CN220491863U - Positioning and conveying device - Google Patents

Abstract

The utility model discloses a positioning conveying device which is applied to nondestructive cutting of silicon wafers and comprises a mounting plate and a conveying mechanism, wherein a first driving component is arranged on the mounting plate, the conveying mechanism comprises a supporting plate component, a driving wheel component, a driven wheel component and a conveying belt, the driving wheel component and the driven wheel component are respectively arranged at two ends of the supporting plate component, the conveying belt is respectively in transmission fit with the driving wheel component and the driven wheel component, a cavity is arranged in the supporting plate component, a suction hole which can be communicated with the cavity is formed in the conveying belt, the supporting plate component can be connected with external negative pressure equipment to enable the cavity to form negative pressure, and the first driving component is in driving connection with the driving wheel component to drive the conveying belt to move. When the device is used, the suction holes are used for adsorbing the silicon wafers on the conveying belt by utilizing the negative pressure of the cavity, so that the silicon wafers are prevented from moving in conveying, the subsequent positioning is convenient, and the production and the application are convenient.

Description

Positioning and conveying device

Technical Field

The utility model relates to the technical field of production equipment, in particular to a positioning and conveying device.

Background

Silicon wafers are main production materials in the fields of semiconductors and photovoltaics, and the quality of the silicon wafers directly influences the conversion efficiency of solar cells. The existing silicon wafer processing is generally to process the silicon wafer by adopting a laser non-destructive cutting mode, and the thermal influence of the cut silicon wafer is extremely small and the precision is high. Before cutting processing of a silicon wafer, the existing mode generally adopts a conveying belt to convey the silicon wafer, the structure of a conveying device is simple, deviation of the silicon wafer easily occurs in the conveying process, and the subsequent cutting positioning is affected, so that the processing quality of the silicon wafer is affected, and the production and the application are inconvenient.

Disclosure of Invention

The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, the utility model provides a positioning and conveying device which is applied to nondestructive cutting of silicon wafers, and utilizes the negative pressure of a cavity to enable a suction hole to adsorb the silicon wafers on a conveying belt, so that the silicon wafers are prevented from moving in conveying, the subsequent positioning is convenient, and the production and the application are convenient.

According to the positioning conveying device disclosed by the embodiment of the utility model, the positioning conveying device is applied to nondestructive cutting of silicon wafers and comprises a mounting plate and a conveying mechanism, wherein a first driving assembly is arranged on the mounting plate, the conveying mechanism comprises a supporting plate assembly, a driving wheel assembly, a driven wheel assembly and a conveying belt, the driving wheel assembly and the driven wheel assembly are respectively arranged at two ends of the supporting plate assembly, the conveying belt is respectively in transmission fit with the driving wheel assembly and the driven wheel assembly, a cavity is arranged in the supporting plate assembly, a suction hole which can be communicated with the cavity is formed in the conveying belt, the supporting plate assembly can be connected with external negative pressure equipment so that negative pressure can be formed in the cavity, and the first driving assembly is in driving connection with the driving wheel assembly so as to drive the conveying belt to move.

The positioning and conveying device provided by the embodiment of the utility model has at least the following beneficial effects: when the silicon wafer conveying device is used, a silicon wafer is placed on the conveying belt, the first driving assembly drives the conveying belt to move so as to convey the silicon wafer, the supporting plate assembly is connected with external negative pressure equipment, the cavity forms negative pressure, and the suction hole on the conveying belt is communicated with the cavity so as to form suction at the suction hole, so that the silicon wafer is adsorbed on the conveying belt, the silicon wafer is prevented from moving in conveying, the follow-up positioning is facilitated, and the production and the application are facilitated.

According to some embodiments of the utility model, two conveying mechanisms are arranged, the two conveying mechanisms are arranged side by side at intervals parallel to the conveying direction, and the first driving assembly can drive the two conveying mechanisms to synchronously act.

According to some embodiments of the present utility model, the driving wheel assemblies of the two conveying mechanisms are linked through a coupling, one of the two driving wheel assemblies is connected with a synchronous pulley assembly, and the first driving assembly is in driving connection with the corresponding driving wheel assembly through the synchronous pulley assembly.

