CN208985962U - Low contact wafer centering, overturning system - Google Patents
Low contact wafer centering, overturning system Download PDFInfo
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- CN208985962U CN208985962U CN201821916407.9U CN201821916407U CN208985962U CN 208985962 U CN208985962 U CN 208985962U CN 201821916407 U CN201821916407 U CN 201821916407U CN 208985962 U CN208985962 U CN 208985962U
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Abstract
The utility model belongs to semicon industry wafer cleaning field, specifically a kind of low contact wafer centering, overturning system, overturning executing agency installation on the support frame, output end be connected with turntable, executing agency is clamped to be arranged on turntable, one end of movable clamping device is connect with the output end of clamping executing agency, one end of fixed clamping device is mounted on turntable, movable clamping device and the other end of fixed clamping device are clamping end, and the side of wafer is equipped with the low contact centering body that centering is carried out to it；Movable clamping device is mobile relative to turntable by the driving of clamping executing agency, clamps wafer with fixed clamping device, clamping executing agency, movable clamping device, fixed clamping device and clamped wafer are with turntable by the driving rotation of overturning executing agency.The utility model can carry out centering, clamping, overturning to wafer, and control wafer contacts area, calibration wafer center may be implemented, guarantee wafer cleaner, it is accurate, be safely completed overturning.
Description
Technical field
The utility model belongs to semicon industry wafer cleaning field, and specifically a kind of low contact wafer centering is turned over
Transfer from one department to another to unite.
Background technique
Growth with domestic market to middle and high end chip product demand, the domestic operation that is made to high-end chip also develop
To a completely new height.Therefore, the cleaning of wafer, the cleannes of wafer are also had higher requirement in industry, is also become
The new issue of semiconductor equipment manufacturer research.It is found in research process, the pollution of backside of wafer has weight to the cleannes on surface
The influence wanted starts to also result in the pollution of backside of wafer wider concern in the industry, the demand of backside of wafer cleaning
Also increasingly increase.Substantially, in the entire technique of wafer-process, every two step will do a Wafer Backside Cleaning, if expect compared with
Almost every step process all be unable to do without cleaning to high yield.So low contact semiconductor crystal wafer overturning system is complied with era development and is given birth to.
Utility model content
Guarantee that wafer switching process is steady to meet existing cleaning wafer back process demand and quickly adjust overturning system
Fixed smooth, the purpose of this utility model is to provide a kind of low contact wafer centerings, overturning system.
The purpose of this utility model is achieved through the following technical solutions:
The utility model include low contact centering body, movable clamping device, fixed clamping device, wafer turnover mechanism and
Support frame, wherein wafer turnover mechanism includes that overturning executing agency and clamping executing agency, the overturning executing agency are mounted on branch
On support, output end be connected with turntable, the clamping executing agency is arranged on turntable, one end of the activity clamping device with
Clamp the output end connection of executing agency, one end of the fixed clamping device is mounted on turntable, the activity clamping device and
The other end of fixed clamping device is clamping end, and the side of wafer is equipped with the low contact centering body that centering is carried out to it；Institute
It is mobile relative to turntable to state driving of the movable clamping device by clamping executing agency, clamps wafer, institute with fixed clamping device
It states clamping executing agency, movable clamping device, fixed clamping device and clamped wafer and is driven with turntable by overturning executing agency
Dynamic rotation；
Wherein: the low contact centering body include centering lifting structure, centering movement executing mechanism, centering support PIN,
Centering terminal contactor, plummer and clamp arm, the plummer are mounted on centering lifting structure, and the plummer is equipped with centering
Movement executing mechanism, two output ends of the centering movement executing mechanism are connected separately with clamp arm, and the clamping end of every end clamp arm is equal
Centering terminal contactor with wafer contacts is installed；The centering that the plummer is equipped with support wafer supports PIN；
