CN115060934B - Fixing method of wafer detection sample stage - Google Patents
Fixing method of wafer detection sample stage Download PDFInfo
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- CN115060934B CN115060934B CN202210779270.1A CN202210779270A CN115060934B CN 115060934 B CN115060934 B CN 115060934B CN 202210779270 A CN202210779270 A CN 202210779270A CN 115060934 B CN115060934 B CN 115060934B
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- annular groove
- driving disc
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- 238000001514 detection method Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000001179 sorption measurement Methods 0.000 claims abstract description 16
- 239000000523 sample Substances 0.000 abstract description 85
- 238000012360 testing method Methods 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 238000007689 inspection Methods 0.000 description 4
- 230000001788 irregular Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a method for fixing a wafer detection sample table, which relates to the technical field of semiconductor testing and probe tables; the fixing method of the wafer detection sample stage comprises three steps of sample placement, annular groove adsorption and semi-annular groove adsorption; the method is applied to a wafer detection sample stage, the wafer detection sample stage comprises a round table, an annular groove, a wedge block and a driving disc, a cavity is arranged in the round table, the annular groove is formed in the upper surface of the round table, the bottom of the annular groove is communicated with the cavity, the wedge block is arranged below the annular groove in a sliding mode along the vertical direction, a plug capable of plugging the annular groove is arranged at the top of the wedge block, the driving disc is arranged in the cavity below the wedge block in a sliding mode along the horizontal direction, when a sample cannot completely cover the annular groove, the driving disc is pushed towards the uncovered direction, the wedge block on the uncovered side is pushed upwards by the driving disc, the wedge block on the uncovered side is enabled to upwards slide, the annular groove is sealed, the wedge block on the covered side is enabled to be immobile, the groove is enabled to form a semi-ring capable of being completely covered by the sample, and the sample is adsorbed by the semi-ring.
Description
Technical Field
The invention discloses a method for fixing a wafer detection sample stage, and relates to the technical field of semiconductor testing and probe stages.
Background
The probe station is mainly applied to the semiconductor industry, the photoelectric industry, the integrated circuit and the packaging test, and is distinguished from the operation: manual, semi-automatic, and fully automatic. In the wafer production process, the probe card is mainly used for reliably contacting the wafer, so as to perform electrical performance test and wafer test on the integrated circuit on the wafer, and judge whether the integrated circuit is good or not.
The probe platform mainly comprises a sample platform, an optical element, a probe (a probe card), a manipulator and a network analyzer, when the probe platform is used, the steps of opening the semiconductor parameter analyzer, opening a light source, opening a vacuum pump, placing a sample, inserting a needle, testing and the like are required, wherein the sample platform is mainly used for placing and adsorbing a wafer, when the sample is placed, the sample is usually placed in the middle of the sample platform through tweezers or a mechanical arm, when the sample is placed, an annular groove on the sample platform and air holes in the annular groove are completely covered by the sample, negative pressure is formed in the annular groove through the vacuum pump, so that the adsorption force of the sample platform on the sample is ensured, when the adsorption force of the sample is insufficient, the sample is easy to move in the process of inserting the needle, and the probe is damaged.
The annular grooves on the existing sample table are all designed fixedly, samples are small in size or irregular in shape due to different cutting modes, the annular grooves cannot adapt to the samples, and therefore when the samples are placed, the samples cannot completely cover the annular grooves, adsorption force is insufficient, and the samples are unstable.
Disclosure of Invention
Aiming at the problem that a sample with an irregular shape cannot be stably adsorbed on a sample table after cutting, the invention provides a wafer detection sample table and a fixing method thereof, wherein a ring groove can be partially closed to form a semi-ring which can be completely covered by the sample, and the semi-ring is used for adsorbing the sample, so that the ring groove can be completely covered by the sample with the irregular shape.
