JPH08195428A - Vacuum suction device - Google Patents
Vacuum suction deviceInfo
- Publication number
- JPH08195428A JPH08195428A JP4958195A JP4958195A JPH08195428A JP H08195428 A JPH08195428 A JP H08195428A JP 4958195 A JP4958195 A JP 4958195A JP 4958195 A JP4958195 A JP 4958195A JP H08195428 A JPH08195428 A JP H08195428A
- Authority
- JP
- Japan
- Prior art keywords
- vacuum suction
- vacuum
- sample
- suction device
- seal portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Jigs For Machine Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
(57)【要約】
【目的】 試料の外周部においてもダスト等による影響
を受けず、試料を高い平面度に矯正することができるよ
うにする。
【構成】 真空吸着器1の上面に真空吸着部3と、これ
を取り囲むシール部4を設ける。真空吸着部3とシール
部4に上面が同一平面を形成するように突子2,11を
それぞれ設け、これらの突子によって試料6を支承す
る。シール部4と試料6との間に形成される微小隙間1
2は、真空排気時に大きな抵抗となり外部の空気を吸い
込まないようにする。また、加工時には加工液が侵入し
ないようにする。
(57) [Summary] [Purpose] The sample should be able to be corrected to have a high flatness without being affected by dust or the like even in the outer periphery of the sample. [Structure] A vacuum suction part 3 and a seal part 4 surrounding the vacuum suction part 3 are provided on the upper surface of the vacuum suction device 1. The vacuum suction part 3 and the seal part 4 are respectively provided with protrusions 2 and 11 so that their upper surfaces form the same plane, and the sample 6 is supported by these protrusions. Minute gap 1 formed between the seal portion 4 and the sample 6
No. 2 has a large resistance during vacuum evacuation so as not to suck the outside air. Also, prevent the working fluid from entering during processing.
Description
【0001】[0001]
【産業上の利用分野】本発明は、LSI製造装置におけ
る、パターン転写装置、描画装置、各種プロセス製造装
置、検査測長装置、および研削、研磨、切断などの加工
装置の試料保持装置と試料搬送装置に用いられる真空吸
着装置に関し、特にその真空吸着器に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pattern transfer device, a drawing device, various process manufacturing devices, an inspection / measuring device, and a sample holding device and a sample transport device for processing equipment such as grinding, polishing and cutting in an LSI manufacturing equipment. The present invention relates to a vacuum suction device used in an apparatus, and particularly to a vacuum suction device thereof.
【0002】[0002]
【従来の技術】従来、LSI製造において用いられるこ
の種の真空吸着装置は、図13(a)、(b)に示すよ
うな真空吸着器を備えている。これを概略説明すると、
1は真空吸着器で、その上面には多数の微小な突子2を
有する真空吸着部3と、環状の突部によって形成され真
空吸着部3を取り囲むランド部4が設けられている。突
子2とランド部4の上面は同一平面を形成し、試料6を
支承する。このため、突子2とランド部4の上面は仕上
げ加工されることにより高精度な平面を形成している。
また、真空吸着器1の内部には一端が真空吸着部3の内
底面3aに開口し、他端が真空吸着器1の下面に開口す
る例えば4つの真空排気孔5が形成されており、その他
端開口部は図示しない真空ポンプに接続されている。2. Description of the Related Art Conventionally, this type of vacuum suction device used in the manufacture of an LSI has a vacuum suction device as shown in FIGS. 13 (a) and 13 (b). The outline of this is
Reference numeral 1 denotes a vacuum suction device, on the upper surface of which a vacuum suction portion 3 having a large number of minute projections 2 and a land portion 4 formed by an annular projection portion and surrounding the vacuum suction portion 3 are provided. The upper surfaces of the protrusion 2 and the land portion 4 form the same plane and support the sample 6. Therefore, the upper surfaces of the protrusion 2 and the land portion 4 are finished to form a highly accurate flat surface.
Further, inside the vacuum suction device 1, for example, four vacuum exhaust holes 5 having one end opening to the inner bottom surface 3a of the vacuum suction part 3 and the other end opening to the lower surface of the vacuum suction device 1 are formed. The end opening is connected to a vacuum pump (not shown).
【0003】このような真空吸着器1において、真空吸
着器1の上面にウエハ等の試料6を載置した後、真空ポ
ンプを作動させて試料6の下部の空気を真空排気孔5か
ら排気すると、真空吸着部3が負圧となるため、試料6
は突子2およびランド部4上に吸着される。ランド部4
の上面は突子2の上面と同一平面を形成しており、試料
6の裏面外周縁部が密接されることで、真空吸着部3を
真空封止する。試料6は、真空吸着されることで突子2
およびランド部4の上面に倣い、反りや曲がりが矯正さ
れる。In such a vacuum suction device 1, after a sample 6 such as a wafer is placed on the upper surface of the vacuum suction device 1, the vacuum pump is operated to exhaust the air below the sample 6 from the vacuum exhaust hole 5. , The vacuum suction unit 3 has a negative pressure.
Is adsorbed on the protrusion 2 and the land portion 4. Land part 4
Has an upper surface flush with the upper surface of the protrusion 2, and the outer peripheral edge portion of the back surface of the sample 6 is brought into close contact with the vacuum suction portion 3 so as to be vacuum-sealed. The sample 6 is vacuum-adsorbed so that the protrusion 2
Also, the warp and the bend are corrected by following the upper surface of the land portion 4.
【0004】[0004]
【発明が解決しようとする課題】上記した従来の真空吸
着装置の真空吸着器にあっては、真空排気によって試料
6を真空吸着部3の突子2とランド部4の上面に吸着す
ることにより、試料6の反りや変形を矯正し平面にする
ことができる。また、突子2により真空吸着器1と試料
6との接触面積をきわめて小さくすることができるの
で、ダスト等による平面度の低下は殆ど生じない。この
場合、単に突子2のみで試料6を支承する構造にする
と、真空吸着部3が外部と連通して試料6を吸着するの
に十分な真空度が得られず、またダストや加工液を吸い
込んでしまい、試料6や真空吸着器を汚染する。そこ
で、従来は真空吸着部3を真空封止するためにランド部
4を設けている。真空封止を十分に行うためにはランド
部4の幅を広くすることが必要となるが、幅が広くなれ
ばなるほど、ランド部4上にダスト等が付着する確率が
高くなり、試料6の外周部を高精度な平面に矯正できな
いという問題があった。In the vacuum suction device of the above-mentioned conventional vacuum suction device, the sample 6 is sucked onto the upper surface of the protrusion 2 and the land portion 4 of the vacuum suction portion 3 by evacuation. It is possible to correct the warp and deformation of the sample 6 to form a flat surface. Further, since the contact area between the vacuum suction device 1 and the sample 6 can be made extremely small by the protrusion 2, the flatness hardly decreases due to dust or the like. In this case, if the structure is such that the sample 6 is supported only by the protrusions 2, the vacuum suction portion 3 communicates with the outside and a sufficient degree of vacuum for adsorbing the sample 6 cannot be obtained, and dust and processing liquid are not absorbed. It is sucked and contaminates the sample 6 and the vacuum suction device. Therefore, conventionally, the land portion 4 is provided for vacuum-sealing the vacuum suction portion 3. It is necessary to widen the width of the land portion 4 in order to sufficiently perform vacuum sealing, but the wider the width, the higher the probability that dust or the like will adhere to the land portion 4, and the There is a problem that the outer peripheral portion cannot be corrected to a highly accurate flat surface.
【0005】本発明は上記した従来の問題点に鑑みてな
されたもので、その目的とするところは、突子のみによ
る支承であるにも拘らず試料を確実に吸着することがで
き、ダスト等の影響を受けず、試料を高い平面に矯正す
ることができるようにした真空吸着装置を提供すること
にある。The present invention has been made in view of the above-mentioned problems of the prior art. The object of the present invention is that the sample can be surely adsorbed in spite of the support by only the protrusion, and dust and the like. Another object of the present invention is to provide a vacuum suction device capable of correcting a sample into a high flat surface without being affected by the above.
【0006】[0006]
【課題を解決するための手段】上記目的を達成するた
め、本発明は、上面が同一平面にある多数の突子のみに
よって試料を支承し、内部に真空ポンプに接続される真
空排気孔を設けた真空吸着器を備えた真空吸着装置であ
って、前記真空吸着器の上面に真空排気孔に連通する真
空吸着部を形成するとともに、この真空吸着部を取り囲
む環状のシール部を設け、前記シール部の突子の高さを
きわめて低く設定することによりシール部と試料との間
に微小隙間が形成されるようにしたことを特徴とする。
また、本発明は、シール部を環状突部によって形成した
ことを特徴とする。また、本発明は、真空吸着部とシー
ル部の突子が設けられる面を同一平面に形成したことを
特徴とする。また、本発明は、真空吸着器に陽圧供給孔
を設け、真空吸着部とシール部との間に前記陽圧供給孔
に連通する環状溝を形成し、この環状溝にリングを設
け、かつこのリングの少なくとも上面に真空吸引時およ
び陽圧空気の供給時に試料の裏面に密着する環状のシー
ル部材を固着したことを特徴とする。また、本発明は、
シール部を突子より加工し易い材料で形成したことを特
徴とする。また、本発明は、突子をピン状に形成したこ
とを特徴とする。また、本発明は、シール部を複数個設
けたことを特徴とする。また、本発明は、真空吸着部に
真空排気孔に連通する環状の真空排気溝を複数個形成し
たことを特徴とする。また、本発明は、上面が同一平面
上にある多数の突子のみによって試料を支承し、内部に
真空ポンプに接続される真空排気孔を設けた真空吸着器
を備えた真空吸着装置であって、前記真空吸着器の上面
に真空排気孔に連通する真空吸着部を形成するととも
に、突子が設けられる面を、真空吸着器の周囲から中心
に向かって低くなるように連続的に傾斜させたことを特
徴とする。In order to achieve the above object, the present invention supports a sample only by a large number of protrusions whose upper surfaces are in the same plane, and is provided with a vacuum exhaust hole connected to a vacuum pump. A vacuum suction device having a vacuum suction device, wherein a vacuum suction portion communicating with a vacuum exhaust hole is formed on an upper surface of the vacuum suction device, and an annular seal portion surrounding the vacuum suction portion is provided. It is characterized in that a minute gap is formed between the seal portion and the sample by setting the height of the protrusion of the portion to be extremely low.
