CN213752671U - Bearing device and semiconductor processing equipment - Google Patents

Abstract

The application discloses a bearing device and semiconductor processing equipment. The bearing device comprises a bearing piece, a pressing piece and an air path. The bearing piece is provided with a cavity, the cavity comprises a bearing surface, and the bearing surface is provided with an air groove. The pressing piece is used for pressing a first area of the workpiece on the bearing surface, a second area of the workpiece corresponds to the cavity and is spaced from the bottom surface of the cavity, and the first area surrounds the second area. The side wall of the cavity is provided with a gas circuit which is communicated with the gas groove and used for pumping so as to adsorb the workpiece on the bearing surface. When the bearing device needs to process the back of the workpiece, the back of the workpiece faces upwards, the front of the workpiece faces downwards, and the workpiece is borne on the bearing surface. Therefore, on one hand, the back of the workpiece faces upwards, so that the workpiece can be conveniently subjected to other processing such as optical detection and the like; on the other hand, the first area on the front surface of the workpiece is borne on the bearing surface, and the second area on the front surface of the workpiece is spaced from the bottom surface of the cavity, so that the probability of pollution and defects to the workpiece in the treatment process can be reduced.

Description

Bearing device and semiconductor processing equipment

Technical Field

The present application relates to the field of semiconductor technology, and more particularly, to a carrier and a semiconductor processing apparatus.

Background

The semiconductor chip manufacturing process is complicated and complicated, and the former process affects the results of the latter process. If a certain process is unqualified or contaminated, the following processes may be affected, and serious contamination may require thorough cleaning of the machine, which adds a great deal of cost to the enterprise. Therefore, a qualified semiconductor chip requires each process to ensure a certain yield requirement, and therefore, the semiconductor chip needs to be comprehensively detected, including back detection of the semiconductor chip, and detection of whether the back has defects such as adhesive residue and bubbles.

Most of the existing semiconductor processing equipment supports processing of the front and edge of the wafer, for example, the front and edge of the wafer are detected, and during the detection, the front of the wafer is upward and the back of the wafer is downward and is placed on the bearing device. However, the carrying device does not support backside detection, and if the front side of the wafer to be detected is placed on the carrying device, the front side of the wafer is inevitably damaged when the carrying device contacts with the front side of the wafer. Therefore, the carrying device needs to be improved, and the carrying device is suitable for back detection.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a bearing device. The bearing device comprises a bearing piece, a pressing piece and an air path. The bearing piece is provided with a cavity, the cavity comprises a bearing surface, and the bearing surface is provided with an air groove. The pressing piece is used for pressing a first area of a workpiece on the bearing surface, a second area of the workpiece corresponds to the cavity and is spaced from the bottom surface of the cavity, and the first area surrounds the second area. The side wall of the cavity is provided with the air path, and the air path is communicated with the air groove and used for pumping air so as to adsorb the workpiece on the bearing surface.

In certain embodiments, the carrier further comprises a drive member. The driving piece is connected with the pressing piece and used for driving the pressing piece to move relative to the bearing piece so as to selectively press or release the workpiece.

In certain embodiments, the drive member comprises a plurality. The driving pieces are symmetrically distributed about the center of the pressing ring of the pressing piece.

In certain embodiments, the compression member comprises a compression ring. The pressing ring is connected with the driving piece, and the driving piece is used for driving the pressing ring to move relative to the bearing piece so as to enable the workpiece to be tightly pressed on the bearing surface.

In certain embodiments, the compression member further comprises a compression post. The compression column is arranged on one side, close to the bearing piece, of the compression ring and used for compressing the first area on the bearing surface.

In some embodiments, the compression leg is annular and corresponds to the bearing surface.

In some embodiments, the compression posts comprise a plurality of compression posts that are evenly distributed around a center of the compression ring.

In some embodiments, the gas circuit is provided with a control valve for controlling the flow and/or velocity of the gas in the gas circuit.

In some embodiments, the predetermined pressure range of the gas path is [ -80kPa, -50kPa ].

In some embodiments, the carrying device further includes a controller, the air path is provided with a pressure sensor, the pressure sensor is used for detecting the air pressure of the air path, and the controller is used for controlling the air pumping unit to adjust the air pressure in the air path to a preset pressure range according to the detected air pressure.

In some embodiments, the number of the cavities is multiple, multiple cavities with gradually increasing sizes are sequentially formed from the center to the periphery of the carrier, multiple workpieces with different sizes can be carried on the carrying surfaces of the multiple cavities, and the cavities with the largest sizes are located on the bottom surfaces of the cavities with the previous larger size; the number of the pressing pieces is multiple, and each pressing piece corresponds to one bearing surface of the cavity.

In some embodiments, the bearing surface of the cavity outside the largest dimension is flush with the bottom surface of the cavity of the previous larger dimension.

