CN116130400A - Precise movement table - Google Patents
Precise movement table Download PDFInfo
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- CN116130400A CN116130400A CN202310032261.0A CN202310032261A CN116130400A CN 116130400 A CN116130400 A CN 116130400A CN 202310032261 A CN202310032261 A CN 202310032261A CN 116130400 A CN116130400 A CN 116130400A
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- rotating shaft
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- screw rod
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 42
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 42
- 239000010703 silicon Substances 0.000 claims abstract description 42
- 235000012431 wafers Nutrition 0.000 claims description 47
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000001514 detection method Methods 0.000 abstract description 8
- 230000010354 integration Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 6
- 238000001179 sorption measurement Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
- B25H1/00—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
- B25H1/00—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby
- B25H1/08—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby with provision for attachment of work holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of silicon wafer detection and discloses a precise movement table. The precise movement table comprises a bracket, a bearing disc, a lifting assembly and a driving assembly. The bearing disc is rotatably arranged on the bracket and is used for bearing the silicon wafer; the lifting assembly comprises a screw rod, a screw nut and a plurality of supporting rods, the supporting rods are annularly arranged and connected with the screw nut, the screw rod is rotationally connected with the bracket, the screw nut is in threaded connection with the screw rod, the bearing disc is provided with a plurality of through holes, and the supporting rods can be arranged through the through holes; the driving assembly comprises a rotating shaft, a driving piece, a first connecting piece and a second connecting piece, and the rotating shaft collar is arranged on the outer side of the lifting assembly and is rotationally connected with the bracket; the driving piece is in driving connection with the rotating shaft and is used for driving the rotating shaft to rotate; the first connecting piece is used for connecting or disconnecting between the rotating shaft and the bearing disc, and the second connecting piece is used for connecting or disconnecting between the rotating shaft and the screw rod. The invention ensures the flatness of the bearing disc for adsorbing the silicon wafer and improves the integration level of the precision motion platform.
Description
Technical Field
The invention relates to the technical field of silicon wafer detection, in particular to a precise movement table.
Background
In the field of defect detection of silicon wafers or masks, a precision motion stage is one of key technologies, and the performance of the precision motion stage directly influences the detection result. With the continuous development of semiconductor chip manufacturing processes, silicon wafer or mask inspection equipment is developed in a direction of more precision, more accuracy and higher yield.
In the prior art, as shown in fig. 1, a carrying disc 10 is integrated on a rotating motion axis of a precision motion stage, the carrying disc 10 is used for fixing a detected workpiece, the detected workpiece is typically a silicon wafer, and a method for fixing the silicon wafer by the carrying disc 10 is typically vacuum adsorption or electrostatic adsorption. However, the carrier tray 10 needs to transfer the wafer with the wafer transfer unit in addition to adsorbing the wafer, that is, the wafer to be detected is obtained from the wafer transfer unit to perform various defect detection, and after the detection is completed, the wafer is returned to the wafer transfer unit. The process of taking or returning the silicon wafer is generally completed by a robot arm mounted on a silicon wafer transfer unit to reciprocate between the carrier tray 10 and the wafer library.
However, in order to facilitate the robot to pick up the silicon wafer on the carrier tray 10, the carrier tray 10 is formed with a relief groove 101 for facilitating the insertion of the fork of the robot. The avoiding groove 101 with a larger size is processed on the carrying tray 10, so that the flatness of the silicon wafer adsorbed by the carrying tray 10 generates micron-sized deformation, and the higher-precision nano-sized ultra-flat adsorption cannot be realized.
Based on this, there is a need for a precision motion stage to solve the above-mentioned problems.
Disclosure of Invention
Based on the above, the invention aims to provide a precise movement table, which ensures the flatness of the silicon wafer adsorbed by the bearing plate, realizes the high-precision nanoscale super-flat adsorption of the silicon wafer on the bearing plate, improves the integration level of the precise movement table, reduces the volume and improves the space utilization rate.
In order to achieve the above purpose, the invention adopts the following technical scheme:
a precision motion stage comprising:
a bracket;
the bearing disc is rotatably arranged on the bracket and is used for bearing the silicon wafer;
the lifting assembly comprises a screw rod, a screw nut and a plurality of supporting rods, the supporting rods are annularly arranged and connected with the screw nut, the screw rod is rotationally connected with the bracket, the screw nut is in threaded connection with the screw rod, the bearing disc is provided with a plurality of through holes, and the supporting rods can penetrate through the through holes;
the driving assembly comprises a rotating shaft, a driving piece, a first connecting piece and a second connecting piece, wherein the rotating shaft is arranged on the outer side of the lifting assembly and is rotationally connected with the bracket; the driving piece is in driving connection with the rotating shaft and is used for driving the rotating shaft to rotate; the first connecting piece is used for connecting or disconnecting between the rotating shaft and the bearing disc, and the second connecting piece is used for connecting or disconnecting between the rotating shaft and the screw rod.
