CN114823457A

CN114823457A - Bearing device, semiconductor processing equipment and using method of bearing device

Info

Publication number: CN114823457A
Application number: CN202110112439.3A
Authority: CN
Inventors: 陈鲁; 范铎; 张鹏斌; 张嵩
Original assignee: Shenzhen Zhongke Feice Technology Co Ltd
Current assignee: Shenzhen Zhongke Feice Technology Co Ltd
Priority date: 2021-01-27
Filing date: 2021-01-27
Publication date: 2022-07-29

Abstract

The application provides a bearing device, semiconductor processing equipment and a using method of the bearing device. The bearing device comprises a bearing part and an adjusting part. The bearing piece is provided with a groove, the side wall of the groove comprises a bearing surface, the bearing surface is provided with a first adsorption unit, the first adsorption unit is used for adsorbing a first area of the workpiece on the bearing surface, the groove corresponds to a second area of the workpiece, and the bottom wall of the groove is spaced from the second area of the workpiece; the adjusting piece comprises a second adsorption unit, the second adsorption unit is used for adsorbing the workpiece so that the flatness of the workpiece is within a preset range, and the adjusting piece can move so that the workpiece is clamped between the bearing piece and the adjusting piece. In the bearing device of this application, the first absorption unit that bears the weight of adsorbs the first district of work piece to the second absorption unit through the adjusting part carries out the level and smooth processing in advance to the work piece, guarantees the demand of subsequent processing to the work piece roughness, and then guarantees the treatment accuracy of semiconductor work piece.

Description

Bearing device, semiconductor processing equipment and using method of bearing device

Technical Field

The present disclosure relates to the field of semiconductor technologies, and more particularly, to a carrier device, a semiconductor processing apparatus, and a method for using the carrier device.

Background

At present, because the process and the use requirements of semiconductor workpieces are different, the thickness of the semiconductor workpieces is different from dozens of micrometers to hundreds of micrometers, when the thickness of the workpieces is thinner, the workpieces are easy to warp greatly due to the manufacturing process, and when the workpieces are placed on a bearing device, the workpieces can also droop and deform greatly due to the action of gravity because the thickness of the workpieces is thinner. For example, when the back surface of the patterned wafer is processed, the front surface of the patterned wafer cannot be adsorbed in a large area to process the back surface of the patterned wafer because the existing process pattern on the front surface of the patterned wafer cannot contact the carrying device. The bearing device can not ensure the flatness of the semiconductor workpiece, thereby influencing the processing precision of the semiconductor workpiece.

Disclosure of Invention

The embodiment of the application provides a bearing device, semiconductor processing equipment and a using method of the bearing device.

The bearing device of the embodiment of the application comprises a bearing piece and an adjusting piece. The bearing piece is provided with a groove, the side wall of the groove comprises a bearing surface, the bearing surface is provided with a first adsorption unit, the first adsorption unit is used for adsorbing a first area of a workpiece on the bearing surface, the groove corresponds to a second area of the workpiece, and the bottom wall of the groove is spaced from the second area of the workpiece; the adjusting piece comprises a second adsorption unit, the second adsorption unit is used for adsorbing the workpiece to enable the flatness of the workpiece to be within a preset range, and the adjusting piece can move to enable the workpiece to be clamped between the bearing piece and the adjusting piece.

In some embodiments, the adjustment member is disposed coaxially with the carrier.

In some embodiments, a sealed cavity is formed between the workpiece and the carrier when the workpiece is sandwiched between the carrier and the conditioning element.

In certain embodiments, the first adsorption unit comprises an annular first air groove disposed at the load-supporting surface.

In certain embodiments, the first adsorption unit comprises a plurality of first pores that are spaced apart from each other and uniformly distributed on the load-supporting surface.

In certain embodiments, the carrier device comprises a first drive member and/or a second drive member. The first driving piece is used for driving the adjusting piece to move and/or rotate; the second driving piece is used for driving the bearing piece to move and/or rotate.

In certain embodiments, the second adsorption unit includes a plurality of annular second air grooves provided in the conditioning member, each of the second air grooves being concentric.

In certain embodiments, the second adsorption unit comprises a plurality of second air holes, and the plurality of second air holes are spaced apart from each other and uniformly distributed.

In some embodiments, the conditioning element is a porous ceramic structure, and the second adsorption unit includes a plurality of second pores of the porous ceramic structure.

In some embodiments, the recess is circular and the bearing surface corresponds to the first region of the workpiece.

In some embodiments, the number of the grooves is multiple, a plurality of the grooves with gradually increasing sizes are formed in sequence from the center to the periphery of the carrier, the workpieces with different sizes can be carried on the carrying surfaces of the plurality of the grooves, and the grooves with the largest size outside are positioned on the bottom surfaces of the grooves with the larger size; the number of the adjusting pieces is multiple, and each adjusting piece corresponds to one bearing surface of the groove.

The present application further provides a semiconductor processing apparatus, which includes a processing device and the carrying device of any of the above embodiments, wherein the processing device corresponds to the carrying device and is configured to process a workpiece carried on the carrying device.

The application also provides a using method of the bearing device, which comprises the following steps: placing a workpiece on a bearing piece, enabling a first area of the workpiece to be located on a bearing surface of the bearing piece, and enabling a second area of the workpiece to correspond to a groove of the bearing piece and be spaced from the bottom wall of the groove; moving an adjusting piece to a first side of the workpiece, which is far away from the bearing piece, and forming a sealed cavity between a second side of the workpiece and the bearing piece, wherein the first side of the workpiece is opposite to the second side of the workpiece; adsorbing the workpiece by using a second adsorption unit of the adjusting piece so that the flatness of the workpiece is within a preset range; adsorbing a first region of the workpiece with a first adsorption unit on the bearing surface; and closing the second adsorption unit and moving away the adjusting piece, wherein the first adsorption unit keeps adsorbing the first area of the workpiece on the bearing surface.