In some embodiments, the bearing surface of the cavity outside the largest dimension is lower than the bottom surface of the cavity of the previous larger dimension and higher than the bearing surface of the cavity of the next smaller dimension.

In some embodiments, the load-bearing surface of the cavity outside the largest dimension is higher than the floor of the cavity of the previous larger dimension and lower than the workpiece supported on the load-bearing surface of the cavity of the previous larger dimension.

In some embodiments, the bearing device further comprises a rotating shaft, wherein the bearing surface is located on the first side. The rotating shaft is installed on the second side of the bearing piece and used for driving the bearing piece to rotate.

The application also provides a semiconductor processing device. The semiconductor processing equipment comprises a processing device and the bearing device of any one of the above embodiments, wherein the processing device corresponds to the bearing device and is used for processing the workpiece borne on the bearing device.

When the carrying device and the semiconductor processing equipment in the embodiment of the application need to process the back surface of the workpiece, the back surface of the workpiece can be upward, and the front surface of the workpiece can be downward and carried on the carrying surface. Therefore, on one hand, the back of the workpiece faces upwards, so that the workpiece can be conveniently subjected to other processing such as optical detection and the like; on the other hand, the first area of the front surface of the workpiece is loaded on the loading surface, and the loading surface supports the whole weight of the workpiece, so that the second area of the front surface of the workpiece corresponding to the cavity is spaced from the bottom surface of the cavity, and only the edge part of the workpiece is contacted with the loading member, thereby reducing the pollution to the workpiece and the probability of causing defects in the processing process. In addition, the bearing device further sucks air through the air passage to adsorb the first area of the workpiece on the bearing surface, and presses the first area of the workpiece on the bearing surface through the pressing piece, so that the workpiece is prevented from warping, the surface of the whole workpiece is located on the same plane, and the processing precision of the workpiece is guaranteed.

Additional aspects and advantages of embodiments of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a perspective view of a load bearing device according to certain embodiments of the present disclosure;

FIG. 2 is an exploded perspective view of a carrier according to certain embodiments of the present disclosure;

FIG. 3 is a schematic cross-sectional view of a portion of the structure of a carrier of the carrier device of certain embodiments of the present application;

FIG. 4 is a schematic cross-sectional view of a portion of the structure of a carrier of the carrier device of certain embodiments of the present application;

FIG. 5 is a schematic cross-sectional view of a portion of the structure of a carrier of the carrier device of certain embodiments of the present application;

FIG. 6 is a schematic illustration of a workpiece structure according to certain embodiments of the present application;

fig. 7 is a schematic perspective view of a semiconductor processing apparatus according to certain embodiments of the present application.

Detailed Description

Embodiments of the present application will be further described below with reference to the accompanying drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout.

In addition, the embodiments of the present application described below in conjunction with the accompanying drawings are exemplary and are only for the purpose of explaining the embodiments of the present application, and are not to be construed as limiting the present application.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the market, the requirement on the processing precision of workpieces is higher, for example, when the workpieces are detected, the defects on the front sides of the workpieces and the defects on the back sides of the workpieces need to be detected. However, most of the existing bearing devices for bearing the workpiece are flat surfaces, and the workpiece is directly placed on the flat surfaces, which inevitably causes one surface of the workpiece to be in physical contact with the flat surfaces, and further causes the contact surfaces of the workpiece and the flat surfaces to be polluted and defective. In addition, when the conventional semiconductor processing equipment processes a thin workpiece, any part of the workpiece is warped, thereby affecting the processing precision.

In order to solve the above technical problem, please refer to fig. 1 to 3 and fig. 6, a carrying device 100 is provided. The carrier device 100 includes a carrier 10, a pressing member 20 and an air passage 30. The bearing member 10 has a cavity 13, the cavity 13 includes a bearing surface 1303, and the bearing surface 1303 has an air groove 1304. The pressing member 20 is used for pressing the first region 401 of the workpiece 400 on the bearing surface 1303, the second region 402 of the workpiece 400 corresponds to the cavity 13 and is spaced from the bottom surface 1301 of the cavity 13, and the first region 401 surrounds the second region 402. The side wall 1302 of the cavity 13 is provided with a gas path 30, and the gas path 30 is communicated with the gas groove 1304 and used for pumping so as to adsorb the workpiece 400 on the bearing surface 1303.

When the back surface of the workpiece 400 needs to be processed, the carrying device 100 in the embodiment of the present application may face the back surface of the workpiece 400 upward, and face the front surface of the workpiece 400 downward and carry the workpiece on the carrying surface 1303. Therefore, on one hand, the back of the workpiece 400 faces upwards, so that other processing such as optical detection and the like can be conveniently carried out on the workpiece; on the other hand, since the first region 401 of the front surface of the workpiece 400 is supported on the bearing surface 1303, and the bearing surface 1303 supports the entire weight of the workpiece 400, so that the second region 401 of the front surface of the workpiece 400 corresponding to the cavity 13 is spaced from the bottom surface 1301 of the cavity 13, only the edge portion of the workpiece 400 is in contact with the bearing member 10, and the contamination and defect probability of the workpiece 400 during the processing process can be reduced. In addition, the bearing device 100 also sucks the first region 401 of the workpiece 400 on the bearing surface 1303 through the air passage 30, and presses the first region 401 of the workpiece 400 on the bearing surface 1303 through the pressing member 20, so that the workpiece 400 is prevented from warping, and the surface of the whole workpiece 400 is located on the same plane (for example, a horizontal plane), thereby ensuring the processing accuracy of the workpiece 400.

