CN115692281A - Wafer access library - Google Patents

Abstract

The invention discloses a wafer access library, comprising: the storage and taking system comprises a storage and taking warehouse, a wafer warehouse and a wafer unloading and taking device, wherein the storage and taking warehouse is used for storing wafers to be warehoused and comprises a storage and taking frame and a transfer machine; the conveying line conveys the wafer; the wafer storage machine is used for transferring the wafer to the conveying line; and the wafer taking machine is used for taking the wafer from the conveying line out. The beneficial effects of the invention are: when the wafer taking machine is used, the card plug with the wafer on the access frame is transferred to a conveying line through the transfer machine, and then the wafer is taken out to the next process through the wafer taking machine.

Description

Wafer access library

Technical Field

The invention relates to the technical field of semiconductor wafer storage, in particular to a wafer access library.

Background

In the semiconductor industry, wafers are an important component of silicon wafers used in the fabrication of silicon semiconductor circuits, and high purity polysilicon is dissolved and doped into silicon crystal seeds and then slowly pulled out to form cylindrical single crystal silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed.

In a storage warehouse of semiconductor wafers (or wafer cassettes), a plurality of storage cells are arranged, and a stacker is used for taking and placing the wafer cassettes in the storage cells in the storage warehouse, but in the actual process of accessing the wafer cassettes, some wafer cassettes need manual intervention in and out of the storage warehouse, for example, workers put the wafer cassettes in the storage warehouse, and the workers take the wafer cassettes out of the storage warehouse, and the like. In addition, in view of the fact that uncontrollable factors such as chip collision and breakage, contact with a stacker and the like are easily caused in the process of entering and exiting the storage warehouse by workers, the workers are not convenient to enter the storage warehouse to directly take and place the wafer box, the overall access efficiency is low, the automation degree is low, and therefore the wafer access warehouse is provided for solving the problems.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provide a wafer access library.

The purpose of the invention is realized by the following technical scheme:

a wafer access library, comprising: the storage and taking system comprises a storage and taking warehouse, a wafer warehouse and a wafer unloading and taking device, wherein the storage and taking warehouse is used for storing wafers to be warehoused and comprises a storage and taking frame and a transfer machine; the conveying line conveys the wafer; the wafer storage machine is used for transferring the wafer to the conveying line; the wafer taking machine is used for taking out the wafer from the conveying line; the wafer storage rack is characterized in that the conveying line is located between the wafer storage machine, the wafer taking machine and the storage and taking warehouse which are arranged in parallel, wafers are transferred to the wafer storage machine, the wafer storage machine is transferred to the wafer storage rack through the transfer machine, when the wafers are required to be taken, the wafers are taken out through the transfer machine and transferred to the conveying line, and the wafers located on the conveying line are carried and taken out through the wafer taking machine.

Preferably, the chip storage machine comprises a first rack for mounting, a feeding turntable mechanism is mounted on the first rack, the feeding turntable mechanism comprises a first fixing frame fixedly mounted on the first rack, a first DD motor is mounted on the first fixing frame, a first turntable is mounted at the power output end of the first DD motor, a plurality of first jigs are arranged on the first turntable and evenly distributed at intervals relative to the axis of the first turntable, at least one first clamping plug is arranged on each first jig, and a detector is arranged below the feeding end of the first turntable; the first machine frame is further provided with a carrying mechanism and a code reader, the carrying mechanism carries the first card plug on the first rotary table to the conveying line, and the code reader is located on one side of the carrying mechanism.

Preferably, the wafer taking machine comprises a second rack, a detection turntable mechanism is arranged on the second rack, a first code reading detection mechanism is arranged at a detection position of the detection turntable mechanism, a carrying mechanism and a first wafer taking mechanism are arranged at an input position of the detection turntable mechanism, a second wafer taking mechanism is arranged at an output position of the detection turntable mechanism, a placing frame is arranged on one side of the second wafer taking mechanism, a warehouse-out cache mechanism is further arranged on the second rack and is positioned on one side of the carrying mechanism, the warehouse-out cache mechanism comprises a second fixing frame arranged on the second rack, a third servo motor is arranged on the bottom surface of the second fixing frame, at least one fourth jig is arranged on a support plate arranged at the power output end of the third servo motor, a fifth clamping plug is arranged on the fourth jig, and a fourth clamping plug is arranged on the other side of the second wafer taking mechanism, wherein the wafer in the fifth clamping plug is transferred to the input position of the detection turntable mechanism by the first wafer taking mechanism;

detect carousel mechanism including installing the first mounting panel in the second frame, a first mounting panel side fixed mounting sixth servo motor, the second carousel is installed to sixth servo motor power take off, set up the standing groove that a plurality of set up about the even interval in second carousel center on the second carousel, the fixed third cylinder that sets up in first mounting panel another side, the first sign indicating number detection camera that reads is installed to the mounting bracket on the third cylinder.