As a preferable technical scheme of the precision movement table, the support comprises a bottom plate, the lifting assembly further comprises a guide seat, the lead screw is rotationally connected to the bottom plate, the guide seat is installed on the bottom plate, a sliding rail extending along a first direction is arranged on the guide seat, and the nut is slidingly connected to the sliding rail.
As a preferable technical scheme of the precision motion platform, an air suction hole is formed in the center of the bearing disc, a rotary pneumatic connector is arranged in the air suction hole, and the rotary pneumatic connector is connected with a first air pipe.
As a preferable technical scheme of the precision motion platform, the lead screw is axially provided with a containing cavity, and the first air pipe penetrates through the containing cavity.
As a preferable technical scheme of the precision motion platform, a flow dividing block is arranged on the outer wall of the screw nut, one end of the supporting rod is arranged on the flow dividing block, the other end of the supporting rod is provided with a flexible sucker, a first air passage is arranged in the flow dividing block, a second air passage is arranged in the supporting rod, one end of the second air passage is communicated with the first air passage, and the other end of the second air passage is communicated with the flexible sucker.
As a preferable technical scheme of the precise movement table, the air-operated joint is arranged on the flow dividing block and is communicated with the first air passage.
As a preferable technical scheme of the precision motion platform, a connecting plate is arranged at the top of the rotating shaft, a rotating plate is connected to the bottom of the bearing disc, one end of the first connecting piece is connected to the rotating plate, and the other end of the first connecting piece is disconnected or connected with the connecting plate; one end of the second connecting piece is connected with the screw rod, and the other end of the second connecting piece is disconnected or connected with the connecting plate.
As a preferable technical scheme of the precision motion platform, the first connecting piece and the second connecting piece are electromagnetic clutches.
As a preferable technical scheme of the precision motion platform, the support comprises a bottom plate, the driving piece comprises an annular rotating motor stator and an annular rotating motor rotor, the annular rotating motor stator is arranged on the bottom plate, and the annular rotating motor rotor is arranged on the outer wall of the rotating shaft.
As a preferable technical scheme of the precision motion platform, the support comprises a bearing seat, and the outer wall of the rotating shaft is rotatably connected with the bearing seat through a first bearing.
The beneficial effects of the invention are as follows:
the invention provides a precision motion platform, which is characterized in that a rotating shaft is connected to a bearing disc through a first connecting piece and disconnected from a lead screw through a second connecting piece when in operation; when the driving piece drives the rotating shaft to rotate, the rotating shaft can drive the bearing plate to rotate, so that the silicon wafer on the bearing plate can be conveniently detected. When the connection is needed, the rotating shaft drives the bearing disc to rotate to a connection position, namely, a position where the through hole is coaxial with the support rod; then the rotating shaft is disconnected from the bearing disc through the first connecting piece, the rotating shaft is connected to the screw rod through the second connecting piece, the rotating shaft can drive the screw rod to rotate, the screw nut moves along the axial direction of the screw rod, so that the supporting rod penetrates through the through hole and supports the silicon wafer, the manipulator is convenient to pick up the detected silicon wafer on the supporting rod, and the silicon wafer to be detected is replaced on the supporting rod; the rotating shaft drives the screw rod to reversely rotate so as to reset the supporting rod, and the silicon wafer to be detected is placed on the bearing disc for further detection. Compared with the prior art, the invention does not need to process the avoiding groove on the bearing disc, ensures the flatness of the bearing disc for adsorbing the silicon wafer, and realizes the high-precision nanoscale super-flat adsorption of the silicon wafer on the bearing disc; furthermore, the bearing disc and the screw rod are respectively rotated through one driving piece, so that the integration level of the precise movement table is improved, the volume is reduced, and the space utilization rate is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following description will briefly explain the drawings needed in the description of the embodiments of the present invention, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the contents of the embodiments of the present invention and these drawings without inventive effort for those skilled in the art.
