TWI804164B - Leveling device and leveling method - Google Patents

Abstract

A leveling device is adapted to level a substrate. The leveling device includes a carrier, a pressing member and an elastic sealing ring. The carrier is disposed for carrying and absorbing the substrate. The pressing member is disposed above the carrier, and is disposed for downwardly pressing the substrate, so as to make the outer periphery of the substrate close to the carrier. The elastic sealing ring is disposed on the carrier and can be absorbed by the carrier. When the pressing member presses the substrate and the elastic sealing ring is absorbed by the carrier, the elastic sealing ring is closely attached to the carrier and the outer periphery of the substrate, so that an airtight chamber is formed among the elastic sealing ring, the carrier and the substrate. The airtight chamber is following evacuated by the carrier to form a vacuum state, so as to absorb the substrate, so that the substrate is completely absorbed on the carrier.

Description

Leveling device and leveling method

The invention relates to a leveling device, in particular to a leveling device and a leveling method for leveling a substrate.

When the automatic optical inspection equipment intends to inspect a semiconductor substrate such as a wafer, the wafer needs to be placed on a stage, and the stage absorbs the wafer through a vacuum suction method for inspection by an inspection device. Since the wafer is prone to warping after passing through multiple semiconductor processing processes, it often causes the stage to be unable to firmly absorb the wafer, causing the wafer to shake, and the wafer image taken by the inspection device is due to the aforementioned wafer Warping and shaking factors cause distortion and affect detection accuracy.

It is an object of the present invention to provide a leveling device that overcomes at least one of the disadvantages of the prior art.

The leveling device of the present invention is suitable for leveling a substrate.

The leveling device includes a carrier, a pressed part and an elastic sealing ring. The stage is used for carrying and absorbing the substrate. The pressing part is arranged above the stage for pressing down the substrate so that an outer peripheral edge of the substrate is close to the stage. The elastic sealing ring is arranged on the stage and can be absorbed by the stage. When the pressing part presses the substrate and the elastic sealing ring is absorbed by the carrier, the elastic sealing ring is closely attached to the outer peripheral edges of the carrier and the substrate, so that an airtight chamber is formed between the elastic sealing ring, the carrier and the substrate. The airtight chamber is further evacuated by the stage to form a vacuum state to absorb the substrate, so that the substrate is completely flat on the stage.

Another object of the present invention is to provide a leveling method that overcomes at least one of the disadvantages of the prior art.

The leveling method of the present invention is suitable for leveling a substrate, and the leveling method comprises the following steps:

Place the substrate on a stage; drive a pressing part to press the substrate downward, so that an outer peripheral edge of the substrate is close to the stage and surrounded by an elastic sealing ring; drive the stage to absorb the elastic sealing ring, so that the elastic sealing ring is tightly attached An airtight chamber is formed between the elastic sealing ring, the stage and the substrate on the stage and the outer periphery; and the airtight chamber is pumped through the stage to form a vacuum state in the airtight chamber, and the substrate is absorbed and completely flat on the carrier tower.

The present invention has at least the following effects: the base plate is pressed down by the pressed part, which can initially level the base plate to reduce the warping degree of the base plate and the height of the outer periphery; the pressed part does not directly flatten the substrate but makes the outer periphery There is a distance between the edge and the top surface of the load, thereby preventing the substrate from being damaged during the process of pressing down the substrate by the pressed part; Further leveling the effect of the substrate, so that the substrate can be flat and firmly positioned on the top surface of the load.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numerals.

Referring to FIG. 1 , a first embodiment of a leveling device 200 of the present invention is applied to an optical inspection device (not shown) to level a substrate 1 so that the optical inspection device can inspect the substrate 1 . In the first embodiment, the substrate 1 is an example of a wafer to be tested, but it is not limited thereto. The substrate 1 may also be a circular circuit substrate to be tested or a panel to be tested. The substrate 1 has a bottom surface 11 , a top surface 12 opposite to the bottom surface 11 , and an outer peripheral edge 13 connected between the bottom surface 11 and the top surface 12 . The outer peripheral edge 13 of the substrate 1 is warped upward, so that the top surface 12 defines a concave portion 14 with an upward opening. The leveling device 200 includes a stage 2 , a vacuum mechanism 3 (as shown in FIG. 4 ), an elastic sealing ring 4 , and a pressing mechanism 5 .

