CN113927462A - Semiconductor shock absorption clamping chuck device and system thereof - Google Patents
Semiconductor shock absorption clamping chuck device and system thereof Download PDFInfo
- Publication number
- CN113927462A CN113927462A CN202111316436.8A CN202111316436A CN113927462A CN 113927462 A CN113927462 A CN 113927462A CN 202111316436 A CN202111316436 A CN 202111316436A CN 113927462 A CN113927462 A CN 113927462A
- Authority
- CN
- China
- Prior art keywords
- air
- chuck
- shock absorbing
- semiconductor
- air bag
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 59
- 230000035939 shock Effects 0.000 title claims abstract description 37
- 238000010521 absorption reaction Methods 0.000 title abstract description 16
- 238000013016 damping Methods 0.000 claims abstract description 61
- 239000000919 ceramic Substances 0.000 claims description 28
- 238000005498 polishing Methods 0.000 claims description 20
- 230000003139 buffering effect Effects 0.000 claims description 5
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 8
- 239000012634 fragment Substances 0.000 abstract description 4
- 238000005192 partition Methods 0.000 description 4
- 239000002002 slurry Substances 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/007—Weight compensation; Temperature compensation; Vibration damping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
Abstract
The invention relates to the field of semiconductor device processing, and discloses a semiconductor damping clamping chuck device and a system thereof in order to solve the problems that an existing semiconductor clamping chuck has vibration and poor clamping effect when in use. When the pneumatic shock absorption device is used, air is blown into the air bag cavity through the air bag air source connecting piece, the air pressure in the shock absorption air bag is increased, the up-and-down vibration of the upper shock absorption piece in the operation process is reduced, and the deformation amount of the shock absorption air bag when the shock absorption air bag is pressed is reduced, so that the shock absorption effect is better played, higher initial and operation flatness is obtained, particularly, the risk of fragments of a semiconductor device in the operation process is reduced, the yield and the precision are improved, and the clamping effect on the semiconductor device is good.
Description
Technical Field
The invention relates to the technical field of semiconductor device processing, in particular to a semiconductor damping clamping chuck device and a system thereof.
Background
Semiconductor devices are electronic devices that have electrical conductivity between a good electrical conductor and an insulator, and that use the special electrical properties of semiconductor materials to perform specific functions, and can be used to generate, control, receive, convert, amplify signals, and perform energy conversion. The semiconductor device needs to be cut, welded, polished and other processing steps in the processing and manufacturing process, wherein a chemical mechanical polishing process is one of key links in the processing and manufacturing process, a vacuum suction plate or a physical adhesion mode is conventionally used for fixing the semiconductor device to be processed on a rotating fixed substrate to contact a rotating polishing pad with certain pressure, proper grinding slurry is added to rotate at a certain speed, thin layers of oxide, copper, silicon and the like on the surface of a patterned wafer are removed through a chemical etching and physical grinding and polishing mode, the patterned wafer is enabled to reach ideal flatness, but the existing semiconductor device clamping chuck has the problems of vibration and poor clamping effect when in use.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a semiconductor shock absorption clamping chuck device and a system thereof.
In order to achieve the purpose, the invention adopts the following technical scheme:
a semiconductor damping and clamping chuck device comprises a chuck base, wherein a chuck mounting seat is arranged on the side surface of the chuck base, and a damping mechanism is arranged on one side, away from the chuck base, of the chuck mounting seat and used for damping;
the damping mechanism comprises a lower damping part and an upper damping part, a damping air bag is arranged between the lower damping part and the upper damping part and used for absorbing and buffering the vibration kinetic energy between the lower damping part and the upper damping part, and an air bag cavity is arranged inside the damping air bag;
a flange connecting piece is arranged on one side of the upper damping piece, which is far away from the lower damping piece, a sensor connector, an air bag air source connecting piece and a chuck air source connecting piece are arranged on one side of the flange connecting piece, which is far away from the lower damping piece, and the interior of the air bag cavity is communicated with the air bag air source connecting piece through a third air hole;
a pressure cavity is formed in the chuck base, porous ceramics are arranged on one side, away from the chuck mounting seat, of the chuck base, and an air source is provided for the porous ceramics through second air holes in the pressure cavity;
the air source connector provides an air source to the inside of the air pressure cavity through the first air hole.
