CN213704939U

CN213704939U - Positioning mechanism of wafer marking machine

Info

Publication number: CN213704939U
Application number: CN202022655062.XU
Authority: CN
Inventors: 丁波; 李轶; 陈瀚; 赵耀; 陈登奎; 杭海燕
Original assignee: Shanghai Micro Semi World Co ltd
Current assignee: Shanghai Micro Semi World Co ltd
Priority date: 2020-11-17
Filing date: 2020-11-17
Publication date: 2021-07-16
Anticipated expiration: 2030-11-17

Abstract

The utility model provides a positioning mechanism of wafer marking machine, including the rotatory suction head that can go up and down, locate the other unloading mechanism of getting the wafer on being used for of rotatory suction head, still include counterpoint mechanism, counterpoint mechanism includes two centering jack catchs that can remove in opposite directions, locate the straight flange on one side centering jack catch, locate the reference column on the opposite side centering jack catch and locate the sensor that can respond to wafer straight flange process of rotatory suction head one side, centering jack catch symmetrical arrangement in the both sides of rotatory suction head axis, straight flange and reference column can cooperate the arc edge of the straight flange and the opposite side of supporting the wafer. The centering claw is used for centering the wafer, so that the center of the wafer is aligned to the center of the rotary suction head, the positioning precision is effectively improved, the angle positioning is carried out on the wafer through the cooperation of the sensor, the flat flange and the positioning column, and the positioning efficiency is higher compared with an image matching mode.

Description

Positioning mechanism of wafer marking machine

Technical Field

The utility model relates to a semiconductor manufacturing equipment field especially relates to a positioning mechanism of wafer marking machine.

Background

Wafers on the production line need to be marked to trace production information. The existing marking process mainly comprises the following procedures that a wafer is placed on a rotary suction head through a feeding mechanism, the rotary suction head drives the wafer to rotate to a specific angle for marking, and after marking is finished, a blanking mechanism moves the wafer on the rotary suction head. The process has the following defects: 1. the existing feeding mechanism can not keep the wafer and the rotary suction head concentric, so that the positioning precision of the wafer has certain deviation. The wafer has a flat edge for indicating the rotation direction, and the prior art adopts an image matching mode to determine the position of the flat edge of the wafer, so that the positioning efficiency is low.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that a novel positioning mechanism of wafer marking machine is provided, the positioning accuracy of wafer can be improved.

The utility model discloses a this technical problem is solved to following mode:

the utility model provides a positioning mechanism of wafer marking machine, includes the rotatory suction head that can go up and down, locates other being used for of rotatory suction head toward get last unloading mechanism of putting the wafer on the rotatory suction head, its characterized in that: still include counterpoint mechanism, counterpoint mechanism includes two centering jack catchs that can remove in opposite directions, locates the straight flange on the centering jack catch of one side, locates reference column on the opposite side centering jack catch and locates rotating suction head one side can respond to the sensor that the wafer straight flange passes through, centering jack catch symmetrical arrangement in the both sides of rotatory suction head axis, the interior side surface of centering jack catch is the adaptation the arc surface at wafer edge, straight flange and reference column can cooperate and support the straight flange of wafer and the arc edge of opposite side.

The centering claw is used for centering the wafer, so that the center of the wafer is aligned to the center of the rotary suction head, the positioning precision is effectively improved, the angle positioning is carried out on the wafer through the cooperation of the sensor, the flat flange and the positioning column, and the positioning efficiency is higher compared with an image matching mode.

As a preferred embodiment of the utility model, go up unloading mechanism and include transverse guide, locate last sliding table board of transverse guide, locate last stub bar and lower stub bar on the sliding table board, locate transverse guide is close to the last magazine of last stub bar one end and locates transverse guide is close to the unloading box of lower stub bar one end, rotatory suction head is located go up between magazine and the unloading box.

As a preferred embodiment of the utility model, rotatory suction head includes the integral key shaft, locates the sucking disc on integral key shaft top, locate terminal tracheal joint of integral key shaft, be used for the drive the rotatory rotary drive device of integral key shaft with be used for the drive the lift drive that the integral key shaft goes up and down, be equipped with the intercommunication in the integral key shaft the air duct of sucking disc and tracheal joint.

