CN106653671B - A kind of sucker and its adsorption method - Google Patents
A kind of sucker and its adsorption method Download PDFInfo
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- CN106653671B CN106653671B CN201510731089.3A CN201510731089A CN106653671B CN 106653671 B CN106653671 B CN 106653671B CN 201510731089 A CN201510731089 A CN 201510731089A CN 106653671 B CN106653671 B CN 106653671B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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Abstract
The invention discloses a kind of sucker and its adsorption methods, including suction cup main body, the center of the suction cup main body is equipped with the through-hole for substrate handover, the suction cup main body be equipped at least one protrusion suction cup main body and with the concentric sealing ring being distributed of the through-hole, annular groove is offered on the sealing ring, several vacuum holes being connected to external vacuum source are equipped in the annular groove, when adsorbing the substrate, it is passed through vacuum from the vacuum hole, the annular groove between the sealing ring and the substrate is formed as vacuum chamber.The present invention uses the structure of ring vaccum chamber, can gradually improve the gap between substrate and ring vaccum chamber, can reduce the gap between adjacent outer ring ring vaccum chamber and substrate, the final effective absorption realized to warpage substrate after the ring vaccum chamber absorption of inner ring.
Description
Technical field
The present invention relates to a kind of sucker and its adsorption methods, are used for absorbable substrate especially warpage base in a photolithographic process
Bottom belongs to field of manufacturing semiconductor devices.
Background technique
Photoetching is a kind of technology by mask pattern exposure image to substrate, is in process for fabrication of semiconductor device
An important step.Known lithographic equipment includes stepping repetitive and step-by-step scanning type.In above-mentioned lithographic equipment, need
Carrier with corresponding device as mask and substrate is mounted with mask/substrate carrier and generates accurate mutually fortune
It moves to meet photoetching needs.In the mutual movement of mask and substrate, it must guarantee mask and substrate always by reliably fixed
Position.The device for being directly used in positioning substrate is referred to as sucker.Sucker is driven by a series of drivers, can produce multiple freedom degrees
Movement makes substrate carry out required position adjustment to complete the leveling and focusing to substrate.The precision of sucker is to lithographic equipment
Focus (depth of focus) and overlay (alignment precision) have a great impact, and embody the surface precision of lower surface on it, and certainly
The clamping deflection of body.It proposes that substrate is made to be located in sucker upper surface by the way of vacuum suction in the prior art, proposes
The distribution of several forms in sucker upper surface is influenced with optimizing deformation, thermal stress for generating in vacuum suction on substrate etc..But it is existing
There is the adsorption design being not directed in patent and documents and materials for warpage substrate.
The sucker that the prior art provides, including suction cup main body 01, for the through-hole 015 and external vacuum of the handover of substrate 02
The vacuum hole 014 of source connection, vacuum hole 014 and sealing ring 012 and substrate 02 generate vacuum chamber 011, by external pressure with
Pressure difference between vacuum chamber 011 generates adsorption capacity and the solid and reliable pressure of substrate 02 is attached in suction cup main body 01, meanwhile, true
It is uniformly distributed with several 013 features of salient point in cavity 011, plays a supporting role to substrate 02, prevents substrate 02 because of absorption
Power and be deformed, influence lithographic accuracy.
The sucker of the substrate relatively good for face type, the prior art can be adsorbed effectively, but then for warpage substrate
It cannot effectively adsorb, the analysis of causes is as shown in figure 3, suction cup main body 01, sealing ring 012 and warpage substrate 04 are formed together vacuum chamber
011, it is contemplated that adsorption capacity is generated by vacuum chamber 011 and outside atmospheric pressure difference, warpage substrate 04 is adsorbed on sucker 01.But
Being is diagram " bowl-shape " due to the main warped shapes of warpage substrate 04, and the vacuum chamber 011 that the substrate 04 and sucker 01 are formed is right
Side has bigger gap (gap size is influenced by basement warping degree), thus leads to vacuum chamber 011 and outside atmosphere phase
It is logical to form itself and the effective pressure difference of outside atmosphere in turn, it cannot also generate effective adsorption capacity and be adsorbed on substrate 04
On sucker 01.Also the adsorption design for warpage substrate 04 is not directed in existing patent and documents and materials.
