CN115060935A - Wafer detection sample platform - Google Patents
Wafer detection sample platform Download PDFInfo
- Publication number
- CN115060935A CN115060935A CN202210779293.2A CN202210779293A CN115060935A CN 115060935 A CN115060935 A CN 115060935A CN 202210779293 A CN202210779293 A CN 202210779293A CN 115060935 A CN115060935 A CN 115060935A
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- voussoir
- annular
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- disc
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- 238000001514 detection method Methods 0.000 title claims abstract description 18
- 238000007689 inspection Methods 0.000 claims description 6
- 239000000523 sample Substances 0.000 abstract description 76
- 238000012360 testing method Methods 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 238000001179 sorption measurement Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer detection sample table, and relates to the technical field of semiconductor testing and probe tables; wafer detection sample platform includes the round platform, the annular, voussoir and driving-disc, the inside of round platform is provided with a cavity, the upper surface of round platform is provided with the annular, the bottom and this cavity intercommunication of annular, the annular below is provided with the voussoir along vertical direction slip, the top of voussoir is provided with the end cap that can the shutoff annular, it is provided with the driving-disc to slide along the horizontal direction in the cavity of voussoir below, when the sample can't cover the annular completely, promote the driving-disc through the orientation uncovered direction, the driving-disc upwards promotes the voussoir, make the voussoir that does not cover one side upwards slide, the annular slot part is sealed, the voussoir that covers one side is motionless, make the annular slot form one can be by the complete semi-ring that covers of sample, adsorb the sample through the semi-ring.
Description
Technical Field
The invention discloses a wafer detection sample table, and relates to the technical field of semiconductor testing and probe tables.
Background
The probe station is mainly applied to the semiconductor industry, the photoelectric industry, the integrated circuit and the packaging test, and is distinguished from the operation: manual, semi-automatic, and fully automatic. In the wafer production process, the probe card is mainly used for reliably contacting the wafer, so as to perform electrical performance test and wafer test on the integrated circuit on the wafer, and judge whether the integrated circuit is good or not.
The probe platform mainly comprises a sample platform, an optical element, a probe (a probe card), a manipulator and a network analyzer, when the probe platform is used, the steps of opening a semiconductor parameter analyzer, opening a light source, opening a vacuum pump, placing a sample, inserting a needle, testing and the like are required, wherein the sample platform is mainly used for placing and adsorbing a wafer, when the sample is placed, the sample is usually placed at the middle position of the sample platform through tweezers or a mechanical arm, when the sample is placed, an annular groove on the sample platform and an air hole in the annular groove are completely covered by the sample, a negative pressure is formed in the annular groove through the vacuum pump, so that the adsorption force of the sample platform on the sample is ensured, when the adsorption force of the sample is insufficient, the sample is easy to move in the needle inserting process, and the probe is damaged.
The annular grooves on the existing sample table are all designed fixedly, samples are small in size or irregular in shape due to different cutting modes, the annular grooves cannot adapt to the samples, and therefore when the samples are placed, the samples cannot completely cover the annular grooves, adsorption force is insufficient, and the samples are unstable.
Disclosure of Invention
Aiming at the problem that a sample with an irregular shape cannot be stably adsorbed on a sample table after cutting, the invention provides a wafer detection sample table and a fixing method thereof, wherein a ring groove can be partially closed to form a semi-ring which can be completely covered by the sample, and the semi-ring is used for adsorbing the sample, so that the ring groove can be completely covered by the sample with the irregular shape.
In order to achieve the purpose, the invention provides the following technical scheme:
a wafer inspection sample stage comprising: round platform, annular, voussoir and driving-disc, the inside of round platform is provided with a cavity, and the upper surface of round platform is provided with the annular, the bottom and this cavity intercommunication of annular, it is provided with the voussoir to slide along vertical direction in the cavity of annular below, and the voussoir is circular-arc, a plurality of the voussoir end to end constitute a ring, and the top of voussoir is provided with the end cap that can shutoff annular, and the bottom of voussoir is provided with the inclined plane, it is provided with the driving-disc to slide along the horizontal direction in the cavity of voussoir below, and the top of driving-disc is provided with a frustum, the side of this frustum with the inclined plane sliding contact of voussoir bottom.