Preferably, the device further comprises a wafer reversing machine, the wafer reversing machine comprises a third rack for installation, a plurality of third wafer taking mechanisms are arranged on the upper surface of the third rack, a first code reading detection mechanism is arranged on the side surface of another adjacent third wafer taking mechanism, a third jig is arranged on one side of each third wafer taking mechanism, a plurality of third clamping plugs with the same number as the third wafer taking mechanisms are arranged on each third jig, and a first code reading detection mechanism is also arranged between each third jig and each third wafer taking mechanism;

the third sheet taking mechanism comprises a seventh linear module arranged on a third rack, the power output end of the seventh linear module is provided with an eighth linear module, and the power output end of the eighth linear module is provided with a third sucker.

Preferably, the transfer machine comprises a base positioned on one side of the storage rack, a guide rail is arranged on the base, a sliding frame is arranged on the guide rail in a sliding manner, a second linear module which can move up and down is arranged on the sliding frame, a rack is further arranged on the base, a first servo motor is fixedly arranged on the sliding frame, a gear matched with the rack is arranged at the power output end of the first servo motor, and the gear is in meshing transmission with the rack; the power output end of the second straight line module is provided with at least one mounting rack, a second DD motor is mounted on each mounting rack, a third straight line module is mounted at the output end of the second DD motor, a first cylinder is arranged on the third straight line module, and a clamping jaw is arranged at the power output end of the first cylinder.

Preferably, the carrying mechanism comprises a supporting frame, a triaxial linear movement module is arranged on the supporting frame, a second servo motor is fixedly mounted on a mounting frame of a power end of the triaxial linear movement module, a rotary plate is mounted at a power output end of the second servo motor, two sliding blocks and every sliding block are arranged below the rotary plate in a sliding mode, a sliding plate is fixedly connected to the bottom surface of each sliding block, a rotary cylinder is mounted on the outer side surface of each sliding plate, a power output end of each rotary cylinder extends to the inner side surface of each sliding plate, a clamping plate is mounted at a power output end of each rotary cylinder, a driving motor is fixedly mounted on one side of the upper surface of the rotary plate, a screw rod is connected between the sliding plates in a transmission mode, and a power input end of the screw rod is connected with a power output end of the driving motor in a transmission mode.

Preferably, still install on the first frame and set up and get piece and read a yard detection mechanism, it reads a yard detection mechanism and is located material loading carousel mechanism one side to get the piece, it reads a yard detection mechanism including installing the first sharp module on first frame to get the piece, power take off end is provided with first piece mechanism of getting on the first sharp module, still be provided with first sign indicating number detection mechanism of reading on the first sharp module, one side of first sharp module is to having the support, be provided with the second tool on the support, place on the second tool and be provided with a plurality of second blocks.

Preferably, the first piece mechanism of getting includes fourth sharp module, fifth sharp module is installed to fourth sharp module power take off end, install fifth servo motor on the output mounting bracket of fifth sharp module, fifth servo motor power take off end sets up the first sucking disc that is used for absorbing the wafer.

Preferably, the first code reading detection mechanism comprises a second mounting plate, a second air cylinder is mounted on the second mounting plate, and a second code reading detection camera is arranged on a mounting frame of a power output end of the second air cylinder.

Preferably, the second film taking mechanism comprises a third fixing frame installed on the second rack, a fourth servo motor is installed on the bottom surface of the third fixing frame, the power output end of the fourth servo motor extends to the top of the third fixing frame, a sixth linear module is installed at the power output end of the fourth servo motor, and a second sucker is arranged at the power output end of the sixth linear module.

The invention has the following advantages:

1. the invention puts the card plug with the wafer into the wafer storage machine, conveys the card plug with the wafer in the wafer storage machine to the input end of the transfer machine, stores the card plug with the wafer on the access frame through the transfer machine, when the invention is used, the card plug with the wafer on the access frame is transferred to the conveying line through the transfer machine, then the wafer is taken out to the next procedure through the wafer taking machine, and then the card plug with the wafer in the wafer storage machine is transferred to the conveying line and the access frame.

2. According to the invention, the sliding frame and the second linear module are driven to move by the first servo motor, so that the clamping plug which is clamped by the clamping claw and is provided with the wafer is moved to the preset position, and then the clamping plug provided with the wafer is transferred to the access frame by the second linear module, so that the clamping plug provided with the wafer is automatically stored, and the automatic access effect is realized.

Drawings

Fig. 1 is a schematic view of the general structure of the present invention.

FIG. 2 is a schematic diagram of a chip storage machine according to the present invention.

Fig. 3 is a schematic structural view of the sheet taking machine of the present invention.

Fig. 4 is a schematic structural diagram of a chip rewinding machine of the present invention.

FIG. 5 is a diagram of a partial structure of an access library according to the present invention.

Fig. 6 is a schematic structural view of a transfer machine according to the present invention.

Fig. 7 is a schematic structural diagram of a conveying mechanism of the present invention.

FIG. 8 is a schematic structural diagram of a warehouse-out caching mechanism according to the present invention.

FIG. 9 is a schematic structural diagram of a pick-up and code-reading detecting mechanism according to the present invention.

Fig. 10 is a schematic structural view of a first sheet taking mechanism according to the present invention.

