CN217788363U - Positioning device for wafer silicon chip - Google Patents
Positioning device for wafer silicon chip Download PDFInfo
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- CN217788363U CN217788363U CN202221680710.XU CN202221680710U CN217788363U CN 217788363 U CN217788363 U CN 217788363U CN 202221680710 U CN202221680710 U CN 202221680710U CN 217788363 U CN217788363 U CN 217788363U
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- adsorption piece
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- positioning
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Abstract
The utility model discloses a positioning device for wafer silicon wafers, which comprises a mechanical arm, wherein the mechanical arm comprises a horizontal moving mechanism, an adsorption component arranged on the horizontal moving mechanism, a first rotating mechanism connected with the horizontal moving mechanism and a lifting mechanism connected with the first rotating mechanism; the calibration mechanism comprises a fixed support, a second rotating mechanism arranged on the fixed support, an adsorption piece connected with the second rotating mechanism and used for adsorbing the wafer silicon chip, and a visual positioning assembly arranged on the fixed support and used for acquiring the position information of the wafer silicon chip on the adsorption piece, wherein a target position of a positioning straight edge is preset in the visual positioning assembly; and the control mechanism is connected with the mechanical arm and the calibration mechanism and is used for controlling the mechanical arm and the rotation mechanism to adjust the position of the wafer silicon wafer, so that the position of the wafer silicon wafer on the adsorption piece is superposed with a preset target position. The positioning device can realize automatic positioning of the wafer silicon wafer, and improve subsequent loading efficiency.
Description
Technical Field
The utility model relates to a positioner especially relates to a positioner for wafer silicon chip.
Background
Before sputtering the wafer silicon wafer, the wafer silicon wafer needs to be accurately installed in the loading cavity. The moving space in the loading cavity is limited, and the position of the wafer silicon chip is difficult to adjust. For example, the gap between the loaded wafer and the inner wall of the loading cavity is less than or equal to 1mm after the existing wafer silicon wafer is loaded. When the loading platform is used for conveying and loading the wafer silicon slice, the wafer silicon slice is often damaged due to inaccurate positioning or collision with the inner wall of the loading cavity.
Disclosure of Invention
In order to overcome the defects in the prior art, the embodiment of the utility model provides a positioner for wafer silicon chip, this positioner can realize the automatic positioning to the wafer silicon chip, make its and the position that loads in the chamber corresponding, improve subsequent loading efficiency, avoid follow-up wafer silicon chip to load the in-process and take place the damage.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a positioning device for a wafer silicon wafer, wherein the edge of the wafer silicon wafer is provided with a positioning straight edge, and the positioning device comprises:
the mechanical arm comprises a horizontal moving mechanism, an adsorption component arranged on the horizontal moving mechanism, a first rotating mechanism which is connected with the horizontal moving mechanism and can drive the horizontal moving mechanism to rotate, and a lifting mechanism which is connected with the first rotating mechanism and can drive the first rotating mechanism to move along the vertical direction;
the calibration mechanism comprises a fixed support, a second rotating mechanism arranged on the fixed support, an adsorption piece connected with the second rotating mechanism and used for adsorbing the wafer silicon chip, and a visual positioning assembly arranged on the fixed support and used for acquiring the position information of the wafer silicon chip on the adsorption piece, wherein a target position of a positioning straight edge is preset in the visual positioning assembly;
and the control mechanism is connected with the mechanical arm and the calibration mechanism and is used for controlling the mechanical arm and the rotation mechanism to adjust the position of the wafer silicon wafer, so that the position of the wafer silicon wafer on the adsorption piece is superposed with a preset target position.
In the above technical scheme, the visual positioning assembly comprises a camera arranged above the adsorption piece and a light source surrounding the adsorption piece.
In the above technical solution, the light source is generated by an annular lamp, and an upper surface of the annular lamp is lower than an upper surface of the adsorbing member.
In the above technical scheme, the adsorption member is cylindrical and is located in the center of the annular lamp.
In the above technical scheme, a first vacuum suction pipe is arranged in the adsorption piece.
