JPH0516088A - Suction type holding tool - Google Patents

Suction type holding tool

Info

Publication number
JPH0516088A
JPH0516088A JP17081391A JP17081391A JPH0516088A JP H0516088 A JPH0516088 A JP H0516088A JP 17081391 A JP17081391 A JP 17081391A JP 17081391 A JP17081391 A JP 17081391A JP H0516088 A JPH0516088 A JP H0516088A
Authority
JP
Japan
Prior art keywords
sintered body
suction
fine particle
substrate
particle sintered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17081391A
Other languages
Japanese (ja)
Inventor
Yoshiyasu Inoue
義康 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP17081391A priority Critical patent/JPH0516088A/en
Publication of JPH0516088A publication Critical patent/JPH0516088A/en
Pending legal-status Critical Current

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  • Manipulator (AREA)
  • Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)

Abstract

PURPOSE:To hold substrate having a high degree of flatness with a suction type holding tool of a liquid crystal plate or the like by fitting a plate porous fine particle sintered body having multiple holes on the surface thereof to one surface of a base, in which vacuum exhaust holes are formed in the other surface, and performing the vacuum suction from the vacuum discharge port to suck the substrate to the surface of the sintered body. CONSTITUTION:Particles such as steatite or the like are sintered to form a porous body, and one surface thereof is ground precisely to form a fine particle sintered body 3. Suction holes 5 are formed in this fine particle sintered body 3. Exhaust holes 10 to be communicated with vertical and horizontal grooves 9 are formed in the recessed surface 8 of a base 2. The fine particle sintered body 3 is fitted to the recessed surface 8 of the base 2 by screws 4, and the exhaust holes 10 and the suction holes 5 are connected to a vacuum pump through connecting nipples 7 and connecting tubes 6. A substrate 1 is placed on the fine particle sintered body 3, and the vacuum pump is operated for suction.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、液晶板,半導体ウェー
ハのような脆弱な基板を吸着保持する吸着保持具に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a suction holder for holding a fragile substrate such as a liquid crystal plate or a semiconductor wafer by suction.

【0002】[0002]

【従来の技術】図2(a)及び(b)は従来の一例を示
す吸着保持具の平面図及び側面図である。従来、この種
の吸着保持具は、図2(a)及び(b)に示すように、
例えば、ステンレス材,アルミ材,鉄材の板材から製作
される板状のベース20と、このベース20の一面に基
板1を乗せるとともに複数の吸着穴22及びこれら吸着
穴22間を通ずる溝24が形成され、複数のかつ吸着穴
22及び溝24の空間部を真空排気するための接続ニッ
プル23とを有していた。
2. Description of the Related Art FIGS. 2A and 2B are a plan view and a side view of a conventional suction holder. Conventionally, this type of suction holding device is, as shown in FIGS. 2 (a) and 2 (b),
For example, a plate-shaped base 20 made of a plate material of stainless steel, aluminum, or iron, a substrate 1 placed on one surface of the base 20, a plurality of suction holes 22 and a groove 24 communicating between these suction holes 22 are formed. And a connecting nipple 23 for evacuating a plurality of spaces of the suction holes 22 and the grooves 24.

【0003】この吸着保持具を用いて薄い脆弱な基板を
保持して他に搬送したりする場合は、まず、吸着面21
を基板1の面と接触させ、接続ニップル23を通して、
吸着穴22及び溝24の空間部を真空排気する。このこ
とによって、吸着面21に基板1が吸着保持される。次
に、この吸着保持具を所定の場所に運搬し、所定の場所
で吸着保持した状態で作業を行う。
When a thin, fragile substrate is held and conveyed to another by using this suction holder, first, the suction surface 21 is used.
With the surface of the substrate 1 through the connection nipple 23,
The spaces of the suction holes 22 and the grooves 24 are evacuated. As a result, the substrate 1 is suction-held on the suction surface 21. Next, the suction holder is transported to a predetermined place, and the work is performed in a state where the suction holder is sucked and held at the predetermined place.

