CN112309947A - Adsorption device, exposure table, photoetching equipment and adsorption method - Google Patents

Adsorption device, exposure table, photoetching equipment and adsorption method Download PDF

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Publication number
CN112309947A
CN112309947A CN201910691314.3A CN201910691314A CN112309947A CN 112309947 A CN112309947 A CN 112309947A CN 201910691314 A CN201910691314 A CN 201910691314A CN 112309947 A CN112309947 A CN 112309947A
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China
Prior art keywords
adsorption
suction
substrate
sealing ring
groove
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Granted
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CN201910691314.3A
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Chinese (zh)
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CN112309947B (en
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蔡晨
王鑫鑫
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Shanghai Micro Electronics Equipment Co Ltd
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Shanghai Micro Electronics Equipment Co Ltd
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Priority to TW109125455A priority patent/TWI764212B/en
Publication of CN112309947A publication Critical patent/CN112309947A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention belongs to the technical field of photoetching, and particularly discloses an adsorption device, an exposure device, photoetching equipment and an adsorption method. The adsorption device comprises: the sucking disc, the base adsorption surface of the sucking disc has mounting grooves around its center, and the base adsorption surface has adsorption grooves on the inner side of the mounting grooves for communicating with the vacuum source; the lower end of the sealing ring is hermetically arranged in the mounting groove, and the upper end of the sealing ring is used for being contacted with the substrate; when the sealing ring is not in contact with the substrate, the upper end of the sealing ring protrudes out of the adsorption surface, when the adsorption groove is in a vacuum state, the sealing ring is completely positioned in the mounting groove, and the upper end of the sealing ring is flush with the substrate adsorption surface. The exposure device comprises the adsorption device, the photoetching equipment comprises the exposure device, and the adsorption method is applied to the adsorption device to adsorb the substrate. The adsorption device, the exposure device, the photoetching equipment and the adsorption method disclosed by the invention can improve the adsorption capacity to the warped substrate and improve the exposure stability and the photoetching quality.

Description

Adsorption device, exposure table, photoetching equipment and adsorption method
Technical Field
The invention relates to the technical field of photoetching, in particular to an adsorption device, an exposure platform, photoetching equipment and an adsorption method.
Background
In photolithography, an exposure stage is used to project a circuit pattern on a mask plate through an optical projection system to a certain magnification or reduction onto a silicon wafer for manufacturing an integrated circuit. Before exposure, a silicon wafer is generally sucked by a transfer mechanism and placed on a sucker of an exposure table, so that the sucker performs vacuum suction on the silicon wafer, the silicon wafer is fixed on the exposure table, and the silicon wafer is prevented from moving in the exposure process.
With the continuous development of the technology in the integrated circuit manufacturing industry, the silicon wafer processing technology is diversified, so that the silicon wafer can generate larger warping deformation frequently. When the conventional sucker is adopted for absorbing the warped silicon wafer, a closed vacuum absorption cavity cannot be formed on the rigid absorption surface due to the warping of the silicon wafer, so that the sucker cannot effectively absorb the silicon wafer, and the exposure stability and the exposure quality of the silicon wafer are affected.
Disclosure of Invention
The invention aims to provide an adsorption device, which improves the adsorption capacity of the adsorption device on a warped substrate and improves the adsorption stability and reliability of the substrate.
It is still another object of the present invention to provide an exposure stage that improves substrate exposure stability and substrate exposure quality.
Another object of the present invention is to provide a lithography machine, which can improve the lithography stability and the lithography quality.
Still another object of the present invention is to provide an adsorption method, which improves the adsorption capacity to the warped substrate, and improves the substrate adsorption stability and reliability.
In order to achieve the purpose, the invention adopts the following technical scheme:
an adsorption device comprising:
the vacuum suction cup comprises a suction cup, wherein a mounting groove is formed in the base adsorption surface of the suction cup around the center of the suction cup, and an adsorption groove used for being communicated with a vacuum source is formed in the inner side of the mounting groove in the base adsorption surface;
the lower end of the sealing ring is hermetically arranged in the mounting groove, and the upper end of the sealing ring is used for being in contact with the substrate;
when the sealing washer with during the basement contact, the upper end protrusion of sealing washer the adsorption plane, work as when the adsorption groove is in vacuum state, the sealing washer is located completely in the mounting groove, just the upper end of sealing washer with basement adsorption plane parallel and level.
As a preferable method of the suction apparatus, the suction cup has a suction hole formed inside the mounting groove, the suction hole penetrates through the suction cup in a thickness direction of the suction cup, the suction apparatus further includes a transfer mechanism, and the transfer mechanism includes:
the adsorption component, its with the basement adsorption plane is perpendicular, adsorption component's lower extreme is located the sucking disc downside, adsorption component's upper end can pass and seal the absorption hole, just adsorption component can be relative the sucking disc is along the perpendicular to the direction motion of sucking disc, vacuum air flue has been seted up in the adsorption component, vacuum air flue runs through adsorption component's up end is in order to adsorb the basement.
As a preferred method of a sorption arrangement, the sorption assembly comprises:
the adsorption column is vertical to the substrate adsorption surface, the upper end of the adsorption column can extend into the adsorption hole and can move relative to the adsorption hole along the direction vertical to the substrate adsorption surface, the adsorption column is internally provided with the vacuum air passage, the upper end of the vacuum air passage penetrates through the upper end surface of the adsorption column, and the vacuum air passage is communicated with a vacuum source;
the suction nozzle sets up the upper end of adsorption column and with the vacuum air flue intercommunication, the surface of suction nozzle can with the sealed laminating of inner wall in absorption hole, just the upper end of suction nozzle is higher than the up end of adsorption column.
As a preferable method of the suction device, the mounting groove includes a mounting groove portion and a receiving groove portion which are located in communication in a thickness direction of the suction cup, the mounting groove portion is located at a bottom of the receiving groove portion, a groove width of the receiving groove portion is larger than a groove width of the mounting groove portion, and a lower end of the seal ring is engaged in the mounting groove portion.
As a preferable method of the adsorption apparatus, the groove width of the installation groove portion is gradually reduced from the groove bottom thereof to the notch thereof.
As a preferred method of an adsorption apparatus, the seal ring includes:
the cross section of the installation part is in a trapezoid shape with a large lower end and a small upper end, and the installation part is in sealed clamping connection with the accommodating groove part;
and one end of the deformation part is connected with the mounting part, and the other end of the deformation part extends along the direction far away from the mounting part.
As a preferable method of the adsorption apparatus, the cross section of the deformation portion has a broken line shape extending in an axial direction of the seal ring; or the like, or, alternatively,
the deformation portion is the toper shape of face, just the toper face is close to the one end of installation department is less than toper face other end internal diameter.
As a preferred method of an adsorption apparatus, the seal ring includes:
the cross section of the sealing ring body is of a long-strip hole structure, and the length direction of the long-strip hole structure is arranged along the axial direction of the sealing ring;
and the rubber rope is arranged at the lower end of the sealing ring body in a penetrating way.
As a preferable method of the suction device, the mounting groove is concentrically disposed with the suction cup.
As a preferable method of the adsorption device, the substrate adsorption surface is formed with a plurality of adsorption areas at intervals along the radial direction of the suction cup for applying the adsorption of the substrates with different sizes, and at least one sealing ring is arranged in each adsorption area.
As a preferable method of the adsorption device, one sealing ring is disposed at an edge of each adsorption region.
As a preferable method of the adsorption device, the adsorption grooves are in a ring shape concentric with the suction cup, a plurality of circles of the adsorption grooves are concentrically arranged on the inner side of each sealing ring, and the adsorption grooves in the same adsorption area are communicated with each other.
As an optimal method of an adsorption device, the upper surface of an adsorption boss formed between two adjacent adsorption grooves is the substrate adsorption surface, the width of each adsorption groove is 0.5-1.5 mm, the width of each adsorption boss is 0.2-0.8 mm, and the width of each adsorption boss is as follows: the width of the adsorption groove is 1: 1.5-1: 2.5.
As a preferable method of the suction device, the suction hole is a tapered hole with a large upper end and a small lower end, and the suction nozzle is a tapered suction nozzle adapted to the tapered hole.
As a preferable method of the adsorption device, the upper end of the suction nozzle is 0.2-1 mm higher than the upper end surface of the adsorption column.
As a preferable method of the adsorption device, the outer wall of the upper end of the adsorption column is provided with an annular clamping groove, the inner wall of the lower end of the suction nozzle is internally provided with an annular convex part, and the annular convex part is clamped with the clamping groove in a sealing manner.