As a preferred embodiment of the present invention, the rotation driving device includes the support frame, locates bearing frame on the support frame, locate axle sleeve in the bearing frame, with the fixed spline bearing who cup joints of bearing frame, be fixed in from the driving wheel of axle sleeve bottom, still including locating rotating electrical machines on the rack, connection the action wheel of rotating electrical machines motor shaft, the cover is located action wheel and from the belt on the driving wheel. The spline shaft penetrates through the spline bearing, and the inner hole wall of the spline bearing is provided with a convex edge meshed with the key on the spline shaft.

As an embodiment of the present invention, the lifting driving device includes a vertical guide rail on the supporting frame, a slider on the vertical guide rail, a lifting linkage plate on the slider, a driving motor beside the vertical guide rail, a lead screw connected with a motor shaft of the driving motor, and a nut block engaged with the lead screw, wherein the nut block is connected with the lifting linkage plate.

As a preferred embodiment of the present invention, the centering jaw is composed of a first jaw and a second jaw which are overlapped, and the radian of the inner side surface of the first jaw is different from that of the second jaw. To accommodate wafers of different sizes.

The utility model discloses compare prior art's main advantage and lie in: and the centering claws are used for centering, so that the circle center of the wafer is aligned with the central axis of the rotary suction head, and the positioning precision is further improved. The flat edge of the wafer is positioned through the cooperation of the sensor, the flat edge retaining edge and the positioning column, the efficiency is greatly improved compared with the mode of image matching positioning, and the overall positioning efficiency is effectively improved.

Synthesize above, the utility model discloses compare prior art and have higher positioning accuracy and better positioning efficiency, have apparent progress.

Drawings

The invention will be further described with reference to the accompanying drawings:

FIG. 1 is an overall view of the present invention;

FIG. 2 is a schematic view of a loading and unloading mechanism;

FIG. 3 is a perspective view of the loading magazine;

FIG. 4 is a schematic view of a rotary suction head;

FIG. 5 is a cross-sectional view of the elevating suction head;

FIG. 6 is a perspective view of the alignment mechanism;

wherein: 100-a loading and unloading mechanism, 110-a transverse guide rail, 120-a sliding table plate, 130-a loading head, 131-a sliding table vertical plate, 132-a support, 133-a lifting cylinder, 134-a sucker fixing plate, 135-a vacuum sucker, 140-a unloading head, 150-a loading box, 151-a notch, 152-a clamping cylinder, 153-a clamping block, 154-a wafer bearing table, 155-a screw rod lifting device, 160-a unloading box, 200-a rotary sucker, 210-a sucker, 220-a spline shaft, 221-an air guide pipe, 222-a step part, 230-an air pipe connector, 240-a lifting driving device, 241-a vertical guide rail, 242-a sliding block, 243-a lifting linkage plate, 244-a driving motor, 245-a screw rod, 246-a nut block and 247-a fixed seat, 250-a rotary driving device, 251-a supporting frame, 252-a bearing seat, 253-a shaft sleeve, 254-a spline bearing, 256-a bearing, 257-a placing plate, 258-a rotary motor, 259-a driving wheel, 260-a driven wheel, 261-a belt, 262-an annular bulge, 263-a fixed ring, 264-a sleeve, 300-a contraposition mechanism, 310-a contraposition cylinder, 311-an elastic device, 312-a sliding rail, 313-a baffle, 314-a spring, 320-a contraposition claw, 321-a first claw, 322-a second claw, 330-a flat edge flange, 340-a sensor, 350-a positioning column, 400-a wafer and 401-a flat edge.

Detailed Description

The invention is further illustrated below by means of specific examples:

as shown in fig. 1, a positioning mechanism of a wafer marking machine includes a loading and unloading mechanism 100, a rotary suction head 200, an alignment mechanism 300, and a marking mechanism (not shown).

As shown in fig. 2, the loading and unloading mechanism 100 includes a transverse guide rail 110, a sliding plate 120 disposed on the transverse guide rail 110, and an loading head 130 and a unloading head 140 disposed on the sliding plate 120. A feeding box 150 arranged at one end of the transverse guide rail 110 close to the feeding head 130, and a discharging box 160 arranged at one end of the transverse guide rail 110 close to the discharging head 140.

