CN115128434B - Adjustable wafer adsorption table - Google Patents
Adjustable wafer adsorption table Download PDFInfo
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- CN115128434B CN115128434B CN202210789919.8A CN202210789919A CN115128434B CN 115128434 B CN115128434 B CN 115128434B CN 202210789919 A CN202210789919 A CN 202210789919A CN 115128434 B CN115128434 B CN 115128434B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses an adjustable wafer adsorption table, and belongs to the technical field of semiconductor testing; the adjustable wafer chuck table includes: the wafer adsorption device comprises a round table, a spiral groove, tooth blocks, a pull head and air holes, wherein the spiral groove is formed in the upper surface of the round table, the tooth blocks are filled in the spiral groove, the air holes are formed in the starting point of the spiral groove, the pull head is arranged below the tooth blocks, after a wafer is placed on the round table, the tooth blocks are pulled downwards in sequence from the starting point of the spiral groove through the pull head, an adsorption groove covered by the wafer and communicated with the air holes is formed in the spiral groove, the adsorption groove is gradually prolonged along with the movement of the pull head, so that a wafer with an irregular shape is formed, a spiral shape which is as large as possible is formed, the wafer is completely covered by the wafer, and the adsorption groove communicated with the air holes is formed.
Description
Technical Field
The invention discloses an adjustable wafer adsorption table, and belongs to the technical field of semiconductor testing.
Background
The probe station is mainly applied to semiconductor industry, photoelectric industry, integrated circuits and packaging test, and is distinguished from operation: manual, semi-automatic, and fully automatic. In the wafer production process, the method is mainly used for reliably contacting the probe card with the wafer so as to perform electrical performance test and wafer test on the integrated circuits on the wafer to judge whether the integrated circuits are good or not.
The probe station mainly comprises a wafer adsorption station, an optical element, a probe (probe card), a manipulator and a network analyzer, wherein the wafer adsorption station is mainly used for placing and adsorbing wafers, the wafers are placed at the middle position of the wafer adsorption station through tweezers or a mechanical arm, when the wafers are placed, the wafers are required to be completely covered on adsorption grooves and air holes on the wafer adsorption station, negative pressure is formed through a vacuum pump, so that the adsorption force of the wafer adsorption station on the wafers is ensured, when the wafer adsorption force is insufficient, the wafers are easy to move in the needle placing process, the probes are poor in contact with the contacts, and the probes are easy to damage when serious.
The adsorption tanks on the existing wafer adsorption tables are designed to be fixed, and wafers with irregular shapes are different in cutting modes, so that the adsorption tanks with large outer diameters can only be adsorbed through the adsorption tanks with small inner diameters due to incomplete coverage when the existing adsorption tanks adsorb the wafers, and the wafer is unstable due to insufficient adsorption force caused by small diameters.
Disclosure of Invention
Aiming at the problem that the wafer with irregular shape cannot be stably adsorbed on the wafer adsorption table, the invention provides the adjustable wafer adsorption table and the wafer adsorption method, and the adsorption grooves can be formed as large as possible while being suitable for adsorbing wafers with different shapes, so that the wafer adsorption table can stably adsorb the wafers with irregular shapes.
In order to achieve the above purpose, the present invention provides the following technical solutions:
an adjustable wafer chuck table, comprising: round platform, helicla flute, tooth piece, pull head and gas pocket, the round platform upper surface is provided with the helicla flute, the helicla flute is located the helicla flute that the centre of a circle department head and the tail of round platform is not linked to each other for the start point, and the inside of helicla flute is filled there is a plurality of tooth piece, and tooth piece top after filling aligns with the round platform upper surface, the start point department of helicla flute is provided with the gas pocket, the below of tooth piece is provided with the pull head, when the pull head is followed the helicla flute slides, can pull down the tooth piece in proper order, and the tooth piece of being pulled down can interlock each other keeps being located the helicla flute bottom.
Further, the round bench includes: the novel tooth block comprises a table body, a cover plate and a tooth block groove, wherein the table body is hollow, the cover plate is covered at the top of the table body, a spiral groove is formed in the cover plate, and the tooth block groove is formed in the bottom of the spiral groove.