Further, the round platform includes: the novel table comprises a table body, a stand column, a first top plate and a second top plate, wherein the stand column is arranged in the middle of the inside of the table body, the first top plate is arranged at the upper end of the stand column, and the second top plate is arranged on the outer side of the first top plate.
Further, the circular truncated cone still includes: reset slider and reset spring, reset slider slip cup joint on the stand, reset and be provided with reset spring between slider and the first roof, the driving-disc in the middle of be provided with the through-hole, the diameter of this through-hole is greater than the diameter of stand, and the last edge department of this through-hole is provided with the chamfer, the side of this chamfer with reset slider's bottom sliding contact.
Furthermore, a vacuum tube is arranged on the side face of the second top plate, and one vacuum tube is arranged on the outer side of each wedge block.
Furthermore, a guide strip is longitudinally arranged on the inner side of the wedge block, and a guide groove is correspondingly arranged on the outer side of the first top plate and the guide strip.
Furthermore, the outer side of the driving disc is of a polygonal structure, the number of sides of the polygonal structure corresponds to the number of the wedge blocks, and an electromagnet is vertically arranged on the outer side of each side of the polygonal structure and the side.
Further, an inner ring groove is arranged on the inner side of the ring groove.
Compared with the prior art, the invention provides a wafer detection sample table and a fixing method thereof, and the wafer detection sample table has the following beneficial effects:
1. the invention discloses a wafer detection sample table, which comprises: the circular platform, the annular, voussoir and driving-disc, the inside of circular platform is provided with a cavity, the upper surface of circular platform is provided with the annular, the bottom and this cavity intercommunication of annular, it is provided with the voussoir to slide along the vertical direction below the annular, the top of voussoir is provided with the end cap that can shutoff annular, it is provided with the driving-disc to slide along the horizontal direction in the cavity of voussoir below, thereby the structure, can realize, when the sample can't cover the annular completely, through pushing the driving-disc towards the direction that does not cover, the driving-disc upwards pushes the voussoir, make the voussoir that does not cover one side upwards slide, the annular slot part is sealed, the voussoir that covers one side does not move, make the annular slot form a semi-ring that can be covered completely by the sample, adsorb the sample through the semi-ring.
2. The invention discloses a method for fixing a wafer detection sample table, which comprises the following steps: step a, placing a sample; and step b, circular groove adsorption and step c, semi-ring groove adsorption, wherein the circular groove is changed into a semi-ring which can be completely covered by the sample by plugging a part of the fixedly arranged circular groove, and the sample is adsorbed by the semi-ring.
Drawings
FIG. 1 is a schematic view of the overall structure of a sample stage according to the present invention;
FIG. 2 is a schematic structural view of a cross section of the sample stage in FIG. 1;
FIG. 3 is a schematic structural diagram of the sample stage after the driving disc slides;
FIG. 4 is a schematic structural diagram of the ring groove adsorbing a sample through a half groove;
FIG. 5 is a schematic view of the internal structure of the sample stage;
FIG. 6 is a schematic structural view of a return slide and a return spring;
FIG. 7 is a schematic view of the construction of a vacuum tube;
FIG. 8 is a schematic view of the sample stage with the second top plate removed;
FIG. 9 is a schematic view of the sample stage with the first top plate and the second top plate removed;
FIG. 10 is a schematic representation of the sample without the cover pocket.