Further, the present invention is characterized in that the seal portion is formed by an annular protrusion. Further, the present invention is characterized in that the surfaces of the vacuum suction portion and the seal portion on which the protrusions are provided are formed in the same plane. Further, in the present invention, a positive pressure supply hole is provided in the vacuum suction device, an annular groove communicating with the positive pressure supply hole is formed between the vacuum suction part and the seal part, and a ring is provided in the annular groove, and An annular sealing member that adheres to the back surface of the sample at the time of vacuum suction and supply of positive pressure air is fixed to at least the upper surface of this ring. Also, the present invention
The seal portion is formed of a material that is easier to process than the protrusion. Further, the present invention is characterized in that the protrusion is formed in a pin shape. Further, the present invention is characterized in that a plurality of seal portions are provided. Further, the present invention is characterized in that a plurality of annular vacuum exhaust grooves communicating with the vacuum exhaust holes are formed in the vacuum suction portion. Further, the present invention is a vacuum suction device including a vacuum suction device which supports a sample only by a large number of protrusions whose upper surfaces are on the same plane, and which has a vacuum suction device provided therein with a vacuum exhaust hole connected to a vacuum pump. A vacuum suction portion communicating with the vacuum exhaust hole is formed on the upper surface of the vacuum suction device, and the surface on which the protrusion is provided is continuously inclined so as to decrease from the periphery of the vacuum suction device toward the center. It is characterized by
【0007】[0007]
【作用】本発明においては、試料を接触面がきわめて小
さい突子のみで支承するから、ダスト等による平面度に
及ぼす影響がほとんどない。シール部は試料との間に微
小隙間を形成しているので、この微小隙間が真空排気時
に大きな抵抗となる。したがって、真空吸着部に吸い込
まれる空気の量はきわめて僅かであるから、真空吸着部
の負圧はそれほど低下せず、試料を吸着する。また、環
状溝内に設けられたシール部材は、真空吸引時に試料に
密着し真空吸着部を真空封止する。また、陽圧空気の供
給時においてもシール部材は試料に押し付けられるの
で、真空吸着部を真空封止する。この時、シール部と試
料との間の微小隙間が陽圧状態となるから、外部からダ
ストや加工液が侵入することがない。また、この陽圧空
気は前記微小隙間を通って真空吸着器の外部に排出され
ることにより試料の裏面外周部に付着したダスト等を除
去する。突子より加工し易い材料からなるシール部は、
後加工により試料の大きさに応じて所定の大きさに加工
される。複数個のシール部と真空排気溝は、大きさの異
なる試料に対して選択使用される。また、真空排気溝は
真空排気孔に比べて広い面積を有し、真空吸着部内の真
空圧分布を均一化させる。突子が設けられている面は、
真空吸着部の周囲から中心に向かって連続的に低くなる
ように傾斜しているので、外周縁部において試料との間
の隙間が微小な隙間となりシール部が形成される。In the present invention, since the sample is supported only by the protrusion having a very small contact surface, there is almost no influence on the flatness due to dust or the like. Since the seal portion forms a minute gap with the sample, this minute gap becomes a large resistance during evacuation. Therefore, since the amount of air sucked into the vacuum suction unit is extremely small, the negative pressure of the vacuum suction unit does not decrease so much and the sample is suctioned. Further, the seal member provided in the annular groove is brought into close contact with the sample at the time of vacuum suction to vacuum seal the vacuum suction portion. Further, since the seal member is pressed against the sample even when the positive pressure air is supplied, the vacuum suction unit is vacuum-sealed. At this time, since the minute gap between the seal portion and the sample is in a positive pressure state, dust and working liquid do not enter from the outside. Further, the positive pressure air is discharged to the outside of the vacuum adsorber through the minute gap to remove dust and the like adhering to the outer periphery of the back surface of the sample. The seal part made of a material that is easier to process than the mast
By post-processing, it is processed into a predetermined size according to the size of the sample. The plurality of seal portions and the vacuum exhaust groove are selectively used for samples of different sizes. Further, the vacuum exhaust groove has a larger area than the vacuum exhaust hole, and makes the vacuum pressure distribution in the vacuum suction portion uniform. The surface with the stem is
Since the vacuum suction portion is inclined so as to be continuously lowered toward the center from the periphery, the gap between the vacuum suction portion and the sample becomes a minute gap to form the seal portion.
【0008】[0008]
【実施例】以下、本発明を図面に基づいて詳細に説明す
る。図1(a)、(b)は本発明に係る真空吸着装置を
構成する真空吸着器の一実施例を示す平面図および要部
の拡大断面図である。なお、図中従来技術の欄で説明し
たものと同一構成部材等については同一符号を付し、そ
の説明を省略する。同図において、真空吸着器1は円板
状に形成されており、その上面中央部に凹部によって形
成され多数の微小な突子2を有する円形の真空吸着部3
が設けられ、さらにその外側にはシール部10が設けら
れている。このシール部10は、真空吸着部3を取り囲
む環状の突部からなり、上面には多数の微小な突子11
が突設されている。また、真空吸着器1の内部には4つ
の真空排気孔5が形成されており、その一端が前記真空
吸着部3の内底面3aに開口し、他端が真空吸着器1の
下面に開口し、かつ図示しない真空ポンプに接続されて
いる。なお、図1(b)においては突子2,11の図示
を一部省略したが、この突子2,11は真空吸着部3お
よびシール部10の全面にわたって設けられるものであ
る。また、後述する図2(a)、図5、図6、図7
(a)、図9(a)、図10(a)、図11および図1
2においても突子2,11,16の一部を図示し、ほと
んどを省略している。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. 1 (a) and 1 (b) are a plan view and an enlarged cross-sectional view of a main part showing an embodiment of a vacuum suction device constituting a vacuum suction device according to the present invention. The same components as those described in the section of the prior art in the figure are designated by the same reference numerals, and the description thereof will be omitted. In the figure, a vacuum suction device 1 is formed in a disk shape, and a circular vacuum suction portion 3 having a large number of minute protrusions 2 formed by a recess in the center of the upper surface thereof.
Is provided, and the seal portion 10 is provided on the outer side thereof. The seal portion 10 is composed of an annular protrusion that surrounds the vacuum suction portion 3, and has a large number of minute protrusions 11 on its upper surface.
Is protruding. Further, four vacuum exhaust holes 5 are formed inside the vacuum suction device 1, one end of which is opened to the inner bottom surface 3 a of the vacuum suction part 3 and the other end is opened to the lower surface of the vacuum suction device 1. , And is connected to a vacuum pump (not shown). Although illustration of the protrusions 2 and 11 is partially omitted in FIG. 1B, the protrusions 2 and 11 are provided over the entire surface of the vacuum suction portion 3 and the seal portion 10. In addition, FIG. 2A, FIG. 5, FIG. 6, and FIG.
(A), FIG. 9 (a), FIG. 10 (a), FIG. 11 and FIG.
2 also shows a part of the protrusions 2, 11 and 16 and omits most of them.
【0009】前記真空吸着部3の深さD、言い換えれば
突子2の高さは100μmから1mm程度である。突子
2は細いピン状に形成され、その上面が高精度な平面を
形成している。シール部10の高さ(真空吸着部3の内
底面3aからの高さ)は、真空吸着部3の深さDより僅
かに(100分の1から10分の1程度)低く設定され
ている。シール部10の突子11は、前記ピン2と同一
の太さのピン状に形成されてはいるが突子2に比べてき
わめて短く、上面が突子2の上面と同一平面をなすよう
に形成している。突子11の高さdは数μm〜50μm
程度であり、このため試料6を吸着したときシール部1
0と試料6との間にはきわめて微小な隙間12が形成さ
れる。これらの突子2,11は、円形、正方形等の適宜
な断面形状でよいが、試料6との接触面積を減らすため
にできるだけ細く形成されるとともに、真空吸着時に試
料6の厚さに応じて試料6に撓みを生じさせない程度の
間隔をおいて設けられる。The depth D of the vacuum suction portion 3, that is, the height of the protrusion 2 is about 100 μm to 1 mm. The protrusion 2 is formed in a thin pin shape, and the upper surface thereof forms a highly accurate flat surface. The height of the seal portion 10 (the height from the inner bottom surface 3a of the vacuum suction portion 3) is set slightly lower (about 1/100 to 1/10) than the depth D of the vacuum suction portion 3. . The protrusion 11 of the seal portion 10 is formed in the shape of a pin having the same thickness as that of the pin 2, but is much shorter than the protrusion 2, so that the upper surface is flush with the upper surface of the protrusion 2. Is forming. The height d of the protrusion 11 is several μm to 50 μm
Therefore, when the sample 6 is adsorbed, the seal portion 1
A very small gap 12 is formed between 0 and the sample 6. These protrusions 2 and 11 may have an appropriate cross-sectional shape such as a circle or a square, but they are formed as thin as possible in order to reduce the contact area with the sample 6, and depending on the thickness of the sample 6 during vacuum adsorption. The sample 6 is provided with an interval such that it does not bend.