The following is further described with reference to the accompanying drawings.

Referring to fig. 1 to 3 and 6, the supporting device 100 includes a supporting member 10, a pressing member 20 and an air passage 30. The carrier 10 is used for carrying the workpiece 400, the pressing member 20 is used for pressing the first region 401 of the workpiece 400 on the carrier 10, and the air passage 30 is used for evacuating to adsorb the first region 401 of the workpiece 400 on the carrier 10. It should be noted that the workpiece 400 includes, but is not limited to, at least one of a wafer, a chip, a display screen, and an optical element. The first region 401 of the workpiece 400 surrounds the second region 402, i.e. the first region 401 of the workpiece 400 is an edge region of the workpiece 400; the second region 402 of the workpiece 400 is a region of the workpiece 400 other than the edge region.

Specifically, referring to fig. 2, the supporting member 10 includes a first side 11 and a second side 12 opposite to each other, and the first side 11 is closer to the pressing member 20 than the second side 12. The first side 11 of the carrier 10 is provided with a cavity 13. The cavity 13 includes a bottom surface 1301 and a sidewall 1302 extending from the bottom surface 1301 to the pressing member 20, and a bearing surface 1303 is disposed on a side of the sidewall 1302 away from the bottom surface 1301. A first region 401 of the workpiece 400 is carried on the bearing surface 1303 and a second region 402 of the workpiece 400 is spaced from the bottom surface 1301 in correspondence with the cavity 13. In this manner, only the edge portions of the workpiece 400 are in contact with the carrier 10, which reduces the chance of contamination and defects to the workpiece 400 during processing.

In some embodiments, when it is desired to process the backside of the workpiece 400, the backside of the workpiece 400 may be oriented upward and the front side of the workpiece 400 may be oriented downward and carried on the bearing surface 1303. Therefore, on one hand, the back of the workpiece 400 faces upwards, so that other processing such as optical detection and the like can be conveniently carried out on the workpiece; on the other hand, since the first region 401 of the front surface of the workpiece 400 is supported on the bearing surface 1303, and the bearing surface 1303 supports the entire weight of the workpiece, so that the second region 401 of the front surface of the workpiece 400 corresponding to the cavity 13 is spaced from the bottom surface 1301 of the cavity 13, only the edge portion of the workpiece 400 is in contact with the bearing member 10, and the contamination and defect probability of the workpiece 400 during the processing process can be reduced. Of course, in some embodiments, when the front side of the workpiece 400 needs to be processed, the front side of the workpiece 400 may be directed upward, and the back side of the workpiece 400 may be directed downward and loaded on the loading surface 1303, which is not described herein again.

Referring to fig. 2 and 3, the bearing surface 1303 is provided with an air groove 1304, the sidewall 1302 of the cavity 13 is provided with an air passage 30, the air passage 30 is communicated with the air groove 1304, and the air passage 30 is used for pumping air to adsorb the first region 401 of the workpiece 400 on the bearing surface 1303. In some embodiments, the carrying apparatus 100 may further include an air pumping unit 40, wherein the air path 30 is used for communicating the air pumping unit 40 with the air tank 1304, so that the air pumping unit 40 performs a vacuum process on the air path 30 to make the air pressure in the air tank 1304 negative, thereby adsorbing the first region 401 of the workpiece 400 on the carrying surface 1303. In this way, the carrier 10 can vacuum adsorb the workpiece 400, so as to avoid the workpiece 400 from warping, and thus, the workpiece 400 can be processed more accurately.

Referring to fig. 3, in some embodiments, the gas path 30 is further provided with a control valve (not shown) for controlling the flow rate and/or flow velocity of the gas in the gas path 30, so as to form negative pressure for the workpieces 400 with different sizes by using pumping manners with different flow rates and/or flow velocities, so that the workpieces 400 with different sizes can quickly and flatly adsorb the bearing surface 1303, thereby avoiding warpage and improving processing accuracy.

