CN107052586A - A kind of silicon chip laser marking machine and method - Google Patents
A kind of silicon chip laser marking machine and method Download PDFInfo
- Publication number
- CN107052586A CN107052586A CN201710245936.4A CN201710245936A CN107052586A CN 107052586 A CN107052586 A CN 107052586A CN 201710245936 A CN201710245936 A CN 201710245936A CN 107052586 A CN107052586 A CN 107052586A
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- component
- feeding
- silicon chip
- blanking
- material frame
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention discloses a kind of silicon chip laser marking machine and method, the silicon chip laser marking machine include rack, the material frame for filling silicon chip, for convey material frame and to silicon chip carry out screening feeding device, for silicon chip is detected and mark detection marking device and by the silicon chip that mark is completed be transported into material frame and submitting blanking device, the feeding device, detection marking device and blanking device are installed on rack 4, and the detection marking device is located between feeding device and blanking device.According to the silicon chip laser marking machine of the present invention, its automaticity is higher, the material frame of silicon chip be will be equipped with after feeding delivery end is put into, automatically each silicon chip is carried out taking piece, detection, mark and removes waste product, then it is again loaded into material frame shipment, it can replace numerous and diverse artificial using the equipment, operating efficiency be improved, while also reducing fragment rate.
Description
Technical field
The present invention relates to solar cell manufacturing equipment technical field, and in particular to a kind of silicon chip laser marking machine and side
Method.
Background technology
In current solar cell manufacturing process, include multiple processes, such as Wafer Cleaning, making herbs into wool, diffusion, mark.
In the prior art, traditional mark methods easily occur that fragment rate is high, big to the pollution of silicon chip and automation efficiency is low
Problem.
The content of the invention
It is convenient it is an object of the present invention to provide a kind of silicon chip laser marking machine, it is proposed that a kind of silicon chip laser marking machine
Laser marking is carried out to silicon chip, operating efficiency is high, and automaticity is high, can reduce fragment rate.
The present invention is achieved through the following technical solutions：The present invention provides a kind of silicon chip laser marking machine, the silicon chip laser
Marking machine include rack, the material frame for filling silicon chip, for convey material frame and to silicon chip carry out screening feeding device,
For silicon chip is detected and mark detection marking device and the silicon chip that mark is completed be transported into material frame and sent out
Blanking device, the feeding device, detection marking device and blanking device be installed on rack, it is described detection mark dress
Setting between feeding device and blanking device.
As the further improvement of above-mentioned technical proposal, the feeding device includes feeding transfer member, feeding lifting structure
Part, feeding screening component, the feeding lift component are arranged on one end of feeding transfer member and feeding screening component, it is described on
Expect that screening component is located at the side of feeding transfer member.
As the further improvement of above-mentioned technical proposal, the detection marking device picks and places component, positioning inspection including silicon chip
Survey component, mark component, reclaim component and rotary components, the mark component, silicon chip pick and place component, detection and localization component and
Four orientation all around that component is located at rotary components respectively are reclaimed, the silicon chip picks and places component, detection and localization component, mark
Component, recovery component and rotary components are installed on rack.
As the further improvement of above-mentioned technical proposal, the blanking device includes blanking transfer member, blanking lifting structure
Part, blanking screening component, the blanking lift component are arranged on one end of blanking transfer member and blanking screening component, it is described under
Expect that screening component is located at the side of blanking transfer member.
As the further improvement of above-mentioned technical proposal, the silicon chip laser marking machine also includes material frame conveying assembly,
The material frame conveying assembly is used to the empty bin in feeding material frame positioning component being transported to blanking material frame positioning group
In part, the material frame conveying assembly is arranged on the side for being located at detection marking device between feeding device and blanking device.
As the further improvement of above-mentioned technical proposal, the feeding transfer member includes the first conveying assembly, second defeated
Sending component and the first translation component, first conveying assembly, the second conveying assembly and the first translation component are installed in
On rack, second conveying assembly is located at the first conveying assembly side, and the first translation component is connected with lift component.
As the further improvement of above-mentioned technical proposal, the feeding lift component include the first lifting assembly, second liter
Come down to a lower group part and feeding material frame positioning component, first lifting assembly is connected with the first translation component, described second liter
Part of coming down to a lower group is located at the side of the first lifting assembly, and the feeding material frame positioning component is arranged on the second lifting assembly.
As the further improvement of above-mentioned technical proposal, the feeding screening component includes loading assemblies and feeding positioning group
Part, loading assemblies and the feeding positioning component is installed on rack, and the feeding positioning component is arranged on loading assemblies
Silicon chip can be transported on feeding positioning component on side and loading assemblies, and the loading assemblies are located at the second lifting assembly and upper
Between material positioning component.
As the further improvement of above-mentioned technical proposal, the feeding screening component also includes the feeding for being used to cache silicon chip
Caching component, the feeding caching component is arranged on rack and positioned at loading assemblies close to one end of feeding positioning component.
Present invention also offers a kind of silicon chip marking method, including：
Step S10:Feeding device sends out the silicon chip to be detected in the material frame for filling silicon chip to be detected piecewise；
Step S20：Marking device is by the silicon chip extracting to be detected sent out piecewise and is detected for detection, will detect what is finished
Qualified silicon chip is put into blanking device；Step S30：Blanking device will detect that the qualified silicon chip finished is transported in empty bin piecewise
The material frame for storing and filling qualified silicon chip is sent out.
Beneficial effects of the present invention at least include：In the silicon chip laser marking machine of the present invention, its automaticity is higher, will
Material frame equipped with silicon chip is carried out taking piece, detection, mark and gone to each silicon chip automatically after feeding delivery end is put into
Except waste product, material frame shipment is then again loaded into, can replace numerous and diverse artificial using the equipment, improve operating efficiency, while
Reduce fragment rate.