As a preferable method of the adsorption device, a plurality of adsorption holes are arranged at intervals along the circumferential direction of the sucker, and the adsorption assemblies are arranged in one-to-one correspondence with the adsorption holes.
As a preferable method of the adsorption apparatus, the transfer mechanism further includes:
the lower end of each adsorption assembly is connected with the supporting plate, a communicating air passage is formed in the supporting plate, the vacuum air passage of each adsorption assembly is communicated with the communicating air passage, and the communicating air passage is communicated with an air source joint;
and the vertical motion assembly is connected with the supporting plate and can drive the supporting plate to move along the direction vertical to the substrate adsorption surface.
An exposure apparatus includes the adsorption apparatus as described above.
A lithographic apparatus comprising an exposure device as described above.
An adsorption method applied to the adsorption device for adsorbing the substrate and comprising the following steps:
the lower surface of the substrate is contacted with the upper end of the sealing ring, so that a closed vacuum adsorption cavity is formed among the sealing ring, the substrate and the sucker;
and vacuumizing the adsorption groove until the sealing ring is completely positioned in the mounting groove, and completely attaching the lower surface of the substrate to the adsorption surface of the substrate.
As a preferable aspect of the suction method, the suction cup has a suction hole formed inside the mounting groove, the suction hole penetrates through the suction cup in a thickness direction of the suction cup, the suction device further includes a transfer mechanism, and the transfer mechanism includes: the suction component is vertical to the suction surface of the substrate, the lower end of the suction component is positioned at the lower side of the sucker, the upper end of the suction component can penetrate through and seal the suction hole, the suction component can move relative to the sucker along the direction vertical to the sucker, a vacuum air passage is formed in the suction component, and the vacuum air passage penetrates through the upper end surface of the suction component to suck the substrate;
before the substrate contacts with the sealing ring, the method further comprises the following steps:
enabling the upper end of the adsorption component to extend out of the upper end surface of the sucker and to be in contact with the substrate;
vacuumizing the vacuum air channel to enable the adsorption component to adsorb the substrate;
enabling the adsorption component to drive the substrate to descend to the lower surface of the substrate to be in contact with the upper end of the sealing ring;
and in the process of vacuumizing the adsorption groove, continuously vacuumizing the vacuum air passage, and enabling the adsorption component to continuously drive the substrate to descend until the upper end of the adsorption component is located at the lowest position of the sucker and seals the adsorption hole, the adsorption component stops descending and stops vacuumizing the vacuum air passage.
The invention has the beneficial effects that:
according to the adsorption device provided by the invention, the sealing ring is arranged on the substrate adsorption surface of the sucker, when the sucker adsorbs a warped substrate, the upper end surface of the sealing ring protrudes out of the substrate adsorption surface, and the upper end surface of the sealing ring is firstly contacted with the lower surface of the substrate; because the sealing ring has elasticity, the sealing ring can be locally deformed under the action of the gravity of the substrate, so that the shape of the upper end of the sealing ring is matched with the bottom surface of the substrate; when the adsorption groove is vacuumized, the substrate moves downwards under the action of vacuum negative pressure to further extrude the sealing ring, so that the upper periphery of the sealing ring is completely attached to the substrate, a closed vacuum adsorption cavity is formed on the inner side of the sealing ring, vacuum leakage cannot occur, and the adsorption capacity and the adsorption effect on the substrate are improved; when the adsorption groove on the inner side of the sealing ring reaches a vacuum state, the sealing ring retracts into the mounting groove due to elastic deformation under the extrusion action, the lower surface of the substrate is in contact with the adsorption surface of the substrate, the substrate is tightly attached to the adsorption surface of the substrate under the action of vacuum negative pressure, the warping state is changed into a flat state, and the adsorption force between the substrate and the sucker is further improved.
According to the exposure device provided by the invention, by adopting the adsorption device, the adsorption capacity of the exposure device on the warped substrate is improved, the applicability of the exposure device on the substrate is expanded, and the exposure stability and the exposure quality are improved.
According to the photoetching equipment provided by the invention, by adopting the exposure device, the applicability and the warping tolerance of the photoetching equipment to the substrate are improved, and the photoetching stability and the photoetching quality are improved.
According to the adsorption method provided by the invention, the substrate is adsorbed by adopting the adsorption device, so that the adsorption capacity and the adsorption stability of the warped substrate are improved.
Drawings
Fig. 1 is a schematic structural diagram of an exposure apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic view of an exposure stage at a viewing angle according to an embodiment of the present invention;
FIG. 3 is a schematic view of an exposure stage at another viewing angle according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of an adsorption apparatus according to an embodiment of the present invention;
FIG. 5 is a front view of a chuck assembly according to one embodiment of the present invention;
FIG. 6 is a sectional view taken along line A-A of FIG. 5;
FIG. 7 is an enlarged view of a portion of FIG. 6 at I;
FIG. 8 is a schematic structural diagram of an interface mechanism according to an embodiment of the present invention;
FIG. 9 is a cross-sectional view of an adsorption apparatus according to an embodiment of the present invention;
FIG. 10 is an enlarged view of a portion of FIG. 9 at J;
FIG. 11 is a perspective view of a pallet provided in accordance with an embodiment of the present invention;
FIG. 12 is a cross-sectional view of a chuck assembly according to a second embodiment of the present invention;
FIG. 13 is an enlarged view of a portion of FIG. 12 at K;
FIG. 14 is a cross-sectional view of a chuck assembly according to a third embodiment of the present invention;
fig. 15 is a partial enlarged view at L in fig. 14.
The figures are labeled as follows:
10-an adsorption device; 20-an exposure stage;
1-a sucker component; 11-a suction cup; 111-adsorption grooves; 112-mounting grooves; 1121-mounting groove parts; 1122-a receiving slot portion; 113-a communication groove; 114-adsorption pores; 115-through holes; 116-vacuum holes; 12-a sealing ring; 121-a mounting portion; 122-a deformation; 1221-polyline board sections; 123-rubber rope;
2-a handover mechanism; 21-a base; 22-a vertical motion component; 23-a pallet; 231-a first connecting air channel; 232-a second communicating air passage; 233-third communicating air passage; 234-plug; 235-a plug groove; 236-a connecting arm; 24-an adsorption column; 241-a main body portion; 242-a plug-in part; 243-vacuum air channel; 25-a suction nozzle; 251-a connection cylinder portion; 2511-annular projection; 26-gas source joint; 27-a guide assembly; 271-a guide rail; 272-rail seat; 273-sliding block; 28-a displacement detection assembly;
201-qi foot; 202-a vertical adjustment mechanism; 203-upper flat plate; 204-a sucker seat; 205-Rz adjustment mechanism; 2051-arc motor; 2052-arc shaped guide blocks; 206-an air guide assembly; 207-a support assembly; 2071-supporting seat; 2072-elastic sheet.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.
Fig. 1 is a schematic structural diagram of an exposure apparatus according to an embodiment of the present invention, and as shown in fig. 1, the embodiment provides an exposure apparatus which is mainly used in a lithography apparatus to perform a lithography exposure process on a substrate such as a silicon wafer substrate and a glass substrate, so as to form a circuit pattern required by an integrated circuit on the substrate.
As shown in fig. 1, in the present embodiment, to facilitate description of the structure of the exposure apparatus, a coordinate system is constructed with reference to the state of the exposure apparatus at the time of normal use. In the normal use of the exposure apparatus, the substrate is horizontally disposed, an X and Y coordinate system is constructed with the horizontal plane of the substrate and the direction shown in fig. 1, a vertical direction is taken as a Z coordinate system, and X, Y and Z satisfy the right-hand rule. It will be appreciated that in other use configurations, the substrate may not be oriented horizontally.
The exposure device provided by the embodiment mainly comprises an exposure platform 20 and an adsorption device 10, wherein the adsorption device 10 is used for handing over and absorbing a substrate to be exposed, and fixing the substrate on the exposure platform 20, so that the exposure stability and the substrate exposure quality are ensured; the exposure stage 20 is used for performing coarse adjustment and fine adjustment of the substrate in each direction, and performing optical exposure processing on the substrate after the substrate is subjected to leveling and focusing. Specifically, fig. 2 is a schematic structural diagram of an exposure stage provided by an embodiment of the present invention at one viewing angle, and fig. 3 is a schematic structural diagram of an exposure stage provided by an embodiment of the present invention at another viewing angle, as shown in fig. 2 and 3, the exposure stage 20 includes a fixed base (not shown), an air foot 201, a vertical adjustment mechanism 202, an Rz adjustment mechanism 205, a support assembly 207, and a chuck base 204.