Preferably, the lower damping piece and the upper damping piece are connected through a guide part and used for guiding and limiting the up-and-down movement of the upper damping piece.
Preferably, the device further comprises a pressure sensor for detecting the air pressure in the air pressure cavity, and the pressure sensor is connected with the sensor connector through a signal line.
Preferably, one end of the shock-absorbing air bag is connected with the inner wall of the upper shock-absorbing member through an upper air bag mounting member, and the other end of the shock-absorbing air bag is connected with the inner wall of the lower shock-absorbing member through a lower air bag mounting member.
Preferably, one side of the chuck base, which is far away from the chuck mounting seat, is provided with a groove, and the porous ceramic is arranged in the groove.
Preferably, an annular groove is formed in the inner wall of one side, far away from the porous ceramic, of the air pressure cavity.
Preferably, the opening position of one end of the second air hole far away from the porous ceramic corresponds to the opening position of the annular groove.
The system for the semiconductor shock absorption clamping chuck device further comprises a first control valve and a first sensor, wherein the first control valve and the first sensor are used for adjusting the air pressure in the shock absorption air bag;
the second control valve and the second sensor are used for adjusting the air pressure in the air pressure cavity;
the controller is used for controlling the first control valve and the second control valve.
Preferably, the clamping device further comprises a conveying mechanism for conveying the semiconductor device to be clamped to one side of the chuck base;
the polishing mechanism is used for polishing the semiconductor device;
and the rotating shaft is used for conveying the clamped semiconductor device to the polishing mechanism for polishing treatment.
The invention has the beneficial effects that:
when in use, air is blown into the air bag cavity through the air bag air source connecting piece, the air pressure in the damping air bag is increased, the deformation of the damping air bag when the upper damping piece shakes up and down and presses the damping air bag in the operation process is reduced, thereby better playing the effect of buffering and damping, obtaining higher initial and operation flatness, especially reducing the risk of fragment occurrence in the operation process of the semiconductor device, thereby improving the yield and the precision, injecting a positive pressure air source or a negative pressure air source into the air pressure cavity through the air source connector, and the air pressure cavity injects positive pressure air source or negative pressure air source into the porous ceramic through the second air hole, so that one side of the porous ceramic, which is contacted with the semiconductor device, and the inside of the air pressure cavity form strong pressure difference, therefore, the semiconductor device is closely adsorbed on one side of the chuck base, which is far away from the chuck mounting seat, and the clamping effect on the semiconductor device is good.
The annular groove that sets up in the atmospheric pressure chamber forms the atmospheric pressure subregion, and every annular groove all has a plurality of atmospheric pressure subregion passageways, when implementing the adsorption operation, ventilates outward in proper order and atmospheric pressure reduces in proper order from circular, forms the atmospheric pressure subregion of different intensity, makes warpage patterning wafer adsorb on the chuck from inside to outside in proper order, and the atmospheric pressure subregion of obstructed intensity can make the wafer more closely adsorbed by the chuck.
Drawings
FIG. 1 is a schematic structural diagram of a semiconductor shock-absorbing clamping chuck device according to an embodiment of the present invention;
fig. 2 is a schematic control flow diagram of a system of a semiconductor shock-absorbing clamping chuck device according to an embodiment of the present invention.
