CN221407272U - Sucking disc and pre-alignment mechanism - Google Patents
Sucking disc and pre-alignment mechanism Download PDFInfo
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- CN221407272U CN221407272U CN202323142247.0U CN202323142247U CN221407272U CN 221407272 U CN221407272 U CN 221407272U CN 202323142247 U CN202323142247 U CN 202323142247U CN 221407272 U CN221407272 U CN 221407272U
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- 238000001179 sorption measurement Methods 0.000 claims abstract description 40
- 230000033001 locomotion Effects 0.000 claims abstract description 38
- 230000002093 peripheral effect Effects 0.000 claims description 18
- 238000013519 translation Methods 0.000 claims description 18
- 238000007664 blowing Methods 0.000 claims description 9
- 230000003287 optical effect Effects 0.000 claims description 7
- 238000000034 method Methods 0.000 abstract description 9
- 238000007789 sealing Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 68
- 230000000694 effects Effects 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a sucker and a prealignment mechanism, which comprises a sucker, a base, a rotary motion module, a lifting motion module, a manipulator and an edge-finding sensor, wherein the sucker is fixed on the rotary motion module, two pipelines are connected, one way of air is compressed, the other way of vacuum is connected with the sensor, a signal can be fed back after the sealing is achieved, the rotary motion module is fixed on the lifting motion module and can do reciprocating lifting motion, one end of the manipulator is fixed on a guide rail of the base, a wafer can be transferred to the sucker and is driven to do linear motion, and the edge-finding sensor is fixed on the base and positioned at the side part of the sucker and is used for detecting the edge of the wafer adsorbed by the sucker. The pre-alignment mechanism can adsorb the wafer with large warpage, thereby realizing the adsorption and fixation of the wafer and facilitating the subsequent alignment process of the wafer.
Description
Technical Field
The utility model relates to the technical field of semiconductor testing, in particular to a sucker and a prealignment mechanism.
Background
With the development of the semiconductor industry, the domestic wafer manufacturers are more and more, the wafer quality is different, a large number of wafers with large warping degree appear in the industry at present, but the adsorption fixation of the wafers with large warping degree can not be realized by utilizing the original vacuum chuck technology, the alignment can not be carried out, and the full-automatic production is influenced.
Disclosure of utility model
The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, the utility model provides the pre-alignment mechanism which can adsorb the wafer with larger warpage, thereby realizing the adsorption and fixation of the wafer and facilitating the subsequent alignment process of the wafer.
The suction cup according to an embodiment of the first aspect of the present utility model comprises:
The two ends of the vacuum channel are communicated, the air inlet of the vacuum channel is a first air inlet, and the air outlet of the vacuum channel is a first air outlet;
The air inlet of the air blowing channel is a second air inlet, the air outlet of the air blowing channel is a second air outlet, and the second air inlet and the second air outlet are positioned on different sides of the sucker;
The first air inlet and the second air outlet are arranged on the same side of the sucker, the second air outlet is arranged around the first air inlet, air can enter the vacuum channel from the first air inlet, so that the sucker adsorbs a workpiece, and air can flow out from the second air outlet, so that the sucker adsorbs the workpiece.
The sucker according to the embodiment of the first aspect of the utility model has at least the following beneficial effects: when the wafer is placed on the sucker, the second air inlet is used for air inflow, and air is blown out from the second air outlet, so that Bernoulli effect is generated, the wafer with large warpage is primarily adsorbed on the sucker, and the wafer is relatively flat; the first air inlet starts to suck air and vacuumize, and further adsorbs the wafer which is preliminarily adsorbed on the sucker; therefore, the problem that the vacuum chuck cannot be tightly adsorbed on an uneven object, namely a wafer with larger warping degree, is solved by using the adsorption method of the Bernoulli effect, the vacuum channel is reserved to carry out vacuum adsorption, the second air outlet surrounds the first air inlet, so that two adsorption forces can be exerted on the adsorption surface of the chuck and are not mutually interfered, the adsorption effect on the wafer is better, and the double adsorption mode enables the adsorption force to be larger, so that the adsorption fixation on the wafer with larger warping degree is realized.