Summary of the invention
Technical problem to be solved by the invention is to provide the suckers that one kind can effectively adsorb warpage substrate, also provide one
The method that kind carries out substrate absorption using above-mentioned sucker.
To achieve the goals above, the present invention is realised by adopting the following technical scheme: a kind of sucker, including sucker master
Body, the center of the suction cup main body are equipped with the through-hole for substrate handover, and the suction cup main body is equipped at least one protrusion and inhales
Disc main body and with the concentric sealing ring being distributed of the through-hole, annular groove is offered on the sealing ring, in the annular groove
Equipped with several vacuum holes being connected to external vacuum source, when adsorbing the substrate, it is passed through vacuum from the vacuum hole, is located at described
Annular groove between sealing ring and the substrate is formed as vacuum chamber.
It using above-mentioned technology, is first adsorbed by the ring vaccum chamber of inner ring, then the ring vaccum chamber of outer ring successively adsorbs
Mode, can gradually improve the gap between substrate and ring vaccum chamber, phase can be reduced after the ring vaccum chamber absorption of inner ring
Gap between adjacent outer ring ring vaccum chamber and substrate is conducive to the absorption of the ring vaccum chamber of outer ring, final to realize to warpage
Effective absorption of substrate.
As an improvement of the present invention, several salient points are also evenly distributed in the suction cup main body.
Preferably, the salient point is distributed in a ring.
Preferably, the height of the sealing ring is identical as the height of the salient point.
Preferably, the height of the sealing ring and the salient point is 50um~100um.
Preferably, the salient point is cylinder.
Preferably, the diameter of the salient point is 0.1mm~0.3mm.
Preferably, between the salient point and salient point between be divided into 3mm~6mm.
Preferably, the width of the annular groove is 1mm~1.5mm.
Preferably, the quantity of the vacuum hole in an annular groove is 3~4.
Using above-mentioned technology, the salient point can play a supporting role to substrate, prevent substrate from generating because of adsorption capacity
Deformation, influences lithographic accuracy.The salient point can also reduce influence and reduction sucker of the pollution such as particle to substrate adsorption plane type
Abrasion, make sucker have higher adaptability for working condition.
As an improvement of the present invention, the vacuum source that a sealing ring is connected to the vacuum hole on another sealing ring
Control it is independent of one another.
Using above-mentioned technology, the gas circuit control of ring vaccum chamber independently of one another, can be controlled successively annular true from inside to outside
The adsorption operations of cavity realize better adsorption effect.
Preferably, the suction cup main body is thyrite.
Preferably, the suction cup main body is aluminum alloy materials.
Compared with prior art, using the structure of multiple ring vaccum chambers, substrate and ring vaccum chamber can gradually be improved
Between gap, gap between adjacent outer ring ring vaccum chamber and substrate can be reduced after the ring vaccum chamber absorption of inner ring, had
Conducive to the absorption of the ring vaccum chamber of outer ring, the final effective absorption realized to warpage substrate.Substrate is risen using bump structure
To supporting role, it can reduce the abrasion of influence and reduction sucker of the pollution such as particle to substrate adsorption plane type, there is sucker
Higher adaptability for working condition.
Preferably, the spacing preferred scope between the two adjacent sealing rings is 10mm~20mm.
The present invention also provides a kind of method for carrying out substrate absorption using above-mentioned sucker, a sealing ring and another sealing
The control for the vacuum source that vacuum hole on ring is connected to is independent of one another, radial by interior along the through-hole when carrying out substrate absorption
The vacuum source that the vacuum hole on the sealing ring is connected to successively is opened outward, carries out timesharing absorption.
Using above-mentioned technology, the adsorption operations of annular vacuum chamber are successively controlled from inside to outside, and the ring vaccum chamber of inner ring is inhaled
The attached gap that can reduce between adjacent outer ring ring vaccum chamber and substrate, is conducive to the absorption of the ring vaccum chamber of outer ring, can
To realize better adsorption effect.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of sucker in the prior art；
Fig. 2 is the top view of sucker salient point distribution in the prior art；
Fig. 3 is the schematic illustration that prior art sucker cannot adsorb warpage substrate；
Fig. 4 is the schematic cross-sectional view of sucker in the embodiment of the invention；
Fig. 5 is the top view of sucker in the embodiment of the invention；
Fig. 6 is the absorption principle schematic diagram of sucker in the embodiment of the invention.
