CN106653671A - Sucker and adsorption method thereof - Google Patents
Sucker and adsorption method thereof Download PDFInfo
- Publication number
- CN106653671A CN106653671A CN201510731089.3A CN201510731089A CN106653671A CN 106653671 A CN106653671 A CN 106653671A CN 201510731089 A CN201510731089 A CN 201510731089A CN 106653671 A CN106653671 A CN 106653671A
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- Prior art keywords
- substrate
- ring
- vacuum
- sealing ring
- sucker
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
The invention discloses a sucker and an adsorption method thereof. The sucker comprises a sucker body of which the center is provided with a through hole for connecting a substrate. The sucker body is equipped with at least one sealing ring which protrudes from the sucker body and is distributed concentric with the through hole. The sealing ring has a ring groove. The ring groove is internally provided with a plurality of vacuum holes communicated with an external vacuum source. When the sucker absorbs the substrate, vacuum is pumped in from the vacuum holes, and the ring groove between the sealing ring and the substrate forms a vacuum cavity. By adoption of a ring vacuum cavity structure, the gap between the substrate and the ring vacuum cavity can be improved gradually. After the ring vacuum cavity at an inner ring is absorbed, the gap between the ring vacuum cavity at an adjacent outer ring and the substrate will be reduced. Finally, the warped substrate is absorbed effectively.
Description
Technical field
The present invention relates to a kind of sucker and its adsorption method, particularly stick up in a photolithographic process for absorbable substrate
Bent substrate, belongs to field of manufacturing semiconductor devices.
Background technology
Photoetching is a kind of technology by mask pattern exposure image to substrate, is semiconductor devices manufacture
An important step in technique.Known lithographic equipment includes stepping repetitive and step-by-step scanning type.Upper
In the lithographic equipment stated, need to have corresponding device as mask and the carrier of substrate, be mounted with mask/
The carrier of substrate produces accurate mutually motion to meet photoetching needs.In the mutual motion of mask and substrate
In, must ensure that mask and substrate are reliably positioned all the time.The device for being directly used in positioning substrate is referred to as
Sucker.Sucker can produce the motion of multiple frees degree by a series of driver drives, so as to complete to substrate
Leveling and focusing, make substrate carry out required position adjustment.The precision of sucker is (burnt to the focus of lithographic equipment
Have a great impact with overlay (alignment precision) deeply), embody the surface precision of lower surface thereon, with
And the clamping deflection of itself.Propose to make substrate be positioned at sucker by the way of vacuum suction in prior art
Upper surface, it is proposed that the distribution of some forms in sucker upper surface, is produced in vacuum suction with optimizing to substrate
Deformation, thermal stress etc. affect.But the suction for warpage substrate is not directed in existing patent and documents and materials
Set up meter.
Prior art provide sucker, including suction cup main body 01, for substrate 02 handing-over through hole 015 and
The vacuum hole 014 of external vacuum source connection, vacuum hole 014 produces vacuum chamber with sealing ring 012 and substrate 02
011, absorption affinity is produced by the pressure differential between external pressure and vacuum chamber 011 substrate 02 firmly may be used
The pressure leaned on is attached in suction cup main body 01, meanwhile, some salient points 013 are uniformly distributed with vacuum chamber 011
Feature, plays a supporting role to substrate 02, prevents substrate 02 to be deformed because of absorption affinity, affects light
Carve precision.
For the reasonable substrate of face type, the sucker of prior art can be adsorbed effectively, but for warpage
Substrate then can not effectively adsorb, and the analysis of causes is as shown in figure 3, suction cup main body 01, sealing ring 012 and warpage
Substrate 04 forms together vacuum chamber 011, it is contemplated that produce absorption by vacuum chamber 011 and outside atmospheric pressure difference
Power adsorbs warpage substrate 04 on sucker 01.But because the main warped shapes of warpage substrate 04 are diagram
" bowl-shape ", the right side of vacuum chamber 011 that the substrate 04 and sucker 01 are formed have than larger gap (
Gap size is affected by basement warping degree), thus result in vacuum chamber 011 and communicate with outside atmosphere and then be unable to shape
The effective pressure differential of Cheng Qiyu outside atmospheres, cannot also produce effective absorption affinity and adsorb substrate 04 in suction
On disk 01.Also the adsorption design for warpage substrate 04 is not directed in existing patent and documents and materials.
The content of the invention
The technical problem to be solved is to provide a kind of sucker that can effectively adsorb warpage substrate, also
A kind of method for carrying out substrate absorption using above-mentioned sucker is provided.
