CN113808991A - Wafer adsorption system and method, electronic equipment and readable storage medium - Google Patents
Wafer adsorption system and method, electronic equipment and readable storage medium Download PDFInfo
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- CN113808991A CN113808991A CN202110968221.8A CN202110968221A CN113808991A CN 113808991 A CN113808991 A CN 113808991A CN 202110968221 A CN202110968221 A CN 202110968221A CN 113808991 A CN113808991 A CN 113808991A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
The application is applicable to the technical field of semiconductor auxiliary equipment, and provides a wafer adsorption system, a wafer adsorption method, electronic equipment and a readable storage medium, wherein the system comprises: the power unit is connected with the conversion unit, a containing groove for placing a wafer and an air hole communicated with the containing groove are formed in the surface of the bearing table, and the air hole is communicated with the conversion unit; a power unit for providing a source of compressed air; the conversion unit is used for converting the compressed air output by the power unit into vacuum, adsorbing the wafer through the air holes and the accommodating groove so as to adsorb the wafer on the bearing table, and the vacuum value is a preset value; the wafer is a wafer with warping degree smaller than or equal to 1.5 mm. The wafer adsorption system can provide enough adsorption force to adsorb wafers on the bearing table, and is simple in structure, low in cost and convenient to operate.
Description
Technical Field
The application belongs to the technical field of semiconductor auxiliary equipment, and particularly relates to a wafer adsorption system, a wafer adsorption method, electronic equipment and a readable storage medium.
Background
At present, with the rapid development of science and technology, the development of integrated circuits is more and more rapid under the contrast of moore's law. CSP (Chip Scale Package) is one of the most advanced forms of integrated circuit packaging. Among various packaging forms, the CSP is the smallest area and the smallest thickness, and in the case of the same number of input/output terminals, it occupies a small area of a printed board at the time of assembly. But the structure of the CSP also poses problems during the testing phase. Specifically, the warpage of the CSP has higher and stricter technical requirements for the testing equipment, which causes the CSP to have a problem of insufficient absorption when tested on a machine, especially the CSP with the warpage less than or equal to 1.5 mm.
Disclosure of Invention
The embodiment of the application provides a wafer adsorption system, a wafer adsorption method, electronic equipment and a readable storage medium, and can solve the problem that the CSP adsorption degree of warpage smaller than or equal to 1.5mm is insufficient during testing.
In a first aspect, an embodiment of the present application provides a wafer adsorption system, including: the wafer processing device comprises a power unit, a conversion unit and a bearing table, wherein the power unit is connected with the conversion unit, the surface of the bearing table is provided with a containing groove for placing a wafer and an air hole communicated with the containing groove, and the air hole is communicated with the conversion unit;
the power unit is used for providing a compressed air source;
the conversion unit is used for converting the compressed air output by the power unit into vacuum, adsorbing the wafer through the air hole and the accommodating groove so as to adsorb the wafer on the bearing table, and the vacuum value is a preset value;
the warpage degree of the wafer is less than or equal to 1.5 mm.
Furthermore, the system also comprises a monitoring unit, wherein the monitoring unit is connected between the conversion unit and the bearing table;
and the monitoring unit is used for judging whether the actual vacuum value output to the bearing table meets a preset condition or not.
Further, the monitoring unit is specifically configured to determine that a preset condition is met if the actual vacuum value is within a preset range;
if the actual vacuum value is not in the preset range, the actual vacuum value is not in accordance with the preset condition.
Furthermore, the plummer is the inside sunken round platform of mid portion, the storage tank reaches the gas pocket is located the mid portion.
Further, the system also comprises a display unit, and the display unit is used for displaying the actual vacuum value output to the bearing table by the conversion unit.
In a second aspect, an embodiment of the present application provides a wafer adsorption method, including:
the conversion unit converts compressed air provided by the power unit into vacuum, and the vacuum value is a preset value;
adsorbing the wafer through the air holes and the accommodating groove so as to adsorb the wafer on the bearing table;
wherein, the wafer is the wafer with warping degree less than or equal to 1.5 mm.
In a third aspect, an embodiment of the present application provides a wafer adsorption method, including:
the monitoring unit judges whether the actual vacuum value output to the bearing table meets a preset condition or not.