【0010】このような構造において、試料6を真空吸
着器1の上に載置し、図示しない真空ポンプによって真
空排気孔5および真空吸着部3内の空気14を排気する
と、この空気14は矢印で示す方向に流れ、真空吸着部
3が負圧になる。したがって、試料6は大気圧によって
突子2,11の上面に押しつけられて反りや曲がりが矯
正される。この時、シール部10と試料6とは直接接触
していないので、外部の空気を真空吸着部3内に吸い込
む。しかし、シール部10は、その上面が突子11の上
面より僅かに低く設定されていることにより、試料6の
裏面との間の隙間12はきわめて微小に形成されている
ので、この微小隙間12が外部から真空吸着部3に流れ
込もうとする空気に対して大きな抵抗となる。このた
め、真空吸着部3に流れ込む空気の量はきわめて僅かで
あり、真空吸着部3の吸着作用に影響を及ぼすことはな
く試料6を吸着することができる。In this structure, when the sample 6 is placed on the vacuum suction device 1 and the air 14 in the vacuum exhaust hole 5 and the vacuum suction portion 3 is exhausted by a vacuum pump (not shown), this air 14 is indicated by an arrow. Flow in the direction indicated by, and the vacuum suction section 3 has a negative pressure. Therefore, the sample 6 is pressed against the upper surfaces of the protrusions 2 and 11 by the atmospheric pressure to correct the warp and the bend. At this time, since the seal portion 10 and the sample 6 are not in direct contact with each other, the outside air is sucked into the vacuum suction portion 3. However, since the upper surface of the seal portion 10 is set to be slightly lower than the upper surface of the protrusion 11, the gap 12 between the seal portion 10 and the back surface of the sample 6 is formed extremely small, and therefore the minute gap 12 is formed. Has a large resistance to the air that is about to flow into the vacuum suction unit 3 from the outside. Therefore, the amount of air flowing into the vacuum suction unit 3 is extremely small, and the sample 6 can be suctioned without affecting the suction action of the vacuum suction unit 3.
【0011】一例として、500μmより厚い試料6を
吸着する場合、各突子2,11の間隔を1mm、突子
2,11の大きさを1辺が0.25mmの角形とする
と、試料6の撓みは殆ど観察されず、かつ試料6の裏面
と突子2,11の上面との接触率は4%ときわめて小さ
い。したがって、試料6の被吸着面全面にわたってダス
トによる影響は小さく高い平面度が得られる。また、突
子2,11をピン状に形成しているので、ダスト等の付
着を少なくすることができる。As an example, in the case of adsorbing a sample 6 thicker than 500 μm, assuming that the interval between the protrusions 2 and 11 is 1 mm and the size of the protrusions 2 and 11 is a square with one side of 0.25 mm, Almost no bending was observed, and the contact rate between the back surface of the sample 6 and the top surfaces of the protrusions 2 and 11 was 4%, which was extremely small. Therefore, the influence of dust is small over the entire surface of the sample 6 to be attracted, and high flatness can be obtained. Moreover, since the protrusions 2 and 11 are formed in a pin shape, it is possible to reduce the adhesion of dust and the like.
【0012】図2(a)、(b)は他の発明の実施例を
示す真空吸着器の平面図および要部の拡大断面図であ
る。同図において、真空吸着器1の上面中央にはアーム
用孔15aが裏面側に貫通して形成されており、また上
面にはアーム用孔15aを取り囲む環状の突部によって
形成されたアーム収納部15が設けられる。そして、そ
の外側にこのアーム収納部15を取り囲むように環状の
凹部からなる真空吸着部3が設けられ、さらにその外側
には環状の突部によって形成され前記真空吸着部3を取
り囲むシール部10が設けられている。また、真空吸着
部3、シール部10およびアーム収納部15には試料6
を支承する多数の微小な突子2,11,16がそれぞれ
設けられており、その上面が同一平面をなすように形成
している。シール部10とアーム収納部15の上面は同
一平面をなすように形成してはいるが、前記突子2,1
1,16の上面より僅かに低く設定されている。シール
部10の一部周面には、ウエハに形成されているオリフ
ラと同様な平坦面部17が形成されている。アーム収納
部15の内空部15aには図示しないウエハオートロー
ダ用のリフトアームが組み込まれる。2 (a) and 2 (b) are a plan view and an enlarged cross-sectional view of a main part of a vacuum suction device showing another embodiment of the invention. In the figure, an arm hole 15a is formed at the center of the upper surface of the vacuum suction device 1 so as to penetrate to the back surface side, and an arm housing portion formed by an annular projection surrounding the arm hole 15a on the upper surface. 15 are provided. A vacuum suction portion 3 composed of an annular concave portion is provided on the outer side of the arm storage portion 15 so as to surround the arm storage portion 15, and a seal portion 10 formed by an annular projection portion and surrounding the vacuum suction portion 3 is provided on the outer side thereof. It is provided. The sample 6 is placed in the vacuum suction unit 3, the seal unit 10 and the arm storage unit 15.
A large number of minute protrusions 2, 11 and 16 for supporting the above are provided respectively, and their upper surfaces are formed so as to be flush with each other. Although the upper surfaces of the seal portion 10 and the arm storage portion 15 are formed so as to be flush with each other, the protrusions 2, 1
It is set to be slightly lower than the upper surfaces of 1 and 16. A flat surface portion 17 similar to the orientation flat formed on the wafer is formed on a part of the peripheral surface of the seal portion 10. A lift arm for a wafer autoloader (not shown) is incorporated in the inner space 15a of the arm storage section 15.
【0013】シール部10とアーム収納部15は、真空
吸着器1および突子2,11,16とは異なった材料に
よって形成されており、その上面から突子11,16の
上端部をきわめて僅かに突出させることにより、試料6
との間に微小隙間12,18がそれぞれ形成される。The seal portion 10 and the arm accommodating portion 15 are made of a material different from that of the vacuum suction device 1 and the protrusions 2, 11 and 16, and the upper end portions of the protrusions 11 and 16 are extremely small from the upper surface thereof. Sample 6
And minute gaps 12 and 18 are formed between and.
【0014】真空吸着器1および突子2,11,16の
材料としては、セラミックス、金属等が用いられ、シー
ル部10およびアーム収納部15の材料としては、真空
吸着器1および突子2,11,16の材料より加工し易
い高分子材料やウェットエッチングにより簡単に選択除
去できる材料(例:ガラス)が用いられる。Ceramics, metals, etc. are used as materials for the vacuum suction device 1 and the protrusions 2, 11 and 16, and as materials for the seal portion 10 and the arm housing portion 15, the vacuum suction device 1 and the protrusions 2, 2. A polymer material which is easier to process than the materials 11 and 16 and a material (eg, glass) which can be easily selectively removed by wet etching are used.
【0015】真空吸着器1の製作に際しては、真空吸着
器1と突子2,11,16を一体に製作し、次にガラス
もしくは高分子材料で真空吸着器1の上面中央部と外周
部を覆い、試料の大きさに応じて所定の大きさに形成し
てシール部10とアーム収納部15とし、突子2,1
1,16をこれらの上方に僅かに突出させればよい。In manufacturing the vacuum suction device 1, the vacuum suction device 1 and the protrusions 2, 11 and 16 are integrally manufactured, and then the central portion and the outer peripheral portion of the upper surface of the vacuum suction device 1 are made of glass or a polymer material. The cover 2 is formed into a predetermined size according to the size of the sample to form the seal part 10 and the arm storage part 15, and the protrusions 2, 1
It suffices to slightly project 1 and 16 above them.
【0016】このような構造においては、シール部10
とアーム収納部15を突子2,11,16の後から製作
することができるので、加工すべき試料の大きさに応じ
た大きさの真空吸着器1を製作することができる。ま
た、シール部10の周面に平坦面部17を設けているの
で、ウエハからなる試料6を載置する際、その向きを真
空吸着器1の向きに合わせて載置することができる。さ
らに、アーム収納孔15aに組み込まれる図示しないウ
エハオートローダ用のリフトアームは、加工後の試料6
の取り外しを容易にする。なお、本発明はアーム収納部
15を設けた例を示したが、必ずしも必要ではない。In such a structure, the seal portion 10
Since the arm storage portion 15 can be manufactured after the protrusions 2, 11 and 16, the vacuum suction device 1 having a size corresponding to the size of the sample to be processed can be manufactured. Further, since the flat surface portion 17 is provided on the peripheral surface of the seal portion 10, when the sample 6 made of a wafer is placed, the orientation can be aligned with the orientation of the vacuum suction device 1. Further, a lift arm for a wafer autoloader (not shown) incorporated in the arm storage hole 15a is used for the processed sample 6
Make it easy to remove. Although the present invention shows an example in which the arm storage portion 15 is provided, it is not always necessary.
【0017】図3(a)、(b)は図1に示した発明の
他の実施例としてウエハ搬送用ロードアームに適用した
例を示す平面図および断面図である。ここでは、ウエハ
搬送用ロードアーム21の先端部にウエハ吸着部20が
一体に設けられている。ウエハ吸着部20は、外形が方
形に形成されている。このため、真空吸着部3とシール
部10はともに方形に形成されている。その他の構造は
図1に示した発明と全く同様である。3 (a) and 3 (b) are a plan view and a sectional view showing an example applied to a wafer transfer load arm as another embodiment of the invention shown in FIG. Here, the wafer suction unit 20 is integrally provided at the tip of the wafer transfer load arm 21. The wafer suction unit 20 has a rectangular outer shape. Therefore, both the vacuum suction part 3 and the seal part 10 are formed in a rectangular shape. The other structure is exactly the same as that of the invention shown in FIG.
【0018】このようなウエハ搬送用ロードアーム21
にあっては方形の試料を吸着して搬送することができ、
搬送時の試料裏面へのダスト等の付着を最小限に抑える
ことができる。Such a wafer transfer load arm 21
In that case, a square sample can be adsorbed and transported,
It is possible to minimize the adhesion of dust or the like to the back surface of the sample during transportation.
【0019】図4は他の発明の実施例を示す真空吸着器
の要部の拡大断面図で、(a)は試料を真空吸着する前
の状態、(b)は試料を真空吸着した状態を示す図であ
る。この発明における真空吸着器1は、図1および図2
に示す発明と同様に、その上面中央部を円形の凹部によ
って形成される真空吸着部3とし、その外側に真空吸着
部3を取り囲む環状溝30と、環状溝30を取り囲む環
状の突部によって形成されるシール部10を同心円状に
設けている。また、真空吸着部3およびシール部10に
多数の微小な突子2,11をそれぞれ突設し、かつ真空
吸着器1の内部に真空排気孔5と陽圧供給孔33を設け
ている。突子2,11の上面は同一平面をなすように形
成している。シール部10は、突子2,11の上面より
僅かに低く設定されており、試料6の裏面との間に微小
隙間12が形成される。またシール部10は、図2に示
した発明と同様に、突子2,11より加工し易い材料に
よって製作される。真空排気孔5の一端は前記真空吸着
部3の内底面3aに開口し、他端が真空吸着器1の下面
に開口し、かつ図示しないポンプに接続されている。陽
圧供給孔33の一端は前記環状溝30の外周壁30bに
開口し、他端が真空吸着器1の下面に開口して図示しな
いコンプレッサ等の陽圧供給手段に接続されている。さ
らに、前記環状溝30には2枚のシール部材32を備え
たリング31が設けられている。FIG. 4 is an enlarged cross-sectional view of a main part of a vacuum suction device showing another embodiment of the invention. FIG. 4 (a) shows a state before a sample is vacuum-sucked, and FIG. FIG. The vacuum suction device 1 according to the present invention is shown in FIGS.
