CN107591356A - Wafer mounting apparatus and its application method - Google Patents
Wafer mounting apparatus and its application method Download PDFInfo
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- CN107591356A CN107591356A CN201710961867.7A CN201710961867A CN107591356A CN 107591356 A CN107591356 A CN 107591356A CN 201710961867 A CN201710961867 A CN 201710961867A CN 107591356 A CN107591356 A CN 107591356A
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- sealing ring
- mounting apparatus
- loading end
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- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000007789 sealing Methods 0.000 claims abstract description 101
- 238000009434 installation Methods 0.000 claims description 16
- 210000005056 cell body Anatomy 0.000 claims description 6
- 238000010276 construction Methods 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 164
- 238000010521 absorption reaction Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- 230000006978 adaptation Effects 0.000 description 5
- 238000001514 detection method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 235000013606 potato chips Nutrition 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 235000002595 Solanum tuberosum Nutrition 0.000 description 1
- 244000061456 Solanum tuberosum Species 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention discloses a kind of wafer mounting apparatus and its application method, wherein, wafer mounting apparatus includes chuck, and chuck includes a loading end, chuck be additionally provided with vacuum line, vacuum hole and sealing ring any one or it is several.Technical solution of the present invention is intended to improve the vacuum suction fastness to big angularity wafer.
Description
Technical field
The present invention relates to technical field of semiconductors, more particularly to a kind of wafer mounting apparatus and its application method.
Background technology
Wafer refers to the silicon wafer of semiconductor integrated circuit, because it is shaped as circle, therefore referred to as wafer.Due in wafer
Detection with process, by using fixed chuck carrying out vacuum suction generally by wafer, to realize that wafer is positioned in rotary moving
Platform, then detect and process piecewise and point by point, but certain warpage, such as potato is often presented in wafer in technical process
Sheet, saddle etc. are randomly distributed, and when angularity is larger, the edge of wafer has air entrance, can not form vacuum chamber
Wafer is then caused can not reliably to be adsorbed by fixed chuck, therefore, the absorption fixation problem of big angularity wafer is that design is fixed
One of chuck problem to be solved.And simultaneously, fixed chuck should also possess following characteristics：
(1) fixed chuck is necessary to ensure that wafer adsorbs securely, and the wafer under the conditions of platform high-speed rotation in rotary moving
It will not be subjected to displacement；
(2) fixed chuck needs librarian use manipulator easy to operation promptly to pick and place wafer；
(3) fixed chuck will not bring extra additives to wafer, cause the two of wafer in connection procedure is adsorbed
Secondary pollution.
The content of the invention
The main object of the present invention is to provide a kind of wafer mounting apparatus, it is intended to improves and the vacuum of big angularity wafer is inhaled
Attached fastness.
To achieve the above object, wafer mounting apparatus proposed by the present invention, including chuck, chuck include a loading end, card
Disk be additionally provided with vacuum line, vacuum hole and sealing ring any one or it is several.
Alternatively, sealing ring in the annular groove on loading end surface and protrudes from loading end located at recessed, and sealing ring includes
Protrude from the deformations of loading end and the installation portion being placed in fixing groove.
Alternatively, at least one vacuum hole is provided with sealing ring area defined.
Alternatively, sealing ring includes the first sealing ring and the second sealing ring, and the first sealing ring and the second sealing ring are concentric
Set, the radius of the first sealing ring is less than the second sealing ring.
Alternatively, vacuum hole includes the first vacuum hole and the second vacuum hole, and the first vacuum hole is located at the first sealing ring and enclosed
Into region in, the second vacuum hole is in the region between the first sealing ring and the second sealing ring.
Alternatively, vacuum hole is located at least vacuum line inside chuck and connected.
Alternatively, the installation position of a sealing ring in recessed in an annular groove on loading end surface.
Alternatively, the bottom surface of annular groove is also arranged with a fixing groove, and the installation portion of sealing ring is by fixing groove clamping.
Alternatively, fixed press strip is equipped with installation portion, fixed press strip extrudes installation portion so that sealing ring is clamped in fixation
Groove.
Alternatively, loading end is further opened with a plurality of vacuum channels connected with vacuum hole, the height of a plurality of vacuum channels by
The center of circle of chuck gradually increases so that curved surface of the loading end in depression laterally.
Alternatively, vacuum channels include the first vacuum channels and the second vacuum channels, and the first vacuum channels are arranged at first
In the region that annular groove surrounds, the second vacuum channels are arranged in the region between first annular groove and the second annular groove, and first
Vacuum hole connects with first annular groove, and the second vacuum hole connects with the second annular groove.
Alternatively, the cell body width of the second vacuum channels is more than the cell body width of the first vacuum channels.