Further, whether the actual vacuum value output to the bearing table meets the preset condition or not is judged, and the method comprises the following steps:
if the actual vacuum value is in a preset range, the actual vacuum value meets a preset condition;
if the actual vacuum value is not in the preset range, the actual vacuum value is not in accordance with the preset condition.
In a fourth aspect, an embodiment of the present application provides an electronic device, which includes a memory, a processor, and a computer program stored in the memory and executable on the processor, and the processor, when executing the computer program, implements the method according to any one of the second aspect or the third aspect.
In a fifth aspect, the present application provides a computer-readable storage medium, which stores a computer program, and when the computer program is executed by a processor, the computer program implements the method according to the second aspect or any one of the third aspects.
In a sixth aspect, the present application provides a computer program product, which when run on an electronic device, causes the electronic device to perform the method of any one of the second aspect or the third aspect.
It is understood that the beneficial effects of the second to sixth aspects can be seen from the description of the first aspect, and are not described herein again.
Compared with the prior art, the embodiment of the application has the advantages that:
the embodiment of the application provides compressed air source through power pack, and the compressed air that the conversion unit exported power pack converts the vacuum into, adsorbs the wafer through gas pocket and storage tank to the messenger adsorbs the wafer on the plummer, and the vacuum value is predetermined numerical value, can provide sufficient adsorption affinity and adsorb the wafer on the plummer, and this system simple structure, with low costs, the operation of being convenient for.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic diagram of a system provided by an embodiment of the present application;
FIG. 2 is a schematic diagram of a system provided by another embodiment of the present application;
fig. 3 is a schematic flow chart illustrating a wafer adsorbing method according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of an electronic device provided in an embodiment of the present application.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It should also be understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
As used in this specification and the appended claims, the term "if" may be interpreted contextually as "when", "upon" or "in response to" determining "or" in response to detecting ". Similarly, the phrase "if it is determined" or "if a [ described condition or event ] is detected" may be interpreted contextually to mean "upon determining" or "in response to determining" or "upon detecting [ described condition or event ]" or "in response to detecting [ described condition or event ]".
Furthermore, in the description of the present application and the appended claims, the terms "first," "second," "third," and the like are used for distinguishing between descriptions and not necessarily for describing or implying relative importance.
Reference throughout this specification to "one embodiment" or "some embodiments," or the like, means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather "one or more but not all embodiments" unless specifically stated otherwise. The terms "comprising," "including," "having," and variations thereof mean "including, but not limited to," unless expressly specified otherwise.
CSP is a package primarily used for low input/low output end count circuits. CSP has the following characteristics: small size, good electrical and thermal properties, light weight and thinness. Due to the characteristics of the CSP wafer, the CSP wafer can generate certain warping degree, the warping degree of each CSP wafer is different, and the greater the warping degree is, the farther the distance from the bearing equipment is, so that the warping degree of the CSP wafer has higher and stricter requirements on the equipment in the testing stage. The embodiment of the application provides a wafer adsorption system, a wafer adsorption method, electronic equipment and a readable storage medium, and solves the problem that the CSP (chip size package) with warping degree smaller than or equal to 1.5mm is insufficient in adsorption degree during testing.
Fig. 1 is a schematic diagram of a system according to an embodiment of the present application. By way of example and not limitation, as shown in FIG. 1, the system includes: the wafer processing device comprises a power unit 10, a conversion unit 20 and a bearing table 30, wherein the power unit 10 is connected with the conversion unit 20, a containing groove (not shown) for placing a wafer and an air hole (not shown) communicated with the containing groove are formed in the surface of the bearing table 30, and the air hole is communicated with the conversion unit 20. Wherein, the warpage degree is less than or equal to 1.5 mm.
A power unit 10 for providing a source of compressed air. A stable source of compressed air is provided by the power unit 10.
The converting unit 20 is configured to convert the compressed air output by the power unit 10 into vacuum, and adsorb the wafer through the air holes and the accommodating groove, so as to adsorb the wafer on the susceptor 30, where the vacuum value is a preset value.
As one implementation, the converting unit 20 is provided with a vacuum generator, by which stable compressed air output from the power unit 10 is converted into vacuum, thereby generating stable vacuum.