In Fig. 1~3: 01 is suction cup main body, and 011 is vacuum chamber, and 012 is sealing ring, and 013 is salient point, and 014 is vacuum hole,
015 is through-hole, and 02 is substrate, and 04 is warpage substrate；
In Fig. 4~6: 03 is suction cup main body, and 031 is annular groove, and 032 is sealing ring, and 033 is salient point, and 034 is vacuum
Hole, 035 is through-hole, and 04 is warpage substrate.
Specific embodiment
The specific embodiment of invention is described in further detail with reference to the accompanying drawing.
As shown in Figure 4 and Figure 5, the present invention provides a kind of sucker, including suction cup main body 03, wherein the suction cup main body 03
Be provided centrally with for substrate handover through-hole 035, the suction cup main body 03 be equipped at least one protrude from suction cup main body
03 and with the concentric sealing ring 032 being distributed of through-hole 035, offer annular groove 031 on the sealing ring 032, the annular is recessed
Several vacuum holes 034 being connected to external vacuum source are equipped in slot 031, correspondingly the vacuum hole 034 runs through and the annular
The suction cup main body 03 of 031 corresponding position of groove is connected to vacuum source.When absorbable substrate 04, it is passed through very from the vacuum hole 034
Sky, the annular groove 031 between the sealing ring 032 and substrate are formed as ring vaccum chamber.
With continued reference to Fig. 5, several salient points 033 are evenly distributed in the suction cup main body 03 around ring vaccum chamber, to base
Bottom is played a supporting role, and substrate is prevented to be deformed because of adsorption capacity, influences lithographic accuracy.The specific distribution side of salient point 033
Formula is not fixed, and is finally uniformly distributed, and may preferably be annular spread.The material of suction cup main body 03 is generally silicon carbide ceramics
(SiC) material can also be aluminium alloy or other materials.
The scheme that the ring vaccum chamber that the present invention uses is combined with salient point 033, i.e., the case where retaining part salient point 033
It is lower that the biggish vacuum chamber 011 of script area in the prior art become the separated lesser annular of the area in concentric circles distribution is true
Although cavity, ring vaccum cavity area become smaller, but its pressure generated is also enough to be adsorbed on substrate is solid and reliable on sucker.
Salient point 033 has the effect that, firstly, salient point 033 can play a supporting role to substrate, prevents substrate from producing because of adsorption capacity
Change shape, influences lithographic accuracy；Secondly, what is formed between adjacent seals ring 032 does not lay in an equal amount of substrate
The circular feature structure of salient point 033 will be far longer than salient point 033, particle etc. compared with salient point 033, with the contact area of substrate
Pollution condition more readily occurs on circular feature and the contact surface of substrate, and then influences the face type of substrate and accelerate sucker
Wear process, thus the progress substrate support of salient point 033 is arranged on circular feature can be better than directly use in the protection of basal surface type
Circular feature contacts substrate.Therefore, it is more able to achieve after being be combined with each other using both ring vaccum chamber and salient point 033 special to substrate
It is effective absorption of warpage substrate, while possesses higher than using circular feature structure to carry out substrate support between sealing ring 032
Adaptability for working condition, reduce influence of the pollution such as particle to substrate adsorption plane type and reduce the abrasion of sucker.