The fixing base is used for fixing and supporting the whole exposure device and positioning the optical system, the bottom of the fixing base is provided with the optical system for exposing the substrate, the fixing base is provided with a light-transmitting through hole for allowing light of the optical system to pass through, and the fixing base is preferably a marble base. The air foot 201 is horizontally arranged on the fixed base and used for carrying out coarse adjustment of large strokes in the X direction and the Y direction on a substrate placed on the exposure platform 20, so that the substrate is ensured to be arranged opposite to the optical system, and scanning exposure processing on the substrate is realized. An X-direction coarse adjustment mechanism and a Y-direction coarse adjustment mechanism are arranged between the air foot 201 and the fixed base so as to realize coarse adjustment of the air foot 201 in the X direction and the Y direction respectively. In this embodiment, the arrangement of the fixed base and the air foot 201, and the coarse adjustment of the air foot 201 in the X direction and the Y direction by using the coarse adjustment mechanism in the X direction and the coarse adjustment mechanism in the Y direction are conventional technical means in the art, and the detailed description of this embodiment is omitted.
The upper flat plate 203 is horizontally arranged above the air foot 201, and a vertical adjusting mechanism 202 is arranged between the upper flat plate 203 and the air foot 201 so as to realize height adjustment of the upper flat plate 203 in the vertical direction. In this embodiment, the upper plate 203 is preferably a rectangular structure, the vertical adjustment mechanisms 202 are respectively provided at four corners of the rectangular structure in one group, and Rx and Ry directions of the upper plate 203 are adjusted by adjusting the adjustment amount of each group of vertical adjustment mechanisms 202, thereby simplifying the adjustment difficulty of the exposure stage 20 and the setting of the adjustment structure. In this embodiment, the vertical adjustment mechanism 202 is driven and adjusted by a voice coil motor, and the specific structure can be described with reference to the structure of the vertical adjustment assembly in patent cn201820746378. In other embodiments, the vertical adjustment mechanism 202 may also adopt a rotating motor and a cam assembly for adjustment or other structures capable of achieving vertical adjustment in the field, which is not described in detail in this embodiment.
A support assembly 207 is also disposed between the upper plate 203 and the gas foot 201 to improve support of the upper plate 203 and to decouple Rx and Ry adjustments. The supporting assembly 207 comprises a supporting seat 2071 and an elastic sheet 2072, wherein the lower end of the supporting seat 2071 is fixedly connected with the air foot 201, and a positioning groove for connecting and positioning the supporting seat 2071 is arranged on the air foot 201. The elastic piece 2072 is in a spoke-like structure, and the upper end of the supporting seat 2071 is fixedly connected with the inner ring of the elastic piece 2072. The outer ring of the elastic piece 2072 is fixedly connected to the lower surface of the upper plate 203. When the adjustment heights of the multiple sets of vertical adjustment mechanisms 202 are different, the deformation of the outer side of each elastic sheet 2072 corresponding to the vertical adjustment mechanisms 202 is different, and the inner ring of each elastic sheet 2072 is basically not deformed due to the limitation of the supporting seat 2071, so that the decoupling motion of the Z-direction translation, the X-direction rotation and the Y-direction rotation can be realized through the deformation of the outer ring of each elastic sheet 2072. In this embodiment, the supporting component 207 can refer to the related description of the supporting component in patent CN201520120168.6, and the description of this embodiment is not repeated.
The suction cup seat 204 is disposed on the upper plate 203 for performing vacuum suction and connection positioning on the suction cup 11. In order to realize the rotation adjustment in the Rz direction, an Rz adjustment mechanism 205 is arranged between the suction cup holder 204 and the upper flat plate 203. In this embodiment, the chuck base 204 has a disk-shaped structure, the Rz adjustment mechanism 205 comprises an arc motor 2051, and the arc motor 2051 comprises a stator and a rotor capable of rotating relative to the stator. The stator is arc structure and with last dull and stereotyped 203 fixed connection, and the stator includes curved casing and the coil of deciding, and the coil setting is in deciding the storage tank of casing to be located and decide between casing and the rotor. The rotor includes curved movable housing and magnet, movable housing one side and sucking disc seat 204 fixed connection, and its one side towards sucking disc seat 204 closely laminates with sucking disc seat 204 outer wall, and a plurality of magnet intervals set up in one side of moving the casing and keeping away from sucking disc seat 204, and the magnetism between two adjacent magnets is opposite. The magnet and the coil are arranged oppositely, and after the arc-shaped motor 2051 is electrified, the movable shell is driven to rotate relative to the fixed shell through the magnetic force generated between the coil and the magnet, so that the sucker seat 204 rotates around the Z direction relative to the upper flat plate 203.
Rz adjustment mechanism 205 further includes a plurality of arcuate guide blocks 2052 to provide guidance for the rotation of chuck base 204 in the Z-direction. The arc guide blocks 2052 are arc-shaped surfaces towards one side of the sucker seat 204, the diameter of each arc-shaped surface is matched with the outer diameter of the sucker seat 204, and the arc guide blocks 2052 are arranged at equal intervals along the circumferential direction of the sucker seat 204. In order to reduce the friction of the chuck base 204 rotating around the Z direction and improve the precision of the Z direction rotation adjustment, in this embodiment, the arc-shaped guide block 2052 is an air-floating guide block. Positive pressure gas is filled into the air floatation guide block, so that an air film is formed between the air floatation guide block and the sucker seat 204, frictionless motion of the sucker seat 204 relative to the air floatation guide block is realized, and the Rz-direction motion adjustment precision of the sucker seat 204 is improved.
In order to further improve the Rz adjustment accuracy, in this embodiment, the lower surface of the suction cup holder 204 and the upper surface of the upper plate 203 are air-floating surfaces, so that during the Rz adjustment process of the suction cup holder 204, the suction cup holder 204 is suspended on the upper plate 203, the motion friction force between the upper plate 203 and the suction cup holder 204 is reduced, and the adjustment accuracy of the suction cup holder 204 is improved. Specifically, the exposure stage 20 provided by the present embodiment further includes an air guide assembly 206 for suspending and adsorbing the suction cup holder 204 and the upper plate 203, and for adsorbing the suction cup 11 by the suction cup holder 204. In the present invention, the suction cup holder 204, the upper plate 203 and the air guide assembly 206 are disposed as conventional technical means in the art, and specific reference is made to the disposition of the suction cup holder 204, the upper plate 203 and the air guide assembly 206, but not limited to the disposition of the suction cup holder, the upper plate and the second air guide assembly in patent CN201520120168.6, and details are not repeated in this embodiment.
In the present embodiment, the overall structure of the exposure stage 20 can adopt the structure of the table in patent CN201520120168.6, but the present embodiment is not limited thereto, and in the prior art, the structure of the exposure stage 20 applied to substrate exposure can be applied to the present embodiment.
Fig. 4 is a schematic structural diagram of an adsorption device according to an embodiment of the present invention, and as shown in fig. 4, the adsorption device 10 is used for transferring and adsorbing a substrate, so that the substrate is fixed on the chuck base 204 of the exposure stage 20. Specifically, the adsorption device 10 includes a suction cup assembly 1 and a transfer mechanism 2, the suction cup assembly 1 is disposed on the suction cup base 204, and is used for adsorbing the substrate, so that the substrate is fixed on the exposure device; the transfer mechanism 2 is used for transferring the substrate, sucking the substrate to be exposed onto the chuck assembly 1, or removing the substrate after exposure from the chuck 11, so as to realize the transfer of substrate exposure and the prior or subsequent processes.
Specifically, fig. 5 is a top view of the chuck assembly according to the embodiment of the present invention, fig. 6 is a sectional view taken along a line a-a in fig. 5, and fig. 7 is a partially enlarged view taken at a point I in fig. 6. As shown in fig. 5-7, the suction cup assembly 1 includes a suction cup 11 and a sealing ring 12. The chuck 11 has a disk-like structure and is suitable for a substrate shape such as a conventional silicon wafer or a glass wafer. In order to make the suction cup 11 perform vacuum adsorption on the substrate, the lower surface of the suction cup 11 facing the suction cup seat 204 is a fixed adsorption surface, so that the suction cup 11 is fixed on the suction cup seat 204 in an adsorption manner, and the upper surface of the suction cup 11 away from the suction cup seat 204 is a substrate adsorption surface for adsorbing the substrate. The vacuum suction of the suction cup 11 by the suction cup holder 204 is a conventional setting in the art, and is not described in detail in this embodiment.