The application also provides a using method of the bearing device, which comprises the following steps: placing a workpiece on the adjusting member; adsorbing the workpiece by using a second adsorption unit of the adjusting piece and enabling the flatness of the workpiece to be within a preset range; moving an adjusting piece to a first side of the workpiece, which is far away from the bearing piece, and enabling a first area of the workpiece to be located on a bearing surface of the bearing piece, and a second area of the workpiece to correspond to the groove of the bearing piece and be spaced from the bottom wall of the groove, wherein a sealed cavity is formed between the workpiece and the bearing piece, and the first side of the workpiece is opposite to the second side of the workpiece; adsorbing a first region of the workpiece with a first adsorption unit on the bearing surface; and closing the second adsorption unit and moving away the adjusting piece, wherein the first adsorption unit keeps adsorbing the first area of the workpiece on the bearing surface.

According to the bearing device, the semiconductor processing equipment and the using method of the bearing device, the first adsorption unit of the bearing device adsorbs the first area of the workpiece, the workpiece is subjected to pre-leveling treatment through the second adsorption unit of the adjusting piece, the requirement of subsequent treatment on the flatness of the workpiece is met, and the processing precision of the semiconductor workpiece is further met.

Additional aspects and advantages of embodiments of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic diagram of a carrier and workpiece configuration according to some embodiments of the present disclosure;

FIG. 2 is a perspective view of a carrier of the carrier device of certain embodiments of the present application;

FIG. 3 is a schematic cross-sectional view of a carrier of the carrier device of certain embodiments of the present application;

FIG. 4 is a schematic perspective view of a conditioning element of a load bearing device according to certain embodiments of the present application;

FIG. 5 is a schematic perspective view of a conditioning element of a load bearing device according to certain embodiments of the present application;

FIG. 6 is a schematic cross-sectional view of the carrier of FIG. 1 taken along line VI-VI;

FIGS. 7-9 are schematic block diagrams of semiconductor processing equipment according to certain embodiments of the present application;

fig. 10-12 are flow charts of methods of using a carrier according to certain embodiments of the present disclosure.

Detailed Description

Embodiments of the present application will be further described below with reference to the accompanying drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout.

In addition, the embodiments of the present application described below in conjunction with the accompanying drawings are exemplary and are only for the purpose of explaining the embodiments of the present application, and are not to be construed as limiting the present application.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1 and 4, a carrying device 100 of the present application includes a carrying component 10 and an adjusting component 20. The carrier 10 has a recess 11, the sidewall 12 of the recess 11 includes a carrying surface 121, the carrying surface 121 has a first adsorption unit 13, and the first adsorption unit 13 is used for adsorbing the first region 31 of the workpiece 30 onto the carrying surface 121. The recess 11 corresponds to the second region 32 of the workpiece 30, and the bottom wall 110 of the recess 11 is spaced from the second region 32 of the workpiece 30; the adjuster 20 includes a second suction unit 21, the second suction unit 21 is used for sucking the workpiece 30 to make the flatness of the workpiece 30 within a preset range, and the adjuster 20 can move to make the workpiece 30 clamped between the carrier 10 and the adjuster 20.

In the carrying device 100, the carrying component 10 can be used to carry various workpieces 30 for processing by the semiconductor processing apparatus 1000 (shown in fig. 8), wherein the workpieces 30 include, but are not limited to, wafers, chips, display screen panels, front covers of mobile phones, rear covers of mobile phones, VR glasses, AR glasses, smart watch covers, glasses, lenses, wood, iron plates, housings of any devices (e.g., mobile phone housings), and the like. At present, due to different processes and use requirements, the thickness of the workpiece 30 varies from tens of micrometers to hundreds of micrometers, when the workpiece 30 is thin, it is easy to generate a large warpage due to the manufacturing process, and when the workpiece is placed on the bearing device 100, it will also generate a large deformation due to gravity because of its thin thickness. For example, when processing the back surface of a patterned wafer, since the existing process pattern on the front surface of the patterned wafer cannot contact the carrier 100, and the front surface of the patterned wafer cannot be adsorbed in a large area to process the back surface of the patterned wafer, the carrier 100 cannot ensure the flatness of the workpiece 30, thereby affecting the processing accuracy of the workpiece 30.

Specifically, the second adsorption unit 21 is connected to an air extractor, and the air extractor adjusts the pressure inside the second adsorption unit 21, so that the second adsorption unit 21 can uniformly adsorb the back of the workpiece 30, and the flatness of the workpiece 30 is ensured within a preset range. For example, when the workpiece 30 is inspected, a preset range of flatness of the workpiece 30 is required to be [0.01mm, 0.5mm ], the pressure of the second adsorption unit 21 is adjusted to a negative pressure to adsorb the workpiece 30, and when the flatness of the workpiece 30 is in the range of [0.01mm, 0.5mm ], the adjustment of the pressure of the second adsorption unit 21 is stopped; when the workpiece 30 is cut, the preset range of the flatness of the workpiece 30 is required to be [0.01mm, 0.7mm ], the pressure of the second adsorption unit 21 is adjusted to a negative pressure to adsorb the workpiece 30, and when the flatness of the workpiece 30 is in the range of [0.01mm, 0.7mm ], the adjustment of the pressure of the second adsorption unit 21 is stopped. Specifically, the preset range of the flatness may be set according to the process or the characteristics of the workpiece 30 itself, so that the pressure of the second adsorption unit 21 is controlled to make the flatness of the workpiece 30 within the preset range.

In the carrying device 100 of the present application, the first adsorption unit 13 of the carrying member 10 adsorbs the first region 31 of the workpiece 30, and the second adsorption unit 21 of the adjusting member 20 performs a pre-leveling process on the workpiece 30, so as to ensure the requirement of the post-processing on the flatness of the workpiece 30, and further ensure the processing precision of the semiconductor workpiece 30.

The following is further described with reference to the accompanying drawings.