Alternatively, vacuum line includes the first vacuum air-channel and the second vacuum air-channel, the first vacuum air-channel and in chuck
One vacuum hole is corresponding to be connected, the connection corresponding with the second vacuum hole of the second vacuum air-channel.
Alternatively, wafer mounting apparatus also includes an at least support bar and lifting drive component, and chuck is further opened with running through
At least a positioning hole of loading end, support bar slidably wear positioning hole, and lifting drive component driving support bar protrudes from carrying
Face is with the surface of contact sample.
Alternatively, support bar includes three, and the quantity of positioning hole and the quantity of support bar match, and three support bars are located at
The inner side of first annular groove.
The present invention also provides a kind of application method applied to above-mentioned wafer mounting apparatus, and the application method includes following step
Suddenly：
Wafer is positioned over loading end；
Wafer vacuum is adsorbed in chuck by control wafer mounting apparatus by vacuum line and vacuum hole.
Technical solution of the present invention sets sealing ring and big angularity wafer not by using increase on the loading end by chuck
The surface adaptation contact of regular distribution, or directly product is positioned on the loading end provided with vacuum suction component, solve
The problem of being not easy by vacuum suction of big angularity wafer, the absorption further improved to big angularity wafer is solid and reliable
Property.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Structure according to these accompanying drawings obtains other accompanying drawings.
Fig. 1 is the overall structure diagram of the embodiment of wafer mounting apparatus one of the present invention；
Fig. 2 is the sectional view of the embodiment of wafer mounting apparatus one of the present invention；
Fig. 3 is the schematic diagram of the vacuum line of wafer mounting apparatus of the present invention；
Fig. 4 is the enlarged diagram at A in Fig. 3；
Fig. 5 is the explosive view of the embodiment of wafer mounting apparatus one of the present invention；
Fig. 6 is the sealing ring nature schematic diagram of wafer mounting apparatus of the present invention；
Fig. 7 is the sealing ring impaction state schematic diagram of wafer mounting apparatus of the present invention.
Drawing reference numeral explanation：
The realization, functional characteristics and advantage of the object of the invention will be described further referring to the drawings in conjunction with the embodiments.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only the part of the embodiment of the present invention, rather than whole embodiments.Base
Embodiment in the present invention, those of ordinary skill in the art obtained under the premise of creative work is not made it is all its
His embodiment, belongs to the scope of protection of the invention.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute is only used in the embodiment of the present invention
In explaining the relative position relation under a certain particular pose (as shown in drawings) between each part, motion conditions etc., if should
When particular pose changes, then directionality instruction also correspondingly changes therewith.
In the present invention, unless otherwise clearly defined and limited, term " connection ", " fixation " etc. should be interpreted broadly,
For example, " fixation " can be fixedly connected or be detachably connected, or integrally；Can be mechanically connect or
Electrical connection；Can be joined directly together, can also be indirectly connected by intermediary, can be the connection or two of two element internals
The interaction relationship of individual element, limited unless otherwise clear and definite.For the ordinary skill in the art, can basis
Concrete condition understands the concrete meaning of above-mentioned term in the present invention.
In addition, in the present invention such as relating to the description of " first ", " second " etc. be only used for describe purpose, and it is not intended that
Indicate or imply its relative importance or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ",
At least one this feature can be expressed or be implicitly included to the feature of " second ".In addition, the technical side between each embodiment
Case can be combined with each other, but must can be implemented as basis with those of ordinary skill in the art, when the combination of technical scheme
Occur conflicting or will be understood that the combination of this technical scheme is not present when can not realize, also not in the guarantor of application claims
Within the scope of shield.
The present invention proposes a kind of wafer mounting apparatus 100.
Fig. 1, Fig. 3 and Fig. 5 are refer to, in embodiments of the present invention, the wafer mounting apparatus 100 includes chuck 10, chuck
10 include a loading end 11, chuck 10 be additionally provided with vacuum line 30, vacuum hole 17 and sealing ring 70 any one or it is several
It is individual.
Referring in particular to Fig. 1, the loading end 11 of chuck 10 is to be set to the curved surface of lower recess in the present invention, because of big angularity
Wafer (not shown) itself certain warpage is also presented, such as potato chips shape, saddle are randomly distributed, when its wafer is positioned over
During the loading end 11, contact is mutually adapted, then is vacuumized by vacuum hole 17 via the vacuum line inside chuck 10, will
Wafer is preferably attached at chuck, then wafer is detected or processed.
Technical solution of the present invention by using increase on the loading end 11 by chuck 10 by setting sealing ring 70 with sticking up greatly
The surface adaptation contact that curvature wafer is randomly distributed, or product is directly positioned over the loading end provided with vacuum suction component
On 11, solve the problems, such as that big angularity wafer is not easy, by vacuum suction, further to improve to big angularity wafer
Adsorb firm reliability.