In order to achieve the purpose, the invention provides the following technical scheme:
a fixing method of a wafer detection sample table comprises the following steps:
step a, sample placement: placing a sample at the center of the circular truncated cone, completely covering the inner ring groove, and adsorbing the middle part of the sample by the inner ring groove;
step b, ring groove adsorption: when the sample can completely cover the ring groove, the driving disc is fixed, the plug at the top of the wedge block is separated from the ring groove, the ring groove is communicated with the vacuum tube, and the ring groove adsorbs the outer side of the sample;
step c, semi-ring groove adsorption: when the sample can not completely cover the ring groove, the electromagnet on the uncovered side of the ring groove is electrified, the other electromagnets keep the power-off device, the electrified electromagnet pulls the driving disc towards the direction of the electromagnet, the side surface of the frustum of the driving disc pushes the wedge block towards the electrified electromagnet upwards, the upper end of the wedge block which slides upwards plugs the ring groove part, meanwhile, a vacuum tube on the outer side of the wedge block which slides upwards is cut off, the ring groove which is partially plugged forms a half ring groove, and the sample is adsorbed through the half ring groove.
Further, use on a wafer inspection sample platform, the sample platform include: round platform, annular, voussoir and driving-disc.
Compared with the prior art, the invention provides a wafer detection sample table and a fixing method thereof, and the wafer detection sample table has the following beneficial effects:
1. the invention discloses a wafer detection sample table, which comprises: the circular truncated cone comprises a circular truncated cone body, an annular groove, a wedge block and a driving disc, wherein a cavity is formed in the circular truncated cone body, the upper surface of the circular truncated cone body is provided with the annular groove, the bottom of the annular groove is communicated with the cavity, the wedge block is arranged below the annular groove in a sliding mode along the vertical direction, a plug capable of plugging the annular groove is arranged at the top of the wedge block, the driving disc is arranged in the cavity below the wedge block in a sliding mode along the horizontal direction, and therefore the structure can be achieved.
2. The invention discloses a method for fixing a wafer detection sample table, which comprises the following steps: step a, placing a sample; and step b, circular groove adsorption and step c, semi-ring groove adsorption, wherein the circular groove is changed into a semi-ring which can be completely covered by the sample by plugging a part of the fixedly arranged circular groove, and the sample is adsorbed by the semi-ring.
Drawings
FIG. 1 is a schematic view of the overall structure of a sample stage according to the present invention;
FIG. 2 is a schematic structural view of a cross section of the sample stage in FIG. 1;
FIG. 3 is a schematic structural diagram of the sample stage after the driving disc slides;
FIG. 4 is a schematic view of a structure of the ring groove when the sample is adsorbed by the half groove;
FIG. 5 is a schematic view of the internal structure of the sample stage;
FIG. 6 is a schematic structural view of a return slide and a return spring;
FIG. 7 is a schematic view of the construction of a vacuum tube;
FIG. 8 is a schematic view of the sample stage with the second top plate removed;
FIG. 9 is a schematic view of the sample stage with the first top plate and the second top plate removed;
FIG. 10 is a schematic representation of the sample without the cover pocket.
Wherein: 1. a circular truncated cone; 2. a ring groove; 3. wedge blocks; 4. a drive disc; 5. a vacuum tube; 6. an electromagnet; 7. an inner ring groove; 1-1, a table body; 1-2, upright posts; 1-3, a first top plate; 1-4, a second top plate; 1-5, resetting the sliding block; 1-6 and a return spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings, and it is to be understood that the described embodiments are only a part of the present invention, and not all of it. All other embodiments, which can be derived by a person skilled in the art from the detailed description of the invention without inventive step, are within the scope of protection of the invention.
Detailed description of the invention
The following is a specific embodiment of a wafer inspection sample stage according to the present invention.
A wafer inspection sample stage in this embodiment is shown in fig. 1 and 2, and includes: round platform 1, annular 2, voussoir 3 and driving-disc 4, the inside of round platform 1 is provided with a cavity, and the upper surface of round platform 1 is provided with annular 2, annular 2's bottom and this cavity intercommunication, it is provided with voussoir 3 to slide along vertical direction in the cavity of annular 2 below, and voussoir 3 is circular-arc, a plurality of voussoir 3 end to end constitute a ring, and voussoir 3's top is provided with the end cap that can shutoff annular 2, and voussoir 3's bottom is provided with the inclined plane, it is provided with driving-disc 4 to slide along the horizontal direction in the cavity of voussoir 3 below, and the top of driving-disc 4 is provided with a frustum, the side of this frustum with the inclined plane sliding contact of voussoir 3 bottoms.
