技术研究所 | A device for forming and cutting feet of axial components |
| CN116237441A (en) * | 2023-02-09 | 2023-06-09 | 珠海格力新元电子有限公司 | Chip pin automatic folding mechanism |
| CN116460230A (en) * | 2023-04-06 | 2023-07-21 | 广州诺顶智能科技有限公司 | Chip pin shaping device capable of improving detection efficiency |
| CN116460230B (en) * | 2023-04-06 | 2023-10-20 | 广州诺顶智能科技有限公司 | Chip pin shaping device capable of improving detection efficiency |
| CN117102385A (en) * | 2023-10-18 | 2023-11-24 | 宁波中车时代传感技术有限公司 | Chip pin bending equipment |
| CN117102385B (en) * | 2023-10-18 | 2024-01-12 | 宁波中车时代传感技术有限公司 | Chip pin bending equipment |
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