In addition, the vacuum structure design that chuck of the present invention is set can have multiple embodiments, wherein, first embodiment can be with
The cooperation of vacuum line, vacuum hole is only provided with for chuck 10, wafer is directly contacted with loading end 11, to wafer and loading end
The 11 vacuum sealing inner chambers surrounded carry out vacuumizing and adsorbing；Second embodiment can be to be provided with vacuum line, vacuum hole
On the basis of, the surface for setting sealing ring 70 to be arranged at loading end 11 is further added by, wafer is first contacted with to sealing ring 70, then to crystalline substance
The vacuum sealing inner chamber that circle, loading end 11 and sealing ring 70 surround jointly carries out vacuumizing and adsorbing.
Further, refer to Fig. 1 and Fig. 5, sealing ring 70 located at it is recessed in the annular groove 13 on the surface of loading end 11 simultaneously
Loading end 11 is protruded from, sealing ring 70 includes protruding from the deformations 701 of loading end 11 and the peace on loading end 11
Dress portion 703.
This programme opens up an at least annular groove 13 in the loading end 11 of chuck 10 and held with being embedded in annular groove 13 and being higher than
The sealing ring 70 of section 11 coordinates, and when the wafer of big angularity is positioned over loading end 11, wafer first contacts with sealing ring 70, close
Seal 70 directly holds up wafer, and curved surface, sealing ring 70 and the loading end 11 of wafer surround vacuum seal closed chamber, and air pressure can be to close
Wafer in seal 70 and sealing ring 70 is applied with downward active force, simultaneously because sealing ring 70 is hollow silicon sebific duct, should
Sealing ring 70 is easily drawn to less than loading end 11 by active force, while the wafer of big angularity is straightened until whole
Wafer face is adsorbed in the loading end 11 of wafer mounting apparatus 100 securely；Careful reference picture 1 is asked simultaneously, is added in annular groove 13
On the basis of upper sealing ring 70, then loading end 11 is arranged to by the curved surface face of outer circumferential central concave so that big angularity
Crystal round fringes are contacted with the periphery of loading end 11, and the center of wafer bow is closer in the center that loading end 11 is recessed, more just
Positioned in the placement of wafer.
The present invention using loading end 11 is set it is in curved surface on the basis of, the loading end 11 is adapted to big angularity wafer
Contact, also open up an at least annular groove 13 and the sealing ring 70 being embedded in the annular groove 13 in loading end 11 while coordinate, change
The problem of kind big angularity wafer vacuum absorption, further improve the absorption firm reliability to wafer.
In addition, refer to Fig. 2, Fig. 3 and Fig. 4, at least one vacuum hole 17 is provided with the area defined of sealing ring 70.
In one embodiment, on the basis of sealing ring 70 is set, it is further added by offering an at least vacuum on loading end 11
Hole 17, vacuum hole 17 are located within the scope of sealing ring 70 surrounded, open vacuum line 30 and to the wafer, sealing ring 70 and hold
The vacuum seal closed chamber that section 11 is surrounded inhales vacuum.
Increase sets vacuum hole 17 in one embodiment, is easy to vacuumize the vacuum seal closed chamber.
Further, Fig. 1, Fig. 2 and Fig. 3 are refer to, vacuum hole 17 includes the first vacuum hole 171 and the second vacuum hole 173,
First vacuum hole 171 is located in the area defined of the first sealing ring 131, and the second vacuum hole 173 is located at the He of the first sealing ring 131
In region between second sealing ring 133.
Because in actual use, different wafers has a variety of different sizes, and the wafer mounting apparatus 100 also has
The wafer smaller than its loading end 11 may be placed, as specification that the radius of loading end 11 is 300mm may need to place radius be
200mm wafer.So for the structure design of independent vacuum pipeline, two vacuum holes 171 for corresponding to two sealing rings 70 are set, and
First vacuum hole 171 is located in the area defined of the first sealing ring 131, and the second vacuum hole 173 is located at the He of the first sealing ring 131
In region between second sealing ring 133, when wafer size is smaller, is only vacuumized by the first vacuum hole 171, work as crystalline substance
When circle size is larger, vacuumized simultaneously by the first vacuum hole 171 and the second vacuum hole 173.
Corresponding two sealing rings 70 of the present invention set two vacuum holes 17, one-object-many-purposes, and the wafer mounting apparatus 100 can be adapted to
The wafer of vacuum suction sizes, and the mode for setting and its vacuumizing of independent vacuum pipeline, it is easy to operation, improve
The efficiency vacuumized.
In addition, refer to Fig. 1, Fig. 2 and Fig. 3, the installation portion 703 of a sealing ring 70 is positioned at recessed on the surface of loading end 11
In one annular groove 13.