Brief description of the drawings
Fig. 1 is the schematic perspective view of silicon chip laser marking machine according to embodiments of the present invention；
Fig. 2 is the schematic perspective view of material frame according to embodiments of the present invention；
Fig. 3 is the schematic perspective view of feeding device according to embodiments of the present invention；
Fig. 4 is the schematic perspective view of the first conveying assembly according to embodiments of the present invention；
Fig. 5 is the schematic perspective view of the second conveying assembly according to embodiments of the present invention；
Fig. 6 is the schematic perspective view that according to embodiments of the present invention first translates component and the first lifting assembly；
Fig. 7 is the schematic perspective view of the second lifting assembly according to embodiments of the present invention and feeding material frame positioning component；
Fig. 8 is the schematic perspective view of loading assemblies according to embodiments of the present invention；
Fig. 9 is the schematic perspective view of feeding positioning component according to embodiments of the present invention；
Figure 10 is the schematic perspective view of feeding caching component according to embodiments of the present invention；
Figure 11 is the schematic perspective view of detection marking device according to embodiments of the present invention；
Figure 12 is the schematic perspective view of blanking device according to embodiments of the present invention；
Figure 13 is another schematic perspective view of silicon chip laser marking machine according to embodiments of the present invention.
Figure 14 is the flow chart of silicon chip marking method according to embodiments of the present invention.
Embodiment
Below in conjunction with accompanying drawing in embodiments of the invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.Generally
The component for the embodiment of the present invention being described and illustrated herein in the accompanying drawings can be arranged and designed with a variety of configurations.Cause
This, the detailed description of the embodiments of the invention to providing in the accompanying drawings is not intended to limit claimed invention below
Scope, but it is merely representative of the selected embodiment of the present invention.Based on embodiments of the invention, those skilled in the art are not doing
The every other embodiment obtained on the premise of going out creative work, belongs to the scope of protection of the invention.
As shown in Figure 1 to Figure 2, the silicon chip laser marking machine includes rack 4, the material frame 5 for filling silicon chip, for defeated
Send material frame 5 and to silicon chip carry out screening feeding device 1, for silicon chip is detected and mark detection marking device
2 and by the silicon chip that mark is completed be transported into material frame 5 and send out blanking device 3, the feeding device 1, detection mark dress
Put 2 and blanking device 3 be installed on rack 4, the detection marking device 2 be located at feeding device 1 and blanking device 3 it
Between.
The material frame 5 includes first material plate 51, support bar 53 and the second material plate 52 being sequentially connected, described first
The material for having mutually contradictory setting between material plate 51 and second material plate 52 places plate 54, and the material is placed and set on plate 54
There is neck 55, silicon chip is placed between the neck 55 that first material places plate 54 and material placement plate 54.Specifically, described
Several locating slots 56 for being used to position and fix, the first material plate are provided with one material plate 51 and second material plate 52
51 and the one end of second material plate 52 be set to opening.
As shown in figure 3, the feeding device 1 includes feeding transfer member, feeding lift component, feeding screening component, institute
Feeding lift component is stated installed in one end of feeding transfer member and feeding screening component, the feeding screening component is located at feeding
The side of transfer member.
The feeding transfer member includes the first conveying assembly 11, the second conveying assembly 12 and the first translation component 13,
First conveying assembly 11, the second conveying assembly 12 and the first translation component 13 are installed on rack 4, and described second is defeated
It is defeated that the material frame 5 that sending component 12 is located on the side of the first conveying assembly 11, and the first conveying assembly 11 can be transported to second
On sending component 12.The conveying assembly 12 of first translation component 13 and second is mutually interspersed to be set.
As shown in figure 4, the first conveying assembly 11 includes the first conveying conveying of mounting bracket 111, first motor 112, Shuo Ge
One conveying roller 113 and the first conveyer belt 114 being set on the first conveying roller 113, the first conveying He of motor 112
First conveying roller 113 is installed on the first conveying mounting bracket 111.First conveying assembly 11 passes through the first conveying motor
Material frame 5 equipped with silicon chip in first conveyer belt 114 is transported to the second conveying assembly by 112 driving from the first conveying assembly 11
On 12.
On first conveying assembly 11 also have be used for detect material frame 5 whether the positive and negative detection components 115 of correct placement,
The positive and negative detection components 115 are arranged between first conveyer belt 114, and the positive and negative detection components 115 are optical sensor, are led to
It is that opening direction is first passed through or opening direction does not first pass through to determine thing when by inductor to cross detection second material plate 52
Whether bin 5 is correct placement.
As shown in figure 5, second conveying assembly 12 includes the second conveying conveying of mounting bracket 121, second motor 122, number
Individual second conveying roller 123 and the second conveyer belt 124 being set on the second conveying roller 123, the second conveying motor
122 and second conveying roller 123 be installed on the second conveying mounting bracket 121.Specifically, the second conveying mounting bracket 121
It is divided into the first installation portion, the second installation portion and the 3rd installation portion, wherein being formed between the first installation portion and the second installation portion
First mounting groove 125, is formed with the second mounting groove 126 between the second installation portion and the 3rd installation portion.Second conveying roller
123 and second the installation of conveyer belt 124 bypass the first mounting groove 125 and the second mounting groove 126, formed and the first mounting groove
125 depressions consistent with the second mounting groove 126.
As shown in fig. 6, the first translation component 13 includes the first translation mounting bracket 131, the first translation motor 132, number
Individual first translation roller 133 and the first translation conveyer belt 134 being set on the first translation roller 133, first translation
The translation roller 133 of motor 132 and first is installed on the first translation mounting bracket 131.Specifically, the first translation mounting bracket
131 include the first translation translation supporting plate 1312 of installing plate 1311 and first, and the first translation supporting plate 1312 is located at the
Between one translation installing plate 1311, material frame 5 can be supported, the first translation installing plate 1311 is configured with interval
Several independent straight panels, these straight panels can be interspersed between the second conveyer belt 124 of the second conveying assembly 12.Wherein, first
It is interspersed design to translate component 13 and second conveying assembly 12, and the first translation conveyer belt 134 of the first translation component 13 is positioned at the
In the first mounting groove 125 and the second mounting groove 126 of two conveying assemblies 12, the first translation supporting plate of the first translation component 13
1312 are located between the second conveyer belt 124 of the second conveying assembly 12.This relatively independent interspersed design can make material frame 5
The movement for two different directions that can be carried out when being conveyed, very flexibly and saves space.
The feeding lift component includes the first lifting assembly 14, the second lifting assembly 15 and feeding material frame positioning group
Part 16, first lifting assembly 14 is connected with the first translation component 13, and second lifting assembly 15 is located at the first lifting
The side of component 14, the feeding material frame positioning component 16 is arranged on the second lifting assembly 15.