In the technical scheme, the adsorption component comprises an adsorption sheet, wherein the adsorption sheet is provided with a positioning column and a second vacuum suction pipe communicated with an air hole in the adsorption sheet.
In the above technical solution, the second rotating device includes a rotating shaft disposed along a vertical direction, and a servo motor connected to the rotating shaft.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
1. the utility model discloses in through predetermineeing target position in the vision positioning component, this target position's center and location straight flange respectively with the center and the location straight flange one-to-one that load the chamber, through manipulator and vision positioning component's cooperation, the center that utilizes the removal of manipulator to make the wafer silicon chip coincides mutually with target position's center, the location straight flange that utilizes second rotary mechanism's rotation to make the wafer silicon chip coincides mutually with target position's location straight flange to guarantee that follow-up loading is more accurate, avoid the damage of wafer silicon chip.
2. And the control mechanism is connected with the mechanical arm and the calibration mechanism, so that automatic control is realized, and the loading efficiency is improved.
3. The visual positioning assembly comprises a camera arranged above the adsorption piece and a light source surrounding the outer side of the adsorption piece, so that the camera can acquire clear and effective images, and the accuracy of the identification position is improved; and the upper surface of the annular lamp is lower than the upper surface of the adsorption piece, so that interference generated in the process that the wafer silicon chip is moved above the adsorption piece by a mechanical arm is avoided.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural view of a positioning device in an embodiment of the present invention;
FIG. 2 is a schematic view of a robot arm according to an embodiment of the present invention;
FIG. 3 is a schematic view of an embodiment of the present invention;
fig. 4 is a schematic diagram of a wafer according to an embodiment of the present invention.
Reference numerals of the above figures: 1. a robot arm; 11. a horizontal movement mechanism; 12. a first rotating mechanism; 13. a lifting mechanism; 14. an adsorption component; 2. a calibration mechanism; 21. a fixed bracket; 22. a second rotating mechanism; 23. an adsorbing member; 24. a camera; 25. an annular light fixture; 3. a wafer silicon wafer; 31. positioning a straight edge; 4. a fixing sheet; 5. and (7) a material platform.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The first embodiment is as follows: referring to fig. 1 to 3, a positioning device for a wafer 3, the edge of the wafer is provided with a positioning straight edge 31, the positioning device includes:
the mechanical arm 1 comprises a horizontal moving mechanism 11, an adsorption component 14 arranged on the horizontal moving mechanism 11, a first rotating mechanism 12 which is connected with the horizontal moving mechanism 11 and can drive the horizontal moving mechanism to rotate, and a lifting mechanism 13 which is connected with the first rotating mechanism 12 and can drive the first rotating mechanism to move along the vertical direction;
the calibration mechanism 2 comprises a fixed support 21, a second rotating mechanism 22 arranged on the fixed support 21, an adsorption piece 23 connected with the second rotating mechanism 22 and used for adsorbing the wafer silicon slice 3, and a visual positioning assembly arranged on the fixed support 21 and used for acquiring the position information of the wafer silicon slice 3 on the adsorption piece 23, wherein a target position of a positioning straight edge 31 is preset in the visual positioning assembly;
and the control mechanism (not shown) is connected with the mechanical arm 1 and the calibration mechanism 2 and is used for controlling the mechanical arm 1 and the rotation mechanism to adjust the position of the wafer silicon slice 3, so that the position of the wafer silicon slice 3 on the adsorption piece 23 is coincided with a preset target position.
Before the positioning of the wafer silicon slice 3, a target position of the wafer silicon slice 3 is preset in the visual positioning assembly, wherein the center of the target position corresponds to the center in the loading cavity for sputtering, and the straight edge position of the target position corresponds to the straight edge position in the loading cavity. After the wafer silicon wafers are in one-to-one correspondence, the wafer silicon wafers 3 move according to a preset path in the loading process, so that the centers of the wafer silicon wafers 3 and the positioning straight edges 31 of the wafer silicon wafers 3 can directly correspond to the centers in the loading cavity, the positioning straight edges 31 correspond to each other, the position adjustment of the wafer silicon wafers 3 in the loading cavity is avoided, the accurate installation of the wafer silicon wafers is ensured, and the damage of the wafer silicon wafers 3 is avoided.
