CN206543950U - A kind of silicon chip laser marking machine - Google Patents
A kind of silicon chip laser marking machine Download PDFInfo
- Publication number
- CN206543950U CN206543950U CN201720255454.2U CN201720255454U CN206543950U CN 206543950 U CN206543950 U CN 206543950U CN 201720255454 U CN201720255454 U CN 201720255454U CN 206543950 U CN206543950 U CN 206543950U
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- Prior art keywords
- feeding
- blanking
- mechanisms
- conveying
- section mechanisms
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Abstract
The utility model discloses a kind of silicon chip laser marking machine, feeding conveying I section mechanisms including frame and in frame, feeding conveys II section mechanisms, feeding conveys III section mechanisms, feeding conveys III sections of elevating mechanisms, feeding screening elevating mechanism, feeding screening mechanism, feeding position adjusting mechanism, linear transmission mechanism, laser scribing detection components, blanking screening mechanism, blanking screening elevating mechanism, blanking conveys III sections of elevating mechanisms, blanking conveys III section mechanisms, blanking conveys II section mechanisms, blanking conveys I section mechanisms and empty basket tool conveying mechanism, laser scribing detection components include a rotating disk and with linear transmission mechanism successively 90 degree be distributed in rotating disk surrounding CCD testing agencies, laser marking mechanism, defective products output mechanism, the utility model is convenient to carry out laser marking to silicon chip, operating efficiency is high, automaticity is high, fragment rate can be reduced.
Description
Technical field
The utility model is related to solar cell manufacturing equipment technical field, and in particular to a kind of silicon chip laser marking machine.
Background technology
In current solar cell manufacturing process, include multiple processes, such as Wafer Cleaning, making herbs into wool, diffusion, mark.
In the prior art, traditional mark methods easily occur that fragment rate is high, big to the pollution of silicon chip, the low problem of efficiency.
Utility model content
(1) technical problem to be solved
It is convenient that laser marking is carried out to silicon chip in order to overcome prior art not enough, it is proposed that a kind of silicon chip laser marking machine,
Operating efficiency is high, and automaticity is high, can reduce fragment rate.
(2) technical scheme
The utility model is achieved through the following technical solutions：The utility model proposes a kind of silicon chip laser marking machine, bag
Including rack and feeding conveying I section mechanisms, feeding conveying II section mechanisms, feeding conveying III section mechanisms, feeding in frame
Convey III sections of elevating mechanisms, feeding screening elevating mechanism, feeding screening mechanism, feeding position adjusting mechanism, straight-line transmitting motivations
Structure, laser scribing detection components, blanking screening mechanism, blanking screening elevating mechanism, blanking convey III sections of elevating mechanisms, blankings
Convey III section mechanisms, blanking conveying II section mechanisms, blanking conveying I section mechanisms and empty basket tool conveying mechanism, the feeding conveying
I section mechanisms, feeding conveying II section mechanisms and feeding conveying III section mechanisms are sequentially connected, and the feeding conveys III sections of lifts
Structure is arranged at the top that feeding conveys III section mechanisms, and the feeding screening elevating mechanism is arranged at the top of feeding screening mechanism,
The feeding screening mechanism connects feeding position adjusting mechanism, and the laser scribing detection components include a rotating disk and and straight line
Transmission mechanism successively 90 degree be distributed in rotating disk surrounding CCD testing agencies, laser marking mechanism, defective products output mechanism, it is described
Include the transfer arm that a two ends are respectively provided with vacuum cup on linear transmission mechanism, silicon chip is by transfer arm respectively from upper discharge position
Adjustment mechanism is moved on rotating disk to be moved in blanking screening mechanism again, and the blanking screening elevating mechanism is arranged at blanking screening
The upper end of mechanism, the blanking conveys III sections of elevating mechanisms and is arranged at blanking conveying III section mechanisms top, while described
Blanking conveying III section mechanisms, blanking conveying II section mechanisms and blanking conveying I section mechanisms are sequentially connected, the empty basket tool conveying
Mechanism connects feeding screening elevating mechanism and blanking screening mechanism.
Further, it is provided with basket on the feeding conveying I section mechanisms and has positive and negative testing agency.
Further, it is respectively arranged with feeding cache mechanism in the middle part of the feeding screening mechanism and blanking screening mechanism
And blanking cache mechanism.
Further, basket tool advance is provided between feeding conveying I section mechanisms and feeding the conveying II section mechanisms to stop
Mechanism.