In order to adsorb the substrate, an adsorption groove 111 for forming a vacuum adsorption cavity is formed in the substrate adsorption surface of the sucker 11, the adsorption groove 111 is communicated with a vacuum source, the adsorption groove 111 is vacuumized through the vacuum source, a vacuum cavity is formed between the lower surface of the substrate and the substrate adsorption surface, and vacuum adsorption of the sucker 11 on the substrate is achieved. In the present embodiment, it is preferable that the suction groove 111 is an annular groove concentrically arranged with the center of the suction cup 11, and the annular groove is concentrically arranged with a plurality of circles along the radial direction of the suction cup 11 to increase the number of the annular grooves on the suction surface of the substrate, thereby increasing the area of the vacuum chamber between the substrate and the suction surface of the substrate, and thus increasing the suction area and the suction strength to the substrate. An adsorption step is formed between two adjacent circles of adsorption grooves 111, and the upper end surface of the adsorption step forms a substrate adsorption surface.
In order to make the suction cup 11 suitable for the suction of substrates with different sizes, such as substrates with 8 inches and 12 inches, in the embodiment, the suction cup 11 is divided along the radial direction to form a plurality of suction areas, and each suction area is provided with a plurality of circles of suction grooves 111. Specifically, as shown in fig. 5, in the present embodiment, the chuck 11 includes a circular first suction region and a second suction region located outside the first suction region, the maximum outer diameter of the first suction region is adapted to the 8-inch silicon wafer substrate, and the maximum outer diameter of the second suction region is adapted to the 12-inch substrate. When 8 inches of substrate needs to be exposed, the adsorption grooves 111 of the first adsorption area are communicated with a vacuum source, and when 12 inches of substrate needs to be exposed, the adsorption grooves 111 of the first adsorption area and the second adsorption area are communicated with the vacuum source. This kind of mode of setting can be when expanding the flexibility and the suitability of sucking disc 11 to not unidimensional basement, can selectively use the adsorption zone that corresponds to adsorb the basement, the energy saving consumption. In other embodiments, the number of the adsorption regions may also be three or more, and the size of each adsorption region may be determined according to the size of the substrate that is required and applicable, which is not particularly limited in this embodiment.
In this embodiment, it is preferable that the adsorption grooves 111 in each adsorption region communicate with each other, simplifying the connection of the adsorption grooves 111 to the vacuum source. Specifically, in each adsorption region, a communication groove 113 is formed along the radial direction of the suction cup 11, and the communication groove 113 radially penetrates through each adsorption groove 111 in the adsorption region, so that each adsorption groove 111 is communicated with the communication groove 113, and each adsorption groove 111 in the same adsorption region is communicated. Preferably, the groove bottom of the communication groove 113 is flush with the groove bottom of the adsorption groove 111, which facilitates the processing of the adsorption groove 111 and the communication groove 113. More preferably, the communication groove 113 is provided in plurality along the circumferential direction of the suction cup 11 to improve the speed and uniformity of the expansion of the vacuum chamber in the suction area.
In this embodiment, preferably, the communicating grooves 113 of two adjacent adsorption areas are arranged in a staggered manner in the circumferential direction of the suction cup 11, which is beneficial to dividing and positioning different adsorption areas, and on the other hand, the two adjacent adsorption areas are prevented from being communicated with each other, and the vacuum degree of the adsorption areas is reduced.
In this embodiment, each of the adsorption regions is opened with a vacuum hole 116 for communicating the vacuum source with the adsorption groove 111. Preferably, the vacuum hole 116 penetrates through the suction cup 11 along the thickness direction of the suction cup 11, the lower end of the vacuum hole 116 is communicated with a vent hole formed in the suction cup seat 204, the vent hole is communicated with the air guide assembly 206, the upper end of the vacuum hole 116 is communicated with the adsorption groove 111, and the air guide assembly 206 is used for vacuumizing the vacuum hole 116, so that the adsorption groove 111 is vacuumized, the adsorption groove 111 is in a vacuum state, and the adsorption of the suction cup 11 to the substrate is realized. By the arrangement, the suction cup 11 and the suction cup seat 204 can share one set of vacuum source device, and the vacuum pumping structure of the suction cup 11 and the suction cup seat 204 is simplified.
Preferably, in the present embodiment, the vacuum holes 116 are opened at the bottom of the communicating groove 113 to improve the uniformity of the vacuum pumping speed and the vacuum degree in each adsorption groove 111, and to achieve smooth adsorption of the substrate. Furthermore, a vacuum hole 116 is formed at the bottom of each communicating groove 113, so that the vacuumizing efficiency and the circumferential vacuum consistency of the adsorption area are improved. More preferably, a vacuum hole 116 is opened at an end of the communication groove 113 away from the center of the suction cup 11 to improve the suction capability to the edge of the substrate.
In the present embodiment, in order to further improve the suction capability of the suction cup 11 to the substrate, the width of each suction groove 111 is preferably 0.5mm to 1.5mm, and is most preferably 1mm, and the width of the suction boss is preferably 0.2mm to 0.8mm, and is most preferably 0.5 mm. And the width of the adsorption boss: the width of the adsorption groove 111 is 1: 1.5-1: 2.5, and preferably 1:2.
In this embodiment, in order to improve the suction capability of the suction cup 11 to the warped substrate, the suction cup assembly 1 further includes a sealing ring 12 disposed on the suction cup 11. Specifically, the base adsorption surface is further provided with a mounting groove 112, the lower end of the sealing ring 12 is hermetically connected in the mounting groove 112, the upper end of the sealing ring 12 is used for contacting with the base, and the sealing ring 12 is arranged around the center of the suction cup 11. When the sealing ring 12 is not in contact with the substrate, the upper end of the sealing ring 12 is higher than the adsorption surface of the substrate by a preset distance; when the corresponding adsorption groove 111 reaches a vacuum state, the seal ring 12 is positioned in the mounting groove 112, and the upper end surface thereof is flush with the substrate adsorption surface.
By arranging the sealing ring 12 on the substrate adsorption surface of the sucker 11, when the sucker 11 adsorbs a warped substrate, the upper end surface of the sealing ring 12 is firstly contacted with the lower surface of the substrate because the upper end surface of the sealing ring 12 protrudes out of the substrate adsorption surface; because the sealing ring 12 has elasticity, the sealing ring 12 can be locally deformed under the gravity action of the substrate, so that the shape of the upper end of the sealing ring 12 is matched with the bottom surface of the substrate. When the adsorption groove 111 is vacuumized, the substrate moves downwards under the action of vacuum negative pressure to further extrude the sealing ring 12, so that the upper periphery of the sealing ring 12 is completely attached to the substrate, a closed vacuum adsorption cavity is formed on the inner side of the sealing ring 12, vacuum leakage cannot occur, and the adsorption capacity and the adsorption effect on the substrate are improved; when the suction groove 111 on the inner side of the sealing ring 12 reaches a vacuum state, the sealing ring 12 retracts into the mounting groove 112 due to elastic deformation under the extrusion action, the lower surface of the substrate contacts with the suction surface of the substrate, the substrate is tightly attached to the suction surface of the substrate under the action of vacuum negative pressure, the warping state is changed into a flat state, the suction force between the substrate and the sucker 11 is further improved, and the substrate is stably and firmly sucked on the sucker 11.
In this embodiment, in order to further improve the suction capacity of the suction cup 11 to the substrate, it is preferable that the sealing ring 12 is concentrically disposed with the suction groove 111, so that the stress on the substrate is more balanced. More preferably, the mounting groove 112 is formed at the edge of the adsorption region, so that the sealing ring 12 supports and adsorbs the edge of the substrate corresponding to the adsorption region, the number of the adsorption grooves 111 inside the sealing ring 12 is increased, the area of the vacuum adsorption cavity formed between the sealing ring 12 and the substrate is enlarged, and the adsorption capacity to the substrate is further improved. In the present embodiment, each adsorption region is provided with one sealing ring 12, in other embodiments, two or more sealing rings 12 may be provided at intervals in the radial direction of the adsorption region in each adsorption region, and the edge of each adsorption region is provided with one sealing ring 12.
Further, in the present embodiment, the mounting groove 112 is communicated with the adsorption groove 111, which is beneficial to vacuuming the mounting groove 112 located inside the sealing ring 12 during the vacuuming process of the adsorption groove 111, so as to improve the negative pressure effect borne by the substrate at the location where the sealing ring 12 is disposed, and increase the extrusion force of the substrate on the sealing ring 12, thereby improving the contact tightness between the sealing ring 12 and the substrate and improving the leveling effect on the substrate.