In some embodiments, the carrying apparatus 100 may further include a controller (not shown), a pressure sensor (not shown) is disposed in the air path 30, the pressure sensor may detect an air pressure of the air path 30, and the controller may control the pumping unit to adjust the air pressure in the air path 30 to a preset pressure range according to the air pressure of the air path 30. For example, when the pressure within the gas path 30 is less than a predetermined pressure range, the workpiece 400 may warp. At this time, the controller is required to control the air pumping unit 40 to increase the air pumping amount to increase the pressure in the air path 30, so that the pressure in the air path 30 is within the preset pressure range, and the workpiece 400 can be smoothly adsorbed on the bearing surface 1303, thereby avoiding warping. When the pressure in the gas path 30 is greater than the predetermined pressure range, the workpiece 400 may also warp. At this time, the controller is required to control the air pumping unit 40 to reduce the air pumping amount to reduce the pressure in the air path 30, so that the pressure in the air path 30 is within the preset pressure range, and the workpiece 400 can be smoothly adsorbed on the bearing surface 1303, thereby avoiding warping.

Specifically, the preset pressure range of the gas circuit 30 may be [ -80kPa, -50kPa ], for example, the pressure of the gas circuit 30 may be any one value or a value between any two values of-80 kPa, -75kPa, -70kPa, -65kPa, -60kPa, -55kPa, or-50 kPa. When the negative pressure of the gas circuit 30 is greater than 80kPa, the adsorption force of the gas circuit 30 to the workpiece 400 is too large, and the workpiece 400 can be damaged; when the negative pressure of the air path 30 is less than 50kPa, the suction force of the air path 30 to the workpiece 400 is too small to smoothly suck the workpiece 400. Therefore, when the air pressure of the air path 30 is-80 kPa to-50 kPa, the workpiece 400 can be smoothly adsorbed without damaging the workpiece 400.

In some embodiments, referring to fig. 2, the carrying device 100 may further include a driving member 50. The driving member 50 is connected to the pressing member 20 and is used to drive the pressing member 20 to move relative to the carrier 10 to selectively press or release the workpiece 400. For example, when it is desired to release the workpiece 400, the driving member 50 drives the pressing member 20 to move away from the carrier 10, so that the pressing member 20 moves away from the carrier 10, thereby releasing the workpiece 400; when the workpiece 400 needs to be pressed, the driving element 50 drives the pressing element 20 to move toward the carrier 10, so that the pressing element 20 approaches the carrier 10, and the first region 401 of the workpiece 400 is pressed on the bearing surface 1303.

Referring to fig. 2, the compressing member 20 may include a compression ring 201. The pressing ring 201 is connected with a driving member 50, and the driving member 50 is used for driving the pressing ring 201 to move relative to the bearing member 10 so as to press the workpiece 400 on the bearing surface 1303. It should be noted that the driving members 50 are disposed corresponding to the pressing members 20, the number of the driving members 50 corresponding to the same pressing member 20 may be 1, 2, 3, 4 or more, and when there are a plurality of driving members 50 corresponding to the same pressing member 20, the plurality of driving members 50 are symmetrically distributed with respect to the center of the pressing ring 201 of the corresponding pressing member 20. This facilitates smooth movement of the hold down member 20 under the drive of the drive member 50.

Referring to fig. 2, the pressing ring 201 includes a first side 2011 and a second side 2012 opposite to the first side 2011, and the second side 2012 of the pressing ring 201 is closer to the carrier 10 than the first side 2011. The compression member 20 may further comprise a compression column 202, the compression column 202 being arranged on a side of the compression ring 201 adjacent to the carrier 10, i.e. the compression column 202 is arranged on a second side 2012 of the compression ring 201. When the workpiece 400 needs to be pressed, the driving element 50 drives the pressing element 20 to move toward the direction close to the bearing element 10 until the pressing column 202 collides with the first area 401 of the workpiece 400 on the bearing surface 1303, so as to press the first area 401 of the workpiece 400 on the bearing surface 1303.

Because the air passage 30 performs vacuum suction on the first region 401 of the workpiece 400 through the air groove 1304, the second region 402 of the workpiece 400 may bulge away from the carrier 10, and the pressing force applied by the pressing column 202 to the workpiece 400 when pressing the first region 401 of the workpiece 400 on the bearing surface 1303 is beneficial to solving the warpage problem of the second region 402 of the workpiece 400, and simultaneously, the surface of the whole workpiece 400 can be located on the same plane, so that only one focusing is needed when processing the workpiece 400, for example, detecting the workpiece 400, thereby improving the processing (detection) efficiency.

In some embodiments, the number of the pressing pillars 202 is one and annular, and corresponds to the bearing surface 1304, so that when the pressing member 20 approaches the carrier 10, the pressing pillars 202 can press the first region 401 of the workpiece 400 against the bearing surface 1303. For example, if the bearing surface 1303 is a ring, the pressing pillars 202 are corresponding to the bearing surface 1303. When the bearing surface 1303 is an elliptical ring, polygonal ring, racetrack ring, etc., the pressing column 202 is an elliptical ring, polygonal ring, racetrack ring, etc. corresponding to the bearing surface 130, and is not limited herein. Because the pressing column 202 is annular and corresponds to the bearing surface 1304, the pressure applied to each position of the first region 401 of the workpiece 400 by the pressing column 202 is more uniform, and the damage to the workpiece 400 caused by the stress concentration effect when the workpiece 400 is pressed is avoided.