According to some embodiments of the utility model, the suction cup comprises: a main body part, the outer surface of which comprises an adsorption surface, wherein the first air inlet is arranged on the adsorption surface; the protruding portion is fixedly connected to the adsorption surface and protrudes relative to the adsorption surface, the protruding portion is annular and surrounds the first air inlet, and a gap between the outer edge of the protruding portion and the adsorption surface is the second air outlet.
According to some embodiments of the utility model, the suction cup further comprises a plurality of peripheral parts, the peripheral parts are fixedly connected with the main body part, the plurality of peripheral parts are arranged around the main body part, and adjacent peripheral parts are arranged at intervals; the top surface of the peripheral part and the top surface of the protruding part are both plane, and the top surface of the peripheral part is flush with the top surface of the protruding part.
According to a second aspect of the present utility model, the pre-alignment mechanism includes the chuck according to the first aspect, and further includes a base, a rotation movement module, a lifting movement module, a manipulator, and an edge-finding sensor, wherein the rotation movement module is connected to the base, the rotation movement module is used for driving the chuck to rotate relative to the base, the lifting movement module is connected to the rotation movement module, and is used for driving the rotation movement module to move along a direction perpendicular to a plane where the chuck is located, the manipulator has an adsorption hole capable of adsorbing a wafer, the manipulator can move relative to the base, so as to place the wafer on the chuck or remove the wafer from the chuck, the edge-finding sensor is fixed to the base, the edge-finding sensor is located at a side portion of the chuck, and the edge-finding sensor is used for detecting an edge of the wafer adsorbed by the chuck.
The pre-alignment mechanism provided by the embodiment of the utility model has at least the following beneficial effects: the wafer is adsorbed from the wafer material box by the mechanical arm, the height of the sucker is adjusted by the lifting motion module, and the wafer is placed on the sucker by the mechanical arm; the air blowing channel is communicated with the sucker, and the second air outlet blows air to adsorb the wafer by using the Bernoulli effect, so that the wafer with warpage is relatively flat; the vacuum channel is communicated with the sucker, so that the vacuum adsorption is firm; the rotary motion module drives the wafer to rotate by a unit angle; the edge-seeking sensor collects data of different angles, and calculates the position and the angle offset of the circle center of the wafer relative to the rotation center of the sucker, so that the position of the wafer relative to the sucker is judged, and the wafer can be adsorbed to the wafer with large warpage, thereby realizing the adsorption fixation of the wafer, and facilitating the subsequent alignment procedure of the wafer.
According to some embodiments of the utility model, a plane of the optical path of the edge-finding sensor is perpendicular to a plane of the suction surface of the suction cup, and a rotation axis of the suction cup is located in the plane of the optical path.
According to some embodiments of the utility model, the rotary motion module comprises a first motor, a first driving wheel, a first driven wheel and a first belt, wherein the first driving wheel is arranged on the first motor, the first driven wheel is fixedly connected with the sucker, the first belt surrounds the first driving wheel and the first driven wheel, and the first motor is used for driving the first driving wheel to rotate so as to enable the first driven wheel to rotate.
According to some embodiments of the utility model, the pre-alignment mechanism further comprises a horizontally disposed rail, the rail being fixed to the base; the manipulator is arranged above the sucker, one end of the manipulator is provided with the adsorption hole, air is sucked from the adsorption hole to generate vacuum for adsorbing the wafer, and the other end of the manipulator is slidably arranged on the guide rail;
The pre-alignment mechanism further comprises a translation module, wherein the translation module is connected with the manipulator and is used for driving the manipulator to move along the guide rail.