In the present embodiment, the mounting recess 112 includes a mounting groove portion 1121 and an accommodation groove portion 1122 that communicate in the thickness direction of the suction cup 11, the mounting groove portion 1121 is located below the accommodation groove portion 1122, and the width of the mounting groove portion 1121 is smaller than the width of the accommodation groove portion 1122. The lower end of the seal ring 12 is caught in the mounting groove portion 1121, and the upper end of the seal groove is accommodated in the accommodation groove portion 1122 when the seal ring 12 is compressively deformed. The clamping mode is adopted, so that the mounting and the dismounting of the sealing ring 12 can be facilitated, and the processing of the sucking disc 11 is simplified. In other embodiments, the connection of the sealing ring 12 in the mounting groove 112 may be other detachable connection methods such as a threaded connection.
In order to improve the installation stability of the sealing ring 12 in the installation groove 112, in the present embodiment, it is preferable that the groove width of the installation groove portion 1121 gradually decreases from the groove bottom thereof to the notch thereof, and the width of the notch of the installation groove portion 1121 is smaller than the width of the lower end of the sealing ring 12, so that the shrinking notch enhances the clamping action on the lower end of the sealing ring 12, the sealing ring 12 is in interference connection with the installation groove portion 1121, and the connection tightness and stability are improved. More preferably, in the present embodiment, the mounting groove portion 1121 is a dovetail groove for facilitating machining.
In the present embodiment, it is preferable that the cross section of the accommodating groove portion 1122 is rectangular, and the groove width of the accommodating groove portion 1122 is larger than that of the mounting groove portion 1121, so that the accommodating capability of the seal ring 12 is improved, and the processing of the mounting groove 112 is facilitated.
In the present embodiment, the sealing ring 12 is preferably made of silicon rubber, and has better supporting strength, deformability and sealing performance. In other embodiments, the sealing ring 12 may be made of other materials, such as fluororubber, as long as the hardness of the sealing ring 12 is not too hard so as to avoid affecting the substrate adsorption reliability, and is not too soft so as to avoid affecting the substrate handover reliability and the contamination of the silicon wafer due to the fact that the upper end surface of the sealing ring 12 is bonded to the silicon wafer after the substrate adsorption is completed, and the hardness of the sealing ring 12 is preferably 45 to 55 shore hardness.
In this embodiment, in order to improve the performance of the sealing ring 12, the sealing ring 12 preferably includes a mounting portion 121 and a deformation portion 122 connected to each other, the mounting portion 121 is connected to a lower end of the deformation portion 122, and an upper end of the deformation portion 122 extends in a direction away from the mounting portion 121. The mounting portion 121 preferably has a trapezoidal cross section that fits into the mounting groove portion 1121 to facilitate the mounting portion 121 to be snapped into the mounting groove portion 1121, and the mounting portion 121 is interference-fitted with the mounting groove portion 1121. The deformation portion 122 is mainly used for accommodating deformation of the seal ring 12 under the action of the pressing force, and in order to improve the deformability of the deformation portion 122, in the present embodiment, the cross section of the deformation portion 122 is preferably a polygonal line shape extending in the axial direction of the seal ring 12. That is, the deformation portion 122 includes a plurality of sequentially connected broken line plate portions 1221, and when the seal ring 12 is not pressed, an included angle between two adjacent broken line plate portions 1221 is 60 ° to 100 °, and the two adjacent broken line plate portions 1221 are connected by arc transition. According to the structure of the sealing ring 12, when the sealing ring 12 is subjected to extrusion acting force, the two adjacent broken line plate parts 1221 are close to each other, the deformability is strong, and the vacuum adsorption pressure for complete adsorption of the substrate can be reduced.
In the present embodiment, the deformation portion 122 includes three polygonal line plate portions 1221, and the plate thickness of a single polygonal line plate portion 1221 is 0.3 to 0.5 mm. In other embodiments, the deformation portion 122 may include two, four, or more of the broken-line plate portions 1221, and the number of the broken-line plate portions 1221 and the plate thickness of the broken-line plate portions 1221 may be designed according to the deformation capability required by the seal ring 12.
In this embodiment, it is preferable that the broken line plate portion 1221 located at the uppermost end of the sealing ring 12 extends outward along the center of the sealing ring 12 in a direction away from the mounting portion 121, so that the upper end of the sealing ring 12 forms a tapered opening, which is advantageous for improving the contact tightness between the substrate and the sealing ring 12 and preventing vacuum leakage.
In the present embodiment, the height H1 of the sealing ring 12 protruding from the suction surface of the substrate when not contacting the substrate is related to the maximum allowable warpage amount of the suction cup 11, and the larger the maximum allowable warpage amount of the suction cup 11, the larger H1. The height H2 of the mounting groove 112 is related to the deformation performance of the sealing ring 12 and the allowable maximum warpage amount of the substrate, and when the allowable maximum warpage amount of the suction cup 11 is fixed, the stronger the deformation capability of the sealing ring 12 is, the smaller the height of the mounting groove 112 is. Therefore, the height H1 of the protrusion of the sealing ring 12 from the suction surface of the substrate when the sealing ring is not in contact with the substrate and the depth H2 of the mounting groove 112 should be set according to the requirement. In this embodiment, when the chuck 11 has a thickness of 9mm, the substrate is an 8-inch silicon wafer, the sealing ring 12 is made of silicon rubber, and H1 is 6.5mm and H2 is 5mm, the silicon wafer with the maximum warpage of 13mm can be absorbed.
When the sucker assembly 1 is used for sucking a substrate, firstly, the lower surface of the substrate is contacted with the upper end of the sealing ring 12, and a closed vacuum suction cavity is formed among the sealing ring 12, the substrate and the sucker 11; and then, the adsorption groove 111 is vacuumized until the sealing ring 12 is completely positioned in the mounting groove 112, and the lower surface of the substrate is completely attached to the adsorption surface of the substrate, so that the substrate is completely adsorbed by the sucker 11.
In this embodiment, if the substrate is directly placed on the suction cup 11 and then vacuum-sucked, when the sealing ring 12 is initially contacted with the substrate, the sealing ring 12 is only contacted with the substrate under the action of gravity of the substrate, and at this time, if the warpage of the substrate is large, in order to successfully vacuumize the suction groove 111, the sealing ring 12 needs to form a closed vacuum-sucking cavity capable of being used for vacuum-sucking during the initial contact with the substrate. That is, as the amount of warpage of the base is larger, the height of the sealing ring 12 protruding from the suction surface needs to be higher, so that the depth of the mounting groove 112 and the thickness of the suction cup 11 are increased simultaneously. In order to reduce the size of the sealing ring 12 and improve the compactness of the chuck assembly 1, and simultaneously improve the suction capacity to the warped substrate and the performance of handing over to the substrate, in the present embodiment, the suction device 10 further comprises a handing-over mechanism 2.
Specifically, fig. 8 is a schematic structural diagram of a handover mechanism according to an embodiment of the present invention, fig. 9 is a cross-sectional view of an adsorption device according to an embodiment of the present invention, and fig. 10 is a partially enlarged view of a portion J in fig. 9. As shown in fig. 8 to 10, the interface mechanism 2 includes a base 21, a pallet 23, a vertical motion unit 22, and a suction unit. The base 21 is used for supporting and fixing the transfer mechanism 2, the supporting plate 23 is arranged above the base 21 and is connected with the base 21 through the vertical moving assembly 22, so that the supporting plate 23 is driven by the vertical moving assembly 22 to move along the direction vertical to the sucker 11, and the supporting plate 23 is driven to move along the direction vertical to the sucker 11; the adsorption component is arranged along the direction vertical to the sucker 11, and the lower end of the adsorption component is connected with the supporting plate 23.
The sucking disc 11 is provided with an adsorption hole 114 matched with the transfer mechanism 2, the upper end of the adsorption component can extend into the adsorption hole 114 and seal the adsorption hole 114, and the adsorption component can move along the direction perpendicular to the sucking disc 11 relative to the adsorption hole 114 under the driving of the vertical movement component 22. The interior of the adsorption assembly is provided with a vacuum air passage 243, the upper end of the vacuum air passage 243 penetrates through the upper end surface of the adsorption assembly to adsorb the substrate, and the vacuum air passage 243 is communicated with a vacuum source to vacuumize the vacuum air passage 243.