The preset value is set according to different types of wafers, so that the wafers can be stably adsorbed on the susceptor 30. Types include size and/or warp.
Specifically, the vacuum that produces the numerical value of predetermineeing passes through the gas pocket and exports to plummer 30 on, and the vacuum from the gas pocket output is along the storage tank diffusion for vacuum is laid evenly in the storage tank, thereby can adsorb the wafer that the angularity is less than or equal to 1.5mm on plummer 30 steadily.
In this embodiment, the wafer placed in the containing slot is transferred from the previous execution step after being jointly operated by an external device, and the external device includes a motor control unit, a mechanical execution unit and a communication unit.
This embodiment provides compressed air source through power pack, and the compressed air that the converting unit exported power pack converts the vacuum to, adsorbs the wafer through gas pocket and storage tank to the messenger adsorbs the wafer on the plummer, and the vacuum value is predetermined numerical value, can provide sufficient adsorption affinity with the wafer adsorb on the plummer, and this system simple structure, with low costs, the operation of being convenient for.
In another embodiment, the system further comprises a monitoring unit connected between the conversion unit and the bearing table;
and the monitoring unit is used for judging whether the actual vacuum value output to the bearing table meets the preset condition or not.
Specifically, if the actual vacuum value is within the preset range, the actual vacuum value meets the preset condition;
if the actual vacuum value is not in the preset range, the actual vacuum value is not in accordance with the preset condition.
The monitoring unit may be a vacuum solenoid valve, but not limited thereto.
In this embodiment, the preset range is a range between a preset upper limit value and a preset lower limit value, and the preset upper limit value and the preset lower limit value are set according to an actual scene, so that the system can avoid time delay during vacuum breaking, and thus, the product is prevented from being damaged; the situation of no adsorption is avoided.
It should be noted that the preset upper limit value and the preset lower limit value of the preset range need to be within the monitoring range of the monitoring unit, so as to avoid the situation of incapability of monitoring or monitoring errors.
Whether this embodiment accords with the preset condition through judging the actual vacuum value of exporting to the plummer, whether can real-time supervision actual vacuum value reasonable, guarantee that the wafer adsorbs on the plummer, does not influence the executive action of next link simultaneously.
In another embodiment, the converting unit is further configured to adjust the vacuum value according to the determination result of the monitoring unit.
Specifically, if the judgment result of the monitoring unit is that the real vacuum value does not meet the preset condition, the difference value between the real vacuum value and the boundary value of the preset range is calculated, and the vacuum value is adjusted according to the difference value, so that the real vacuum value is in the preset range. The boundary value is a preset upper limit value or a preset lower limit value.
In another embodiment, the susceptor is a circular truncated cone with an inwardly recessed middle portion, and the accommodating groove and the air holes are formed in the middle portion.
Correspondingly, the bearing table is a circular table with high periphery and low middle. Through the bearing table, the wafer is better adsorbed on the bearing table.
In another embodiment, the system further comprises a display unit, the display unit is connected with the conversion unit, and the display unit is used for displaying the actual vacuum value output to the bearing table by the conversion unit. The real vacuum value can be known by users in time, so that the conversion unit can be adjusted in time.
Fig. 2 is a schematic diagram of a system according to another embodiment of the present application. By way of example and not limitation, as shown in fig. 2, the system includes: the wafer processing device comprises a power unit 10, a conversion unit 20, a bearing table 30, a monitoring unit 40 and a display unit 50, wherein the power unit 10 is connected with the conversion unit 20, a containing groove (not shown) for placing a wafer 60 and an air hole (not shown) communicated with the containing groove are formed in the surface of the bearing table 30, the air hole is communicated with the conversion unit 20, the monitoring unit 40 is connected between the conversion unit 20 and the bearing table 30, and the display unit 50 is connected with the conversion unit 20.
Wherein, the power unit 10 is used for providing a compressed air source. The converting unit 20 is configured to convert the compressed air output by the power unit 10 into vacuum, and adsorb the wafer 60 through the air holes and the accommodating groove, so that the wafer 60 is adsorbed on the susceptor 30, and the vacuum value is a preset value. The monitoring unit 40 is configured to determine whether the actual vacuum value output to the susceptor 30 meets a preset condition. The display unit 50 is used for displaying the actual vacuum value output to the bearing table 30 by the conversion unit 20.
