CN114823457A - Bearing device, semiconductor processing equipment and using method of bearing device - Google Patents

Abstract

The application provides a bearing device, semiconductor processing equipment and a using method of the bearing device. The bearing device comprises a bearing part and an adjusting part. The bearing piece is provided with a groove, the side wall of the groove comprises a bearing surface, the bearing surface is provided with a first adsorption unit, the first adsorption unit is used for adsorbing a first area of the workpiece on the bearing surface, the groove corresponds to a second area of the workpiece, and the bottom wall of the groove is spaced from the second area of the workpiece; the adjusting piece comprises a second adsorption unit, the second adsorption unit is used for adsorbing the workpiece so that the flatness of the workpiece is within a preset range, and the adjusting piece can move so that the workpiece is clamped between the bearing piece and the adjusting piece. In the bearing device of this application, the first absorption unit that bears the weight of adsorbs the first district of work piece to the second absorption unit through the adjusting part carries out the level and smooth processing in advance to the work piece, guarantees the demand of subsequent processing to the work piece roughness, and then guarantees the treatment accuracy of semiconductor work piece.

Description

Carrier device, semiconductor processing equipment, and method of using the carrier device

technical field

The present application relates to the field of semiconductor technology, and more particularly, to a carrier device, semiconductor processing equipment, and a method for using the carrier device.

Background technique

At present, the thickness of semiconductor workpieces varies from tens to hundreds of microns due to different processes and usage requirements. When the thickness of the workpiece is relatively thin, it is easy to produce relatively large warpage due to the manufacturing process, and because of its Its own thickness is relatively thin, and when placed on the bearing device, a large sagging deformation will occur due to the action of gravity. For example, when processing the backside of the patterned wafer, the front side of the patterned wafer cannot be contacted with the carrier device due to the existing process pattern, and the front side of the wafer cannot be adsorbed in a large area to process the backside of the patterned wafer. Such a carrier device cannot guarantee the flatness of the semiconductor workpiece, thereby affecting the processing accuracy of the semiconductor workpiece.

SUMMARY OF THE INVENTION

Embodiments of the present application provide a carrier device, a semiconductor processing equipment, and a method for using the carrier device.

The carrying device of the embodiment of the present application includes a carrying member and an adjusting member. The carrier is provided with a groove, the side wall of the groove includes a bearing surface, and the bearing surface is provided with a first adsorption unit, and the first adsorption unit is used to adsorb the first area of the workpiece on the carrier surface, the groove corresponds to the second area of the workpiece, and the bottom wall of the groove is spaced from the second area of the workpiece; the adjustment member includes a second adsorption unit, and the second adsorption unit uses In order to adsorb the workpiece so that the flatness of the workpiece is within a preset range, the adjustment member can move so that the workpiece is sandwiched between the carrier and the adjustment member.

In some embodiments, the adjustment member is disposed coaxially with the carrier member.

In some embodiments, when the workpiece is sandwiched between the carrier and the adjustment element, a sealed cavity is formed between the workpiece and the carrier.

In some embodiments, the first adsorption unit includes an annular first air groove disposed on the bearing surface.

In some embodiments, the first adsorption unit includes a plurality of first air holes, and the plurality of first air holes are spaced apart from each other and evenly distributed on the bearing surface.

In certain embodiments, the carrier device includes a first drive member and/or a second drive member. The first driving member is used for driving the adjusting member to move and/or rotate; the second driving member is used for driving the carrier member to move and/or rotate.

In some embodiments, the second adsorption unit includes a plurality of annular second air grooves disposed on the adjustment member, and each of the second air grooves is concentric.

In some embodiments, the second adsorption unit includes a plurality of second air holes, and the plurality of second air holes are spaced apart from each other and evenly distributed.

In some embodiments, the adjustment member is a porous ceramic structure, and the second adsorption unit includes a plurality of second pores of the porous ceramic structure.

In some embodiments, the groove is circular, and the bearing surface corresponds to the first area of the workpiece.

In some embodiments, the number of the grooves is multiple, and a plurality of the grooves with gradually increasing sizes are formed sequentially from the center to the periphery of the carrier, and a plurality of the workpieces of different sizes can be supported On the bearing surface of a plurality of the grooves, the grooves other than the largest size are located on the bottom surface of the grooves of the previous larger size; the number of the adjustment members is multiple, and each adjustment member The piece corresponds to a bearing surface of one of the grooves.

The present application further provides a semiconductor processing equipment, the semiconductor processing equipment includes a processing device and the carrier device according to any one of the above embodiments, the processing device corresponds to the carrier device, and is used for the processing device to be carried on the carrier device. workpiece to be processed.