When the substrate is sucked by the transfer mechanism 2, the vertical motion assembly 22 drives the supporting plate 23 and the adsorption assembly to ascend, so that the substrate is placed on the upper end surface of the adsorption assembly and is in contact with the lower surface of the substrate when the upper end surface of the adsorption assembly is higher than the sealing ring 12; the vacuum source vacuumizes the vacuum air channel 243 to enable the adsorption assembly to adsorb the substrate, so that the adsorption assembly can drive the substrate to move. When the vertical moving assembly 22 drives the supporting plate 23 and the adsorption assembly to descend, the substrate moves towards the suction cup 11 along with the adsorption assembly under the action of vacuum negative pressure, so that the substrate is gradually contacted with the sealing ring 12 and presses the sealing ring, and in the process that the substrate is driven to move downwards, the sealing ring 12 continuously deforms under the combined action of the gravity of the substrate and the downward movement force of the substrate. Therefore, in this embodiment, by providing the handover mechanism 2, the handover mechanism 2 first adsorbs the substrate and drives the substrate to descend to contact with the sealing ring 12, so that when the sealing ring 12 contacts with the substrate, the sealing ring 12 is extruded and deformed under the action of the gravity of the substrate and the adsorption force of the handover mechanism 2 on the substrate, so as to increase the acting force between the sealing ring 12 and the substrate, even if the substrate warpage is large, the substrate can be driven by the vertical motion of the handover mechanism 2 to be in close contact with the sealing ring 12 to form a vacuum adsorption cavity, thereby reducing the requirement on the overall height of the sealing ring 12, improving the allowable maximum warpage of the suction cup assembly 1 on the substrate, and improving the adsorption capacity of the adsorption device 10 on the warped substrate.
In the present embodiment, the suction assembly includes a suction column 24 and a suction nozzle 25. The adsorption column 24 is perpendicular to the suction cup, the lower end of the adsorption column 24 is connected with the support plate 23, and the upper end of the adsorption column can extend into the adsorption hole 114. The adsorption column 24 is provided with a vacuum air passage 243 along the axial direction thereof, and the vacuum air passage 243 penetrates through the upper end surface of the adsorption column 24. The suction nozzle 25 is arranged around the upper end of the adsorption column 24, the upper end surface of the suction nozzle 25 is higher than the upper end surface of the adsorption column 24, and the outer surface of the suction nozzle 25 can be in sealing fit with the inner wall of the adsorption hole 114, so that the suction nozzle 25 seals the adsorption hole 114 when being positioned in the adsorption hole 114.
According to the arrangement mode, when the substrate is adsorbed and handed over, the substrate is firstly contacted with the edge of the upper end of the suction nozzle 25, then a vacuum cavity is rapidly formed between the suction nozzle 25 and the substrate, the substrate is adsorbed in vacuum by the handing-over mechanism 2, then the suction nozzle 25 is deformed due to the contact of the inner surface of the suction nozzle 25 and the substrate, the upper end surface of the adsorption column 24 is contacted with the suction nozzle 25, the adsorption column 24 is enabled to adsorb the suction nozzle 25 for the second time, and the adsorption stability of the substrate is improved. In the present embodiment, it is preferable that the height difference between the upper end surface of the suction nozzle 25 and the upper end surface of the adsorption column 24 is 0.2mm to 1 mm.
In the present embodiment, in order to improve the sealing matching performance between the suction hole 114 and the suction nozzle 25, it is preferable that the suction hole 114 is a tapered hole with a small upper end opening and a large upper end opening, and the suction nozzle 25 is a tapered suction nozzle matched with the suction hole 114, so that the processing of the suction hole 114 can be simplified, the sealing performance of the suction nozzle 25 on the suction hole 114 can be improved, and the suction nozzle 25 can be prevented from falling out of the suction hole 114. Further, the suction nozzle 25 is made of silicon rubber or other elastic material.
In order to realize the installation of the suction nozzle 25 on the adsorption column 24, an annular clamping groove is formed in the outer wall of the upper end of the adsorption column 24, a connecting cylinder portion 251 is axially extended from the lower end of the suction nozzle 25, an annular convex portion 2511 is convexly arranged on the inner wall of the connecting cylinder portion 251, the inner diameter of the connecting cylinder portion 251 is equal to the outer diameter of the adsorption column 24, and the annular convex portion 2511 is clamped in the clamping groove in a sealing mode, so that the suction nozzle 25 is connected with the adsorption column 24 in a sealing and clamping mode.
In this embodiment, the suction cup 11 is further provided with a through hole 115 communicated with the lower end of the suction hole 114, the through hole 115 is coaxial with the suction hole 114, and is preferably cylindrical, so as to facilitate the processing and positioning of the suction hole 114, and when the size of the upper end opening of the suction hole 114 is sufficient, the vertical movement of the suction column 24 relative to the suction hole 114 due to the too small lower end opening of the suction hole 114 is avoided.
In this embodiment, to enhance the smoothness of the substrate handover and adsorption of the handover mechanism 2, preferably, the suction cup 11 is provided with a plurality of adsorption holes 114, the number of the adsorption holes 114 and the adsorption columns 24 are arranged in a one-to-one correspondence, the lower end of each adsorption hole 114 is communicated with a through hole 115, and the upper end of each adsorption column 24 is provided with a suction nozzle 25. The upper end edges of the suction nozzles 25 are located on the same plane, the upper end faces of the adsorption columns 24 are located on the same plane, and the suction nozzles 25 and the adsorption columns 24 adsorb the substrate in the handover process, so that the stress balance and the adsorption stability of the substrate can be improved. And more preferably, the suction holes 114 are uniformly distributed along the circumferential direction of the suction cup 11 at intervals, so that the plurality of suction columns 24 can suck the substrate around the center of the substrate, which is beneficial to leveling the central area of the substrate in the process of sucking the substrate, and is more beneficial to the suction of the subsequent suction cup 11 to the substrate. In the present embodiment, the number of the suction holes 114, the suction columns 24, and the suction nozzles 25 is three, and in other embodiments, the number of the suction holes 114, the suction columns 24, and the suction nozzles 25 may be two, four, or more.
In the present embodiment, the support plate 23 is a plate-shaped structure, and a plurality of connecting arms 236 extend outward in the radial direction, and the plurality of connecting arms 236 are uniformly spaced along the circumferential direction of the support plate 23. The connecting arms 236 correspond to the adsorption columns 24 one by one, and the lower end of each adsorption column 24 is arranged on the connecting arm 236. The connecting arm 236 is provided to reduce the size of the support plate 23 and reduce the weight and the occupied space of the interface mechanism 2.
In this embodiment, preferably, the adsorption column 24 and the connecting arm 236 are connected in a plugging manner, specifically, the connecting arm 236 is provided with a plugging groove 235, and the lower end of the adsorption column 24 extends into the plugging groove 235 and is in interference fit with the plugging groove 235. More preferably, the suction column 24 includes a cylindrical main body portion 241 and a plug portion 242 protruding downward along the axial direction of the main body portion 241, and the outer diameter of the plug portion 242 is smaller than the outer diameter of the main body portion 241, so that a limiting step is formed between the main body portion 241 and the plug portion 242. The inserting portion 242 is inserted into the inserting groove 235 and is in interference fit with the inserting groove 235, and the limiting step is abutted to the upper surface of the supporting plate 23. The positioning is provided for the insertion installation of the adsorption column 24 and the support plate 23, the disassembly and assembly between the adsorption column 24 and the support plate 23 are facilitated, and the air tightness between the adsorption column 24 and the support plate 23 can be effectively ensured.
The adsorption column 24 is provided with a cylindrical vacuum air passage 243 along the axial direction thereof, and the vacuum air passage 243 penetrates through the upper and lower end surfaces of the adsorption column 24. In order to realize the synchronous vacuum-pumping treatment of the plurality of vacuum air channels 243 by the vacuum source, preferably, a communicating air channel is provided inside the supporting plate 23, and the lower end of each vacuum air channel 243 is communicated with the communicating air channel. Fig. 11 is a perspective view of a pallet according to an embodiment of the present invention, as shown in fig. 11, the communicating air duct includes a first communicating air duct 231 and a second communicating air duct 232, one end of the first communicating air duct 231 extends to one of the connecting arms 236 and penetrates through an outer wall of the connecting arm 236, the other end of the first communicating air duct 231 vertically communicates with the second communicating air duct 232, and both ends of the second communicating air duct 232 respectively extend to the other two connecting arms 236 and penetrate through an outer wall of the connecting arm 236. Two ends of the second communicating air passage 232 are respectively and vertically communicated with one end of a third communicating air passage 233, and the other end of the third communicating air passage 233 penetrates through the outer wall of the corresponding connecting arm 236. And the end of each air passage, which is not connected with other air passages, is provided with a plug 234, so that vacuum leakage in each air passage is prevented.
The first connecting air passage 231 and the third connecting air passage 233 are in opposite communication with the insertion groove 235 at the corresponding connecting arm 236, so that the first connecting air passage 231 is communicated with the vacuum air passage 243 of one of the adsorption columns 24, and the two third connecting air passages 233 are respectively communicated with the vacuum air passages 243 of the other two adsorption columns 24. The first connecting air passage 231 is also communicated with an air source connector 26 for communicating with a vacuum source. The vacuum source vacuums the communicating air passages in the supporting plate 23 through the air source connector 26, so as to vacuate each adsorption column 24. In this embodiment, the opening manner of the communicating air passages in the supporting plate 23 is only an exemplary arrangement, and in other embodiments, the opening manner of the communicating air passages may also take other forms as long as the communication of the vacuum air passages 243 in each adsorption column 24 can be achieved.