Further, the tooth block includes: the block body slide and set up in tooth piece inslot, the top of block body is provided with the end cap.
Further, the tooth block further includes: the bottom of the block body is provided with a reed, and the lower end of the reed is contacted with the bottom of the tooth block groove.
Further, the tooth block further includes: the block body is provided with the occlusion block towards the upper end of one side of the starting point of the spiral groove, and the other side of the block body is correspondingly provided with the occlusion groove.
Further, the tooth block further includes: the upper end of the guide rod is fixedly connected to the bottom of the block body, the lower end of the guide rod penetrates through the bottom of the tooth block groove and extends to the inside of the table body, and the bottom of the guide rod is provided with a sliding block.
Further, the slider includes: the sliding device comprises a sliding groove, a pull head seat, a sliding rod, a driving ring and a driving motor, wherein the pull head seat is fixedly connected to the bottom of the sliding groove, the pull head seat is arranged on the sliding rod in a sliding mode, the outer end of the sliding rod is fixedly connected to the inner side of the driving ring, and the driving ring is connected with the driving motor.
Further, the pull head further comprises: the guide block and the guide groove are arranged at the bottom of the pull head seat, the guide block is arranged in the guide groove in a sliding mode, and the guide groove and the spiral groove are correspondingly arranged.
Compared with the prior art, the invention provides the adjustable wafer adsorption table and the adsorption method thereof, which have the following beneficial effects:
the first, the invention discloses an adjustable wafer adsorption table, comprising: the wafer adsorbing bench comprises a round table, a spiral groove, tooth blocks, a pull head and air holes, wherein the spiral groove is formed in the upper surface of the round table, the tooth blocks are filled in the spiral groove, the air holes are formed in the starting point of the spiral groove, the pull head is arranged below the tooth blocks, and therefore the structure can be achieved.
The invention discloses a wafer adsorption method, which comprises the following steps: step a, placing a wafer; step b, moving the pull head; step c, moving the tooth block; step d, tooth block engagement; step e, stopping the pull head; the wafer sucking device can realize that along with the movement of the pull head, the sucking groove is gradually prolonged, so that a wafer with irregular shape is formed, the wafer is covered completely in a spiral shape as large as possible, and the sucking groove communicated with the air hole is suitable for sucking the wafer with irregular shape.
Drawings
FIG. 1 is a schematic view of the overall structure of the wafer chuck of the present invention.
Fig. 2 is a schematic cross-sectional view of the wafer chuck shown in fig. 1.
Fig. 3 is a schematic diagram of a wafer chuck according to the present invention.
Fig. 4 is a schematic structural view of the circular truncated cone.
Fig. 5 is a schematic cross-sectional structure of the tooth block after being pulled down.
Fig. 6 is a schematic cross-sectional structure of the tooth block before being pulled down.
Fig. 7 is a schematic view of the structure of the tooth block when engaged.
Fig. 8 is a schematic perspective view of a tooth block.
Fig. 9 is a schematic structural view of the slider.
Fig. 10 is a schematic top view of a slider.
FIG. 11 is a flow chart of the wafer chucking method of the present invention.
Wherein: 1. round bench; 2. a spiral groove; 3. tooth blocks; 4. a pull head; 5. air holes; 1-1, a table body; 1-2, a cover plate; 1-3, tooth block grooves; 3-1, a block; 3-2, plugs; 3-3, reed; 3-4, a bite block; 3-5, occluding grooves; 3-6, a guide rod; 4-1, a chute; 4-2, a pull head seat; 4-3, sliding bar; 4-4 driving ring; 4-5, driving a motor; 4-6, a guide block; 4-7, guiding groove.
Detailed Description
The following description of the embodiments of the present invention will be made more apparent and fully hereinafter with reference to the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
Detailed description of the preferred embodiments
The following is a specific embodiment of an adjustable wafer chuck table according to the present invention.