According to some embodiments of the utility model, the positioning and conveying device further comprises an alignment platform and a mounting base, wherein the alignment platform is arranged on the mounting base, the mounting plate is arranged on the alignment platform, and the alignment platform can drive the mounting plate to move horizontally and rotate around the vertical direction.

According to some embodiments of the utility model, a light source board is provided on the mounting board, the light source board being located below the pallet assembly.

According to some embodiments of the utility model, the pallet assembly is laterally provided with auxiliary positioning blocks for assisting visual inspection.

According to some embodiments of the utility model, a waterproof board is arranged on the lower side of the mounting plate, and the waterproof board is located on the side of the alignment platform and can shield the alignment platform.

According to some embodiments of the utility model, the positioning and conveying device further comprises a limiting mechanism, wherein the limiting mechanism is connected to the mounting plate and is arranged corresponding to the conveying mechanism, and the limiting mechanism can limit the position of the silicon wafer on the conveying belt.

According to some embodiments of the utility model, the limiting mechanism comprises two limiting plates and a second driving assembly, wherein the limiting plates are respectively positioned at two sides of the silicon wafer along the conveying direction, and the second driving assembly can respectively drive the two limiting plates to move relatively.

According to some embodiments of the utility model, the limiting plate is rotatably connected with a roller for contacting with the silicon wafer.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

FIG. 1 is a schematic view of a positioning and conveying device according to an embodiment of the present utility model;

FIG. 2 is a schematic side view of the positioning conveyor of FIG. 1;

fig. 3 is a schematic structural view of the limiting mechanism in fig. 1.

Reference numerals:

mounting plate 100, first drive assembly 110, timing pulley assembly 120, light source plate 130, waterproof plate 140;

conveying mechanism 200, pallet assembly 210, pipe joint 211, auxiliary positioning block 212, driving wheel assembly 220, coupling 221, driven wheel assembly 230, conveying belt 240 and suction hole 241;

the limiting mechanism 300, the limiting plate 310, the roller 311 and the second driving component 320;

alignment platform 400 and mounting base 500.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

In the description of the present utility model, it should be understood that if an orientation or positional relationship such as upper, lower, front, rear, left, right, etc. is referred to in the description of the present utility model, it is merely for convenience of description and simplification of the description, and does not indicate or imply that the apparatus or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

In the description of the present utility model, if a number, greater than, less than, exceeding, above, below, within, etc., words are present, wherein the meaning of a number is one or more, and the meaning of a number is two or more, greater than, less than, exceeding, etc. are understood to not include the present number, and above, below, within, etc. are understood to include the present number.

The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present utility model, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present utility model can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.

Referring to fig. 1 and 2, a positioning and conveying device is applied to nondestructive cutting of silicon wafers, and comprises a mounting plate 100 and a conveying mechanism 200, wherein a first driving component 110 is arranged on the mounting plate 100, the conveying mechanism 200 comprises a supporting plate component 210, a driving wheel component 220, a driven wheel component 230 and a conveying belt 240, the driving wheel component 220 and the driven wheel component 230 are respectively arranged at two ends of the supporting plate component 210, the conveying belt 240 is respectively in transmission fit with the driving wheel component 220 and the driven wheel component 230, a cavity is arranged in the supporting plate component 210, a suction hole 241 which can be communicated with the cavity is arranged on the conveying belt 240, the supporting plate component 210 can be connected with external negative pressure equipment to enable the cavity to form negative pressure, and the first driving component 110 is in driving connection with the driving wheel component 220 to drive the conveying belt 240 to move.