Fig. 11 is a schematic structural view of a second sheet taking mechanism according to the present invention.

FIG. 12 is a schematic view of the transmission line structure of the present invention.

Fig. 13 is a schematic structural diagram of a detection turntable mechanism according to the present invention.

Fig. 14 is a schematic structural view of a third sheet taking mechanism according to the present invention.

Fig. 15 is a schematic structural view of a loading turntable mechanism of the invention.

Fig. 16 is a schematic view of a jig structure according to the present invention.

Fig. 17 is a schematic view of a structure of the plug of the present invention.

Fig. 18 is a schematic view of the splint structure of the present invention.

In the figure, 1, a chip storage machine; 11. a first frame; 12. a feeding turntable mechanism; 121. a first fixing frame; 122. a first DD motor; 123. a detector; 124. a first turntable; 125. a first jig; 126. a first stopper; 13. a film-taking code-reading detection mechanism; 131. a first linear module; 132. a support; 133. a second jig; 134. a second stopper; 14. a code reader; 2. taking a sheet machine; 21. a second frame; 22. placing a rack; 23. a detection turntable mechanism; 231. a first mounting plate; 232. a sixth servo motor; 233. a second turntable; 234. a placement groove; 235. a third cylinder; 236. a first code reading detection camera; 24. a second film taking mechanism; 241. a third fixing frame; 242. a fourth servo motor; 243. a sixth linear module; 244. a second suction cup; 25. a warehouse-out caching mechanism; 251. a second fixing frame; 252. a third servo motor; 253. a fourth jig; 254. a fifth jam; 26. a fourth card plug; 3. accessing a library; 31. an access shelf; 32. a transfer machine; 320. a base; 321. a guide rail; 322. a rack; 323. a second linear module; 324. a carriage; 325. a first servo motor; 326. a second DD motor; 327. a third linear module; 328. a first cylinder; 329. a clamping jaw; 4. a conveying line; 5. a wafer rewinding machine; 51. a third frame; 52. a third film taking mechanism; 521. a seventh linear module; 522. an eighth linear module; 523. a third suction cup; 53. a third jig; 54. a third plug; 6. a carrying mechanism; 61. a support frame; 62. a three-axis linear movement module; 63. a second servo motor; 64. a rotating plate; 65. a rotating cylinder; 66. a splint; 67. a drive motor; 68. a slider; 69. a sliding plate; 7. a first film taking mechanism; 71. a fourth linear module; 72. a fifth linear module; 73. a fifth servo motor; 74. a first suction cup; 8. a first code reading detection mechanism; 81. a second mounting plate; 82. a second cylinder; 83. a second code reading detection camera.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings of the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.

As in the embodiment shown in figures 1-17,

a wafer access library, comprising: the storage and taking system comprises an access warehouse 3, wherein the access warehouse 3 stores wafers to be warehoused, the access warehouse 3 comprises an access frame 31 and a transfer machine 32, the access frame 31 stores the wafers, and the transfer machine 32 stores and takes the wafers positioned on the access frame 31; the conveying line 4 is used for conveying the wafer; the wafer storage machine 1 is used for transferring the wafer to the conveying line 4; the wafer taking machine 2 is used for taking the wafer from the conveying line 4 out; wherein, transfer chain 4 is located deposit mascerating machine 1, the piece machine of getting 2 that set up side by side and deposits between storehouse 3, with the wafer transfer to deposit mascerating machine 1, deposit on the frame 31 of putting into storage through moving the wafer that moves machine 32 with depositing mascerating machine 1 and transport to transfer chain 4, when needs get the piece, take out and transport the wafer to transfer chain 4 through moving the machine 32, get mascerating machine 2 and carry the wafer that is located transfer chain 4 and take out.

The conveying line 4 can move in two directions to realize linear conveying, specifically, a linear motor can be used as a motion power source, the clamping plug is driven by the linear motor to move, the conveying line 4 can be set to be a single layer or a double layer, when the conveying line is a double layer, one layer is specially butted with the wafer storage machine 1, the other side is butted with the wafer taking machine 2, for example, the upper layer is butted with the wafer storage machine 1, the lower layer is butted with the wafer taking machine 2, when the wafer storage machine needs to store, the wafer storage machine 1 transfers the clamping plug with the wafer to the upper layer conveying line 4, the clamping plug with the wafer on the upper layer is transferred to the access frame 31 through the transfer machine 32, when the wafer taking needs to be carried out, the transfer machine 32 takes out the clamping plug with the wafer from the access frame 31 and sends the clamping plug with the wafer to the lower layer conveying line 4, then the clamping plug with the wafer on the lower layer conveying line 4 is taken out by the wafer taking machine 2, and the next process is carried out;

when the conveying line 4 has only one layer, the conveying line 4 is responsible for storing the clamping plugs filled with the wafer and taking out the clamping plugs; the choice of double-layer or single-layer is made according to actual needs, and it can be easily thought by those skilled in the art that the linear motor is used as a power source to drive the chuck plug with the wafer to move as needed.