Referring to FIG. 2 , FIG. 3 and FIG. 4 , the stage 2 is a vacuum adsorption stage and includes a lower surface 21 and an upper surface 22 opposite to the lower surface 21 . The platform 2 defines a positioning ring groove 23 recessed from the upper surface 22 toward the lower surface 21 for accommodating the elastic sealing ring 4 . The stage 2 includes a disc body 24 located inside the positioning ring groove 23 and surrounded by the positioning ring groove 23 . The disk body 24 is disc-shaped and has a circular top surface 241 for carrying the substrate 1 and a surrounding surface 242 .

The platform 2 also defines an air suction channel 25 formed between the lower surface 21 , the carrying top surface 241 and the surrounding surface 242 . The suction channel 25 has a central groove 251 , a plurality of inner ring grooves 252 , an outer ring groove 253 , a plurality of long grooves 254 , and a plurality of air holes 255 . The central groove 251 is recessed downward from the center of the carrying top surface 241 for absorbing the bottom surface 11 of the substrate 1 . A plurality of inner ring grooves 252 and outer ring grooves 253 each have a circular shape and have different diameters. The plurality of inner ring grooves 252 and outer ring grooves 253 are recessed downward from the bearing top surface 241 and are concentric. are arranged radially at intervals and located around the central groove 251 , and each inner ring groove 252 is used for absorbing the bottom surface 11 of the substrate 1 . The outer ring groove 253 extends to the surrounding surface 242 and is adjacent to the surrounding surface 242 and communicates with the positioning ring groove 23 for absorbing the bottom surface 11 of the substrate 1 and the elastic sealing ring 4 located in the positioning ring groove 23 . A plurality of long grooves 254 are recessed downward from the bearing top surface 241 and are arranged at equal angles and in a radial shape. Each long groove 254 extends radially outward from the central groove 251 to the outer ring groove 253 and communicates with the central groove 251, the inner ring groove 252 and the outer ring groove 253, and each long groove 254 is used to adsorb the bottom surface of the substrate 1 11. Each air hole 255 extends from the lower surface 21 to the corresponding long groove 254 and communicates with the corresponding long groove 254 for connecting with the vacuum mechanism 3 . In the first embodiment, the number of long grooves 254 is four as an example, and the number of air holes 255 is eight as an example, but it is not limited thereto, and can also be adjusted according to requirements.

The vacuum mechanism 3 includes a vacuum source 31 and a connecting pipeline 32 . The vacuum source 31 is, for example, a vacuum pump, but not limited thereto. The connection pipeline 32 is connected between the vacuum source 31 and the plurality of air holes 255 . When the vacuum source 31 is running, it will pump air through the connecting pipeline 32 and the air hole 255 to the long groove 254, so that the long groove 254, the central groove 251, the inner ring groove 252 and the outer ring groove 253 generate suction to absorb the substrate 1 and the elastic Sealing ring 4.

The elastic sealing ring 4 is made of deformable elastic material. The elastic material mentioned above can be elastic material such as rubber or silicon rubber, for example. The elastic sealing ring 4 includes a positioning ring body 41 and a movable ring body 42 . The positioning ring body 41 is accommodated in the positioning ring groove 23 , and can be positioned in the positioning ring groove 23 by means of tight fit or adhesive bonding, so that the positioning ring body 41 surrounds the surrounding surface 242 of the disc body 24 . The positioning method between the positioning ring body 41 and the positioning ring groove 23 is not limited to the aforementioned method, and can also be achieved through other positioning methods. The positioning ring 41 has a ring top surface 411 and an inner peripheral surface 412 .