Wherein: 1. a circular truncated cone; 2. a ring groove; 3. a wedge block; 4. a drive plate; 5. a vacuum tube; 6. an electromagnet; 7. an inner ring groove; 1-1, a table body; 1-2, upright columns; 1-3, a first top plate; 1-4, a second top plate; 1-5, resetting the sliding block; 1-6 and a return spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings, and it is to be understood that the described embodiments are only a part of the present invention, and not all of it. All other embodiments that can be derived by a person skilled in the art from the detailed description of the invention without inventive step are within the scope of the invention.
Detailed description of the invention
The following is a specific embodiment of a wafer inspection sample stage according to the present invention.
A wafer inspection sample stage in this embodiment is shown in fig. 1 and 2, and includes: round platform 1, annular 2, voussoir 3 and driving-disc 4, the inside of round platform 1 is provided with a cavity, and the upper surface of round platform 1 is provided with annular 2, annular 2's bottom and this cavity intercommunication, it is provided with voussoir 3 to slide along vertical direction in the cavity of annular 2 below, and voussoir 3 is circular-arc, a plurality of voussoir 3 end to end constitute a ring, and voussoir 3's top is provided with the end cap that can shutoff annular 2, and voussoir 3's bottom is provided with the inclined plane, it is provided with driving-disc 4 to slide along the horizontal direction in the cavity of voussoir 3 below, and the top of driving-disc 4 is provided with a frustum, the side of this frustum with the inclined plane sliding contact of voussoir 3 bottoms.
Referring to fig. 3, 4 and 10 (it should be noted that fig. 10 is a real object diagram for easy understanding only, considering the knowledge of those skilled in the art and the knowledge level of examiners, and even if fig. 10 is not placed, those skilled in the art and examiners will not have difficulty in understanding), in order to solve the problem that the sample cannot completely cover the ring groove 2 and cause unstable adsorption, a plurality of wedges 3 are used to form a ring, the ring groove 2 is blocked by pushing different wedges 3 through the driving disc 4, it is easy to understand that, when the sample cannot completely cover the ring groove 2, the driving disc 4 pushes the wedges 3 upwards by pushing the driving disc 4 towards the uncovered direction, so that the wedges 3 on the uncovered side slide upwards to partially close the ring groove 2 and the wedges 3 on the covered side are not moved, so that the ring groove 2 forms a half ring which can be completely covered by the sample, the sample is adsorbed by the half-ring.
Specifically, as shown in fig. 5, the circular truncated cone 1 includes: the novel table comprises a table body 1-1, upright columns 1-2, first top plates 1-3 and second top plates 1-4, wherein the upright columns 1-2 are arranged in the middle of the inside of the table body 1-1, the first top plates 1-3 are arranged at the upper ends of the upright columns 1-2, and the second top plates 1-4 are arranged on the outer sides of the first top plates 1-3.
In order to solve the problem of connection between the table body 1-1 and the first top plate 1-3, the top of the upright column 1-2 is connected with the first top plate 1-3 by means including but not limited to screw connection, and it is easy to understand that the first top plate 1-3 is connected with the upper end of the upright column 1-2 by screw connection, and the first top plate 1-3 is supported by the upright column 1-2 to form a cavity for accommodating the driving disc 4.
In order to solve the problem of connection between the table body 1-1 and the second top plate 1-4, the table body 1-1 and the second top plate 1-4 are connected by means of bolts, but not limited to, the bolt grooves are formed in the outer sides of the second top plate 1-4, the bolt holes are formed in the table body 1-1 corresponding to the bolt grooves, it is easy to understand that the table body 1-1 and the second top plate 1-4 are connected by installing bolts in the corresponding bolt grooves and bolt holes, and a gap is left between the second top plate 1-4 and the first top plate 1-3 to form the ring groove 2.
In order to avoid the wedge 3 from protruding from the upper end of the annular groove 2 to affect the surface flatness of the circular truncated cone 1, the first top plates 1-3 and the second top plates 1-4 are recessed inwards at positions below the annular groove 2 to form a step surface, so that after the wedge 3 slides upwards, the plug at the upper end plugs the annular groove 2, and the side surface of the wedge 3 is clamped on the step surface, so that the wedge 3 is limited.
