CN108242418A - A kind of substrate adsorbing mechanism, substrate connection device and method - Google Patents
A kind of substrate adsorbing mechanism, substrate connection device and method Download PDFInfo
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- CN108242418A CN108242418A CN201611205575.2A CN201611205575A CN108242418A CN 108242418 A CN108242418 A CN 108242418A CN 201611205575 A CN201611205575 A CN 201611205575A CN 108242418 A CN108242418 A CN 108242418A
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- adsorbing mechanism
- absorption column
- air bag
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
Abstract
The present invention provides a kind of substrate adsorbing mechanism, substrate connection device and methods, by setting first chamber and second chamber in supporting rack, bumper and absorbing shock during achieving the effect that substrate handing-over, and buckling deformation that can be in the adsorption process of adaptive base bottom, soft readjustment is carried out to the buckling deformation of substrate after absorption, saves handover time, improves handing-over efficiency, it is economical and practical so as to improve product yield.
Description
Technical field
The present invention relates to a kind of substrate adsorbing mechanism, substrate connection device and methods, especially a kind of to have adaptive work(
The adsorbent equipment and method of energy.
Background technology
Important equipment of the lithographic equipment as field of microelectronic fabrication, is mainly used for IC chip, flat-panel monitor
The processing and manufacturing of part and other associated semiconductor devices.As the chief component of lithographic equipment, workpiece table system work
Precision, speed and stability etc. considerably determine the production efficiency of litho machine.Contact pin arm device (Lift-PIN) conduct
The important component of work stage subsystem, for completing the work of the upper and lower piece of work stage.Contact pin arm device by installation pedestal,
The compositions such as support component, drive component, measuring unit, gas control unit and auxiliary support assemblies, as shown in Figure 1, usually having
The vertical direction motor function of single-degree-of-freedom, and with Incision Machine's, the carrying fixation and handing-over of substrate are completed, often
There are pneumatic type and electrodynamic type with type of drive.
One group of substrate adsorbent equipment with suction nozzle is devised on contact pin arm device, there is Incision Machine's, substrate absorption
The Incision Machine's of device are used for realizing the handing-over substrate action between transmission manipulator, the absorption effect of substrate adsorbent equipment
Fruit is the factor that emphasis is needed to consider in contact pin arm device vacuum suction design process, and adsorption effect refers mainly to the stability of absorption
And deformation extent that substrate generates after absorbable substrate etc..
In order to ensure adsorption effect, substrate adsorbent equipment needs to reach during vacuum suction certain absorption threshold value.
However, in handshaking, since the size of general silicon chip or glass substrate in itself is larger and relatively thin, in mechanical palm fork and substrate
Under the action of dead weight, silicon chip or glass substrate are pushed up into the bowl-type of handstand, generate buckling deformation phenomenon, as shown in Figure 2.At present originally
Technical field personnel using substrate adsorbent equipment in adsorption process on multiple contour suction nozzles are set or using multiple lift pins
Carry out support substrate.Due to the buckling deformation of substrate, the suction nozzle of multiple close silicon chips or glass substrate edge is due under substrate dead weight
It drops and fits closely together, and the suction nozzle far from edge does not completely set up vacuum, generates leakage vacuum, and substrate absorption effect is not achieved
Fruit.Using multiple lift pins come support substrate, although the probability of leakage vacuum can be reduced, it is detrimental to the reduction of substrate deformation
And lack flexibility, and realize the control to substrate deformation, and uneconomical using the means of electrical control lifter pin at present.
Therefore, it is necessary to the device and methods that a kind of mode of simple economy can be achieved with substrate absorption.
Invention content
It is a primary object of the present invention to propose a kind of substrate adsorbing mechanism and the side of substrate absorption is carried out using this mechanism
The buckling deformation of substrate when method, the mechanism and method are adapted to join, the generation of anti-leak-stopping vacuum, and can be in absorbable substrate
Afterwards, the deformation of substrate is adjusted, saves handover time, improved handing-over efficiency, also with certain buffering vibration-absorbing function, carry
High absorption stability.