The wafer clamping plug is placed in the wafer storage machine 1, the wafer clamping plug arranged in the wafer storage machine 1 is conveyed to the input end of the transfer machine 32 through the transfer machine 4, the wafer clamping plug arranged in the wafer storage machine 1 is stored on the storage rack 31 through the transfer machine 32, when the wafer storage machine is used, the wafer clamping plug arranged in the storage rack 31 is transferred to the conveying line 4 through the transfer machine 32, the wafer is taken out to the next process through the wafer taking machine, the wafer clamping plug arranged in the wafer storage machine 1 is transferred to the conveying line and the storage rack, and the whole process from the storage rack to the wafer taking machine is completed automatically without manual operation.

The chip storage machine 1 comprises a first rack 11 for mounting, a feeding turntable mechanism 12 is mounted on the first rack 11, the feeding turntable mechanism 12 comprises a first fixing frame 121 fixedly mounted on the first rack 11, a first DD motor 122 is mounted on the first fixing frame 121, a first turntable 124 is mounted at a power output end of the first DD motor 122, a plurality of first jigs 125 uniformly distributed at intervals around an axis of the first turntable 124 are arranged on the first turntable 124, at least one first clamping plug 126 is arranged on each first jig 125, and a detector 123 is arranged below a feeding end of the first turntable 124; the first frame 11 is also provided with a carrying mechanism 6 and a code reader 14; the code reader 14 scans the first jam 126 conveyed by the conveying mechanism 6, so as to conveniently know the position of the jam when the jam is subsequently taken out, the conveying mechanism 6 conveys the first jam 126 on the first turntable 124 to the conveying line 4, and the code reader 14 is positioned at one side of the conveying mechanism 6.

The first clamping plug 126 containing the wafer is manually placed on the first jig 125, after the placement is completed, the detector 123 detects that the first clamping plug 126 is arranged on the first jig 125, the lamp of the detector 123 is turned on, the detector 123 is used for judging whether the first clamping plug 126 is placed on the first jig 125, or the detector 123 is used for detecting whether the first clamping plug 126 is placed to enable the first DD motor 122 to work, when the first DD motor 122 is ready to transport the first clamping plug 126 containing the wafer to the feeding end of the transporting mechanism 6, the first clamping plug 126 is transported to the transporting line 4 through the transporting mechanism 6, then the first clamping plug 126 is transported to the feeding end of the transfer machine 32 through the transporting line 4, and then the clamping plug containing the wafer is transported to the access frame 31 through the transfer machine 32.

The wafer taking machine 2 comprises a second rack 21, a detection turntable mechanism 23 is arranged on the second rack 21, a first code reading detection mechanism 8 is arranged at a detection position of the detection turntable mechanism 23, a carrying mechanism 6 and a first wafer taking mechanism 7 are arranged at an input position of the detection turntable mechanism 23, a second wafer taking mechanism 24 is arranged at an output position of the detection turntable mechanism 23, a placing rack 22 is arranged on one side of the second wafer taking mechanism 24, a warehouse-out cache mechanism 25 is further arranged on the second rack 21 and is positioned on one side of the carrying mechanism 6, the warehouse-out cache mechanism 25 comprises a second fixing rack 251 arranged on the second rack 21, a third servo motor 252 is arranged on the bottom surface of the second fixing rack 251, at least one fourth fixture 253 is arranged on a support plate arranged at the power output end of the third servo motor 252, a fifth clamping plug fixture 254 is arranged on the fourth fixture 253, a fourth clamping plug 26 is arranged on the other side of the second wafer taking mechanism 24, and the wafer in the fifth clamping plug 254 is transferred to the detection turntable mechanism 23 by the first wafer taking mechanism 7;

the card plug to be taken out is taken out from the conveying line 4 by the carrying mechanism 6 in the wafer taking machine 2 and is placed in the fourth jig 253, in the embodiment, the fourth jig 253 is provided with two stations, namely, two card plugs can be placed, then the wafer in the fifth card plug 254 on the fourth jig 253 is taken out by the first code reading detection mechanism 8 and is placed at the feeding position of the detection turntable mechanism 23 close to the fourth jig 253, then the code reading detection is carried out by the first code reading detection mechanism 8, then the wafer after the code reading detection is placed in the card plug on the placing frame 22 by the second wafer taking mechanism 24, the placing frame 22 can be automatically lifted, or the placing frame 22 can be automatically lifted, the specific lifting mechanism can be a linear driving mechanism such as an air cylinder, a servo motor screw rod defect module and the like, and the fourth card plug 26 is used for placing the wafer which is not needed or has a defect; empty jams after the wafers are transferred in the ex-warehouse buffer mechanism 25 can be transferred to empty positions on the second rack 21 through the carrying mechanism 6, and then the empty jams can be manually transferred out, so that the empty jams are prevented from being accumulated on the second rack 21.