The movable ring body 42 integrally extends upward from the ring top surface 411 of the positioning ring body 41 adjacent to the inner peripheral surface 412 and extends obliquely away from the surrounding surface 242. The movable ring body 42 surrounds the bearing top surface 241 of the disc body 24 and surrounds surface 242, and the outer ring groove 253 of the suction channel 25. The movable ring body 42 has an inner ring surface 421 and a top end 422 , and the inner ring surface 421 faces the outer ring groove 253 of the suction channel 25 . The movable ring 42 can be bent and deformed relative to the positioning ring 41 to pivot between an initial position (shown in the enlarged block of FIG. 4 ) and an attaching position (shown in the enlarged block of FIG. 8 ). At the initial position, the movable ring body 42 is inclined, the inner ring surface 421 is spaced apart from the surrounding surface 242 and the outer ring groove 253 , and the height of the top end 422 is higher than that of the outer ring groove 253 . In the attaching position, the movable ring body 42 is in an upright shape, and the inner ring surface 421 is closely attached to the surrounding surface 242 and closes the outside of the outer ring groove 253 . With the inner ring surface 421 of the movable ring body 42 facing the outer ring groove 253 and corresponding to the position of the outer ring groove 253, the movable ring body 42 can be absorbed by the outer ring groove 253 and pivot from the initial position to the attaching position .

The pressing mechanism 5 includes a bearing ring 51 and a pressing part 52 . The bearing ring 51 is connected with a transfer mechanism (not shown in the figure) and forms a positioning ring groove 511 facing downward for accommodating the pressed part 52 . The pressing part 52 of the first embodiment is a ring-shaped pressing strip, such as an O-ring. The pressed part 52 is made of elastic material, such as polyetheretherketone (PEEK) or rubber. The pressing part 52 is accommodated in the positioning ring groove 511 and partially protrudes from the bottom of the bearing ring 51 for pressing the top surface 12 of the substrate 1 adjacent to the outer peripheral edge 13 . The pressed part 52 can be positioned in the positioning ring groove 511 through a tight fit method or an adhesive bonding method. The positioning method between the pressing part 52 and the positioning ring groove 511 is not limited to the aforementioned method, and can also be achieved by other positioning methods.

The transfer mechanism is used to drive the pressing mechanism 5 to move to a position to be pressed (as shown in FIG. 4 ) or to move away from the position to be pressed. When the pressing mechanism 5 is in the position to be pressed, the pressing part 52 is located above the stage 2 and aligned on the carrying top surface 241 and the surrounding surface 242 of the disc body 24, and the pressing part 52 can be aligned on the top surface 12 of the substrate 1 adjacent to the outer peripheral edge 13 parts. The transfer mechanism is also used to drive the pressing mechanism 5 to move up and down between the position to be pressed and a pressing position (as shown in FIG. 6 ). When the pressing mechanism 5 is in the pressing position, the pressing member 52 presses down the top surface 12 of the substrate 1 adjacent to the peripheral edge 13 so that the peripheral edge 13 of the substrate 1 is close to the loading top surface 241 of the stage 2 .

The following is a detailed description of how the leveling device 200 operates using the leveling method of the first embodiment of the present case:

5 is a flow chart of the leveling steps of the leveling method of the first embodiment, which includes the following steps: Step S1: placing the substrate on the carrier, step S2: driving the pressing part to press the substrate, step S3: driving the carrier to absorb The elastic sealing ring, and step S4: pumping air through the carrier to the airtight chamber.

Referring to FIG. 4 and FIG. 5, in step S1, the substrate 1 is transferred through a pick-and-place device (not shown) and placed on the carrier top surface 241 of the tray 24, so that the bottom surface 11 of the substrate 1 partially contacts the carrier. Top surface 241 .