An adjustable wafer chuck table comprising: round platform 1, helicla flute 2, tooth piece 3, pull head 4 and gas pocket 5, round platform 1 upper surface is provided with helicla flute 2, helicla flute 2 is located the helicla flute that the centre of a circle department head-to-tail of round platform 1 is not connected for the start point, and the inside of helicla flute 2 is filled with a plurality of tooth piece 3, and tooth piece 3 top after filling aligns with round platform 1 upper surface, the start point department of helicla flute 2 is provided with gas pocket 5, the below of tooth piece 3 is provided with pull head 4, when pull head 4 follows helicla flute 2 slides, can downwards pulling tooth piece 3 in proper order, and the tooth piece 3 of being pulled downwards can interlock keep being located the helicla flute 2 bottom each other.
In order to solve the problem that the wafer cannot completely cover the adsorption groove, a spiral groove 2 is arranged in a spiral mode, the spiral groove 2 is spirally extended outwards from the middle position of the circular table 1, the inside of the spiral groove 2 is filled with a plurality of tooth blocks 3, the bottom of each tooth block 3 is provided with a pull head 4, an air hole 5 is arranged at the starting position of the spiral groove 2, and it is easy to understand that when the wafer cannot completely cover the spiral groove 2 after being placed on the circular table 1, the tooth blocks 3 are sequentially pulled downwards from the starting position of the spiral groove 2 to the tail of the spiral groove 2 through the pull heads 4, the top of the pulled tooth blocks 3 fall into the bottom of the spiral groove 2, an adsorption groove covered by the wafer and communicated with the air hole 5 is formed in the spiral groove 2, the adsorption groove is gradually prolonged along with the movement of the pull heads 4 until the next tooth block 3 which is not covered by the wafer is stopped, and accordingly an adaptive wafer is formed, the wafer is completely covered by the wafer, and the adsorption groove communicated with the air hole 5 is formed as large as possible. The adsorption groove can be formed as large as possible according to the shape of the wafer, the wafer is adsorbed, and the adsorption groove as large as possible is formed while the wafer with different shapes is adapted to be adsorbed.
In this schematic view, the spiral groove 2 is unfolded to be a linear groove for easy understanding, the tooth blocks 3 filled in the spiral groove 2 fill the spiral groove 2 to make the upper surface of the round table 1 be a flat surface, the air holes 5 are arranged at the starting point position of the spiral groove 2, the tooth blocks 3 are pulled downwards in sequence in the sliding process of the pull head 4 along the starting point of the spiral groove 2 to the tail part, the pulled tooth blocks 3 are mutually engaged and kept at the bottom of the spiral groove 2, an adsorption groove is formed at the same time, and the length of the pull head 4 is larger than the distance between the two tooth blocks 3, so that the pull head 4 keeps pulling the tooth blocks 3 downwards when moving.
Specifically, referring to fig. 4, the circular table 1 includes: the novel tooth block comprises a table body 1-1, a cover plate 1-2 and a tooth block groove 1-3, wherein the table body 1-1 is hollow, the cover plate 1-2 is covered on the top of the table body 1-1, a spiral groove 2 is arranged on the cover plate 1-2, and the tooth block groove 1-3 is arranged at the bottom of the spiral groove 2.
In order to solve the problem that the tooth block 3 slides up and down, the tooth block groove 1-3 is arranged in the cover plate 1-2, so that it is easy to understand that the tooth block groove 1-3 is used as a chute for the tooth block 3 to slide up and down, and the distance and the position for the tooth block 3 to slide up and down are limited by the tooth block groove 1-3.
Specifically, as shown in fig. 5, the tooth block 3 includes: the block 3-1 and the plug 3-2 are arranged in the tooth block groove 1-3 in a sliding mode, and the plug 3-2 is arranged at the top of the block 3-1.
The block 3-1 is slidably arranged in the tooth block groove 1-3, the spiral groove 2 is blocked by the plug 3-2 at the upper end of the block 3-1, and when the tooth block 3 is pulled downwards by the pull head 4, the plug 3-2 can move downwards along with the block 3-1, so that an adsorption groove is formed in the spiral groove 2.