First lifting assembly 14 includes the first lifting mounting bracket 141, the first lifting motor 142, the first riser guide
143rd, the first elevating screw 144 and the first lifting slider 145, the first lifting mounting bracket 141 are connected with rack 4, institute
State the first lifting motor 142 and the first riser guide 143 is fixed on the first lifting mounting bracket 141, first lifting slider
145 are set on the first riser guide 143.The first lifting mounting bracket 141 includes the first installation being fixedly connected with rack 4
Plate 1411, the second installing plate 1412 being fixedly connected with the described first translation component 13, first lifting motor 142 and first
Riser guide 143 is fixed on the first installing plate 1411, and first lifting slider 145 is fixed on the second installing plate 1412.
It is also equipped with second installing plate 1412 for the guiding with the first lifting motor 142 and the cooperation of the first elevating screw 144
Set, described one end of first elevating screw 144 is connected one end with the motor shaft of the first lifting motor 142 in guide sleeve.Institute
The first lifting assembly 14 is stated to drive the first elevating screw 144 to rotate in guide sleeve to drive by the first lifting motor 142
First translation component 13 is moved up and down.
As shown in fig. 7, second lifting assembly 15 includes the second lifting motor 151, the second riser guide 152, second
Elevating screw and the second lifter slide 153, second riser guide 152 are arranged on rack 4, second lifting motor
151 are arranged on the second riser guide 152, and described second elevating screw one end is connected with the motor shaft of the second lifting motor 151
One end is connect in the pilot hole on the second lifter slide 153, the lower end of the second lifter slide 153, which is equipped with, to be used to install feeding
The supporting plate of material frame positioning component 16.Second lifting assembly 15 is lifted by the second lifting motor 151 by driving second
Screw mandrel rotates to drive the second lifter slide 153 to move up and down, so as to drive the upper material on the second lifter slide 153
Bin positioning component 16 is moved up and down.
The feeding material frame positioning component 16 is fixedly connected with the second lifter slide 153, for being determined material frame 5
Position and fixation.The feeding material frame positioning component 16 includes feeding material frame positioning installation frame 161, feeding material frame positioning electricity
Machine 162, several feeding material frame positioning rollers 163, feeding material frame positioning belt 164, feeding material frame positioning cylinder 165, on
Material bin location-plate 166 and feeding material frame locating dowel 167.The feeding material frame positioning installation frame 161 is arranged on the
On the supporting plate of the lower end of two lifter slide 153, the feeding material frame positioning motor 162 is arranged on feeding material frame positioning installation frame
161 side, the feeding material frame positioning roller 163 is arranged in material part positioning installation frame, and the feeding material frame is determined
Bit strip 164 is set on feeding material frame positioning roller 163, and upper material is driven by the operating of feeding material frame positioning motor 162
Bin positioning roller 163 rotates to drive feeding material frame positioning belt 164 to rotate so that positioned at feeding material frame positioning belt
Material frame 5 on 164 is moved so as to adjustment position；The feeding material frame positioning cylinder 165 is arranged on the second lifting and slided
The other end of plate 153, the feeding material frame location-plate 166 is connected with the cylinder axis of feeding material frame positioning cylinder 165, institute
State feeding material frame locating dowel 167 to be fixed on feeding material frame location-plate 166, described its head of feeding material frame locating dowel 167
Portion's shape is mutually chimeric with the shape of the locating slot 56 on first material plate 51, is made by the driving of feeding material frame positioning cylinder 165
Locating slot 56 on the insertion first material of feeding material frame locating dowel 167 plate 51 is so as to be positioned and be fixed to material frame 5.
As shown in figure 8, the feeding screening component includes loading assemblies 17 and feeding positioning component 18, the loading assemblies
17 and feeding positioning component 18 be installed on rack 4, the feeding positioning component 18 be arranged on loading assemblies 17 side and
Silicon chip can be transported on feeding positioning component 18 on loading assemblies 17, and the loading assemblies 17 are located at the He of the second lifting assembly 15
Between feeding positioning component 18.
The loading assemblies 17 are used to transport the silicon chip in material frame 5, and the loading assemblies 17 include feeding rail
Road, feeding motor 173, upper material roller, feeding conveyer belt 176, feeding cylinder 177, feeding slide rail 178 and feeding sliding block 179.Institute
Stating feeding track includes feeding orbit determination road 171 and feeding dynamic rail road 172, and the feeding orbit determination road 171 is fixed on rack 4, institute
Feeding dynamic rail road 172 is stated on feeding sliding block 179；The feeding motor 173 is arranged on rack 4；The upper material roller
Determine track roller 174 including feeding and feeding moves track roller 175, the feeding determines track roller 174 and is fixed on feeding orbit determination
On road 171, the feeding moves track roller 175 and is arranged on feeding sliding block 179；The feeding conveyer belt 176 is set in feeding
On roller, the feeding cylinder 177 and feeding slide rail 178 are fixed on rack 4；The feeding sliding block 179 is set in feeding cunning
It is connected on rail 178 and with the cylinder axis of feeding cylinder 177.The feeding motor 173 drive the operating of feeding conveyer belt 176 so as to
Silicon chip is transported；The feeding cylinder 177 drives feeding sliding block 179 mobile so as to drive feeding on feeding slide rail 178
Dynamic rail road 172 is moved so that feeding dynamic rail road 172 can be stretched.In specific implementation, when the second lifting assembly 15
With feeding material frame positioning component 16 when carrying out position adjustment and positioning fixed to material frame 5, the feeding dynamic rail road 172 times
Contracting, after the position adjustment of material frame 5 is got well and is fixed, the feeding dynamic rail road 172 stretches out and from the opening of second material plate 52
Place enters the lower section of material frame 5, enables silicon chip to transport by the conveyer belt of feeding dynamic rail road 172.In loading assemblies 17 to material
When silicon chip in frame 5 is transported, loading assemblies 17 transport a piece of silicon chip every time, and second lifting assembly 15 will drive
Feeding material frame positioning component 16 is moved so as to driving material frame 5 to move so that under a piece of silicon chip conveyed with feeding
Band 176 is contacted and is transported away, is so carried out successively until the silicon chip in material frame 5 all transports by loading assemblies 17.