The present application also provides a method for using a carrying device, the using method includes: placing a workpiece on a carrier, so that a first area of the workpiece is located on a bearing surface of the carrier, and a second area of the workpiece is connected to the carrier. The groove of the carrier corresponds to and is spaced from the bottom wall of the groove; moves the adjustment member to the first side of the workpiece away from the carrier, and makes the second side of the workpiece and the carrier A sealed cavity is formed therebetween, and the first side of the workpiece is opposite to the second side of the workpiece; the workpiece is adsorbed by the second adsorption unit of the adjustment piece to make the flatness of the workpiece within the predetermined use the first adsorption unit on the bearing surface to adsorb the first area of the workpiece; and close the second adsorption unit and remove the adjustment member, the first adsorption unit keeps adsorbing the The first area of the workpiece is on the bearing surface.

The present application also provides a method for using a carrying device, which includes: placing a workpiece on an adjustment member; using a second adsorption unit of the adjustment member to adsorb the workpiece and keep the flatness of the workpiece within a preset range inside; move the adjustment member to the first side of the workpiece away from the carrier, and make the first area of the workpiece located on the bearing surface of the carrier, and the second area of the workpiece and the carrier The groove corresponds to and is spaced from the bottom wall of the groove, a sealed cavity is formed between the workpiece and the carrier, and the first side of the workpiece is opposite to the second side of the workpiece; The first adsorption unit on the bearing surface adsorbs the first area of the workpiece; and the second adsorption unit is closed and the adjustment piece is removed, and the first adsorption unit keeps the first area for adsorption of the workpiece in the bearing surface.

In the carrier device, the semiconductor processing equipment, and the method for using the carrier device of the present application, the first adsorption unit of the carrier absorbs the first area of the workpiece, and the second adsorption unit of the adjustment member pre-levels the workpiece to ensure subsequent processing. The demand for the flatness of the workpiece, thereby ensuring the processing accuracy of the semiconductor workpiece.

Additional aspects and advantages of embodiments of the present application will be set forth, in part, in the following description, and in part will be apparent from the following description, or learned by practice of embodiments of the present application.

Description of drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily understood from the following description of embodiments taken in conjunction with the accompanying drawings, wherein:

1 is a schematic structural diagram of a carrying device and a workpiece according to some embodiments of the present application;

2 is a schematic perspective view of a carrier of a carrier device according to some embodiments of the present application;

3 is a schematic cross-sectional view of a carrier of a carrier device according to some embodiments of the present application;

4 is a schematic perspective view of an adjustment member of a carrying device according to some embodiments of the present application;

5 is a schematic perspective view of an adjustment member of a carrying device according to some embodiments of the present application;

Fig. 6 is the cross-sectional schematic diagram of the carrying device in Fig. 1 along VI-VI line;

7 to 9 are schematic structural diagrams of semiconductor processing equipment according to some embodiments of the present application;

10 to 12 are flowcharts of methods of using the carrying device according to some embodiments of the present application.

Detailed ways

The embodiments of the present application will be further described below with reference to the accompanying drawings. The same or similar reference numbers refer to the same or similar elements or elements having the same or similar functions throughout the drawings.

In addition, the embodiments of the present application described below in conjunction with the accompanying drawings are exemplary, only used to explain the embodiments of the present application, and should not be construed as limitations on the present application.

In this application, unless otherwise expressly stated and defined, a first feature "on" or "under" a second feature may be in direct contact with the first and second features, or the first and second features indirectly through an intermediary touch. Also, the first feature being "above", "over" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

Please refer to FIG. 1 and FIG. 4 , the carrying device 100 of the present application includes a carrying member 10 and an adjusting member 20 . The carrier 10 is provided with a groove 11 , the side wall 12 of the groove 11 includes a bearing surface 121 , and the bearing surface 121 is provided with a first adsorption unit 13 , and the first adsorption unit 13 is used for adsorbing the first area 31 of the workpiece 30 to the bearing surface 121 . face 121. The groove 11 corresponds to the second area 32 of the workpiece 30 , and the bottom wall 110 of the groove 11 is spaced from the second area 32 of the workpiece 30 ; the adjustment member 20 includes a second adsorption unit 21 , and the second adsorption unit 21 is used for adsorption of the workpiece 30 In order to keep the flatness of the workpiece 30 within a preset range, the adjustment member 20 can move so that the workpiece 30 is sandwiched between the carrier member 10 and the adjustment member 20 .