To achieve these goals, the present invention is adopted the following technical scheme that and is achieved：A kind of sucker, including
Suction cup main body, the center of the suction cup main body is provided with the through hole for substrate handing-over, sets in the suction cup main body
There is the sealing ring of at least one protrusion suction cup main body and distribution concentric with the through hole, open up on the sealing ring
There is annular groove, some vacuum holes connected with external vacuum source are provided with the annular groove, absorption is described
During substrate, vacuum is passed through from the vacuum hole, the annular groove between the sealing ring and the substrate
Be formed as vacuum chamber.
Using above-mentioned technology, first adsorbed by the ring vaccum chamber of inner ring, then the ring vaccum chamber of outer ring according to
The mode of secondary absorption, can progressively improve the gap between substrate and ring vaccum chamber, the ring vaccum of inner ring
The gap between adjacent outer ring ring vaccum chamber and substrate can be reduced after the absorption of chamber, be conducive to the annular of outer ring true
The absorption of cavity, finally realizes the effective absorption to warpage substrate.
As a modification of the present invention, some salient points are also evenly distributed with the suction cup main body.
Preferably, the salient point is distributed in a ring.
Preferably, the height of the sealing ring is highly identical with the salient point.
Preferably, the sealing ring and the height of the salient point are 50um～100um.
Preferably, the salient point is cylinder.
Preferably, a diameter of 0.1mm～0.3mm of the salient point.
Preferably, between the salient point and salient point at intervals of 3mm～6mm.
Preferably, the width of the annular groove is 1mm～1.5mm.
Preferably, the quantity of the vacuum hole in an annular groove is 3～4.
Using above-mentioned technology, the salient point can play a supporting role to substrate, prevent substrate because absorption affinity
And be deformed, affect lithographic accuracy.The salient point can also reduce particle etc. and pollute to substrate adsorption plane type
Impact and reduce sucker abrasion, make sucker have higher adaptability for working condition.
Used as a modification of the present invention, a sealing ring is connected with the vacuum hole on another sealing ring
The control of vacuum source is independent of one another.
Using above-mentioned technology, the gas circuit control in ring vaccum chamber is independent of one another, can control successively from inside to outside
The adsorption operations in ring vaccum chamber, realize more preferable adsorption effect.
Preferably, the suction cup main body is thyrite.
Preferably, the suction cup main body is aluminum alloy materials.
Compared with prior art, using the structure in multiple ring vaccum chambers, substrate can progressively be improved with annular
Gap between vacuum chamber, after the ring vaccum chamber absorption of inner ring adjacent outer ring ring vaccum chamber and base can be reduced
Gap between bottom, is conducive to the absorption in the ring vaccum chamber of outer ring, finally realizes to the effective of warpage substrate
Absorption.Substrate is played a supporting role using bump structure, particle etc. can be reduced and polluted to substrate adsorption plane
The impact of type and the abrasion of reduction sucker, make sucker have higher adaptability for working condition.
Preferably, the spacing preferred scope between the two adjacent sealing rings is 10mm～20mm.
The present invention also provides a kind of method for carrying out substrate absorption using above-mentioned sucker, a sealing ring with it is another
The control of the vacuum source that the vacuum hole on individual sealing ring is connected is independent of one another, when substrate absorption is carried out, edge
The through hole radially opens successively from inside to outside the vacuum source that the vacuum hole on the sealing ring is connected, and carries out
Timesharing is adsorbed.
Using above-mentioned technology, the adsorption operations of annular vacuum chamber are controlled successively from inside to outside, the annular of inner ring is true
The gap between adjacent outer ring ring vaccum chamber and substrate can be reduced after cavity absorption, be conducive to the annular of outer ring
The absorption of vacuum chamber, it is possible to achieve more preferable adsorption effect.
Description of the drawings
Fig. 1 is a kind of structural representation of sucker in prior art；
Fig. 2 is the top view of sucker salient point distribution in prior art；
Fig. 3 is the principle schematic that prior art sucker can not adsorb warpage substrate；
Fig. 4 is the cross section structure diagram of sucker in the embodiment of the invention；
Fig. 5 is the top view of sucker in the embodiment of the invention；
Fig. 6 is the absorption principle schematic diagram of sucker in the embodiment of the invention.