As shown in figure 9, the feeding positioning component 18 is determined for being conveyed through the silicon chip come to the loading assemblies 17
Position, the feeding positioning component 18 includes feeding positioning installation frame 181, feeding positioning motor 182, several feeding positioning rollers
183rd, feeding positioning conveyer belt 184, the feeding positioning motor 182 and feeding positioning roller 183 are arranged on feeding location and installation
On frame 181, the feeding positioning conveyer belt 184 is set on feeding positioning roller 183.The loading assemblies 17 are conveyed through what is come
Silicon chip picks and places component absorption with silicon chip and seen off again after being positioned through feeding positioning component 18.
As shown in Figure 10, the feeding screening component also includes feeding caching component 19, the feeding caching component 19
In feeding orbit determination road 171 close to one end of feeding positioning component 18, the feeding caching component 19 is used to cache loading assemblies 17
Be conveyed through the come and silicon chip that can not be positioned in time, when as above expecting to be positioned on positioning component 18, now by
Loading assemblies 17 transport the silicon chip come will be by the temporary cache of feeding caching component 19.The feeding caching component 19 includes feeding
Cache shelf 191, feeding caching motor mounting plate 192, feeding caching motor 193, feeding caching screw mandrel 194 and feeding caching are oriented to
Bar 195.Material for placing silicon chip is installed in the feeding cache shelf 191 and places plate 54,191 sets of the feeding cache shelf
It is located on feeding caching guide rod 195, the feeding caching guide rod 195 is fixedly connected with rack 4, and the feeding caches motor
193 installing plates 192 are connected with feeding caching guide rod 195, and the feeding caching motor 193 is arranged on feeding and caches motor
On 193 installing plates 192, the feeding caching screw mandrel 194 is connected with the motor shaft that feeding caches motor 193, slow by feeding
Depositing the operating of motor 193 drives feeding cache shelf 191 to be moved on feeding caching guide rod 195.Specifically, the feeding group
Part 17 is passed through between placing plate 54 from the material of feeding cache shelf 191, and the silicon chip on feeding conveyer belt 176 can place plate from material
Neck 55 between 54 passes through, when silicon chip is transported to feeding caching component 19 if necessary to being cached to silicon chip, it is described on
Material caching motor 193, which drives feeding cache shelf 191 to rise, makes silicon chip leave feeding conveyer belt 176 and cache to feeding cache shelf
191 material is placed in the neck 55 of plate 54, under a piece of silicon chip next group of plate 54 can be placed from the material of feeding cache shelf 191
Pass through in neck 55；When needing to transport the silicon chip of caching, it need to only allow feeding to cache motor 193 and drive feeding cache shelf
191 make the silicon chip cached in feeding cache shelf 191 touch feeding conveyer belt 176.
As shown in figure 11, the detection marking device 2 picks and places component 21, detection and localization component 22, mark group including silicon chip
Part 23, recovery component 24 and rotary components 25, the mark component 23, silicon chip pick and place component 21, the and of detection and localization component 22
Four orientation all around that component 24 is located at rotary components 25 respectively are reclaimed, the silicon chip picks and places component 21, detection and localization group
Part 22, mark component 23, recovery component 24 and rotary components 25 are installed on rack 4.
The rotary components 25 include electric rotating machine, swivel plate 251 and adsorption piece 252, the electric rotating machine and rotation
Plate 251 is connected for driving swivel plate 251 to be rotated, the adsorption piece 252 installed in swivel plate 251 all around four
In individual orientation, its position corresponds to mark component 23, silicon chip and picks and places component 21, detection and localization component 22 and reclaim component 24 respectively,
The adsorption piece 252 is the suction nozzle that surface is covered with pore, and the adsorption piece 252 can be connected with vacuum generator produces absorption
Silicon chip is adsorbed convenient detection and mark on adsorption piece 252 by power.
The silicon chip pick and place component 21 including silicon chip pick and place motor, silicon chip pick and place mounting bracket 211, silicon chip pick and place sliding block 212,
Silicon chip disassembling and assembling guide rail 213 and silicon chip pick and place sucker 214, and the silicon chip disassembling and assembling guide rail 213 and silicon chip pick and place motor and be fixed on rack 4
On, the silicon chip picks and places sliding block 212 on silicon chip disassembling and assembling guide rail 213, and the silicon chip picks and places mounting bracket 211 and picked and placeed with silicon chip
Sliding block 212 is connected, and the silicon chip picks and places sucker 214 and picked and placeed installed in silicon chip on mounting bracket 211.The silicon chip picks and places motor can
Moved with driving silicon chip to pick and place sliding block 212 by way of screw mandrel or timing belt on silicon chip disassembling and assembling guide rail 213.It is described
Silicon chip, which picks and places sucker 214, two groups, is separately mounted to the two ends that silicon chip picks and places mounting bracket 211, in specific implementation, and described two
Group silicon chip picks and places sucker 214 and draws the adsorption piece that the side of component 21 is picked and placeed on feeding positioning component 18 and positioned at silicon chip respectively
Silicon chip on 252, the silicon chip picks and places component 21 and moved from feeding device 1 to blanking device 3 after the completion of absorption, and feeding is positioned
Silicon chip on component 18 is put on adsorption piece 252, and the silicon chip taken out from adsorption piece 252 is put on blanking positioning component, complete
Initial access position is back to after.
The detection and localization component 22 is used to the silicon chip on rotary components 25 is positioned and detected, the detection and localization
Component 22 includes detector lens 221 and lens mounting frame 222, and the detector lens 221 are arranged on lens mounting frame 222,
The detector lens 221 are CCD detection and localizations camera lens 221, and the positioning and detection to silicon chip are realized by CCD detection and localizations.
The mark component 23 includes mark mounting bracket 231 and marking machine 232, and the mark mounting bracket 231 is arranged on machine
On cabinet 4, the marking machine 232 is arranged on mark mounting bracket 231, and the marking machine 232 is well known to those skilled in the art
Silicon chip laser marking machine 232.