(3) beneficial effect
The utility model has the advantages that relative to prior art：
A kind of silicon chip laser marking machine that the utility model is mentioned, its automaticity is higher, will be equipped with the basket tool of silicon chip
After feeding delivery end is put into, automatically each silicon chip is carried out taking piece, detection, mark and remove waste product, then again
Load basket tool shipment, can replace numerous and diverse artificial using the equipment, operating efficiency be improved, while also reducing fragment rate.
Brief description of the drawings
Fig. 1 is the utility model structural representation.
Fig. 2 is the utility model top view.
1- feedings convey I section mechanisms；2- baskets have advance blocking mechanism；3- feedings convey II section mechanisms；4- feedings convey III
Section mechanism；5- feedings convey III sections of elevating mechanisms；6- feeding screening elevating mechanisms；7- feeding screenings mechanism；8- feedings cache machine
Structure；9- feeding position adjusting mechanisms；10- linear transmission mechanisms；11- laser scribing detection components；12- blanking screenings mechanism；13-
Blanking cache mechanism；14- blanking screening elevating mechanisms；15- blankings convey III sections of elevating mechanisms；16- blankings convey III sections of machines
Structure；17- blankings convey II section mechanisms；18- blankings convey I section mechanisms；19- sky basket tool conveying mechanisms；20- baskets have positive and negative detection machine
Structure；101- transfer arms；111- rotating disks；112-CCD testing agencies；113- laser marking mechanisms；114- defective products output mechanisms.
Embodiment
In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation
Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only to explain
The utility model, is not used to limit the utility model.
A kind of silicon chip laser marking machine as depicted in figs. 1 and 2, including frame and the feeding conveying I in frame
Section mechanism 1, feeding conveying II section mechanisms 3, feeding conveying III section mechanisms 4, feeding convey III sections of elevating mechanisms 5, feeding screenings
Elevating mechanism 6, feeding screening mechanism 7, feeding position adjusting mechanism 9, linear transmission mechanism 10, laser scribing detection components 11,
Blanking screening mechanism 12, blanking screening elevating mechanism 14, blanking convey III sections of elevating mechanisms 15, blanking conveying III section mechanisms
16th, blanking conveying II section mechanisms 17, blanking conveying I section mechanisms 18 and empty basket tool conveying mechanism 19, the feeding convey I sections of machines
Structure 1, feeding conveying II section mechanisms 3 and feeding conveying III section mechanisms 4 are sequentially connected, and the feeding conveys III sections of elevating mechanisms
5 are arranged at the top of feeding conveying III section mechanisms 4, and the feeding screening elevating mechanism 6 is arranged at the upper of feeding screening mechanism 7
Portion, the connection feeding of feeding screening mechanism 7 position adjusting mechanism 9, the laser scribing detection components 11 include a rotating disk 111
And it is distributed in the CCD testing agencies 112 of the surrounding of rotating disk 111, laser marking mechanism for 90 degree successively with linear transmission mechanism 10
113rd, the transfer arm that a two ends are respectively provided with vacuum cup is included on defective products output mechanism 114, the linear transmission mechanism 10
101, silicon chip is moved on rotating disk 111 from feeding position adjusting mechanism 9 and is moved to blanking arranging machine again respectively by transfer arm 101
On structure 12, the blanking screening elevating mechanism 14 is arranged at the upper end of blanking screening mechanism 12, and the blanking conveys III sections
Elevating mechanism 15 is arranged at the top of blanking conveying III section mechanisms 16, while blanking conveying III section mechanisms 16, blanking conveying
II section mechanisms 17 and blanking conveying I section mechanisms 18 are sequentially connected, the empty basket tool conveying mechanism 19 connection feeding screening lifting
Mechanism 6 and blanking screening mechanism 12.
Wherein, it is provided with basket on the feeding conveying I section mechanisms 1 and has positive and negative testing agency 20；The feeding screening mechanism 7
And the middle part of blanking screening mechanism 12 is respectively arranged with feeding cache mechanism 8 and blanking cache mechanism 13；The feeding is defeated
I section mechanisms 1 and feeding is sent to be provided with basket tool advance blocking mechanism 2 between conveying II section mechanisms 3.