It will be appreciated that, as shown in fig. 1 and 2, the driving wheel assembly 220 is disposed at the rear end of the pallet assembly 210, the driven wheel assembly 230 is disposed at the front end of the pallet assembly 210, the conveyor belt 240 is respectively wound around the driving wheel assembly 220 and the driven wheel assembly 230, a plurality of suction holes 241 are formed in the conveyor belt 240, the pallet assembly 210 is disposed between upper and lower belt layers of the conveyor belt 240, a cavity (not shown) is formed in the pallet assembly 210, and a pipe joint 211 for connecting with external negative pressure equipment is formed at a side portion of the pallet assembly 210. When the silicon wafer conveying device is used, silicon wafers are placed on the conveying belt 240, the first driving assembly 110 drives the conveying belt 240 to move so as to convey the silicon wafers along the front-rear direction, the supporting plate assembly 210 is connected with external negative pressure equipment through the pipe joint 211, the external negative pressure equipment can be a vacuum pump or a negative pressure fan and the like, the cavity forms negative pressure, and the suction hole 241 on the conveying belt 240 is communicated with the cavity so as to form suction force at the suction hole 241, so that the silicon wafers are adsorbed on the conveying belt 240, the silicon wafer conveying device is beneficial to avoiding silicon wafer movement in conveying, improving the stability of silicon wafer conveying, facilitating subsequent positioning and production and application. In practical applications, the specific structures of the mounting plate 100 and the conveying mechanism 200 may be set according to practical requirements, and will not be described in detail herein.

In some embodiments, two conveying mechanisms 200 are provided, and the two conveying mechanisms 200 are arranged side by side at intervals parallel to the conveying direction, and the first driving assembly 110 can drive the two conveying mechanisms 200 to act synchronously.

It will be understood that, as shown in fig. 1, the conveying direction of the silicon wafer is a front-back direction, and the two conveying mechanisms 200 are parallel to the front-back direction and are arranged side by side along the left-right direction at intervals, when in use, the left and right sides of the silicon wafer are respectively placed on the conveying belts 240 of the left and right conveying mechanisms 200, and the first driving assembly 110 drives the two conveying mechanisms 200 to synchronously act so as to convey the silicon wafer. Through setting up two conveying mechanism 200 to can adsorb the left and right sides portion of silicon chip, improve the stability of carrying, and two conveying mechanism 200 interval set up, make between form the clearance to the silicon chip middle part, reduce the contact with the silicon chip, reduce the unloading difficulty that causes because of the middle part laminating conveyer belt 240 of silicon chip, the silicon chip of being convenient for uses. In practical application, the conveying mechanism 200 may be further provided with a plurality of conveying mechanisms, and the specific number of the conveying mechanisms can be set according to practical use requirements.

Further, the driving wheel assemblies 220 of the two conveying mechanisms 200 are linked through a coupling 221, one of the two driving wheel assemblies 220 is connected with the synchronous pulley assembly 120, and the first driving assembly 110 is in driving connection with the corresponding driving wheel assembly 220 through the synchronous pulley assembly 120.

Specifically, as shown in fig. 1 and 2, the left driving wheel assembly 220 and the right driving wheel assembly 220 are connected and linked through a coupling 221, the synchronous pulley assembly 120 comprises a synchronous belt and a synchronous pulley, the first driving assembly 110 comprises a motor and is in driving connection with the left driving wheel assembly 220 through the synchronous pulley assembly 120, so as to drive the left driving wheel assembly 220 to rotate, and the right driving wheel assembly 220 is linked and synchronously moved through the coupling 221, so that the left conveying mechanism 200 and the right conveying mechanism synchronously act. In practical application, besides the above structure, two driving motors may be further provided and connected to the two driving wheel assemblies 220, and the two driving motors are synchronously driven to make the two conveying mechanisms 200 synchronously operate, which may be set according to practical use requirements.

In some embodiments, the positioning and conveying device further includes an alignment platform 400 and a mounting base 500, the alignment platform 400 is disposed on the mounting base 500, the mounting plate 100 is disposed on the alignment platform 400, and the alignment platform 400 can drive the mounting plate 100 to move horizontally and rotate around the vertical direction.