In the figure: the gas-liquid separation device comprises a chuck mounting seat 1, a chuck base 2, a first gas hole 3, a pressure sensor 4, a lower gas bag mounting part 5, a lower damping part 6, an upper damping part 7, a flange connecting part 8, a sensor connector 9, a gas bag gas source connecting part 10, a chuck gas source connecting part 11, an upper gas bag mounting part 12, a gas bag cavity 13, a damping gas bag 14, a gas source connector 15, a gas pressure cavity 16, porous ceramic 17 and a second gas hole 18.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1, the semiconductor damping and clamping chuck device comprises a chuck base 2, a chuck mounting seat 1 is arranged on the side surface of the chuck base 2, and a damping mechanism is arranged on one side of the chuck mounting seat 1 away from the chuck base 2 and used for damping;
the damping mechanism comprises a lower damping part 6 and an upper damping part 7, a damping air bag 14 is arranged between the lower damping part 6 and the upper damping part 7 and is used for absorbing and buffering the vibration kinetic energy between the lower damping part 6 and the upper damping part 7, and an air bag cavity 13 is arranged inside the damping air bag 14;
a flange connecting piece 8 is arranged on one side, far away from the lower damping piece 6, of the upper damping piece 7, a sensor connector 9, an air bag air source connecting piece 10 and a chuck air source connecting piece 11 are arranged on one side, far away from the lower damping piece 6, of the flange connecting piece 8, and the interior of an air bag cavity 13 is communicated with the air bag air source connecting piece 10 through a third air hole;
an air pressure cavity 16 is formed in the chuck base 2, porous ceramics 17 are arranged on one side, away from the chuck mounting seat 1, of the chuck base 2, and an air source is provided for the porous ceramics 17 through a second air hole 18 in the air pressure cavity 16;
the gas source connector 15 is used for providing a gas source for the inside of the gas pressure cavity 16 through the first gas hole 3, when the gas source connector 15 is used, air is blown into the gas bag cavity 13 through the gas bag gas source connector 10, the gas pressure inside the shock absorption gas bag 14 is increased, the deformation quantity of the shock absorption gas bag 14 during the up-and-down shaking of the upper shock absorption part 7 and the pressing of the shock absorption gas bag 14 in the operation process is reduced, the effect of buffering and shock absorption is better achieved, high initial and operation flatness is obtained, particularly, the risk of fragments of a semiconductor device during the operation process is reduced, the yield and the precision are improved, a positive pressure gas source or a negative pressure gas source is injected into the gas pressure cavity 16 through the gas source connector 15, and the positive pressure gas source or the negative pressure gas source is injected into the gas pressure cavity 16 through the second gas hole 18 to the porous ceramic 17, so that a strong pressure difference is formed between one side of the porous ceramic 17, which is in contact with the semiconductor device, and the inside of the gas pressure cavity 16, therefore, the semiconductor device is closely adsorbed on one side of the chuck base 2 far away from the chuck mounting seat 1, and the clamping effect on the semiconductor device is good.
As a preferred embodiment of the invention, the lower shock absorbing member 6 and the upper shock absorbing member 7 are connected through a guide member for guiding and limiting the up and down movement of the upper shock absorbing member 7.
As a preferred embodiment of the present invention, the number of guide members is 3, 4, etc., and in this embodiment, the number of guide members is preferably 3.
As a preferred embodiment of the present invention, a pressure sensor 4 is further included for detecting the air pressure in the air pressure chamber 16, and the pressure sensor 4 is connected to the sensor connector 9 through a signal line.
As a preferred embodiment of the present invention, one end of the shock-absorbing air bag 14 is connected to the inner wall of the upper shock-absorbing member 7 through the upper bag-mounting member 12, and the other end of the shock-absorbing air bag 14 is connected to the inner wall of the lower shock-absorbing member 6 through the lower bag-mounting member 5.
As a preferred embodiment of the present invention, a groove is provided on a side of the chuck base 2 away from the chuck mounting base 1, and the porous ceramic 17 is provided inside the groove.
As a preferred embodiment of the invention, the inner wall of the gas pressure chamber 16 on the side away from the porous ceramic 17 is provided with an annular groove.
As a preferred embodiment of the present invention, an opening position of one end of the second air hole 18, which is far away from the porous ceramic 17, corresponds to an opening position of the annular groove, the annular groove forms an air pressure partition, each annular groove has a plurality of air pressure partition channels, when the adsorption operation is performed, air is sequentially introduced from the circular shape to the outside, and the air pressure is sequentially reduced, so that air pressure partitions with different strengths are formed, and the wafer is sequentially adsorbed on the chuck from the inside to the outside, and the wafer can be more tightly adsorbed by the chuck through the air pressure partition with different strengths.