Similarly to the invention shown in FIG. 2, the central portion of the upper surface is a vacuum suction portion 3 formed by a circular recessed portion, and the outer periphery thereof is formed by an annular groove 30 surrounding the vacuum suction portion 3 and an annular protrusion surrounding the annular groove 30. The seal portion 10 is provided concentrically. Further, a large number of minute protrusions 2 and 11 are provided on the vacuum suction portion 3 and the seal portion 10, respectively, and a vacuum exhaust hole 5 and a positive pressure supply hole 33 are provided inside the vacuum suction device 1. The upper surfaces of the protrusions 2 and 11 are formed so as to be flush with each other. The seal portion 10 is set slightly lower than the upper surfaces of the protrusions 2 and 11, and a minute gap 12 is formed between the seal portion 10 and the back surface of the sample 6. The seal portion 10 is made of a material that is easier to process than the protrusions 2 and 11, as in the invention shown in FIG. One end of the vacuum exhaust hole 5 is opened to the inner bottom surface 3a of the vacuum suction portion 3, the other end is opened to the lower surface of the vacuum suction device 1, and is connected to a pump (not shown). One end of the positive pressure supply hole 33 opens to the outer peripheral wall 30b of the annular groove 30, and the other end opens to the lower surface of the vacuum adsorber 1 and is connected to a positive pressure supply means such as a compressor (not shown). Further, the annular groove 30 is provided with a ring 31 having two sealing members 32.
【0020】前記リング31は環状溝30の内周壁30
aに固着されており、環状溝30の外側壁30bとの間
には陽圧空気用の隙間が形成されている。また、リング
31の上下面の径方向外側半分は、全周にわたって内側
半分よりも一段低く形成されることにより環状の段差部
34,35をそれぞれ形成している。シール部材32
は、ポリイミドなどの高分子膜によって形成されたきわ
めて薄い(10μm〜30μm程度)リング状のシート
からなり、その径方向内側半分が全周にわたってリング
31の上下面にそれぞれ固着されている。一方、シール
部材32の外側半分はリング31に固着されておらず、
前記段差部34,35の上方および下方にそれぞれ延在
している。上側のシール部材32は、真空排気時および
陽圧空気41の供給時に試料6の裏面に密着することに
より、真空吸着部3を真空封止する。下側のシール部材
32は、陽圧空気41の供給時に環状溝30の内底面に
押し付けられることにより、環状溝30の内周壁30a
とリング31との隙間をシールする。段差部34,35
はシール部材32との間に隙間を形成することにより陽
圧空気41が作用し易くする。また、上側の段差部34
は不使用時に上側シート部材32が垂れ下がるのを防止
し、下側の段差部35は真空排気時に下側シート部材3
2が上方へ大きく変形するを防止するためのものであ
る。The ring 31 is an inner peripheral wall 30 of the annular groove 30.
It is fixed to a and a gap for positive pressure air is formed between it and the outer wall 30b of the annular groove 30. The outer half of the upper and lower surfaces of the ring 31 in the radial direction is formed one step lower than the inner half over the entire circumference to form annular step portions 34 and 35, respectively. Seal member 32
Is an extremely thin (about 10 μm to 30 μm) ring-shaped sheet formed of a polymer film such as polyimide, and its inner half in the radial direction is fixed to the upper and lower surfaces of the ring 31 over the entire circumference. On the other hand, the outer half of the seal member 32 is not fixed to the ring 31,
It extends above and below the step portions 34 and 35, respectively. The upper sealing member 32 adheres to the back surface of the sample 6 during vacuum exhaust and supply of the positive pressure air 41, thereby vacuum-sealing the vacuum suction unit 3. The lower seal member 32 is pressed against the inner bottom surface of the annular groove 30 when the positive pressure air 41 is supplied, so that the inner peripheral wall 30 a of the annular groove 30 is pressed.
And the gap between the ring 31 and the ring 31 is sealed. Steps 34, 35
Forms a gap between the positive pressure air 41 and the seal member 32 to facilitate the action. Also, the upper step portion 34
Prevents the upper sheet member 32 from hanging down when not in use, and the lower step portion 35 prevents the lower sheet member 3 from being evacuated.
This is to prevent the 2 from being largely deformed upward.
【0021】このような構造において、ウエハなどの試
料6を真空吸着器1上に載置し、真空ポンプにより真空
排気孔5を真空排気すると、真空排気孔5および真空吸
着部3内の空気14が矢印方向に流れて真空吸着部3を
負圧にする。このため、試料6は突子2,11上に吸着
される。したがって、試料6は突子2,11の上面に倣
い、反りや曲がりが矯正される。この時、上側のシール
部材32は(b)図に示すように上方に吸い上げられて
試料6の裏面に密着し、真空吸着部3を真空封止する。In such a structure, when a sample 6 such as a wafer is placed on the vacuum suction device 1 and the vacuum exhaust hole 5 is evacuated by a vacuum pump, the air 14 in the vacuum exhaust hole 5 and the vacuum adsorption portion 3 is evacuated. Flow in the direction of the arrow to make the vacuum suction section 3 a negative pressure. Therefore, the sample 6 is adsorbed on the protrusions 2 and 11. Therefore, the sample 6 follows the upper surfaces of the protrusions 2 and 11 and the warpage and bending are corrected. At this time, the upper seal member 32 is sucked up and adheres to the back surface of the sample 6, as shown in FIG.
【0022】次に、陽圧供給孔33から陽圧空気41を
環状溝30に供給すると、シール部10と試料6との間
の微小隙間12が陽圧空気41に対して大きな抵抗とな
るため、環状溝30が陽圧状態となり、上側のシール部
材32を試料6の裏面に押し付け、下側のシール部材3
2を環状溝30の内底面に押し付ける。したがって、陽
圧空気41が真空吸着部3に流れ込むことはない。この
状態で加工液を流し、試料6の加工を行えば、真空吸着
器1内に加工液やダストが侵入するのを阻止することが
でき、試料6の裏面と真空吸着器1の真空吸着面、すな
わち突子2,11の上面の汚染を防止することができ
る。また、陽圧空気41は微小隙間12を通って外部に
排出されるため、試料6の裏面外周部に付着しているダ
スト等を除去する。ちなみに、微小隙間12を50〜1
00μm、陽圧空気41の圧力を100g/cm2 とし
て真空吸着器1を水中に浸漬しても、真空吸着器1への
水の侵入を完全に抑えることができた。また、微小隙間
12を10μm以下にすれば、さらに圧力の高い水中で
も使用することができる。Next, when the positive pressure air 41 is supplied to the annular groove 30 from the positive pressure supply hole 33, the minute gap 12 between the seal portion 10 and the sample 6 has a large resistance to the positive pressure air 41. , The annular groove 30 is in a positive pressure state, the upper seal member 32 is pressed against the back surface of the sample 6, and the lower seal member 3
2 is pressed against the inner bottom surface of the annular groove 30. Therefore, the positive pressure air 41 does not flow into the vacuum suction section 3. If the processing liquid is flowed in this state to process the sample 6, it is possible to prevent the processing liquid and dust from entering the vacuum suction device 1, and the back surface of the sample 6 and the vacuum suction surface of the vacuum suction device 1 can be prevented. That is, it is possible to prevent the upper surfaces of the protrusions 2 and 11 from being contaminated. Further, since the positive pressure air 41 is discharged to the outside through the minute gap 12, the dust and the like adhering to the outer periphery of the back surface of the sample 6 is removed. By the way, the minute gap 12 is 50 to 1
Even if the vacuum adsorber 1 was immersed in water at a pressure of 00 μm and the positive pressure air 41 was 100 g / cm 2 , the invasion of water into the vacuum adsorber 1 could be completely suppressed. Further, if the minute gap 12 is set to 10 μm or less, it can be used even in water with higher pressure.
【0023】なお、本実施例においてはリング31の上
下面にシール部材32をそれぞれ固着した例を示した
が、上面にのみ固着した場合でも真空吸着部3を真空封
止することができる。In this embodiment, the sealing members 32 are fixed to the upper and lower surfaces of the ring 31, respectively, but the vacuum suction unit 3 can be vacuum-sealed even if the sealing members 32 are fixed only to the upper surface.
【0024】図5は他の発明の実施例を示す真空吸着器
の平面図である。真空吸着器1の上面には円形の凹部に
よって形成される真空吸着部3と、環状の突部によって
形成される第1、第2シール部10−1 ,10−2 が同
心円状に設けられている。内側の第1シール部10−1
は、真空吸着部3の外周寄りに設けられ、外側の第2シ
ール部10−2 は真空吸着部3の外周を取り囲むように
設けられている。このため、真空吸着部3は、第1シー
ル部10−1 より内側部分3Aと外側部分3Bに2分割
されている。真空吸着部3および第1、第2シール部1
0−1 ,10−2 には上面が同一平面をなすように形成
し試料を支承する突子2,11,16がそれぞれ突設さ
れている。真空吸着部3に連通する真空排気孔5は、第
1シール部10−1 の内側中央に1つ、外側に4つそれ
ぞれ形成されている。他の構造については、図1〜図4
に示すものと同じである。なお、5つの真空排気孔5の
中、第1シール部10−1 と第2シール部10−1 ,1
0−2 の間に形成されている外側4つの真空排気孔5
は、電磁弁等の弁を介して真空ポンプに接続されてい
る。FIG. 5 is a plan view of a vacuum suction device showing another embodiment of the invention. On the upper surface of the vacuum suction device 1, a vacuum suction portion 3 formed by a circular concave portion and first and second sealing portions 10-1, 10-2 formed by annular protrusions are concentrically provided. There is. Inner first seal portion 10-1
Is provided near the outer circumference of the vacuum suction section 3, and the outer second seal section 10-2 is provided so as to surround the outer circumference of the vacuum suction section 3. Therefore, the vacuum suction part 3 is divided into two parts, an inner part 3A and an outer part 3B, from the first seal part 10-1. Vacuum suction part 3 and first and second sealing parts 1
Protrusions 2, 11 and 16 are formed on the 0-1 and 10-2, respectively, so that their upper surfaces are flush with each other and support the sample. The vacuum evacuation holes 5 communicating with the vacuum suction portion 3 are formed in the center of the inside of the first seal portion 10-1 and in the outside thereof, respectively. Other structures are shown in FIGS.