The recovery component 24 includes reclaiming motor, reclaims mounting bracket, reclaim sliding block, reclaim guide rail, reclaim sucker and return
Box is received, the recovery guide rail is fixed on rack 4, the recovery motor, which is arranged on, to be reclaimed on guide rail, and the recovery sliding block is installed
On guide rail is reclaimed, the recovery mounting bracket is connected with reclaiming sliding block, and the recovery sucker, which is arranged on, to be reclaimed on mounting bracket, institute
State the side that recycling box is located at rotary components 25 on rack 4.The recovery motor can pass through screw mandrel or timing belt
Mode drive recovery sliding block reclaim guide rail on move, in specific implementation, it is described recovery motor drive it is described reclaim
The unqualified silicon chip of absorption is placed and reclaimed in recycling box by sucker.
As shown in figure 12, the blanking device 3 includes blanking transfer member, blanking lift component, blanking screening component, institute
Blanking lift component is stated installed in one end of blanking transfer member and blanking screening component, the blanking screening component is located at blanking
The side of transfer member.
The blanking screening component includes blanking component 41 and blanking positioning component 42, and the blanking component 41 is anticipated with
Hyte part 42 is installed on rack 4, and the blanking positioning component 42 is arranged on the side of blanking component 41 and blanking positioning group
Silicon chip on part 42 can be transported on blanking component 41, and the blanking component 41 is lifted positioned at blanking positioning component 42 and the 3rd
Between component.
The blanking positioning component 42 is positioned for picking and placeing the silicon chip that component 21 is conveyed through to the silicon chip, described
Blanking positioning component 42 includes blanking positioning installation frame, blanking positioning motor, several blanking positioning rollers, blanking positioning conveying
Band, the blanking positioning motor and blanking positioning roller are arranged in blanking positioning installation frame, and the blanking positions conveyer belt set
It is located on blanking positioning roller.The blanking component 41 is conveyed through after the silicon chip come is positioned through blanking positioning component 42 again by blanking
Component 41 is seen off.
The blanking component 41 is used to transport to being conveyed through the silicon chip come on blanking positioning component 42, the blanking group
Part 41 includes blanking track, blanking motor, lower material roller, blanking conveyer belt, blanking cylinder, blanking slide rail and blanking sliding block.Institute
Stating blanking track includes blanking orbit determination road and blanking dynamic rail road, and the blanking orbit determination road is fixed on rack 4, the blanking dynamic rail
Road is arranged on blanking sliding block；The blanking motor is arranged on rack 4；The lower material roller including blanking determine track roller and
Track roller is moved in blanking, and the blanking is determined track roller and is fixed on blanking orbit determination road, and the blanking is moved track roller and is arranged on
On blanking sliding block；The blanking conveyer belt is set on lower material roller, and the blanking cylinder and blanking slide rail are fixed on rack 4
On；The blanking sliding block is set on blanking slide rail and is connected with the cylinder axis of blanking cylinder.Under the blanking motor drives
Material conveyer belt operating to silicon chip so as to transport；The blanking cylinder drives blanking sliding block mobile so as to band on blanking slide rail
Dynamic blanking dynamic rail road is moved so that blanking dynamic rail road can be stretched.In specific implementation, when the 3rd lifting assembly and
Blanking material frame positioning component to material frame 5 when carrying out position adjustment and fixed positioning, and the blanking dynamic rail road retraction works as thing
After the position adjustment of bin 5 is got well and fixed, the blanking dynamic rail road stretches out and enters material frame 5 at the opening of 3 material plate
In, the blanking conveyer belt and the neck 55 of the top on the material placement plate 54 of material frame 5 is located at same level position,
Silicon chip is set to be transported to by blanking dynamic rail road conveyer belt in material frame 5.The silicon chip in material frame 5 is carried out in blanking component 41
During transport, blanking component 41 transports a piece of silicon chip every time, and the 3rd lifting assembly will drive blanking material frame positioning component
Move so as to driving material frame 5 to move so that under a piece of silicon chip be stored in next neck 55, so enter successively
Row is until the neck 55 in material frame 5 is all filled.
The blanking screening component also includes blanking caching component 43, and the blanking caching component 43 is located at blanking orbit determination road
Close to the 3rd lifting assembly one end, the blanking caching component 43 be used for cache blanking component 41 be conveyed through come and can not
The silicon chip stored in time.The blanking caching component 43 delays including blanking cache shelf, blanking caching motor mounting plate, blanking
Deposit motor, blanking caching screw mandrel and blanking caching guide rod.Material for placing silicon chip is installed in the blanking cache shelf
Plate 54 is placed, the blanking cache shelf is set on blanking caching guide rod, the blanking caching guide rod is fixed with rack 4 to be connected
Connect, the blanking caching motor mounting plate is connected with blanking caching guide rod, the blanking caching motor is slow installed in blanking
Deposit on motor mounting plate, the blanking caching screw mandrel is connected with the motor shaft that blanking caches motor, and motor is cached by blanking
Operating drives blanking cache shelf to be moved on blanking caching guide rod.Specifically, the blanking component 41 is cached from blanking
The material of frame is passed through between placing plate 54, and the silicon chip on blanking conveyer belt can place the neck 55 between plate 54 from material to be passed through,
When silicon chip is transported to blanking caching component 43 if necessary to be cached to silicon chip, the blanking caching motor drives blanking to delay
Deposit frame rise make silicon chip leave blanking conveyer belt and cache to blanking cache shelf material place plate 54 neck 55 in, under it is a piece of
Silicon chip can be placed from the material of blanking cache shelf to be passed through in next group of neck 55 of plate 54；When needs are transported to the silicon chip of caching
When defeated, it need to only allow blanking to cache motor and drive blanking cache shelf the silicon chip cached in blanking cache shelf is touched blanking conveyer belt
.
The blanking lift component includes the 3rd lifting assembly 44, the 4th lifting assembly 45 and blanking material frame positioning component
46, the blanking material frame positioning component 46 is arranged on the 3rd lifting assembly 44, and the 3rd lifting assembly 44 is located at blanking
The side of component 41, the 4th lifting assembly 45 is connected and positioned at the one of the 3rd lifting assembly 44 with the second translation component
Side.