Annular groove 13 in one embodiment of the invention includes the first annular annular groove 133 of groove 131 and second, first annular
For the annular groove 133 of groove 131 and second to be arranged concentrically, the second annular groove 133 is surrounded on the outside of first annular groove 131, a sealing
Circle 70 is embedded in an annular groove 13, and vacuum hole 17 includes the first vacuum in the first annular area defined of groove 131
Hole 171, and the second vacuum hole 173 between the first annular annular groove 133 of groove 131 and second.The embodiment of the present invention is also
Two ring annular grooves 13 have been opened up simultaneously on loading end 11, can also similarly have been needed to set multi-ring annular groove 13 according to use,
A sealing ring 70 is placed in corresponding each annular groove 13, such two annular grooves, 13 and two sealing ring, 70 common cooperation is compatible two
The wafer of kind size.
Specifically, the present invention is by setting the annular groove 13 of two or the above in the loading end 11 of chuck 10, and will correspond to
Sealing ring 70 be positioned in annular groove 13, the solid and reliable property of sealing ring 70 can be improved, it is ensured that the safety of wafer, set simultaneously
Put a plurality of annular groove 13 and may be such that the wafer mounting apparatus 100 is applied to various sizes of wafer, one-object-many-purposes, reduce repetition
Mold the financial cost of production.
Incorporated by reference to reference picture 2, Fig. 3 and Fig. 4, the bottom surface of annular groove 13 is also arranged with a fixing groove 135, the peace of sealing ring 70
Dress portion 703 is by the clamping of fixing groove 135.
In order to ensure that sealing ring 70 is accommodating and is fixed in annular groove 13, also it is recessed to form one in the bottom surface of annular groove 13
Fixing groove 135, the bore of the fixing groove 135 is smaller, the sealing ring 70 in an embodiment be hollow-core construction silica gel ring, silica gel
Circle is set in ellipsoid like structure thick between the detail of both ends, and the upper part of sealing ring 70 protrudes from the loading end 11 of chuck 10, close
The bottom of seal 70 is thinner, and the outer surface of sealing ring 70 is connected to the inwall of fixing groove 135, the bottom adaptation clamping of sealing ring 70
In in fixing groove 135.
In the embodiment of the present invention on the basis of annular groove 13 is set, then at the bottom surface of annular groove 13, increase opens up a fixation
Groove 135, the upper part of sealing ring 70 protrude from the height of loading end 11, and its underpart is placed in annular groove 13, while will sealing
The bottom of circle 70 is clamped in fixing groove 135, it is ensured that the firm reliability of sealing ring 70, beneficial to picking and placeing for wafer, reduces pair
Artificial breakage in wafer fabrication processes.
Refer to Fig. 6 and Fig. 7, be equipped with fixed press strip 71 in installation portion 703, fixed press strip 71 extrude installation portion 703 with
Sealing ring 70 is set to be clamped in fixing groove 135,.
During the detection or processing to wafer, the mobile platform that wafer is positioned over to rotation by chuck 10 is carried out
Detection or processing either piecewise point by point, so in order to prevent in moving process, sealing ring 70 detach fixing groove 135,
Or whole sealing ring 70 completely disengages out annular groove 13, further ensure that installation portion 703 is not deviate from fixing groove 135, close
One is placed in the bottom of seal 70 and fixes press strip 71, the sealing ring 70 is the silica gel ring of hollow-core construction, is fixed in class ellipse
In annular groove 13, deformations 701 protrude from loading end 11, and the adaptation of installation portion 703 is clamped in fixing groove 135, then passes through fixation
The crush seal circle 70 of press strip 71 so that the outer surface of installation portion 703 is connected to the inwall of fixing groove 135, and sealing ring 70 is entered into one
The fixation of step ground is blocked in fixing groove 135.
This programme further assures that sealing ring 70 and fixing groove 135, annular groove 13 are adapted to uniformity and sealing ring 70
Solid and reliable property, reduce wafer fetching process in damage, reduce production cost.
Carefully reference picture 1, loading end 11 it please be further opened with a plurality of vacuum channels 15 connected with vacuum hole 17, a plurality of vacuum
The height of groove 15 gradually increases so that curved surface of the loading end 11 in depression laterally by the center of circle of chuck 10.
The wafer mounting apparatus 100 also uses mainly for solving the absorption problem of big angularity wafer in this programme
Loading end 11 uniformly offers the vacuum channels 15 that a plurality of different radii concentric circles is set, and a plurality of vacuum channels 15 are distributed in chuck
10 11 whole plane of loading end, the height of vacuum channels 15 gradually increase so that whole carrying laterally by the center of circle of chuck 10
Face 11 in depression taper surface, due to silicon wafer warpage degree it is larger when, the surface curvature of wafer be in the potato chips shape that is randomly distributed or
The curved surface of person's saddle type, the vacuum channels 15 are adapted to as crystal column surface of the adsorption structure just with big angularity, stuck up greatly
The brim height of curvature wafer is higher than the center of wafer, the central concave of wafer in the middle part of the taper loading end 11, wafer
For EDGE CONTACT in the outside of the taper loading end 11, the whole surface of wafer is closer contacted with loading end 11, then passes through vacuum
The vacuum seal closed chamber that hole 17 surrounds to wafer, sealing ring 70 and loading end 11 is vacuumized so that big angularity wafer is able to completely
Fitting is adsorbed in loading end 11, the absorption problem for solving big angularity wafer.