The activity clamping device includes upper low contact support column, top tray connector, last arm and top tray, hand on this
One end of arm is connected with clamping executing agency output end, and the other end is equipped with top tray connector, the top tray connector
On top tray is installed, the upper low contact support column for clamping wafer is provided in the top tray；
The side of the top tray connector is connected with the other end of last arm, and the side of top tray connector and upper hand
There are height to adjust gap between the other end of arm；Side tune is equipped between the rear and front end and top tray connector of the top tray
Whole gap；
The fixed clamping device low contact support column, fixed tray, fixed tray connector and fixed arm under including,
One end of the fixation arm and the turntable are connected, and the other end is equipped with fixed tray connector, on the fixed tray connector
Fixed tray is installed, is provided on the fixed tray for clamping low contact support column under wafer；
The activity clamping device is equipped with movable clamping device centering guide post, and the fixed clamping device, which is equipped with, fixes
Clamping device centering guide post is equipped with roll-over unit jig guide holder, the activity folder on the fixed clamping device centering guide post
Device centering guide post is held to be inserted into calibrating position in the locating slot of roll-over unit jig guide holder；
Strip groove is radially offered on the turntable, one end of the activity clamping device is passed through, simultaneously by the strip groove
It is connected with the output end of the clamping executing agency；
One end of the activity clamping device is passed through by turntable, and is equipped with connecting plate, and turntable is equipped with sliding rail, the connection
Plate is slidably connected by sliding block and the sliding rail；The output end of the clamping executing agency is connected with connecting plate；
Wafer detection system is installed, which includes that there are detection sensors, level on support frame as described above
Detection sensor, upturned position sensor and clamp position sensor, the side of support frame as described above towards wafer are separately installed with
Detect wafer whether there is or not there are detection sensor and detection the whether inclined horizontal detection sensor of wafer；Support frame as described above is separate
The side of wafer is separately installed with the mobile clamp position sensor of detection activity clamping device and detection turntable rotates angle
Upturned position sensor；
The lower section of the fixed clamping device is equipped with the entrained particle control system being installed on support frame, the entrained particle
Control system includes powder collection box and control piper, and the powder collection box is affixed on the support frame, on the powder collection box
It is circumscribed with the control piper with negative pressure.
The advantages of the utility model and good effect are as follows:
1. the utility model can carry out centering, clamping, overturning to wafer, control wafer contacts area, school may be implemented
Quasi-crystalline substance circle center, guarantee wafer cleaner, it is accurate, be safely completed overturning.
2. the utility model is provided with wafer detection system and entrained particle control system, it is able to detect wafer state and right
Pneumatic floating is collected.
3. the low contact centering body of the utility model, plummer uses point contact PIN supporting way, reduces PIN and crystalline substance
Round contacting surface product, avoids the cross contamination of wafer.
4. the movable clamping device and fixed clamping device of the utility model can ensure wafer in clamping process not by
To impact, while reducing the contact area of wafer.
5. the wafer turnover mechanism of the utility model realizes that wafer is steadily overturn, it can be determined that whether wafer rotary movement is complete
At, and feed back to control system and be monitored and detect.
6. each sensor in the wafer detection system of the utility model is interrelated, inseparable, complete monitoring is realized
The purpose of wafer stabilizing.
7. the utility model clamping and centering terminal contact clamping with wafer contacts part to be low, contact point material is non-gold
Belong to, at least control of contact points is everywhere, to accommodate reliable and stable.
8. the adjustment of the position of the utility model and wafer contacts part is divided into the adjustment of X/Y plane, the adjustment of Z plane, items are adjusted
It is whole non-interference, it is independent to adjust.
9. the utility model has quick dedicated adjustment jig, mechanical position limitation teaching for upper and lower contact point clamping concentric design
Coaxially, mechanical position limitation height initial value adjusts.
Detailed description of the invention
Fig. 1 is one of the schematic perspective view of the utility model；
Fig. 2 is the two of the schematic perspective view of the utility model；
Fig. 3 is the schematic perspective view of the low contact centering body of the utility model；
Fig. 4 is the structural schematic diagram of the utility model activity clamping device and fixed clamping device；
Fig. 5 is the structural schematic diagram of the utility model wafer turnover mechanism；
Fig. 6 is the structural schematic diagram of the utility model turnover device localization tool；
Fig. 7 is the structural schematic diagram of the utility model entrained particle control system；
Wherein: 1 is low contact centering body, and 101 be centering lifting structure, and 102 be centering movement executing mechanism, and 103 are
Centering supports PIN (pillar), and 104 be centering terminal contactor, and 105 be plummer, and 106 be clamp arm；
2 be movable clamping device, and 201 be upper low contact support column, and 202 be movable clamping device centering guide post, and 203 be upper
Pallet connector, 204 be last arm, and 205 be top tray, and 206 be height adjustment gap；
3 be fixed clamping device, 301 be under low contact support column, 302 be fixed tray, and 303 connect for fixed tray
Body, 304 be fixed arm, and 305 be fixed clamping device centering guide post；
4 be wafer detection system, and 401 is are horizontal detection sensor there are detection sensor, 402, and 403 be upturned position
Sensor, 404 be clamp position sensor；
5 be entrained particle control system, and 501 be control piper, and 502 be powder collection box；
6 be wafer；
7 be wafer turnover mechanism, and 701 be overturning executing agency, and 702 be clamping executing agency, and 703 be turnover mechanism angle
Degree adjustment jig, 704 be fixed adjustment plate, and 705 be connecting plate, and 706 be sliding rail, and 707 be shaft coupling；
8 be roll-over unit jig guide holder；
9 be support frame, and 901 be turntable, and 902 be foreboard, and 903 be back plate.
Specific embodiment
The utility model is described in further detail with reference to the accompanying drawing.
As shown in Fig. 1~7, the utility model includes low contact centering body 1, movable clamping device 2, fixed clamping device
3, wafer detection system 4, entrained particle control system 5, wafer turnover mechanism 7 and support frame 9, wherein wafer turnover mechanism 7 wraps
Overturning executing agency 701 and clamping executing agency 702 are included, which is mounted on support frame 9, output end connects
It is connected to turntable 901, clamping executing agency 702 is arranged on turntable 901, one end of movable clamping device 2 and clamping executing agency
702 output end connection, one end of fixed clamping device 3 are fixed on turntable 901, movable clamping device 2 and fixed clamp dress
The other end for setting 3 is clamping end, and the side of wafer 6 is equipped with the low contact centering body 1 that centering is carried out to it.Activity clamping dress
2 are set by the driving of clamping executing agency 702 relative to the movement of turntable 901, clamps wafer 6 with fixed clamping device 3, clamping is held
Row mechanism 702, movable clamping device 2, fixed clamping device 3 and clamped wafer 6 are with turntable 901 by overturning executing agency
701 driving rotations.The lower section of fixed clamping device 3 is equipped with the entrained particle control system 5 being fixed on support frame 9.Support frame 9
On be also equipped with wafer detection system 4.
As shown in Figure 1, Figure 2 and Figure 3, the low contact centering body 1 of the present embodiment is located at the lower section of fixed clamping device 3,
The low contact centering body 1 includes centering lifting structure 101, centering movement executing mechanism 102, centering support PIN103, centering
Terminal contactor 104, plummer 105 and clamp arm 106, centering lifting structure 101 include lifting drive source and elevating lever, elevating lever
One end connect with the output end in lifting drive source, the other end is connected with plummer 105, and the plummer 105 is by lifting drive source
Driving lifting.Plummer 105 is equipped with centering movement executing mechanism 102, which can be cylinder, electricity
Cylinder or hydraulic cylinder, the present embodiment are two-way cylinder；Two output ends of centering movement executing mechanism 102 are connected separately with L shape
Clamp arm 106, one end of every end clamp arm 106 connect with an output end of two-way cylinder, and the other end is clamping end, on clamping end
Centering terminal contactor 104 with 6 point contact of wafer is installed, which can be idler wheel or bearing.Carrying
The centering support PIN103 of multiple support wafers 6 is along the circumferential direction evenly equipped on platform 105.