Referring to fig. 2, in some embodiments, the grooves 11 are circular, the grooves 11 correspond to the second region 32 of the workpiece 30, and the supporting surface 121 corresponds to the first region 31 of the workpiece 30. That is, the carrying surface 121 surrounds the recess 11, and the first region 31 surrounds the second region 32. For example, when the workpiece 30 with the process pattern is subjected to back (non-pattern) detection, the front surface of the workpiece 30 faces the groove 11, so that the front surface of the workpiece 30 is prevented from contacting the carrier 100, and the process pattern of the workpiece 30 is prevented from being scratched. In other embodiments, the groove 11 may also be in other regular or irregular shapes such as triangle, quadrangle, pentagon, hexagon, etc., and accordingly, the shape of the outer contour of the supporting member 10 and/or the shape of the outer contour of the adjusting member 20 may correspond to the shape of the groove 11, and may also be in other regular or irregular shapes such as triangle, quadrangle, pentagon, hexagon, etc. to be suitable for workpieces 30 with different shapes; alternatively, the outer contour of the carrier 10 and/or the outer contour of the adjustment member 20 are still circular as shown in fig. 1, and the shape of the bearing surface 121 is the shape of the rest of the circle except the shape of the groove 11 (triangle, quadrangle, pentagon, hexagon, etc. other regular or irregular shapes). Or the shape of the outer contour of the carrier 10 and/or the shape of the outer contour of the adjusting member 20 do not correspond to the shape of the recess 11, it is sufficient to ensure that the carrier 10 has the bearing surface 121 for bearing the first region 31 of the workpiece 30 and that the adjusting member 20 can completely absorb the entire surface of the workpiece 30.

With continued reference to fig. 2, in some embodiments, the number of the grooves 11 may be one, and the carrier 10 is used for carrying a workpiece 30 of one size. Correspondingly, the number of the adjusting members 20 is also one, and the size corresponds to the size of the workpiece 30 which can be carried by the carrier 10.

Referring to fig. 3, in some embodiments, the number of the grooves 11 may be multiple, the size of the grooves 11 gradually increases from the center to the periphery of the carrier 10, a plurality of workpieces 30 with different sizes can be carried on the carrying surfaces 121 corresponding to the grooves 11, and the grooves 11 outside the largest size are located on the bottom surface 111 of the previous groove 11 with a larger size. For example, the number of the grooves 11 is three, and in the vertical direction extending from the bearing surface 121a toward the bearing surface 121c, there are the grooves 11a, the grooves 11b, and the grooves 11c, respectively, the size (e.g., diameter) of the groove 11c is larger than the size (e.g., diameter) of the grooves 11b and the grooves 11c, the size (e.g., diameter) of the groove 11b is larger than the size (e.g., diameter) of the groove 11a, and the groove 11b is located where the bottom surface 111 of the groove 11c is located, that is, the groove 11b is located on the bearing surface 121a of the groove 11 a. The carrying surfaces 121 are suitable for workpieces 30 with different sizes, and when the workpieces 30 with different sizes are replaced, the carrying device 100 does not need to be replaced, so that the material is saved and the production requirement is met.

Correspondingly, the number of the adjusting members 20 is plural, and each adjusting member 20 corresponds to the bearing surface 121 of one of the grooves 11, so that when the bearing device 100 is used, the flatness of the workpiece 30 with the corresponding size can be ensured within a preset range.

For example, the bearing surface 121a corresponding to the groove 11a is suitable for a workpiece 30 with a size of 8 inches, and the corresponding conditioning element 20 performs a pre-smoothing process on the workpiece 30; the bearing surface 121b corresponding to the groove 11b is suitable for a workpiece 30 with the size of 12 inches, and the corresponding adjusting piece 20 performs pre-leveling treatment on the workpiece 30; the corresponding bearing surface 121c of the pocket 11c is adapted for a 16 "sized workpiece 30, and the corresponding conditioning element 20 pre-flattens the workpiece 30. The sizes of the carrier 10 are not limited to 8 inches, 12 inches and 16 inches, but may be 17 inches, 15 inches, 14 inches, 13 inches, 11 inches, 7 inches, 6 inches, 5 inches, 4 inches, 3 inches, 2 inches, 1 inch and the like, and the sizes of the carrier may be set according to the actual sizes of the workpieces 30.

Referring to fig. 1, in one embodiment, the first adsorption unit 13 may include a plurality of first air holes 131, and the plurality of first air holes 131 are spaced apart from each other and uniformly distributed on the supporting surface 121. Specifically, the suction pressure of the first air hole 131 can be adjusted by a suction pump communicated with the first air hole 131, so as to realize the absorption of the first area 31 of the workpiece 30 on the carrying surface 121. The first air holes 131 which are spaced from each other and evenly distributed can evenly adsorb the first area 31 of the workpiece 30, so that all parts of the first area 31 are evenly stressed, the first area 31 is prevented from warping, and meanwhile, the workpiece 30 can be stably adsorbed on the bearing piece 10 through the adsorption of the first air holes 131.

In another embodiment, the first adsorption unit 13 may include a first annular air groove (not shown) disposed on the bearing surface 121, that is, the first annular air groove on the bearing surface 121 is formed to be recessed downward. The annular first gas grooves may include one or more (two or more) annular first gas grooves, the annular first gas grooves are concentrically disposed on the bearing surface 121, and the annular first gas grooves can increase the adsorption area of the first region 31, so as to stably adsorb the first region 31 of the workpiece 30 on the bearing surface 121. Similarly, the suction of the first region 31 of the workpiece 30 on the bearing surface 121 may be achieved by adjusting the air pressure of the first air groove via a suction pump in communication with the annular first air groove.

Referring to fig. 4, in an embodiment, the second adsorption unit 21 may include a plurality of annular second air grooves 211 disposed on a surface of the adjusting member 20 facing the carrier 10, each of the annular second air grooves 211 is concentrically disposed, the adjusting member 20 may have an air path, the air path is communicated with the plurality of second air grooves 211, the second air grooves 211 are pumped by an air pumping device such as an air pump, and the pressure of the second air grooves 211 is adjusted to be a negative pressure, so as to adsorb the back surface of the workpiece 30, thereby implementing a pre-planarization process on the workpiece 30.