The feeding head 130 has the same structure as the feeding head 140, and includes a sliding platform vertical plate 131 disposed on the sliding platform plate 120, a bracket 132 disposed on the front surface of the sliding platform vertical plate 131, a lifting cylinder 133 disposed on the bracket 132, a suction cup fixing plate 134 connected to a piston rod at the bottom of the lifting cylinder 133, and a vacuum suction cup 135 disposed at the periphery of the suction cup fixing plate 134.

As shown in fig. 3, the upper material box 150 has a cylindrical shape, a pair of notches 151 are formed on a peripheral wall of the upper material box 150 in an opposed manner, and a pair of clamping cylinders 152 are disposed at the notches 151. The piston rod of the clamp cylinder 152 is connected to the clamp block 153. The inner surface of the clamping block 153 is an arc surface matched with the inner peripheral wall of the upper material box 150.

A wafer support 154 connected with a screw rod lifting device 155 is arranged on the bottom surface of the upper material box 150. Can be driven by the screw rod lifting device 155 to lift. The wafer stage 154 is used for placing the wafer 400.

The cassette 160 is also cylindrical and receives the marked wafer 400.

As shown in fig. 4 and 5, the rotary suction head 200 is interposed between the upper magazine 150 and the lower magazine 160 at a position below the marking mechanism (not shown). Comprises a suction cup 210, a spline shaft 220, an air pipe joint 230, a lifting driving device 240 and a rotating driving device 250.

The rotary driving device 250 comprises a supporting frame 251, a bearing seat 252 arranged on the supporting frame 251, a shaft sleeve 253 arranged in the bearing seat 252 in a penetrating way, a spline bearing 254 fixedly sleeved with the shaft sleeve 253, a driven wheel 260 connected to the bottom of the shaft sleeve 253, a bearing 256 supported between the shaft sleeve 253 and the bearing seat 252, a placing plate 257 arranged at one end of the supporting frame 251 and extending downwards along the vertical direction, a rotary motor 258 arranged on the placing plate 257, a driving wheel 259 connected with a motor shaft of the rotary motor 258, and a belt 261 sleeved on the driving wheel 259 and the driven wheel 260. The top of the shaft sleeve 253 is provided with an annular bulge 262 abutting against the upper end surface of the bearing seat 252, the middle part of the shaft sleeve 253 is sleeved with a fixing ring 263, and the fixing ring 263 is provided with a sleeve 264 extending into the through hole of the shaft sleeve 253 and abutting against the bottom end of the bearing 253. Thereby, the shaft sleeve 253 and the bearing 253 are axially fixed on the support frame 251.

The spline shaft 220 is inserted into the spline bearing 254, and the inner hole wall of the spline bearing 254 is provided with a convex rib engaged with the key on the spline shaft 220. The spline shaft 220 and the spline bearing 254 can be axially moved relative to each other while maintaining the radial lock.

The lifting driving device 240 comprises a vertical guide rail 241 arranged on a placing plate 257, a sliding block 242 arranged on the vertical guide rail 241, a lifting linkage plate 243 arranged on the sliding block 242, a driving motor 244 arranged on the placing plate 257, a screw rod 245 connected with a motor shaft of the driving motor 244 through a coupling, and a nut block 246 engaged with the screw rod 245, wherein the nut block 246 is connected with the lifting linkage plate 243.

The spline shaft 220 is provided with an air duct 221, and the suction cup 210 is connected to the top end of the spline shaft 220 and communicated with the air duct 221.

A fixed seat 247 is arranged on the bottom surface of the lifting linkage plate 243, and the spline shaft 220 penetrates through the lifting linkage plate 243 and the fixed seat 247 downwards. The bottom end of the spline shaft 220 has a step 222 with a smaller diameter than the body of the spline shaft 220, and the air tube connector 230 is connected to the step 222 and communicates with the air tube 221. The top of the air pipe joint 230 abuts against the bottom surface of the fixed seat 247. The stepped end surface of the step portion 222 abuts against the top surface of the fixing seat 247, thereby axially locking the spline shaft 220 to the elevation-interlocking plate 243. The spline shaft 220 can move up and down along with the lifting linkage plate 243 on the premise of rotating relative to the lifting linkage plate 243.

When the driving device is used, the rotating motor 258 sequentially drives the driving wheel 259, the belt 261, the driven wheel 260, the shaft sleeve 253, the spline bearing 254 and the spline shaft 220 meshed with the spline bearing 254 to rotate along with the motor shaft of the rotating motor 258. Thereby driving the suction cup 210 on the top of the spline shaft 220 to rotate.