This programme by set a plurality of height by the center of circle of loading end 11 laterally gradually increased vacuum groove structure, make
The loading end 11 for obtaining chuck 10 is in the taper surface of depression, further increases the suction of big angularity wafer and the loading end 11 of chuck 10
Attached area, improve the placement fastness of big angularity wafer.
Refer to shown in Fig. 1 and Fig. 2, vacuum channels 15 include the first vacuum channels 151 and the second vacuum channels 153, the
One vacuum channels 151 are arranged in the region that first annular groove 131 surrounds, and the second vacuum channels 153 are arranged at first annular groove
131 and the second region between annular groove 133 in, the first vacuum hole 171 connects with first annular groove 131, the second vacuum hole 173
Connected with the second annular groove 133.
The loading end 11 of chuck 10 is divided for two parts region, the region and first surrounded by first annular groove 131
Two big binding domains between the annular groove 133 of annular groove 131 and second, correspond to respectively in two big binding domains offer it is a plurality of
The first vacuum channels 151 and the second vacuum channels 153 of even distribution；When the wafer for needing to place reduced size is in loading end 11
When, the edge of smaller wafer is placed along the sealing ring 70 in first annular groove 131, close in smaller wafer, first annular groove 131
Loading end 11 in the region of 70 and first vacuum channels of seal 151 forms the first vacuum seal closed chamber, accordingly, when needing to place
The wafer of large-size when loading end 11, along the sealing ring 70 in the second annular groove 133 place, larger by the edge of larger wafer
Loading end 11 in the region of 70 and second vacuum channels of sealing ring 153 in wafer, the second annular groove 133 forms the second vacuum
Closing chamber.
Subregion absorption in this programme is applied to various sizes of wafer, one-object-many-purposes, has saved the system for repeating die sinking
Cause this, while also allow for be replaced as frequently as during operator's use the chuck 10 of adaptation, improve detection and processing
The operating efficiency of wafer.
Specifically, the cell body width of the second vacuum channels 153 is more than the cell body width of the first vacuum channels 151.
The width of vacuum channels 15 in 11 different binding domains of loading end sets also difference, when absorption reduced size wafer
When, the edge of smaller wafer is placed along first annular groove 131, smaller wafer, the first of first annular groove 131 and loading end 11
The region of vacuum channels 151, the gas flow vacuumized is smaller, and the width of the first vacuum channels 151 is also corresponding smaller；Accordingly, when
Adsorb large-size wafer when, the edge of larger wafer is placed along the second annular groove 133, larger wafer, the second annular groove 133 with
And the region of the second vacuum channels 153 of loading end 11, the gas flow vacuumized is larger, and the width of the second vacuum channels 153 is also right
Should be larger, the corresponding different width inhaled vacuum pneumatic amount and different vacuum channels 15 are set.
This programme improves the uniformity of structure, improves the efficiency vacuumized to a certain extent, has saved and vacuumized
Time.
Fig. 2, Fig. 3 and Fig. 4 are refer to, vacuum hole 17 is located at an at least vacuum line 30 for the inside of chuck 10 and connection.
The vacuum hole 17 of the present invention connects sealing ring 70, wafer and loading end 11 can be surrounded with vacuum line 30
Vacuum sealing inner chamber is vacuumized.
Specifically, in one embodiment of the invention, vacuum line 30 includes the first vacuum air-channel and the second vacuum in chuck 10
Gas circuit, the first vacuum air-channel and the 171 corresponding connection of the first vacuum hole, the second vacuum air-channel and the 173 corresponding connection of the second vacuum hole.
On the basis of increase sets a plurality of vacuum channels 15, it is also necessary to by the subregion of loading end 11 and realize that different zones are true
The independent control of EC, the first vacuum air-channel surround the first vacuum hole 171 in region with being arranged at first annular groove 131 and connected
Logical, the second vacuum air-channel connects with the second vacuum hole 173 being arranged between the first annular annular groove 133 of groove 131 and second, when
When placing smaller wafer, the edge of smaller wafer is placed along first annular groove 131, it is true to first only to open the first vacuum air-channel
Empty closing chamber is vacuumized, and when placing larger wafer, the edge of larger wafer is placed along the second annular groove 133, while open-minded
First vacuum air-channel and the second vacuum air-channel vacuumize to the second vacuum seal closed chamber simultaneously, similarly, with opening up three annulars
When groove 13 and the above, the vacuum channels 15 and vacuum hole 17 in two regions are correspondingly arranged, then the wafer of three kinds of compatibility and the above is only
The structure design of the vacuum line 30 of vertical control is by that analogy.