To achieve the above object, the first aspect of the present invention provides a kind of substrate adsorbing mechanism, which is characterized in that including branch
Support, suction nozzle, absorption column, the first control loop and the second control loop, the suction nozzle are mounted on the top of the absorption column
End, for absorbable substrate；The absorption column is connect across support frame as described above with first control loop, the absorption column
Middle part be equipped with absorption the column shaft shoulder, it is described absorption the column shaft shoulder will from top to bottom be divided into first chamber inside support frame as described above
And second chamber, second control loop controls the pressure in the first chamber and second chamber, and then passes through the suction
The attached column shaft shoulder drives the absorption column movement.
Preferably, in above-mentioned substrate adsorbing mechanism, the first flexible piece is equipped in the first chamber, described first is flexible
Part is around the absorption column setting, the top connection support frame as described above of first flexible piece, the bottom of first flexible piece
The end connection absorption column shaft shoulder；The second flexible piece is equipped in the second chamber, second flexible piece surrounds the suction
Attached column setting, the top connection absorption column shaft shoulder of second flexible piece, the bottom end connection of second flexible piece
Support frame as described above.
Preferably, in above-mentioned substrate adsorbing mechanism, first flexible piece is the first air bag, and second flexible piece is
Second air bag, first air bag and the second air bag are connected with second control loop, the second control loop control
Pressure in first air bag and the second air bag, and then drive the absorption column movement.
Preferably, in above-mentioned substrate adsorbing mechanism, first air bag and the second air bag are inflatable airbag.
Preferably, in above-mentioned substrate adsorbing mechanism, first air bag and the second air bag are to fill liquid-type air bag.
Preferably, in above-mentioned substrate adsorbing mechanism, first air bag and the second air bag are made of rubber material.
Preferably, in above-mentioned substrate adsorbing mechanism, first flexible piece is the first spring, and second flexible piece is
Second spring.
Preferably, in above-mentioned substrate adsorbing mechanism, the absorption column shaft shoulder is equipped with a dynamic seal ring, to realize
State the dynamic sealing between first chamber and second chamber.
Preferably, in above-mentioned substrate adsorbing mechanism, linear motion bearing, the linear motion are equipped in support frame as described above
Bearing is set on the absorption column, and the absorption column moves in the linear motion bearing.
Preferably, in above-mentioned substrate adsorbing mechanism, first control loop includes first vacuum source, the first solenoid valve
And first sensor, the first vacuum source connect the absorption column, the first sensor by first solenoid valve
For detecting the air pressure in the absorption column, first solenoid valve is used to control the air pressure in the absorption column.
Preferably, in above-mentioned substrate adsorbing mechanism, second control loop is pneumatic circuit.
Preferably, in above-mentioned substrate adsorbing mechanism, second control loop includes second vacuum source, second solenoid valve
And second sensor, the second vacuum source connects the first chamber and second chamber by the second solenoid valve, described
Second sensor is set on support frame as described above, for detecting the location of substrate described in adsorption process.
Preferably, in above-mentioned substrate adsorbing mechanism, second control loop is hydraulic circuit.
Preferably, in above-mentioned substrate adsorbing mechanism, first solenoid valve is 2/2-way solenoid valve.
Preferably, in above-mentioned substrate adsorbing mechanism, the second solenoid valve is two position four-way solenoid valves.
Preferably, in above-mentioned substrate adsorbing mechanism, support frame as described above is equipped with limited block, and the limited block is located at
Below the suction nozzle, for the mechanical position limitation in the buckling deformation recovery process of the substrate.
Preferably, in above-mentioned substrate adsorbing mechanism, support frame as described above is cylinder.
To achieve the above object, the second aspect of the present invention provides a kind of substrate connection device, including any of the above-described substrate
Adsorbing mechanism, the handing-over piece action being used to implement between work stage and transmission manipulator.
Preferably, realize that the method that substrate joins includes the following steps using above-mentioned substrate connection device:
Etc. the multiple substrate adsorbing mechanisms of high settings, setting absorption threshold value；
The adsorption capacity of the multiple substrate adsorbing mechanism is detected after undertaking substrate, control adsorption capacity is not up to the absorption threshold
The substrate adsorbing mechanism of value rises, while detects its adsorption capacity in real time, and power to be adsorbed reaches after the absorption threshold value described in control
Substrate adsorbing mechanism declines, and the buckling deformation of the substrate is adjusted.