3rd lifting assembly 44 includes the 3rd lifting motor, the 3rd riser guide, the 3rd elevating screw and the 3rd
Lifter slide, the 3rd riser guide is arranged on rack 4, and the 3rd lifting motor is arranged on the 3rd riser guide,
Described 3rd elevating screw one end is connected guiding of the one end on the 3rd lifter slide with the motor shaft of the 3rd lifting motor
Kong Zhong, the 3rd lifter slide lower end is equipped with the supporting plate for being used for installing blanking material frame positioning component 46.3rd lifting
Component 44 drives the 3rd lifter slide to move up and down by the 3rd lifting motor by driving the 3rd elevating screw to rotate, so that
The blanking material frame positioning component 46 being arranged on the 3rd lifter slide is driven to move up and down.
The blanking material frame positioning component 46 is fixedly connected with the 3rd lifter slide, for being positioned to material frame 5
And fixation.The blanking material frame positioning component 46 includes blanking material frame positioning installation frame, blanking material frame positioning motor, number
Individual blanking material frame positioning roller, blanking material frame positioning belt, blanking material frame positioning cylinder, blanking material frame location-plate and
Blanking material frame locating dowel.The blanking material frame positioning installation frame is arranged on the supporting plate of the 3rd lifter slide lower end, described
Blanking material frame positioning motor is arranged on the side of blanking material frame positioning installation frame, and the blanking material frame positioning roller is installed
In material part positioning installation frame, the blanking material frame positioning belt is set on blanking material frame positioning roller, passes through blanking
The operating of material frame positioning motor drives blanking material frame positioning roller to rotate to drive blanking material frame positioning belt to rotate so that
Material frame 5 on blanking material frame positioning belt is moved so as to adjustment position；The blanking material frame positioning cylinder peace
Mounted in the other end of the 3rd lifter slide, the blanking material frame location-plate is connected with the cylinder axis of blanking material frame positioning cylinder
Connect, the blanking material frame locating dowel is fixed on blanking material frame location-plate, described its head shape of blanking material frame locating dowel
Shape is mutually chimeric with the shape of the locating slot 56 on 3 material plate, makes blanking material frame by the driving of blanking material frame positioning cylinder
Locating slot 56 on locating dowel insertion 3 material plate is so as to be positioned and be fixed to material frame 5.
4th lifting assembly 45 include the 4th lifting mounting bracket, the 4th lifting motor, the 4th riser guide, the 4th liter
Screw mandrel and the 4th lifting slider drop, and the 4th lifting mounting bracket is connected with rack 4, the 4th lifting motor and the 4th
Riser guide is fixed on the 4th lifting mounting bracket, and the 4th lifting slider is set on the 4th riser guide.Described 4th
Lifting mounting bracket includes the 3rd installing plate being fixedly connected with rack 4, the 4th peace being fixedly connected with the described second translation component
Plate is filled, the 4th lifting motor and the 4th riser guide are fixed on the 3rd installing plate, and the 4th lifting slider is fixed on
On 4th installing plate.Be also equipped with 4th installing plate for the 4th lifting motor and the 4th elevating screw cooperation lead
To set, described 4th elevating screw one end is connected one end with the motor shaft of the 4th lifting motor in guide sleeve.Described
Four lifting assemblies 45 drive the 4th elevating screw to rotate in guide sleeve to drive the second translation group by the 4th lifting motor
Part is moved up and down.
The blanking transfer member includes the second translation component 47, the 3rd conveying assembly 48 and the 4th conveying assembly 49,
The second translation component 47, the 3rd conveying assembly 48 and the 4th conveying assembly 49 are installed on rack 4, and the described 3rd is defeated
It is defeated that the material frame 5 that sending component 48 is located on the side of the 4th conveying assembly 49, and the 3rd conveying assembly 48 can be transported to the 4th
On sending component 49.The conveying assembly 48 of second translation component 47 and the 3rd is mutually interspersed to be set.
It is described second translation component 47 include second translation mounting bracket, the second translation motor, it is several second translation roller with
And the second translation conveyer belt on the second translation roller is set in, second translation motor and the second translation roller are installed in
On second translation mounting bracket.Specifically, the second translation mounting bracket includes the second translation installing plate and the second translation support
Plate, the second translation supporting plate is located between the second translation installing plate, material frame 5 can be supported, described second is flat
Move installing plate and be arranged to spaced several independent straight panels, these straight panels can be interspersed in the 3rd conveying of the 3rd conveying assembly 48
Between band.Wherein, the second translation component 47 and the 3rd conveying assembly 48 is interspersed design, the second translation of the second translation component 47
Conveyer belt is located in the 3rd mounting groove and the 4th mounting groove of the 3rd conveying assembly 48, the second translation branch of the second translation component 47
Fagging is located between the 3rd conveyer belt of the 3rd conveying assembly 48.This relatively independent interspersed design can make material frame 5 exist
The movement for two different directions that can be carried out when being conveyed, very flexibly and saves space.
3rd conveying assembly 48 include the 3rd conveying mounting bracket, the 3rd conveying motor, several 3rd conveying rollers with
And the 3rd conveyer belt on the 3rd conveying roller is set in, the 3rd conveying motor and the 3rd conveying roller are installed in the 3rd
Convey on mounting bracket.Specifically, the 3rd conveying mounting bracket is divided into the first installation part, the second mounting portion and the 3rd installation
The 3rd mounting groove, the second mounting portion and the 3rd peace are provided between part, wherein the first installation part and the second mounting portion
Dress part is provided with the 4th mounting groove.The installation of 3rd conveying roller and the 3rd conveyer belt bypasses the 3rd mounting groove and
Four mounting grooves, form the depression consistent with the 4th mounting groove with the 3rd mounting groove.3rd conveying assembly 48 is defeated by the 3rd
The driving of power transmission machine translates the material frame 5 equipped with silicon chip on conveyer belt by second and is transported to the 4th conveying from the 3rd conveying assembly 48
On component 49.
4th conveying assembly 49 includes the 4th conveying mounting bracket, the 4th conveying motor, several 4th conveying rollers and set
The 4th conveyer belt on the 4th conveying roller is located at, the 4th conveying motor and the 4th conveying roller are installed in the 4th conveying
On mounting bracket.4th conveying assembly 49 by the 4th conveying motor driving by from the 3rd conveying assembly 48 be conveyed through come
Material frame 5 equipped with silicon chip is transported.Positive and negative detection components 115 are also equipped with the blanking device 3, it is mounted in the 4th conveying assembly
Between 49 the 4th conveyer belt.