It refer to Fig. 3, the structure of vacuum line 30 in this programme, the first vacuum line 30 is at least one first gas circuit conduit
331 directly connect the first vacuum hole 171 through chuck 10, one end of the first gas circuit conduit 331, and other end connection wafer is fixed
First aspirating hole 311 in the outside of device 100 1；Second vacuum line 30 is the second gas circuit conduit 333, the second gas circuit conduit
333 are that three vertical communication grooves 335 are opened up in the inside of chuck 10, and three vertical communication grooves 335 mutually fold connection and set
Put, one end of the second gas circuit conduit 333 connects the second vacuum hole 173, and the other end then extends to the outside of wafer mounting apparatus 100
Connect with the second aspirating hole 313, vacuum seal closed chamber is vacuumized by the vacuum line 30.
The corresponding structure of independent vacuum pipeline 30 is set in this programme inside chuck 10, goes for sizes crystalline substance
Round subregion absorption, increase the versatility of vacuum suction, the independent absorption to different size wafers is fixed, to a certain extent
Cost is saved.
Refer to shown in Fig. 1 and Fig. 5, wafer mounting apparatus 100 also includes an at least support bar 51 and lifting drive component,
Chuck 10 is further opened with least a positioning hole 55 through loading end 11, and support bar 51 slidably wears positioning hole 55, and lifting is driven
Dynamic Component driver support bar 51 protrudes from loading end 11 with the surface of contact sample.
Conveniently picked and placeed for the ease of the wafer mounting apparatus 100 simultaneously, do not bring the characteristics of additional pollution, on chuck 10
At least a positioning hole 55 and support bar 51 are offered, lifting drive component driving support bar 51 is vertically slided in positioning hole 55
Dynamic, lifting rod component rises and falls two kinds of working conditions, it is necessary to when placing wafer, and the bar of support bar 51 is in raised configuration, branch
The plane that the top of strut 51 is formed is higher than about 20 millimeters of the surface of chuck 10, and manipulator is being moved to chuck 10 just with wafer from side
Top simultaneously declines, and after the wafer on manipulator is less than 20 millimeters with the apparent height of chuck 10, manipulator continues to decline then wafer
To be supported on the top of support bar 51, manipulator continue decline certain altitude after and remove the upper area of chuck 10, at this moment, branch
Strut 51 together declines wafer is carried, and when the tip height of support bar 51 is less than 10 surface of chuck, wafer is left on the table of chuck 10
Face, realize that wafer is placed.Wafer takes out similar placement inverse process：Support bar 51, which rises, drives wafer to rise, and manipulator is from side
It is moved to below wafer and rises, the region of chuck 10 is removed to side after drive wafer disengaging support bar 51.
This programme coordinates straight line round dot realization above and below wafer to pick and place by the lifting structure of support bar 51, and person easy to operation exists
By manipulator clamping wafer during use, relatively easily accurate contraposition, improves operating efficiency, avoids Wafer alignment not
Standard, which is easily separated from chuck 10, to be caused to pollute or damages.
Fig. 1 is refer to, support bar 51 includes three, and the quantity and the quantity of support bar 51 of positioning hole 55 match, three
Support bar 51 is located at the inner side of first annular groove 131.
Consider that wafer for circle, is uniformly arranged in the first vacuum suction region of the first annular groove 131 of loading end 11
Three support bars 51,120 ° of angle interval between each support bar 51, lifting drive component 50 drive three support bars 51 simultaneously
The common wafer that carries together rises or declined；In addition, it is additionally provided with three stage clips 53 of the decline of auxiliary support bar 51, a stage clip
53 are correspondingly sheathed on a support bar 51, and three stage clips 53 persistently provide a downward elastic force, when lifting drive component 50 drives
Stage clip 53 is stretched in the uphill process of support bar 51, after the external force for lifting drive component 50 removes, due to stage clip 53
Build-in attribute recovers its elastic deformation, and stage clip 53 spontaneously recovers and foreshorten to three support bars 51 to descend below loading end 11
State.Similarly, in order to more securely be picked and placeed to wafer, can also the first annular annular groove 133 of groove 131 and second it
Between the second vacuum suction region in be uniformly arranged multiple support bars 51, further wafer is coordinated.
Picking and placeing for the vertically common cooperation wafer of lifting that this programme passes through three elevating levers, further improves wafer
The security picked and placeed, the contraposition of person easy to operation, improve detection and the operating efficiency processed.
The present invention also provides a kind of application method using above-mentioned wafer mounting apparatus 100, and the application method is included such as
Lower step：
Wafer is positioned over loading end 11；
Wafer vacuum is adsorbed in chuck 10 by control wafer mounting apparatus 100 by vacuum line 30 and vacuum hole 17.