In some embodiments, the number of compression posts 202 is multiple, and the multiple compression posts 202 are evenly spaced around the center of the compression ring 201. Therefore, the pressure applied to all positions of the first area 401 of the workpiece 400 from the pressure column 202 can be more uniform, and the workpiece 400 is prevented from being damaged due to the stress concentration effect when the workpiece 400 is pressed. The number of the plurality of compression legs 202 may be 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc., which are not listed herein. The plurality of compression columns 202 can save a portion of material compared to one compression column 202 having a ring shape.

It should be noted that, in some embodiments, the pressure ring 201 and the pressure column 202 may be integrally formed; alternatively, the pressure ring 201 and the pressure column 202 are formed separately, and the pressure column 202 is fixedly attached to the pressure ring 201. So can make compression leg 202 and clamping ring 201 stable connection, avoid pressing 20 in-process, compression leg 202 drops from clamping ring 201. Of course, in some embodiments, the pressing ring 201 and the pressing columns 202 can be formed in a split structure, and the pressing columns 202 can be detachably mounted on the pressing ring 201, so that a required number of pressing columns 202 can be mounted on the pressing ring 201 as required, and meanwhile, the pressing columns 202 can be replaced conveniently.

In one embodiment, the pressure ring 201 may be made of a metallic material. The press ring 201 made of metal material has certain strength, is not easy to deform or damage under the driving of the driving part 30, and has a long service life. The metal press ring 201 also has a certain weight, and when the press ring 201 presses the workpiece 400, the press ring 201 can apply pressure to the workpiece 400 by the weight of the metal press ring 201 itself, so that the metal press ring 201 can press the workpiece 400 without applying too large driving force to the press ring 201 by the driving member 30. In another embodiment, the pressure ring 201 may be made of a non-metallic material. Static electricity is not easily generated on the pressing ring 201 made of the non-metal material, and damage to the workpiece 400 caused by the static electricity can be prevented. For example, when the workpiece 400 is a wafer, a circuit may be formed on the surface of the wafer, and if static electricity is generated on the pressure ring 201, the wafer is easily damaged by the static electricity when the pressure ring 201 contacts the wafer. Furthermore, the weight of the pressing ring 201 made of non-metallic material is light, so that the driving member 30 can easily drive the pressing ring 201 to move relative to the carrier 10.

Likewise, in one embodiment, the compression leg 202 may be made of a metallic material. The compression leg 202 made of metal material has certain strength, is not easy to deform or damage under the driving of the driving member 30, and has a long service life. The compression column 202 made of the metal material also has a certain weight, and when the compression column 202 compresses the workpiece 400, the compression column 202 can apply pressure to the workpiece 400 by means of the weight of the compression column 202, so that the driving member 30 can enable the compression column 202 to compress the workpiece 400 without applying too large driving force to the compression ring 201. In another embodiment, the compression leg 202 may be made of a non-metallic material. Static electricity is not easily generated on the compression leg 202 made of a non-metallic material, and damage to the workpiece 400 due to the static electricity can be prevented. For example, when the workpiece 400 is a wafer, the wafer surface may be provided with circuits, and if static electricity is generated on the pressing column 202, the wafer is easily damaged by the static electricity when the pressing column 202 contacts with the wafer. In addition, the compression column 202 made of non-metal material is light in weight, so that the driving member 30 can easily drive the compression ring 201 to move relative to the bearing member 10.

Referring to fig. 2, the supporting device 100 may further include a rotating shaft 80. The rotating shaft 80 is mounted on the second side 12 of the carrier 10 and is used to rotate the carrier 10. The rotation shaft 80 is provided to enable the rotation processing of the workpiece 400 by the semiconductor processing apparatus 300 (shown in fig. 7).

Referring to fig. 2, in some embodiments, the number of the cavities 13 may be multiple, and in this case, the number of the pressing members 20 may also be multiple, and one pressing member 20 corresponds to one cavity 13. Specifically, a plurality of cavities 13 with gradually increasing sizes are formed from the center to the peripheral side of the carrier 10, and the cavities 13 outside the largest size are located on the bottom surface 1301 of the previous cavity 13 with a larger size. That is, a plurality of cavities 13 having a size gradually increasing from the center to the peripheral side of the carrier 10 are formed, the second large-sized cavity 13 of the plurality of cavities 13 is disposed on the bottom surface 1301 of the maximum-sized cavity 13, and the third large-sized cavity 13 of the plurality of cavities 13 is disposed on the bottom surface 1301 of the second large-sized cavity 13. At this time, a plurality of workpieces 400 of different sizes can be carried on the carrying surface 1303 having the cavities 13 of corresponding sizes. The bearing device 100 comprises a plurality of pressing pieces 20, each pressing piece 20 corresponds to the bearing surface 1303 of one cavity 13, and each pressing piece 20 can press the workpiece 400 to the bearing surface 1303 of the corresponding cavity 13. In this way, the carrying device 100 of the present application can carry workpieces 400 with different sizes, thereby improving the utilization rate of the carrying device 100.