In the present embodiment, the base 21 is a disc-shaped base to facilitate the fitting of the delivery mechanism 2 to the exposure stage 20. In this embodiment, the support base 2071 on the exposure stage 20 is cylindrical, and the base 21 is disposed on the air foot 201 and inside the support base 2071. The outer diameter of the base 21 is equal to the inner diameter of the support base 2071, so that the base 21 can be clamped in the support base 2071 to realize the positioning and installation of the handover mechanism 2. The centers of the upper flat plate 203 and the sucker seat 204 are both provided with a through hole for the upper end of the transfer mechanism 2 to penetrate out, and the aperture of the through hole is preferably equal to the outer diameter of the base 21.
Vertical motion assembly 22 is disposed between pallet 23 and base 21. In this embodiment, the vertical motion assembly 22 preferably includes a voice coil motor, and the voice coil motor directly drives the supporting plate 23 to perform vertical motion, so that the structure is compact, the motion precision is high, and the size is small. In other embodiments, the vertical movement component 22 may also be a rotating motor, and a gear and rack transmission or a lead screw and nut transmission, and the structure capable of realizing the vertical movement component 22 is conventional in the art, and is not described in detail in this embodiment.
The interface mechanism 2 further comprises a guide assembly 27 for guiding the vertical movement of the pallet 23. In this embodiment, the guide member 27 is a linear guide member, which includes a guide rail 271 connected to the support plate 23 and a slider 273 engaged with the guide rail 271, and the slider 273 is connected to the base 21 through a guide rail seat 272. In other embodiments, the guiding component 27 may also be in other structural forms capable of implementing motion guiding, and the guiding component 27 is configured as a means of conventional technology in the art, which is not described in detail in this embodiment.
The transfer mechanism 2 further comprises a displacement detecting component 28 for detecting the displacement of the supporting plate 23 in vertical lifting. In this embodiment, the displacement detecting assembly 28 is a grating scale assembly, which has high detecting precision and high reliability. In other embodiments, the displacement detection assembly 28 may also be a distance sensor, a photosensor, or the like. And grating chi subassembly, distance sensor and photoelectric sensor are prior art, and this embodiment is no longer repeated.
The embodiment also provides an adsorption method for the non-warped substrate, which comprises the following steps:
step S101: the adsorption column 24 moves upwards to make the suction nozzle 25 extend out of the adsorption surface of the suction disc 11;
step S102: the substrate transfer robot moves the substrate onto the transfer mechanism 2 and brings the substrate into contact with the suction nozzle 25;
step S103: vacuumizing the vacuum air passage 243 to make the suction nozzle 25 adsorb the substrate;
step S104: continuously vacuumizing the vacuum air passage 243, pressing the suction nozzle 25 by the substrate to deform the suction nozzle 25, contacting the substrate with the upper end surface of the adsorption column 24, and carrying out secondary adsorption on the substrate by the adsorption column 24;
step S105: withdrawing the substrate conveying manipulator;
step S106: the adsorption column 24 drives the substrate to move downwards until the substrate is contacted with the sealing ring 12, the adsorption air passage of the sucker 11 is vacuumized, so that the sucker 11 adsorbs the substrate, and meanwhile, the vacuumizing of the vacuum air passage 243 is stopped;
step S107: the adsorption column 24 continues to descend until the suction nozzle 25 falls into the lowest position of the adsorption hole 114; meanwhile, the suction duct is continuously evacuated until the substrate is completely sucked by the suction cup 11.
The embodiment also provides an adsorption method for the warped substrate, which comprises the following steps:
step S201: the adsorption column 24 moves upwards to make the suction nozzle 25 extend out of the adsorption surface of the suction disc 11;
step S202: the substrate transfer robot moves the substrate onto the transfer mechanism 2 and brings the substrate into contact with the suction nozzle 25;
step S203: vacuumizing the vacuum air passage 243 to make the suction nozzle 25 adsorb the substrate;
step S204: continuously vacuumizing the vacuum air passage 243, pressing the suction nozzle 25 by the substrate to deform the suction nozzle 25, contacting the substrate with the upper end surface of the adsorption column 24, and carrying out secondary adsorption on the substrate by the adsorption column 24;
step S205: withdrawing the substrate conveying manipulator;
step S206: the adsorption column 24 drives the substrate to move downwards until the substrate is contacted with the sealing ring 12, and the adsorption air channel of the suction cup 11 is vacuumized, so that the suction cup 11, the adsorption column 24 and the suction nozzle 25 can simultaneously adsorb the substrate;
step S207: the adsorption column 24 drives the substrate to move downwards continuously, so that a sealed adsorption cavity is formed by the substrate, the sealing ring 12 and the sucker 11;
step S208: the adsorption column 24 continues to drive the substrate to move downwards until the suction nozzle 25 falls into the lowest position of the adsorption hole 114, the adsorption column 24 stops moving, and the vacuum air channel 243 stops being vacuumized;
step S209: the suction air channel of the suction cup 11 is continuously vacuumized until the sealing ring 12 is completely pressed into the mounting groove 112, and the substrate is completely sucked by the suction cup 11.
In the present embodiment, the suction method applied to the warped substrate can be similarly applied to the suction of the non-warped substrate.
The embodiment also provides a lithographic apparatus comprising the exposure device.
Example two
The second embodiment provides an exposure apparatus, which includes an exposure stage 20 and an adsorption device 10, and compared with the first embodiment, the exposure apparatus provided by the second embodiment is substantially the same as the first embodiment, except that the structural form of the sealing ring 12 in the chuck assembly 1 is different, and in this embodiment, only the structure different from that of the first embodiment is described, and the structure same as that of the first embodiment is not described again.
Fig. 12 is a sectional view of the suction cup assembly provided in this embodiment, and fig. 13 is an enlarged partial view of a portion K in fig. 12, as shown in fig. 12 and 13, in this embodiment, the sealing ring 12 includes an O-ring body having an elongated hole-shaped cross section, a rubber string 123 is inserted through a bottom portion of the sealing ring body, and the sealing ring 12 inserted through the rubber string 123 is pressed into the mounting groove portion 1121 of the suction cup 11 by the rubber string 123, so that a lower end of the sealing ring 12 is sealingly engaged with the mounting groove portion 1121. Preferably, in the present embodiment, the cross-sectional thickness of the seal ring 12 is 0.1 to 0.2 mm.
The embodiment further provides an adsorption method applied to a common substrate, and with the adsorption device 10, the adsorption method may specifically refer to the first embodiment, and details are not repeated in this embodiment.
The embodiment further provides an adsorption method applied to the warped substrate, and with the adsorption device 10, the first embodiment may be specifically referred to as the adsorption method, and details are not repeated in this embodiment.
The embodiment also provides a lithographic apparatus comprising the exposure device.
EXAMPLE III
The present embodiment provides an exposure apparatus, which includes an exposure stage 20 and an adsorption device 10, and compared with the first embodiment, the exposure apparatus provided in the present embodiment is substantially the same as the first embodiment, except that the structural form of the sealing ring 12 in the chuck assembly 1 is different, and in the present embodiment, only the structure different from the first embodiment is described, and the structure same as the first embodiment is not repeated.
Fig. 14 is a sectional view of a suction cup assembly according to an embodiment of the present invention, and fig. 15 is an enlarged partial view of a portion L in fig. 14, as shown in fig. 14 and 15, in this embodiment, the sealing ring 12 includes a mounting portion 121 and a deformation portion 122, a cross section of the mounting portion 121 is a trapezoid fitted to the mounting groove portion 1121, a lower end of the deformation portion 122 is connected to an inner side edge of the mounting portion 121, and an upper end of the deformation portion 122 extends in a direction away from a center of the suction cup 11, so that the sealing ring 12 forms a tapered structure with a large opening at an upper end and a small opening. Preferably, in the present embodiment, the thickness of the deformation portion 122 is 0.3 to 0.5mm, and the height of the sealing ring 12 protruding from the base suction surface and the thickness of the mounting groove 112 are determined by the maximum allowable warpage of the suction cup 11 and the deformation capability of the sealing ring 12.
The embodiment further provides an adsorption method applied to a common substrate, and with the adsorption device 10, the adsorption method may specifically refer to the first embodiment, and details are not repeated in this embodiment.
The embodiment further provides an adsorption method applied to the warped substrate, and with the adsorption device 10, the first embodiment may be specifically referred to as the adsorption method, and details are not repeated in this embodiment.