For absorbable substrate especially warpage substrate that can be solid and reliable, and higher adaptability for working condition is obtained, on
The design and distribution for stating sealing ring 032, salient point 033, annular groove 031 and vacuum hole 034 all must satisfy certain condition.Tool
Body, sealing ring 032 should be consistent with 033 height h of salient point, and preferred size is 50um~100um, is conducive to ring vaccum in this way
The quick foundation of uniform air pressure in chamber；Salient point 033 is cylinder, the diameter a preferred size of 033 upper surface of salient point be 0.1mm~
0.3mm had both avoided having large contact area with substrate, and then cannot reach high adaptability for working condition, is also prevented from and accelerates salient point mill
Damage；Interval S preferred size between two adjacent salient points 033 is 3mm~6mm, both prevented substrate from deforming due to adsorption capacity, and also kept away
Exempt to have large contact area with substrate and high adaptability for working condition cannot be reached；The width d preferred size of annular groove 031 is
1mm~1.5mm, in favor of the smooth foundation of ring vaccum chamber；The quantity of vacuum hole 034 is preferably in each annular groove 031
Containing 3~4 vacuum holes 034, such sucker structure is unlikely to too complicated, while being conducive to uniform air pressure in ring vaccum chamber
It establishes；The quantity of sealing ring 032 can be depending on substrate sizes in practical application, and general substrate is bigger, close in suction cup main body 03
The quantity of seal ring 032 is more, preferably, the spacing preferred scope between two adjacent sealing rings 032 is 10mm~20mm, two is adjacent
Spacing between sealing ring 032 is too small, and the effect of salient point 033 is unobvious；Spacing is too greatly for substrate especially warpage base
The adsorption capacity at bottom will reduce.The application adsorbs substrate in such a way that ring vaccum chamber is combined with salient point 033,
Simultaneously it is also to find an equalization point between salient point 033 and sealing ring 032, selects the quantity and distribution of suitable salient point 033,
And the quantity and distribution of the suitable sealing ring 032 of selection are adsorbing substrate by the reasonable combination of the two well
While protect basal surface type.
As Figure 4-Figure 6 for using the embodiment of the present invention one warpage substrate 04 of absorption.The embodiment is in suction cup main body
The present invention is illustrated for 3 sealing rings 032 of setting on 03, wherein three sealing rings 032 are radial by interior along through-hole 035
It sets gradually outward, the internal diameter of the sealing ring 032 of innermost circle is identical as 035 internal diameter of through-hole, the outer diameter of the sealing ring 032 of outmost turns
It is identical as the outer diameter of warpage substrate 04, and the distance between adjacent seals ring 032 meets 10mm~20mm.The embodiment of the present invention is inhaled
The principle analysis of attached warpage substrate 04 is as shown in fig. 6, by taking the sectional structure chart of the sucker of 035 side of through-hole as an example, suction cup main body
03,3 sealing rings 032 and the 3 ring vaccum chambers of expected formation of warpage substrate 04, to show that difference is radial from introversion along through-hole 035
Successively it is referred to as first annular vacuum chamber 031a, the second ring vaccum chamber 031b and third ring vaccum chamber 031c outside.It is simultaneously
Show difference, the three kinds of states presented during warpage substrate 04 is adsorbed are referred to as first state substrate 04a, the second state
Substrate 04b and third state substrate 04c.When diagram " bowl-shape " warpage substrate 04 is placed in sucker upper surface, after vacuum source is opened, the
032 upper surface of sealing ring where one ring vaccum chamber 031a is smaller apart from 04 gap of warpage substrate, so first annular vacuum
Chamber 031a can be established smoothly, and then generate certain adsorption capacity and warpage substrate 04 is adsorbed on sucker.Simultaneously as the
The absorption of one ring vaccum chamber 031a makes warpage substrate 04 generate the smooth trend that flattens, i.e., warpage substrate 04 is institute in Fig. 6 at this time
The first state substrate 04a shown.In this way, 032 upper surface of sealing ring where the second ring vaccum chamber 031b is apart from warpage substrate
04 gap becomes smaller, and so that the second ring vaccum chamber 031b also can be smoothly established and is generated another makes the adsorption capacity of warpage substrate 04
Warpage substrate 04 continues to flatten.Warpage substrate 04 is the second state substrate 04b shown in Fig. 6, same principle, third ring at this time
032 upper surface of sealing ring where shape vacuum chamber 031c also becomes smaller apart from 04 gap of warpage substrate, third ring vaccum chamber 031c
Also it can smoothly establish and continue to flatten by warpage substrate 04, warpage substrate 04 is made to become third state substrate shown in Fig. 6
04c, finally, 3 ring vaccum chambers make warpage substrate 04 is solid and reliable to be attracted on sucker.It is verified by experiments, for
Angularity be less than or equal to 120um warpage substrate 04, the program can solid and reliable absorption fix.