It will be appreciated that, as shown in fig. 1 and 2, the alignment platform 400 is disposed on the upper side of the mounting base 500, and the mounting board 100 is disposed on the upper side of the alignment platform 400. When the device is used, a visual detection system (not shown in the figure) is arranged above the conveying mechanism 200, the position of the silicon wafer on the conveying belt 240 is captured through the visual detection system, the left and right directions are taken as the X axis, the front and back directions are taken as the Y axis, the up and down directions are taken as the Z axis, and the alignment platform 400 is utilized to drive the mounting plate 100 to move along the X axis direction, move along the Y axis direction and rotate around the Z axis, so that the silicon wafer placed on the conveying belt 240 is positioned and corrected, the rapid positioning of the silicon wafer is facilitated, the higher positioning precision can be obtained, and the subsequent laser nondestructive cutting is convenient to use. In practical application, the alignment platform 400 may be an XXY automatic alignment platform or a UVW automatic alignment platform, which may be set according to practical needs, and since the specific construction and working principles of the alignment platform 400 in the embodiment of the present utility model are known to those skilled in the art, they will not be described in detail herein.

Further, the mounting board 100 is provided with a light source board 130, and the light source board 130 is located below the pallet assembly 210. It can be appreciated that, as shown in fig. 1 and 2, by arranging the light source plate 130 below the pallet assembly 210, the light source plate 130 is utilized to emit light to irradiate the silicon wafer above, so that the vision detection system is convenient to accurately capture the silicon wafer, and the use is convenient. In practical application, the light source plate 130 can emit light to irradiate the silicon wafer through a plurality of lamp beads, and the specific changes can be correspondingly changed according to the practical use requirement.

Further, auxiliary positioning blocks 212 for assisting visual inspection are provided on the sides of the pallet assembly 210. It can be understood that, as shown in fig. 1 and 2, four auxiliary positioning blocks 212 are provided, two auxiliary positioning blocks 212 are provided on the left side of the left side supporting plate assembly 210, two auxiliary positioning blocks 212 are provided on the right side of the right side supporting plate assembly 210 to be distributed in four corners, and are matched with the light source plate 130 below to detect and capture the four corner positions of the silicon wafer, so that the position condition of the silicon wafer can be conveniently detected. In practical application, the specific structure, the number of the auxiliary positioning blocks 212, etc. can also be changed according to the practical use requirement.

Further, the lower side of the mounting plate 100 is provided with a waterproof board 140, and the waterproof board 140 is located at the side of the alignment platform 400 and can shield the alignment platform 400. It can be understood that, as shown in fig. 1 and fig. 2, the waterproof board 140 is located at the front side of the alignment platform 400 and can partially shield the alignment platform 400, the front side of the conveying mechanism 200 is the output side of the silicon wafer, and is abutted to the laser cutting device (not shown in the figure), when the silicon wafer is subjected to laser nondestructive cutting, the laser cutting device can cool the cutting position by using water, and by setting the waterproof board 140, the possibility that the water is sputtered to the alignment platform 400 to cause influence is reduced, the reliability of the operation of the alignment platform 400 is improved, and the use is convenient. In practical applications, the specific structure of the waterproof board 140 can be set according to practical requirements.

In some embodiments, the positioning and conveying device further comprises a limiting mechanism 300, wherein the limiting mechanism 300 is connected to the mounting plate 100 and is arranged corresponding to the conveying mechanism 200, and the limiting mechanism 300 can limit the position of the silicon wafer on the conveying belt 240.

It can be understood that, as shown in fig. 1 and 2, by setting the limiting mechanism 300, when in use, the position of the silicon wafer on the conveyor belt 240 can be initially limited by the limiting mechanism 300, so that the position deviation of the silicon wafer is reduced, the displacement correction amount of the subsequent alignment platform 400 is reduced, and the subsequent alignment platform 400 is convenient to rapidly and accurately position the silicon wafer and is convenient to use.

Specifically, the limiting mechanism 300 includes two limiting plates 310 and a second driving assembly 320, the limiting plates 310 are respectively located at two sides of the silicon wafer along the conveying direction, and the second driving assembly 320 can respectively drive the two limiting plates 310 to move relatively.