Specifically, the wafer silicon wafer 3 is adsorbed by the manipulator and moves above the adsorption piece 23, so that the center of the wafer silicon wafer 3 coincides with the center of the target position in the visual positioning assembly. Then, the wafer silicon wafer 3 is placed on the adsorption piece 23, the adsorption piece 23 is driven to rotate through the second rotating mechanism 22, and the positioning straight edge 31 on the wafer silicon wafer 3 is overlapped with the positioning straight edge 31 of the target position in the visual positioning assembly.
Referring to fig. 1, the positioning device includes a fixing plate 4, the calibration mechanism 2 is disposed on the fixing plate 4, the mechanical arm 1 penetrates through the fixing plate 4, material tables 5 for placing the wafer silicon wafers 3 are disposed on two sides of the mechanical arm 1, and the mechanical arm 1 can rotate between the material tables 5 and the calibration mechanism 2, so that the wafer silicon wafers 3 can be moved between the material tables 5 and the calibration mechanism 2.
Referring to fig. 2, the robot arm 1 includes a horizontal moving mechanism 11, an adsorption component 14 disposed on the horizontal moving mechanism 11, a first rotating mechanism 12 connected to the horizontal moving mechanism 11 and capable of driving the horizontal moving mechanism to rotate, and a lifting mechanism 13 connected to the first rotating mechanism 12 and capable of driving the first rotating mechanism to move in a vertical direction. The horizontal moving mechanism 11, the first rotating mechanism 12 and the lifting mechanism 13 include a servo motor connected with a control mechanism to control the movement of the mechanical arm 1.
The adsorption unit 14 includes an adsorption sheet, on which a positioning column and a second vacuum suction pipe (not shown) communicating with the air hole are provided. The process of the mechanical arm 1 for sucking the wafer silicon chip 3 comprises the following steps: the mechanical arm 1 moves to the lower part of the wafer silicon chip 3 to support the wafer silicon chip 3 and adsorb the wafer silicon chip 3 by using the air hole through horizontal, lifting, rotating and other movements, and in the process that the adsorption piece is inserted into the lower part of the wafer silicon chip 3 to adsorb the wafer silicon chip 3, the positioning column on the adsorption piece is abutted against the edge of the wafer silicon chip 3 to determine the position of the wafer silicon chip 3 on the adsorption piece.
Referring to fig. 3, the visual positioning assembly includes a camera 24 disposed above the adsorbing member 23, and a light source surrounding the adsorbing member 23. The light source is generated by a ring-shaped lamp 25, the upper surface of the ring-shaped lamp 25 is lower than the upper surface of the absorbing member 23. The light source is arranged around the outer side of the adsorption piece 23, so that the camera 24 can acquire clear and effective images, and the accuracy of the identification position is improved; and the upper surface of the annular lamp 25 is lower than the upper surface of the adsorption piece 23, so that interference generated in the process that the mechanical arm 1 moves the wafer silicon slice 3 above the adsorption piece 23 is avoided.
In an alternative embodiment, the suction member 23 has a cylindrical shape and is located at the center of the annular lamp 25. A first vacuum suction pipe (not shown) is provided in the suction member 23. Therefore, when the second rotating mechanism 22 is used to drive the adsorption piece 23 to rotate, and the positioning straight edge 31 of the wafer silicon slice 3 is rotated to be overlapped with the positioning straight edge 31 of the target position, the wafer silicon slice 3 can be prevented from moving, and the position accuracy can be ensured. Specifically, the second rotating device comprises a rotating shaft arranged in the vertical direction and a servo motor connected with the rotating shaft. The adsorption member 23 is disposed on the top of the rotation shaft.
Specifically, the control mechanism is connected with servo motors in the camera 24, the horizontal moving mechanism 11, the first rotating mechanism 12, the lifting mechanism 13 and the second rotating mechanism 22 in the visual positioning assembly, so that the mutual cooperation effect of the control mechanism and the horizontal moving mechanism is realized.