In Fig. 1～3：01 is suction cup main body, and 011 is vacuum chamber, and 012 is sealing ring, and 013 is salient point,
014 is vacuum hole, and 015 is through hole, and 02 is substrate, and 04 is warpage substrate；
In Fig. 4～6：03 is suction cup main body, and 031 is annular groove, and 032 is sealing ring, and 033 is salient point,
034 is vacuum hole, and 035 is through hole, and 04 is warpage substrate.
Specific embodiment
Below in conjunction with the accompanying drawings the specific embodiment to inventing is described in further detail.
As shown in Figure 4 and Figure 5, the present invention provides a kind of sucker, including suction cup main body 03, wherein, it is described
Suction cup main body 03 be provided centrally with for substrate handing-over through hole 035, the suction cup main body 03 be provided with to
A few sealing ring 032 for protruding from suction cup main body 03 and distribution concentric with through hole 035, the sealing ring 032
On offer annular groove 031, is provided with some vacuum connected with external vacuum source in the annular groove 031
Hole 034, correspondingly the vacuum hole 034 is through the suction cup main body with the corresponding position of the annular groove 031
03 connects with vacuum source.During absorbable substrate 04, vacuum is passed through from the vacuum hole 034, positioned at the sealing
Annular groove 031 between ring 032 and substrate is formed as ring vaccum chamber.
With continued reference to Fig. 5, in the suction cup main body 03 around ring vaccum chamber some salient points are evenly distributed with
033, substrate is played a supporting role, prevent substrate to be deformed because of absorption affinity, affect lithographic accuracy.
The specific distribution mode of salient point 033 is not fixed, and is finally uniformly distributed, and may preferably be annular spread.
The material of suction cup main body 03 is generally silicon carbide ceramics (SiC) material, alternatively aluminium alloy or other materials.
Scheme of the ring vaccum chamber that the present invention is adopted in combination with salient point 033, i.e., in member-retaining portion salient point 033
In the case of the larger vacuum chamber 011 of script area in prior art is changed into into separate in concentric circles distribution
Although the less ring vaccum chamber of area, ring vaccum cavity area diminishes, but its produce pressure also be enough to by
The solid and reliable absorption of substrate is on sucker.Salient point 033 has the effect that, first, salient point 033 can be with
Substrate is played a supporting role, prevents substrate to be deformed because of absorption affinity, affect lithographic accuracy；Secondly,
In the case of an equal amount of substrate, what is formed between adjacent seals ring 032 does not lay the ring-type of salient point 033
Compared with salient point 033, it will be far longer than the dirts such as salient point 033, particle to feature structure with the contact area of substrate
Dye situation is more readily occurred on the contact surface of circular feature and substrate, and then is affected the face type of substrate and added
The wear process of fast sucker, thus salient point 033 is arranged on circular feature carries out substrate support in basal surface type
Can be better than directly with circular feature contact substrate in protection.Therefore, using 033 liang of ring vaccum chamber and salient point
Person more can realize being particularly substrate effective absorption of warpage substrate after be combineding with each other, while possess comparing sealing ring
The higher adaptability for working condition of substrate support is carried out using circular feature structure between 032, reduces the pollution such as particle right
The impact of substrate adsorption plane type and the abrasion of reduction sucker.
In order to warpage substrate can be particularly with solid and reliable absorbable substrate, and obtain higher operating mode adaptation
Property, the design and distribution of above-mentioned sealing ring 032, salient point 033, annular groove 031 and vacuum hole 034 all must
Must meet some requirements.Specifically, sealing ring 032 should be consistent with the height h of salient point 033, preferred chi
It is very little for 50um～100um, be so conducive to the quick foundation of uniform air pressure in ring vaccum chamber；Salient point 033 is
Cylinder, the diameter a preferred sizes of the upper surface of salient point 033 are 0.1mm～0.3mm, both avoid having with substrate
Large contact area, and then high adaptability for working condition can not be reached, it is also prevented from accelerating salient point abrasion；Two is adjacent
Interval S preferred sizes between salient point 033 are 3mm～6mm, have both prevented substrate from deforming due to absorption affinity,
Also avoid having large contact area and high adaptability for working condition can not be reached with substrate；The width of annular groove 031
Degree d preferred sizes are 1mm～1.5mm, are beneficial to the smooth foundation in ring vaccum chamber；The number of vacuum hole 034
Amount is preferably in each annular groove 031 and contains 3～4 vacuum holes 034, and such sucker structure is unlikely to too
Complexity, while being conducive to the foundation of uniform air pressure in ring vaccum chamber；The quantity of sealing ring 032 can be according to reality
In the application of border depending on substrate sizes, general substrate is bigger, and the quantity of the upper sealing ring 032 of suction cup main body 03 is more,
It is preferred that the spacing preferred scope between two adjacent sealing rings 032 is 10mm～20mm, two adjacent sealing rings
Spacing between 032 is too little, and the effect of salient point 033 is not obvious；Spacing is too greatly for substrate is particularly stuck up
The adsorption capacity of bent substrate will be reduced.The application is by the way of ring vaccum chamber is in combination with salient point 033
Substrate is adsorbed, while being also one equalization point of searching between salient point 033 and sealing ring 032, is selected
Quantity and the distribution of suitable salient point 033, and quantity and the distribution of the suitable sealing ring 032 of selection are selected,
By both reasonable combinations, basal surface type is protected while being adsorbed well to substrate.