Specifically, as shown in fig. 6, the circular truncated cone 1 further includes: the reset device comprises reset sliding blocks 1-5 and reset springs 1-6, wherein the reset sliding blocks 1-5 are sleeved on the upright posts 1-2 in a sliding mode, the reset springs 1-6 are arranged between the reset sliding blocks 1-5 and the first top plates 1-3, a through hole is formed in the middle of the driving plate 4, the diameter of the through hole is larger than that of the upright posts 1-2, a chamfer is arranged on the upper edge of the through hole, and the side face of the chamfer is in sliding contact with the bottoms of the reset sliding blocks 1-5.
In order to reset the driving disk 4, the reset sliders 1-5 and the reset springs 1-6 are adopted, and it is easy to understand that after the driving disk 4 slides, the reset sliders 1-5 slide upwards along the chamfer of the middle through hole of the driving disk 4, and simultaneously the reset springs 1-6 are pressed tightly to apply reset thrust to the driving disk 4, so that the driving disk 4 is reset.
Specifically, as shown in fig. 7, the side surfaces of the second top boards 1 to 4 are provided with vacuum pipes 5, and one vacuum pipe 5 is provided on the outer side of each wedge 3.
In order to solve the connection problem of the vacuum pump and the ring groove 2, a vacuum tube 5 is formed by a connecting tube, a ring tube and a communicating tube, the outer side of the ring tube is connected with the vacuum pump by a connecting tube, the inner side of the ring tube is provided with the communicating tube corresponding to the wedge block 3, one end of the communicating pipe is connected with the annular pipe, the other end pipe orifice of the communicating pipe is arranged at the outer side of the wedge block 3, as is easy to understand, the wedge block 3 and the pipe orifice of the communicating pipe form a switch structure, before the wedge block 3 slides upwards, the pipe orifice of the communicating pipe is in an open state, after the wedge block 3 slides upwards, the pipe orifice of the communicating pipe is covered and sealed, which can realize that after the driving disk 4 slides, when the wedge block 3 pushed upwards blocks the ring groove 2, the mouth of the corresponding communicating pipe is also closed, while the mouth of the communicating pipe corresponding to the wedge 3 which is not pushed is kept open, so that the formed semi-ring is kept communicated with the vacuum pump.
Specifically, as shown in fig. 8, the inner side of the wedge 3 is provided with a guide strip along the longitudinal direction, and the outer side of the first top plate 1-3 is provided with a guide groove corresponding to the guide strip.
In order to guide the wedge 3, a guide bar and a guide groove are used, and it is easy to understand that the guide bar and the guide groove can guide the wedge 3 when the wedge 3 slides up and down, so that the wedge 3 slides stably.
Specifically, as shown in fig. 9, the outer side of the driving disk 4 is a polygonal structure, the number of sides of the polygonal structure corresponds to the number of the wedges 3, and an electromagnet 6 is arranged on the outer side of each side of the polygonal structure and perpendicular to the side.
To solve the driving problem of the driving disc 4, by including but not limited to arranging a plurality of electromagnets 6 in an annular array on the outer side of the driving disc 4, it is easy to understand that when the sample cannot completely cover the ring groove 2, the driving disc 4 is attracted to the side by starting the electromagnet 6 on the uncovered side, so that the driving disc 4 moves to the side.
In particular, the inner side of the ring groove 2 is provided with an inner ring groove 7.
In order to increase the stability of adsorbing a sample, the inner ring groove 7 capable of being completely covered by the sample is arranged in the middle of the circular truncated cone 1, and the inner ring groove is connected with a vacuum pump, so that the inner ring groove 7 with a smaller size is easily and completely covered during adsorption, and the adsorption force is increased.
Detailed description of the invention
The following is a specific embodiment of the fixing method of the wafer detection sample stage of the present invention, which can be implemented independently, and can also be applied to a wafer detection sample stage disclosed in the specific embodiment.