Referring to FIG. 4, FIG. 5 and FIG. 6, in step S2, the transfer mechanism will first drive the pressing mechanism 5 to move to the position to be pressed as shown in FIG. 13 places. Subsequently, the transfer mechanism drives the pressing mechanism 5 to move downward from the position to be pressed along the pressing direction D. When the pressing piece 52 contacts the top surface 12 of the substrate 1 and presses down the top surface 12, the pressing piece 52 is applied to the top surface. The downward force of 12 gradually increases the portion where the bottom surface 11 contacts the bearing top surface 241 , and the outer peripheral edge 13 gradually approaches the bearing top surface 241 . When the pressing mechanism 5 descends to the pressing position shown in FIG. 6 , the transfer mechanism stops driving the pressing mechanism 5 to move down. At this time, the pressing part 52 presses down the portion of the top surface 12 of the substrate 1 adjacent to the outer peripheral edge 13 , and makes a distance d between the outer peripheral edge 13 and the supporting top surface 241 . In the first embodiment, the value of the distance d is, for example, any value between 1 mm and 2 mm. In other embodiments, the value of the distance d can be changed according to actual requirements.

Referring to Fig. 6 and Fig. 7, during the process of pressing down the substrate 1, the portion where the bottom surface 11 contacts the top surface 241 gradually increases and the outer peripheral edge 13 gradually approaches the top surface 241, thereby achieving preliminary leveling. The effect of the substrate 1 is to reduce the degree of warpage of the substrate 1 and the height of the outer peripheral edge 13 . Thereby, the inner ring surface 421 of the movable ring body 42 at the initial position can surround the outer peripheral edge 13 of the substrate 1 and be spaced apart from the outer peripheral edge 13 , and the height of the top end 422 can be higher than that of the outer peripheral edge 13 . In addition, when the pressing mechanism 5 descends to the pressing position, the pressing part 52 does not directly flatten the substrate 1 but keeps the distance d between the outer peripheral edge 13 and the carrying top surface 241, thereby preventing the pressing part 52 from pressing the substrate 1 Usually, the excessive downforce path causes the bottom surface 11 to collide with the friction-bearing top surface 241 to cause damage.

Referring to Fig. 5, Fig. 8 and Fig. 9, in step S3, the vacuum source 31 of the vacuum mechanism 3 is driven to operate. When the vacuum source 31 operates, the long groove 254 will be pumped through the connecting pipeline 32 and the air hole 255, so that the long groove 254 , the central groove 251 , the inner ring groove 252 and the outer ring groove 253 generate suction. Wherein, the upward and downward vertical suction force produced by the long groove 254, the central groove 251, the inner ring groove 252 and the outer ring groove 253 will adsorb the bottom surface 11 of the substrate 1, while the outer ring groove 253 is produced by the outer ring groove 253. The inward radial suction force (the direction of the arrow shown in FIG. 9 ) will absorb the movable ring body 42 of the elastic sealing ring 4, so as to drive the movable ring body 42 to bend and deform inwardly relative to the positioning ring body 41 and pivot to Attachment locations shown in Figure 8. At the same time, the movable ring body 42 is bent and deformed relative to the positioning ring body 41 to accumulate restoring elastic force.

Since the height of the top end 422 of the movable ring body 42 is higher than the height of the outer ring groove 253 and the height of the outer peripheral edge 13 when the movable ring body 42 is in the initial position, it can be ensured that when the movable ring body 42 pivots to the attachment position, the inner ring surface 421 is simultaneously tightly It is attached to the surrounding surface 242 of the disc body 24 and the outer peripheral edge 13 of the substrate 1 , and seals the outside of the outer ring groove 253 . Thereby, an airtight airtight chamber 6 is formed between the movable ring body 42 of the elastic sealing ring 4, the disk body 24 of the stage 2, and the substrate 1, thereby preventing air from the external environment from being sucked into the airtight chamber 6 And the air in the airtight chamber 6 leaks outwards.

The movable ring body 42 is designed to extend upward from the ring top surface 411 of the positioning ring body 41 adjacent to the inner peripheral surface 412 and obliquely extend away from the surrounding surface 242, so that the movable ring body 42 is formed by the outer ring groove 253 When adsorbed by the radial suction force, it is attached to the surrounding surface 242, the outside of the sealing outer ring groove 253, and the outer peripheral edge 13 sequentially from bottom to top. In this way, the compliance of the inner ring surface 421 attached to the surrounding surface 242 and the outer peripheral edge 13 can be improved, so that the inner ring surface 421 can be closely attached to the surrounding surface 242 and the outer peripheral edge 13 to improve the sealing of the outer ring groove 253 Effect.