Specifically, as shown in fig. 6, the tooth block 3 further includes: the bottom of the block 3-1 is provided with a reed 3-3, and the lower end of the reed 3-3 is contacted with the bottom of the tooth block groove 1-3.
In order to solve the problem of resetting the tooth block 3, the reed 3-3 is arranged at the bottom of the block 3-1, so that it is easy to understand that the lower end of the reed 3-3 contacts with the bottom of the tooth block groove 1-3, after the tooth block 3 is pulled down, the reed 3-3 is compressed, after the tooth block 3 is released, the reed 3-3 is restored, and the block 3-1 is pushed to slide upwards for resetting.
Specifically, as shown in fig. 7, the tooth block 3 further includes: the block 3-1 is provided with a snap block 3-4 towards the upper end of one side of the starting point of the spiral groove 2, and the other side of the block 3-1 is correspondingly provided with a snap groove 3-5.
In order to solve the problem of occlusion of the tooth block 3, an occlusion block 3-4 and an occlusion groove 3-5 are arranged on the tooth block 3, it is easy to understand that before the tooth block 3 is pulled down by the pull head 4, the tooth block 3 is kept at a high position by the reed 3-3, when the tooth block 3 is pulled down by the pull head 4, the occlusion groove 3-5 at the front end of the tooth block 3 is separated from the occlusion block 3-4 of the tooth block 3 in front of the tooth block 3, at the moment, the tooth block 3 behind the tooth block 3 is kept at a low position by the pull head 4, after the tooth block 3 is pulled down, the occlusion block 3-4 at the rear end of the tooth block 3 is embedded in the occlusion groove 3-5 at the front end of the tooth block 3 behind the tooth block 3, at the moment, the tooth block 3 behind the tooth block 3 is kept at a low position by the pull head 4, and the tooth block 3 behind the tooth block 3 is kept at a low position by the occlusion block 3-4.
Specifically, as shown in fig. 7 and 8, the tooth block 3 further includes: the upper end of the guide rod 3-6 is fixedly connected to the bottom of the block body 3-1, the lower end of the guide rod 3-6 penetrates through the bottom of the tooth block groove 1-3 and extends to the inside of the table body 1-1, and a sliding block is arranged at the bottom of the guide rod 3-6.
In order to ensure the stability of the tooth block 3 during the up-and-down sliding and avoid the movement of the tooth block 3, the design that the lower end of the guide rod 3-6 passes through the bottom of the tooth block groove 1-3 is adopted, and it is easy to understand that the guide rod 3-6 guides the tooth block 3 during the up-and-down sliding of the tooth block 3.
Specifically, as shown in fig. 9, the slider 4 includes: the sliding groove 4-1, the pull head seat 4-2, the sliding rod 4-3, the driving ring 4-4 and the driving motor 4-5, wherein the pull head seat 4-2 is fixedly connected to the bottom of the sliding groove 4-1, the pull head seat 4-2 is arranged on the sliding rod 4-3 in a sliding manner, the outer end of the sliding rod 4-3 is fixedly connected to the inner side of the driving ring 4-4, and the driving ring 4-4 is connected with the driving motor 4-5.
In order to solve the driving problem of the pull head 4, the pull head seat 4-2 is slidably arranged on the slide rod 4-3, the outer end of the slide rod 4-3 is fixedly connected to the inner side of the driving ring 4-3, it is easy to understand that the pull head 4 can slide on the slide rod 4-3, radial movement of the pull head 4 is achieved, the driving ring 4-4 is rotated through the driving motor 4-5, annular movement of the pull head 4 is achieved, and radial movement and annular movement are combined, so that the pull head 4 can move along the spiral groove 2.
Specifically, referring to fig. 10, the slider 4 further includes: the guide block 4-6 and the guide groove 4-7 are arranged at the bottom of the pull head seat 4-2, the guide block 4-6 is slidably arranged in the guide groove 4-7, and the guide groove 4-7 is correspondingly arranged with the spiral groove 2.