A kind of substrate adsorbing mechanism provided by the invention, substrate connection device and method, by setting in supporting rack
One chamber and second chamber, with achieve the effect that substrate handing-over when bumper and absorbing shock；Further, using first chamber and second chamber
The movement of control absorption column avoids using traditional lifter pin, reducing the probability that leakage vacuum occurs, economical and practical, absorption
Stability it is high, and can be in the adsorption process of adaptive base bottom buckling deformation；Further, using first chamber and the second chamber
The movement of room control absorption column, can carry out soft readjustment to the deformation of substrate after absorption, reduce buckling deformation, save and hand over
The time is connect, handing-over efficiency is improved, so as to improve product yield.
Description of the drawings
Fig. 1 is contact pin arm device and adsorbent equipment schematic diagram in the prior art；
Fig. 2 deforms schematic diagram for basement warping in the prior art；
Fig. 3 and Fig. 4 is the substrate adsorbing mechanism schematic diagram in first embodiment of the invention；
Fig. 5 is the workflow of substrate connection device in first embodiment；
Two position four-way solenoid valve working state schematic representations when Fig. 6 rises for suction nozzle；
Fig. 7 is schematic diagram after substrate adsorbing mechanism completion vacuum suction；
Two position four-way solenoid valve working state schematic representations when Fig. 8 declines for suction nozzle；
Fig. 9 and Figure 10 is the substrate adsorbing mechanism schematic diagram in second embodiment of the invention；
Figure 11 is the workflow of the substrate connection device in second embodiment of the invention.
Wherein, 1- suction nozzles；2- adsorbs column；21- adsorbs the column shaft shoulder；31- 2/2-way solenoid valves；32- first is sensed
Device；Two position four-way solenoid valves of 41-；42- second sensors；51- first chambers；52- second chambers；The first air bags of 511-；521-
Second air bag；The first springs of 512-；522- second springs；6- dynamic seal rings；7- supporting racks；71- linear motion bearings；72- is limited
Position block.
Specific embodiment
The specific embodiment of the present invention is explained in more detail below in conjunction with schematic diagram.
First embodiment
The present embodiment proposes a kind of substrate adsorbing mechanism, which includes supporting rack 7, suction nozzle 1, absorption column 2, first and control
Circuit processed and the second control loop.Specifically, as shown in Figure 3 or Figure 4, supporting rack 7 is cylindrical support frame, and the present invention is to branch
The shape and structure of support 7 do not do any restrictions；Supporting rack 7 is equipped with linear motion bearing 71, and linear motion bearing 71 is arranged
On absorption column 2, for adsorbing the guiding that column 2 is moved.A limited block 72, limiting block are additionally provided on supporting rack 7
Block 72 is located at 1 lower section of suction nozzle, for the mechanical position limitation in the buckling deformation recovery process of substrate.Suction nozzle 1 is mounted on absorption column 2
Top, for absorbable substrate, 1 structure of suction nozzle can be cylinder, or cone, the present invention is to the structure of suction nozzle 1, big
Small, quantity and material are not intended to be limited in any.It adsorbs column 2 to connect by supporting rack and the first control loop, the first control loop
Pressure in control absorption column 2；The middle part for adsorbing column 2 is equipped with an absorption column shaft shoulder 21, and the absorption column shaft shoulder 21 will branch
The inside of support is from top to bottom divided into first chamber 51 and second chamber 52, the second control loop control first chamber 51 and the
Pressure in two chambers 52, and then absorption column 2 is driven to move by adsorbing the column shaft shoulder 21, to drive the movement of suction nozzle 1.This
Absorption column 2 in embodiment is moved along Y-direction, i.e. suction nozzle 1 is along Y-direction back and forth movement.
Specifically, the first flexible piece in first chamber 51 in the present embodiment is the first air bag 511, in second chamber 52
The second flexible piece be the second air bag 521.First air bag 511 is set around absorption column 2, and top is connect with supporting rack 7, bottom
End is connect with the absorption column shaft shoulder 21；Second air bag 521 is set around absorption column 2, and top connects with the absorption column shaft shoulder 21
It connects, bottom end connect the first air bag 511 with supporting rack 7 and connect with the second air bag 521 with the second control loop, the second control loop
The pressure in the first air bag 511 and the second air bag 521 is controlled, absorption column 2 to be driven to be moved along Y-direction, and then drives suction nozzle 1
It is moved along Y-direction.