By making the inner ring surface 421 of the movable ring body 42 face the outer ring groove 253 and being absorbed by the radial suction force generated by the outer ring groove 253 , the force bearing area of the movable ring body 42 that can be absorbed by the suction force is large. Since the outer ring groove 253 has a circular shape, the radial suction force generated by the outer ring groove 253 can apply force to evenly absorb the inner ring surface 421 of the movable ring body 42 . With the aforementioned design, the movable ring body 42 can be smoothly and quickly bent and deformed relative to the positioning ring body 41 to pivot from the initial position to the attaching position when attracted by the radial suction force generated by the outer ring groove 253 .

Referring to Fig. 5, Fig. 9 and Fig. 10, in step S4, by the continuous operation of the vacuum source 31, the suction channel 25 will pass through the central groove 251, the inner ring groove 252, the outer ring groove 253 and the long groove 254 The airtight chamber 6 is evacuated so that the airtight chamber 6 becomes a vacuum state. By means of the central groove 251, the inner ring groove 252, the outer ring groove 253, and the long groove 254, the bottom surface 11 of the substrate 1 is adsorbed by means of vacuum adsorption, so that the warped part near the outer peripheral edge 13 of the substrate 1 can be pulled down to make the outer peripheral edge 13 moves down along the inner ring surface 421 to further level the substrate 1 . In this way, the warped substrate 1 can be leveled and the bottom surface 11 can be completely attached to the top surface 241 , and the flattened substrate 1 can be firmly positioned on the top surface 241 .

After the substrate 1 is leveled, the transfer mechanism will firstly drive the pressing mechanism 5 to rise and return to the position to be pressed, and then drive the pressing mechanism 5 to move away from the position to be pressed, so that the pressing mechanism 5 will not cover the substrate 1 . Then, the flattened substrate 1 can be detected by a detection device (not shown in the figure). Since what the detection device captures is the image of the substrate 1 firmly positioned on the carrying top surface 241 and leveled, the detection accuracy of the detection device can be effectively improved.

When the detection by the detection device is completed, the vacuum source 31 stops to release the vacuum adsorption state of the central groove 251 , the inner ring groove 252 , the outer ring groove 253 and the long groove 254 . At this time, the movable ring body 42 of the elastic sealing ring 4 automatically rebounds and resets to the initial position shown in FIG. 4 by the accumulated reset elastic force.

The positioning ring body 41 and the movable ring body 42 are molded by the elastic sealing ring 4 in a one-piece manufacturing method, so that the movable ring body 42 can accumulate reset elastic force when it is absorbed by suction, and can be reset by the accumulation when it is not absorbed by suction. Elastic automatic rebound reset. In this way, the movable ring body 42 can achieve the effect of automatic reset without the assistance of additional components such as springs.

Referring to FIG. 11 and FIG. 12 , the overall structure of the second embodiment of the leveling device 200 of the present invention is substantially the same as that of the first embodiment, except for the structure of the pressing part 52 ′ of the pressing mechanism 5 .

In the second embodiment, the pressing part 52 ′ includes a plurality of pressing strips 521 arranged in a ring shape at equiangular intervals and accommodated in the positioning ring groove 511 . Each pressing bar 521 is in the shape of an arc and is used for pressing on the portion of the top surface 12 of the substrate 1 adjacent to the outer peripheral edge 13 . In this way, the effect of pressing the substrate 1 to initially level the substrate 1 can also be achieved.

To sum up, the leveling device 200 of each embodiment can initially level the substrate 1 by pressing down the substrate 1 through the pressing parts 52 and 52 ′, so as to reduce the degree of warping of the substrate 1 and the height of the outer peripheral edge 13 . The pressing parts 52, 52' do not directly flatten the substrate 1 but keep the distance d between the outer peripheral edge 13 and the carrying top surface 241, thereby preventing the pressing part 52 from causing damage to the substrate 1 in the process of pressing down on the substrate 1. damaged. By cooperating with the pressing parts 52, 52', the stage 2, the vacuum mechanism 3 and the elastic sealing ring 4, the effect of further leveling the substrate 1 can be achieved, so that the substrate 1 can be flattened and firmly positioned on the carrier top surface 241 , so the purpose of the present invention can really be achieved.