FIG. 1 is a schematic view of a prior art carrier tray;
FIG. 2 is a cross-sectional view of a precision motion stage provided in accordance with an embodiment of the present invention;
fig. 3 is an enlarged view of fig. 2 at a;
FIG. 4 is a schematic view of a carrier tray according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a lifting assembly according to an embodiment of the present invention.
The figures are labeled as follows:
10. a carrying tray; 101. an avoidance groove;
1. a bracket; 11. a bottom plate; 12. a bearing seat;
2. a carrying tray; 21. a through hole; 22. an air suction hole;
3. a lifting assembly; 31. a screw rod; 311. a receiving chamber; 32. a nut; 33. a support rod; 331. a second airway; 34. a guide seat; 341. a slide rail; 35. a shunt block; 351. a first airway; 36. a flexible suction cup; 37. a pneumatic connector; 38. a sealing plate;
4. a drive assembly; 41. a rotation shaft; 42. a driving member; 421. an annular rotating electric machine stator; 422. a ring-shaped rotating motor mover; 43. a first connector; 44. a second connector;
5. a rotary pneumatic joint; 6. a connecting plate; 7. a rotating plate; 8. a first bearing; 9. and a second bearing.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
In the description of the present invention, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are orientation or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.
As shown in fig. 2 to 4, the present embodiment provides a precision motion stage including a bracket 1, a carrier plate 2, a lifting assembly 3, and a driving assembly 4.
Specifically, a bearing disc 2 is rotatably installed on the bracket 1, and the bearing disc 2 is used for bearing silicon wafers; the lifting assembly 3 comprises a screw rod 31, a screw nut 32 and a plurality of supporting rods 33, the plurality of supporting rods 33 are annularly arranged and connected with the screw nut 32, the screw rod 31 is rotationally connected with the bracket 1, the screw nut 32 is in threaded connection with the screw rod 31, the bearing disc 2 is provided with a plurality of through holes 21, and the supporting rods 33 can be arranged in the through holes 21 in a penetrating mode; the driving assembly 4 comprises a rotating shaft 41, a driving piece 42, a first connecting piece 43 and a second connecting piece 44, wherein the rotating shaft 41 is arranged on the outer side of the lifting assembly 3 in a surrounding manner and is rotatably connected with the bracket 1; the driving member 42 is drivingly connected to the rotation shaft 41, and is used for driving the rotation shaft 41 to rotate; the first connection 43 is used for connection or disconnection between the rotation shaft 41 and the carrier plate 2, and the second connection 44 is used for connection or disconnection between the rotation shaft 41 and the screw 31. In this embodiment, the screw 31 is a ball screw shaft, and the moving accuracy of the support rod 33 is improved.
In operation, the rotary shaft 41 is connected to the carrier plate 2 via the first connector 43, and the rotary shaft 41 is disconnected from the screw shaft 31 via the second connector 44; when the driving piece 42 drives the rotating shaft 41 to rotate, the rotating shaft 41 can drive the bearing plate 2 to rotate, so that the silicon wafers on the bearing plate 2 can be conveniently detected. When the connection is needed, the rotating shaft 41 drives the bearing plate 2 to rotate to the connection position, namely, the coaxial position of the through hole 21 and the supporting rod 33; then the rotating shaft 41 is disconnected from the bearing disc 2 through the first connecting piece 43, the rotating shaft 41 is connected to the screw rod 31 through the second connecting piece 44, the rotating shaft 41 can drive the screw rod 31 to rotate, the screw nut 32 moves along the axial direction of the screw rod 31, so that the supporting rod 33 penetrates through the through hole 21 and supports the silicon wafer, the manipulator is convenient to pick up the detected silicon wafer on the supporting rod 33, and the silicon wafer to be detected is replaced on the supporting rod 33; the rotating shaft 41 drives the screw rod 31 to reversely rotate so as to reset the supporting rod 33, and the silicon wafer to be detected is placed on the bearing disc 2 for detection. Compared with the prior art, the embodiment does not need to process the avoiding groove on the bearing disc 2, ensures the flatness of the bearing disc 2 for adsorbing the silicon wafer, and realizes the high-precision nanoscale super-flat adsorption of the silicon wafer on the bearing disc 2; furthermore, the bearing plate 2 and the screw rod 31 are respectively rotated by one driving piece 42, so that the integration level of the precision motion platform is improved, the volume is reduced, and the space utilization rate is improved.
