CN220029613U

CN220029613U - Wafer horizontal buffer positioning combination device

Info

Publication number: CN220029613U
Application number: CN202320413804.9U
Authority: CN
Inventors: 王宏声; 陈柏柏; 葛成重
Original assignee: Beijing Sunt Technology Co ltd
Current assignee: Beijing Riyang Hongchuang Intelligent Equipment Co ltd
Priority date: 2023-03-06
Filing date: 2023-03-06
Publication date: 2023-11-17
Anticipated expiration: 2033-03-06

Abstract

The utility model relates to the technical field of semiconductor auxiliary equipment, and discloses a wafer horizontal cache positioning combination device which comprises a device substrate, a positioning substrate, a horizontal cache assembly and a positioning station. When the polishing device is used, wafers are taken out of the material frame and placed in the horizontal buffer assembly through the thin mechanical arm until the horizontal buffer assembly is buffered to a specified number, when the polishing device is required to be charged, the wafers are taken out of the horizontal buffer assembly through the thin mechanical arm, one wafer or a plurality of wafers are taken at a time and placed on the positioning station, the three positioned wafers are respectively absorbed by the feeding sucker mechanical arm, and three wafers are charged for the polishing device again. The structure can realize the horizontal positioning of the wafer through the arrangement of the positioning stations, thereby reducing the surface scratch of the wafer.

Description

Wafer horizontal buffer positioning combination device

Technical Field

The utility model relates to the technical field of semiconductor auxiliary equipment, in particular to a wafer horizontal cache positioning combination device.

Background

At present, in the production process of wafer polishing equipment, the wafer polishing equipment is divided into manual loading and unloading and automatic loading and unloading, when the manual loading is carried out for the polishing equipment, a worker takes out a wafer from a wafer material frame and puts into the polishing groove of the polishing equipment, 3 polishing grooves in the polishing equipment are in a group, five groups are all arranged, and the five groups of polishing grooves are evenly distributed relative to the rotation center of a polishing disk. Because the polishing disk is large in size, after one group of polishing grooves is fed manually, a rotary button of the polishing disk is triggered, so that the polishing disk rotates 72 degrees, the next group of polishing grooves rotate to the front of a worker, and then feeding is performed until all 5 groups of polishing grooves are fed. When the polishing device is automatically fed, according to the actual production working condition of the polishing device, the sucker type manipulator can only be used for automatically feeding into the polishing groove, and because of the limitation of the standard material frame structure, the sucker type manipulator can not directly remove the standard material frame of the wafer to take the material, so that the wafer needs to be firstly taken out from the material frame by other thin type manipulators and placed at a buffer station, and then the wafer with the buffer position sucked by the sucker type manipulator is fed into the polishing device.

The existing buffer station is a vertical buffer and gravity shaping positioning mode, as shown in fig. 4.

It has the following disadvantages in the practical process:

1. in order to ensure the position accuracy of the wafer, the gap between the groove where the wafer is positioned and the wafer is designed to be smaller, so that the wafer is easy to scratch the surface of the wafer in the process of entering and exiting the groove and the groove wall;

2. because the gap between the wafer and the groove wall is smaller, the speed of the manipulator in the process of taking and placing the wafer must be very slow, so that the feeding time is prolonged, and the yield of polishing equipment is indirectly affected.

Disclosure of Invention

The utility model mainly provides a wafer horizontal cache positioning combination device, which solves the problem that the surface of a wafer is scratched easily to ensure the position accuracy; and the gap is smaller, so that the feeding time is long and the yield is influenced.

In order to solve the technical problems, the utility model adopts the following technical scheme:

the wafer horizontal cache positioning combination device comprises a device substrate and a positioning substrate arranged on the device substrate, wherein a plurality of horizontal cache components for caching wafers are arranged between the device substrate and the positioning substrate, and a plurality of positioning stations for positioning the wafers are arranged on the positioning substrate. Wherein, a plurality of the components refer to two or more components, and the specific quantity of the components is set according to actual needs. When the polishing device is used, wafers are taken out of the material frame and placed in the horizontal buffer assembly through the thin mechanical arm until the horizontal buffer assembly is buffered to a specified number, when the polishing device is required to be charged, the wafers are taken out of the horizontal buffer assembly through the thin mechanical arm, one wafer or a plurality of wafers are taken at a time and placed on the positioning station, the three positioned wafers are respectively absorbed by the feeding sucker mechanical arm, and three wafers are charged for the polishing device again. The structure can realize the horizontal positioning of the wafer through the arrangement of the positioning stations, thereby reducing the surface scratch of the wafer.

Further, six guiding and positioning shafts distributed along the circumferential direction of the wafer, a group of detecting sensors for detecting whether the wafer exists or not, and a group of cylinder positioning assemblies for pushing the wafer to position are arranged on the positioning substrate in the corresponding positioning station. When the wafer positioning device is used, a wafer is taken out from the horizontal buffer assembly and placed on steps of six guiding and positioning shafts through the thin mechanical arm, whether the wafer exists or not is detected by the detecting sensor, and when the wafer exists, the wafer on the guiding and positioning shafts is pushed through the cylinder positioning assembly to be positioned. Compared with the prior art, the positioning is realized through the arrangement of smaller gaps, and the surface scratch of the wafer can be reduced.

Further, two groups of inclination detection sensors for detecting the inclination of the wafer are installed on the positioning substrate corresponding to the positioning station. The inclination detection sensor is arranged to detect the inclination of the wafer, and after the non-inclination model is detected, three wafers are respectively sucked by the feeding sucker manipulator, and three feeding is performed for the polishing equipment once again.