As shown in figure 13, the silicon chip laser marking machine also includes material frame conveying assembly, the material frame conveying assembly
For the empty bin 5 in feeding material frame positioning component 16 to be transported in blanking material frame positioning component 46, the material
Frame conveying assembly includes material frame delivery track 61, material frame conveying motor 62, material frame conveying roller 63, material frame conveyer belt
64, the material frame delivery track 61 is arranged on rack 4, and the material frame conveying motor 62 and material frame conveying roller 63 are pacified
On material frame delivery track 61, the material frame conveyer belt 64 is set on material frame conveying roller 63.The material frame
Conveying assembly is arranged on the side for being located at detection marking device 2 between the second lifting assembly 15 and the 3rd lifting assembly 44.It is described
Material frame 5 conveys conveying assembly by material frame and is transported to blanking device 3 from feeding device 1, realizes the circulation profit of material frame 5
With automaticity is high, convenient and swift.
As shown in figure 14, invention additionally discloses a kind of silicon chip marking method, it is realized by above-mentioned silicon chip laser marking machine.
The silicon chip marking method comprises the following steps：Step S10:Feeding device 1 is by waiting in the material frame 5 for filling silicon chip to be detected
Detection silicon chip is sent out piecewise；Step S20：Marking device 2 is by the silicon chip extracting to be detected sent out piecewise and is detected for detection, will
Detect that the qualified silicon chip finished is put into blanking device 3；Step S30：Blanking device 3 will detect that the qualified silicon chip finished is transported piecewise
The material frame 5 for being stored into empty bin 5 and filling qualified silicon chip is sent out.More specifically, comprising the steps：
Step S1：The material frame 5 that feeding transfer member and feeding lift component will be equipped with silicon chip delivers to feeding screening structure
The side of part；
Step S2：Feeding screening component sends out the silicon chip in material frame 5 piecewise, while by empty material frame 5 from material
Frame conveying assembly is transported to blanking device 3；
Step S3：Silicon chip is taken out and detected and mark by the detection marking device 2 from feeding device 1；It is described
Detection marking device 2 will complete the silicon chip extracting of mark and be placed on blanking device 3；
Step S4：Silicon chip is transported in empty bin 5 and stored by the blanking screening component piecewise；
Step S5：The material frame 5 for filling silicon chip is transported on blanking transfer member by the blanking lift component；Under described
Material frame 5 is transported silicon chip laser marking machine by material transfer member.
In the description of the invention, it is to be understood that term " first ", " second " etc. be only used for describe purpose, without
It is understood that to indicate or imply relative importance.For the ordinary skill in the art, on being understood with concrete condition
State the concrete meaning of term in the present invention.In addition, in the description of the invention, unless otherwise indicated, " several " are meant that
Two or more.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that：Not
In the case of departing from the principle and objective of the present invention a variety of change, modification, replacement and modification can be carried out to these embodiments, this
The scope of invention is limited by claim and its equivalent.
Claims (10)
1. a kind of silicon chip laser marking machine, it is characterised in that the silicon chip laser marking machine includes rack, the thing for filling silicon chip
Bin, for convey material frame and to silicon chip carry out screening feeding device, for silicon chip is detected and mark inspection
Survey marking device and the silicon chip that mark is completed is transported into material frame and the blanking device sent out, the feeding device, detection
Marking device and blanking device are installed on rack, the detection marking device be located at feeding device and blanking device it
Between.
2. silicon chip laser marking machine according to claim 1, it is characterised in that the feeding device includes feeding and conveys structure
Part, feeding lift component, feeding screening component, the feeding lift component are arranged on feeding transfer member and feeding screening component
One end, the feeding screening component be located at feeding transfer member side.
3. silicon chip laser marking machine according to claim 1, it is characterised in that the detection marking device takes including silicon chip
Put component, detection and localization component, mark component, reclaim component and rotary components, the mark component, silicon chip pick and place component,
Detection and localization component and recovery component are located at four orientation all around of rotary components respectively, and the silicon chip picks and places component, determined
Position detection components, mark component, recovery component and rotary components are installed on rack.
4. silicon chip laser marking machine according to claim 1, it is characterised in that the blanking device includes blanking and conveys structure
Part, blanking lift component, blanking screening component, the blanking lift component are arranged on blanking transfer member and blanking screening component
One end, the blanking screening component be located at blanking transfer member side.
5. silicon chip laser marking machine according to claim 1, it is characterised in that the silicon chip laser marking machine also includes thing
Bin conveying assembly, the material frame conveying assembly is used to the empty bin in feeding material frame positioning component being transported to blanking
In material frame positioning component, the material frame conveying assembly, which is arranged between feeding device and blanking device, is located at detection mark dress
The side put.
6. silicon chip laser marking machine according to claim 2, it is characterised in that it is defeated that the feeding transfer member includes first
Sending component, the second conveying assembly and the first translation component, first conveying assembly, the second conveying assembly and the first translation
Component is installed on rack, and second conveying assembly is located at the first conveying assembly side, and the first translation component is with rising
Drop component is connected.
7. silicon chip laser marking machine according to claim 2, it is characterised in that the feeding lift component includes first liter
Come down to a lower group part, the second lifting assembly and feeding material frame positioning component, first lifting assembly is connected with the first translation component
Connect, second lifting assembly is located at the side of the first lifting assembly, the feeding material frame positioning component is arranged on second liter
Come down to a lower group on part.
8. silicon chip laser marking machine according to claim 2, it is characterised in that the feeding screening component includes feeding group
Part and feeding positioning component, loading assemblies and the feeding positioning component are installed on rack, the feeding positioning component peace
Silicon chip can be transported on feeding positioning component on the side of loading assemblies and loading assemblies, and the loading assemblies are located at the
Between two lifting assemblies and feeding positioning component.
9. silicon chip laser marking machine according to claim 2, it is characterised in that the feeding screening component also includes being used for
The feeding caching component of silicon chip is cached, the feeding caching component is arranged on rack and positioned positioned at loading assemblies close to feeding
One end of component.