In this embodiment, as shown in fig. 2, an air suction hole 22 is provided in the center of the carrier plate 2, a rotary pneumatic connector 5 is provided in the air suction hole 22, the rotary pneumatic connector 5 is connected with a first air pipe, and the first air pipe and the rotary pneumatic connector 5 cooperate with the air suction hole 22, so that a silicon wafer can be adsorbed on the carrier plate 2, and the stability of the silicon wafer is improved. Furthermore, the rotary pneumatic connector 5 is adopted in the embodiment, when the bearing plate 2 rotates, the first air pipe does not rotate along with the bearing plate 2, so that the first air pipe is prevented from winding. It should be noted that the rotary pneumatic connector 5 is in the prior art, and the structure and principle thereof are not repeated in this embodiment.
Preferably, the lead screw 31 is provided with a containing cavity 311 along the axial direction, and the first air pipe penetrates through the containing cavity 311, so that the inside neatness of the precision motion table is improved, and the attractiveness is improved.
Preferably, as shown in fig. 2-5, the support 1 comprises a base plate 11 and the lifting assembly 3 further comprises a guide seat 34. The lead screw 31 rotates to be connected in bottom plate 11, is provided with the rotation hole on the bottom plate 11, and the bottom of lead screw 31 passes through second bearing 9 rotation to be connected in the rotation hole, improves the rotation precision of lead screw 31. The guide seat 34 is mounted on the bottom plate 11, a sliding rail 341 extending along a first direction is arranged on the guide seat 34, the first direction is the axial direction of the screw rod 31, namely, the vertical direction, the screw nut 32 is slidably connected to the sliding rail 341, and on one hand, when the screw rod 31 rotates, the sliding rail 341 can limit the screw nut 32 to rotate along with the screw rod 31, so that the screw nut 32 can move along the axial direction of the screw rod 31; on the other hand, the slide rails 341 increase the movement stability of the nut 32, and improve the movement accuracy.
Further preferably, as shown in fig. 2 and 3, the outer wall of the nut 32 is provided with a split block 35, one end of a supporting rod 33 is installed on the split block 35, the other end of the supporting rod is provided with a flexible sucker 36, a first air passage 351 is arranged in the split block 35, a second air passage 331 is arranged in the supporting rod 33, one end of the second air passage 331 is communicated with the first air passage 351, and the other end of the second air passage 331 is communicated with the flexible sucker 36. When the plurality of support rods 33 support the silicon wafer, the first air passage 351 and the second air passage 331 enable the flexible sucker 36 to form negative pressure, the flexible sucker 36 adsorbs the silicon wafer, and stability of the silicon wafer is improved. In this embodiment, the flexible suction cup 36 is made of rubber, and adopts a reducing structure, so that the flexible suction cup 36 can adapt to the uneven working condition of the silicon wafer, and the process adaptability is widened. The flow dividing block 35 is provided with a flow channel groove, and an opening of the flow channel groove is blocked by a sealing plate 38 to form a first air channel 351. In this embodiment, the split block 35 is slidably connected to the sliding rail 341 on the guide seat 34.
Wherein, install pneumatic connector 37 on the reposition of redundant personnel piece 35, pneumatic connector 37 communicates in first air flue 351, and pneumatic connector 37 is used for connecting the negative pressure equipment, has realized that flexible sucking disc 36 is connected in the negative pressure equipment.
Further, as shown in fig. 2, the top of the rotating shaft 41 is provided with a connecting plate 6, the bottom of the bearing plate 2 is connected with a rotating plate 7, the rotating plate 7 is connected to the bearing plate 2 through a screw, one end of the first connecting piece 43 is connected to the rotating plate 7, and the other end is disconnected or connected with the connecting plate 6; the second connecting piece 44 has one end connected to the screw 31 and the other end disconnected or connected to the connecting plate 6. In this embodiment, the first connector 43 and the second connector 44 are both electromagnetic clutches. When the first connecting piece 43 is electrified, the connection between the adapter plate and the rotating plate 7 is realized, and when the first connecting piece 43 is powered off, the disconnection between the adapter plate and the rotating plate 7 is realized; similarly, when the second connecting piece 44 is electrified, the lead screw 31 is connected with the connecting plate 6, and when the second connecting piece 44 is deenergized, the connecting plate 6 is disconnected with the lead screw 31.
In this embodiment, the driving member 42 includes an annular rotating electric machine stator 421 and an annular rotating electric machine mover 422, the annular rotating electric machine stator 421 is mounted on the base plate 11, the annular rotating electric machine mover 422 is disposed on the outer wall of the rotating shaft 41, and the annular rotating electric machine stator 421 can drive the annular rotating electric machine mover 422 to rotate, thereby driving the rotating shaft 41 to rotate.