According to some embodiments of the utility model, the translation module includes a second motor, a second driving wheel, a second driven wheel and a second belt, the second driving wheel is mounted on the motor, the second driven wheel is fixed relative to the base, the second belt surrounds the second driving wheel and the second driven wheel, the manipulator is connected with the second belt, and the second motor is used for driving the second driving wheel to rotate so as to enable the second belt to move.
According to some embodiments of the utility model, two translation modules are provided, two manipulators are provided, and each translation module drives one manipulator to move respectively.
According to some embodiments of the utility model, the pre-alignment mechanism further comprises a vacuum sensor connected to the first air outlet, the vacuum sensor being configured to detect a vacuum level of the vacuum channel.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.
Drawings
The utility model is further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a perspective view of a pre-alignment mechanism according to an embodiment of the present utility model;
FIG. 2 is a perspective view of the suction cup of FIG. 1;
FIG. 3 is a bottom view of FIG. 2;
FIG. 4 is a top view of a pre-alignment mechanism according to an embodiment of the present utility model;
FIG. 5 is a perspective view of a rotational movement module of a pre-alignment mechanism according to an embodiment of the present utility model;
Fig. 6 is a perspective view of a guide rail and belt drive system of a pre-alignment mechanism according to an embodiment of the present utility model.
Reference numerals: the device comprises an edge finding sensor 100, a rotary motion module 101, a sucker 102, a manipulator 103, a lifting motion module 104, a guide rail 105, a base 106, an edge finding sensor light path 107, a first air inlet 201, a second air inlet 202, a second air outlet 203, a main body 204, a protruding part 205, a peripheral part 206, a first air outlet 301, a first driven wheel 501, a first driving wheel 502, a first belt 503, a first motor 504, an air source 505, a second motor 601, a second driving wheel 602, a second driven wheel 603 and a second belt 604.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.
In the description of the present utility model, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present utility model and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present utility model.
In the description of the present utility model, the meaning of a number is one or more, the meaning of a number is two or more, and greater than, less than, exceeding, etc. are understood to exclude the present number, and the meaning of a number is understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present utility model, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present utility model can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
In the description of the present utility model, the descriptions of the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model.
Referring to fig. 2 and 3, a suction cup 102 according to an embodiment of the first aspect of the present utility model includes a vacuum channel, a blowing channel. The vacuum channel is characterized in that two ends of the vacuum channel are communicated, the air inlet of the vacuum channel is a first air inlet 201, the air outlet of the vacuum channel is a first air outlet 301, the air inlet of the air blowing channel is a second air inlet 202, the air outlet of the air blowing channel is a second air outlet 203, the second air inlet 202 and the second air outlet 203 are positioned on different sides of the sucker, the first air inlet 201 and the second air outlet 203 are arranged on the same side of the sucker 102, and the second air outlet 203 is arranged around the first air inlet 201.
In summary, when the wafer is placed on the chuck 102, the second air inlet 202 is connected to the air source to start air intake, and air is blown out from the second air outlet 203, so as to generate bernoulli effect, so that the wafer with large warpage is primarily adsorbed on the chuck 102, and the wafer is relatively flat; the first air outlet 301 is connected to a vacuum pump to perform vacuum pumping, and the first air inlet 201 starts to suck air to further adsorb the wafer which is primarily adsorbed on the chuck 102, so as to realize adsorption and fixation of the wafer with large warpage.
Referring to fig. 2, in some embodiments of the utility model, the suction cup 102 comprises: a main body 204 having an outer surface including an adsorption surface on which the first air inlet 201 is provided; the protruding portion 205 is fixedly connected to the adsorption surface and protrudes relative to the adsorption surface, the protruding portion 205 is annular and surrounds the first air inlet 201, and a gap between the outer edge of the protruding portion 205 and the adsorption surface is the second air outlet 203. Therefore, both adsorption forces can act on the adsorption surface of the sucker 102 without mutual interference, and the adsorption effect on the wafer is better.