Fig. 3 is a schematic flow chart of a wafer adsorbing method according to an embodiment of the present application, corresponding to the system described in the above embodiment. By way of example and not limitation, as shown in fig. 3, the method comprises:
s301: the conversion unit converts compressed air provided by the power unit into vacuum, and the vacuum value is a preset value;
s302: adsorbing the wafer through the air holes and the accommodating groove so as to adsorb the wafer on the bearing table;
wherein, the warpage degree is less than or equal to 1.5 mm.
This embodiment is through converting the compressed air that provides power pack into the vacuum, and the vacuum value is for predetermineeing numerical value, adsorbs the wafer through gas pocket and storage tank to the messenger adsorbs the wafer on the plummer, can provide sufficient adsorption affinity and adsorb the wafer on the plummer.
Corresponding to the system described in the above embodiments, another embodiment of the present application provides a wafer chucking method, which includes, by way of example and not limitation:
the monitoring unit judges whether the actual vacuum value output to the bearing table meets the preset condition or not.
Specifically, if the actual vacuum value is within the preset range, the actual vacuum value meets the preset condition;
if the actual vacuum value is not in the preset range, the actual vacuum value is not in accordance with the preset condition.
Whether this embodiment accords with the preset condition through judging the actual vacuum value of exporting to the plummer, whether can real-time supervision actual vacuum value reasonable, guarantee that the wafer adsorbs on the plummer, does not influence the executive action of next link simultaneously.
Fig. 4 is a schematic structural diagram of an electronic device according to an embodiment of the present application. As shown in fig. 4, the electronic apparatus 4 of this embodiment includes: at least one processor 40 (only one shown in fig. 4), a memory 41, and a computer program 42 stored in the memory 41 and executable on the at least one processor 40, the steps of any of the various method embodiments described above being implemented when the computer program 42 is executed by the processor 40.
The electronic device 4 may be a desktop computer, a notebook, a palm computer, a cloud server, or other computing devices. The electronic device may include, but is not limited to, a processor 40, a memory 41. Those skilled in the art will appreciate that fig. 4 is merely an example of the electronic device 4, and does not constitute a limitation of the electronic device 4, and may include more or less components than those shown, or combine some of the components, or different components, such as an input-output device, a network access device, etc.
The Processor 40 may be a Central Processing Unit (CPU), and the Processor 40 may be other general purpose Processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), an off-the-shelf Programmable Gate Array (FPGA) or other Programmable logic device, discrete Gate or transistor logic device, discrete hardware component, or the like. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
The memory 41 may in some embodiments be an internal storage unit of the electronic device 4, such as a hard disk or a memory of the electronic device 4. The memory 41 may also be an external storage device of the electronic device 4 in other embodiments, such as a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card), and the like, which are provided on the electronic device 4. Further, the memory 41 may also include both an internal storage unit and an external storage device of the electronic device 4. The memory 41 is used for storing an operating system, an application program, a BootLoader (BootLoader), data, and other programs, such as program codes of the computer program. The memory 41 may also be used to temporarily store data that has been output or is to be output.
It should be noted that, for the information interaction, execution process, and other contents between the above-mentioned devices/units, the specific functions and technical effects thereof are based on the same concept as those of the embodiment of the method of the present application, and specific reference may be made to the part of the embodiment of the method, which is not described herein again.
It will be apparent to those skilled in the art that, for convenience and brevity of description, only the above-mentioned division of the functional units and modules is illustrated, and in practical applications, the above-mentioned function distribution may be performed by different functional units and modules according to needs, that is, the internal structure of the apparatus is divided into different functional units or modules to perform all or part of the above-mentioned functions. Each functional unit and module in the embodiments may be integrated in one processing unit, or each unit may exist alone physically, or two or more units are integrated in one unit, and the integrated unit may be implemented in a form of hardware, or in a form of software functional unit. In addition, specific names of the functional units and modules are only for convenience of distinguishing from each other, and are not used for limiting the protection scope of the present application. The specific working processes of the units and modules in the system may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
The embodiments of the present application further provide a computer-readable storage medium, where a computer program is stored, and when the computer program is executed by a processor, the computer program implements the steps in the above-mentioned method embodiments.