Further, the support 1 comprises a bearing seat 12, the bearing seat 12 is arranged above the bottom plate 11, the outer wall of the rotating shaft 41 is rotatably connected with the bearing seat 12 through the first bearing 8, the rotating shaft 41 is rotatably connected with the support 1, and the rotating stability of the rotating shaft 41 is improved.
The embodiment also provides a silicon wafer handover method adopting the precise movement platform, which comprises the following steps:
s1, disconnecting the rotating shaft 41 from the screw 31 by a second connector 44, and connecting the rotating shaft 41 to the bearing plate 2 by a first connector 43;
s2, the driving piece 42 drives the rotating shaft 41 to rotate so as to enable the bearing disc 2 to rotate to the connection position;
s3, connecting the rotating shaft 41 to the screw rod 31 by the second connecting piece 44, disconnecting the rotating shaft 41 from the bearing disc 2 by the first connecting piece 43, and driving the rotating shaft 41 by the driving piece 42 to rotate so as to enable the supporting rod 33 to ascend, and enabling the supporting rod 33 to penetrate through the through hole 21 and move to a height capable of being connected with the manipulator;
s4, the flexible sucker 36, the supporting rod 33 and the split flow block 35 are all vacuumized by negative pressure equipment, and a manipulator places a silicon wafer to be detected on the flexible sucker 36 on the supporting rod 33;
s5, reversely rotating the lead screw 31 to enable the screw nut 32 and the supporting rod 33 to descend, and when the silicon wafer is placed on the bearing disc 2, rotating the pneumatic connector 5 to open vacuum, and enabling the bearing disc 2 to adsorb the silicon wafer to be detected;
s6, the flexible sucker 36 stops vacuumizing and continues to move downwards until the flexible sucker moves to a safe position, wherein the safe position is that the upper surface of the flexible sucker 36 is positioned below the bearing disc 2, and at the moment, the silicon wafer handover is completed.
Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.
Claims (10)
1. A precision motion stage, comprising:
a bracket (1);
the bearing disc (2) is rotatably arranged on the bracket (1), and the bearing disc (2) is used for bearing silicon wafers;
the lifting assembly (3) comprises a screw rod (31), a screw nut (32) and a plurality of supporting rods (33), wherein the supporting rods (33) are annularly arranged and connected with the screw nut (32), the screw rod (31) is rotationally connected with the bracket (1), the screw nut (32) is in threaded connection with the screw rod (31), the bearing disc (2) is provided with a plurality of through holes (21), and the supporting rods (33) can be arranged in the through holes (21) in a penetrating mode;
the driving assembly (4) comprises a rotating shaft (41), a driving piece (42), a first connecting piece (43) and a second connecting piece (44), wherein the rotating shaft (41) is annularly arranged on the outer side of the lifting assembly (3) and is rotatably connected with the bracket (1); the driving piece (42) is in driving connection with the rotating shaft (41) and is used for driving the rotating shaft (41) to rotate; the first connecting piece (43) is used for connecting or disconnecting the rotating shaft (41) and the bearing disc (2), and the second connecting piece (44) is used for connecting or disconnecting the rotating shaft (41) and the screw rod (31).
2. The precision motion stage according to claim 1, characterized in that the support (1) comprises a bottom plate (11), the lifting assembly (3) further comprises a guide holder (34), the screw rod (31) is rotatably connected to the bottom plate (11), the guide holder (34) is mounted on the bottom plate (11), a sliding rail (341) extending along a first direction is arranged on the guide holder (34), and the screw nut (32) is slidably connected to the sliding rail (341).
3. The precise movement table according to claim 1, characterized in that the center of the bearing plate (2) is provided with an air suction hole (22), a rotary pneumatic joint (5) is arranged in the air suction hole (22), and the rotary pneumatic joint (5) is connected with a first air pipe.
4. A precision motion stage according to claim 3, characterized in that the screw (31) is provided with a receiving cavity (311) in the axial direction, the first air tube being arranged in the receiving cavity (311) in a penetrating manner.
5. The precise movement table according to claim 1, wherein a flow dividing block (35) is mounted on the outer wall of the screw nut (32), one end of the supporting rod (33) is mounted on the flow dividing block (35), a flexible sucker (36) is arranged at the other end of the supporting rod, a first air passage (351) is arranged in the flow dividing block (35), a second air passage (331) is arranged in the supporting rod (33), one end of the second air passage (331) is communicated with the first air passage (351), and the other end of the second air passage (331) is communicated with the flexible sucker (36).