It is as Figure 4-Figure 6 the embodiment using the present invention one warpage substrate 04 of absorption.The embodiment is with suction
Arrange on disc main body 03 present invention is illustrated as a example by 3 sealing rings 032, wherein, three sealing rings 032
Radially set gradually from inside to outside along through hole 035, in the internal diameter and through hole 035 of the sealing ring 032 of innermost circle
Footpath is identical, and the external diameter of the sealing ring 032 of outmost turns is identical with the external diameter of warpage substrate 04, and adjacent seals ring
The distance between 032 meets 10mm～20mm.The principle analysis of embodiment of the present invention absorption warpage substrate 04 is such as
Shown in Fig. 6, by taking the sectional structure chart of the sucker of the side of through hole 035 as an example, 03,3 sealings of suction cup main body
Ring 032 and warpage substrate 04 are expected to form 3 ring vaccum chambers, distinguish along the radial direction of through hole 035 from interior to show
Outwards it is referred to as first annular vacuum chamber 031a, the second ring vaccum chamber 031b and the 3rd ring vaccum chamber successively
031c.Simultaneously to show difference, by warpage substrate 04 during adsorbed three kinds of states of presentation be referred to as the
One state substrate 04a, the second state substrate 04b and third state substrate 04c.When diagram " bowl-shape " warpage
Substrate 04 is placed in sucker upper surface, after vacuum source is opened, the sealing ring that first annular vacuum chamber 031a is located
032 upper surface is less apart from the gap of warpage substrate 04, so first annular vacuum chamber 031a can smoothly build
Stand, and then produce certain absorption affinity and warpage substrate 04 is adsorbed onto on sucker.Simultaneously as first annular
The absorption of vacuum chamber 031a, makes warpage substrate 04 produce the trend for becoming flat, i.e., now warpage substrate 04 is
First state substrate 04a shown in Fig. 6.So, the sealing ring 032 that the second ring vaccum chamber 031b is located
Upper surface diminishes apart from the gap of warpage substrate 04, the second ring vaccum chamber 031b also can be smoothly set up and is produced
Raw another absorption affinity to warpage substrate 04 makes warpage substrate 04 continue to flatten.Now warpage substrate 04 is
The second state substrate 04b shown in Fig. 6, same principle, the sealing that the 3rd ring vaccum chamber 031c is located
The upper surface of ring 032 also diminishes apart from the gap of warpage substrate 04, and the 3rd ring vaccum chamber 031c also can smoothly build
Stand and continue warpage substrate 04 to flatten, make warpage substrate 04 be changed into the third state substrate shown in Fig. 6
04c, finally, 3 ring vaccum chambers cause that warpage substrate 04 is solid and reliable to be attracted on sucker.Jing realities
Checking is real, and for warpage substrate 04 of the angularity less than or equal to 120um, the program can be with solid and reliable suction
Attached fixation.
The embodiment of the present invention is first adsorbed by the ring vaccum chamber of inner ring, and then the ring vaccum chamber of outer ring is successively
The mode of absorption, can progressively improve the gap between substrate and ring vaccum chamber, the ring vaccum chamber of inner ring
The gap between adjacent outer ring ring vaccum chamber and substrate can be reduced after absorption, be conducive to the ring vaccum of outer ring
The absorption in chamber, finally realizes the effective absorption to warpage substrate.