The method for fixing the wafer detection sample stage in the specific embodiment comprises the following steps:
step a, sample placement: placing a sample at the central position of the circular truncated cone 1, completely covering the inner annular groove 7, and adsorbing the middle part of the sample by the inner annular groove 7;
step b, ring groove adsorption: when the sample can completely cover the ring groove 2, the driving disc 4 is fixed, the plug at the top of the wedge block 3 is kept separated from the ring groove 2, the ring groove 2 is communicated with the vacuum tube 5, and the ring groove 2 adsorbs the outer side of the sample;
step c, semi-ring groove adsorption: when the sample can not completely cover the ring groove 2, the electromagnet 6 on the uncovered side of the ring groove 2 is electrified, the rest electromagnets 6 keep the power-off device, the electrified electromagnet 6 pulls the driving disc 4 towards the direction of the electromagnet 6, the side surface of the frustum of the driving disc 4 pushes the wedge block 3 on the side of the electrified electromagnet 6 upwards, the plug at the upper end of the wedge block 3 sliding upwards partially plugs the ring groove 2, meanwhile, the vacuum tube 5 on the outer side of the wedge block 3 sliding upwards is cut off, so that the ring groove 2 after partial plugging forms a half ring groove, and the sample is adsorbed through the half ring groove.
Specifically, use on a wafer inspection sample platform, the sample platform include: the circular truncated cone comprises a circular truncated cone 1, a ring groove 2, a wedge block 3 and a driving disc 4.
Although particular embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these particular embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a wafer inspection sample platform which characterized in that includes: round platform (1), annular (2), voussoir (3) and driving-disc (4), the inside of round platform (1) is provided with a cavity, and the upper surface of round platform (1) is provided with annular (2), and the bottom and this cavity intercommunication of annular (2), it is provided with voussoir (3) to slide along vertical direction in the cavity of annular (2) below, and voussoir (3) are circular-arcly, a plurality of voussoir (3) end to end constitute a ring, and the top of voussoir (3) is provided with the end cap that can shutoff annular (2), and the bottom of voussoir (3) is provided with the inclined plane, it is provided with driving-disc (4) to slide along the horizontal direction in the cavity of voussoir (3) below, and the top of driving-disc (4) is provided with a frustum, the side of this frustum with the inclined plane sliding contact of voussoir (3) bottom.
2. The wafer detection sample stage according to claim 1, wherein the circular truncated cone (1) comprises: the novel table comprises a table body (1-1), upright columns (1-2), first top plates (1-3) and second top plates (1-4), wherein the upright columns (1-2) are arranged in the middle of the inner portion of the table body (1-1), the first top plates (1-3) are arranged at the upper ends of the upright columns (1-2), and the second top plates (1-4) are arranged on the outer sides of the first top plates (1-3).
3. The wafer detection sample stage according to claim 2, wherein the circular table (1) further comprises: the reset device comprises a reset sliding block (1-5) and a reset spring (1-6), wherein the reset sliding block (1-5) is sleeved on an upright post (1-2) in a sliding mode, the reset spring (1-6) is arranged between the reset sliding block (1-5) and a first top plate (1-3), a through hole is formed in the middle of a driving plate (4), the diameter of the through hole is larger than that of the upright post (1-2), a chamfer is arranged at the upper edge of the through hole, and the side face of the chamfer is in sliding contact with the bottom of the reset sliding block (1-5).
4. The wafer detection sample stage according to claim 3, wherein vacuum tubes (5) are arranged on the side surfaces of the second top plates (1-4), and one vacuum tube (5) is arranged on the outer side of each wedge block (3).
5. The wafer detection sample stage as claimed in claim 4, wherein the inner side of the wedge block (3) is provided with a guide strip along the longitudinal direction, and the outer side of the first top plate (1-3) is provided with a guide groove corresponding to the guide strip.