The embodiments of the present application provide a computer program product, which when running on a mobile terminal, enables the mobile terminal to implement the steps in the above method embodiments when executed.
The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, all or part of the processes in the methods of the embodiments described above can be implemented by a computer program, which can be stored in a computer-readable storage medium and can implement the steps of the embodiments of the methods described above when the computer program is executed by a processor. Wherein the computer program comprises computer program code, which may be in the form of source code, object code, an executable file or some intermediate form, etc. The computer readable medium may include at least: any entity or device capable of carrying computer program code to a photographing apparatus/electronic device, a recording medium, computer Memory, Read-Only Memory (ROM), Random Access Memory (RAM), an electrical carrier signal, a telecommunications signal, and a software distribution medium. Such as a usb-disk, a removable hard disk, a magnetic or optical disk, etc. In certain jurisdictions, computer-readable media may not be an electrical carrier signal or a telecommunications signal in accordance with legislative and patent practice.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and reference may be made to the related descriptions of other embodiments for parts that are not described or illustrated in a certain embodiment.
Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus/network device and method may be implemented in other ways. For example, the above-described apparatus/network device embodiments are merely illustrative, and for example, the division of the modules or units is only one logical division, and there may be other divisions when actually implementing, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not implemented. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.
Claims (10)
1. A wafer chucking system, comprising: the wafer processing device comprises a power unit, a conversion unit and a bearing table, wherein the power unit is connected with the conversion unit, the surface of the bearing table is provided with a containing groove for placing a wafer and an air hole communicated with the containing groove, and the air hole is communicated with the conversion unit;
the power unit is used for providing a compressed air source;
the conversion unit is used for converting the compressed air output by the power unit into vacuum, adsorbing the wafer through the air hole and the accommodating groove so as to adsorb the wafer on the bearing table, and the vacuum value is a preset value;
the warpage degree of the wafer is less than or equal to 1.5 mm.
2. The system of claim 1, further comprising a monitoring unit connected between the conversion unit and the carrier;
and the monitoring unit is used for judging whether the actual vacuum value output to the bearing table meets a preset condition or not.
3. The system according to claim 2, wherein the monitoring unit is specifically configured to meet a predetermined condition if the actual vacuum value is within a predetermined range;
if the actual vacuum value is not in the preset range, the actual vacuum value is not in accordance with the preset condition.
4. The system of claim 1, wherein the susceptor is a circular truncated cone having an inwardly recessed middle portion, and the receiving slot and the gas hole are disposed in the middle portion.
5. The system of claim 1, further comprising a display unit, wherein the display unit is connected to the converting unit, and the display unit is configured to display the actual vacuum value output to the carrier by the converting unit.
6. A wafer adsorption method applied to the system according to any one of claims 1 to 5, comprising:
the conversion unit converts compressed air provided by the power unit into vacuum, and the vacuum value is a preset value;
adsorbing the wafer through the air holes and the accommodating groove so as to adsorb the wafer on the bearing table;
wherein, the wafer is the wafer with warping degree less than or equal to 1.5 mm.
7. A wafer adsorption method applied to the system according to any one of claims 1 to 5, comprising:
the monitoring unit judges whether the actual vacuum value output to the bearing table meets a preset condition or not.
8. The method of claim 7, wherein determining whether the actual vacuum value outputted to the carrier meets a predetermined condition comprises:
if the actual vacuum value is in a preset range, the actual vacuum value meets a preset condition;
if the actual vacuum value is not in the preset range, the actual vacuum value is not in accordance with the preset condition.
9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the method of claim 6 or any of claims 7-8 when executing the computer program.
10. A computer-readable storage medium, in which a computer program is stored which, when being executed by a processor, carries out the method according to claim 6 or any one of claims 7-8.
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| CN202110968221.8A CN113808991A (en) | 2021-08-23 | 2021-08-23 | Wafer adsorption system and method, electronic equipment and readable storage medium |
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| CN202110968221.8A CN113808991A (en) | 2021-08-23 | 2021-08-23 | Wafer adsorption system and method, electronic equipment and readable storage medium |
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Application publication date: 20211217 |