Wherein, in the carrier device 100, the carrier 10 can be used to carry various types of workpieces 30 for processing by the semiconductor processing equipment 1000 (shown in FIG. 8), wherein the workpieces 30 include but are not limited to wafers, chips, display panels, Mobile phone front cover, mobile phone back cover, VR glasses, AR glasses, smart watch cover, glass, lens, wood, iron plate, casing of any device (such as mobile phone case) and other components. At present, the thickness of the workpiece 30 varies from tens to hundreds of microns due to different processes and usage requirements. When the thickness of the workpiece 30 is thin, it is easy to produce relatively large warpage due to the manufacturing process. And because its thickness is relatively thin, when it is placed on the carrying device 100, a large deformation will also occur due to the effect of gravity. For example, when processing the backside of the patterned wafer, the front side of the patterned wafer cannot be contacted with the carrier device 100 due to the existing process patterns on the front side, and the front side of the wafer cannot be adsorbed in a large area to process the backside of the patterned wafer. The device 100 cannot guarantee the flatness of the workpiece 30 , thereby affecting the processing accuracy of the workpiece 30 .

Specifically, the second adsorption unit 21 is connected to an air extraction device, and the air extraction device adjusts the pressure in the second adsorption unit 21 so that the second adsorption unit 21 can evenly adsorb the back of the workpiece 30 to ensure that the flatness of the workpiece 30 is at a preset level within the range. For example, when the workpiece 30 is detected, the preset range of the flatness of the workpiece 30 is required to be [0.01mm, 0.5mm], and the pressure of the second adsorption unit 21 is adjusted to a negative pressure to adsorb the workpiece 30. When the flatness of the workpiece 30 is When the degree of flatness is in the range of [0.01mm, 0.5mm], stop adjusting the pressure of the second adsorption unit 21; when cutting the workpiece 30, the preset range of the flatness of the workpiece 30 is required to be [0.01mm, 0.7mm], Then, adjust the pressure of the second adsorption unit 21 to a negative pressure to adsorb the workpiece 30. When the flatness of the workpiece 30 is within the range of [0.01mm, 0.7mm], stop adjusting the pressure of the second adsorption unit 21. Specifically, the preset range of flatness can be set according to the processing procedure or the characteristics of the workpiece 30 itself, so as to control the pressure of the second adsorption unit 21 to make the flatness of the workpiece 30 within the preset range.

In the carrier device 100 of the present application, the first adsorption unit 13 of the carrier 10 adsorbs the first area 31 of the workpiece 30 , and the workpiece 30 is pre-leveled by the second adsorption unit 21 of the adjustment element 20 to ensure that the workpiece 30 is not affected by the subsequent processing. 30 flatness requirements, thereby ensuring the processing accuracy of the semiconductor workpiece 30 .

Further description will be given below in conjunction with the accompanying drawings.

Referring to FIG. 2 , in some embodiments, the groove 11 is circular, the groove 11 corresponds to the second area 32 of the workpiece 30 , and the bearing surface 121 corresponds to the first area 31 of the workpiece 30 . That is, the bearing surface 121 surrounds the groove 11 , and the first area 31 surrounds the second area 32 . For example, when the workpiece 30 with the process pattern is inspected on the back side (the side without the pattern), the front side of the workpiece 30 faces the groove 11 , so that the front side of the workpiece 30 can be prevented from contacting the carrier device 100 , thereby preventing damage to the workpiece 30 . craft graphics. In some other embodiments, the groove 11 may also have other regular or irregular shapes such as triangle, quadrangle, pentagon, hexagon, etc. Correspondingly, the shape of the outer contour of the carrier 10 and/or the shape of the adjustment member 20 The shape of the outer contour can correspond to the shape of the groove 11 , and can also be in other regular or irregular shapes such as triangles, quadrilaterals, pentagons, hexagons, etc., so as to be suitable for workpieces 30 of different shapes; The contour and/or the outer contour of the adjusting member 20 is still the circle shown in FIG. 1 , and the shape of the bearing surface 121 is the circle except for the shape of the groove 11 (triangle, quadrilateral, pentagon, hexagon and other rules). or irregular shape) after the remaining part of the shape. Or the shape of the outer contour of the carrier 10 and/or the shape of the outer contour of the adjustment member 20 does not correspond to the shape of the groove 11, it is only necessary to ensure that the carrier 10 has the bearing surface 121 of the first area 31 of the workpiece 30 and the adjustment It is sufficient that the workpiece 20 can completely absorb the entire surface of the workpiece 30 .

Please continue to refer to FIG. 2 , in some embodiments, the number of grooves 11 may be one, and in this case, the carrier 10 is used to carry the workpiece 30 of one size. Correspondingly, the number of the adjusting member 20 is also one, and the size corresponds to the size of the workpiece 30 that the carrier 10 can carry.