Is the same as that shown in FIG. In the five vacuum exhaust holes 5, the first seal portion 10-1 and the second seal portions 10-1, 1
Four outer vacuum exhaust holes 5 formed between 0-2
Is connected to a vacuum pump via a valve such as a solenoid valve.
【0025】このような構造においては、大きさが異な
る試料に対して共通に使用することができる。すなわ
ち、第1シール部10−1 と略同じ大きさの小さな試料
を真空吸着する場合は、第1シール部10−1 と試料と
の間に形成される微小隙間が大きな抵抗となり空気の吸
い込み量を少なくするため、小さな試料を真空吸着する
ことができる。この時、5つの真空排気孔5の中、第1
シール部10−1 より外側の真空排気孔5は、弁の切換
操作によって閉塞され、加工液を吸い込まないようにす
る。一方、第2シール部10−2 と略同じ大きさの大き
な試料を真空吸着する場合は、第2シール部10−2 と
試料との間に形成される微小隙間が大きな抵抗となり空
気の吸い込み量を少なくするため、大きな試料を真空吸
着することができる。この時は全ての真空排気孔5によ
って真空吸着部3全体を真空排気する。なお、本発明に
おいては、真空吸着器1の外形を円形に形成したが、図
6に示すように矩形に形成したものであってもよい。Such a structure can be commonly used for samples of different sizes. That is, when a small sample having substantially the same size as that of the first seal portion 10-1 is vacuum-adsorbed, the minute gap formed between the first seal portion 10-1 and the sample becomes a large resistance and the amount of air sucked in. In order to reduce the amount, a small sample can be vacuum-adsorbed. At this time, the first of the five vacuum exhaust holes 5
The vacuum exhaust hole 5 outside the seal portion 10-1 is closed by the switching operation of the valve so that the machining liquid is not sucked. On the other hand, when a large sample having substantially the same size as the second seal portion 10-2 is vacuum-adsorbed, the minute gap formed between the second seal portion 10-2 and the sample becomes a large resistance and the amount of air sucked in. Therefore, a large sample can be suctioned by vacuum. At this time, the entire vacuum suction unit 3 is evacuated by all the vacuum exhaust holes 5. In the present invention, the outer shape of the vacuum suction device 1 is formed into a circular shape, but it may be formed into a rectangular shape as shown in FIG.
【0026】図7(a)、(b)は他の発明の実施例を
示す真空吸着器の平面図および断面図である。真空吸着
器1の突子2,11が突設される上面は同一平面をなす
ように形成されている。突子2,11は、高さが例えば
数μmから100μmで、上面が同一平面をなすように
形成している。このため、真空吸着器1の上面と試料6
との間には全面にわたって微小な隙間45が形成され
る。真空排気孔5は、真空吸着器1の上面外周寄りに周
方向に等間隔をおいて8個形成している。FIGS. 7A and 7B are a plan view and a sectional view of a vacuum suction device showing another embodiment of the invention. The upper surfaces of the vacuum suction device 1 on which the protrusions 2 and 11 are provided are formed so as to be flush with each other. The protrusions 2 and 11 have a height of, for example, several μm to 100 μm and are formed such that their upper surfaces are flush with each other. Therefore, the upper surface of the vacuum suction device 1 and the sample 6
A minute gap 45 is formed over the entire surface between and. Eight vacuum exhaust holes 5 are formed near the outer periphery of the upper surface of the vacuum suction device 1 at equal intervals in the circumferential direction.
【0027】このような構造において、試料6を真空吸
着器1上に載置し、真空排気孔5を真空排気すると、真
空排気孔5よりも内側部分が真空排気され、真空吸着部
3として機能する。一方、真空排気孔5よりも外側部分
は、真空吸着器1の外側と隙間45を介して連通してい
るが、この隙間45は微小であり大きな抵抗となるた
め、図1〜図6に示すシール部と同様に、外部に対して
シール部10として機能する。したがって、真空排気時
に真空吸着器1が吸い込む空気47の量はきわめて僅か
であり、試料6の真空吸着には影響を及ぼさない。ま
た、真空吸着部3とシール部10が同一平面を形成して
いるので、凹部からなる真空吸着部と環状の突部からな
るシール部を形成する場合に比べて真空吸着器1の製作
が容易である。In such a structure, when the sample 6 is placed on the vacuum suction device 1 and the vacuum exhaust hole 5 is vacuum-exhausted, the portion inside the vacuum exhaust hole 5 is vacuum-exhausted and functions as the vacuum suction portion 3. To do. On the other hand, the portion outside the vacuum exhaust hole 5 communicates with the outside of the vacuum adsorber 1 through a gap 45. Since this gap 45 is minute and has a large resistance, it is shown in FIGS. Like the seal portion, it functions as a seal portion 10 with respect to the outside. Therefore, the amount of the air 47 sucked by the vacuum suction device 1 during the vacuum evacuation is extremely small and does not affect the vacuum suction of the sample 6. Further, since the vacuum suction portion 3 and the seal portion 10 form the same plane, the vacuum suction device 1 can be easily manufactured as compared with the case where the vacuum suction portion formed of a concave portion and the seal portion formed of an annular protrusion are formed. Is.
【0028】図8は他の発明の実施例を示す真空吸着器
の要部の拡大断面図である。この発明においては、真空
吸着部3とシール部10の突子2,11が設けられる面
を、真空吸着器1の周囲から中心に向かって低くなるよ
うに連続的に傾斜させ、突子の2,11の高さをシール
部10から真空吸着部3の周囲から中心に向かって連続
的に高くなるように変化させている。すなわち、突子
2,11の上面が水平な同一平面になるように形成して
いる。突子2,11の高さとしては、シール部10を形
成する周縁部付近で数μm〜数10μm程度、真空吸着
部3を形成する中央部分で数10μm〜数100μm程
度である。その他の構造は図7に示した発明と同様であ
る。FIG. 8 is an enlarged sectional view of a main part of a vacuum suction device showing another embodiment of the invention. In the present invention, the surfaces of the vacuum suction portion 3 and the seal portions 10 on which the protrusions 2 and 11 are provided are continuously inclined so as to decrease from the periphery of the vacuum suction device 1 toward the center. , 11 are changed so that the height from the seal portion 10 continuously increases from the periphery of the vacuum suction portion 3 toward the center. That is, the upper surfaces of the protrusions 2 and 11 are formed so as to be flush with each other. The height of the protrusions 2 and 11 is about several μm to several tens of μm in the vicinity of the peripheral portion forming the seal portion 10, and about several tens of μm to several hundred μm in the central portion forming the vacuum suction portion 3. Other structures are the same as those of the invention shown in FIG.
【0029】このような構造にあっては、シール部10
を形成する周縁部付近においては試料6との間に微小隙
間12が形成される。したがって、ダストや加工液が侵
入することがない。一方、真空吸着部3を形成する中央
部分においては試料6との間に大きな隙間が形成される
ので、空気の通り道となり、真空吸着部3の真空排気を
容易にすることができる。In such a structure, the seal portion 10
A minute gap 12 is formed between the sample 6 and the peripheral portion near the edge. Therefore, dust and processing liquid do not enter. On the other hand, since a large gap is formed between the sample 6 and the central portion forming the vacuum suction portion 3, it serves as a passage for air, and the vacuum suction portion 3 can be easily evacuated.
【0030】図9(a)、(b)は他の発明の実施例を
示す真空吸着器の平面図および要部の拡大断面図であ
る。真空吸着器1は、その上面中央部を円形の真空吸着
部3とし、この真空吸着部3の外周寄りに真空排気孔5
に連通する真空排気溝50を形成し、さらにその外側に
環状のシール部10を形成している。真空吸着部3とシ
ール部10は、図7に示した発明と同様に同一平面をな
すように形成している。真空吸着部3とシール部11の
突子2,11は、高さが例えば数μmから100μm
で、上面が同一平面をなすように形成している。このた
め、真空吸着器1の上面と試料6との間にはきわめて微
小な隙間45がそれぞれ形成される。真空排気溝50
は、真空の立ち上がりを向上させるために真空排気孔5
を多数形成する代わりに設けられている。9 (a) and 9 (b) are a plan view and an enlarged cross-sectional view of a main part of a vacuum suction device showing another embodiment of the invention. The vacuum suction device 1 has a circular vacuum suction portion 3 at the center of its upper surface, and a vacuum exhaust hole 5 is provided near the outer circumference of the vacuum suction portion 3.
Is formed with a vacuum exhaust groove 50, and an annular seal portion 10 is formed outside the vacuum exhaust groove 50. The vacuum suction part 3 and the seal part 10 are formed so as to form the same plane as in the invention shown in FIG. 7. The height of the protrusions 2 and 11 of the vacuum suction part 3 and the seal part 11 is, for example, several μm to 100 μm.
Thus, the upper surfaces are formed so as to be flush with each other. Therefore, extremely minute gaps 45 are formed between the upper surface of the vacuum suction device 1 and the sample 6. Vacuum exhaust groove 50
Is a vacuum exhaust hole 5 to improve the vacuum rise.
It is provided instead of forming a large number.