A kind of silicon chip laser marking machine that the utility model is mentioned, it will be equipped with the basket of silicon chip when specifically used first
Tool is put on feeding conveying I section mechanisms 1, under conveyer belt effect, and basket tool is walked on feeding conveying I section mechanisms 1, positioned at feeding
Basket on conveying I section mechanisms 1, which has positive and negative testing agency 20, can detect that basket tool is forward and reverse, when detect basket tool it is oppositely positioned when,
Staff can be reminded to carry out replacing adjustment, basket tool is transferred to feeding conveying II section mechanisms 3 from feeding conveying I section mechanisms 1,
Basket tool advance blocking mechanism 2 positioned between the two may insure that every strip transmission line only has by a basket every time, when equipped with silicon
The basket tool of piece is entered after feeding conveying III section mechanisms 4, and feeding conveys III sections of elevating mechanisms 5 and feeding is conveyed into III sections of machines
The overall too up to same level of feeding screening mechanism 7 height of structure 4, it is lateral transfer that feeding, which conveys III section elevating mechanisms 5, can be with
Basket tool with silicon chip is delivered to feeding screening mechanism 7, feeding screening elevating mechanism 6 is gradually reduced, and will be located in basket tool
Silicon chip be gradually removed and placed in feeding arranging machine structure 7, silicon chip is then transmitted enters line position at supreme discharge position adjustment mechanism 9
Positioning is put, during being somebody's turn to do, the unnecessary silicon chip that feeding screening mechanism 7 comes out is transferred to feeding cache mechanism 8 and cached, and leads to
The vacuum cup positioned at the upper left side of transfer arm 101 is crossed to take out from feeding position adjusting mechanism 9 silicon chip and along Linear transmission
Mechanism 10 is laterally moved to be put down at rotating disk 111, and rotating disk 111 starts to rotate, and 90 degree are rotated clockwise first and passes through CCD detection machines
Structure 112 is detected, then proceedes to rotate 90 degree, mark is carried out by laser marking mechanism 113, is then rotating 90 degree of arrival
Defective products output mechanism 114 can discharge defective products, finally return to the initial position of rotating disk 111 being rotated by 90 ° silicon chip, pass through
Silicon chip after mark is moved in blanking screening mechanism 12 by the vacuum cup positioned at the right-hand member of transfer arm 101, is now placed in feeding
Empty basket tool in screening mechanism 7 has conveying mechanism 19 by empty basket to be transmitted to blanking screening mechanism 12, passes through blanking screening liter
Silicon chip can be gradually put into basket tool by descending mechanism 14, and now blanking screening elevating mechanism 14 gradually rises, during being somebody's turn to do, under
Unnecessary silicon chip can be stored by blanking cache mechanism 13 in material screening mechanism 12, after silicon chip is filled in basket tool, basket tool quilt
Transmit to blanking conveying III section mechanisms 16, then blanking III sections of elevating mechanisms 15 of conveying are whole by blanking conveying III section mechanisms 16
Body declines, and the basket tool equipped with silicon chip passes sequentially through blanking conveying II section mechanisms 17 again and blanking conveying I section mechanisms 18 are transmitted out
Go, complete whole mark process.
Embodiment described above is only that preferred embodiment of the present utility model is described, not to this practicality
New spirit and scope are defined.On the premise of the utility model design concept is not departed from, this area ordinary person couple
The all variations and modifications that the technical solution of the utility model is made, all should drop into protection domain of the present utility model, this reality
With new claimed technology contents, all record in detail in the claims.
Claims (4)
1. a kind of silicon chip laser marking machine, it is characterised in that：Feeding conveying I section mechanisms including frame and in frame
(1), feeding conveying II section mechanisms (3), feeding conveying III section mechanisms (4), feeding convey III sections of elevating mechanisms (5), feeding row
Piece elevating mechanism (6), feeding screening mechanism (7), feeding position adjusting mechanism (9), linear transmission mechanism (10), laser scribing inspection
Survey component (11), blanking screening mechanism (12), blanking screening elevating mechanism (14), blanking convey III sections of elevating mechanisms (15), under
Material conveying III section mechanisms (16), blanking conveying II section mechanisms (17), blanking conveying I section mechanisms (18) and empty basket tool conveyer
Structure (19), the feeding conveying I section mechanisms (1), feeding conveying II section mechanisms (3) and feeding conveying III section mechanisms (4) are successively
Connection, the feeding conveys the top that III sections of elevating mechanisms (5) are arranged at feeding conveying III section mechanisms (4), the feeding row
Piece elevating mechanism (6) is arranged at the top of feeding screening mechanism (7), and the feeding screening mechanism (7) connects feeding position adjustment
Mechanism (9), the laser scribing detection components (11) include a rotating disk (111) and with 90 degree successively of linear transmission mechanism (10)
The CCD testing agencies (112) of rotating disk (111) surrounding, laser marking mechanism (113), defective products output mechanism (114) are distributed in,
Include the transfer arm (101) that a two ends are respectively provided with vacuum cup on the linear transmission mechanism (10), silicon chip passes through transfer arm
(101) it is moved on rotating disk (111) and is moved to again in blanking screening mechanism (12) from feeding position adjusting mechanism (9) respectively, institute
The upper end that blanking screening elevating mechanism (14) is arranged at blanking screening mechanism (12) is stated, the blanking conveys III sections of liftings
Mechanism (15) be arranged at blanking conveying III section mechanisms (16) top, while the blanking conveying III section mechanisms (16), blanking it is defeated
Send II section mechanisms (17) and blanking to convey I section mechanisms (18) to be sequentially connected, empty basket tool conveying mechanism (19) the connection feeding
Screening elevating mechanism (6) and blanking screening mechanism (12).