As shown in Figure 1, Figure 2 and shown in Fig. 5, support frame 9 includes the foreboard 902 being connected with each other and back plate 903, and foreboard 902 is with after
Space is formed between plate 903.Turntable 901 is set to 902 middle part of foreboard, radially offers strip groove on turntable 901, activity
One end of clamping device 2 is passed through by the strip groove, and is equipped with connecting plate 705, and turntable 901 is equipped with sliding rail 706, connecting plate 705
It is slidably connected by sliding block and sliding rail 706；Clamping executing agency 702 is fixed on turntable 901, output end and 705 phase of connecting plate
Even.Overturning executing agency 701 is fixed in back plate 903, and output shaft is connected by the middle part of shaft coupling 707 and turntable 901.This
It is rotation motor that executing agency 701 is overturn in embodiment, and clamping executing agency 702 is cylinder.
As shown in Figure 1, Figure 2 and shown in Fig. 4, movable clamping device 2 includes upper low contact support column 201, top tray connector
203, it is held after, with clamping by the strip groove on turntable 901 one end of last arm 204 and top tray 205, the last arm 204
The output end of row mechanism 702 is connected, and the other end of last arm 204 is equipped with top tray connector 203, top tray connector 203
Side (upside) is connected with the other end of last arm 204, and the other end of the side of top tray connector 203 and last arm 204
Between there are height adjust gap 206, the other side (downside) of top tray connector 203 is equipped with top tray 205, top tray
It is equipped with side between 205 rear and front end and top tray connector 203 and adjusts gap.Top tray 205 towards in the one side of wafer 6,
Edge angle end is provided with the upper low contact support column 201 for clamping wafer 6.The low contact branch under including of fixed clamping device 3
Dagger 301, fixed tray 302, fixed tray connector 303 and fixed arm 304, one end of the fixation arm 304 and turntable
901 are connected, and the other end is equipped with fixed tray connector 303, is equipped with fixed tray 302 on fixed tray connector 303, this is solid
Determine pallet 302 towards in the one side of wafer 6, is provided at edge angle end for clamping low contact support column 301 under wafer 6.
Top tray 205 is equipped with movable clamping device centering guide post 202 towards the middle part of 6 one side of wafer, and fixed tray 302 is towards wafer 6
One and middle part be equipped with fixed clamping device centering guide post 305, overturning is installed on the fixed clamping device centering guide post 305
Unit jig guide holder 8, movable clamping device centering guide post 202 are inserted into roll-over unit jig guide holder 8 in calibrating position
In locating slot；If the center decentraction of top tray 205 and fixed tray 302, needs to adjust top tray 205 and top tray
Side between connector 203 adjusts gap, until movable clamping device centering guide post 202 is inserted into roll-over unit jig guiding
In the locating slot of seat 8.Mechanism work when, when wafer 6 is clamped, upper surface is abutted with upper low contact support column 201, lower surface and
Under low contact support column 301 abut.
As shown in Fig. 2, Fig. 5, wafer detection system 4 is installed on support frame 9, which includes the presence of inspection
Survey sensor 401, horizontal detection sensor 402, upturned position sensor 403 and clamp position sensor 404,9 court of support frame
To the side (i.e. on foreboard 902) of wafer 6 be separately installed between detection activity clamping device 2 and fixed clamping device 3 whether there is or not
Wafer 6 there are detection sensor 401 and detection wafer 6 whether there is inclination conditions horizontal detection sensor 402；This implementation
The horizontal detection sensor 402 of example is two, can be laser sensor, and two horizontal detection sensors 402 are respectively arranged on support
The two sides of frame 9.It is mobile that side (i.e. back plate 903 in) of the support frame 9 far from wafer 6 is separately installed with detection activity clamping device 2
Clamp position sensor 404 and detection turntable 901 rotate angle upturned position sensor 403.The clamping position of the present embodiment
Setting sensor 404 is two, positioned at the side of sliding rail 706.Each sensor of the utility model is the prior art.This is practical
The limit point that novel mobile limit point and turntable 901 in movable 2 one end of clamping device rotates, which is equipped with, plays buffer function
Damper, which is also the prior art.
As shown in Figure 1, Figure 2 and shown in Fig. 7, entrained particle control system 5 includes powder collection box 502 and control piper 501,
Powder collection box 502 is fixed on support frame 9, is circumscribed on the lower section of fixed clamping device 3, the powder collection box 502
Control piper 501 with negative pressure.In movable clamping device 2, fixed clamping device 3, the continuous motion process of wafer turnover device 7
In, it would be possible to the impurity such as dust are generated, powder collection box 502 is used for particulate pollutant, the dust etc. itself to fall off to wafer 6
It is collected, then the pollutant in powder collection box 502 is concentrated discharge by the control piper 501 by external with negative pressure, is kept away
Exempt to influence other modules.