Referring to fig. 3, 4 and 10 (it should be noted that fig. 10 is a real object diagram for easy understanding, considering the knowledge of those skilled in the art and the knowledge level of examiners, and even though fig. 10 is not placed, those skilled in the art and examiners do not have difficulty in understanding), in order to solve the problem that the sample cannot completely cover the ring groove 2 and the adsorption is unstable, a plurality of wedges 3 are used to enclose a ring, the ring groove 2 is blocked by pushing different wedges 3 through the driving disc 4, it is easy to understand that, when the sample cannot completely cover the ring groove 2, the driving disc 4 pushes the wedges 3 upwards by pushing the driving disc 4 towards the uncovered direction, the wedges 3 on the uncovered side slide upwards, the ring groove 2 is partially closed, the wedges 3 on the covered side are not moved, the ring groove 2 forms a half ring which can be completely covered by the sample, and the sample is adsorbed through the half ring.
Specifically, as shown in fig. 5, the circular truncated cone 1 includes: the novel table comprises a table body 1-1, upright columns 1-2, first top plates 1-3 and second top plates 1-4, wherein the upright columns 1-2 are arranged in the middle of the inside of the table body 1-1, the first top plates 1-3 are arranged at the upper ends of the upright columns 1-2, and the second top plates 1-4 are arranged on the outer sides of the first top plates 1-3.
In order to solve the problem of connection between the table body 1-1 and the first top plate 1-3, the top of the upright column 1-2 is connected with the first top plate 1-3 by means including but not limited to screw connection, and it is easy to understand that the first top plate 1-3 is connected with the upper end of the upright column 1-2 by screw connection, and the first top plate 1-3 is supported by the upright column 1-2 to form a cavity for accommodating the driving disc 4.
In order to solve the problem of connection between the table body 1-1 and the second top plate 1-4, the table body 1-1 and the second top plate 1-4 are connected by means of bolts, but not limited to, the bolt grooves are formed in the outer sides of the second top plate 1-4, the bolt holes are formed in the table body 1-1 corresponding to the bolt grooves, it is easy to understand that the table body 1-1 and the second top plate 1-4 are connected by installing bolts in the corresponding bolt grooves and bolt holes, and a gap is left between the second top plate 1-4 and the first top plate 1-3 to form the ring groove 2.
In order to avoid the wedge 3 from protruding out of the upper end of the annular groove 2 to affect the surface flatness of the circular truncated cone 1, the first top plates 1-3 and the second top plates 1-4 are all sunken inwards to form step surfaces at positions below the annular groove 2, and after the wedge 3 slides upwards, the plugs at the upper end of the wedge 3 plug the annular groove 2, the side surfaces of the wedge 3 are clamped on the step surfaces, and therefore the wedge 3 is limited.
Specifically, as shown in fig. 6, the circular truncated cone 1 further includes: the reset device comprises reset sliding blocks 1-5 and reset springs 1-6, wherein the reset sliding blocks 1-5 are sleeved on the upright posts 1-2 in a sliding mode, the reset springs 1-6 are arranged between the reset sliding blocks 1-5 and the first top plates 1-3, a through hole is formed in the middle of the driving plate 4, the diameter of the through hole is larger than that of the upright posts 1-2, a chamfer is arranged on the upper edge of the through hole, and the side face of the chamfer is in sliding contact with the bottoms of the reset sliding blocks 1-5.
In order to reset the driving disk 4, the reset sliders 1-5 and the reset springs 1-6 are adopted, and it is easy to understand that after the driving disk 4 slides, the reset sliders 1-5 slide upwards along the chamfer of the middle through hole of the driving disk 4, and simultaneously the reset springs 1-6 are pressed tightly to apply reset thrust to the driving disk 4, so that the driving disk 4 is reset.
Specifically, as shown in fig. 7, vacuum tubes 5 are disposed on the lateral sides of the second top plates 1-4, and one vacuum tube 5 is disposed on the outer side of each wedge 3.