6. A wafer detection sample stage according to any one of claims 1, 2, 3, 4 or 5, wherein the driving disk (4) has a polygonal structure on the outer side, the number of sides of the polygonal structure corresponds to the number of the wedges (3), and an electromagnet (6) is arranged on the outer side of each side of the polygonal structure and perpendicular to the side.
7. A wafer inspection sample stage according to any one of claims 1, 2, 3, 4, 5 or 6, wherein the inner side of the ring groove (2) is provided with an inner ring groove (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210779293.2A CN115060935B (en) | 2022-07-04 | 2022-07-04 | Wafer detection sample platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210779293.2A CN115060935B (en) | 2022-07-04 | 2022-07-04 | Wafer detection sample platform |
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| Publication Number | Publication Date |
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| CN115060935A true CN115060935A (en) | 2022-09-16 |
| CN115060935B CN115060935B (en) | 2023-01-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210779293.2A Active CN115060935B (en) | 2022-07-04 | 2022-07-04 | Wafer detection sample platform |
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|---|---|---|---|---|
| JP2000232083A (en) * | 1999-02-10 | 2000-08-22 | Okamoto Machine Tool Works Ltd | Universal chucking mechanism for semiconductor wafer |
| US20020129819A1 (en) * | 2001-01-31 | 2002-09-19 | Tatyana Feldman | Lumen occluders made from thermodynamic materials |
| CN102270597A (en) * | 2011-08-16 | 2011-12-07 | 清华大学 | Wafer switching equipment and wafer bracket assembly applied to same |
| CN102941546A (en) * | 2012-11-08 | 2013-02-27 | 昆山允可精密工业技术有限公司 | Vacuum absorption platform with two-dimension angle adjustment function |
| CN108861572A (en) * | 2018-07-18 | 2018-11-23 | 南通大学 | A kind of wafer component suction nozzle having both size dimension |
| CN111326462A (en) * | 2018-12-13 | 2020-06-23 | 东泰高科装备科技有限公司 | Vacuum adsorption platform and vacuum adsorption system |
| CN112309947A (en) * | 2019-07-29 | 2021-02-02 | 上海微电子装备（集团）股份有限公司 | Adsorption device, exposure table, photoetching equipment and adsorption method |
| CN214449606U (en) * | 2021-01-26 | 2021-10-22 | 惠州市瑞科机械设备有限公司 | Honeycomb vacuum adsorption platform |
-
2022
- 2022-07-04 CN CN202210779293.2A patent/CN115060935B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000232083A (en) * | 1999-02-10 | 2000-08-22 | Okamoto Machine Tool Works Ltd | Universal chucking mechanism for semiconductor wafer |
| US20020129819A1 (en) * | 2001-01-31 | 2002-09-19 | Tatyana Feldman | Lumen occluders made from thermodynamic materials |
| CN102270597A (en) * | 2011-08-16 | 2011-12-07 | 清华大学 | Wafer switching equipment and wafer bracket assembly applied to same |
| CN102941546A (en) * | 2012-11-08 | 2013-02-27 | 昆山允可精密工业技术有限公司 | Vacuum absorption platform with two-dimension angle adjustment function |
| CN108861572A (en) * | 2018-07-18 | 2018-11-23 | 南通大学 | A kind of wafer component suction nozzle having both size dimension |
| CN111326462A (en) * | 2018-12-13 | 2020-06-23 | 东泰高科装备科技有限公司 | Vacuum adsorption platform and vacuum adsorption system |
| CN112309947A (en) * | 2019-07-29 | 2021-02-02 | 上海微电子装备（集团）股份有限公司 | Adsorption device, exposure table, photoetching equipment and adsorption method |
| CN214449606U (en) * | 2021-01-26 | 2021-10-22 | 惠州市瑞科机械设备有限公司 | Honeycomb vacuum adsorption platform |
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| Publication number | Publication date |
|---|---|
| CN115060935B (en) | 2023-01-31 |
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