Further, the wafer processing device also comprises an offset detection sensor for detecting whether the wafer is placed on the horizontal cache assembly or not. Whether the position deviation of the wafer placed on the horizontal cache assembly occurs can be detected by the setting of the deviation sensor, and the position deviation is timely adjusted, so that follow-up feeding failure caused by deviation is avoided, and a detection closed loop is formed.

Further, at least three sets of positioning stations are included. This arrangement can conform to the existing form of mainstream wafer polishing equipment.

Further, the cylinder positioning assembly comprises a frame body arranged on the positioning substrate and a pushing cylinder arranged on the frame body.

The beneficial effects are that: when the polishing device is used, wafers are taken out of the material frame and placed in the horizontal buffer assembly through the thin mechanical arm until the horizontal buffer assembly is buffered to a specified number, when the polishing device is required to be charged, the wafers are taken out of the horizontal buffer assembly through the thin mechanical arm, one wafer or a plurality of wafers are taken at a time and placed on the positioning station, the three positioned wafers are respectively absorbed by the feeding sucker mechanical arm, and three wafers are charged for the polishing device again. The structure can realize the horizontal positioning of the wafer through the arrangement of the positioning stations, thereby reducing the surface scratch of the wafer.

Drawings

FIG. 1 is a schematic diagram of a wafer level buffer positioning assembly according to an embodiment;

FIG. 2 is an enlarged schematic view of FIG. 1A according to the present embodiment;

FIG. 3 is an enlarged schematic view of FIG. 1B according to the present embodiment;

fig. 4 is a schematic diagram of a vertical cache device in the prior art.

Reference numerals: the device comprises a device substrate 1, a horizontal buffer assembly 2, a positioning substrate 3, a guiding positioning shaft 4, an inclination detection sensor 5, a cylinder positioning assembly 6, a pushing cylinder 61, a frame 62, a presence detection sensor 7 and an offset detection sensor 8.

Detailed Description

The following will further describe the technical scheme of the wafer horizontal cache positioning combination device according to the present utility model in detail by combining the embodiments.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

As shown in fig. 1, 2 and 3, the wafer horizontal buffer positioning combination device of the present embodiment includes a device substrate 1 and a positioning substrate 3 mounted on the device substrate 1, a plurality of horizontal buffer assemblies 2 for buffering wafers are mounted between the device substrate 1 and the positioning substrate 3, and a plurality of positioning stations for positioning wafers are disposed on the positioning substrate 3. The number of the water storage modules 2 in this embodiment is two. Six guide positioning shafts 4 distributed along the circumferential direction of the wafer are arranged on the positioning substrate 3 in the corresponding positioning station, a group of detection sensors 7 for detecting whether the wafer exists or not are arranged, and a group of cylinder positioning assemblies 6 for pushing the wafer to position are arranged. Two groups of inclination detection sensors 5 for detecting the inclination of the wafer are arranged on the positioning substrate 3 corresponding to the positioning station. An offset detection sensor 8 for detecting whether the wafer is placed on the horizontal buffer assembly 2 is also included. Comprises at least three groups of positioning stations. The cylinder positioning assembly 6 includes a frame 62 mounted on the positioning base plate 3, and a pushing cylinder 61 mounted on the frame 62. When the polishing device is used, wafers are taken out of a material frame and placed in the horizontal buffer assembly 2 through the thin mechanical arm until the horizontal buffer assembly 2 is buffered to a specified number, when the polishing device is required to be fed, the wafers are taken out of the horizontal buffer assembly 2 through the thin mechanical arm, one wafer or a plurality of wafers are taken out at a time and placed on steps of the guide positioning shaft 4 arranged on the positioning substrate 3, whether the wafers are detected and output a material-bearing signal or not through the sensor, the inclination detection sensor 5 can detect inclination and output the inclination-free signal, then the cylinder positioning assembly 6 pushes the cylinder 61 to stretch out to mechanically push and position the wafers, the feeding sucker mechanical arm respectively absorbs the three positioned wafers, and then the pushing cylinder 61 is released to feed the three wafers to the polishing device at a time.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a wafer level buffer memory location composite set which characterized in that: the wafer positioning device comprises a device substrate and a positioning substrate arranged on the device substrate, wherein a plurality of horizontal caching assemblies for caching wafers are arranged between the device substrate and the positioning substrate, and a plurality of positioning stations for positioning the wafers are arranged on the positioning substrate.

2. The wafer level cache alignment assembly of claim 1, wherein: six guide positioning shafts distributed along the circumferential direction of the wafer, a group of detection sensors for detecting whether the wafer exists or not, and a group of cylinder positioning assemblies for pushing the wafer to position are arranged on the positioning substrate in the corresponding positioning station.

3. The wafer level cache alignment assembly of claim 1, wherein: two groups of inclination detection sensors for detecting the inclination of the wafer are arranged on the positioning substrate corresponding to the positioning station.

4. The wafer level cache alignment assembly of claim 1, wherein: and the horizontal buffer assembly further comprises an offset detection sensor for detecting whether the wafer is placed on the horizontal buffer assembly or not.

5. The wafer level cache alignment assembly of claim 2, wherein: comprises at least three groups of positioning stations.

6. The wafer level cache alignment assembly of claim 2, wherein: the cylinder positioning assembly comprises a frame body arranged on the positioning substrate and a pushing cylinder arranged on the frame body.