【0031】このような構造にあっては図7に示した発
明に比べて真空の立ち上がりがよく、より均一な真空圧
分布が得られ、試料6を真空吸着することができる。す
なわち、単に真空吸着部3と試料6との間に微小な隙間
45を形成しただけでは、空気の粘性抵抗によって空気
の流れが悪くなり、吸着面の真空圧分布が不均一にな
る。これに対して真空排気溝50を設けると、その面積
が大きく、また真空吸着部3の外周付近全体をむらなく
真空排気されるため、微小な隙間45にも拘らず真空の
立ち上がりがよく、均一な真空圧分布を得ることができ
る。また、このような構造にすると、吸引効果が大きい
ため上方に大きく反った試料6であっても安定して真空
吸着することができる。In such a structure, the rise of vacuum is better than in the invention shown in FIG. 7, a more uniform vacuum pressure distribution is obtained, and the sample 6 can be vacuum-adsorbed. That is, if the minute gap 45 is simply formed between the vacuum suction part 3 and the sample 6, the air flow will be deteriorated due to the viscous resistance of the air, and the vacuum pressure distribution on the suction surface will be non-uniform. On the other hand, when the vacuum exhaust groove 50 is provided, the area is large, and the entire area around the outer periphery of the vacuum suction portion 3 is uniformly vacuum-exhausted, so that the vacuum rises well and is uniform despite the minute gap 45. It is possible to obtain a wide vacuum pressure distribution. Further, with such a structure, since the suction effect is large, even the sample 6 which is largely warped upward can be stably vacuum-adsorbed.
【0032】図10(a)、(b)は図9に示した発明
の他の実施例としてウエハ搬送用ロードアームに適用し
た例を示す平面図および断面図である。ウエハ搬送用ロ
ードアーム21の先端部に方形のウエハ吸着部20が一
体に設けられている。真空吸着部3の外側には真空排気
溝50が形成され、さらにその外側をシール部10が取
り囲んでいる。真空吸着部3、シール部10および真空
排気溝50はウエハ吸着部20の外形と相似形の方形に
形成されている。その他の構造は、図9に示した発明と
全く同様である。FIGS. 10A and 10B are a plan view and a sectional view showing an example applied to a wafer transfer load arm as another embodiment of the invention shown in FIG. A square wafer suction unit 20 is integrally provided at the tip of the wafer transfer load arm 21. A vacuum exhaust groove 50 is formed outside the vacuum suction portion 3, and the seal portion 10 surrounds the outside. The vacuum suction portion 3, the seal portion 10, and the vacuum exhaust groove 50 are formed in a rectangular shape similar to the outer shape of the wafer suction portion 20. The other structure is exactly the same as that of the invention shown in FIG.
【0033】このようなウエハ搬送用ロードアーム21
にあっては図3に示した実施例と同様に方形の試料を安
定して真空吸着することができる。Such a wafer transfer load arm 21
In this case, a rectangular sample can be stably vacuum-adsorbed as in the embodiment shown in FIG.
【0034】図11は他の発明の実施例を示す真空吸着
器の平面図である。真空吸着器1の真空吸着部3には環
状溝からなる2つの真空排気溝50,51が同心円状に
形成されている。これらの真空排気溝50,51は真空
排気孔5にそれぞれ接続されている。その他の構造は図
9に示した発明と同様である。すなわち、真空吸着部3
と、これを取り囲むシール部10は、同一平面をなすよ
うに形成されている。また、真空吸着部3とシール部1
0に設けられる突子2,11の高さは、例えば数μmか
ら100μmで、上面が同一平面をなすように形成され
ており、試料6と真空吸着部3およびシール部10との
間にきわめて微小な隙間を形成される。FIG. 11 is a plan view of a vacuum suction device showing another embodiment of the invention. In the vacuum suction unit 3 of the vacuum suction device 1, two vacuum exhaust grooves 50 and 51, which are annular grooves, are concentrically formed. These vacuum exhaust grooves 50 and 51 are connected to the vacuum exhaust hole 5, respectively. The other structure is similar to that of the invention shown in FIG. That is, the vacuum suction unit 3
And the seal portion 10 surrounding it is formed so as to be flush with each other. Also, the vacuum suction part 3 and the seal part 1
The height of the protrusions 2 and 11 provided at 0 is several μm to 100 μm, for example, and the upper surfaces thereof are formed to be flush with each other, and the height between the sample 6 and the vacuum suction unit 3 and the seal unit 10 is extremely high. A minute gap is formed.
【0035】このような構成においては、図5に示した
発明と同様に大きさが異なる試料に対して共通に使用す
ることができる。すなわち、真空吸着部3と試料との間
には図9(b)に示した微小な隙間(45)が形成され
ているので、内側の真空排気溝50より大きく外側の環
状溝51より小さい試料を吸着する場合は、真空吸着部
3のうち2つの真空排気溝50,51によって囲まれた
部分3Bがシール部として機能し空気の吸い込みを阻止
するため、真空吸着部3の環状溝50より内側部分3A
が真空排気され、小さな試料を真空吸着する。一方、ラ
ンド部10と略同じ大きさの大きな試料を吸着する場合
は、シール部10と試料との間に形成される微小な隙間
が大きな抵抗となり空気の吸い込みを阻止するため、真
空吸着部3全体が真空排気され、大きな試料を真空吸着
する。なお、2つの真空排気孔5の中、外側の真空排気
溝51に接続されている真空排気孔5は、図5に示した
発明と同様に真空ポンプに対して弁を介して接続されて
おり、小さい試料を真空吸着する際に閉塞される。ここ
で、本実施例においては、真空吸着器1を円形に形成し
た例を示したが、図12に他の実施例として示すように
矩形に形成したものであってもよい。Such a structure can be commonly used for samples having different sizes as in the invention shown in FIG. That is, since the minute gap (45) shown in FIG. 9B is formed between the vacuum suction part 3 and the sample, the sample is larger than the inner vacuum exhaust groove 50 and smaller than the outer annular groove 51. When sucking air, the portion 3B of the vacuum suction portion 3 surrounded by the two vacuum exhaust grooves 50 and 51 functions as a seal portion to prevent air from being sucked in. Therefore, the portion inside the annular groove 50 of the vacuum suction portion 3 is blocked. Part 3A
Is evacuated to vacuum-adsorb a small sample. On the other hand, when a large sample having substantially the same size as the land part 10 is adsorbed, a minute gap formed between the seal part 10 and the sample becomes a large resistance to prevent air from being sucked in. The whole is evacuated and a large sample is vacuum-adsorbed. Of the two vacuum exhaust holes 5, the vacuum exhaust hole 5 connected to the outer vacuum exhaust groove 51 is connected to the vacuum pump via a valve as in the invention shown in FIG. , It is blocked when vacuum-adsorbing a small sample. Here, in the present embodiment, an example in which the vacuum suction device 1 is formed in a circular shape is shown, but it may be formed in a rectangular shape as shown as another embodiment in FIG.
【0036】なお、上記した実施例においてはいずれも
突子2,11,16をピン状に形成した例を示したが、
本発明はこれに限らず、環状や渦巻状の細長い突子とす
ることができる。In each of the above embodiments, the pins 2, 11 and 16 are formed in a pin shape.
The present invention is not limited to this, and can be an annular or spiral elongated protrusion.
【0037】[0037]
【発明の効果】以上説明したように本発明に係る真空吸
着装置は、真空吸着部とシール部に設けた突子のみによ
って試料を支承するから、試料と真空吸着器の接触面積
を小さくすることができる。したがって、ダストによる
影響が少なく、試料の反りや曲がりを矯正して高い平面
を得ることができる。また、シール部と試料との間に形
成される微小隙間は大きな抵抗となるので、真空吸引時
や加工時に外部からダストや加工液が侵入することはな
い。したがって、試料を確実に真空吸着することがで
き、試料や真空吸着器の汚染を防止することができる。As described above, in the vacuum suction device according to the present invention, the sample is supported only by the protrusions provided in the vacuum suction portion and the seal portion, so that the contact area between the sample and the vacuum suction device is reduced. You can Therefore, the influence of dust is small, and it is possible to correct the warp and bending of the sample and obtain a high flat surface. Further, since the minute gap formed between the seal portion and the sample has a large resistance, dust and processing liquid do not enter from the outside during vacuum suction or processing. Therefore, the sample can be securely vacuum-adsorbed, and contamination of the sample and the vacuum adsorber can be prevented.
【0038】また、シール部を環状突部によって形成し
た発明では、真空吸着部内の真空圧分布が均一となり、
試料を良好に吸着することができる。Further, in the invention in which the seal portion is formed by the annular protrusion, the vacuum pressure distribution in the vacuum suction portion becomes uniform,
The sample can be adsorbed well.
【0039】また、真空吸着部とシール部の突子が設け
られる面を同一平面をなすように形成した発明では、真
空吸着器の加工形成が容易である。Further, in the invention in which the surfaces of the vacuum suction portion and the seal portion on which the protrusions are provided are formed in the same plane, the vacuum suction device can be easily processed and formed.
【0040】また、環状溝内に配置したシール部材を真
空吸引時および陽圧空気の供給時に試料の裏面に密着さ
せるようにした発明では、真空吸着時および陽圧空気の
供給時にシール部材によって真空吸着部を確実に真空封
止することができる。また、環状溝が陽圧状態になるの
で、ダストや加工液が侵入することもない。さらに陽圧
空気は、シール部と試料との間に形成される微小隙間を
通って外部に排出されることで、試料の裏面に付着して
いるダスト等を除去する。Further, in the invention in which the seal member arranged in the annular groove is brought into close contact with the back surface of the sample at the time of vacuum suction and the supply of positive pressure air, in the vacuum suction and at the time of supply of positive pressure air, the seal member causes a vacuum. The suction part can be securely vacuum-sealed. Further, since the annular groove is in a positive pressure state, dust and working liquid do not enter. Further, the positive pressure air is discharged to the outside through a minute gap formed between the seal portion and the sample, thereby removing dust and the like adhering to the back surface of the sample.
【0041】また、シール部を突子より加工し易い材料
で形成した発明では、突子を形成した後にシール部を形
成することができる。これにより吸着すべき試料の大き
さ等に応じてシール部を加工形成することができる。In the invention in which the seal portion is made of a material that is easier to process than the protrusion, the seal portion can be formed after forming the protrusion. As a result, the seal portion can be processed and formed according to the size of the sample to be adsorbed.
【0042】また、シール部を複数個設けた発明では、
大きさの異なる試料に対して共通に使用することがで
き、真空吸着器の種類を削減することができる。In the invention having a plurality of seal portions,
It can be commonly used for samples of different sizes, and the number of vacuum adsorbers can be reduced.