It should be noted that " wafer is positioned in the step of loading end 11 ", wafer can be directly contacted with loading end
11 place planes；Two annular grooves 13 can also be opened up in loading end 11, the first ring that two annular groove 13 includes being arranged concentrically
The annular groove 133 of shape groove 131 and second, the second annular groove 133 are surrounded on the outside of first annular groove 131, and a sealing ring 70 is embedded in
In one annular groove 13, sealing ring 70 protrudes from loading end 11, and the first vacuum hole 171 is located at the region that first annular groove 131 surrounds
Interior, similarly, the second vacuum hole 173 is located between the second annular groove 133 and first annular groove 131.When wafer size is smaller,
The edge of wafer is positioned over loading end 11 along the first Contact Seal ring 70 of first annular groove 131, when wafer size is larger, by crystalline substance
Round edge is positioned over loading end 11, wafer, sealing ring 70 and loading end 11 along 133 first Contact Seal ring 70 of the second annular groove
Three is formed and vacuumizes closing inner chamber, then the wafer mounting apparatus is vacuumized by vacuum hole 17 and vacuum line 30,
Because sealing ring 70 is hollow-core construction, when it is vacuum environment that this, which is vacuumized in closing inner chamber, the gravity and air pressure pressure of wafer
Power can produce the outer active force of retracted downward to sealing ring 70 so that sealing ring 70 is dropped in annular groove 13 until less than carrying
Below face, realize that big angularity wafer is able to fitting completely and is adsorbed in loading end.
In view of in actual use, various sizes of wafer is required to be adsorbed in the loading end 11, and the present invention is being held
The annular groove 133 of first annular groove 131 and second set on section, can also set more than two annular groove 13, and in order to
It is easy to subregion independent control that vacuum line 30 is carried out into independent gas circuit structure design, when wafer size is smaller, by the side of wafer
Edge is positioned over loading end 11 along the first Contact Seal ring 70 of first annular groove 131, now only needs by the first vacuum hole 171,
One gas circuit conduit 331 and the first aspirating hole 311 are vacuumized；When wafer size is larger, by the edge of wafer along second
The first Contact Seal ring 70 of annular groove 133 is positioned over loading end 11, now not only wants the second vacuum hole 173, the second gas circuit conduit 333
And second aspirating hole 313 vacuumized, while yet to pass through the first vacuum hole 171, the first gas circuit conduit 331 and
One aspirating hole 311 is vacuumized, similarly, the wafer mounting apparatus 100 when the wafer of three kinds of compatibility and dimensions above
The structure design of independent vacuum pipeline 30 is by that analogy.
In addition, the accuracy aligned when the present invention is for the ease of picking and placeing wafer, in addition to three through loading end 11
Positioning hole 55 and three support bars 51, a support bar 51 slide and are arranged in a positioning hole, by controlling lifting drive component 50 to adjust
Section support bar 51 is higher or lower than loading end 11, and when needing to place wafer in loading end, control lifting drive component 50 is adjusted
Support bar 51 rises above about 20 millimeters of loading end 11, then the position of three support bars 51 of wafer alignment slowly put down until
Support bar 51 is undertaken in wafer, and control lifting drive component 50 adjusts three support bars 51 and carries wafer decline jointly simultaneously, when three
When the individual tip height of support bar 51 is less than loading end 11, the placement of wafer is realized.Wafer takes out similar placement inverse process：Three branch
Strut 51, which rises, drives wafer to rise, and wafer is fetched to the region of removal chuck after disengaging support bar 51.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the scope of the invention, it is every at this
Under the inventive concept of invention, the equivalent structure transformation made using description of the invention and accompanying drawing content, or directly/use indirectly
It is included in other related technical areas in the scope of patent protection of the present invention.
Claims (16)
- A kind of 1. wafer mounting apparatus, it is characterised in that including：Chuck, the chuck include a loading end, and the chuck is also set Be equipped with vacuum line, vacuum hole and sealing ring any one or it is several.
- 2. wafer mounting apparatus as claimed in claim 1, it is characterised in that the sealing ring is hollow-core construction and protrudes from institute Loading end is stated, the sealing ring includes protruding from the deformations of the loading end and the installation on the loading end Portion.
- 3. wafer mounting apparatus as claimed in claim 2, it is characterised in that be provided with extremely in the sealing ring area defined A few vacuum hole.
- 4. wafer mounting apparatus as claimed in claim 2, it is characterised in that the sealing ring includes the first sealing ring and second To be arranged concentrically, the radius of first sealing ring is less than second for sealing ring, first sealing ring and second sealing ring Sealing ring.