For example, the first cavity 131 and the second cavity 132 are formed from the center to the periphery of the carrier 10, the size of the first cavity 131 is gradually increased, that is, the size of the first cavity 131 is smaller than that of the second cavity 132, and the first cavity 131 is located on the bottom 1321 of the second cavity 132. The carrying surface 1311 of the first cavity 131 is used for carrying the workpiece 400 with the first size, and the air groove 1314 formed in the carrying surface 1311 of the first cavity 131 can be used for adsorbing the workpiece 400 with the first size. The carrying surface 1323 of the second cavity 132 is configured to carry the workpiece 400 having the second size, and the air slot 1324 formed on the carrying surface 1323 of the second cavity 132 is capable of adsorbing the workpiece 400 having the second size, where the first size is smaller than the second size. At this time, the carrying device 100 may include a first pressing member 21 and a second pressing member 22 at the same time, where the first pressing member 21 corresponds to the first cavity 131 and is used to press the workpiece 400 with the first size on the carrying surface 1311 of the first cavity 131; the second pressing member 22 corresponds to the second cavity 132, and is used for pressing the workpiece 400 with the second size onto the carrying surface 1323 of the second cavity 132. When the workpiece 400 with the first size needs to be inspected, the workpiece 400 with the first size is loaded on the loading surface 1313 of the first cavity 131, the air groove 1314 formed in the loading surface 1313 is configured to absorb the first region 401 of the workpiece 400 with the first size, and then the driving element 50 corresponding to the first pressing element 21 drives the first pressing element 21 to move toward the direction close to the loading element 10 until the pressing column 212 of the first pressing element 21 abuts against the workpiece 400, so as to press the first region 401 of the workpiece 400 with the first size against the loading surface 1313 of the first cavity 131. When the workpiece 400 with the second size needs to be inspected, the workpiece 400 with the second size is loaded on the loading surface 1323 of the second cavity 132, the air slot 1324 formed in the loading surface 1323 can be used for adsorbing the first area 401 of the workpiece 400 with the second size, and then the driving element 50 corresponding to the second pressing element 22 drives the second pressing element 22 to move toward the direction close to the loading element 10 until the pressing column 222 of the second pressing element 22 abuts against the workpiece 400, so as to press the first area 401 of the workpiece 400 with the second size onto the loading surface 1323 of the second cavity 132.

In some embodiments, when the bearing device 100 includes a plurality of pressing members 20, the pressing member 20 corresponding to the smaller-sized cavity 13 is disposed on a side of the pressing member 20 corresponding to the previous large-sized cavity 13, which is away from the bearing member 10, and the pressing ring 201 of the pressing member 20 is provided with a through hole 203, so that the pressing member 20 corresponding to the smaller-sized cavity 13 can partially pass through the through hole 203 of the pressing member 20 corresponding to the larger-sized body 13, so that the pressing column 202 of the pressing member 20 corresponding to the smaller-sized cavity 13 can abut against the workpiece 400 borne on the bearing member 10, so as to press the workpiece 400 against the bearing surface 1303 of the corresponding cavity 13. For example, in the above embodiment, the first pressing member 21 is farther from the carrier 10 than the second pressing member 22, the size of the pressing ring 211 of the first pressing member 21 is smaller than the size of the pressing ring 221 of the second pressing member 22, the pressing ring 221 of the second pressing member 22 is provided with the through hole 223, and the first pressing member 21 can partially penetrate through the through hole 223 of the second pressing member 22, so that when the workpiece 400 with the first size is detected, the pressing column 212 of the first pressing member 21 can abut against the workpiece 400 loaded on the loading surface 1313 of the first cavity 131 to press the workpiece 400 on the loading surface 1313 corresponding to the first cavity 131. Like this, same load bearing device 100 can bear the weight of not unidimensional work piece 400 to improve load bearing device 100's utilization ratio, a plurality of compressing tightly 20 only need reciprocate can realize compressing tightly or releasing to the work piece 400 on the carrier 10 simultaneously, compare in detect not unidimensional work piece 400 at every turn and need move the top that bears carrier 10 with compressing tightly 20 that corresponds from other position, greatly reduced load bearing device 100's the operation degree of difficulty.