6. The precision motion stage according to claim 5, characterized in that the diverter block (35) is provided with a pneumatic connector (37), the pneumatic connector (37) being in communication with the first air passage (351).
7. The precision motion stage according to claim 1, characterized in that the top of the rotation shaft (41) is provided with a connection plate (6), the bottom of the bearing disc (2) is connected with a rotation plate (7), one end of the first connection piece (43) is connected with the rotation plate (7), and the other end is disconnected or connected with the connection plate (6); one end of the second connecting piece (44) is connected with the screw rod (31), and the other end of the second connecting piece is disconnected or connected with the connecting plate (6).
8. The precision motion stage according to any one of claims 1 to 7, characterized in that the first connection (43) and the second connection (44) are both electromagnetic clutches.
9. The precision motion stage according to any one of claims 1 to 7, characterized in that the support (1) comprises a base plate (11), the driving member (42) comprises an annular rotating electric stator (421) and an annular rotating electric mover (422), the annular rotating electric stator (421) is mounted on the base plate (11), and the annular rotating electric mover (422) is provided on an outer wall of the rotating shaft (41).
10. The precision motion stage according to any one of claims 1-7, characterized in that the support (1) comprises a bearing housing (12), the outer wall of the rotation shaft (41) being rotatably connected to the bearing housing (12) by means of a first bearing (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310032261.0A CN116130400A (en) | 2023-01-10 | 2023-01-10 | Precise movement table |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310032261.0A CN116130400A (en) | 2023-01-10 | 2023-01-10 | Precise movement table |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116130400A true CN116130400A (en) | 2023-05-16 |
Family
ID=86302352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310032261.0A Pending CN116130400A (en) | 2023-01-10 | 2023-01-10 | Precise movement table |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116130400A (en) |
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| JPH10303110A (en) * | 1997-04-30 | 1998-11-13 | Dainippon Screen Mfg Co Ltd | Method and device for treating substrate |
| CN103309176A (en) * | 2013-06-17 | 2013-09-18 | 清华大学 | Six-freedom-degree micropositioner with lifting vacuum claw |
| CN107591356A (en) * | 2017-10-13 | 2018-01-16 | 深圳中科飞测科技有限公司 | Wafer mounting apparatus and its application method |
| CN210516691U (en) * | 2019-05-30 | 2020-05-12 | 深圳中科飞测科技有限公司 | Bearing device |
| CN217361537U (en) * | 2022-04-02 | 2022-09-02 | 苏州精濑光电有限公司 | Positioning device for wafer |
| CN218069814U (en) * | 2022-09-19 | 2022-12-16 | 杭州长川科技股份有限公司 | Climbing mechanism and wafer adsorption equipment |
| CN115480452A (en) * | 2021-05-31 | 2022-12-16 | 上海微电子装备（集团）股份有限公司 | Sucker assembly, exposure device and photoetching system |
| CN218215259U (en) * | 2022-08-16 | 2023-01-03 | 苏州华兴源创科技股份有限公司 | Bearing mechanism |
-
2023
- 2023-01-10 CN CN202310032261.0A patent/CN116130400A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10303110A (en) * | 1997-04-30 | 1998-11-13 | Dainippon Screen Mfg Co Ltd | Method and device for treating substrate |
| CN103309176A (en) * | 2013-06-17 | 2013-09-18 | 清华大学 | Six-freedom-degree micropositioner with lifting vacuum claw |
| CN107591356A (en) * | 2017-10-13 | 2018-01-16 | 深圳中科飞测科技有限公司 | Wafer mounting apparatus and its application method |
| CN210516691U (en) * | 2019-05-30 | 2020-05-12 | 深圳中科飞测科技有限公司 | Bearing device |
| CN115480452A (en) * | 2021-05-31 | 2022-12-16 | 上海微电子装备（集团）股份有限公司 | Sucker assembly, exposure device and photoetching system |
| CN217361537U (en) * | 2022-04-02 | 2022-09-02 | 苏州精濑光电有限公司 | Positioning device for wafer |
| CN218215259U (en) * | 2022-08-16 | 2023-01-03 | 苏州华兴源创科技股份有限公司 | Bearing mechanism |
| CN218069814U (en) * | 2022-09-19 | 2022-12-16 | 杭州长川科技股份有限公司 | Climbing mechanism and wafer adsorption equipment |
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