In the present embodiment, the first air bag 511 and the second air bag 521 are inflatable airbag, the first air bag 511 and the second gas
Capsule 521 can be, but not limited to as inflatable airbag and fill liquid-type air bag, the first air bag 511 and the second air bag 521 can with but not
Rubber material composition is limited to, the present invention is to the shape of the first air bag 511 and the second air bag 521, material, inner wall thickness, inside
Filler etc. is not made, is not intended to be limited in any；
The first control loop in the present embodiment is pneumatic circuit, including：First vacuum source, the first solenoid valve and first
Sensor 32, wherein, in the present embodiment, the first solenoid valve is 2/2-way solenoid valve 31.Specifically, 2/2-way solenoid valve 31
It is connect with absorption column 2, for controlling the air pressure adsorbed in column 2, first sensor 32 is for the gas in detection absorption column 2
Pressure.
The second control loop in the present embodiment is pneumatic circuit, including：Second vacuum source, second solenoid valve and second
Sensor 42, wherein, in the present embodiment, second solenoid valve is two position four-way solenoid valves 41.Specifically, second vacuum source passes through two
Position four-way solenoid valve 41 connects first chamber 51 and second chamber 52, second sensor 42 are located on supporting rack, is inhaled for detecting
The location of substrate during attached.
Multiple adsorbing mechanisms provided in this embodiment form a kind of substrate connection device, are used to implement work stage and conveyer
Handing-over piece action between tool hand.Specifically, the workflow that the base connection device in the present embodiment carries out handing-over piece is as follows,
As shown in Figure 5.
Step S1：External input substrate starts the signal of handing-over, loads the transmission manipulator of substrate and the contact pin of work stage
Hand is joined, at this point, waiting the multiple substrate adsorbing mechanisms of high settings, and sets absorption threshold value.
Step S2：2/2-way solenoid valve 31 and first vacuum source work in first control loop, adsorb 2 internal pressure of column
Strong to reduce, suction nozzle 1 starts absorbable substrate, and 2 inner cavity of absorption column gradually forms negative pressure；It is vertical that first sensor 32 starts detection absorption
Pressure in column 2, judges whether suction nozzle 1 reaches absorption threshold value, i.e., whether forms vacuum suction.If having formed vacuum suction,
This suction nozzle does not occur leakage vacuum phenomenon, can terminate the step with safe and stable operation.If in handshaking, substrate has occurred
Buckling deformation, the suction nozzle far from substrate edge adsorption capacity deficiency will occur since basement warping deforms the elastic force generated,
Suction nozzle 1 is caused to be detached from substrate, leakage vacuum phenomenon is generated, as shown in Fig. 2, suction nozzle does not form vacuum suction at this time.Then with wherein one
For the workflow of 1 absorbable substrate of suction nozzle at a separate substrate edge, adsorption process is：
Step S21：In order to enable the suction nozzle 1 far from substrate edge can move upwards, two position four-way solenoid valves 41 start
Work, with reference to figure 6, the P and A of two position four-way solenoid valves 41 are connected at this time, R and B are connected, and second vacuum source is started to work, and second
Pressure increases in air bag 521, and 511 pressure of the first air bag reduces, therefore, the increase of 521 volume of the second air bag, 511 body of the first air bag
Product reduces, and the absorption column shaft shoulder 21 is driven to be moved upwards under the guiding role of linear motion bearing 71 along Y-direction.
Step S22：Suction nozzle 1 starts again at absorbable substrate, and 2/2-way solenoid valve 31 is started to work, 2 inner cavity of absorption column
Pressure reduces, and suction nozzle 1 starts absorbable substrate, and 2 inner cavity of absorption column gradually forms negative pressure；First sensor 32 starts detection absorption
The pressure of 2 inner cavity of column, judges whether suction nozzle 1 reaches absorption threshold value, i.e., whether forms vacuum suction.If vacuum suction is formed
Attached, then this suction nozzle 1 does not occur leakage vacuum phenomenon, can terminate the step with safe and stable operation.If not forming vacuum suction,
This flow is repeated, judges that suction nozzle forms vacuum suction until first sensor 32 detects, terminates the step.