In some embodiments, referring to fig. 2 and fig. 4, when the carrier 10 includes a plurality of cavities 13 with different sizes, the bearing surface 1303 of the cavity 13 outside the maximum size is flush with the bottom surface 1301 of the previous cavity 13 with a larger size. Illustratively, the first cavity 131 and the second cavity 132 are formed from the center to the peripheral edge of the carrier 10, i.e., the size of the first cavity 131 is smaller than that of the second cavity 132. The first cavity 131 is located on the bottom surface 1321 of the second cavity 132, and the supporting surface 1313 of the first cavity 131 is flush with the bottom surface 1321 of the second cavity 132, i.e. the supporting surface 1313 of the first cavity 131 and the bottom surface 1321 of the second cavity 132 are on the same plane, and the supporting surface 1323 of the second cavity 132 is higher than the supporting surface 1313 of the first cavity 131. This prevents the second region 402 of the second-sized workpiece 400 from contacting the carrying surface 1313 of the first cavity 131 when the second-sized workpiece 400 is carried on the carrying surface 1323 of the second cavity 132, thereby reducing contamination and defects to the workpiece 400 during processing.

In some embodiments, referring to fig. 2 and 3, when the carrier 10 includes a plurality of cavities 13 with different sizes, the bearing surface 1303 of the cavity 13 outside the maximum size is higher than the bottom surface 1301 of the previous cavity 13 with a larger size and lower than the workpiece 400 loaded on the bearing surface 1303 of the previous cavity 13 with a larger size. For example, the first cavity 131 and the second cavity 132 are formed from the center to the peripheral side of the carrier 10, wherein the size of the first cavity 131 is gradually increased, and the size of the second cavity 132 is smaller than the size of the first cavity 131. The first cavity 131 is located on the bottom surface 1321 of the second cavity 132, and the carrying surface 1313 of the first cavity 131 is higher than the bottom surface 1321 of the second cavity 132 but lower than the workpiece 400 carried on the carrying surface 1323 of the second cavity 132. That is, the carrying surface 1313 of the first cavity 131 is higher than the bottom surface 1321 of the second cavity 132, but when the first region 401 of the second-sized workpiece 400 is carried on the carrying surface 1323 of the second cavity 132, the second region 402 of the second-sized workpiece 400 is spaced apart from the carrying surface 1313 of the first cavity 131. Thus, the second region 402 of the workpiece 400 with the second dimension can be prevented from contacting the carrying surface 1313 of the first cavity 131 when the workpiece 400 with the second dimension is carried on the carrying surface 1323 of the second cavity 132, and the bottom surface 1321 of the second cavity 132 can be prevented from contacting the workpiece 400 when the workpiece 400 with the first dimension is carried on the carrying surface 1313 of the first cavity 131, so that the contamination and defect probability to the workpiece 400 during the processing process can be reduced.

In some embodiments, referring to fig. 2 and 5, when the carrier 10 includes a plurality of cavities 13 with different sizes, the bearing surface 1303 of the cavity 13 outside the maximum size is lower than the bottom surface 130 of the previous cavity 13 with a larger size and higher than the bearing surface 1303 of the next cavity 13 with a smaller size. Illustratively, a first cavity 131, a second cavity 132 and a third cavity 133 with gradually increasing sizes are formed from the center to one side of the periphery of the carrier 10, i.e., the size of the third cavity 133 is the largest; the second cavity 132 has the second largest dimension and the first cavity 131 has the smallest dimension. The first cavity 131 is located on the bottom surface 1321 of the second cavity 132, the second cavity 132 is located on the bottom surface 1331 of the third cavity 133, the supporting surface 1323 of the second cavity 132 is lower than the bottom surface 1331 of the third cavity 133, and the supporting surface 1323 of the second cavity 132 is higher than the supporting surface 1313 of the first cavity 131. Thus, the second region 402 of the workpiece 400 with the third dimension can be prevented from contacting the carrying surface 1323 of the second cavity 132 when the workpiece 400 with the third dimension is carried on the carrying surface 1333 of the third cavity 133, and the second region 402 of the workpiece 400 with the second dimension can be prevented from contacting the carrying surface 1313 of the first cavity 131 when the workpiece 400 with the second dimension is carried on the carrying surface 1323 of the second cavity 132, so that the contamination and defect probability of the workpiece 400 during the processing process can be reduced.

Referring to fig. 7, the present application further provides a semiconductor processing apparatus 300. The semiconductor processing apparatus 300 may include the processing device 200 and the carrier device 100 according to any of the above embodiments. The processing device 200 corresponds to the carrier device 100 and is used to process the workpiece carried on the carrier device 100. Workpieces include, but are not limited to, wafers, display screens, housings for electronic devices, chips, and the like. In one embodiment, the processing device 200 may be a detector, which may be used to detect defects in the workpieces carried on the carrier 100. In one embodiment, the processing device 200 may be an etching device, which may be used to etch a workpiece carried on the carrier 100. In another embodiment, the processing device 200 can also be a coating device, which can be used to evaporate, sputter, etc. a workpiece carried on the carrier 100. The processing device 200 may be of other types, which are not listed here, and all fall within the scope of the present application.