The embodiment of the present invention is first adsorbed by the ring vaccum chamber of inner ring, and then the ring vaccum chamber of outer ring successively adsorbs
Mode can gradually improve the gap between substrate and ring vaccum chamber, can reduce after the ring vaccum chamber absorption of inner ring adjacent
Gap between outer ring ring vaccum chamber and substrate is conducive to the absorption of the ring vaccum chamber of outer ring, final to realize to warpage base
Effective absorption at bottom.
With continued reference to fig. 4 to fig. 6, the present invention also provides a kind of suckers using above-mentioned absorbable substrate especially warpage substrate
Adsorption method, the control of the vacuum source that a sealing ring 032 is connected to the vacuum hole 034 on another sealing ring 032 that
This independence, so that the gas circuit control of the ring vaccum chamber is independent of one another on sealing ring 032.When carrying out substrate absorption, along logical
The radial vacuum source for successively opening the ring vaccum chamber connection from inside to outside in hole 035, carries out timesharing absorption to substrate.It is specific real
The mode of applying can refer to as shown in fig. 6, suction cup main body 03, sealing ring 032 and warpage substrate 04 are expected forms 3 ring vaccum chambers,
To show that difference is successively referred to as first annular vacuum chamber 031a, the second ring vaccum chamber 031b and third ring vaccum from inside to outside
Chamber 031c.Simultaneously to show difference, the three kinds of states presented during warpage substrate 04 is adsorbed are referred to as first state base
Bottom 04a, the second state substrate 04b and third state substrate 04c.The gas circuit control of 3 ring vaccum chambers is independent of one another.Work as diagram
" bowl-shape " warpage substrate 04 is placed in sucker upper surface, is first turned on the vacuum source of first annular vacuum chamber 031a, first annular true
032 upper surface of sealing ring where cavity 031a is smaller apart from 04 gap of warpage substrate, so first annular vacuum chamber 031a can
Smoothly to establish, and then generates certain adsorption capacity and warpage substrate 04 is adsorbed on sucker.Simultaneously as first annular true
The absorption of cavity 031a makes warpage substrate 04 generate the smooth trend that flattens, i.e., warpage substrate 04 is first shown in Fig. 6 at this time
State substrate 04a.In this way, 032 upper surface of sealing ring where the second ring vaccum chamber 031b becomes apart from 04 gap of warpage substrate
It is small, at this point, opening the vacuum source of the second ring vaccum chamber 031b again, the second ring vaccum chamber 031b is made also smoothly to establish and produce
Raw another makes warpage substrate 04 continue to flatten the adsorption capacity of warpage substrate 04.Warpage substrate 04 is shown in Fig. 6 at this time
Second state substrate 04b.Then the vacuum source of third ring vaccum chamber 031c is opened again, where third ring vaccum chamber 031c
032 upper surface of sealing ring also becomes smaller apart from 04 gap of warpage substrate, and third ring vaccum chamber 031c also can be established smoothly and will be stuck up
Bent substrate 04 continues to flatten, and warpage substrate 04 is made to become third state substrate 04c shown in Fig. 6.Finally, 3 ring vaccums
The successive unlatching of chamber makes warpage substrate 04 is solid and reliable to be adsorbed on sucker.The present embodiment thes improvement is that, initial
When adsorbed state, the vacuum of first annular vacuum chamber 031a will not be because of third ring vaccum chamber 031c or the second ring vaccum
It causes damages at chamber 031b with the wide arc gap of crossing of warpage substrate 04, so that first annular vacuum chamber 031a is more effectively established, together
Manage the second ring vaccum chamber 031b vacuum will not because of third ring vaccum chamber 031c larger gap and cause damages, make
Second ring vaccum chamber 031b also can be established more effectively.