Referring to fig. 5, in another embodiment, the second adsorption unit 21 may further include a plurality of second air holes 212 disposed on a surface of the adjustment member 20 facing the carrier 10, the plurality of second air holes 212 are spaced from each other and uniformly disposed on the adjustment member 20, similarly, the adjustment member 20 may have an air path, the air path is communicated with the plurality of second air holes 212, the second air holes 212 are pumped by an air pumping device such as an air pump, and the pressure in the second air holes 212 is adjusted to be a negative pressure, so as to adsorb the back surface of the workpiece 30, thereby implementing a pre-leveling process on the workpiece 30.

In another embodiment, the adjusting member 20 is a porous ceramic structure, and the second adsorption unit 21 may include a plurality of second air holes 212 of the porous ceramic structure, since the porous ceramic is an insulating material, the electrostatic property can be dissipated when the adjusting member 20 of the porous ceramic structure adsorbs the workpiece 30, so as to prevent the workpiece 30 from being damaged or contaminated by the adjusting member 20 during the pre-planarization process.

Specifically, the adjustment member 20 ensures the flatness of the workpiece 30 within a preset range by adjusting the pressure inside the second adsorption unit 21. For example, assuming that the preset flatness range is [0.01mm, 0.5mm ], the pressure of the second adsorption unit 21 is adjusted to a negative pressure by the air-extracting device, and when the flatness of the workpiece 30 is in the [0.01mm, 0.5mm ] range, at this time, the adjustment of the pressure of the second adsorption unit 21 is stopped; when the flatness of the workpiece 30 is not in the range of [0.01mm, 0.5mm ], the pressure of the second adsorption unit 21 is continuously adjusted until the flatness of the workpiece 30 is adjusted to be in the range of [0.01mm, 0.5mm ] and the flatness of the workpiece 30 is maintained within a preset range. The flatness of the workpiece is within the range of 0.01mm and 0.5mm, which is acceptable by the equipment, if the flatness is more than 0.5mm, the detection equipment needs to focus again when detecting different areas of the workpiece to obtain an ideal result, thus the working efficiency is seriously influenced, the production requirement is not facilitated, and if the flatness is less than 0.01mm, an accurate electrical control assembly is needed, and the cost of the detection equipment is increased. When the flatness of the workpiece 30 is maintained within the predetermined range and then the adjustment member 20 is moved upward, the first adsorption unit 13 of the carrier 10 can stably adsorb the workpiece 30 onto the carrier 10 and ensure that the flatness of the workpiece 30 is maintained within the predetermined range, and at this time, the processing apparatus 200 (shown in fig. 8) of the semiconductor processing apparatus 1000 (shown in fig. 8) can perform inspection or processing or the like on the workpiece 30.

In some embodiments, the supporting member 10 and the adjusting member 20 are coaxially disposed, so that the movement of the adjusting member 20 can be reduced, and the adjusting member 20 only needs to be lifted and lowered by aligning with the supporting member 10 when moving, so that the second suction unit 21 can generate uniform suction force to uniformly suck the workpiece 30, and thus the flatness of the workpiece 30 can be efficiently adjusted within a predetermined range.

Referring to fig. 6, when the workpiece 30 is clamped between the carrier 10 and the adjustment member 20, a sealed cavity 40 is formed between the workpiece 30 and the carrier 10, and when the front surface of the workpiece 30 is placed toward the bottom wall 110 of the groove 11, the cavity 40 can avoid the process pattern on the front surface of the workpiece 30, so as to ensure the integrity of the process pattern on the front surface of the workpiece 30. At this time, the second adsorption unit 21 of the adjustment member 20 is opened and the flatness of the workpiece 30 is adjusted to be within a predetermined range, so that the processing device 200 (shown in fig. 8) of the semiconductor processing apparatus 1000 (shown in fig. 8) can perform processing operation on the workpiece 30, thereby improving the processing accuracy of the workpiece 30.

Further, referring to fig. 7, the supporting device 100 may further include a first driving member 50, and the first driving member 50 is used for driving the adjusting member 20 to move and/or rotate. Specifically, the first driving member 50 may be a motor, a cylinder, a hydraulic device, or the like, and drives the adjusting member 20 to move or rotate along at least one of the X-axis, the Y-axis, and the Z-axis shown in fig. 7. The first driving member 50 drives the adjusting member 20 to move and/or rotate, so that the adjusting member 20 and the bearing member 10 are coaxial, and thus the second adsorption unit 21 can generate uniform adsorption force to uniformly adsorb the workpiece 30, and further can efficiently adjust the flatness of the workpiece 30 within a preset range. Meanwhile, the adjusting member 20 is coaxial with the bearing member 10, so that the first adsorption unit 13 can accurately and uniformly adsorb the first region 31 of the workpiece 30, after the adjusting member 20 is removed, the adsorption force generated by the first adsorption unit 13 can still stably adsorb the workpiece 30 on the bearing member 10, and the flatness of the workpiece 30 can be ensured to be kept within a preset range.

Specifically, when the workpiece 30 is processed, the carrier 10 is separated from the adjustment member 20, that is, the adjustment member 20 is located at a high position relative to the carrier 10, the first side 33 (back side) of the workpiece 30 is first placed on the carrier 10 toward the adjustment member 20, due to the existence of the grooves 11, only the first region 31 of the workpiece 30 is in contact with the carrying surface 121, the second region 32 of the workpiece 30 corresponds to the grooves 11, and the region of the second side 34 (front side) of the workpiece 30 having the process pattern is kept out of contact. At this time, the adjuster 20 is moved by the first driving element 50 in the axial direction of the workpiece 30 toward the carrier 10, and since the first side 33 (back side) of the workpiece 30 faces the adjuster 20 and the first region 31 of the second side 34 (front side) of the workpiece 30 is supported on the supporting surface 121 of the carrier 10, a sealed cavity 40 is formed between the workpiece 30 and the carrier 10 when the workpiece 30 is clamped between the carrier 10 and the adjuster 20. At this time, the vacuum adsorption switch of the second adsorption unit 21 of the adjusting member 20 is turned on, the pressure of the second adsorption unit 21 is adjusted to be negative pressure, the workpiece 30 is completely adsorbed and leveled on the adjusting member 20, and the flatness of the workpiece 30 is adjusted to be within a preset range, and at this time, the workpiece 30 can be corrected and leveled due to the warpage of the workpiece 30 caused by the self-process and gravity. Then, the vacuum suction switch of the first suction unit 13 is turned on, and the pressure of the first suction unit 13 is adjusted to a negative pressure, so that the first zone 31 of the second side 34 (front surface) of the workpiece 30 is simultaneously sucked on the carrying surface 121. At this time, since the workpiece 30 has been pre-corrected to a flat state by the conditioning member 20, and the second side 34 (front side) first region 31 of the workpiece 30 is uniformly adsorbed on the carrying surface 121 in the flat state, the workpiece 30 can still maintain the flat state when the vacuum adsorption switch of the second adsorption unit 21 is turned off. Finally, the first driving member 50 drives the adjusting member 20 to move away from the supporting member 10, so as to perform a subsequent processing operation on the workpiece 30.