【0004】また、吸着面21の吸着穴22の溝2の数
を大きくすることによって、基板1を真空吸引する面積
を増大させ、ある程度均一に基板を吸着するようにして
使用していた。
Further, by increasing the number of the grooves 2 of the suction holes 22 of the suction surface 21, the area for vacuum suction of the substrate 1 is increased and the substrate is sucked uniformly to some extent.

【0005】[0005]

【発明が解決しようとする課題】この従来の吸着保持具
では基板1が吸着面21の吸着穴22か又は溝24に接
している部分のみで吸着されるため単に基板を保持する
だけの役割であれば充分であるが、例えば印刷工程や微
小量塗布工程等で基板面の平坦度がより高い精度を必要
する場合には、溝24及び吸着穴22に対応する基板1
の面が変形し、印刷むらや塗布むらが起るという問題が
ある。
In this conventional suction holder, since the substrate 1 is sucked only by the portion of the suction surface 21 which is in contact with the suction hole 22 or the groove 24, it serves only to hold the substrate. It is sufficient if the substrate 1 corresponding to the groove 24 and the suction hole 22 is required, for example, when a higher degree of flatness of the substrate surface is required in a printing process or a minute amount coating process.
However, there is a problem that the surface of is deformed, and uneven printing or uneven application occurs.

【0006】本発明の目的は、かかる問を解消すべく、
基板の平坦度を高い精度を維持して吸着保持出来る吸着
保持具を提供することにある。
The object of the present invention is to solve such a problem.
An object of the present invention is to provide a suction holder that can hold the flatness of a substrate with high accuracy by suction.

【0007】[0007]

【課題を解決するための手段】本発明の吸着保持は、表
面に多孔を有する板状の多孔質微粒子焼結体と、この多
孔質微粒子焼結体を一面に取付けるとともに他面に第1
の真空排気穴が形成されるベースとを備え、前記多孔質
微粒子焼結体に基板を乗せ、前記真空排気穴より真空排
気して前記多孔質微粒子焼結体に前記基板を吸着保持す
ることを特徴としている。
In the adsorption and holding of the present invention, a plate-like porous fine particle sintered body having a porous surface, and the porous fine particle sintered body is attached to one surface and the first surface is attached to the other surface.
And a base on which a vacuum exhaust hole is formed, the substrate is placed on the porous fine particle sintered body, and the substrate is adsorbed and held on the porous fine particle sintered body by evacuation from the vacuum exhaust hole. It has a feature.

【0008】[0008]

【実施例】次に本発明について図面を参照して説明す
る。
The present invention will be described below with reference to the drawings.

【0009】図1(a)及び(b)は本発明の一実施例
を示す吸着保持具の平面図と側面図である。この吸着保
持具は、同図に示すように、基板1を乗せるとともに溝
9及び排気穴10が形成されるベース2の窪み面8にね
じ4で密着固定される微粒子焼結体3を設けたことであ
る。
FIGS. 1 (a) and 1 (b) are a plan view and a side view of a suction holder showing an embodiment of the present invention. In this suction holder, as shown in the figure, a substrate 1 is placed and a fine particle sintered body 3 which is tightly fixed by a screw 4 is provided on a recessed surface 8 of a base 2 in which a groove 9 and an exhaust hole 10 are formed. That is.

【0010】また、微粒子焼結体3は、ステアタイトの
ような安価な粒子物を焼結することで、ポーラス状とな
り、10〜50μ程度の多数の孔をもつ多孔質体として
形成され、一面を精密に研磨されたものである。そし
て、この微粒子焼結体3に吸着穴5を明け、ベース2の
窪み面8に微粒子焼結体3との間に空間部を設けるため
に縦横に連らなる溝9とこれら溝9と連結する排気穴1
0を形成したことである。さらにこの排気穴10及び吸
着穴5を接続ニップル7及び接続チューブ6を介して外
部真空ポンプと接続する。
Further, the fine particle sintered body 3 is formed into a porous shape by sintering an inexpensive particle material such as steatite, and is formed as a porous body having a large number of pores of about 10 to 50 μm. Is precisely polished. Then, a suction hole 5 is opened in the fine particle sintered body 3, and a groove 9 connected vertically and horizontally to connect the groove 9 to form a space between the hollow surface 8 of the base 2 and the fine particle sintered body 3. Exhaust hole 1
0 is formed. Further, the exhaust hole 10 and the suction hole 5 are connected to an external vacuum pump via a connection nipple 7 and a connection tube 6.