Referring to fig. 2, in some embodiments of the present utility model, the suction cup 102 further includes a plurality of peripheral portions 206, the peripheral portions 206 being fixedly connected with the main body portion 204, the plurality of peripheral portions 206 being disposed around the main body portion 204, adjacent peripheral portions 206 being disposed at intervals; the top surface of the peripheral portion 206 and the top surface of the boss 205 are both planar, and the top surface of the peripheral portion 206 is flush with the top surface of the boss 205. Therefore, the wafer can be stably placed on the sucker 102, and the first air inlet 201 is vacuumized and needs less sucked air due to the convex part 205, so that the wafer can be more effectively sucked.
Referring to fig. 1 and 4, the prealignment mechanism according to the second aspect of the present utility model includes the suction cup 102 described above, and further includes a base 106, a rotary motion module 101, a lifting motion module 104, a robot 103, and an edge finding sensor 100. The rotary motion module 101 is connected with the base 106 and is used for driving the sucker 102 to rotate relative to the base 106. The lifting movement module 104 is connected with the rotary movement module 101 and is used for driving the rotary movement module 101 to move along the plane direction where the suction surface of the vertical suction cup 102 is located. The robot 103 has suction holes capable of sucking the wafer, and is movable with respect to the base 106 to place the wafer on the chuck 102 or to remove the wafer from the chuck 102. The edge-seeking sensor 100 is fixed to the base 106, and is located at a side portion of the chuck 102, for detecting an edge of the wafer sucked by the chuck 102.
In summary, the robot 103 adsorbs the wafer from the wafer cassette, the lifting motion module 104 adjusts the height of the chuck 102, and the robot 103 places the wafer on the chuck 102; the second air inlet 202 is connected with an air source to start blowing air from the second air outlet 203, so that Bernoulli effect is generated, and the wafer with large warpage is primarily adsorbed on the sucker 102, so that the wafer is relatively flat; the first air outlet 301 is connected with a vacuum pump to vacuumize, the first air inlet 201 starts to suck air, and the wafer which is preliminarily adsorbed on the sucker 102 is further adsorbed; the rotary motion module 101 drives the wafer to rotate by a unit angle; the edge-seeking sensor 100 collects data of different angles, calculates the position and the angle offset of the circle center of the wafer relative to the rotation center of the sucker, and judges the position of the wafer relative to the sucker 102, so that the wafer with large warpage can be adsorbed, the wafer can be adsorbed and fixed, and the subsequent alignment procedure of the wafer is facilitated.
Referring to fig. 1 and 4, in some embodiments of the present utility model, the plane of the edge-seeking sensor optical path 107 is perpendicular to the plane of the suction surface of the suction cup 102, and the rotation axis of the suction cup 102 is located in the plane of the optical path 107. Therefore, the offset of the plane of the edge-seeking sensor optical path 107 relative to the rotation center of the chuck 102 is zero, so that when the position and the angular offset of the circle center of the wafer relative to the rotation center of the chuck 102 are detected, whether the circle center of the wafer is coincident with the rotation center of the chuck 102 can be better judged.
Referring to fig. 5, in some embodiments of the present utility model, the rotary motion module 101 includes a first motor 504, a first driving wheel 502, a first driven wheel 501, and a first belt 503, the first driving wheel 502 is mounted on the first motor 504, the first driven wheel 501 is fixedly connected to the suction cup 102, the first belt 503 surrounds the first driving wheel 502 and the first driven wheel 501, and the first motor 504 is used for driving the first driving wheel 502 to rotate so as to rotate the first driven wheel 501. Therefore, the first motor 504 is started to enable the first driving wheel 502 to rotate, and then the first belt 503 drives the first driven wheel 501 to rotate, so that the sucker 102 connected to the first driven wheel 501 rotates, and the rotary motion module 101 is simple and traditional in structure, can be placed in the whole pre-alignment mechanism better, and is convenient for subsequent use and maintenance.