10. a kind of silicon chip laser marking method, it is characterised in that including：
Step S10:Feeding device sends out the silicon chip to be detected in the material frame for filling silicon chip to be detected piecewise；
Step S20：Detection marking device is by the silicon chip extracting to be detected sent out piecewise and is detected, by detect finish it is qualified
Silicon chip is put into blanking device；
Step S30：Blanking device will detect that the qualified silicon chip finished is transported to piecewise and qualified silicon stored and filled in empty bin
The material frame of piece is sent out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710245936.4A CN107052586B (en) | 2017-04-14 | 2017-04-14 | A kind of silicon wafer laser marking machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710245936.4A CN107052586B (en) | 2017-04-14 | 2017-04-14 | A kind of silicon wafer laser marking machine |
Publications (2)
| Publication Number | Publication Date |
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| CN107052586A true CN107052586A (en) | 2017-08-18 |
| CN107052586B CN107052586B (en) | 2019-07-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710245936.4A Expired - Fee Related CN107052586B (en) | 2017-04-14 | 2017-04-14 | A kind of silicon wafer laser marking machine |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107584215A (en) * | 2017-08-21 | 2018-01-16 | 大族激光科技产业集团股份有限公司 | Laser marking device |
| CN108213980A (en) * | 2017-12-14 | 2018-06-29 | 深圳市清雅科技有限公司 | A kind of automatic loading and unloading system |
| CN109676263A (en) * | 2019-02-22 | 2019-04-26 | 合肥齐泰光电科技有限公司 | Self-service laser marking method and device |
| CN112183688A (en) * | 2020-09-29 | 2021-01-05 | 北京智芯微电子科技有限公司 | Automatic issuing equipment for radio frequency tag |
| CN112872609A (en) * | 2021-04-01 | 2021-06-01 | 刘永国 | Electronic laser code spraying system and use method thereof |
| CN116344424A (en) * | 2023-05-30 | 2023-06-27 | 诺德凯(苏州)智能装备有限公司 | High-efficient silicon chip detects sorting unit |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060113290A1 (en) * | 2004-12-01 | 2006-06-01 | Shareef Iqbal A | Heated chuck for laser thermal processing |
| CN101127301A (en) * | 2007-09-20 | 2008-02-20 | 格兰达技术（深圳）有限公司 | Laser marker for fully automatic IC material bar |
| CN201084718Y (en) * | 2007-09-20 | 2008-07-09 | 格兰达技术（深圳）有限公司 | Detection system of IC strip laser marking machine |
| CN101369523A (en) * | 2008-10-17 | 2009-02-18 | 格兰达技术（深圳）有限公司 | IC material strip laser mark printing machine and its operation mode |
| CN201333837Y (en) * | 2009-01-16 | 2009-10-28 | 格兰达技术（深圳）有限公司 | Pressurization marking device of IC material laser marking machine |
| CN101722738A (en) * | 2009-11-20 | 2010-06-09 | 格兰达技术（深圳）有限公司 | Marking method of material strips and compact type full-automatic IC (integrated circuit) material strip laser marking machine |
| CN201586972U (en) * | 2009-11-20 | 2010-09-22 | 格兰达技术（深圳）有限公司 | Grabbing and emptying device of compact-type full-automatic IC material strip laser marking machine |
| CN102310658A (en) * | 2010-06-29 | 2012-01-11 | 吴华 | Marker for integrated circuit packaged chip |
| CN206543950U (en) * | 2017-03-16 | 2017-10-10 | 东莞市启天自动化设备股份有限公司 | A kind of silicon chip laser marking machine |
-
2017
- 2017-04-14 CN CN201710245936.4A patent/CN107052586B/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060113290A1 (en) * | 2004-12-01 | 2006-06-01 | Shareef Iqbal A | Heated chuck for laser thermal processing |
| CN101127301A (en) * | 2007-09-20 | 2008-02-20 | 格兰达技术（深圳）有限公司 | Laser marker for fully automatic IC material bar |
| CN201084718Y (en) * | 2007-09-20 | 2008-07-09 | 格兰达技术（深圳）有限公司 | Detection system of IC strip laser marking machine |
| CN101369523A (en) * | 2008-10-17 | 2009-02-18 | 格兰达技术（深圳）有限公司 | IC material strip laser mark printing machine and its operation mode |
| CN201333837Y (en) * | 2009-01-16 | 2009-10-28 | 格兰达技术（深圳）有限公司 | Pressurization marking device of IC material laser marking machine |
| CN101722738A (en) * | 2009-11-20 | 2010-06-09 | 格兰达技术（深圳）有限公司 | Marking method of material strips and compact type full-automatic IC (integrated circuit) material strip laser marking machine |
| CN201586972U (en) * | 2009-11-20 | 2010-09-22 | 格兰达技术（深圳）有限公司 | Grabbing and emptying device of compact-type full-automatic IC material strip laser marking machine |
| CN102310658A (en) * | 2010-06-29 | 2012-01-11 | 吴华 | Marker for integrated circuit packaged chip |
| CN206543950U (en) * | 2017-03-16 | 2017-10-10 | 东莞市启天自动化设备股份有限公司 | A kind of silicon chip laser marking machine |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107584215A (en) * | 2017-08-21 | 2018-01-16 | 大族激光科技产业集团股份有限公司 | Laser marking device |
| CN108213980A (en) * | 2017-12-14 | 2018-06-29 | 深圳市清雅科技有限公司 | A kind of automatic loading and unloading system |
| CN109676263A (en) * | 2019-02-22 | 2019-04-26 | 合肥齐泰光电科技有限公司 | Self-service laser marking method and device |
| CN112183688A (en) * | 2020-09-29 | 2021-01-05 | 北京智芯微电子科技有限公司 | Automatic issuing equipment for radio frequency tag |
| CN112872609A (en) * | 2021-04-01 | 2021-06-01 | 刘永国 | Electronic laser code spraying system and use method thereof |
| CN116344424A (en) * | 2023-05-30 | 2023-06-27 | 诺德凯(苏州)智能装备有限公司 | High-efficient silicon chip detects sorting unit |
| CN116344424B (en) * | 2023-05-30 | 2023-07-21 | 诺德凯(苏州)智能装备有限公司 | High-efficient silicon chip detects sorting unit |
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| CN107052586B (en) | 2019-07-12 |
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