When the chuck base is used, air is blown into the air bag cavity 13 through the air bag air source connecting piece 10, the air pressure inside the damping air bag 14 is increased, the up-and-down vibration of the upper damping piece 7 in the operation process is reduced, and the deformation amount of the damping air bag 14 when the damping air bag 14 is pressed is reduced, so that the damping effect is better played, higher initial and operation flatness is obtained, particularly, the risk of fragments of a semiconductor device in the operation process is reduced, so that the yield and the precision are improved, a positive pressure air source or a negative pressure air source is injected into the air pressure cavity 16 through the air source connector 15, the positive pressure air source or the negative pressure air source is injected into the porous ceramic 17 through the second air hole 18 by the air pressure cavity 16, so that a strong pressure difference is formed between one side of the porous ceramic 17, which is in contact with the semiconductor device, and the inside of the air pressure cavity 16, so that the semiconductor device is tightly adsorbed on one side of the chuck base 2, which is far away from the chuck base 1, the clamping effect on the semiconductor device is good.
Referring to fig. 2, a system for shock absorbing and clamping a chuck device for a semiconductor further includes a first control valve and a first sensor for adjusting air pressure in a shock absorbing air bag 14;
a second control valve and a second sensor for adjusting the air pressure in the air pressure chamber 16;
the controller is used for controlling the first control valve and the second control valve.
As a preferred embodiment of the present invention, there is further included a conveying mechanism for conveying the semiconductor device to be held to one side of the chuck base 2;
the polishing mechanism is used for polishing the semiconductor device;
and the rotating shaft is used for conveying the clamped semiconductor device to the polishing mechanism for polishing treatment.
As a preferred embodiment of the invention, the pressure sensor 4 feeds back the air pressure intensity in the air pressure cavity 16 to be infinitely close to the air pressure intensity set by the controller, and then the system judges that the porous ceramic 17 is blocked and needs to timely remove the fault, so as to prevent the chip dropping fault of the semiconductor equipment.
As a preferred embodiment of the present invention, the difference between the air pressure intensity in the feedback air pressure chamber 16 of the pressure sensor 4 and the air pressure intensity set by the controller is two or more orders of magnitude, the system will determine that the semiconductor device is not in contact with the porous ceramic 17 or the contact distance is greater than the vacuum reaction intensity, and at this time, the system will detect the position information of the semiconductor device again.
In a preferred embodiment of the present invention, the semiconductor device is at the set position, the system determines again that the semiconductor device is warped to a greater extent, the controller will increase the negative pressure intensity of the second control valve, the pressure sensor 4 will detect continuously, and the pressure intensity in the pressure chamber 16 fed back by the pressure sensor 4 matches the set value of the controller.
As a preferred embodiment of the invention, the porous ceramic 17 is a ceramic material with air permeability sintered by one of alumina and silicon carbide in a special form, the pores are irregularly arranged under a microscope, the diameter of the pores is 0.5-350 μm, during the polishing operation of immersing the semiconductor device into polishing slurry, the moisture in the polishing slurry enters the air pressure cavity 16 along with the micropores of the porous ceramic 17, the air pressure cavity 16 temporarily collects the moisture, and the moisture and the particles of the polishing solution do not pollute the pipeline of the upstream vacuum equipment; after finishing the polishing operation of the semiconductor device, the controller sends an instruction to the first control valve, the positive pressure gas source applies the positive pressure gas source to the air pressure cavity 16 through the pipeline to remove the vacuum state, the semiconductor device removes the adsorption state with the porous ceramic 17, and meanwhile, when the positive pressure gas source is applied to the air pressure cavity 16, residual polishing solution moisture in the air pressure cavity 16 and micropore moisture in the porous ceramic 17 are discharged.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (9)
1. A semiconductor damping and clamping chuck device comprises a chuck base, wherein a chuck mounting seat is arranged on the side surface of the chuck base;
the damping mechanism comprises a lower damping part and an upper damping part, a damping air bag is arranged between the lower damping part and the upper damping part and used for absorbing and buffering the vibration kinetic energy between the lower damping part and the upper damping part, and an air bag cavity is arranged inside the damping air bag;
a flange connecting piece is arranged on one side of the upper damping piece, which is far away from the lower damping piece, a sensor connector, an air bag air source connecting piece and a chuck air source connecting piece are arranged on one side of the flange connecting piece, which is far away from the lower damping piece, and the interior of the air bag cavity is communicated with the air bag air source connecting piece through a third air hole;
a pressure cavity is formed in the chuck base, porous ceramics are arranged on one side, away from the chuck mounting seat, of the chuck base, and an air source is provided for the porous ceramics through second air holes in the pressure cavity;
the air source connector provides an air source to the inside of the air pressure cavity through the first air hole.