With continued reference to Fig. 4 to Fig. 6, the present invention also provides one kind and is particularly warpage substrate using above-mentioned absorbable substrate
Sucker adsorption method, sealing ring 032 connects with the vacuum hole 034 on another sealing ring 032
The control of logical vacuum source is independent of one another so that the gas circuit in the ring vaccum chamber controls that on sealing ring 032
This independence.When substrate absorption is carried out, radially the ring vaccum is opened successively from inside to outside along through hole 035
The vacuum source of chamber connection, to substrate timesharing absorption is carried out.Specific embodiment is referred to as shown in fig. 6, inhaling
Disc main body 03, sealing ring 032 and warpage substrate 04 are expected to form 3 ring vaccum chambers, distinguish from interior to show
Outwards it is referred to as first annular vacuum chamber 031a, the second ring vaccum chamber 031b and the 3rd ring vaccum chamber successively
031c.Simultaneously to show difference, by warpage substrate 04 during adsorbed three kinds of states of presentation be referred to as the
One state substrate 04a, the second state substrate 04b and third state substrate 04c.The gas in 3 ring vaccum chambers
Road control is independent of one another.When diagram " bowl-shape " warpage substrate 04 is placed in sucker upper surface, first is first turned on
The vacuum source of ring vaccum chamber 031a, the upper surface of sealing ring 032 that first annular vacuum chamber 031a is located away from
It is less from the gap of warpage substrate 04, so first annular vacuum chamber 031a can smoothly set up, and then produce
The certain absorption affinity of life is adsorbed onto warpage substrate 04 on sucker.Simultaneously as first annular vacuum chamber 031a
Absorption, produce warpage substrate 04 and become flat trend, i.e., now warpage substrate 04 is shown in Fig. 6
First state substrate 04a.So, the second ring vaccum chamber 031b be located the upper surface of sealing ring 032 away from
Diminish from the gap of warpage substrate 04, now, then open the vacuum source of the second ring vaccum chamber 031b, make
Second ring vacuum chamber 031b also can smoothly set up and produce another absorption affinity to warpage substrate 04 makes warpage
Substrate 04 continues to flatten.Now warpage substrate 04 is the second state substrate 04b shown in Fig. 6.Then again
Open the vacuum source of the 3rd ring vaccum chamber 031c, the sealing ring 032 that the 3rd ring vaccum chamber 031c is located
Upper surface also diminishes apart from the gap of warpage substrate 04, and the 3rd ring vaccum chamber 031c also can smoothly set up and will
Warpage substrate 04 continues to flatten, and makes warpage substrate 04 be changed into third state substrate 04c shown in Fig. 6.Most
Eventually, the successive unlatching in 3 ring vaccum chambers, makes the solid and reliable absorption of warpage substrate 04 on sucker.This
Embodiment thes improvement is that, in initial adsorption state, the vacuum of first annular vacuum chamber 031a will not
Because at the 3rd ring vaccum chamber 031c or the second ring vaccum chamber 031b and warpage substrate 04 it is excessive between
Gap causes damage, and first annular vacuum chamber 031a is more effectively set up, in the same manner the second ring vaccum chamber 031b
Vacuum also will not cause damage because of the larger gap of the 3rd ring vaccum chamber 031c, make the second annular true
Cavity 031b also can more effectively set up.
Claims (14)
1. a kind of sucker, including suction cup main body, the center of the suction cup main body is provided with for the logical of substrate handing-over
Hole, it is characterised in that the suction cup main body is provided with least one protrusion suction cup main body and same with the through hole
The heart distribution sealing ring, annular groove is offered on the sealing ring, be provided with the annular groove it is some with
The vacuum hole of external vacuum source connection, when adsorbing the substrate, is passed through vacuum, positioned at institute from the vacuum hole
The annular groove stated between sealing ring and the substrate is formed as vacuum chamber.
2. sucker according to claim 1, it is characterised in that be also uniformly distributed in the suction cup main body
There are some salient points.
3. sucker according to claim 2, it is characterised in that the salient point is distributed in a ring.
4. sucker according to claim 2, it is characterised in that the height of the sealing ring is convex with described
That what is put is highly identical.
5. sucker according to claim 4, it is characterised in that the height of the sealing ring and the salient point
Spend for 50um～100um.
6. sucker according to claim 2, it is characterised in that the salient point is cylinder.
7. sucker according to claim 6, it is characterised in that a diameter of 0.1mm of the salient point～
0.3mm。
8. sucker according to claim 2, it is characterised in that the interval between the salient point and salient point
For 3mm～6mm.
9. sucker according to claim 1, it is characterised in that the width of the annular groove be 1mm～
1.5mm。
10. sucker according to claim 1, it is characterised in that described in an annular groove
The quantity of vacuum hole is 3～4.