The detection turntable mechanism 23 comprises a first mounting plate 231 mounted on the second frame 21, a sixth servo motor 232 is fixedly mounted on one side of the first mounting plate 231, a second turntable 233 is mounted at the power output end of the sixth servo motor 232, a plurality of placing grooves 234 formed in the center of the second turntable 233 are formed in the second turntable 233 at equal intervals, a third air cylinder 235 is fixedly arranged on the other side of the first mounting plate 231, and a first code reading detection camera 236 is mounted on a mounting frame on the third air cylinder 235.

The first code detection mechanism 8 that reads transports the pan feeding department of standing groove 234 with the wafer in the fifth card stopper 254, then sixth servo motor 232 starts to drive second carousel 233 and rotates, then along with rotating, detects when first code detection camera 236 that reads, and rethread second after the detection finishes gets piece mechanism 24 and takes out the wafer from the standing groove 234 of ejection of compact department and transports to rack 22 in the card stopper or place on the fourth card stopper 26.

The automatic sheet feeding device is characterized by further comprising a sheet rewinding machine 5, wherein the sheet rewinding machine 5 comprises a third rack 51 for installation, a plurality of third sheet taking mechanisms 52 are arranged on the upper surface of the third rack 51, a first code reading detection mechanism 8 is arranged on the side surface of another adjacent third sheet taking mechanism 52, a third jig 53 is arranged on one side of each third sheet taking mechanism 52, a plurality of third clamping plugs 54 with the same number as that of the third sheet taking mechanisms 52 are arranged on each third jig 53, and the first code reading detection mechanisms 8 are also arranged between the third jigs 53 and the third sheet taking mechanisms 52;

the third film taking mechanism 52 comprises a seventh linear module 521 mounted on the third frame 51, an eighth linear module 522 is arranged at a power output end of the seventh linear module 521, and a third suction cup 523 is arranged at a power output end of the eighth linear module 522.

The third chuck 54 with the wafer is manually placed in the third jig 53, at this time, the seventh linear module 521 and the eighth linear module 522 are linked to enable the third sucker 523 to be aligned with the wafer in the third chuck 54, the wafer is sucked and taken out through the third sucker 523, the wafer is moved to the first code reading detection mechanism 8 for detection, then the code is read through the first code reading detection mechanism 8 positioned between the third jig 53 and the third chip taking mechanism 52, and the information is transmitted to the adaptive controller through the code reading, wherein the controller can be a computer, a mobile phone, a single chip microcomputer, a PLC and the like, so that the subsequent wafer taking and position finding are facilitated; after all the wafers are detected and the code reading is finished, the third card plug 54 with the detected code reading of the wafers is manually transferred to the chip storage machine 1, and the transfer from the third card plug 54 to the chip storage machine 1 can be finished manually or by a mechanical arm, a transfer line and other devices, and in this embodiment, a manual transfer mode is adopted.

The transfer machine 32 comprises a base 320 positioned on one side of the access frame 31, a guide rail 321 is arranged on the base 320, a sliding frame 324 is arranged on the guide rail 321 in a sliding manner, a second linear module 323 for moving up and down is arranged on the sliding frame 324, a rack 322 is further arranged on the base 320, a first servo motor 325 is fixedly arranged on the sliding frame 324, a gear matched with the rack 322 is arranged at the power output end of the first servo motor 325, and the gear is in meshing transmission with the rack 322; the power output end of the second straight line module 323 is provided with at least one mounting frame, each mounting frame is provided with a second DD motor 326, the output end of the second DD motor 326 is provided with a third straight line module 327, the third straight line module 327 is provided with a first air cylinder 328, and the power output end of the first air cylinder 328 is provided with a clamping jaw 329.

When a card plug with wafer from the conveying line 4 is required to be transferred to the access frame 31 or the card plug is required to be transferred from the access frame 31 to the conveying line 4, the first servo motor 325 is started to make the sliding frame 324 slide on the guide rail 321 through the gear and rack 322 engagement, so that the clamping jaw 329 is moved to the conveying line 4, the card plug is clamped and conveyed under the linkage of the second linear module 323, the second DD motor 326, the third linear module 327 and the first air cylinder 328, then the first servo motor 325 is started to transfer the clamped card plug to the preset access frame 31, the clamped card plug is placed on the access frame 31 under the linkage of the second linear module 323, the second DD motor 326, the third linear module 327 and the first air cylinder 328, and after the placement is finished, each component is returned to the initial position.

The carrying mechanism 6 comprises a supporting frame 61, a three-axis linear movement module 62 is arranged on the supporting frame 61, a second servo motor 63 is fixedly mounted on a mounting frame at the power end of the three-axis linear movement module 62, a rotating plate 64 is mounted at the power output end of the second servo motor 63, two sliding blocks 68 are slidably arranged below the rotating plate 64, a sliding plate 69 is fixedly connected to the bottom surface of each sliding block 68, a rotating cylinder 65 is mounted on the outer side surface of each sliding plate 69, the power output end of each rotating cylinder 65 extends to the inner side surface of each sliding plate 69, a clamping plate 66 is mounted at the power output end of each rotating cylinder 65, a driving motor 67 is fixedly mounted on one side of the upper surface of the rotating plate 64, specifically, each driving motor 67 is a servo motor, a lead screw is connected between the two sliding plates 69 in a transmission manner, and the power input end of the lead screw is in transmission connection with the power output end of the driving motor 67;