【0043】また、真空排気孔に連通する環状溝を複数
個設けた発明では、大きさの異なる試料に対して共通に
使用することができ、真空吸着器の種類を削減すること
ができる。Further, in the invention in which a plurality of annular grooves communicating with the vacuum exhaust hole are provided, it can be commonly used for samples of different sizes, and the number of vacuum adsorbers can be reduced.
【0044】また、突子が設けられる面を真空吸着器の
周囲から中心に向かって低くなるように連続的に傾斜さ
せた発明では、外周縁部において試料との間に微小な隙
間が形成され、真空吸引時や加工時に外部からダストや
加工液が侵入するのを防止する。一方、中央部において
は、試料との間の隙間を大きくするので、真空吸着部の
真空排気を容易にする。Further, in the invention in which the surface on which the protrusion is provided is continuously inclined so as to be lowered from the periphery of the vacuum suction device toward the center, a minute gap is formed between the sample and the outer peripheral edge portion. Prevents dust and processing liquid from entering from the outside during vacuum suction and processing. On the other hand, in the central part, the gap between the sample and the sample is increased, so that the vacuum suction part can be easily evacuated.
【図1】 (a)、(b)は本発明に係る真空吸着装置
を構成する真空吸着器の一実施例を示す平面図および要
部の拡大断面図である。1A and 1B are a plan view and an enlarged cross-sectional view of a main part showing an embodiment of a vacuum suction device that constitutes a vacuum suction device according to the present invention.
【図2】 (a)、(b)は他の発明の実施例を示す真
空吸着器の平面図および要部の拡大断面図である。2 (a) and 2 (b) are a plan view and an enlarged sectional view of a main part of a vacuum suction device showing another embodiment of the invention.
【図3】 (a)、(b)は図1に示した発明の他の実
施例を示すもので、ウエハ搬送用ロードアームの先端部
に設けられるウエハ吸着部に適用した例を示す平面図お
よび断面図である。3 (a) and 3 (b) are views showing another embodiment of the invention shown in FIG. 1, and are plan views showing an example in which the invention is applied to a wafer suction section provided at the tip of a wafer transfer load arm. And FIG.
【図4】 他の発明の実施例を示す真空吸着器の要部の
拡大断面図で、(a)は試料を真空吸着する前の状態、
(b)は試料を真空吸着した状態を示す図である。FIG. 4 is an enlarged cross-sectional view of a main part of a vacuum suction device showing another embodiment of the invention, in which (a) is a state before vacuum suction of a sample,
(B) is a figure which shows the state which the sample was vacuum-adsorbed.
【図5】 他の発明の実施例を示す真空吸着器の平面図
である。FIG. 5 is a plan view of a vacuum suction device showing another embodiment of the invention.
【図6】 図5に示した発明の他の実施例を示す真空吸
着器の平面図である。FIG. 6 is a plan view of a vacuum suction device showing another embodiment of the invention shown in FIG.
【図7】 (a)、(b)は他の発明の実施例を示す真
空吸着器の平面図および要部の拡大断面図である。7 (a) and 7 (b) are a plan view and an enlarged sectional view of an essential part of a vacuum suction device showing another embodiment of the invention.
【図8】 他の発明の実施例を示す真空吸着器の要部の
拡大断面図である。FIG. 8 is an enlarged sectional view of a main part of a vacuum suction device showing another embodiment of the invention.
【図9】 (a)、(b)は他の発明の実施例を示す真
空吸着器の平面図および要部の拡大断面図である。9 (a) and 9 (b) are a plan view and an enlarged sectional view of a main part of a vacuum suction device showing another embodiment of the invention.
【図10】 (a)、(b)は図9に示した発明の実施
例を示すもので、ウエハ搬送用ロードアームの先端部に
設けられるウエハ吸着部に適用した例を示す平面図およ
び断面図である。10 (a) and 10 (b) show an embodiment of the invention shown in FIG. 9, and are a plan view and a cross section showing an example applied to a wafer suction unit provided at the tip of a wafer transfer load arm. It is a figure.
【図11】 他の発明の実施例を示す真空吸着器の平面
である。FIG. 11 is a plan view of a vacuum suction device showing another embodiment of the invention.
【図12】 図11に示した発明の他の実施例を示す真
空吸着器の平面である。12 is a plan view of a vacuum suction device showing another embodiment of the invention shown in FIG.
【図13】 (a)、(b)は従来の真空吸着器の正面
図および要部の拡大断面図である。13 (a) and 13 (b) are a front view and an enlarged cross-sectional view of a main part of a conventional vacuum suction device.
1…真空吸着器、2…突子、3…真空吸着部、4…ラン
ド部、10…シール部、10−1 …第1シール部、10
−2 …第2シール部、5…真空排気孔、6…試料、11
…突子、12…微小隙間、16…突子、17…平坦面
部、30…環状溝、31…リング、32…シール部材、
33…陽圧供給孔、41…陽圧空気、45…微小隙間、
50,51…真空排気溝。DESCRIPTION OF SYMBOLS 1 ... Vacuum suction device, 2 ... Protrusion, 3 ... Vacuum suction part, 4 ... Land part, 10 ... Seal part, 10-1 ... 1st seal part, 10
-2 ... Second seal part, 5 ... Vacuum exhaust hole, 6 ... Sample, 11
... protrusion, 12 ... small gap, 16 ... protrusion, 17 ... flat surface portion, 30 ... annular groove, 31 ... ring, 32 ... sealing member,
33 ... Positive pressure supply hole, 41 ... Positive pressure air, 45 ... Minute gap,
50, 51 ... Vacuum exhaust groove.
Claims (9)
によって試料を支承し、内部に真空ポンプに接続される
真空排気孔を設けた真空吸着器を備えた真空吸着装置で
あって、前記真空吸着器の上面に真空排気孔に連通する
真空吸着部を形成するとともに、この真空吸着部を取り
囲む環状のシール部を設け、このシール部の突子の高さ
をきわめて低く設定することによりシール部と試料との
間に微小隙間が形成されるようにしたことを特徴とする
真空吸着装置。1. A vacuum adsorption device comprising a vacuum adsorption device which supports a sample only by a plurality of protrusions whose upper surfaces are on the same plane, and which is provided with a vacuum adsorption device provided with a vacuum exhaust hole connected to a vacuum pump, By forming a vacuum suction portion communicating with the vacuum exhaust hole on the upper surface of the vacuum suction device and providing an annular seal portion surrounding the vacuum suction portion, and setting the height of the protrusion of the seal portion to be extremely low. A vacuum suction device characterized in that a minute gap is formed between the seal portion and the sample.
て、シール部を環状突部によって形成したことを特徴と
する真空吸着装置。2. The vacuum suction device according to claim 1, wherein the seal portion is formed by an annular protrusion.
て、真空吸着部とシール部の突子が設けられる面を同一
平面に形成したことを特徴とする真空吸着装置。3. The vacuum suction device according to claim 1, wherein the surfaces of the vacuum suction portion and the seal portion on which the protrusions are provided are formed in the same plane.
て、真空吸着器に陽圧供給孔を設け、真空吸着部とシー
ル部との間に前記陽圧供給孔に連通する環状溝を形成
し、この環状溝にリングを設け、かつこのリングの少な
くとも上面に真空吸引時および陽圧空気の供給時に試料
の裏面に密着する環状のシール部材を固着したことを特
徴とする真空吸着装置。4. The vacuum suction device according to claim 1, wherein the vacuum suction device is provided with a positive pressure supply hole, and an annular groove communicating with the positive pressure supply hole is formed between the vacuum suction portion and the seal portion. A vacuum adsorption device characterized in that a ring is provided in the annular groove, and an annular seal member that is in close contact with the back surface of the sample is fixed to at least the upper surface of the ring during vacuum suction and supply of positive pressure air.
て、シール部を突子より加工し易い材料で形成したこと
を特徴とする真空吸着装置。5. The vacuum suction device according to claim 2, wherein the seal portion is formed of a material that is easier to process than the protrusion.
載の真空吸着装置において、突子をピン状に形成したこ
とを特徴とする真空吸着装置。6. The vacuum suction device according to claim 1, wherein the protrusion is formed in a pin shape.
て、シール部を複数個設けたことを特徴とする真空吸着
装置。7. The vacuum suction device according to claim 2, wherein a plurality of seal portions are provided.
て、真空吸着部に真空排気孔に連通する環状の真空排気
溝を複数個形成したことを特徴とする真空吸着装置。8. The vacuum suction device according to claim 3, wherein a plurality of annular vacuum exhaust grooves communicating with the vacuum exhaust holes are formed in the vacuum suction portion.