2. The semiconductor shock absorbing and clamping chuck device as claimed in claim 1, wherein the lower shock absorbing member and the upper shock absorbing member are connected by a guiding member for guiding and limiting the up and down movement of the upper shock absorbing member.
3. The semiconductor shock absorbing clamping chuck device as claimed in claim 2, further comprising a pressure sensor for detecting the air pressure in the air pressure chamber, wherein the pressure sensor is connected to the sensor connector through a signal line.
4. The semiconductor shock absorbing clamping chuck device as claimed in claim 3, wherein one end of the shock absorbing air bag is connected to the inner wall of the upper shock absorbing member through an upper air bag mounting member, and the other end of the shock absorbing air bag is connected to the inner wall of the lower shock absorbing member through a lower air bag mounting member.
5. The semiconductor shock absorbing and clamping chuck device as claimed in claim 4, wherein the chuck base is provided with a groove on a side thereof away from the chuck mounting seat, and the porous ceramic is disposed inside the groove.
6. The semiconductor shock absorbing clamping chuck device as claimed in claim 1, wherein the inner wall of the pressure chamber on the side away from the porous ceramic is provided with an annular groove.
7. The semiconductor shock absorbing clamping chuck device as claimed in claim 6, wherein the opening position of the end of the second air hole far from the porous ceramic corresponds to the opening position of the annular groove.
8. The system of semiconductor shock absorbing clamp chuck devices of any one of claims 1-7, further comprising a first control valve and a first sensor for adjusting the air pressure within the shock absorbing bladder;
the second control valve and the second sensor are used for adjusting the air pressure in the air pressure cavity;
the controller is used for controlling the first control valve and the second control valve.
9. The system for shock absorbing semiconductor handling chuck assemblies as claimed in claim 8, further comprising a transfer mechanism for transferring the semiconductor device to be handled to one side of the chuck base;
the polishing mechanism is used for polishing the semiconductor device;
and the rotating shaft is used for conveying the clamped semiconductor device to the polishing mechanism for polishing treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111316436.8A CN113927462A (en) | 2021-11-08 | 2021-11-08 | Semiconductor shock absorption clamping chuck device and system thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111316436.8A CN113927462A (en) | 2021-11-08 | 2021-11-08 | Semiconductor shock absorption clamping chuck device and system thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113927462A true CN113927462A (en) | 2022-01-14 |
Family
ID=79285982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111316436.8A Pending CN113927462A (en) | 2021-11-08 | 2021-11-08 | Semiconductor shock absorption clamping chuck device and system thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113927462A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW426585B (en) * | 1999-02-12 | 2001-03-21 | Shinetsu Handotai Kk | Work holding disc for polishing, work polishing apparatus, and work polishing method |
| TW431942B (en) * | 1997-04-04 | 2001-05-01 | Tokyo Seimitsu Co Ltd | Polishing device |
| TW434114B (en) * | 1999-05-07 | 2001-05-16 | Tokyo Seimitsu Co Ltd | Apparatus for polishing wafers |
| CN1476366A (en) * | 2000-09-27 | 2004-02-18 | 斯特拉斯保 | Tool for applying resilient tape to chuck used for grinding or polishing wafers |
| JP2010153585A (en) * | 2008-12-25 | 2010-07-08 | Ebara Corp | Tool and method for holding substrate |
| CN102164719A (en) * | 2008-09-29 | 2011-08-24 | 日东电工株式会社 | Suction sheet |
| CN106653671A (en) * | 2015-10-30 | 2017-05-10 | 上海微电子装备有限公司 | Sucker and adsorption method thereof |