It can be understood that, as shown in fig. 1 and 3, the second driving assembly 320 includes two driving cylinders, and two limiting plates 310 are respectively disposed on the left and right sides of the mounting plate 100, and the two driving cylinders are respectively connected with the two limiting plates 310 in a driving manner so as to respectively drive the two limiting plates 310 to move left and right relatively. When the device is used, the silicon wafer is conveyed in the front-back direction, the two limiting plates 310 are respectively driven to move relatively in the left-right direction through the second driving assembly 320, and the limiting plates 310 are utilized to drive the silicon wafer to move in the left-right direction, so that the left-right position of the silicon wafer is initially corrected, and the left-right relative position of the silicon wafer on the conveying belt 240 is limited. In practical application, in addition to the above structure, the limiting mechanism 300 may further include one or two inclined guide blocks, and the guiding surface of the inclined guide block is used to contact and guide the silicon wafer, so that the silicon wafer is offset left and right relative to the conveyor belt 240, and the left and right relative positions of the silicon wafer on the conveyor belt 240 are limited, which can be set correspondingly according to practical use requirements.

Further, a roller 311 for contacting with the silicon wafer is rotatably connected to the limiting plate 310. It can be understood that, as shown in fig. 1 and 3, two rollers 311 are provided on each limiting plate 310, and the two rollers 311 are disposed at intervals on the front and rear sides of the limiting plate 310 along the front and rear directions. When in use, the roller 311 is in contact with the silicon wafer, so that the contact friction between the roller 311 and the silicon wafer is reduced, the possibility of damaging the silicon wafer is reduced, and the use is convenient. In practical application, the specific number and distribution positions of the rollers 311 can be set according to the practical use requirement.

The embodiments of the present utility model have been described in detail with reference to the accompanying drawings, but the present utility model is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present utility model.

Claims (10)

1. The utility model provides a location conveyor is applied to silicon chip nondestructive cut which characterized in that includes:

the mounting plate is provided with a first driving component;

the conveying mechanism comprises a supporting plate assembly, a driving wheel assembly, a driven wheel assembly and a conveying belt, wherein the driving wheel assembly and the driven wheel assembly are respectively arranged at two ends of the supporting plate assembly, the conveying belt is respectively in transmission fit with the driving wheel assembly and the driven wheel assembly, a cavity is formed in the supporting plate assembly, a suction hole which can be communicated with the cavity is formed in the conveying belt, the supporting plate assembly can be connected with external negative pressure equipment so that negative pressure can be formed in the cavity, and the first driving assembly is in driving connection with the driving wheel assembly so as to drive the conveying belt to move.

2. The positioning and conveying device according to claim 1, wherein two conveying mechanisms are arranged, the two conveying mechanisms are arranged side by side at intervals parallel to the conveying direction, and the first driving assembly can drive the two conveying mechanisms to synchronously act.

3. The positioning and conveying device according to claim 2, wherein the driving wheel assemblies of the two conveying mechanisms are linked through a coupling, one of the two driving wheel assemblies is connected with a synchronous pulley assembly, and the first driving assembly is in driving connection with the corresponding driving wheel assembly through the synchronous pulley assembly.

4. The positioning and conveying device according to claim 1, further comprising an alignment platform and a mounting base, wherein the alignment platform is disposed on the mounting base, the mounting plate is disposed on the alignment platform, and the alignment platform can drive the mounting plate to move horizontally and rotate around a vertical direction.

5. The positioning and transporting device of claim 4, wherein a light source board is provided on the mounting plate, the light source board being located below the pallet assembly.

6. The positioning and conveying device according to claim 5, wherein auxiliary positioning blocks for assisting visual inspection are arranged on the side of the supporting plate assembly.

7. The positioning and conveying device according to claim 4, wherein a waterproof plate is arranged on the lower side of the mounting plate, and the waterproof plate is located on the side of the alignment platform and can shield the alignment platform.

8. The positioning and transporting device according to claim 1 or 4, further comprising a limiting mechanism connected to the mounting plate and disposed in correspondence with the transporting mechanism, the limiting mechanism being capable of limiting the position of the silicon wafer on the transporting belt.

9. The positioning and conveying device according to claim 8, wherein the limiting mechanism comprises two limiting plates and a second driving assembly, the limiting plates are respectively positioned on two sides of the silicon wafer along the conveying direction, and the second driving assembly can respectively drive the two limiting plates to move relatively.

10. The positioning and conveying device according to claim 9, wherein the limiting plate is rotatably connected with a roller for contacting with the silicon wafer.