Due to substrate Gravitative Loads, buckling deformation occurs for substrate, and the substrate connection device in the present embodiment has to this change
Shape carries out the function of flexible adjustment, and work step is as follows.
Step Sa：Substrate adsorbing mechanism completes schematic diagram such as Fig. 7 after vacuum suction, due to substrate Gravitative Loads, substrate hair
Raw buckling deformation, the substrate connection device in the present embodiment have the function of to carry out this deformation flexibility adjustment.That is 2/2-way
Solenoid valve 31 is started to work, and the pressure adsorbed in column 2 reduces, and establishes negative pressure, 1 successful absorbable substrate of suction nozzle, first sensor
32 generate detection signal, and two position four-way solenoid valves, 41 reverse operation, the P and B of two position four-way solenoid valves 41 are connected, R and A are connected,
As shown in figure 8, at this point, 511 pressure of the first air bag increases, 521 pressure of the second air bag reduces, i.e. the increase of 511 volume of the first air bag,
Second air bag, 521 volume-diminished, drive absorption the column shaft shoulder 21 under the guiding role of linear motion bearing 71, along Y-direction to
Lower movement, the buckling deformation of substrate start to restore.
Step Sb：Second sensor 42 starts to detect the position of suction nozzle 1 and limited block 72, judges the buckling deformation of substrate
Whether restore completely, if having restored, which terminates, if not restoring, repeatedly flow Sa, until the buckling deformation of substrate is extensive
Multiple, then the step terminates.
Although the substrate adsorbing mechanism proposed in the present embodiment, base connection device and method are used to make when joining substrate
With, but other technologies field being can also be applied to, such as carry material, food etc. is still applicable in, all in protection scope of the present invention
It is interior.
The substrate adsorption structure proposed in the present embodiment includes supporting rack 7, suction nozzle 1, absorption column 2, the first control loop
And second control loop.The middle part for adsorbing column 2 is equipped with an absorption column shaft shoulder 21, adsorbs the column shaft shoulder 21 by supporting rack
Inside is from top to bottom divided into first chamber 51 and second chamber 52, and the in first chamber 51 is controlled by the second control loop
Pressure driving absorption column 2 in the second air bag 521 in one air bag 511 and second chamber 52 moves.First air bag 511 and
Two air bags 521 have the function of bumper and absorbing shock, realize the vacuum suction of substrate, and ensure the stability of absorption；Further, this reality
It applies multiple substrate adsorption structures in example and forms a substrate connection device, can not only realize substrate absorption and handing-over, it can be with
Soft readjustment is carried out to the buckling deformation of substrate, reduces the deflection of substrate so that handover time reduces, and improves handing-over efficiency.
Second embodiment
The present embodiment is a kind of change to first embodiment.
As shown in fig. 9 or 10, different from the substrate adsorbing mechanism in first embodiment, the first chamber in the present embodiment
The first flexible piece in 51 is the first spring 512, and the second flexible piece in second chamber 52 is second spring 522, plays substrate and hands over
To the effect of substrate bumper and absorbing shock when connecing.The present invention is to the material of the first spring 512 and second spring 522, and quantity and shape are not
It imposes any restrictions.First spring 512 around absorption column 2 set, the top of the first spring 512 is connect with supporting rack 7, bottom end and
The absorption column shaft shoulder 21 connects；Second spring 522 is set around absorption column 2, and top is connect with the absorption column shaft shoulder 21.
The absorption column shaft shoulder 71 in the present embodiment is equipped with a dynamic seal ring 6, realizes first chamber 51 and second chamber
Dynamic sealing between 52, the present invention are not intended to be limited in any the material of dynamic seal ring 6 and shape etc..
Two position four-way solenoid valves 41 in second control loop are connect with first chamber 51 and second chamber 52, for controlling
Pressure in first chamber 51 and second chamber 52 to change the volume of first chamber 51 and second chamber 52, drives absorption vertical
Column 2 is moved along Y-direction, i.e., suction nozzle 1 is moved along Y-direction.