The present invention has been explained by using specific embodiments, and the explanation of the above embodiments is only used to help understand the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be changes in the specific embodiments and the application range, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (7)
1. The utility model provides a positioner for wafer silicon chip, the edge of wafer silicon chip is equipped with the location straight flange, its characterized in that, positioner includes:
the mechanical arm comprises a horizontal moving mechanism, an adsorption component arranged on the horizontal moving mechanism, a first rotating mechanism which is connected with the horizontal moving mechanism and can drive the horizontal moving mechanism to rotate, and a lifting mechanism which is connected with the first rotating mechanism and can drive the first rotating mechanism to move along the vertical direction;
the calibration mechanism comprises a fixed support, a second rotating mechanism arranged on the fixed support, an adsorption piece connected with the second rotating mechanism and used for adsorbing the wafer silicon wafer, and a visual positioning assembly arranged on the fixed support and used for acquiring the position information of the wafer silicon wafer on the adsorption piece, wherein a target position of a positioning straight edge is preset in the visual positioning assembly;
and the control mechanism is connected with the mechanical arm and the calibration mechanism and is used for controlling the mechanical arm and the rotation mechanism to adjust the position of the wafer silicon wafer, so that the position of the wafer silicon wafer on the adsorption piece is superposed with a preset target position.
2. The positioning device for the wafer silicon wafer as set forth in claim 1, wherein: the visual positioning assembly comprises a camera arranged above the adsorption piece and a light source surrounding the adsorption piece.
3. The positioning device for the wafer silicon wafer as claimed in claim 2, wherein: the light source is generated by a ring-shaped lamp, and the upper surface of the ring-shaped lamp is lower than the upper surface of the adsorption piece.
4. The positioning device for the wafer silicon wafer as claimed in claim 3, wherein: the adsorption piece is cylindrical and is positioned in the center of the annular lamp.
5. The positioning device for the wafer silicon wafer as claimed in claim 1, wherein: a first vacuum suction pipe is arranged in the adsorption piece.
6. The positioning device for the wafer silicon wafer as claimed in claim 1, wherein: the adsorption component comprises an adsorption piece, a positioning column and a second vacuum suction pipe, wherein the positioning column is arranged on the adsorption piece, and the second vacuum suction pipe is communicated with the air hole in the adsorption piece.
7. The positioning device for the wafer silicon wafer as claimed in claim 1, wherein: the second rotating mechanism comprises a rotating shaft arranged in the vertical direction and a servo motor connected with the rotating shaft.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221680710.XU CN217788363U (en) | 2022-06-30 | 2022-06-30 | Positioning device for wafer silicon chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221680710.XU CN217788363U (en) | 2022-06-30 | 2022-06-30 | Positioning device for wafer silicon chip |
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| Publication Number | Publication Date |
|---|---|
| CN217788363U true CN217788363U (en) | 2022-11-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221680710.XU Active CN217788363U (en) | 2022-06-30 | 2022-06-30 | Positioning device for wafer silicon chip |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116276585A (en) * | 2022-12-12 | 2023-06-23 | 苏州赛森电子科技有限公司 | Positioning assembly and silicon wafer polishing machine |
| CN116344395A (en) * | 2023-03-07 | 2023-06-27 | 东莞市智赢智能装备有限公司 | Edge finder |
-
2022
- 2022-06-30 CN CN202221680710.XU patent/CN217788363U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116276585A (en) * | 2022-12-12 | 2023-06-23 | 苏州赛森电子科技有限公司 | Positioning assembly and silicon wafer polishing machine |
| CN116276585B (en) * | 2022-12-12 | 2024-01-30 | 苏州赛森电子科技有限公司 | Positioning assembly and silicon wafer polishing machine |
| CN116344395A (en) * | 2023-03-07 | 2023-06-27 | 东莞市智赢智能装备有限公司 | Edge finder |
| CN116344395B (en) * | 2023-03-07 | 2023-10-20 | 东莞市智赢智能装备有限公司 | Edge finder |
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