With reference to fig. 7, the supporting device 100 may further include a second driving member 60, wherein the second driving member 60 is used for driving the supporting member 10 to move and/or rotate. Specifically, the second driving member 60 may be a motor, a cylinder, a hydraulic device, or the like, and may drive the supporting member 10 to move or rotate along at least one of the X axis, the Y axis, and the Z axis shown in fig. 7. The second driving member 60 drives the bearing member 10 to move and/or rotate, so that the bearing member 10 and the adjusting member 20 are coaxial, and thus the second adsorption unit 21 can generate uniform adsorption force to uniformly adsorb the workpiece 30, and thus the flatness of the workpiece 30 can be efficiently adjusted to be within a preset range. Meanwhile, the carrier 10 is coaxial with the adjusting member 20, which enables the first adsorption unit 13 to accurately and uniformly adsorb the first region 31 of the workpiece 30, and after the carrier 10 is removed, the adsorption force generated by the first adsorption unit 13 can still stably adsorb the workpiece 30 on the carrier 10, and can ensure that the flatness of the workpiece 30 is kept within a preset range, so that the workpiece can be processed by the processing device 200 (shown in fig. 8) and the processing precision of the workpiece 30 is ensured. Specifically, when the workpiece 30 is processed, the carrier 10 is separated from the adjustment member 20, that is, the adjustment member 20 is located at a high position relative to the carrier 10, the first side 33 (back side) of the workpiece 30 is first placed on the carrier 10 toward the adjustment member 20, due to the existence of the grooves 11, only the first region 31 of the workpiece 30 is in contact with the carrying surface 121, the second region 32 of the workpiece 30 corresponds to the grooves 11, and the region of the second side 34 (front side) of the workpiece 30 having the process pattern is kept out of contact. At this time, the carrier 10 is moved by the second driving element 60 in the axial direction of the workpiece 30 toward the adjusting member 20, and the first side 33 (back side) of the workpiece 30 faces the adjusting member 20, and at the same time, the first region 31 of the second side 34 (front side) of the workpiece 30 is supported on the supporting surface 121 of the carrier 10, so that when the workpiece 30 is clamped between the carrier 10 and the adjusting member 20, a sealed cavity 40 is formed between the workpiece 30 and the carrier 10. At this time, the vacuum adsorption switch of the second adsorption unit 21 of the adjusting member 20 is turned on, the pressure of the second adsorption unit 21 is adjusted to be negative pressure, the workpiece 30 is completely adsorbed and leveled on the adjusting member 20, and the flatness of the workpiece 30 is adjusted to be within a preset range, and at this time, the warping of the workpiece 30 due to the self-process and gravity can be corrected and leveled. Then, the vacuum suction switch of the first suction unit 13 is turned on, and the pressure of the first suction unit 13 is adjusted to a negative pressure, so that the first zone 31 of the second side 34 (front surface) of the workpiece 30 is simultaneously sucked on the carrying surface 121. At this time, since the workpiece 30 has been pre-corrected to a flat state by the conditioning member 20, and the second side 34 (front side) first region 31 of the workpiece 30 is uniformly adsorbed on the carrying surface 121 in the flat state, the workpiece 30 can still maintain the flat state when the vacuum adsorption switch of the second adsorption unit 21 is turned off. Finally, the second driving member 60 drives the bearing member 10 to move in a direction away from the adjusting member 20, and at this time, the first adsorbing unit 13 still adsorbs the workpiece 30, so that the second driving member 60 can drive the bearing member 10 and the workpiece 30 to move together, and the subsequent processing operation on the workpiece 30 can be performed.

Referring to fig. 7, the carrying device 100 may further include a first driving member 50 and a second driving member 60. The first driving member 50 is used for driving the adjusting member 20 to move and/or rotate, and the second driving member 60 is used for driving the carrier 10 to move and/or rotate. Specifically, the first driving member 50 and the second driving member 60 can be driven by a motor, a cylinder, a hydraulic pressure, etc., and can respectively drive the adjusting member 20 and the supporting member 10 to move or rotate along at least one of the X-axis, the Y-axis, and the Z-axis shown in fig. 7. The first driving member 50 and the second driving member 60 can be simultaneously turned on, that is, while the first driving member 50 drives the adjusting member 20 to move and/or rotate, the second driving member 60 drives the supporting member 10 to move and/or rotate, and controls the adjusting member 20 and the supporting member 10 to be coaxial, so that the second adsorption unit 21 can generate uniform adsorption force to uniformly adsorb the workpiece 30, and thus the flatness of the workpiece 30 can be efficiently adjusted to be within a preset range. Meanwhile, the adjusting member 20 is coaxial with the bearing member 10, so that the first adsorption unit 13 can accurately and uniformly adsorb the first region 31 of the workpiece 30, after the adjusting member 20 is removed, the adsorption force generated by the first adsorption unit 13 can still stably adsorb the workpiece 30 on the bearing member 10, and the flatness of the workpiece 30 can be ensured to be kept within a preset range.