In order to solve the connection problem of the vacuum pump and the ring groove 2, a vacuum pipe 5 is formed by a connecting pipe, a ring pipe and a communicating pipe, the outer side of the ring pipe is connected with the vacuum pump through a connecting pipe, the inner side of the ring pipe is provided with a communicating pipe corresponding to the wedge block 3, one end of the communicating pipe is connected with the ring pipe, and the pipe orifice at the other end of the communicating pipe is arranged on the outer side of the wedge block 3.
Specifically, as shown in fig. 8, the inner side of the wedge 3 is provided with a guide strip along the longitudinal direction, and the outer side of the first top plate 1-3 is provided with a guide groove corresponding to the guide strip.
In order to guide the wedge 3, a guide bar and a guide groove are used, and it is easy to understand that when the wedge 3 slides up and down, the guide bar and the guide groove can guide the wedge 3, so that the wedge 3 slides stably.
Specifically, as shown in fig. 9, the outer side of the driving disk 4 is a polygonal structure, the number of sides of the polygonal structure corresponds to the number of the wedges 3, and an electromagnet 6 is arranged on the outer side of each side of the polygonal structure and perpendicular to the side.
To solve the driving problem of the driving disk 4, by including but not limited to arranging a plurality of electromagnets 6 in an annular array on the outer side of the driving disk 4, it is easy to understand that when the sample cannot completely cover the ring groove 2, the driving disk 4 is attracted to the side by starting the electromagnet 6 on the uncovered side, so that the driving disk 4 moves to the side.
In particular, the inner side of the ring groove 2 is provided with an inner ring groove 7.
In order to increase the stability of adsorbing the sample, the inner annular groove 7 which can be completely covered by the sample is arranged in the middle of the circular truncated cone 1, and the inner annular groove is connected with a vacuum pump, so that the inner annular groove 7 with a smaller size can be completely covered easily during adsorption, and the adsorption force is increased.
Detailed description of the invention
The following is a specific embodiment of the fixing method of the wafer detection sample stage of the present invention, which can be implemented independently, and can also be applied to a wafer detection sample stage disclosed in the specific embodiment.
The method for fixing the wafer detection sample stage in the specific embodiment comprises the following steps:
step a, sample placement: placing a sample at the central position of the circular truncated cone 1, completely covering the inner annular groove 7, and adsorbing the middle part of the sample by the inner annular groove 7;
step b, ring groove adsorption: when the sample can completely cover the ring groove 2, the driving disc 4 is fixed, the plug at the top of the wedge block 3 is kept separated from the ring groove 2, the ring groove 2 is communicated with the vacuum tube 5, and the ring groove 2 adsorbs the outer side of the sample;
step c, semi-ring groove adsorption: when the sample can not completely cover the ring groove 2, the electromagnet 6 on the uncovered side of the ring groove 2 is electrified, the rest electromagnets 6 keep the power-off device, the electrified electromagnet 6 pulls the driving disc 4 towards the direction of the electromagnet 6, the side surface of the frustum of the driving disc 4 pushes the wedge block 3 on the side of the electrified electromagnet 6 upwards, the plug at the upper end of the wedge block 3 sliding upwards partially plugs the ring groove 2, meanwhile, the vacuum tube 5 on the outer side of the wedge block 3 sliding upwards is cut off, so that the ring groove 2 after partial plugging forms a half ring groove, and the sample is adsorbed through the half ring groove.
Specifically, use on a wafer inspection sample platform, the sample platform include: the circular truncated cone comprises a circular truncated cone 1, a ring groove 2, a wedge block 3 and a driving disc 4.