The substrate adsorbing mechanism progress substrate absorption workflow that the present embodiment provides is as follows, as shown in figure 11.
Step SA：External input substrate starts the signal of handing-over, loads the transmission manipulator of substrate and the contact pin of work stage
Hand is joined, at this point, waiting the multiple substrate adsorbing mechanisms of high settings, and sets absorption threshold value.
Step SB：2/2-way solenoid valve 31 and first vacuum source work in first control loop, adsorb 2 internal pressure of column
Strong to reduce, suction nozzle 1 starts absorbable substrate, and 2 inner cavity of absorption column gradually forms negative pressure；It is vertical that first sensor 32 starts detection absorption
Pressure in column 2, judges whether suction nozzle 1 reaches absorption threshold value, i.e., whether forms vacuum suction.If having formed vacuum suction,
This suction nozzle does not occur leakage vacuum phenomenon, can terminate the step with safe and stable operation.If in handshaking, substrate has occurred
Buckling deformation, the suction nozzle far from substrate edge adsorption capacity deficiency will occur since basement warping deforms the elastic force generated,
Suction nozzle 1 is caused to be detached from substrate, leakage vacuum phenomenon is generated, as shown in Fig. 2, suction nozzle does not form vacuum suction at this time.Then with wherein one
For the workflow of 1 absorbable substrate of suction nozzle at a separate substrate edge, adsorption process is：
Step SB1：In order to enable the suction nozzle 1 far from substrate edge can move upwards, two position four-way solenoid valves 41 start
Work, with reference to figure 6, the P and A of two position four-way solenoid valves 41 are connected at this time, R and B are connected, and second vacuum source is started to work, and second
Pressure increases in chamber 52, and 51 pressure of first chamber reduces, therefore, the increase of 52 volume of second chamber, the contracting of 51 volume of first chamber
It is small, the absorption column shaft shoulder 21 is driven to be moved upwards under the guiding role of linear motion bearing 71 along Y-direction.
Step SB2：Suction nozzle 1 starts again at absorbable substrate, and 2/2-way solenoid valve 31 is started to work, 2 inner cavity of absorption column
Pressure reduces, and suction nozzle 1 starts absorbable substrate, and 2 inner cavity of absorption column gradually forms negative pressure；First sensor 32 starts detection absorption
The pressure of 2 inner cavity of column, judges whether suction nozzle 1 reaches absorption threshold value, i.e., whether forms vacuum suction.If vacuum suction is formed
Attached, then this suction nozzle 1 does not occur leakage vacuum phenomenon, can terminate the step with safe and stable operation.If not forming vacuum suction,
This flow is repeated, judges that suction nozzle forms vacuum suction until first sensor 32 detects, terminates the step.
Due to substrate Gravitative Loads, buckling deformation occurs for substrate, and the substrate connection device in the present embodiment has to this change
Shape carries out the function of flexible adjustment, and work step is as follows.
Step Ss1：Substrate adsorbing mechanism completes schematic diagram such as Fig. 7 after vacuum suction, due to substrate Gravitative Loads, substrate hair
Raw buckling deformation, the substrate connection device in the present embodiment have the function of to carry out this deformation flexibility adjustment.That is 2/2-way
Solenoid valve 31 is started to work, and the pressure adsorbed in column 2 reduces, and establishes negative pressure, 1 successful absorbable substrate of suction nozzle, first sensor
32 generate detection signal, and two position four-way solenoid valves, 41 reverse operation, the P and B of two position four-way solenoid valves 41 are connected, R and A are connected,
As shown in figure 8, at this point, 51 pressure of first chamber increases, 52 pressure of second chamber reduces, i.e. the increase of 511 volume of the first air bag, the
Two air bags, 521 volume-diminished drives the absorption column shaft shoulder 21 under the guiding role of linear motion bearing 71, downward along Y-direction
Movement, the buckling deformation of substrate start to restore.
Step Ss2：Second sensor 42 starts to detect the position of suction nozzle 1 and limited block 72, judges that the warpage of substrate becomes
Whether shape is restored completely, if having restored, which terminates, if not restoring, repeatedly flow Sa, until the buckling deformation of substrate
Restore, then the step terminates.