When lifting is needed, the driving motor 244 drives the screw 245 to rotate, and the nut block 246 is driven to lift along the screw 245. The lifting linkage plate 243 connected with the nut block 246 is driven to lift. Thereby driving the spline shaft 220 to lift.

When the wafer 400 needs to be adsorbed, the air pipe connector 230 is connected to an air compressor for vacuum pumping, so that the wafer 400 is adsorbed on the suction cup 210.

As shown in fig. 6, the alignment mechanism 300 includes a centering cylinder 310, a centering claw 320, a flat edge flange 330, a sensor 340 and a positioning column 350.

The centering cylinders 310 are slipway cylinders, and are disposed on both sides of the rotary suction head 200. The centering clamping jaws 320 are arranged on the sliding table of the centering cylinder 310, and the inner side surfaces of the centering clamping jaws 320 are arc surfaces matched with the edges of the wafer 400. Two sets of centering cylinders 310 are symmetrically disposed on both sides of the central axis of the rotary suction head 200.

A flat edge rib 330 is provided on the top surface of one side centering pawl 320. Two locating posts 350 are provided on the top surface of the centering jaw 320 on the other side. The flat edge flange 330 and the positioning post 350 can abut against the flat edge and the circular arc edge of the wafer 400, respectively.

A sensor 340 is provided on one side of the rotary chuck 200, the sensor 340 being capable of sensing the flat edge of the wafer 400 passing therethrough. When the sensor 340 senses the flat edge of the wafer 400, the flat edge is held in a perpendicular position to the flat edge rib 330.

In addition, in order to accommodate different wafers 400, the centering claws 320 are formed by overlapping the first claws 321 and the second claws 322, and the first claws 321 and the second claws 322 have different arc surface radians so as to adapt to wafers 400 with different sizes.

Preferably, in order to avoid the centering jaws 320 from clamping the wafer 400, one of the centering cylinders 310 is provided with an elastic device 311 connected to the centering jaws 320, and the elastic device 311 includes a slide rail 312 disposed on a sliding table of the centering cylinder 310, a slide block disposed on the slide rail 312, and a baffle 313 disposed at a rear end of the slide rail 312. The centering pawl 320 is disposed on the slider, and a spring is disposed between the centering pawl 320 and the stop plate 313. So that the centering claws 320 have a certain elasticity against the wafer 400. The wafer 400 is not easily damaged.

Above is the utility model discloses an overall structure, its operation method is as follows:

the loading head 130 moves right above the loading cassette 150, the loading head 130 descends to suck the wafer 400, and transfers the wafer 400 to the suction cup of the rotary suction head 200 to be reset, and then the wafer table 154 in the loading cassette 150 ascends by a unit height. So that the feeding head 130 can suck the next wafer 400 at the same height;

the height of the rotary suction head 200 is adjusted so that the centering jaws 320 are aligned with the height of the wafer 400, then the centering jaws 320 are moved toward each other so that the centering jaws 320 abut against the edge of the wafer 400 and the center of the wafer 400 is aligned with the central axis of the rotary suction head 200, and then the rotary suction head 200 is vacuumed to suck the wafer 400 on the suction head 210.

The height of the rotary suction head 200 is adjusted, so that the flat edge flange 330 and the positioning column 350 are aligned with the height of the wafer 400, then the rotary suction head 200 is rotated to drive the wafer 400 to rotate, when the sensor 340 senses the flat edge 401 of the wafer 400, namely the flat edge 401 of the wafer 400 is perpendicular to the end surface of the flat edge flange 330, the rotary suction head 200 stops rotating and rotates 90 degrees, so that the flat edge 401 of the wafer 400 is aligned with the flat edge flange 330, then the centering jaws 320 move oppositely, and the flat edge flange 330 and the positioning column 350 are matched to abut against the edge of the wafer 400, so that the angle alignment of the wafer 400 is realized;

a marking mechanism (not shown) marks the positioned wafer 400;

the lower head 140 moves right above the rotary head 200, the rotary head 200 finishes vacuuming, and the lower head 140 descends to suck up the wafer 400 on the rotary head 200 and moves the wafer into the lower box 160. This completes the automatic positioning and marking process for the entire wafer 400.