11. suckers according to claim 1 a, it is characterised in that sealing ring and another sealing ring
On the control of vacuum source that connected of vacuum hole it is independent of one another.
12. suckers according to claim 1, it is characterised in that the suction cup main body is silicon carbide ceramics
Or aluminum alloy materials.
13. suckers according to claim 1, it is characterised in that between the two adjacent sealing rings
Spacing preferred scope is 10mm～20mm.
The method that a kind of 14. suckers using as described in claim 1-13 is arbitrary carry out substrate absorption, it is special
Levy and be, a sealing ring is only each other with the control of the vacuum source that the vacuum hole on another sealing ring is connected
It is vertical, when substrate absorption is carried out, radially open true on the sealing ring successively from inside to outside along the through hole
The vacuum source that emptying aperture is connected, carries out timesharing absorption.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510731089.3A CN106653671B (en) | 2015-10-30 | 2015-10-30 | A kind of sucker and its adsorption method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510731089.3A CN106653671B (en) | 2015-10-30 | 2015-10-30 | A kind of sucker and its adsorption method |
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| Publication Number | Publication Date |
|---|---|
| CN106653671A true CN106653671A (en) | 2017-05-10 |
| CN106653671B CN106653671B (en) | 2019-08-23 |
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ID=58810498
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510731089.3A Active CN106653671B (en) | 2015-10-30 | 2015-10-30 | A kind of sucker and its adsorption method |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107363595A (en) * | 2017-09-01 | 2017-11-21 | 北京亦盛精密半导体有限公司 | A kind of fragile material vaccum-suction attachement pad |
| CN107499937A (en) * | 2017-08-17 | 2017-12-22 | 中国南玻集团股份有限公司 | Adsorption method |
| CN107591356A (en) * | 2017-10-13 | 2018-01-16 | 深圳中科飞测科技有限公司 | Wafer mounting apparatus and its application method |
| CN109280904A (en) * | 2018-11-27 | 2019-01-29 | 中山德华芯片技术有限公司 | A kind of graphite plate applied to lattice mismatched structures epitaxial growth |
| CN113078094A (en) * | 2021-03-25 | 2021-07-06 | 深圳中科飞测科技股份有限公司 | Warpage correction method, bearing device and bearing system |
| CN113927462A (en) * | 2021-11-08 | 2022-01-14 | 广东海拓创新精密设备科技有限公司 | Semiconductor shock absorption clamping chuck device and system thereof |
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| CN102270596A (en) * | 2010-06-02 | 2011-12-07 | 上海微电子装备有限公司 | Sucking disc and sheet-holding table |
| CN103367217A (en) * | 2012-04-11 | 2013-10-23 | 上海微电子装备有限公司 | Silicon-chip absorption device and absorption method thereof |
| CN104471700A (en) * | 2012-03-28 | 2015-03-25 | 盛美半导体设备（上海）有限公司 | Vacuum chuck |
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| US5707051A (en) * | 1993-08-13 | 1998-01-13 | Kabushiki Kaisha Toshiba | Wafer stage apparatus for attracting and holding semiconductor wafer |
| CN102270596A (en) * | 2010-06-02 | 2011-12-07 | 上海微电子装备有限公司 | Sucking disc and sheet-holding table |
| CN104471700A (en) * | 2012-03-28 | 2015-03-25 | 盛美半导体设备（上海）有限公司 | Vacuum chuck |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107499937A (en) * | 2017-08-17 | 2017-12-22 | 中国南玻集团股份有限公司 | Adsorption method |
| CN107363595A (en) * | 2017-09-01 | 2017-11-21 | 北京亦盛精密半导体有限公司 | A kind of fragile material vaccum-suction attachement pad |
| CN107591356A (en) * | 2017-10-13 | 2018-01-16 | 深圳中科飞测科技有限公司 | Wafer mounting apparatus and its application method |
| CN109280904A (en) * | 2018-11-27 | 2019-01-29 | 中山德华芯片技术有限公司 | A kind of graphite plate applied to lattice mismatched structures epitaxial growth |
| CN113078094A (en) * | 2021-03-25 | 2021-07-06 | 深圳中科飞测科技股份有限公司 | Warpage correction method, bearing device and bearing system |
| CN113927462A (en) * | 2021-11-08 | 2022-01-14 | 广东海拓创新精密设备科技有限公司 | Semiconductor shock absorption clamping chuck device and system thereof |
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|---|---|
| CN106653671B (en) | 2019-08-23 |
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