| CN108242418A (en) * | 2016-12-23 | 2018-07-03 | 上海微电子装备（集团）股份有限公司 | A kind of substrate adsorbing mechanism, substrate connection device and method |
| CN110039421A (en) * | 2019-04-24 | 2019-07-23 | 邹云雅 | It is a kind of to flow the excessive online grinding device of anti-polishing pressure with gas |
-
2021
- 2021-11-08 CN CN202111316436.8A patent/CN113927462A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW431942B (en) * | 1997-04-04 | 2001-05-01 | Tokyo Seimitsu Co Ltd | Polishing device |
| TW426585B (en) * | 1999-02-12 | 2001-03-21 | Shinetsu Handotai Kk | Work holding disc for polishing, work polishing apparatus, and work polishing method |
| TW434114B (en) * | 1999-05-07 | 2001-05-16 | Tokyo Seimitsu Co Ltd | Apparatus for polishing wafers |
| CN1476366A (en) * | 2000-09-27 | 2004-02-18 | 斯特拉斯保 | Tool for applying resilient tape to chuck used for grinding or polishing wafers |
| CN102164719A (en) * | 2008-09-29 | 2011-08-24 | 日东电工株式会社 | Suction sheet |
| JP2010153585A (en) * | 2008-12-25 | 2010-07-08 | Ebara Corp | Tool and method for holding substrate |
| CN106653671A (en) * | 2015-10-30 | 2017-05-10 | 上海微电子装备有限公司 | Sucker and adsorption method thereof |
| CN108242418A (en) * | 2016-12-23 | 2018-07-03 | 上海微电子装备（集团）股份有限公司 | A kind of substrate adsorbing mechanism, substrate connection device and method |
| CN110039421A (en) * | 2019-04-24 | 2019-07-23 | 邹云雅 | It is a kind of to flow the excessive online grinding device of anti-polishing pressure with gas |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20160018401A (en) | Method and apparatus for separating adhesive tape | |
| US20130133828A1 (en) | Bonding apparatus, bonding system and bonding method | |
| CN110815034B (en) | Method for grinding wafer | |
| US9960069B2 (en) | Joining device and joining system | |
| JP2012191051A (en) | Method of manufacturing semiconductor, and device of manufacturing semiconductor | |
| KR20140117413A (en) | Suction pad | |
| KR100417571B1 (en) | Chuck for a plate and suction board | |
| US11600515B2 (en) | Die pickup module and die bonding apparatus including the same | |
| JP2008300426A (en) | Vacuum chuck | |
| CN113927462A (en) | Semiconductor shock absorption clamping chuck device and system thereof | |
| TW201936045A (en) | Chip sucking device and chip bonding system including a base, a porous sucking disk arranged on the base, a vacuum gas source and a first gas guiding channel | |
| KR20100077523A (en) | A moving arm for wafer | |
| CN104992921A (en) | Clamping device for large-size ultrathin wafer | |
| CN218837087U (en) | Integrated wafer thinning equipment | |
| JP2018142615A (en) | Wafer carrying/holding device | |
| TWI833414B (en) | Wafer adsorption method | |
| JP2018074120A (en) | Wafer transfer and holding device | |
| JP2004209633A (en) | Apparatus for securing work substrate and method for manufacturing the same | |
| WO2021054265A1 (en) | Joining device and joining method | |
| CN116798929B (en) | Ceramic vacuum chuck suitable for adsorbing wafer and production method for reducing surface scratch rate of wafer | |
| JPH0516088A (en) | Suction type holding tool | |
| CN111063647A (en) | System and method for placing and taking wafer on vacuum chuck by Bernoulli manipulator | |
| CN213936153U (en) | Electrostatic chuck device | |
| KR101438334B1 (en) | Polishing head of cmp apparatus | |
| CN117428607A (en) | Substrate bearing mechanism and substrate grinding equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20220729 Address after: 523000 Room 305, building 2, No. 28, Gaopo Square North Road, Gaopo Town, Dongguan City, Guangdong Province Applicant after: Guangdong Haituo Innovation Technology Co.,Ltd. Address before: 523000 No. 01, zone B, building C, YONGLIDA Science Park, No. 13, Baima Xianfeng Road, Nancheng street, Dongguan City, Guangdong Province Applicant before: GUANGDONG SEATOOLS INNOVATION PRECISION EQUIPMENT TECHNOLOGY CO.,LTD. |
|
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20220114 |