In order to facilitate the movement of the slider 4 along the spiral groove 2, the guide groove 4-7 is arranged corresponding to the spiral groove 2, and it is easy to understand that the slider 4 can be guided by sliding the guide block 4-6 in the guide groove 4-7 when the driving ring 4-4 rotates.
Detailed description of the preferred embodiments
The following is a specific embodiment of a wafer adsorption method according to the present invention.
The wafer adsorption method in this embodiment, the flowchart is shown in fig. 11, and includes the following steps:
step a, placing a wafer: placing the wafer in the center of the round table 1, and completely covering the air holes 5;
step b, moving the pull head: the pull head 4 starts to move from the starting point of the spiral groove 2 along the spiral groove 2 to the tail part of the spiral groove 2;
step c, tooth block movement: the pull head 4 pulls the tooth block 3 downwards, so that the top of the tooth block 3 moves downwards to the inside of the spiral groove 2 from the position aligned with the surface of the round table 1, and an adsorption groove communicated with the air hole 5 is formed between the top of the tooth block 3 and the side surface of the spiral groove 2;
step d, tooth block engagement: the pull head 4 continues to move and pull the tooth blocks 3 downwards, and the tooth blocks 3 pulled down later are meshed with the tooth blocks 3 pulled down firstly, so that all the tooth blocks 3 pulled down are kept at the bottom of the spiral groove 2, and an adsorption groove which is spirally and outwards prolonged from the starting point of the spiral groove 2 is formed;
step e, stopping the pull head: the slider 4 continues to move until it stops when the next tooth 3 is not completely covered by the wafer, and the wafer is sucked by the suction groove formed at this time.
Specifically, the method is applied to an adjustable wafer adsorption platform, and the adjustable wafer adsorption platform comprises the following steps: round table 1, helical groove 2, tooth piece 3, pull head 4 and gas pocket 5.
Although particular embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations may be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. An adjustable wafer chuck table, comprising: the novel tooth structure comprises a round table (1), a spiral groove (2), tooth blocks (3), a pull head (4) and an air hole (5), wherein the spiral groove (2) is arranged on the upper surface of the round table (1), the spiral groove (2) is a spiral groove with a starting point located at the circle center of the round table (1) and not connected end to end, a plurality of tooth blocks (3) are filled in the spiral groove (2), the top of the filled tooth blocks (3) is aligned with the upper surface of the round table (1), the air hole (5) is arranged at the starting point of the spiral groove (2), the pull head (4) is arranged below the tooth blocks (3), when the pull head (4) slides along the spiral groove (2), the tooth blocks (3) can be pulled downwards in sequence, and the tooth blocks (3) pulled downwards can be mutually meshed and kept at the bottom of the spiral groove (2). The spiral groove (2) is internally provided with an adsorption groove covered by a wafer and communicated with the air hole (5), and the adsorption groove is gradually prolonged along with the movement of the pull head (4), so that a wafer with an irregular shape is formed, the spiral groove is as large as possible, the spiral groove is completely covered by the wafer and communicated with the air hole (5), the adsorption groove can be used for forming the adsorption groove as large as possible while being suitable for the adsorption of wafers with different shapes, and the adsorption stability of the wafer adsorption table to the wafer with the irregular shape is ensured.
2. An adjustable wafer chuck table according to claim 1, wherein the table (1) comprises: the novel tooth block comprises a table body (1-1), a cover plate (1-2) and a tooth block groove (1-3), wherein the table body (1-1) is hollow, the top of the table body (1-1) is covered with the cover plate (1-2), the cover plate (1-2) is provided with a spiral groove (2), and the bottom of the spiral groove (2) is provided with a tooth block groove (1-3).
3. An adjustable wafer chuck table according to claim 2, wherein the tooth block (3) comprises: the tooth block comprises a block body (3-1) and a plug (3-2), wherein the block body (3-1) is arranged in a tooth block groove (1-3) in a sliding mode, and the plug (3-2) is arranged at the top of the block body (3-1).