when the jam needs to be transported, the three-axis linear movement module 62 performs three-axis movement, the three-axis movement is performed in a manner of moving in three directions of X, Y and Z in a space, the movement manner is the prior art, and a person skilled in the art can easily think of the movement manner, then the second servo motor 63 is started to drive the rotation plate 64 to rotate by a certain angle, finally the rotation cylinders 65 on two sides of the rotation plate 64 are started to drive the clamping plates 66 to rotate, after the jam is positioned between the two clamping plates 66, the driving motor 67 is started to drive the screw rod in transmission connection with the sliding plate 69 to rotate through the synchronous belt, and under the guiding sliding of the sliding block 68, the two sliding plates 69 are driven to move oppositely, so as to clamp the jam to be transported, and finally the rotation cylinders 65 are started to rotate the clamped jam.

Still install on first frame 11 and set up and get piece and read yard detection mechanism 13, it reads yard detection mechanism 13 and is located material loading carousel mechanism 12 one side to get the piece, it reads yard detection mechanism 13 including installing first straight line module 131 on first frame 11 to get the piece, power take off end is provided with first piece mechanism 7 of getting on the first straight line module 131, still be provided with first sign indicating number detection mechanism 8 of reading on the first straight line module 131, one side of first straight line module 131 is to having support 132, be provided with second tool 133 on the support 132, place on the second tool 133 and be provided with a plurality of second blocks 134.

When the detection is needed, the first linear module 131 is first started to move the first wafer taking mechanism 7 to a predetermined position and take out the wafer and place the wafer at the first code reading detection mechanism 8 for detecting the code reading, and after the code reading detection is finished, the wafer for spot inspection is placed in the second card plug 134.

The first film taking mechanism 7 comprises a fourth linear module 71, a fifth linear module 72 is mounted at the power output end of the fourth linear module 71, a fifth servo motor 73 is mounted on an output end mounting frame of the fifth linear module 72, and a first suction disc 74 used for sucking a wafer is arranged at the power output end of the fifth servo motor 73.

When taking the wafer, the fourth linear module 71, the fifth linear module 72 and the fifth servo motor 73 are started firstly, the first suction cup 74 is moved to the wafer under the linkage of the fourth linear module, the fifth linear module 72 and the fifth servo motor 73, and the wafer is sucked.

The first code reading detection mechanism 8 comprises a second mounting plate 81, a second air cylinder 82 is mounted on the second mounting plate 81, and a second code reading detection camera 83 is arranged on a mounting frame of a power output end of the second air cylinder 82.

The second cylinder 82 drives the second code reading detection camera 83 to move towards the direction of the wafer, and after the second cylinder moves to a preset position, the second code reading detection camera 83 reads or detects the code of the wafer.

The second film taking mechanism 24 includes a third fixing frame 241 installed on the second frame 21, a fourth servo motor 242 is installed on the bottom surface of the third fixing frame 241, the power output end of the fourth servo motor 242 extends to the upper side of the third fixing frame 241, a sixth linear module 243 is installed at the power output end of the fourth servo motor 242, and the power output end of the sixth linear module 243 is provided with a second suction disc 244.

The fourth servo motor 242 is started to drive the sixth linear module 243 to rotate, when the wafer rotates to a proper angle, the sixth linear module 243 is started to move the second suction cup 244 to the wafer direction, the second suction cup 244 is moved to a preset position and then is used for sucking and transferring the wafer, after the wafer is sucked, the sixth linear module 243 is started again to drive the second suction cup 244 with the wafer to recover to the initial position, or the fourth servo motor 242 is started to rotate the second suction cup 244 with the wafer to the preset position while driving the second suction cup 244 to recover to the initial position, and then the wafer is moved to a preset chuck through the sixth linear module 243;

the second pick-up mechanism 24 can also cooperate with the lifting mechanism to move in coordination, so as to convey wafers to the stoppers with different heights.

In this embodiment, the linear modules such as the first linear module 131 and the second linear module 323 may be linear driving devices such as a motor screw assembly, a cylinder, a synchronous belt linear module (a motor synchronous belt module), and a linear motor module; in an embodiment, each of the code-reading detection cameras has functions of detecting, reading and scanning codes, and can detect wafers and scan codes, the code scanning can transmit information to the processor, so that the placement positions of the wafers or the cards can be known conveniently, the positions of the wafers or the cards are marked and determined in the processor system, and the wafers or the cards can be taken out conveniently in the follow-up process;

as can be seen from fig. 16 and 17, the surface of each jig in the present embodiment is provided with a placement groove, and the card is placed in the placement groove on the jig.

The movement of each component in the embodiment is controlled and coordinated by the controller.