As shown in fig. 6, the rotation adjustment of wafer turnover mechanism 7 is needed using fixed adjustment plate 704 with groove and with fixed
The turnover mechanism angle of position slot adjusts jig 703, and fixed adjustment plate 704 is placed on determining for turnover mechanism angle adjustment jig 703
In the slot of position；Horizontal ruler is placed on fixed tray 302 first when adjustment, guarantees that fixed tray 302 is horizontal；Then it is adjusted fixed
Plate 704 is placed on fixed tray 302, and it is recessed in fixed adjustment plate 704 to pass through the output shaft for overturning executing agency 701
Slot, then screw overturning executing agency 701 on angle adjusting screw, and moving and turning machine structure angle adjustment jig 703 so that
Locating slot thereon blocks the output shaft of overturning executing agency 701, so that it is determined that the initial bit of overturning 701 output shaft of executing agency
It sets and final position, to guarantee that overturning executing agency 701 drives turntable 901 to rotate 180 ° to final position by initial position.It is brilliant
When circle turnover mechanism 7 works, it need to guarantee accurately 180 ° of the rotation of 901 drive activity clamping device 2 of turntable and fixed clamping device 3,
It needs to carry out above-mentioned adjustment.
Movable clamping device 2 needs to carry out weight after carrying out clamping wafer 6 for the first time or being used for multiple times with fixed clamping device 3
When new calibrating position, roll-over unit jig guide holder 8 is needed to be adjusted.In adjustment, fixed clamping device 3 is kept first
In bottom, while it is motionless to need to be kept fixed arm 304, then positions fixed tray 302 and fixed tray connector 303
Afterwards, and with attachment screw it is locked.Fixed clamping device centering guide post 305 is locked after positioning using attachment screw simultaneously
Tightly, 8 sets of roll-over unit jig guide holder in fixed clamping device pair on guide post 305.Decline movable clamping device 2, until
Movable 202 lower end of clamping device centering guide post can pack into the locating slot of roll-over unit jig guide holder 8, realize centre bit
Set adjustment.After movable clamping device 2, fixed clamping device 3 are adjusted center, it is high that wafer 6 is placed into adjustment clamping
Degree, i.e., under fixed clamping device 3 in low contact support column 301, then decline movable clamping device 2, until upper low contact
Support column 201 touches 6 upper surface of wafer, then using between the height adjustment between last arm 204 and top tray connector 203
Gap 206 utilizes the installation site of the side adjustment gap adjustment front and back between top tray 205 and top tray connector 203.With upper
It sets after all adjusting, is fastened using screw.
The working principle of the utility model are as follows:
Wafer 6 first turns on equipment and is initialized, make each unit to initialization position in carrying out switching process
It sets, wafer 6 is sent in low contact centering body 1 by external transport mechanism, carries out center and the activity clamping device 2 of wafer 6
Center and fixed clamping device 3 center calibration actions, then by low contact centering body 1 be sent to activity clamping dress
It sets in 2 and fixed clamping device 3, is then judged using wafer detection system 4, will test result and feed back to external control system
(external control system of the utility model is the prior art), then wafer 6 is executed according to feedback result by external control system
Rotary movement takes wafer 6 away carry out the next step by external transport mechanism after wafer 6 carries out 108 ° of overturnings.Specifically
Are as follows:
During carrying out in, centering lifting structure 101 is risen first, and centering support PIN103 is made to accept wafer 6,
Then it drives the clamp arm 106 at both ends mobile to 6 direction of wafer from centering movement executing mechanism 102, utilizes centering terminal contactor
The center of 104 calibration wafers 6 keeps the center of wafer 6 identical as the center of movable clamping device 2 and fixed clamping device 3, to protect
It can be accurate when card progress holding action.Then declined again by centering lifting structure 101, wafer 6 is sent to activity clamping dress
Set 2 or fixed clamping device 3 low contact support column in.