Referring to fig. 2 and fig. 3, in the semiconductor processing apparatus 300 of the embodiment of the present invention, when the back surface of the workpiece 400 needs to be processed, the back surface of the workpiece 400 faces upward, and the front surface of the workpiece 400 faces downward and is carried on the carrying surface 1303 of the carrying device 100. Therefore, on one hand, the back of the workpiece 400 faces upwards, so that other processing such as optical detection and the like can be conveniently carried out on the workpiece; on the other hand, since the first region 401 of the front surface of the workpiece 400 is supported on the bearing surface 1303, and the bearing surface 1303 supports the entire weight of the workpiece 400, so that the second region 401 of the front surface of the workpiece 400 corresponding to the cavity 13 is spaced from the bottom surface 1301 of the cavity 13, only the edge portion of the workpiece 400 is in contact with the bearing member 10, and the contamination and defect probability of the workpiece 400 during the processing process can be reduced. In addition, the semiconductor processing apparatus 300 further sucks air through the air passage 30 of the carrying device 100 to adsorb the first region 401 of the workpiece 400 on the carrying surface 1303, and presses the first region 401 of the workpiece 400 on the carrying surface 1303 through the pressing member 20 of the carrying device 100, so that the workpiece 400 is prevented from warping, the surface of the whole workpiece 400 is located on the same plane, and the processing precision is improved.

In the description herein, reference to the description of the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present application, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations of the above embodiments may be made by those of ordinary skill in the art within the scope of the present application, which is defined by the claims and their equivalents.

Claims (13)

1. A carrier, comprising:

the bearing piece is provided with a cavity, the cavity comprises a bearing surface, and the bearing surface is provided with an air groove;

the pressing piece is used for pressing a first area of a workpiece on the bearing surface, a second area of the workpiece corresponds to the cavity and is spaced from the bottom surface of the cavity, and the first area surrounds the second area; and

the side wall of the cavity is provided with a gas path, and the gas path is communicated with the gas groove and is used for pumping so as to adsorb the workpiece on the bearing surface.

2. The carrier as claimed in claim 1, further comprising:

the driving piece is connected with the pressing piece and is used for driving the pressing piece to move relative to the bearing piece so as to selectively press or release the workpiece.

3. The carrier as claimed in claim 2, wherein the drive member includes a plurality of drive members symmetrically distributed about a center of the compression ring of the compression member.

4. The carrier as claimed in claim 2 wherein the hold down member comprises:

the pressing ring is connected with the driving piece, and the driving piece is used for driving the pressing ring to move relative to the bearing piece so as to enable the workpiece to be tightly pressed on the bearing surface.

5. The carrier as claimed in claim 4 wherein the hold down member further comprises:

the compression ring is arranged on one side, close to the bearing piece, of the compression ring and used for compressing the first area on the bearing surface.

6. The carrier according to claim 5,

the pressing column is annular and corresponds to the bearing surface; or

The compression leg includes a plurality ofly, and is a plurality of the compression leg is around the center evenly distributed of clamping ring.

7. The carrier device according to claim 1, wherein the gas circuit is provided with a control valve for controlling the flow and/or velocity of the gas in the gas circuit.

8. The carrier as claimed in claim 1 wherein the predetermined pressure range of the air path is [ -80kPa, -50kPa ].

9. The carrying device according to claim 8, further comprising a controller, wherein the air path is provided with a pressure sensor, the pressure sensor is used for detecting the air pressure of the air path, and the controller is used for controlling the air pumping unit to adjust the air pressure in the air path to a preset pressure range according to the detected air pressure.

10. The carrier apparatus according to claim 1, wherein the number of the cavities is plural, a plurality of cavities with gradually increasing sizes are formed in sequence from the center to the periphery of the carrier, a plurality of workpieces with different sizes can be carried on the carrying surfaces of the plurality of cavities, and the cavities with the largest sizes are located on the bottom surfaces of the cavities with the largest sizes; the number of the pressing pieces is multiple, and each pressing piece corresponds to one bearing surface of the cavity.

11. The carrier of claim 10, wherein the cavity carrying surface outside the largest dimension is flush with the bottom surface of the cavity of the previous larger dimension; or

The bearing surface of the cavity out of the maximum size is lower than the bottom surface of the cavity with the former larger size and higher than the bearing surface of the cavity with the latter smaller size; or

The bearing surface of the cavity beyond the maximum dimension is higher than the bottom surface of the cavity with the previous larger dimension and lower than the workpiece borne on the bearing surface of the cavity with the previous larger dimension.

12. The carrier device of claim 1, wherein the carrier comprises a first side and a second side opposite to each other, the carrying surface being located on the first side, the carrier device further comprising:

the rotating shaft is installed on the second side of the bearing piece and used for driving the bearing piece to rotate.

13. A semiconductor processing apparatus, comprising:

a processing device; and

the carrier of any of claims 1-12, wherein the processing device corresponds to the carrier and is configured to process a workpiece carried on the carrier.

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