Claims (9)
1. a kind of sucker, including suction cup main body, the center of the suction cup main body is equipped with the through-hole for substrate handover, and feature exists
In, the suction cup main body be equipped at least two protrusion suction cup main bodies and with the concentric sealing ring being distributed of the through-hole, it is described close
It offers annular groove in seal ring, is equipped with several vacuum holes being connected to external vacuum source in the annular groove, described in absorption
When substrate, it is passed through vacuum from the vacuum hole, the annular groove between the sealing ring and the substrate is formed as vacuum
Chamber；Several salient points are also evenly distributed in the suction cup main body；The salient point is distributed in a ring；The height of the sealing ring and institute
The height for stating salient point is identical；The control for the vacuum source that one sealing ring is connected to the vacuum hole on another sealing ring is only each other
It is vertical；Spacing preferred scope between the two adjacent sealing rings is 10mm~20mm.
2. sucker according to claim 1, which is characterized in that the height of the sealing ring and the salient point be 50um~
100um。
3. sucker according to claim 1, which is characterized in that the salient point is cylinder.
4. sucker according to claim 3, which is characterized in that the diameter of the salient point is 0.1mm~0.3mm.
5. sucker according to claim 1, which is characterized in that be divided into 3mm~6mm between the salient point and salient point.
6. sucker according to claim 1, which is characterized in that the width of the annular groove is 1mm~1.5mm.
7. sucker according to claim 1, which is characterized in that the quantity of the vacuum hole in an annular groove
It is 3~4.
8. sucker according to claim 1, which is characterized in that the suction cup main body is silicon carbide ceramics or aluminium alloy material
Material.
9. a kind of method for carrying out substrate absorption using sucker a method as claimed in any one of claims 1-8, which is characterized in that one close
The control for the vacuum source that seal ring is connected to the vacuum hole on another sealing ring is independent of one another, when carrying out substrate absorption, edge
The through-hole radially successively opens the vacuum source that the vacuum hole on the sealing ring is connected to from inside to outside, carries out timesharing absorption.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107499937A (en) * | 2017-08-17 | 2017-12-22 | 中国南玻集团股份有限公司 | Adsorption method |
| CN107363595A (en) * | 2017-09-01 | 2017-11-21 | 北京亦盛精密半导体有限公司 | A kind of fragile material vaccum-suction attachement pad |
| CN107591356A (en) * | 2017-10-13 | 2018-01-16 | 深圳中科飞测科技有限公司 | Wafer mounting apparatus and its application method |
| CN109280904A (en) * | 2018-11-27 | 2019-01-29 | 中山德华芯片技术有限公司 | A kind of graphite plate applied to lattice mismatched structures epitaxial growth |
| CN113078094A (en) * | 2021-03-25 | 2021-07-06 | 深圳中科飞测科技股份有限公司 | Warpage correction method, bearing device and bearing system |
| CN113927462A (en) * | 2021-11-08 | 2022-01-14 | 广东海拓创新精密设备科技有限公司 | Semiconductor shock absorption clamping chuck device and system thereof |
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| CN102270596A (en) * | 2010-06-02 | 2011-12-07 | 上海微电子装备有限公司 | Sucking disc and sheet-holding table |
| CN103367217A (en) * | 2012-04-11 | 2013-10-23 | 上海微电子装备有限公司 | Silicon-chip absorption device and absorption method thereof |
| CN104471700A (en) * | 2012-03-28 | 2015-03-25 | 盛美半导体设备（上海）有限公司 | Vacuum chuck |
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| US5707051A (en) * | 1993-08-13 | 1998-01-13 | Kabushiki Kaisha Toshiba | Wafer stage apparatus for attracting and holding semiconductor wafer |
| CN102270596A (en) * | 2010-06-02 | 2011-12-07 | 上海微电子装备有限公司 | Sucking disc and sheet-holding table |
| CN104471700A (en) * | 2012-03-28 | 2015-03-25 | 盛美半导体设备（上海）有限公司 | Vacuum chuck |
| CN103367217A (en) * | 2012-04-11 | 2013-10-23 | 上海微电子装备有限公司 | Silicon-chip absorption device and absorption method thereof |
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Address after: 201203 Pudong New Area East Road, No. 1525, Shanghai Applicant after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Applicant after: Shanghai Micro And High Precision Mechine Engineering Co., Ltd. Address before: 201203 Pudong New Area East Road, No. 1525, Shanghai Applicant before: Shanghai Micro Electronics Equipment Co., Ltd. Applicant before: Shanghai Micro And High Precision Mechine Engineering Co., Ltd. |
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