Although the substrate adsorbing mechanism proposed in the present embodiment, base connection device and method are used to make when joining substrate
With, but other technologies field being can also be applied to, such as carry material, food etc. is still applicable in, all in protection scope of the present invention
It is interior.
The substrate adsorption structure proposed in the present embodiment includes supporting rack 7, suction nozzle 1, absorption column 2, the first control loop
And second control loop.The middle part for adsorbing column 2 is equipped with an absorption column shaft shoulder 21, adsorbs the column shaft shoulder 21 by supporting rack
Inside is from top to bottom divided into first chamber 51 and second chamber 52, and first chamber 51 and second is controlled by the second control loop
Pressure driving absorption column 2 in chamber 52 moves.First chamber 51 and second chamber 52 have the function of bumper and absorbing shock, realize
The vacuum suction of substrate, and ensure the stability of absorption；Further, multiple substrate adsorption structures in the present embodiment form a base
Bottom connection device can not only realize substrate absorption and handing-over, can also carry out soft readjustment to the buckling deformation of substrate, reduce
The deflection of substrate so that handover time reduces, and improves handing-over efficiency.
In conclusion substrate adsorbing mechanism provided by the invention, substrate connection device and method, by being set in supporting rack
Put first chamber and second chamber, with achieve the effect that substrate handing-over when bumper and absorbing shock；Further, using first chamber and second
The movement of chamber control absorption column avoids using traditional lifter pin, reducing the probability that leakage vacuum occurs, economical and practical,
The stability of absorption is high, and can be in the adsorption process of adaptive base bottom buckling deformation；Further, using first chamber and
The movement of two chambers control absorption column, can carry out soft readjustment to the deformation of substrate after absorption, reduce buckling deformation, section
About handover time improves handing-over efficiency, so as to improve product yield.
Substrate described in this implementation includes silicon chip or glass substrate.
The preferred embodiment of the present invention is above are only, does not play the role of any restrictions to the present invention.Belonging to any
Those skilled in the art, in the range of technical scheme of the present invention is not departed from, to the invention discloses technical solution and
Technology contents make the variations such as any type of equivalent replacement or modification, belong to the content without departing from technical scheme of the present invention, still
Within belonging to the scope of protection of the present invention.
Claims (19)
1. a kind of substrate adsorbing mechanism, which is characterized in that including supporting rack, suction nozzle, absorption column, the first control loop and second
Control loop, the suction nozzle is mounted on the top of the absorption column, for absorbable substrate；The absorption column passes through the branch
Support is connect with first control loop, and the middle part of the absorption column is equipped with the absorption column shaft shoulder, the absorption column axis
Shoulder will from top to bottom be divided into first chamber and second chamber inside support frame as described above, the second control loop control described the
Pressure in one chamber and second chamber, and then the absorption column is driven to move by the absorption column shaft shoulder.
2. substrate adsorbing mechanism as described in claim 1, which is characterized in that the first flexible piece is equipped in the first chamber,
First flexible piece is around the absorption column setting, the top connection support frame as described above of first flexible piece, and described the
The bottom end connection absorption column shaft shoulder of one flexible piece；The second flexible piece is equipped in the second chamber, described second is flexible
Part is around the absorption column setting, and the top connection absorption column shaft shoulder of second flexible piece, described second is flexible
The bottom end connection support frame as described above of part.
3. substrate adsorbing mechanism as claimed in claim 2, which is characterized in that first flexible piece is the first air bag, described
Second flexible piece is the second air bag, and first air bag and the second air bag are connected with second control loop, described second
Control loop controls the pressure in first air bag and the second air bag, and then drives the absorption column movement.
4. substrate adsorbing mechanism as claimed in claim 3, which is characterized in that first air bag and the second air bag are inflation
Formula air bag.
5. substrate adsorbing mechanism as claimed in claim 3, which is characterized in that first air bag and the second air bag are filling liquid
Body formula air bag.
6. substrate adsorbing mechanism as claimed in claim 3, which is characterized in that first air bag and the second air bag are by rubber material
Material is formed.