The working process of the invention is as follows: firstly, manually placing a third chuck 54 with a wafer into a third fixture 53, taking out a middle wafer of the third chuck 54 through a third wafer taking mechanism 52, respectively placing the middle wafer into two first code reading detection mechanisms 8, respectively reading and scanning codes for detection, finally placing the wafer into the third chuck 54 again, and transmitting data obtained by detecting and scanning the codes to a controller;

then, manually transferring a third card plug 54 with a wafer to the feeding turntable mechanism 12, performing sampling inspection on the wafer by the chip-taking and code-reading detection mechanism 13 to judge the quality of the wafer in the process of transferring the card plug to the carrying mechanism 6 by the feeding turntable mechanism 12, finally transferring the card plug with the wafer to the conveying line 4 by the carrying mechanism 6, scanning the card plug by the code reader 14 when the card plug is transferred to the conveying line 4 by the carrying mechanism 6, facilitating a subsequent controller system to know the position of the card plug, and then transferring the card plug with the wafer to the feeding position of the transfer machine 32 by the conveying line;

the transfer machine 32 transfers the card plug with the wafer transferred to the conveying line 4 from the wafer storage machine 1 to the access frame 31 for storage;

when the wafer needs to be taken out from the access frame 31, firstly, the transfer machine 32 takes out the card plug with the wafer to be taken out from the access frame 31 and transfers the card plug to the conveying line 4, the conveying line 4 transfers the taken-out card plug to the inlet of the wafer taking machine 2, when the taken-out card plug is positioned at the inlet of the wafer taking machine 2, firstly, the conveying mechanism 6 in the wafer taking machine 2 takes out the card plug positioned on the conveying line 4 and places the card plug at the warehouse-out cache mechanism 25, then, the first wafer taking mechanism 7 takes out the wafer in the card plug in the warehouse-out cache mechanism 25 and sends the wafer to the detection turntable mechanism 23, when the detection turntable mechanism 23 rotates, the first code reading detection mechanism 8 and the first code reading detection camera 236 perform code scanning and reading detection on the wafer, the wafer after the detection is transferred to the output, the wafer after the code reading and scanning detection is transferred to the card plug on the storage rack 22 through the second wafer taking mechanism 24,

the above is the flow of storing and taking out the wafer.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.

Claims (10)

1. A wafer access library, comprising:

the storage and taking system comprises a storage and taking warehouse (3), wherein the storage and taking warehouse (3) is used for storing wafers to be warehoused, the storage and taking warehouse (3) comprises a storage and taking frame (31) and a transfer machine (32), the wafers are stored by the storage and taking frame (31), and the transfer machine (32) is used for storing and taking the wafers positioned on the storage and taking frame (31);

the conveying line (4), the said conveying line (4) transports the wafer;

the wafer storage machine (1) is used for transferring the wafers to the conveying line (4);

the wafer taking machine (2) is used for taking out the wafers from the conveying line (4);

wherein, transfer chain (4) are located deposit mascerating machine (1), get mascerating machine (2) and access storehouse (3) that set up side by side, transfer the wafer to deposit mascerating machine (1) in, place access frame (31) through moving carry machine (32) with deposit mascerating machine (1) the wafer of transporting to transfer chain (4) on, when needs get the piece, take out the wafer and transport to transfer chain (4) through moving carry machine (32), get mascerating machine (2) and will be located the wafer of transfer chain (4) and carry and take out.

2. The wafer access library of claim 1, wherein: the wafer storage machine (1) comprises a first rack (11) for mounting, a feeding turntable mechanism (12) is mounted on the first rack (11), the feeding turntable mechanism (12) comprises a first fixing frame (121) fixedly mounted on the first rack (11), a first DD motor (122) is mounted on the first fixing frame (121), a first turntable (124) is mounted at the power output end of the first DD motor (122), a plurality of first jigs (125) which are uniformly distributed at intervals relative to the axis of the first turntable (124) are arranged on the first turntable (124), at least one first clamping plug (126) is arranged on each first jig (125), and a detector (123) is arranged below the feeding end of the first turntable (124); the first rack (11) is further provided with a carrying mechanism (6) and a code reader (14), the carrying mechanism (6) carries a first card plug (126) on the first rotary table (124) to the conveying line (4), and the code reader (14) is located on one side of the carrying mechanism (6).

3. The wafer access library of claim 1, wherein: the chip taking machine (2) comprises a second rack (21), a detection turntable mechanism (23) is arranged on the second rack (21), a first code reading detection mechanism (8) is arranged at a detection position of the detection turntable mechanism (23), a carrying mechanism (6) and a first chip taking mechanism (7) are arranged at an input position of the detection turntable mechanism (23), a second chip taking mechanism (24) is arranged at an output position of the detection turntable mechanism (23), a placing frame (22) is arranged at one side of the second chip taking mechanism (24), a warehouse-out cache mechanism (25) is further arranged on the second rack (21), the warehouse-out cache mechanism (25) is located at one side of the carrying mechanism (6), the warehouse-out cache mechanism (25) comprises a second fixing frame (251) installed on the second rack (21), a third servo motor (252) is installed on the bottom surface of the second fixing frame (252), at least one fourth jig (253) is arranged on a support plate installed at the power output end of the third servo motor (252), a fifth card taking jig (254) is arranged on the fourth jig (253), and a first plug taking mechanism (26) is arranged on the second fixing frame (24);

detect carousel mechanism (23) including installing first mounting panel (231) on second frame (21), a first mounting panel (231) side fixed mounting sixth servo motor (232), second carousel (233) are installed to sixth servo motor (232) power take off, set up standing groove (234) that a plurality of set up about the even interval in second carousel (233) center on second carousel (233), first mounting panel (231) another side is fixed to be set up third cylinder (235), first reading code detection camera (236) are installed to the mounting bracket on third cylinder (235).