Although particular embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these particular embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (1)
1. A fixing method of a wafer detection sample table is characterized by comprising the following steps:
step a, sample placement: placing a sample at the central position of the circular truncated cone (1), completely covering the inner annular groove (7), and adsorbing the middle part of the sample by the inner annular groove (7);
step b, ring groove adsorption: when the sample can completely cover the ring groove (2), the driving disc (4) is fixed, the plug at the top of the wedge block (3) is kept separated from the ring groove (2), the ring groove (2) is communicated with the vacuum tube (5), and the ring groove (2) adsorbs the outer side of the sample;
step c, semi-ring groove adsorption: when the sample can not completely cover the ring groove (2), the electromagnet (6) on the uncovered side of the ring groove (2) is electrified, the rest electromagnets (6) keep the power-off device, the electrified electromagnet (6) pulls the driving disc (4) towards the direction of the electromagnet, the side surface of the frustum of the driving disc (4) pushes the wedge block (3) on the side of the electrified electromagnet (6) upwards, the plug at the upper end of the upwards sliding wedge block (3) partially plugs the ring groove (2), meanwhile, the vacuum tube (5) on the outer side of the upwards sliding wedge block (3) is cut off, the ring groove (2) which is partially plugged forms a semi-ring groove, and the sample is adsorbed through the semi-ring groove;
the fixing method of the wafer detection sample stage is applied to the wafer detection sample stage, and the sample stage comprises the following steps: the circular truncated cone comprises a circular truncated cone (1), a ring groove (2), a wedge block (3) and a driving disc (4);
the round platform (1) comprises: the table comprises a table body (1-1), upright posts (1-2), first top plates (1-3), second top plates (1-4), reset sliders (1-5) and reset springs (1-6), wherein the upright posts (1-2) are arranged in the middle of the inside of the table body (1-1), the first top plates (1-3) are arranged at the upper ends of the upright posts (1-2), and the second top plates (1-4) are arranged on the outer sides of the first top plates (1-3); the reset sliding block (1-5) is sleeved on the upright post (1-2) in a sliding manner, a reset spring (1-6) is arranged between the reset sliding block (1-5) and the first top plate (1-3), a through hole is formed in the middle of the driving disc (4), the diameter of the through hole is larger than that of the upright post (1-2), a chamfer is arranged at the upper edge of the through hole, and the side face of the chamfer is in sliding contact with the bottom of the reset sliding block (1-5);
a vacuum tube (5) is arranged on the side surface of the second top plate (1-4), and a vacuum tube (5) is arranged on the outer side of each wedge block (3);
a guide strip is longitudinally arranged on the inner side of the wedge block (3), and a guide groove is correspondingly arranged on the outer side of the first top plate (1-3) and the guide strip;
the outer side of the driving disc (4) is of a polygonal structure, the number of sides of the polygonal structure corresponds to the number of the wedge blocks (3), and an electromagnet (6) is arranged on the outer side of each side of the polygonal structure and is perpendicular to the side;
the inner side of the ring groove (2) is provided with an inner ring groove (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202210779270.1A CN115060934B (en) | 2022-07-04 | 2022-07-04 | Fixing method of wafer detection sample stage |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210779270.1A CN115060934B (en) | 2022-07-04 | 2022-07-04 | Fixing method of wafer detection sample stage |
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| CN115060934A CN115060934A (en) | 2022-09-16 |
| CN115060934B true CN115060934B (en) | 2023-01-31 |
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| CN113816141A (en) * | 2021-11-01 | 2021-12-21 | 博众精工科技股份有限公司 | Battery cell taking and placing device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2003303876A (en) * | 2002-04-10 | 2003-10-24 | Seiko Instruments Inc | Semiconductor wafer holding mechanism of sample stage |
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| KR20070071565A (en) * | 2005-12-30 | 2007-07-04 | 엘지.필립스 엘시디 주식회사 | Cover for sealing process bath using type of vaccum absorption |
| CN103021919A (en) * | 2012-12-27 | 2013-04-03 | 上海交通大学 | Wafer prealignment device |
| CN105161449A (en) * | 2014-05-30 | 2015-12-16 | 盛美半导体设备（上海）有限公司 | Wafer fixing device |
| CN206931569U (en) * | 2017-06-22 | 2018-01-26 | 珠海市中芯集成电路有限公司 | Wafer sort platform |
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| CN113816141A (en) * | 2021-11-01 | 2021-12-21 | 博众精工科技股份有限公司 | Battery cell taking and placing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115060934A (en) | 2022-09-16 |
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