It should be noted that the rotation module may also be a common transmission manner such as a worm gear transmission, a chain transmission, etc., and the purpose of the rotation module is to drive the suction cup 102 to rotate.
Referring to fig. 1 and 6, in some embodiments of the utility model, the pre-alignment mechanism further comprises a horizontally disposed rail 105, the rail 105 being fixed to the base 106; the manipulator 103 is arranged above the sucker 102, one end of the manipulator 13 is provided with the adsorption hole, air is sucked into the adsorption hole to generate vacuum for adsorbing the wafer, and the other end of the manipulator is slidably arranged on the guide rail 105; the pre-alignment mechanism further comprises a translation module connected with the manipulator 103 for driving the manipulator 103 to move along the guide rail 105. Therefore, the manipulator 103 can move along the horizontal direction of the guide rail 105, so that the wafer can be conveniently adsorbed from the wafer material box and placed on the sucker 102, and the position of the wafer can be horizontally moved and adjusted when the wafer is placed, so that the wafer alignment process is facilitated.
Referring to fig. 1 and 6, in some embodiments of the present utility model, the translation module includes a second motor 601, a second driving wheel 602, a second driven wheel 603, and a second belt 604, the second driving wheel 602 is mounted on the second motor 601, the second driven wheel 603 is fixed relative to the base 106, the second belt 604 surrounds the second driving wheel 602 and the second driven wheel 603, the manipulator 103 is connected to the second belt 604, and the second motor 601 is used to drive the second driving wheel 602 to rotate so as to move the second belt 604. Therefore, the translation module is simple and traditional in structure, can be placed in the whole prealignment mechanism better, and is convenient for subsequent use and maintenance.
It should be noted that, the translation module may also be a common transmission mode such as a screw transmission, a gear transmission, a chain transmission, or a common driving mode such as hydraulic driving, pneumatic driving, etc., and the purpose of the translation module is to drive the manipulator 103 to perform linear motion.
Referring to fig. 1 and 6, in some embodiments of the present utility model, two translation modules are provided, and two manipulators 103 are provided, and each translation module drives one manipulator 103 to move. Therefore, the two translation module second motors 601 respectively drive the second driving wheels 602 to rotate, the second driving wheels 602 then drive the second belt 604 connected with the second driving wheels to rotate, and the movement track of the second belt 604 is adjusted by using the second driven wheels 603, so that the manipulator 103 connected to the second belt 604 performs linear movement. The two manipulators 103 are not interfered with each other, so that when one manipulator 103 moves to the wafer material box to adsorb wafers, the other manipulator 103 can perform the process of placing the adsorbed wafers on the sucker 102, the work efficiency is improved due to the design of the two manipulators 103 which are not interfered with each other, and the wafers can be conveniently subjected to a faster adsorption alignment process.
In some embodiments of the present utility model, a vacuum sensor is connected to the first air outlet 301 of the vacuum channel. Therefore, in the vacuumizing process, whether the pressure value of the vacuum reaches the requirement or not can be detected through the vacuum sensor, and the wafer adsorption effect can be judged more intuitively.
The embodiments of the present utility model have been described in detail with reference to the accompanying drawings, but the present utility model is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Claims (10)
1. The sucking disc, its characterized in that, the sucking disc includes:
The air inlet of the vacuum channel is a first air inlet, and the air outlet of the vacuum channel is a first air outlet;
The air inlet of the air blowing channel is a second air inlet, the air outlet of the air blowing channel is a second air outlet, and the second air inlet and the second air outlet are positioned on different sides of the sucker;
The first air inlet and the second air outlet are arranged on the same side of the sucker, the second air outlet is arranged around the first air inlet, one air can be sucked into the vacuum channel from the first air inlet, so that the sucker adsorbs a workpiece, and the other air can be blown out from the second air outlet, so that the sucker adsorbs the workpiece.