After wafer 6 is fallen on low contact support column, by by wafer detection system 4 there are detection sensors 401 to carry out
It detects whether that wafer 6 is transmitted in clamping device, while whether there is by horizontal detection sensor 402 detection wafer 6
The case where inclination；Meanwhile above testing result feedback external control system being carried out judging whether to be alarmed either
Perform the next step movement.When all testing results are correct, external control system control clamping executing agency 702 is acted, by pressing from both sides
The driving activity clamping device 2 for holding executing agency 702 is smoothly gently close to fixed clamping device 3；In clamping executing agency
Under 702 position-limiting action, make movable clamping device 2 and fixed clamping device 3 upper low contact support column 201 and under low contact
Support column 301 and wafer 6 carry out it is low contact, compress wafer 6, while triggering clamp position sensor 404 and feeding back to external control
System processed, external control system control overturning executing agency 701 work, and driving turntable 901 is overturn, and then drives the peace of wafer 6
Complete 180 ° of overturning.After the completion of rotary movement, triggers upturned position sensor 403 and issue external control system signal, in turn
Control clamping executing agency 702 acts, and is smoothly gently opened by clamping 702 driving activity clamping device 2 of executing agency, simultaneously
Clamp position sensor 404 is triggered, and feeds back to external control system judgement and performs the next step movement.
The utility model provides wafer in the low contact wafer pair used in cleaning process process, overturning system, benefit
The safety machine clean-up performance that ensure that wafer switching process with wafer detection system 4 and air-flow particle control system 5, solves
The quickly safety and cleaning for being tuned into method and guaranteeing wafer switching process of adjustment wafer overturning system during wafer process
Property.
Claims (10)
1. a kind of low contact wafer centering, overturning system, it is characterised in that: including low contact centering body (1), activity clamping dress
(2), fixed clamping device (3), wafer turnover mechanism (7) and support frame (9) are set, wherein wafer turnover mechanism (7) includes overturning
Executing agency (701) and clamping executing agency (702), which is mounted on support frame (9), output end
It is connected with turntable (901), the clamping executing agency (702) is arranged on turntable (901), the activity clamping device (2)
One end is connect with the output end of clamping executing agency (702), and one end of the fixed clamping device (3) is mounted on turntable (901)
On, the other end of the activity clamping device (2) and fixed clamping device (3) is clamping end, and the side of wafer (6) is equipped with to it
Carry out the low contact centering body (1) of centering；The driving phase that the activity clamping device (2) passes through clamping executing agency (702)
It is mobile for turntable (901), wafer (6) are clamped with fixed clamping device (3), the clamping executing agency (702), activity clamping
Device (2), fixed clamping device (3) and clamped wafer (6) are with turntable (901) by overturning executing agency (701) driving rotation
Turn.
2. low contact wafer centering according to claim 1, overturning system, it is characterised in that: the low contact transducer
Structure (1) includes that centering lifting structure (101), centering movement executing mechanism (102), centering support PIN (103), centering terminal connect
Tentaculum (104), plummer (105) and clamp arm (106), which is mounted on centering lifting structure (101), described
Plummer (105) is equipped with centering movement executing mechanism (102), two output ends point of the centering movement executing mechanism (102)
It is not connected with clamp arm (106), the clamping end of every end clamp arm (106) is mounted on the centering terminal contactor contacted with wafer (6)
(104)；The centering that the plummer (105) is equipped with support wafer (6) supports PIN (103).
3. low contact wafer centering according to claim 1, overturning system, it is characterised in that: the activity clamping device
It (2) include upper low contact support column (201), top tray connector (203), last arm (204) and top tray (205), hand on this
One end of arm (204) is connected with clamping executing agency (702) output end, and the other end is equipped with top tray connector (203), institute
It states and is equipped on top tray connector (203) top tray (205), is provided on the top tray (205) for clamping wafer (6)
Upper low contact support column (201).
4. low contact wafer centering according to claim 3, overturning system, it is characterised in that: the top tray connector
(203) side is connected with the other end of last arm (204), and the side of top tray connector (203) and last arm (204)
There are height to adjust gap (206) between the other end；The rear and front end and top tray connector (203) of the top tray (205)
Between be equipped with side adjust gap.