7. substrate adsorbing mechanism as claimed in claim 2, which is characterized in that first flexible piece is the first spring, described
Second flexible piece is second spring.
8. substrate adsorbing mechanism as claimed in claim 7, which is characterized in that the absorption column shaft shoulder is equipped with a dynamic sealing
Circle, to realize the dynamic sealing between the first chamber and second chamber.
9. substrate adsorbing mechanism as described in claim 1, which is characterized in that linear motion bearing is equipped in support frame as described above,
The linear motion bearing is set on the absorption column, and the absorption column moves in the linear motion bearing.
10. substrate adsorbing mechanism as described in claim 1, which is characterized in that first control loop includes the first vacuum
Source, the first solenoid valve and first sensor, the first vacuum source connect the absorption column, institute by first solenoid valve
First sensor is stated for detecting the air pressure in the absorption column, first solenoid valve is used to control in the absorption column
Air pressure.
11. substrate adsorbing mechanism as claimed in claim 4, which is characterized in that second control loop is pneumatic circuit.
12. substrate adsorbing mechanism as claimed in claim 11, which is characterized in that second control loop includes the second vacuum
Source, second solenoid valve and second sensor, the second vacuum source by the second solenoid valve connect the first chamber and
Second chamber, the second sensor is set on support frame as described above, for detecting the location of substrate described in adsorption process.
13. substrate adsorbing mechanism as claimed in claim 5, which is characterized in that second control loop is hydraulic circuit.
14. substrate adsorbing mechanism as claimed in claim 10, which is characterized in that first solenoid valve is 2/2-way electromagnetism
Valve.
15. substrate adsorbing mechanism as claimed in claim 12, which is characterized in that the second solenoid valve is two four-way electromagnetics
Valve.
16. substrate adsorbing mechanism as described in claim 1, which is characterized in that support frame as described above is equipped with limited block, described
Limited block is located at below the suction nozzle, for the mechanical position limitation in the buckling deformation recovery process of the substrate.
17. substrate adsorbing mechanism as described in claim 1, which is characterized in that support frame as described above is cylinder.
18. a kind of substrate connection device, which is characterized in that including multiple such as any substrate adsorbing mechanism in claim 1-17,
The handing-over piece action being used to implement between work stage and transmission manipulator.
A kind of 19. method that substrate handing-over is realized using substrate connection device as claimed in claim 18, which is characterized in that packet
Include following steps:
Etc. the multiple substrate adsorbing mechanisms of high settings, setting absorption threshold value；
The adsorption capacity of the multiple substrate adsorbing mechanism is detected after undertaking substrate, control adsorption capacity is not up to the absorption threshold value
Substrate adsorbing mechanism rises, while detects its adsorption capacity in real time, and power to be adsorbed controls the substrate after reaching the absorption threshold value
Adsorbing mechanism declines, and the buckling deformation of the substrate is adjusted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611205575.2A CN108242418A (en) | 2016-12-23 | 2016-12-23 | A kind of substrate adsorbing mechanism, substrate connection device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611205575.2A CN108242418A (en) | 2016-12-23 | 2016-12-23 | A kind of substrate adsorbing mechanism, substrate connection device and method |
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| CN108242418A true CN108242418A (en) | 2018-07-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201611205575.2A Pending CN108242418A (en) | 2016-12-23 | 2016-12-23 | A kind of substrate adsorbing mechanism, substrate connection device and method |
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Cited By (3)
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| CN113927462A (en) * | 2021-11-08 | 2022-01-14 | 广东海拓创新精密设备科技有限公司 | Semiconductor shock absorption clamping chuck device and system thereof |
| CN115241108A (en) * | 2022-09-25 | 2022-10-25 | 杭州中欣晶圆半导体股份有限公司 | Handover device and rapid handover method for increasing processing speed of silicon wafer |
| CN116331845A (en) * | 2023-05-30 | 2023-06-27 | 泰州恒润玻璃有限公司 | Toughened glass handling device |
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| CN113927462A (en) * | 2021-11-08 | 2022-01-14 | 广东海拓创新精密设备科技有限公司 | Semiconductor shock absorption clamping chuck device and system thereof |
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Application publication date: 20180703 |