【0011】次に、この吸着保持具の動作について述べ
る。まず、基板1を微粒子焼結体3上に乗せる。次に吸
着穴5に通ずる空間部を真空排気し、基板1を吸着保持
する。次に、基板1を吸着保持具とともに印刷機内台に
載置し、吸着穴5に通ずる空間部に空気を導入し、大気
に戻し、吸着穴5に通ずる真空ポンプ系統のバルブを閉
じる。次に排気穴10に通ずる溝9の空間部を真空排気
する。このことにより微粒子焼結体3の微小穴を通して
基板1との間の空間部が真空排気され、基板1は一様の
吸着力で保持される。また、微粒子焼結体3の表面の平
坦度は精密に研削されているので、基板1も平坦度を維
持して吸着保持される。
Next, the operation of the suction holder will be described. First, the substrate 1 is placed on the fine particle sintered body 3. Next, the space portion communicating with the suction hole 5 is evacuated to vacuum and hold the substrate 1. Next, the substrate 1 is placed on a table inside the printing machine together with the suction holder, air is introduced into the space portion communicating with the suction hole 5 and returned to the atmosphere, and the valve of the vacuum pump system communicating with the suction hole 5 is closed. Next, the space of the groove 9 communicating with the exhaust hole 10 is evacuated. As a result, the space between the fine particle sintered body 3 and the substrate 1 is evacuated through the minute holes, and the substrate 1 is held with a uniform suction force. Further, since the flatness of the surface of the fine particle sintered body 3 is precisely ground, the substrate 1 is also sucked and held while maintaining the flatness.

【0012】[0012]

【発明の効果】以上説明したように本発明は、基板を吸
着する面に、平坦度の良い多孔質の微粒子焼結体を用い
ることによって基板全面を均一な吸着力で保持すること
ができ、かつ基板が平坦度の良い微粒子焼結体の表面に
倣うので、基板を高い精度の平坦度の維持して吸着保持
出来る吸着保持具が得られるという効果がある。
As described above, according to the present invention, by using a porous fine particle sintered body having a good flatness on the surface for adsorbing a substrate, the entire surface of the substrate can be held with a uniform adsorbing force, Moreover, since the substrate follows the surface of the fine particle sintered body having a good flatness, there is an effect that a suction holding tool can be obtained which can hold the substrate by suction while maintaining the flatness with high accuracy.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例を示し、(a)は吸着保持具
の平面図、(b)は側面図である。
FIG. 1 shows an embodiment of the present invention, (a) is a plan view of a suction holder, and (b) is a side view.

【図2】従来の一例を示し、(a)は吸着保持具の平面
図、(b)は側面図である。
2A and 2B show a conventional example, FIG. 2A is a plan view of a suction holder, and FIG.

【符号の説明】[Explanation of symbols]

1 基板 2,20 ベース 3 微粒子焼結体 4 ねじ 5,22 吸着穴 6 接続チューブ 7,23 接続ニップル 8 窪み面 9,24 溝 10 排気穴 1 substrate 2,20 base 3 Fine particle sintered body 4 screws 5,22 Suction hole 6 connection tube 7,23 connection nipple 8 hollow surface 9,24 groove 10 exhaust holes