The embodiment also provides a lithographic apparatus comprising the exposure device.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims (22)

1. An adsorption device, comprising:
the vacuum suction cup comprises a suction cup (11), wherein a mounting groove (112) is formed in the base adsorption surface of the suction cup (11) around the center of the suction cup, and an adsorption groove (111) which is used for being communicated with a vacuum source is formed in the inner side of the mounting groove (112) on the base adsorption surface;
a sealing ring (12) with a lower end hermetically arranged in the mounting groove (112) and an upper end used for contacting with the substrate;
when sealing washer (12) not with when the basement contacts, the upper end protrusion of sealing washer (12) adsorbs the face, works as when adsorbing recess (111) is in vacuum state, sealing washer (12) are located completely in mounting groove (112), just the upper end of sealing washer (12) with basement adsorption face parallel and level.
2. The suction device according to claim 1, wherein the suction cup (11) has a suction hole (114) formed inside the mounting groove (112), the suction hole (114) penetrates the suction cup (11) in a thickness direction of the suction cup (11), the suction device (10) further includes a connection mechanism (2), and the connection mechanism (2) includes:
the adsorption component is perpendicular to the adsorption surface of the substrate, the lower end of the adsorption component is located on the lower side of the sucker (11), the upper end of the adsorption component can penetrate through and seal the adsorption hole (114), the adsorption component can be opposite to the sucker (11) and move in the direction perpendicular to the sucker (11), a vacuum air channel (243) is formed in the adsorption component, and the vacuum air channel (243) penetrates through the upper end surface of the adsorption component to adsorb the substrate.
3. The sorption arrangement of claim 2, wherein the sorption assembly includes:
the adsorption column (24) is perpendicular to the substrate adsorption surface, the upper end of the adsorption column (24) can extend into the adsorption hole (114) and can move along the direction perpendicular to the substrate adsorption surface relative to the adsorption hole (114), the vacuum air channel (243) is formed in the adsorption column (24), the upper end of the vacuum air channel (243) penetrates through the upper end surface of the adsorption column (24), and the vacuum air channel (243) is communicated with a vacuum source;
the suction nozzle (25) is arranged at the upper end of the adsorption column (24) and communicated with the vacuum air channel (243), the outer surface of the suction nozzle (25) can be attached to the inner wall of the adsorption hole (114) in a sealing mode, and the upper end of the suction nozzle (25) is higher than the upper end face of the adsorption column (24).
4. The suction apparatus according to any one of claims 1 to 3, wherein the mounting groove (112) includes a mounting groove portion (1121) and a housing groove portion (1122) which are located so as to communicate in a thickness direction of the suction cup (11), the mounting groove portion (1121) is located at a bottom of the housing groove portion (1122), a groove width of the housing groove portion (1122) is larger than a groove width of the mounting groove portion (1121), and a lower end of the seal ring (12) is caught in the mounting groove portion (1121).
5. The adsorption apparatus according to claim 4, wherein the groove width of the mounting groove portion (1121) is gradually reduced from the groove bottom thereof to the notch thereof.
6. A suction device according to claim 5, characterized in that the sealing ring (12) comprises:
the cross section of the installation part (121) is in a trapezoid shape with a large lower end and a small upper end, and the installation part (121) is in sealed clamping connection with the accommodating groove part (1122);
and a deformation part (122) having one end connected to the mounting part (121) and the other end extending in a direction away from the mounting part (121).
7. The suction device according to claim 6, characterized in that the cross section of the deformation portion (122) has a polygonal line shape extending in the axial direction of the sealing ring (12); or the like, or, alternatively,
deformation portion (122) are the toper shape of face, just the toper face is close to the one end of installation department (121) is less than toper face other end internal diameter.
8. A suction device according to claim 5, characterized in that the sealing ring (12) comprises:
the cross section of the sealing ring (12) body is of a long-strip hole structure, and the length direction of the long-strip hole structure is arranged along the axial direction of the sealing ring (12);
and the rubber rope (123) is arranged at the lower end of the sealing ring (12) body in a penetrating way.
9. A suction device according to any one of claims 1-3, characterized in that the mounting groove (112) is arranged concentrically with the suction cup (11).
10. A suction device according to claim 9, characterized in that the substrate suction surface is formed with a plurality of suction areas spaced apart in the radial direction of the suction cup (11) for accommodating the suction of substrates of different sizes, and at least one sealing ring (12) is provided in each suction area.
11. A suction device according to claim 10, characterized in that one sealing ring (12) is arranged at the edge of each suction zone.
12. A suction device according to any one of claim 10, wherein the suction grooves (111) are in a ring shape concentric with the suction cup (11), and a plurality of rings of suction grooves (111) are concentrically arranged on the inner side of each sealing ring (12), and the suction grooves (111) in the same suction area are communicated with each other.
13. The adsorption device according to claim 12, wherein the upper surface of the adsorption boss formed between two adjacent adsorption grooves (111) is the substrate adsorption surface, the width of each adsorption groove (111) is 0.5-1.5 mm, the width of each adsorption boss is 0.2-0.8 mm, and the width of the adsorption boss is: the width of the adsorption groove (111) is 1: 1.5-1: 2.5.
14. A suction device according to claim 3, characterized in that the suction hole (114) is a tapered hole with a large upper end and a small lower end, and the suction nozzle (25) is a tapered suction nozzle (25) adapted to the tapered hole.
15. The suction device according to claim 3, wherein the upper end of the suction nozzle (25) is 0.2-1 mm higher than the upper end surface of the suction column (24).
16. The adsorption device according to claim 3, wherein the outer wall of the upper end of the adsorption column (24) is provided with an annular clamping groove, the inner wall of the lower end of the suction nozzle (25) is internally provided with an annular convex part (2511) in a protruding manner, and the annular convex part (2511) is in sealing clamping connection with the clamping groove.
17. The suction device according to claim 2, wherein the suction holes (114) are provided in plurality at intervals along a circumferential direction of the suction cup (11), and the suction components are provided in one-to-one correspondence with the suction holes (114).
18. A suction device according to claim 17, characterized in that the interface mechanism (2) further comprises:
the lower end of the adsorption component is connected with the supporting plate (23), a communicating air passage is formed in the supporting plate (23), the vacuum air passage (243) of each adsorption component is communicated with the communicating air passage, and the communicating air passage is communicated with an air source connector (26);
and the vertical motion assembly (22) is connected with the supporting plate (23) and can drive the supporting plate (23) to move along the direction vertical to the substrate adsorption surface.
19. An exposure apparatus, characterized by comprising an adsorption apparatus (10) according to any one of claims 1 to 18.
20. A lithographic apparatus comprising the exposure apparatus of claim 19.
21. A method of adsorbing the substrate by applying the adsorption apparatus (10) according to any one of claims 1 to 18, comprising the steps of:
the lower surface of the substrate is contacted with the upper end of a sealing ring (12), so that a closed vacuum adsorption cavity is formed among the sealing ring (12), the substrate and the sucker (11);
and vacuumizing the adsorption groove (111) until the sealing ring (12) is completely positioned in the mounting groove (112), and completely attaching the lower surface of the substrate to the adsorption surface of the substrate.
22. The suction method according to claim 21, wherein the suction cup (11) has a suction hole (114) formed inside the mounting recess (112), the suction hole (114) penetrating the suction cup (11) in a thickness direction of the suction cup (11), the suction device (10) further comprises a transfer mechanism (2), and the transfer mechanism (2) comprises: the adsorption component is vertical to the adsorption surface of the substrate, the lower end of the adsorption component is positioned at the lower side of the sucker (11), the upper end of the adsorption component can penetrate through and seal the adsorption hole (114), the adsorption component can move relative to the sucker (11) along the direction vertical to the sucker (11), a vacuum air channel (243) is formed in the adsorption component, and the vacuum air channel (243) penetrates through the upper end surface of the adsorption component to adsorb the substrate;
before the substrate contacts the sealing ring (12), the method further comprises the following steps:
the upper end of the adsorption component extends out of the upper end surface of the sucker (11) and is contacted with the substrate;
evacuating the vacuum air channel (243) to cause the adsorption assembly to adsorb the substrate;
the adsorption component drives the substrate to descend until the lower surface of the substrate is contacted with the upper end of the sealing ring (12);
and in the process of vacuumizing the adsorption groove (111), continuously vacuumizing the vacuum air channel (243), and enabling the adsorption assembly to continuously drive the substrate to descend until the adsorption assembly stops descending and stops vacuumizing the vacuum air channel (243) after the upper end of the adsorption assembly is located at the lowest position of the sucker (11) and seals the adsorption hole (114).
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