But what is described above is only an embodiment of the present invention, and should not limit the scope of the present invention. All simple equivalent changes and modifications made according to the patent scope of the present invention and the content of the patent specification are still within the scope of the present invention. Within the scope covered by the patent of the present invention.

1: Substrate

11: bottom surface

12: top surface

13: Outer periphery

14: Concave

200: leveling device

2: carrier

21: lower surface

22: Upper surface

23: positioning ring groove

24: Disk body

241: Load top surface

242: around the surface

25: Inhalation channel

251: Center slot

252: Inner ring groove

253: Outer ring groove

254: long groove

255: stomata

3: Vacuum mechanism

31: Vacuum source

32: Connect the pipeline

4: Elastic sealing ring

41: positioning ring body

411: ring top surface

412: inner peripheral surface

42: Movable ring body

421: inner ring surface

422: top

5: Press mechanism

51: Bearing ring

511: positioning ring groove

52, 52': pressed parts

521: pressed bar

6: Airlock

d: distance

D: Down direction

S1~S4: Leveling steps

Other features and effects of the present invention will be clearly presented in the implementation manner with reference to the drawings, wherein: Fig. 1 is a three-dimensional exploded view of the first embodiment of the leveling device of the present invention and a base plate; Fig. 2 is a three-dimensional exploded view of the first embodiment; Fig. 3 is a three-dimensional exploded view of the first embodiment viewed from another perspective; Fig. 4 is an incomplete sectional view of the first embodiment and the substrate; Fig. 5 is a flow chart of a leveling step of the leveling method of the first embodiment; Fig. 6 is an incomplete sectional view of the first embodiment and the substrate; Fig. 7 is an incomplete top view of the first embodiment and the substrate; Fig. 8 is an incomplete sectional view of the first embodiment and the substrate; Fig. 9 is an incomplete top view of the first embodiment and the substrate; Fig. 10 is an incomplete sectional view of the first embodiment and the substrate; Fig. 11 is a three-dimensional exploded view of a pressing mechanism of the second embodiment of the leveling device of the present invention; and FIG. 12 is a cross-sectional view of the second embodiment and the substrate.

1: Substrate

11: bottom surface

12: top surface

13: Outer periphery

14: Concave

200: leveling device

2: carrier

25: Inhalation channel

253: Outer ring groove

254: long groove

4: Elastic sealing ring

42: Movable ring body

5: Press mechanism

51: Bearing ring

Claims (18)