- 5. wafer mounting apparatus as claimed in claim 4, it is characterised in that the vacuum hole includes the first vacuum hole and second Vacuum hole, first vacuum hole are located in the first sealing ring area defined, and second vacuum hole is located at first In region between sealing ring and second sealing ring.
- 6. wafer mounting apparatus as claimed in claim 5, it is characterised in that the vacuum hole is located inside the chuck and connected A logical at least vacuum line.
- 7. the wafer mounting apparatus as described in claim 2 or 6, it is characterised in that the installation position of a sealing ring is in recessed It is located in an annular groove on the loading end surface.
- 8. wafer mounting apparatus as claimed in claim 7, it is characterised in that the bottom surface of the annular groove is also arranged with a fixation Groove, the installation portion of the sealing ring is by the fixing groove clamping.
- 9. wafer mounting apparatus as claimed in claim 8, it is characterised in that fixed press strip, institute are equipped with the installation portion State fixed press strip and extrude the installation portion so that the sealing ring is clamped in the fixing groove.
- 10. the wafer mounting apparatus as described in any one in claim 1 to 6, it is characterised in that the loading end also opens up Have an a plurality of vacuum channels connected with the vacuum hole, the height of a plurality of vacuum channels by the chuck the center of circle laterally Gradually increase so that curved surface of the loading end in depression.
- 11. wafer mounting apparatus as claimed in claim 10, it is characterised in that the vacuum channels include the first vacuum channels With the second vacuum channels, first vacuum channels are arranged in the region that the first annular groove surrounds, second vacuum Groove is arranged in the region between the first annular groove and second annular groove, first vacuum hole and described first Annular groove connects, and second vacuum hole connects with second annular groove.
- 12. wafer mounting apparatus as claimed in claim 11, it is characterised in that the cell body width of second vacuum channels is big In the cell body width of first vacuum channels.
- 13. wafer mounting apparatus as claimed in claim 5, it is characterised in that it is true to include first for vacuum line in the chuck Air road and the second vacuum air-channel, first vacuum air-channel connection corresponding with first vacuum hole, the second vacuum gas Road connection corresponding with second vacuum hole.
- 14. wafer mounting apparatus as claimed in claim 2, it is characterised in that the wafer mounting apparatus also includes at least one Support bar and lifting drive component, the chuck are further opened with least a positioning hole through the loading end, the support bar The positioning hole is slidably worn, the lifting drive component drives the support bar to protrude from the loading end with contact sample Surface.
- 15. wafer mounting apparatus as claimed in claim 14, it is characterised in that the support bar includes three, the positioning The quantity in hole and the quantity of the support bar match, and three support bars are located at the inner side of the first annular groove.
- A kind of 16. application method of wafer mounting apparatus as described in any one in claim 1 to 15, it is characterised in that The application method comprises the following steps：Wafer is positioned over the loading end；The wafer mounting apparatus is controlled to be adsorbed in the wafer vacuum by the vacuum line and the vacuum hole described Chuck.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710961867.7A CN107591356A (en) | 2017-10-13 | 2017-10-13 | Wafer mounting apparatus and its application method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710961867.7A CN107591356A (en) | 2017-10-13 | 2017-10-13 | Wafer mounting apparatus and its application method |
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| CN107591356A true CN107591356A (en) | 2018-01-16 |
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| CN201710961867.7A Pending CN107591356A (en) | 2017-10-13 | 2017-10-13 | Wafer mounting apparatus and its application method |
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| CN112309947A (en) * | 2019-07-29 | 2021-02-02 | 上海微电子装备（集团）股份有限公司 | Adsorption device, exposure table, photoetching equipment and adsorption method |
| CN114558839A (en) * | 2022-02-09 | 2022-05-31 | 智程半导体设备科技(昆山)有限公司 | Adsorption rotating device and single-chip wafer cleaning machine |
| CN114864470A (en) * | 2022-04-27 | 2022-08-05 | 苏州科韵激光科技有限公司 | Wafer fixing carrier |
| CN115083988A (en) * | 2022-07-12 | 2022-09-20 | 法特迪精密科技（苏州）有限公司 | Wafer adsorption platform facing probe platform and reducing ring groove and rotating ring groove thereof |
| CN115480452A (en) * | 2021-05-31 | 2022-12-16 | 上海微电子装备（集团）股份有限公司 | Sucker assembly, exposure device and photoetching system |
| WO2023279546A1 (en) * | 2021-07-07 | 2023-01-12 | 长鑫存储技术有限公司 | Wafer adjustment apparatus, reaction chamber, and wafer adjustment method |
| CN116130400A (en) * | 2023-01-10 | 2023-05-16 | 上海御微半导体技术有限公司 | Precise movement table |
| US11892778B2 (en) | 2021-07-07 | 2024-02-06 | Changxin Memory Technologies, Inc. | Device for adjusting wafer, reaction chamber, and method for adjusting wafer |
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