5. low contact wafer centering according to claim 1, overturning system, it is characterised in that: the fixed clamping device
(3) low contact support column (301), fixed tray (302), fixed tray connector (303) and fixation arm (304) under including,
One end and the turntable (901) of the fixation arm (304) are connected, and the other end is equipped with fixed tray connector (303), described solid
Determine that fixed tray (302) are installed on pallet connector (303), is provided on the fixed tray (302) for clamping wafer (6)
Under low contact support column (301).
6. low contact wafer centering according to claim 1, overturning system, it is characterised in that: the activity clamping device
(2) it is equipped with movable clamping device centering guide post (202), the fixed clamping device (3) is equipped with fixed clamping device centering
Guide post (305) is equipped with roll-over unit jig guide holder (8), the activity folder on the fixed clamping device centering guide post (305)
Device centering guide post (202) is held to be inserted into calibrating position in the locating slot of roll-over unit jig guide holder (8).
7. low contact wafer centering according to claim 1, overturning system, it is characterised in that: edge on the turntable (901)
Radial direction offers strip groove, one end of the activity clamping device (2) passed through by the strip groove and with the clamping executing agency
(702) output end is connected.
8. low contact wafer centering according to claim 1, overturning system, it is characterised in that: the activity clamping device
(2) one end is passed through by turntable (901), and is equipped with connecting plate (705), and turntable (901) is equipped with sliding rail (706), the connection
Plate (705) is slidably connected by sliding block with the sliding rail (706)；The output end and connecting plate of clamping executing agency (702)
(705) it is connected.
9. low contact wafer centering according to claim 1, overturning system, it is characterised in that: support frame as described above is pacified on (9)
Equipped with wafer detection system (4), which includes that there are detection sensors (401), horizontal detection sensor
(402), upturned position sensor (403) and clamp position sensor (404), side of the support frame as described above (9) towards wafer (6)
Be separately installed with detection wafer (6) whether there is or not there are the whether inclined horizontal detections of detection sensor (401) and detection wafer (6)
Sensor (402)；Support frame as described above (9) is separately installed with detection activity clamping device (2) movement far from the side of wafer (6)
The upturned position sensor (403) of clamp position sensor (404) and detection turntable (901) rotation angle.
10. low contact wafer centering according to claim 1, overturning system, it is characterised in that: the fixed clamping device
(3) lower section is equipped with the entrained particle control system (5) being installed on support frame (9), which includes
Powder collection box (502) and control piper (501), the powder collection box (502) are fixed on support frame (9), which receives
The control piper (501) with negative pressure is circumscribed on collection box (502).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821916407.9U CN208985962U (en) | 2018-11-21 | 2018-11-21 | Low contact wafer centering, overturning system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821916407.9U CN208985962U (en) | 2018-11-21 | 2018-11-21 | Low contact wafer centering, overturning system |
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| Publication Number | Publication Date |
|---|---|
| CN208985962U true CN208985962U (en) | 2019-06-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821916407.9U Active CN208985962U (en) | 2018-11-21 | 2018-11-21 | Low contact wafer centering, overturning system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112542414A (en) * | 2019-09-20 | 2021-03-23 | 沈阳芯源微电子设备股份有限公司 | Substrate clamping bearing table |
| CN113770935A (en) * | 2020-12-18 | 2021-12-10 | 钟兴进 | Wafer centering structure and method |
-
2018
- 2018-11-21 CN CN201821916407.9U patent/CN208985962U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112542414A (en) * | 2019-09-20 | 2021-03-23 | 沈阳芯源微电子设备股份有限公司 | Substrate clamping bearing table |
| CN112542414B (en) * | 2019-09-20 | 2024-04-26 | 沈阳芯源微电子设备股份有限公司 | Substrate clamping bearing table |
| CN113770935A (en) * | 2020-12-18 | 2021-12-10 | 钟兴进 | Wafer centering structure and method |
| CN113770935B (en) * | 2020-12-18 | 2022-12-06 | 钟兴进 | Wafer centering structure and method |
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