A leveling device suitable for leveling a substrate, the leveling device comprising: a stage for carrying and absorbing the substrate; a pressing part, arranged above the stage, for pressing down the substrate so that an outer peripheral edge of the substrate is close to the stage; and An elastic sealing ring is arranged on the carrier and can be absorbed by the carrier. When the pressed part presses the substrate and the elastic sealing ring is absorbed by the carrier, the elastic sealing ring is closely attached to the carrier and the carrier. The outer peripheral edge of the substrate, so that an airtight chamber is formed between the elastic sealing ring, the stage and the substrate, and the airtight chamber is then evacuated by the stage to form a vacuum state to absorb the substrate, so that the substrate is completely flat on the platform. The leveling device as described in claim 1, wherein the platform has a surrounding surface, and the platform defines an annular outer ring groove adjacent to the surrounding surface, and the elastic sealing ring has a surrounding surface The movable ring body surrounding the surface and the outer ring groove, when the pressing part presses the substrate, the movable ring body surrounds the outer peripheral edge of the substrate, and when the elastic sealing ring is absorbed by the carrier, the movable ring The body is closely attached to the surrounding surface and the outer peripheral edge. The leveling device according to claim 2, wherein the movable ring pivots between an initial position and an attached position, and when the movable ring is at the initial position, the movable ring and the surrounding surface , the outer ring groove and the outer peripheral edge are spaced apart, when the movable ring body is absorbed by the outer ring groove and pivoted from the initial position to the attaching position, the movable ring body is closely attached to the surrounding surface and the outer peripheral edge and seal the outer ring groove. The leveling device according to claim 3, wherein the elastic sealing ring also has a positioning ring body arranged on the platform, the positioning ring body has a ring top surface and an inner peripheral surface, and the movable ring body is formed by the The top surface of the ring adjacent to the inner peripheral surface integrally faces upwards and extends obliquely away from the surrounding surface of the carrier. The movable ring body can be bent and deformed relative to the positioning ring body so as to be in the initial position and the attached position. pivot between. The leveling device as claimed in claim 4, wherein the movable ring body has a top end, and when the movable ring body is at the initial position, the height of the top end is higher than the height of the outer ring groove and the outer peripheral edge. The leveling device according to any one of claims 2 to 5, wherein the movable ring body has an inner ring surface facing the outer ring groove and capable of being absorbed by the outer ring groove, and the inner ring surface is used for The outer ring groove is tightly attached to the surrounding surface of the stage and the outer peripheral edge of the substrate. The leveling device as claimed in claim 1, wherein the platform defines an outer ring groove that is circular and is used to absorb the elastic sealing ring, and the elastic sealing ring has a groove facing the outer ring and can be The outer ring groove is adsorbed by the inner ring surface, and the inner ring surface is used to closely adhere to the carrier and the outer peripheral edge of the substrate, thereby sealing the outer ring groove. The flattening device as claimed in claim 1, wherein the stage has a top surface for carrying the substrate, and when the pressed part presses the substrate, there is a gap between the outer peripheral edge of the substrate and the top surface separated by a distance. The leveling device as claimed in claim 8, wherein the distance is between 1mm and 2mm. The flattening device as claimed in claim 1, wherein the pressing piece comprises a ring-shaped pressing bar for pressing the substrate. The flattening device as claimed in claim 1, wherein the pressed piece comprises a plurality of pressed strips, and the pressed strips are arranged at equal angles and spaced apart in a ring shape, and are used to press the substrate. A leveling method suitable for leveling a substrate, the leveling method comprising the following steps: placing the substrate on a stage; driving a pressing member to press down the substrate so that an outer peripheral edge of the substrate is close to the stage and surrounded by an elastic sealing ring; driving the stage to absorb the elastic sealing ring, so that the elastic sealing ring is closely attached to the stage and the outer peripheral edge, so that an airtight chamber is formed between the elastic sealing ring, the stage and the substrate; and The airtight chamber is evacuated through the stage to form a vacuum state in the airtight chamber, and then the substrate is sucked and flatly attached to the stage completely. The leveling method according to claim 12, wherein the elastic sealing ring surrounds a surrounding surface of the carrier through a movable ring body, and the carrier passes through a circular outer ring groove adjacent to the surrounding surface The groove absorbs an inner ring surface of the movable ring body, so that the inner ring surface is closely attached to the surrounding surface and the outer peripheral edge, and seals the outer ring groove. The leveling method according to claim 13, wherein the elastic sealing ring is arranged on the platform through a positioning ring body, the positioning ring body has a ring top surface and an inner peripheral surface, and the movable ring body is formed by the ring top The surface adjacent to the inner peripheral surface is integrally upward and extends obliquely away from the surrounding surface of the carrier, and the movable ring can be bent and deformed relative to the positioning ring to be between an initial position and an attached position pivot. The leveling method as claimed in claim 12, wherein when the pressed part presses the substrate, there is a distance between the outer peripheral edge and a carrying top surface of the stage carrying the substrate. The leveling method according to claim 15, wherein the distance is between 1mm and 2mm. The flattening method as claimed in claim 12, wherein driving the pressing part to press down the substrate is pressing the substrate through a ring-shaped pressing bar of the pressing part. The flattening method as claimed in claim 12, wherein driving the pressing part to press the substrate downward is to press the substrate through a plurality of pressing bars of the pressing part, and the pressing bars are arranged in a ring at equal angles and spaced apart shape.

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