2. a kind of silicon chip laser marking machine according to claim 1, it is characterised in that：The feeding conveying I section mechanisms (1)
On be provided with basket and have positive and negative testing agency (20).
3. a kind of silicon chip laser marking machine according to claim 1, it is characterised in that：The feeding screening mechanism (7) with
And feeding cache mechanism (8) and blanking cache mechanism (13) are respectively arranged with the middle part of blanking screening mechanism (12).
4. a kind of silicon chip laser marking machine according to claim 1, it is characterised in that：The feeding conveying I section mechanisms (1)
Basket tool advance blocking mechanism (2) is provided between feeding conveying II section mechanisms (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720255454.2U CN206543950U (en) | 2017-03-16 | 2017-03-16 | A kind of silicon chip laser marking machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720255454.2U CN206543950U (en) | 2017-03-16 | 2017-03-16 | A kind of silicon chip laser marking machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206543950U true CN206543950U (en) | 2017-10-10 |
Family
ID=59996528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720255454.2U Expired - Fee Related CN206543950U (en) | 2017-03-16 | 2017-03-16 | A kind of silicon chip laser marking machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206543950U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107052586A (en) * | 2017-04-14 | 2017-08-18 | 东莞市启天自动化设备股份有限公司 | A kind of silicon chip laser marking machine and method |
| CN108015426A (en) * | 2017-12-13 | 2018-05-11 | 陈寿春 | Intelligent Laser stamp welding system |
| CN108655572A (en) * | 2018-05-22 | 2018-10-16 | 靳红梅 | A kind of automation rearview mirror laser marking device |
| CN108971759A (en) * | 2018-05-22 | 2018-12-11 | 靳红梅 | A kind of abnormal curved surface glass full-automatic laser marking machine |
| CN110220903A (en) * | 2019-05-18 | 2019-09-10 | 福建福顺半导体制造有限公司 | A kind of chip disk detection device |
-
2017
- 2017-03-16 CN CN201720255454.2U patent/CN206543950U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107052586A (en) * | 2017-04-14 | 2017-08-18 | 东莞市启天自动化设备股份有限公司 | A kind of silicon chip laser marking machine and method |
| CN107052586B (en) * | 2017-04-14 | 2019-07-12 | 东莞市启天自动化设备股份有限公司 | A kind of silicon wafer laser marking machine |
| CN108015426A (en) * | 2017-12-13 | 2018-05-11 | 陈寿春 | Intelligent Laser stamp welding system |
| CN108655572A (en) * | 2018-05-22 | 2018-10-16 | 靳红梅 | A kind of automation rearview mirror laser marking device |
| CN108971759A (en) * | 2018-05-22 | 2018-12-11 | 靳红梅 | A kind of abnormal curved surface glass full-automatic laser marking machine |
| CN110220903A (en) * | 2019-05-18 | 2019-09-10 | 福建福顺半导体制造有限公司 | A kind of chip disk detection device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 523000 Room 101, building 2, No.1, Chibu Road, Zhangmutou town, Dongguan City, Guangdong Province Patentee after: GUANGDONG QITIAN AUTOMATIC INTELLIGENT EQUIPMENT Co.,Ltd. Address before: 523637, building 8, two bamboo street, Sassafras community, Zhangmutou town, Dongguan, Guangdong Patentee before: DONGGUAN QITIAN AUTOMATION EQUIPMENT Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171010 Termination date: 20210316 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |