CN116810191A - Crack-resistant semiconductor wafer laser cutting device and cutting method - Google Patents
Crack-resistant semiconductor wafer laser cutting device and cutting method Download PDFInfo
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- CN116810191A CN116810191A CN202310732656.1A CN202310732656A CN116810191A CN 116810191 A CN116810191 A CN 116810191A CN 202310732656 A CN202310732656 A CN 202310732656A CN 116810191 A CN116810191 A CN 116810191A
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- 238000003698 laser cutting Methods 0.000 title claims abstract description 28
- 239000004065 semiconductor Substances 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000005520 cutting process Methods 0.000 title claims abstract description 9
- 230000007246 mechanism Effects 0.000 claims description 41
- 241000252254 Catostomidae Species 0.000 claims description 13
- 238000001179 sorption measurement Methods 0.000 claims description 13
- 238000007789 sealing Methods 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 74
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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Abstract
The application discloses an anti-crack semiconductor wafer laser cutting device and a cutting method, and particularly relates to the field of laser cutting. According to the wafer lifting device, the wafer with the uneven bottom is pressed against the second telescopic spring, so that the wafer is elastically deformed to drive the first support bracket and the second support bracket to deflect, and the wafer can be lifted in an auxiliary mode, so that a part of sucking discs are adsorbed and fixed at the bottom of the wafer, and the stability of the wafer when being cut is further maintained.
Description
Technical Field
The application relates to the technical field of laser cutting, in particular to a crack-resistant semiconductor wafer laser cutting device and a crack-resistant semiconductor wafer laser cutting method.
Background
In electronics, wafers (also known as slices or substrates) are thin sheets of semiconductor, such as crystalline silicon (c-Si), used to fabricate integrated circuits and in photovoltaic devices to fabricate solar cells. The wafer serves as a substrate for microelectronic devices built into and on the wafer. It undergoes a number of micromachining processes such as doping, ion implantation, etching, thin film deposition of various materials, and photolithographic patterning. Finally, individual microcircuits are separated and packaged as integrated circuits by wafer dicing.
The application discloses a semiconductor wafer laser cutting device and a semiconductor wafer laser cutting method, wherein a first screw is arranged to drive a sliding seat to move along a containing groove, so that a sliding table can enter and exit in a shell along a guide rail to realize loading and unloading of a wafer, and a laser head positioned in the shell is used for carrying out laser cutting processing when the sliding seat is driven by the first screw to enter the shell, a toothed ring in the sliding seat rotates under the action of a section of rack arranged on the inner side wall of the containing groove, and then a second screw is driven to rotate to drive a piston plate to descend in a negative pressure hole, so that negative pressure is generated in a space above the negative pressure hole. The negative pressure adsorption is adopted to fix the wafer during processing, so that the wafer with irregular concave or convex shape can be adsorbed and fixed on the one hand, and on the other hand, the part released from the wafer is made of flexible materials, so that the wafer is prevented from being damaged by the original clamping.
However, when the wafer is adsorbed and fixed in this way, the wafer cannot be suitable for wafers with different sizes, and when the bottom of the wafer is in an irregular structure with an inclined shape, the negative pressure hole arranged in the device cannot be in flat contact with the bottom of the wafer, and the problem of small contact range and poor support exists between the negative pressure hole and the wafer during contact, so that the wafer is easy to shake during cutting, the cutting quality is influenced, and the actual use is inconvenient.
Disclosure of Invention
In order to overcome the above-mentioned drawbacks of the prior art, embodiments of the present application provide an anti-crack semiconductor wafer laser cutting device and a cutting method, in which a wafer with an uneven bottom is pressed against a second extension spring, so that the wafer is elastically deformed to drive a first support bracket and a second support bracket to deflect, and the wafer can be lifted in an auxiliary manner, so as to solve the problems in the prior art.
In order to achieve the above purpose, the present application provides the following technical solutions: the crack-resistant semiconductor wafer laser cutting device comprises a main body mechanism, wherein a moving mechanism is fixedly arranged at the top of the main body mechanism, an adsorption mechanism is fixedly connected to the top of the moving mechanism, and an adjusting mechanism is arranged at the top of the adsorption mechanism;
the adsorption mechanism comprises a gas collecting bin, a plurality of first through pipes are arranged on the outer wall of the gas collecting bin in a communicating mode, second through pipes are arranged on the outer wall of the first through pipes in a sliding mode, sucking discs are arranged on the top of the second through pipes in a communicating mode, a third through pipe is arranged on the bottom of the gas collecting bin in a communicating mode, a fourth through pipe is fixedly connected to one end of the third through pipe, a piston rod is inserted into an inner cavity of the fourth through pipe, a positioning seat is fixedly arranged at one end, extending out of the fourth through pipe, of the piston rod, the adjusting mechanism comprises a first supporting plate fixedly arranged at the top of the gas collecting bin, a plurality of second sliding grooves are formed in the inner cavity of each first supporting plate, limit type sliding blocks are arranged in the inner cavities of the plurality of second sliding grooves in a sliding mode, a plurality of second supporting plates are fixedly arranged in the inner portions of the limit type sliding blocks, second telescopic springs are fixedly arranged on the top of the second supporting plates, first supporting plates are fixedly arranged on the tops of the second supporting plates, first supporting plates are fixedly arranged on the second supporting plates, and second supporting brackets are fixedly arranged on the two sides of the first supporting brackets.
In a preferred embodiment, a plurality of the second through pipes and the suckers are sequentially and equidistantly arranged around the outer circumferential surface of the gas collection bin, a plurality of the second supporting plates are sequentially and equidistantly arranged around the outer circumferential surface of the first supporting plate, and each sucker is arranged between two adjacent second supporting plates.
In a preferred embodiment, the top of the first supporting plate is rotatably provided with a first gear disc, a plurality of arc-shaped limiting grooves which are arranged in a penetrating mode are formed in the first gear disc, the inner cavities of the arc-shaped limiting grooves are slidably provided with positioning rods fixedly connected with the limiting sliding blocks, the top of the second supporting plate is fixedly provided with a first rubber pad, and the top of the first gear disc is fixedly provided with a second rubber pad.
In a preferred embodiment, the top of the first supporting plate is rotatably provided with a second gear disc, the second gear disc and the first gear disc are arranged in an intermeshing state, and the bottom of the second gear disc is fixedly connected with a motor for driving the second gear disc to rotate.
In a preferred embodiment, a first sliding groove is formed in the inner wall of the second through pipe, a sealing sliding sleeve is fixedly installed on the outer wall of the first through pipe, a first telescopic spring is fixedly installed on one side of the sealing sliding sleeve, and the first telescopic spring is sleeved on the outer wall of the first through pipe and fixedly connected with the second through pipe.
In a preferred embodiment, the main body mechanism comprises a base, a supporting frame is fixedly arranged at the top of the base, a laser cutting machine is fixedly arranged at the bottom of the supporting frame, the moving mechanism comprises a limiting slide rail fixedly arranged at the top of the base, a limiting slide rod is fixedly arranged at the top of the limiting slide rail, a bearing type sliding seat is slidably arranged on the outer wall of the limiting slide rod, a bearing block is fixedly arranged in the bearing type sliding seat, a bearing seat fixedly connected with the gas collecting bin is fixedly arranged at one end of the bearing block, and the positioning seat is fixedly arranged at the top of the base.
In a preferred embodiment, a method for cutting a crack-resistant semiconductor wafer by using a laser cutting device comprises the following specific operation steps:
firstly, placing a wafer on the top of a first support bracket and the top of a second support bracket, and pressing a second telescopic spring to deform according to the weight of the wafer, so that the first support bracket and the second support bracket deflect according to the bottom structure of the wafer to be attached to the bottom of the wafer, and the work of limiting and supporting the bottom of the wafer is completed;
step two, starting a motor according to the size of the wafer to drive a second gear disc to rotate, then enabling a first gear disc to rotate, and further enabling a plurality of limiting sliding blocks to slide in the inner cavity of the arc-shaped limiting groove through a positioning rod synchronously to enable the positions of the limiting sliding blocks to be adjusted until the limiting sliding blocks synchronously drive a plurality of suckers to be attached to the bottom of the wafer to stop the motor;
thirdly, pushing the whole bearing type sliding seat, so that when the whole bearing type sliding seat moves towards the bottom of the laser cutting machine, the fourth through pipe synchronously moves on the outer wall of the piston rod, gas in the inner cavity of the gas collection bin is extracted into the inner cavity of the fourth through pipe through the third through pipe, meanwhile, negative pressure is generated in the sucker at the part contacted with the bottom of the wafer, and then the wafer is stably, limitedly and adsorbed;
and fourthly, after the supporting type sliding seat integrally drives the wafer to move to the bottom of the laser cutting machine, the wafer placed at the tops of the first supporting bracket and the second supporting bracket can be cut by starting the laser cutting machine.
The application has the technical effects and advantages that:
1. according to the wafer lifting device, when the wafer with the uneven bottom is placed on the tops of the second support bracket and the first support bracket, the first support bracket and the second support bracket are driven to deflect through the elastic deformation of the second telescopic spring, so that the wafer can be lifted in an auxiliary mode, when the wafer with the abnormal bottom is used, a part of suckers can be adsorbed and fixed on the bottom of the wafer, the stability of the wafer when the wafer is cut is further maintained, and the wafer cannot be displaced easily;
2. according to the application, when the first gear disc is rotated to enable the arc-shaped limiting groove to generate displacement deflection, the positioning rod can move along the inner track of the arc-shaped limiting groove, then the limiting sliding block integrally slides in the second sliding groove, so that the plurality of second through pipes can drive the suckers to move away from each other, and then when wafers with different sizes are used, the mounting distances of the plurality of suckers can be conveniently adjusted, and the use is more convenient.
Drawings
Fig. 1 is a schematic diagram of the overall structure of the present application.
Fig. 2 is a schematic diagram of the axial structure of the present application.
Fig. 3 is a schematic view of a part of the structure of the adsorption mechanism and the adjusting mechanism of the present application.
Fig. 4 is an enlarged view of the structure of the portion a of fig. 3 according to the present application.
Fig. 5 is a partial structural cross-sectional view of the adsorption mechanism and the adjusting mechanism of the present application.
Fig. 6 is an enlarged view of the B part structure of fig. 5 according to the present application.
Fig. 7 is an enlarged view of the C-section structure of fig. 5 according to the present application.
The reference numerals are: the device comprises a main body mechanism, a 101 base, a 102 supporting frame, a 103 laser cutting machine, a 2 moving mechanism, a 21 limiting slideway, a 22 bearing type sliding seat, a 23 limiting sliding rod, a 24 bearing block, a 25 bearing seat, a 3 adsorption mechanism, a 31 gas collecting bin, a 32 first through pipe, a 33 second through pipe, a 34 sucking disc, a 35 third through pipe, a 36 fourth through pipe, a 37 piston rod, a 38 positioning seat, a 39 first sliding groove, a 310 sealing sliding sleeve, a 311 first telescopic spring, a 4 regulating mechanism, a 41 first supporting plate, a 42 second sliding groove, a 43 limiting sliding block, a 44 second supporting plate, a 45 second telescopic spring, a 46 first supporting plate, a 47 second supporting plate, a 48 first gear disc, a 49 arc limiting groove, a 410 positioning rod, a 411 second gear disc, a 412 motor 413, a first rubber pad and a 414 second rubber pad.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Referring to fig. 1-7 of the specification, as shown in fig. 1, the crack-resistant semiconductor wafer laser cutting device in one embodiment of the application comprises a main body mechanism 1, wherein a moving mechanism 2 is fixedly arranged at the top of the main body mechanism 1, an adsorption mechanism 3 is fixedly connected to the top of the moving mechanism 2, and an adjusting mechanism 4 is arranged at the top of the adsorption mechanism 3;
referring to fig. 5-6, the adsorption mechanism 3 comprises a gas collection bin 31, wherein the outer wall of the gas collection bin 31 is communicated with a plurality of first through pipes 32, the outer walls of the plurality of first through pipes 32 are all provided with second through pipes 33 in a sliding manner, the tops of the plurality of second through pipes 33 are all communicated with suckers 34, in actual use, a wafer is placed on the tops of the plurality of suckers 34, negative pressure can be generated between the plurality of suckers 34 and the wafer by pumping out the gas in the inner cavity of the gas collection bin 31, and then the wafer is firmly adsorbed, meanwhile, the bottom of the gas collection bin 31 is communicated with a third through pipe 35, one end of the third through pipe 35 is fixedly connected with a fourth through pipe 36, the inner cavity of the fourth through pipe 36 is inserted with a piston rod 37, one end of the piston rod 37 extends out of the fourth through pipe 36 and is fixedly provided with a positioning seat 38, in use, the positioning seat 38 is fixed, and then the piston rod 37 is kept fixed, when the gas collecting bin 31 drives the third through pipe 35 and the fourth through pipe 36 to move, the fourth through pipe 36 can slide on the outer wall of the piston rod 37, then gas in the gas collecting bin 31 is pumped into the inner cavity of the fourth through pipe 36 through the third through pipe 35, then the contact part of the sucker 34 and the wafer generates negative pressure to limit the contact part, the regulating mechanism 4 comprises a first supporting plate 41 fixedly arranged at the top of the gas collecting bin 31, a plurality of second sliding grooves 42 are formed in the first supporting plate 41, limiting sliding blocks 43 are slidably arranged in the inner cavities of the plurality of second sliding grooves 42, a plurality of second through pipes 33 are fixedly arranged in the limiting sliding blocks 43, a plurality of second supporting plates 44 are fixedly arranged on the outer surfaces of the first supporting plates 41, a plurality of second telescopic springs 45 are fixedly arranged at the tops of the plurality of second supporting plates 44, the top fixed mounting of second extension spring 45 has first support bracket 46, the both sides of first support bracket 46 are all fixed mounting has second support bracket 47, under the state of second extension spring 45 in the expansion lift first support bracket 46 under the normality, and the supporting height of first support bracket 46 is higher than the horizontal height of sucking disc 34, then when in actual use, when placing at the top of second support bracket 47 and first support bracket 46 to the wafer of bottom unevenness, the first support bracket 46 of drive through the elastic deformation of second extension spring 45 and second support bracket 47 is deflected can assist to lift the wafer, thereby when using to the wafer of bottom for special-shaped structure, can make a portion sucking disc 34 adsorb and fix in its bottom, and then keep the stability of wafer when being cut, can not easily take place the displacement, further, a plurality of second siphunculus 33 and sucking disc 34 all are arranged around the outer circumference of gas collection storehouse 31 annular equidistant state in proper order, a plurality of second layer boards 44 all are arranged around the outer circumference of first support bracket 41 in proper order annular state, and each adjacent setting up at the equal distance between the two adjacent positions of the sucking disc 34, the stability that the second layer board is located at the equal distance between the adjacent position of the bottom of layer board 34, the stability is in order, the stability is improved.
As a further extension of the scheme, referring to fig. 4, in order to be applicable to wafers of different sizes, the top of the first supporting plate 41 is rotatably provided with a first gear plate 48, the interior of the first gear plate 48 is provided with a plurality of arc-shaped limiting grooves 49 which are arranged in a penetrating manner, the inner cavities of the plurality of arc-shaped limiting grooves 49 are all slidably provided with a positioning rod 410 fixedly connected with the limiting slide block 43, in a normal state, the limiting slide block 43 completely extends into the inner cavity of the second slide groove 42, at the moment, the plurality of suckers 34 are mutually close to each other, and the positioning rod is applicable to fixing smaller wafers, when the arc-shaped limiting grooves 49 are displaced and deflected by rotating the first gear plate 48, the positioning rod 410 moves along the inner track of the arc-shaped limiting grooves 49, and then the limiting slide block 43 integrally slides in the second slide groove 42, the second through pipes 33 can drive the suckers 34 to move away from each other, which is suitable for fixing larger wafers, meanwhile, the top parts of the second supporting plates 44 are fixedly provided with the first rubber pads 413, a second rubber pad 414 is fixedly mounted on top of the first gear plate 48, and is arranged so that, before the bottom of the wafer is joined to the second pallet 44 and the first gear plate 48, the first and second rubber pads 413 and 414 are preferentially contacted, and then the first and second rubber pads 413 and 414 can be deformed and attached to the bottom of a wafer according to the difference of the bottom structures, so that the stability of the wafer which is fixedly supported is further maintained, meanwhile, the second gear disc 411 is rotatably arranged at the top of the first supporting plate 41, the second gear disc 411 and the first gear disc 48 are arranged in an intermeshing state, a motor 412 for driving the second gear disc 411 to rotate is fixedly connected at the bottom of the second gear disc 411, the purpose that sets up like this is, when driving motor 412 makes second toothed disc 411 take place to rotate, can make first toothed disc 48 wholly rotate, then plays the purpose of quick convenient regulation a plurality of spacing type slider 43 positions, then makes the distance between a plurality of sucking discs 34 adjust, and it is more convenient to use, more convenient in-service use.
Further, while adjusting the distance between the plurality of suction cups 34, the distance between the plurality of suction cups 34 can be synchronously changed, and then the distance between the second through pipe 33 and the corresponding first through pipe 32 is changed, in order to maintain the communication tightness between the first through pipe 32 and the second through pipe 33, referring to fig. 6, a first sliding groove 39 is formed on the inner wall of the second through pipe 33, a sealing sliding sleeve 310 is fixedly mounted on the outer wall of the first through pipe 32, a first telescopic spring 311 is fixedly mounted on one side of the sealing sliding sleeve 310, and the first telescopic spring 311 is sleeved on the outer wall of the first through pipe 32 and fixedly connected with the second through pipe 33.
Further, referring to fig. 2-3, the main body mechanism 1 includes a base 101, a support frame 102 is fixedly installed at the top of the base 101, a laser cutting machine 103 is fixedly installed at the bottom of the support frame 102, the moving mechanism 2 includes a limiting slide rail 21 fixedly installed at the top of the base 101, a limiting slide bar 23 is fixedly installed at the top of the limiting slide rail 21, a bearing slide seat 22 is slidably installed on the outer wall of the limiting slide bar 23, a bearing block 24 is fixedly installed inside the bearing slide seat 22, a bearing seat 25 fixedly connected with a gas collecting bin 31 is fixedly installed at one end of the bearing block 24, and a positioning seat 38 is fixedly installed at the top of the base 101.
A cutting method of a crack-resistant semiconductor wafer laser cutting device comprises the following specific operation steps:
firstly, placing a wafer on the top of a first support bracket 46 and a second support bracket 47, and pressing a second telescopic spring 45 to deform according to the weight of the wafer, so that the first support bracket 46 and the second support bracket 47 deflect according to the bottom structure of the wafer to be attached to the bottom of the wafer, and completing the work of limiting and supporting the bottom of the wafer;
secondly, starting a motor 412 according to the size of the wafer to drive a second gear disc 411 to rotate, then enabling a first gear disc 48 to rotate, and further enabling a plurality of limit type sliding blocks 43 to slide in the inner cavity of an arc-shaped limit groove 49 through a locating rod 410 to enable the positions of the limit type sliding blocks to be adjusted synchronously until the limit type sliding blocks 43 synchronously drive a plurality of suckers 34 to be attached to the bottom of the wafer to stop the motor 412;
thirdly, pushing the whole bearing type sliding seat 22 to enable the whole bearing type sliding seat 22 to move towards the bottom direction of the laser cutting machine 103, enabling the fourth through pipe 36 to synchronously move on the outer wall of the piston rod 37, enabling gas in the inner cavity of the gas collection bin 31 to be pumped into the inner cavity of the fourth through pipe 36 through the third through pipe 35, and simultaneously enabling negative pressure to be generated inside the sucker 34 at the part contacted with the bottom of the wafer, and then enabling the wafer to be stably, limitedly and adsorbed;
fourth, after the supporting slide 22 integrally drives the wafer to move to the bottom of the laser cutter 103, the laser cutter 103 is started to cut the wafer placed on the top of the first support bracket 46 and the second support bracket 47.
The last points to be described are: first, in the description of the present application, it should be noted that, unless otherwise specified and defined, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be mechanical or electrical, or may be a direct connection between two elements, and "upper," "lower," "left," "right," etc. are merely used to indicate relative positional relationships, which may be changed when the absolute position of the object being described is changed;
secondly: in the drawings of the disclosed embodiments, only the structures related to the embodiments of the present disclosure are referred to, and other structures can refer to the common design, so that the same embodiment and different embodiments of the present disclosure can be combined with each other under the condition of no conflict;
finally: the foregoing description of the preferred embodiments of the application is not intended to limit the application to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and principles of the application are intended to be included within the scope of the application.
Claims (7)
1. The crack-resistant semiconductor wafer laser cutting device comprises a main body mechanism (1), wherein a moving mechanism (2) is fixedly arranged at the top of the main body mechanism (1), an adsorption mechanism (3) is fixedly connected to the top of the moving mechanism (2), and an adjusting mechanism (4) is arranged at the top of the adsorption mechanism (3);
the method is characterized in that: the adsorption mechanism (3) comprises a gas collecting bin (31), a plurality of first through pipes (32) are arranged on the outer wall of the gas collecting bin (31) in a communicating manner, a plurality of second through pipes (33) are arranged on the outer wall of the first through pipes (32) in a sliding manner, sucking discs (34) are arranged on the top of the second through pipes (33) in a communicating manner, a third through pipe (35) is arranged on the bottom of the gas collecting bin (31) in a communicating manner, a fourth through pipe (36) is fixedly connected to one end of the third through pipe (35), a piston rod (37) is inserted into an inner cavity of the fourth through pipe (36), a positioning seat (38) is fixedly arranged at one end of the piston rod (37) extending out of the fourth through pipe (36), the regulating mechanism (4) comprises a first supporting plate (41) fixedly arranged at the top of the gas collecting bin (31), a plurality of second sliding grooves (42) are formed in the inner portion of the first supporting plate (41), limit sliding blocks (43) are arranged in the inner cavities of the second sliding grooves (42), a plurality of second through pipes (33) are fixedly arranged in the inner surfaces of the second sliding grooves (43), a plurality of second supporting plates (44) are fixedly arranged on the inner surfaces of the second supporting plates (44) respectively, the top of second telescopic spring (45) is fixed mounting has first support bracket (46), both sides of first support bracket (46) are fixed mounting has second support bracket (47).
2. The crack resistant semiconductor wafer laser dicing apparatus as described in claim 1, wherein: the second through pipes (33) and the suckers (34) are sequentially and equidistantly arranged around the outer circumferential surface of the gas collection bin (31), the second support plates (44) are sequentially and equidistantly arranged around the outer circumferential surface of the first support plate (41), and each sucker (34) is arranged between two adjacent second support plates (44).
3. The crack resistant semiconductor wafer laser dicing apparatus as set forth in claim 2, wherein: the top of first layer board (41) rotates installs first toothed disc (48), a plurality of arc spacing groove (49) that run through form arrangement have been seted up to the inside of first toothed disc (48), and a plurality of the inner chamber of arc spacing groove (49) all slidable mounting have locating lever (410) with spacing slider (43) looks fixed connection, a plurality of the top of second layer board (44) all fixed mounting has first rubber pad (413), the top fixed mounting of first toothed disc (48) has second rubber pad (414).
4. A crack resistant semiconductor wafer laser dicing apparatus according to claim 3, wherein: the top of first layer board (41) rotates installs second toothed disc (411), be intermeshing state setting between second toothed disc (411) and first toothed disc (48), just the bottom fixedly connected with of second toothed disc (411) is used for driving it and carries out pivoted motor (412).
5. The crack resistant semiconductor wafer laser dicing apparatus as described in claim 4, wherein: the inner wall of the second through pipe (33) is provided with a first sliding groove (39), the outer wall of the first through pipe (32) is fixedly provided with a sealing sliding sleeve (310), one side of the sealing sliding sleeve (310) is fixedly provided with a first telescopic spring (311), and the first telescopic spring (311) is sleeved on the outer wall of the first through pipe (32) and fixedly connected with the second through pipe (33).
6. The crack resistant semiconductor wafer laser dicing apparatus as described in claim 5, wherein: the main body mechanism (1) comprises a base (101), a support frame (102) is fixedly arranged at the top of the base (101), a laser cutting machine (103) is fixedly arranged at the bottom of the support frame (102), the moving mechanism (2) comprises a limiting slide rail (21) fixedly arranged at the top of the base (101), a limiting slide bar (23) is fixedly arranged at the top of the limiting slide rail (21), a bearing slide seat (22) is slidably arranged on the outer wall of the limiting slide bar (23), a bearing block (24) is fixedly arranged in the bearing slide seat (22), a bearing seat (25) fixedly connected with a gas collecting bin (31) is fixedly arranged at one end of the bearing block (24), and a positioning seat (38) is fixedly arranged at the top of the base (101).
7. The cutting method of the crack-resistant semiconductor wafer laser cutting device is characterized by comprising the following specific operation steps of:
firstly, placing a wafer on the tops of a first support bracket (46) and a second support bracket (47), and pressing a second telescopic spring (45) to deform according to the weight of the wafer, so that the first support bracket (46) and the second support bracket (47) are deflected according to the bottom structure of the wafer and attached to the bottom of the wafer, and the work of limiting and supporting the bottom of the wafer is completed;
secondly, starting a motor (412) according to the size of a wafer to drive a second gear disc (411) to rotate, then enabling a first gear disc (48) to rotate, and further enabling a plurality of limit type sliding blocks (43) to slide in the inner cavity of an arc-shaped limit groove (49) through a locating rod (410) synchronously to enable the positions of the limit type sliding blocks to be adjusted until the limit type sliding blocks (43) synchronously drive a plurality of suckers (34) to be attached to the bottom of the wafer to stop the motor (412);
thirdly, pushing the whole bearing type sliding seat (22) to enable the whole bearing type sliding seat (22) to move towards the bottom of the laser cutting machine (103), enabling the fourth through pipe (36) to synchronously move on the outer wall of the piston rod (37), enabling gas in the inner cavity of the gas collection bin (31) to be pumped into the inner cavity of the fourth through pipe (36) through the third through pipe (35), and simultaneously enabling negative pressure to be generated in the sucker (34) at the part contacted with the bottom of the wafer, and then enabling the wafer to be stably and limitedly adsorbed;
fourth, after the supporting slide seat (22) integrally drives the wafer to move to the bottom of the laser cutting machine (103), the wafer placed on the tops of the first supporting bracket (46) and the second supporting bracket (47) can be cut by starting the laser cutting machine (103).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310732656.1A CN116810191A (en) | 2023-06-20 | 2023-06-20 | Crack-resistant semiconductor wafer laser cutting device and cutting method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310732656.1A CN116810191A (en) | 2023-06-20 | 2023-06-20 | Crack-resistant semiconductor wafer laser cutting device and cutting method |
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| CN116810191A true CN116810191A (en) | 2023-09-29 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117862699A (en) * | 2024-03-05 | 2024-04-12 | 北方道路科技(辽宁)有限公司 | Building steel plate laser cutting machine |
-
2023
- 2023-06-20 CN CN202310732656.1A patent/CN116810191A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117862699A (en) * | 2024-03-05 | 2024-04-12 | 北方道路科技(辽宁)有限公司 | Building steel plate laser cutting machine |
| CN117862699B (en) * | 2024-03-05 | 2024-05-07 | 北方道路科技(辽宁)有限公司 | Building steel plate laser cutting machine |
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