Similarly, when the workpiece 30 is processed, the carrier 10 is separated from the conditioning element 20, i.e., the conditioning element 20 is located at a high position relative to the carrier 10, the first side 33 (back side) of the workpiece 30 can be placed on the carrier 10 toward the conditioning element 20, only the first region 31 of the workpiece 30 is in contact with the carrying surface 121 due to the existence of the grooves 11, the second region 32 of the workpiece 30 corresponds to the grooves 11, and the region of the second side 34 (front side) of the workpiece 30 having the process pattern is kept out of contact. At this time, the first driving element 50 drives the adjusting element 20 to move and/or rotate, and the second driving element 60 drives the bearing element 10 to move and/or rotate, so as to save the coaxial adjusting time and improve the coaxial adjusting efficiency, thereby shortening the time of the whole processing process and improving the processing efficiency. Since the first side 33 (back side) of the workpiece 30 faces the adjuster 20, and the first region 31 of the second side 34 (front side) of the workpiece 30 is supported on the supporting surface 121 of the carrier 10, a sealed cavity 40 is formed between the workpiece 30 and the carrier 10 when the workpiece 30 is sandwiched between the carrier 10 and the adjuster 20. At this time, the vacuum adsorption switch of the second adsorption unit 21 of the adjusting member 20 is turned on, the pressure of the second adsorption unit 21 is adjusted to be negative pressure, the workpiece 30 is completely adsorbed and leveled on the adjusting member 20, and the flatness of the workpiece 30 is adjusted to be within a preset range, and at this time, the warping of the workpiece 30 due to the self-process and gravity can be corrected and leveled. Then, the vacuum suction switch of the first suction unit 13 is turned on, and the pressure of the first suction unit 13 is adjusted to a negative pressure, so that the first zone 31 of the second side 34 (front surface) of the workpiece 30 is simultaneously sucked on the carrying surface 121. At this time, since the workpiece 30 has been pre-corrected to a flat state by the conditioning member 20, and the second side 34 (front side) of the workpiece 30 is uniformly adsorbed on the bearing surface 121 in the flat state, the workpiece 30 can still maintain the flat state when the vacuum adsorption switch of the second adsorption unit 21 is turned off. Finally, the first driving member 50 drives the adjusting member 20 to move away from the supporting member 10 and/or the second driving member 60 drives the supporting member 10 to move away from the adjusting member 20, so as to facilitate the processing device 200 (shown in fig. 8) to process the workpiece 30; meanwhile, the second driving member 60 can drive the carrying member 10 to move, so that the semiconductor processing apparatus 1000 (shown in fig. 8) is located at the focusing position when processing (e.g., optical detection) the workpiece 30, thereby improving the processing precision of the workpiece 30; or the second driving member 60 can drive the supporting member 10 to rotate, so as to perform a rotational processing (e.g. inspecting, coating, etching, cutting) on the workpiece 30.

Referring to fig. 8, the present application further provides a semiconductor processing apparatus 1000, wherein the semiconductor processing apparatus 1000 includes a processing device 200 and the carrying device 100 of any of the above embodiments, and the processing device 200 corresponds to the carrying device 100 and is configured to process the workpiece 30 carried on the carrying device 100.

In one embodiment, the processing device 200 may be a detector, which may be used to detect defects in the workpieces 30 carried on the carrier 100. In one embodiment, the processing device 200 may be an etching device that may be used to etch the workpiece 30 carried on the carrier 100. In another embodiment, the processing device 200 can also be a coating device that can be used to evaporate, sputter, etc. the workpiece 30 carried on the carrier 100. The processing device 200 may be of other types, which are not listed here, and all fall within the scope of the present application.

Referring to fig. 8 and 10, the present application further provides a method for using the carrying device 100, the method comprising:

01: placing the workpiece 30 on the carrier 10 such that the first region 31 of the workpiece 30 is located on the carrying surface 121 of the carrier 10, and the second region 32 of the workpiece 30 corresponds to the groove 11 of the carrier 10 and is spaced from the bottom wall 110 of the groove 11;

02: moving the adjuster 20 to a first side 33 of the workpiece 30 away from the carrier 10 and forming a sealed cavity 40 between a second side 34 of the workpiece 30 and the carrier 10, the first side 33 of the workpiece 30 being opposite the second side 34 of the workpiece 30;

03: adsorbing the workpiece 30 by using the second adsorption unit 21 of the adjustment member 20 so that the flatness of the workpiece 30 is within a preset range;

04: adsorbing a first area 31 of the workpiece 30 by using the first adsorption unit 13 on the bearing surface 121; and

05: the second suction unit 21 is closed and the adjustment member 20 is removed, and the first suction unit 13 keeps sucking the first region 31 of the workpiece 30 on the carrying surface 121.

Specifically, when the workpiece 30 is processed, the carrier 10 is separated from the adjustment member 20, that is, the adjustment member 20 is located at a high position relative to the carrier 10, the first side 33 (back side) of the workpiece 30 is first placed on the carrier 10 toward the adjustment member 20, due to the existence of the grooves 11, only the first region 31 of the workpiece 30 is in contact with the carrying surface 121, the second region 32 of the workpiece 30 corresponds to the grooves 11 and is separated from the bottom wall 110 of the grooves 11, and the region of the second side 34 (front side) of the workpiece 30 having the process pattern is kept in non-contact. At this time, the adjuster 20 is moved to the first side 33 of the workpiece 30 by the first driving member 50, and since the first side 33 (back side) of the workpiece 30 faces the adjuster 20 and the first region 31 of the second side 34 (front side) of the workpiece 30 is supported on the supporting surface 121 of the carrier 10, a sealed cavity 40 is formed between the workpiece 30 and the carrier 10 when the workpiece 30 is sandwiched between the carrier 10 and the adjuster 20. At this time, the vacuum adsorption switch of the second adsorption unit 21 of the adjusting member 20 is turned on, the pressure of the second adsorption unit 21 is adjusted to be negative pressure, the workpiece 30 is completely adsorbed and leveled on the adjusting member 20, and the flatness of the workpiece 30 is adjusted to be within a preset range, and at this time, the warping of the workpiece 30 due to the self-process and gravity can be corrected and leveled. Then, the vacuum suction switch of the first suction unit 13 is turned on, and the pressure of the first suction unit 13 is adjusted to a negative pressure, so that the first zone 31 of the second side 34 (front surface) of the workpiece 30 is simultaneously sucked on the carrying surface 121. At this time, since the workpiece 30 has been pre-corrected to a flat state by the conditioning member 20, and the first suction unit 13 keeps uniformly sucking the second side 34 (front surface) of the workpiece 30 on the carrying surface 121 in the flat state, the workpiece 30 can still keep the flat state when the vacuum suction switch of the second suction unit 21 is turned off. Finally, the first driving member 50 can drive the adjusting member 20 to move away from the supporting member 10, so that the processing apparatus 200 can perform subsequent processing on the workpiece 30.