The utility model discloses compare prior art's main advantage and lie in: the centering claws 320 are used for centering, so that the center of the wafer 400 is aligned with the central axis of the rotary suction head 200, and the positioning precision is further improved. The flat edge 401 of the wafer 400 is positioned through the matching of the sensor 340, the flat edge flange 330 and the positioning column 350, so that compared with an image matching positioning mode, the efficiency is greatly improved, and the overall positioning efficiency is effectively improved.

However, those skilled in the art should realize that the above embodiments are only for illustrative purposes and are not to be used as limitations of the present invention, and that changes and modifications to the above embodiments are intended to fall within the scope of the appended claims, as long as they fall within the true spirit of the present invention.

Claims

1. The utility model provides a positioning mechanism of wafer marking machine, includes that the rotatory suction head (200) that can go up and down with locate other being used for of rotatory suction head (200) toward go up and down unloading mechanism (100) of getting on rotatory suction head (200) and putting wafer (400), its characterized in that: still include counterpoint mechanism (300), counterpoint mechanism (300) include two centering jack catchs (320) that can remove in opposite directions, locate plain end flange (330) on one side centering jack catch (320), locate reference column (350) on the opposite side centering jack catch (320) and locate rotatory suction head (200) one side can respond to sensor (340) that wafer (400) plain end (401) passed through, centering jack catch (320) symmetrical arrangement in the both sides of rotatory suction head (200) axis, the inboard surface of centering jack catch (320) is the adaptation the arc surface at wafer (400) edge, plain end flange (330) and reference column (350) can cooperate and support plain end (401) and the arc limit of opposite side of wafer (400).

2. The positioning mechanism of a wafer marking machine as defined in claim 1 wherein: the feeding and discharging mechanism (100) comprises a transverse guide rail (110), a sliding table plate (120) arranged on the transverse guide rail (110), a feeding head (130) and a discharging head (140) arranged on the sliding table plate (120), a feeding box (150) arranged at one end, close to the feeding head (130), of the transverse guide rail (110), and a discharging box (160) arranged at one end, close to the discharging head (140), of the transverse guide rail (110), and the rotary suction head (200) is located between the feeding box (150) and the discharging box (160).

3. The positioning mechanism of the wafer marking machine as claimed in claim 2, wherein: rotatory suction head (200) include integral key shaft (220), locate sucking disc (210) on integral key shaft (220) top, locate the terminal air pipe connector (230) of integral key shaft (220), be used for the drive the rotatory rotation driving device (250) of integral key shaft (220) and be used for the drive the lift drive (240) that integral key shaft (220) go up and down, be equipped with the intercommunication in integral key shaft (220) air duct (221) of sucking disc (210) and air pipe connector (230).

4. The positioning mechanism of the wafer marking machine as claimed in claim 3, wherein: the rotary driving device (250) comprises a supporting frame (251), a bearing seat (252) arranged on the supporting frame (251), a shaft sleeve (256) arranged in the bearing seat (252), a spline bearing (254) fixedly sleeved with the bearing seat (252), and a driven wheel (260) fixed at the bottom of the shaft sleeve (256), and further comprises a rotary motor (258) arranged on the supporting frame (251), a driving wheel (259) connected with a motor shaft of the rotary motor (258), and a belt (261) sleeved on the driving wheel (259) and the driven wheel (260), wherein the spline shaft (220) is arranged in the spline bearing (254) in a penetrating manner, and a convex ridge meshed with a key on the spline shaft (220) is arranged on the inner hole wall of the spline bearing (254).

5. The positioning mechanism of the wafer marking machine as set forth in claim 4 wherein: the lifting driving device (240) comprises a vertical guide rail (241) arranged on the supporting frame (251), a sliding block (242) arranged on the vertical guide rail (241), a lifting linkage plate (243) arranged on the sliding block (242), a driving motor (244) beside the vertical guide rail (241), a screw rod (245) connected with a motor shaft of the driving motor (244), and a nut block (246) meshed with the screw rod (245), wherein the nut block (246) is connected with the lifting linkage plate (243).

6. The positioning mechanism for a wafer marking machine according to claim 1, wherein said centering pawl (320) is formed by a first pawl (321) and a second pawl (322) which are placed in an overlapping manner, and the radian of the inner side surface of said first pawl (321) is different from that of the inner side surface of said second pawl (322).