4. The wafer access library of claim 1, wherein: the automatic film rewinding machine is characterized by further comprising a film rewinding machine (5), wherein the film rewinding machine (5) comprises a third rack (51) used for installation, a plurality of third film taking mechanisms (52) are arranged on the upper surface of the third rack (51), a first code reading detection mechanism (8) is arranged on the side surface of another adjacent third film taking mechanism (52), a third jig (53) is arranged on one side of each third film taking mechanism (52), a plurality of third clamping plugs (54) the number of which is the same as that of the third film taking mechanisms (52) are arranged on each third jig (53), and the first code reading detection mechanism (8) is also arranged between each third jig (53) and each third film taking mechanism (52);

the third film taking mechanism (52) comprises a seventh straight line module (521) installed on a third rack (51), an eighth straight line module (522) is arranged at the power output end of the seventh straight line module (521), and a third sucker (523) is arranged at the power output end of the eighth straight line module (522).

5. The wafer access library of claim 1, wherein: the transfer machine (32) comprises a base (320) located on one side of the access frame (31), a guide rail (321) is arranged on the base (320), a sliding frame (324) is arranged on the guide rail (321) in a sliding mode, a second linear module (323) which can move up and down is arranged on the sliding frame (324), a rack (322) is further arranged on the base (320), a first servo motor (325) is fixedly arranged on the sliding frame (324), a gear matched with the rack (322) is arranged at the power output end of the first servo motor (325), and the gear is in meshing transmission with the rack (322); the power output end of the second straight line module (323) is provided with at least one mounting frame, a second DD motor (326) is mounted on each mounting frame, a third straight line module (327) is mounted at the output end of the second DD motor (326), a first air cylinder (328) is arranged on the third straight line module (327), and a clamping jaw (329) is arranged at the power output end of the first air cylinder (328).

6. A wafer access library as claimed in claim 2 or 3, wherein: the carrying mechanism (6) comprises a supporting frame (61), a triaxial linear moving module (62) is arranged on the supporting frame (61), a second servo motor (63) is fixedly mounted on a mounting frame of a power end of the triaxial linear moving module (62), a rotating plate (64) is mounted at a power output end of the second servo motor (63), two sliding blocks (68) are arranged below the rotating plate (64) in a sliding mode, each sliding block (68) is fixedly connected with a sliding plate (69) on the bottom surface, each sliding plate (69) is provided with a rotating cylinder (65) on the outer side surface, the power output end of each rotating cylinder (65) extends to the inner side surface of the corresponding sliding plate (69), a clamping plate (66) is mounted at the power output end of each rotating cylinder (65), a driving motor (67) is fixedly mounted on one side of the upper surface of the rotating plate (64), a screw rod is connected between the sliding plates (69) in a transmission mode, and the power input end of each rotating cylinder is connected with the power output end of the driving motor (67).

7. The wafer access library of claim 2, wherein: still install on first frame (11) and set up and get piece and read a yard detection mechanism (13), it reads a yard detection mechanism (13) to get piece and be located material loading carousel mechanism (12) one side, it reads a yard detection mechanism (13) including installing first sharp module (131) on first frame (11), power take off end is provided with first piece mechanism (7) of getting on first sharp module (131), still be provided with first reading yard detection mechanism (8) on first sharp module (131), one side of first sharp module (131) is to having support (132), be provided with second tool (133) on support (132), place on second tool (133) and be provided with a plurality of second bayonet plugs (134).

8. The wafer access library of claim 3 or 7, wherein: the first piece mechanism (7) of getting includes fourth straight line module (71), fifth straight line module (72) are installed to fourth straight line module (71) power take off end, install fifth servo motor (73) on the output mounting bracket of fifth straight line module (72), fifth servo motor (73) power take off end sets up and is used for absorbing first sucking disc (74) of wafer.

9. The wafer access library of claim 2, 5 or 7, wherein: the first code reading detection mechanism (8) comprises a second mounting plate (81), a second air cylinder (82) is mounted on the second mounting plate (81), and a second code reading detection camera (83) is arranged on a mounting rack of a power output end of the second air cylinder (82).

10. The wafer access library of claim 3, wherein: the second film taking mechanism (24) comprises a third fixing frame (241) installed on a second rack (21), a fourth servo motor (242) is installed on the bottom surface of the third fixing frame (241), the power output end of the fourth servo motor (242) extends to the top of the third fixing frame (241), a sixth linear module (243) is installed on the power output end of the fourth servo motor (242), and a second sucking disc (244) is arranged on the power output end of the sixth linear module (243).

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