4. An adjustable wafer chuck table according to claim 3, wherein the tooth block (3) further comprises: the bottom of the block body (3-1) is provided with a reed (3-3), and the lower end of the reed (3-3) is contacted with the bottom of the tooth block groove (1-3).
5. An adjustable wafer chuck table according to claim 4, wherein the tooth block (3) further comprises: the novel spiral groove comprises a meshing block (3-4) and a meshing groove (3-5), wherein the meshing block (3-4) is arranged at the upper end of one side, facing the starting point of the spiral groove (2), of the block (3-1), and the meshing groove (3-5) is correspondingly arranged at the other side of the block (3-1).
6. An adjustable wafer chuck table according to claim 5, wherein the tooth block (3) further comprises: the upper end of the guide rod (3-6) is fixedly connected to the bottom of the block body (3-1), the lower end of the guide rod (3-6) penetrates through the bottom of the tooth block groove (1-3) and extends to the inside of the table body (1-1), and a sliding block is arranged at the bottom of the guide rod (3-6).
7. An adjustable wafer chuck table according to any one of claims 1, 2, 3, 4, 5 or 6, wherein the pull head (4) comprises: spout (4-1), pull head seat (4-2), slide bar (4-3), drive ring (4-4) and driving motor (4-5), the bottom fixedly connected with pull head seat (4-2) of spout (4-1), pull head seat (4-2) slip setting is on slide bar (4-3), the outer end fixed connection of slide bar (4-3) is in the inboard of drive ring (4-4), and drive ring (4-4) are connected with driving motor (4-5).
8. An adjustable wafer chuck table according to claim 7, wherein the slider (4) further comprises: the guide block (4-6) and guide groove (4-7), guide block (4-6) is provided with in the bottom of pull head seat (4-2), guide block (4-6) slides and sets up in guide groove (4-7), guide groove (4-7) correspond setting with helicla flute (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210789919.8A CN115128434B (en) | 2022-07-06 | 2022-07-06 | Adjustable wafer adsorption table |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210789919.8A CN115128434B (en) | 2022-07-06 | 2022-07-06 | Adjustable wafer adsorption table |
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| Publication Number | Publication Date |
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| CN115128434A CN115128434A (en) | 2022-09-30 |
| CN115128434B true CN115128434B (en) | 2023-08-11 |
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| CN202210789919.8A Active CN115128434B (en) | 2022-07-06 | 2022-07-06 | Adjustable wafer adsorption table |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0584682A (en) * | 1991-03-29 | 1993-04-06 | Hitachi Ltd | Vacuum chuck device |
| JPH11163107A (en) * | 1997-11-28 | 1999-06-18 | Nikon Corp | Wafer holder |
| JP2001105261A (en) * | 1999-09-30 | 2001-04-17 | Matsushita Electric Ind Co Ltd | Board holding device |
| JP2015138859A (en) * | 2014-01-22 | 2015-07-30 | 三菱電機株式会社 | Wafer chuck and wafer chuck support |
| CN108766927A (en) * | 2018-05-29 | 2018-11-06 | 李涵 | A kind of semiconductor chip production technology |
-
2022
- 2022-07-06 CN CN202210789919.8A patent/CN115128434B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0584682A (en) * | 1991-03-29 | 1993-04-06 | Hitachi Ltd | Vacuum chuck device |
| JPH11163107A (en) * | 1997-11-28 | 1999-06-18 | Nikon Corp | Wafer holder |
| JP2001105261A (en) * | 1999-09-30 | 2001-04-17 | Matsushita Electric Ind Co Ltd | Board holding device |
| JP2015138859A (en) * | 2014-01-22 | 2015-07-30 | 三菱電機株式会社 | Wafer chuck and wafer chuck support |
| CN108766927A (en) * | 2018-05-29 | 2018-11-06 | 李涵 | A kind of semiconductor chip production technology |
Non-Patent Citations (1)
| Title |
|---|
| 采用晶圆传送机器人的晶圆预对准方法;刘劲松;《电子科技》;第第29卷卷(第第11期期);第9-12页 * |
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| CN115128434A (en) | 2022-09-30 |
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