Referring to fig. 8 and 11, in an embodiment, the order of

processing

02 and 04 in the using method of the carrying device 100 can be adjusted, that is, the using method can include:

04: adsorbing a first area 31 of the workpiece 30 by using the first adsorption unit 13 on the bearing surface 121;

03: adsorbing the workpiece 30 by using the second adsorption unit 21 of the adjustment member 20 so that the flatness of the workpiece 30 is within a preset range; and

Specifically, when the workpiece 30 is processed, the carrier 10 is spaced apart from the adjuster 20, that is, the adjuster 20 is located at a high position relative to the carrier 10, the first side 33 (back side) of the workpiece 30 is first placed on the carrier 10 toward the adjuster 20, only the first region 31 of the workpiece 30 is in contact with the carrying surface 121 due to the existence of the grooves 11, the second region 32 of the workpiece 30 corresponds to the grooves 11 and is spaced apart from the bottom walls 110 of the grooves 11, and the region of the second side 34 (front side) of the workpiece 30 having the artwork remains in non-contact. At this time, the vacuum adsorption switch of the first adsorption unit 13 is turned on, and the pressure of the first adsorption unit 13 is adjusted to a negative pressure, so that the first region 31 of the second side 34 (front surface) of the workpiece 30 is simultaneously adsorbed on the carrying surface 121. Then, the adjuster 20 can be moved to the first side 33 of the workpiece 30 by the first driving member 50, since the first side 33 (back side) of the workpiece 30 faces the adjuster 20, and at the same time, the first region 31 of the second side 34 (front side) of the workpiece 30 is supported on the supporting surface 121 of the carrier 10, so that when the workpiece 30 is clamped between the carrier 10 and the adjuster 20, a sealed cavity 40 is formed between the workpiece 30 and the carrier 10. At this time, the vacuum adsorption switch of the second adsorption unit 21 of the adjusting member 20 is turned on, the pressure of the second adsorption unit 21 is adjusted to be negative pressure, the workpiece 30 is completely adsorbed and leveled on the adjusting member 20, and the flatness of the workpiece 30 is adjusted to be within a preset range, and at this time, the warping of the workpiece 30 due to the self-process and gravity can be corrected and leveled. At this time, since the workpiece 30 has been pre-corrected to be in a flat state by the adjustment member 20, and the first suction unit 13 still keeps uniformly sucking the first area 31 on the carrying surface 121 on the second side 34 (front surface) of the workpiece 30 in the flat state, the workpiece 30 can still be kept in the flat state when the vacuum suction switch of the second suction unit 21 is turned off. Finally, the first driving member 50 can drive the adjusting member 20 to move away from the supporting member 10, so that the processing apparatus 200 can perform subsequent processing on the workpiece 30.

In the method 01 to 05, the workpiece 30 is firstly carried on the carrier 10 by the first adsorption unit 13, and then the adjusting member 20 is moved to the position of the carrier 10 to pre-level the workpiece 30, so that the workpiece 30 with a level within a predetermined range can align the first region 31 of the workpiece 30 with the carrying surface 121 without adjusting the position, thereby reducing the position adjustment of the workpiece 30 and preventing the process pattern on the second side 34 (front surface) of the workpiece 30 from being scratched during the position adjustment.

Referring to fig. 9 and 12, in another embodiment, the using method may further include:

06: placing the workpiece 30 on the conditioning element 20;

07: using the second adsorption unit 21 of the adjustment member 20 to make the flatness of the workpiece 30 within a preset range;

08: moving the adjuster 20 to a first side 33 of the workpiece 30 away from the carrier 10, and positioning a first region 31 of the workpiece 30 on the carrying surface 121 of the carrier 10, and positioning a second region 32 of the workpiece 30 corresponding to the recess 11 of the carrier 10 and spaced from the bottom wall 110 of the recess 11, wherein a sealed cavity 40 is formed between the workpiece 30 and the carrier 10, and the first side 33 of the workpiece 30 is opposite to the second side 34 of the workpiece;

09: adsorbing a first area 31 of the workpiece 30 by using the first adsorption unit 13 on the bearing surface 121; and

010: the second suction unit 21 is closed and the adjustment member 20 is removed, and the first suction unit 13 keeps sucking the first region 31 of the workpiece 30 on the carrying surface 121.

Specifically, when the workpiece 30 is processed, the carrier 10 is separated from the adjustment member 20, that is, the adjustment member 20 is located at a low position relative to the carrier 10, the first side 33 (back side) of the workpiece 30 is placed on the adjustment member 20 toward the adjustment member 20, at this time, the vacuum adsorption switch of the second adsorption unit 21 of the adjustment member 20 is turned on, the pressure of the second adsorption unit 21 is adjusted to be negative pressure, the workpiece 30 is completely adsorbed and leveled on the adjustment member 20, and the flatness of the workpiece 30 is adjusted to be within a preset range, and at this time, the warping of the workpiece 30 due to self-process and gravity can be corrected and leveled. Then, the adjuster 20 can be moved to the position of the carrier 10 by the first driving member 50 (shown in fig. 8), since the first side 33 (back side) of the workpiece 30 faces the adjuster 20, and meanwhile, the first region 31 of the second side 34 (front side) of the workpiece 30 is located on the carrying surface 121 of the carrier 10, and the second region 32 of the workpiece 30 corresponds to the groove 11, so that when the workpiece 30 is clamped between the carrier 10 and the adjuster 20, a sealed cavity 40 is formed between the workpiece 30 and the carrier 10. At this time, the vacuum adsorption switch of the first adsorption unit 13 is turned on, and the pressure of the first adsorption unit 13 is adjusted to a negative pressure, so that the first region 31 of the second side 34 (front surface) of the workpiece 30 is simultaneously adsorbed on the carrying surface 121. At this time, since the workpiece 30 has been pre-corrected to be in a flat state by the adjustment member 20, and the first suction unit 13 still keeps uniformly sucking the first area 31 on the carrying surface 121 on the second side 34 (front surface) of the workpiece 30 in the flat state, the workpiece 30 can still be kept in the flat state when the vacuum suction switch of the second suction unit 21 is turned off. Finally, the first driving member 50 (shown in fig. 8) can drive the adjusting member 20 to move away from the carrier 10, so that the processing apparatus 200 can perform subsequent processing on the workpiece 30.