によって試料を支承し、内部に真空ポンプに接続される
真空排気孔を設けた真空吸着器を備えた真空吸着装置で
あって、前記真空吸着器の上面に真空排気孔に連通する
真空吸着部を形成するとともに、突子が設けられる面
を、真空吸着器の周囲から中心に向かって低くなるよう
に連続的に傾斜させたことを特徴とする真空吸着装置。9. A vacuum adsorption device comprising a vacuum adsorption device which supports a sample only by a plurality of protrusions whose upper surfaces are on the same plane, and which is provided with a vacuum adsorption device internally provided with a vacuum exhaust hole connected to a vacuum pump, A vacuum suction part communicating with the vacuum exhaust hole is formed on the upper surface of the vacuum suction device, and the surface on which the protrusion is provided is continuously inclined so as to decrease from the periphery of the vacuum suction device toward the center. Vacuum suction device characterized by.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4958195A JP3312163B2 (en) | 1994-11-18 | 1995-03-09 | Vacuum suction device |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28497094 | 1994-11-18 | ||
JP6-284970 | 1994-11-18 | ||
JP4958195A JP3312163B2 (en) | 1994-11-18 | 1995-03-09 | Vacuum suction device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH08195428A true JPH08195428A (en) | 1996-07-30 |
JP3312163B2 JP3312163B2 (en) | 2002-08-05 |
Family
ID=26389999
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4958195A Expired - Lifetime JP3312163B2 (en) | 1994-11-18 | 1995-03-09 | Vacuum suction device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3312163B2 (en) |
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001056074A1 (en) * | 2000-01-28 | 2001-08-02 | Hitachi Tokyo Electronics Co., Ltd. | Wafer chuck, exposure system, and method of manufacturing semiconductor device |
JP2003142566A (en) * | 2001-11-07 | 2003-05-16 | New Creation Co Ltd | Vacuum sucker and its manufacturing method |
JP2005175016A (en) * | 2003-12-08 | 2005-06-30 | Canon Inc | Substrate holding device, exposure device using the same, and method of manufacturing device |
JP2006310588A (en) * | 2005-04-28 | 2006-11-09 | Nikon Corp | Substrate-holding device and exposure device, and device manufacturing method |
JP2008042023A (en) * | 2006-08-08 | 2008-02-21 | Hitachi Kokusai Electric Inc | Substrate processing equipment |
JP2008177303A (en) * | 2007-01-17 | 2008-07-31 | Tokyo Electron Ltd | Substrate processing apparatus, substrate processing method, and storage medium |
US7425238B2 (en) | 2002-10-16 | 2008-09-16 | Canon Kabushiki Kaisha | Substrate holding device |
JP2009212344A (en) * | 2008-03-05 | 2009-09-17 | Nsk Ltd | Work chuck, aligner, and process for producing flat panel |
JP2009212345A (en) * | 2008-03-05 | 2009-09-17 | Nsk Ltd | Work chuck, aligner, and process for producing flat panel |
JP2010240806A (en) * | 2009-04-09 | 2010-10-28 | Ihi Corp | Robot hand and transfer robot |
JP2011114238A (en) * | 2009-11-27 | 2011-06-09 | Canon Inc | Substrate holding device, exposure device using the same, and device manufacturing method |
JP2012064872A (en) * | 2010-09-17 | 2012-03-29 | Disco Abrasive Syst Ltd | Cutting working device |
EP2562104A1 (en) * | 2011-08-20 | 2013-02-27 | Festo AG & Co. KG | Negative pressure holding device |
KR101324722B1 (en) * | 2013-03-15 | 2013-11-05 | 쿠어스텍아시아 유한회사 | Wafer chuck having independent vacuum areas |
WO2014084060A1 (en) | 2012-11-28 | 2014-06-05 | 京セラ株式会社 | Placement member and method for manufacturing same |
JP2014241357A (en) * | 2013-06-12 | 2014-12-25 | レーザーテック株式会社 | Substrate holding device, optical device, and substrate holding method |
JP2017174898A (en) * | 2016-03-22 | 2017-09-28 | 日本特殊陶業株式会社 | Substrate support member |
TWI636500B (en) * | 2016-03-09 | 2018-09-21 | 日本特殊陶業股份有限公司 | Vacuum adsorption method |
JP2018160570A (en) * | 2017-03-23 | 2018-10-11 | 株式会社東京精密 | Prober and wafer chuck |
JP2019109982A (en) * | 2017-12-15 | 2019-07-04 | トヨタ自動車株式会社 | Suction table of membrane electrode assembly for fuel cell |
KR20230120986A (en) | 2022-02-10 | 2023-08-17 | 우시오덴키 가부시키가이샤 | Work stage and exposure apparatus |
JP2024155656A (en) * | 2023-04-21 | 2024-10-31 | 梭特科技股▲分▼有限公司 | Transfer mount apparatus and method utilizing positive pressure to maintain wafer or die position |
WO2025142585A1 (en) * | 2023-12-26 | 2025-07-03 | 東京エレクトロン株式会社 | Substrate processing device and electrostatic chuck |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009018434B4 (en) | 2009-04-22 | 2023-11-30 | Ev Group Gmbh | Receiving device for holding semiconductor substrates |
KR20210097535A (en) | 2020-01-30 | 2021-08-09 | 삼성전자주식회사 | wafer chuck |
-
1995
- 1995-03-09 JP JP4958195A patent/JP3312163B2/en not_active Expired - Lifetime
Cited By (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6664549B2 (en) | 2000-01-28 | 2003-12-16 | Hitachi Tokyo Electronics Co., Ltd. | Wafer chuck, exposure system, and method of manufacturing semiconductor device |
KR100804006B1 (en) * | 2000-01-28 | 2008-02-18 | 히다치 도쿄 에렉트로닉스 가부시키가이샤 | Wafer chuck |
WO2001056074A1 (en) * | 2000-01-28 | 2001-08-02 | Hitachi Tokyo Electronics Co., Ltd. | Wafer chuck, exposure system, and method of manufacturing semiconductor device |
JP2010166085A (en) * | 2000-01-28 | 2010-07-29 | Renesas Eastern Japan Semiconductor Inc | Wafer chuck and exposure apparatus using the same, and method for manufacturing semiconductor device |
JP2003142566A (en) * | 2001-11-07 | 2003-05-16 | New Creation Co Ltd | Vacuum sucker and its manufacturing method |
US7425238B2 (en) | 2002-10-16 | 2008-09-16 | Canon Kabushiki Kaisha | Substrate holding device |
JP2005175016A (en) * | 2003-12-08 | 2005-06-30 | Canon Inc | Substrate holding device, exposure device using the same, and method of manufacturing device |
JP2006310588A (en) * | 2005-04-28 | 2006-11-09 | Nikon Corp | Substrate-holding device and exposure device, and device manufacturing method |
JP2008042023A (en) * | 2006-08-08 | 2008-02-21 | Hitachi Kokusai Electric Inc | Substrate processing equipment |
JP2008177303A (en) * | 2007-01-17 | 2008-07-31 | Tokyo Electron Ltd | Substrate processing apparatus, substrate processing method, and storage medium |
JP2009212344A (en) * | 2008-03-05 | 2009-09-17 | Nsk Ltd | Work chuck, aligner, and process for producing flat panel |
JP2009212345A (en) * | 2008-03-05 | 2009-09-17 | Nsk Ltd | Work chuck, aligner, and process for producing flat panel |
JP2010240806A (en) * | 2009-04-09 | 2010-10-28 | Ihi Corp | Robot hand and transfer robot |
JP2011114238A (en) * | 2009-11-27 | 2011-06-09 | Canon Inc | Substrate holding device, exposure device using the same, and device manufacturing method |
JP2012064872A (en) * | 2010-09-17 | 2012-03-29 | Disco Abrasive Syst Ltd | Cutting working device |
EP2562104A1 (en) * | 2011-08-20 | 2013-02-27 | Festo AG & Co. KG | Negative pressure holding device |
US10937684B2 (en) | 2012-11-28 | 2021-03-02 | Kyocera Corporation | Placement member and method of manufacturing the same |
WO2014084060A1 (en) | 2012-11-28 | 2014-06-05 | 京セラ株式会社 | Placement member and method for manufacturing same |
KR101324722B1 (en) * | 2013-03-15 | 2013-11-05 | 쿠어스텍아시아 유한회사 | Wafer chuck having independent vacuum areas |
JP2014241357A (en) * | 2013-06-12 | 2014-12-25 | レーザーテック株式会社 | Substrate holding device, optical device, and substrate holding method |
TWI636500B (en) * | 2016-03-09 | 2018-09-21 | 日本特殊陶業股份有限公司 | Vacuum adsorption method |
JP2017174898A (en) * | 2016-03-22 | 2017-09-28 | 日本特殊陶業株式会社 | Substrate support member |
JP2018160570A (en) * | 2017-03-23 | 2018-10-11 | 株式会社東京精密 | Prober and wafer chuck |
JP2019109982A (en) * | 2017-12-15 | 2019-07-04 | トヨタ自動車株式会社 | Suction table of membrane electrode assembly for fuel cell |
KR20230120986A (en) | 2022-02-10 | 2023-08-17 | 우시오덴키 가부시키가이샤 | Work stage and exposure apparatus |
US12261077B2 (en) | 2022-02-10 | 2025-03-25 | Ushio Denki Kabushiki Kaisha | Work stage and exposure apparatus |
JP2024155656A (en) * | 2023-04-21 | 2024-10-31 | 梭特科技股▲分▼有限公司 | Transfer mount apparatus and method utilizing positive pressure to maintain wafer or die position |
WO2025142585A1 (en) * | 2023-12-26 | 2025-07-03 | 東京エレクトロン株式会社 | Substrate processing device and electrostatic chuck |
Also Published As
Publication number | Publication date |
---|---|
JP3312163B2 (en) | 2002-08-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH08195428A (en) | Vacuum suction device | |
JP3312164B2 (en) | Vacuum suction device | |
JP2007258442A (en) | Substrate supporting structure, heat treatment apparatus using same, sheet-like article used for substrate supporting structure, and manufacturing method of substrate supporting structure | |
US7914694B2 (en) | Semiconductor wafer handler | |
JPH08330401A (en) | Wafer chuck | |
JPH09181153A (en) | Semiconductor wafer fixing device | |
TW201944866A (en) | Bonding system and bonding method | |
JP2001185607A5 (en) | ||
JP2006310697A (en) | Vacuum chuck | |
JP3323797B2 (en) | Hydrophobic treatment device | |
KR20010049473A (en) | Ball suction head | |
JP3817613B2 (en) | Vacuum adsorption device | |
JP3769618B2 (en) | Vacuum adsorption device | |
JP5316172B2 (en) | Wafer suction pad and pre-aligner having the same | |
JPH10128633A (en) | Vacuum suction device | |
JPH06132387A (en) | Vacuum adsorption stage | |
JP2005032977A (en) | Vacuum chuck | |
TWI804164B (en) | Leveling device and leveling method | |
JP4451578B2 (en) | Vacuum chuck | |
US20080051018A1 (en) | Semiconductor Wafer Handler | |
JP3164629B2 (en) | Vacuum chuck stage for semiconductor wafer | |
JP2021197373A (en) | Substrate holding device | |
JPH0516088A (en) | Suction type holding tool | |
JP2001176956A (en) | Substrate chuck device | |
JPH09225768A (en) | Substrate holding device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090531 Year of fee payment: 7 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090531 Year of fee payment: 7 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100531 Year of fee payment: 8 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100531 Year of fee payment: 8 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110531 Year of fee payment: 9 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120531 Year of fee payment: 10 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130531 Year of fee payment: 11 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140531 Year of fee payment: 12 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
EXPY | Cancellation because of completion of term |