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 表面に多孔を有する板状の多孔質微粒子
焼結体と、この多孔質微粒子焼結体を一面に取付けると
ともに他面に第1の真空排気穴が形成されるベースとを
備え、前記多孔質微粒子焼結体に基板を乗せ、前記真空
排気穴より真空排気して前記多孔質微粒子焼結体に前記
基板を吸着保持することを特徴とする吸着保持具。
1. A plate-shaped porous fine particle sintered body having a porous surface, and a base on which the porous fine particle sintered body is mounted on one surface and a first vacuum exhaust hole is formed on the other surface. A suction holder, wherein a substrate is placed on the porous fine particle sintered body, and the porous fine particle sintered body is sucked and held by vacuum evacuation from the vacuum exhaust hole.
【請求項2】 前記多孔質微粒子焼結体に複数の穴を明
け、この穴と通ずる第2の真空排気穴を前記ベースに形
成し、この第2の真空排気穴より真空排気して前記基板
を前記多孔質微粒子焼結体に吸着することを特徴とする
請求項1記載の吸着保持具。
2. A plurality of holes are formed in the porous fine particle sintered body, and a second vacuum exhaust hole communicating with the holes is formed in the base, and the substrate is evacuated from the second vacuum exhaust hole. The adsorption holder according to claim 1, wherein the adsorption is carried out on the porous fine particle sintered body.
JP17081391A 1991-07-11 1991-07-11 Suction type holding tool Pending JPH0516088A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17081391A JPH0516088A (en) 1991-07-11 1991-07-11 Suction type holding tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17081391A JPH0516088A (en) 1991-07-11 1991-07-11 Suction type holding tool

Publications (1)

Publication Number Publication Date
JPH0516088A true JPH0516088A (en) 1993-01-26

Family

ID=15911815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17081391A Pending JPH0516088A (en) 1991-07-11 1991-07-11 Suction type holding tool

Country Status (1)

Country Link
JP (1) JPH0516088A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0970783A (en) * 1995-09-06 1997-03-18 Sharp Corp Suction device
JP2000021952A (en) * 1998-04-27 2000-01-21 Tokyo Seimitsu Co Ltd Flattening device for wafer
CN102758831A (en) * 2011-04-26 2012-10-31 塔工程有限公司 Vacuum absorption device
WO2018168002A1 (en) * 2017-03-16 2018-09-20 株式会社日本製鋼所 Laser irradiation apparatus, laser irradiation method, and semiconductor device manufacturing method
CN109928213A (en) * 2019-04-10 2019-06-25 深圳市华星光电半导体显示技术有限公司 Mechanical arm

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4869251A (en) * 1971-12-23 1973-09-20
JPS6412039B2 (en) * 1981-07-10 1989-02-28 Tokyo Shibaura Electric Co

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4869251A (en) * 1971-12-23 1973-09-20
JPS6412039B2 (en) * 1981-07-10 1989-02-28 Tokyo Shibaura Electric Co

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0970783A (en) * 1995-09-06 1997-03-18 Sharp Corp Suction device
JP2000021952A (en) * 1998-04-27 2000-01-21 Tokyo Seimitsu Co Ltd Flattening device for wafer
CN102758831A (en) * 2011-04-26 2012-10-31 塔工程有限公司 Vacuum absorption device
CN102758831B (en) * 2011-04-26 2014-10-29 塔工程有限公司 Vacuum absorption device
WO2018168002A1 (en) * 2017-03-16 2018-09-20 株式会社日本製鋼所 Laser irradiation apparatus, laser irradiation method, and semiconductor device manufacturing method
JP2018157000A (en) * 2017-03-16 2018-10-04 株式会社日本製鋼所 Laser irradiation device, laser irradiation method, and manufacturing method of semiconductor device
CN110418691A (en) * 2017-03-16 2019-11-05 株式会社日本制钢所 Laser irradiation device, laser irradiating method and method, semi-conductor device manufacturing method
US10950474B2 (en) 2017-03-16 2021-03-16 The Japan Steel Works, Ltd. Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device
CN110418691B (en) * 2017-03-16 2022-02-15 株式会社日本制钢所 Laser irradiation apparatus, laser irradiation method, and semiconductor device manufacturing method
US11676831B2 (en) 2017-03-16 2023-06-13 Jsw Aktina System Co., Ltd Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device
CN109928213A (en) * 2019-04-10 2019-06-25 深圳市华星光电半导体显示技术有限公司 Mechanical arm

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Effective date: 19970701