In the 06 to 010 method, the workpiece 30 is pre-leveled, and then the workpiece 30 after the pre-leveling is stably placed on the carrier 10 by controlling the adjusting member 20 to be coaxial with the carrier 10, so that the situation that the workpiece 30 falls into the groove 11 when the warped workpiece 30 is placed on the carrier 10 is avoided, and the first suction unit 13 can better suck the first region 31 of the workpiece 30.

Referring to fig. 8, in the carrying device 100, the semiconductor processing apparatus 1000 and the using method of the carrying device 100 of the present application, the first adsorption unit 13 of the carrying component 10 adsorbs the first region 31 of the workpiece 30, the adjusting component 20 is movable to the position of the carrying component 10 to clamp the workpiece 30 between the carrying component 10 and the adjusting component 20, and the workpiece 30 is subjected to the pre-leveling process by the second adsorption unit 21 (shown in fig. 4) of the adjusting component 20, so as to ensure the requirement of the subsequent process on the flatness of the workpiece 30, and further ensure the flatness of the semiconductor workpiece 30 within the preset range.

In the description herein, reference to the description of the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present application, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations of the above embodiments may be made by those of ordinary skill in the art within the scope of the present application, which is defined by the claims and their equivalents.

Claims

1. A load bearing device, comprising:

the bearing part is provided with a groove, the side wall of the groove comprises a bearing surface, the bearing surface is provided with a first adsorption unit, the first adsorption unit is used for adsorbing a first area of a workpiece on the bearing surface, the groove corresponds to a second area of the workpiece, and the bottom wall of the groove is spaced from the second area of the workpiece; and

the adjusting piece comprises a second adsorption unit, the second adsorption unit is used for adsorbing the workpiece so that the flatness of the workpiece is within a preset range, and the adjusting piece can move so that the workpiece is clamped between the bearing piece and the adjusting piece.

2. The carrier as claimed in claim 1, wherein the adjustment member is disposed coaxially with the carrier.

3. The carrier of claim 1, wherein a sealed cavity is formed between the workpiece and the carrier when the workpiece is sandwiched between the carrier and the conditioning element.

4. The carrier device of claim 1, wherein the first adsorption unit comprises an annular first air groove disposed on the carrying surface; or the first adsorption unit comprises a plurality of first air holes which are mutually spaced and uniformly distributed on the bearing surface.

5. The carrier as claimed in claim 1, wherein the carrier comprises:

the first driving piece is used for driving the adjusting piece to move and/or rotate; and/or

And the second driving piece is used for driving the bearing piece to move and/or rotate.

6. The carrier device according to claim 1, wherein the second adsorption unit comprises a plurality of annular second air grooves provided in the conditioning member, each of the second air grooves being concentric; or

The second adsorption unit comprises a plurality of second air holes which are mutually spaced and uniformly distributed; or

The adjusting piece is of a porous ceramic structure, and the second adsorption unit comprises a plurality of second air holes of the porous ceramic structure.

7. The carrier as claimed in claim 1, wherein the recess is circular and the bearing surface corresponds to the first region of the workpiece.

8. The carrying device as claimed in claim 1, wherein the number of the grooves is plural, a plurality of the grooves with gradually increasing sizes are formed in sequence from the center to the periphery of the carrying device, the workpieces with different sizes can be carried on the carrying surfaces of the plurality of the grooves, and the groove with the largest size is located at the bottom surface of the groove with the larger size; the number of the adjusting pieces is multiple, and each adjusting piece corresponds to one bearing surface of the groove.

9. A semiconductor processing apparatus, comprising:

a processing device; and

the carrier of any of claims 1-8, wherein the processing device corresponds to the carrier and is configured to process a workpiece carried on the carrier.

10. A method for using a carrier, comprising:

placing a workpiece on a bearing piece, enabling a first area of the workpiece to be located on a bearing surface of the bearing piece, and enabling a second area of the workpiece to correspond to a groove of the bearing piece and be spaced from the bottom wall of the groove;

moving an adjusting piece to a first side of the workpiece, which is far away from the bearing piece, and forming a sealed cavity between a second side of the workpiece and the bearing piece, wherein the first side of the workpiece is opposite to the second side of the workpiece;

adsorbing the workpiece by using a second adsorption unit of the adjusting piece so that the flatness of the workpiece is within a preset range;

adsorbing a first region of the workpiece with a first adsorption unit on the bearing surface; and

and closing the second adsorption unit and moving away the adjusting piece, wherein the first adsorption unit keeps adsorbing the first area of the workpiece on the bearing surface.

11. A method for using a carrier, comprising:

placing a workpiece on the adjusting member;

adsorbing the workpiece by using a second adsorption unit of the adjusting piece and enabling the flatness of the workpiece to be within a preset range;

moving an adjusting piece to a first side of the workpiece, which is far away from the bearing piece, and enabling a first area of the workpiece to be located on a bearing surface of the bearing piece, and a second area of the workpiece to correspond to the groove of the bearing piece and be spaced from the bottom wall of the groove, wherein a sealed cavity is formed between the workpiece and the bearing piece, and the first side of the workpiece is opposite to the second side of the workpiece;