2. The suction cup as set forth in claim 1, wherein the suction cup includes:
a main body part, the outer surface of which comprises an adsorption surface, wherein the first air inlet is arranged on the adsorption surface;
The protruding portion is fixedly connected to the adsorption surface and protrudes relative to the adsorption surface, the protruding portion is annular and surrounds the first air inlet, and a gap between the outer edge of the protruding portion and the adsorption surface is the second air outlet.
3. The suction cup as set forth in claim 2 further comprising a plurality of peripheral portions fixedly connected to said body portion, a plurality of said peripheral portions being disposed about said body portion, adjacent said peripheral portions being spaced apart;
The top surface of the peripheral part and the top surface of the protruding part are both plane, and the top surface of the peripheral part is flush with the top surface of the protruding part.
4. A pre-alignment mechanism, comprising:
A base;
a suction cup according to any one of claims 1 to 3;
The rotary motion module is connected with the base and is used for driving the sucker to rotate relative to the base;
The lifting movement module is connected with the rotary movement module and used for driving the rotary movement module to move along the direction vertical to the plane where the sucker is positioned;
A robot having a suction hole capable of sucking a wafer, the robot being movable with respect to the base so as to suck the wafer onto the chuck or suck the wafer away from the chuck;
The edge searching sensor is fixed on the base and is positioned at the side part of the sucker, and the edge searching sensor is used for detecting the edge of the wafer adsorbed by the sucker.
5. The prealignment mechanism of claim 4, wherein a plane of the optical path of the edge-seeking sensor is perpendicular to a plane of the suction surface of the suction cup, and the rotation axis of the suction cup is located in the plane of the optical path.
6. The prealignment mechanism according to claim 4, wherein the rotary motion module comprises a first motor, a first driving wheel, a first driven wheel and a first belt, the first driving wheel is mounted on the first motor, the first driven wheel is fixedly connected with the suction cup, the first belt surrounds the first driving wheel and the first driven wheel, and the first motor is used for driving the first driving wheel to rotate so as to enable the first driven wheel to rotate.
7. The pre-alignment mechanism of claim 4, further comprising a horizontally disposed rail, the rail being secured to the base; the manipulator is arranged above the sucker, one end of the manipulator is provided with the adsorption hole, air is sucked from the adsorption hole to generate vacuum for adsorbing the wafer, and the other end of the manipulator is slidably arranged on the guide rail;
The pre-alignment mechanism further comprises a translation module, wherein the translation module is connected with the manipulator and is used for driving the manipulator to move along the guide rail.
8. The prealignment mechanism of claim 7, wherein the translation module comprises a second motor, a second driving wheel, a second driven wheel and a second belt, the second driving wheel is mounted on the motor, the second driven wheel is relatively fixed with the base, the second belt surrounds the second driving wheel and the second driven wheel, the manipulator is connected with the second belt, and the second motor is used for driving the second driving wheel to rotate so as to enable the second belt to move.
9. The prealignment mechanism of claim 7, wherein there are two translation modules, and there are two manipulators, and each translation module drives one manipulator to move.
10. The pre-alignment mechanism of claim 4, further comprising a vacuum sensor coupled to the first air outlet, the vacuum sensor configured to detect a vacuum level of the vacuum channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323142247.0U CN221407272U (en) | 2023-11-21 | 2023-11-21 | Sucking disc and pre-alignment mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323142247.0U CN221407272U (en) | 2023-11-21 | 2023-11-21 | Sucking disc and pre-alignment mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221407272U true CN221407272U (en) | 2024-07-23 |
Family
ID=91921117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323142247.0U Active CN221407272U (en) | 2023-11-21 | 2023-11-21 | Sucking disc and pre-alignment mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221407272U (en) |
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2023
- 2023-11-21 CN CN202323142247.0U patent/CN221407272U/en active Active
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