Referring to FIG. 3 , in some embodiments, the number of the grooves 11 may be multiple, and the sizes of the multiple grooves 11 gradually increase from the center to the periphery of the carrier 10 , and multiple workpieces 30 of different sizes can be It is carried on the bearing surfaces 121 corresponding to the plurality of grooves 11 , and the grooves 11 other than the largest size are located on the bottom surface 111 of the previous groove 11 with a larger size. For example, the number of the grooves 11 is three, and in the vertical direction extending from the bearing surface 121a toward the bearing surface 121c, the grooves 11a, 11b, 11c, respectively, the size (eg, diameter) of the groove 11c is larger than the size (eg, diameter) of groove 11b and groove 11c, the size (eg, diameter) of groove 11b is larger than the size (eg, diameter) of groove 11a, and groove 11b is located where bottom surface 111 of groove 11c is located The position, that is, the groove 11b is located on the bearing surface 121a of the groove 11a. The plurality of bearing surfaces 121 are applicable to workpieces 30 of different sizes. When replacing workpieces 30 of different sizes, the carrier device 100 does not need to be replaced, which saves materials and meets production requirements.

Correspondingly, the number of adjustment members 20 is multiple, and each adjustment member 20 corresponds to a bearing surface 121 of the groove 11 . When using the bearing device 100 , the flatness of the workpiece 30 of the corresponding size can be guaranteed to be within a preset range.

For example, the bearing surface 121a corresponding to the groove 11a is suitable for the workpiece 30 with a size of 8 inches, and the corresponding adjustment member 20 performs pre-leveling treatment on the workpiece 30; the bearing surface 121b corresponding to the groove 11b is suitable for the workpiece 30 with a size of 12 inches. , the corresponding adjustment part 20 pre-levels the workpiece 30 ; the bearing surface 121 c corresponding to the groove 11 c is suitable for the workpiece 30 with a size of 16 inches, and the corresponding adjustment part 20 pre-levels the workpiece 30 . The size is not limited to 8 inches, 12 inches, 16 inches, but also can be 17 inches, 15 inches, 14 inches, 13 inches, 11 inches, 7 inches, 6 inches, 5 inches, 4 inches, 3 inches, 2 inches , 1 inch, etc., the size of the carrier 10 can be set according to the actual size of the workpiece 30 .

Referring to FIG. 1 , in one embodiment, the first adsorption unit 13 may include a plurality of first air holes 131 , and the plurality of first air holes 131 are spaced apart from each other and evenly distributed on the bearing surface 121 . Specifically, the air pressure of the first air hole 131 can be adjusted by an air pump communicating with the first air hole 131 , so that the first region 31 of the workpiece 30 can be adsorbed on the bearing surface 121 . The first air holes 131 that are spaced apart and evenly distributed can evenly absorb the first area 31 of the workpiece 30 , so that each part of the first area 31 is evenly stressed, preventing the first area 31 from warping, and at the same time, ensuring that the first air holes 131 pass through the first area 31 . The adsorption can stably adsorb the workpiece 30 on the carrier 10 .

In another embodiment, the first adsorption unit 13 may include an annular first air groove (not shown) provided on the bearing surface 121 , that is, the annular first air groove on the bearing surface 121 is recessed downward. . The annular first air grooves may include one or more (greater than or equal to two), the plurality of annular first air grooves are concentrically arranged on the bearing surface 121 , and the plurality of annular first air grooves can increase the first area 31 So that the first area 31 of the workpiece 30 can be stably adsorbed on the bearing surface 121 . Similarly, the air pressure of the first air groove can be adjusted by an air pump communicating with the annular first air groove, so that the first area 31 of the workpiece 30 can be adsorbed on the bearing surface 121 .

Referring to FIG. 4 , in one embodiment, the second adsorption unit 21 may include a plurality of annular second air grooves 211 disposed on the surface of the adjustment member 20 facing the carrier 10 , each annular second air groove 211 Concentrically arranged, the adjustment member 20 can be provided with an air path, and the air path is connected to a plurality of second air grooves 211, and the second air grooves 211 are pumped by an air suction device such as an air pump, and the pressure of the second air groove 211 is adjusted to Negative pressure is applied to adsorb the back surface of the workpiece 30 to realize pre-leveling treatment of the workpiece 30 .

Referring to FIG. 5 , in another embodiment, the second adsorption unit 21 may further include a plurality of second air holes 212 disposed on the surface of the adjustment member 20 facing the carrier 10 , and the plurality of second air holes 212 are spaced apart and uniform from each other Similarly, the adjustment member 20 can be provided with an air path, and the air path is connected to a plurality of second air holes 212. The pressure in 212 is adjusted to a negative pressure, so as to adsorb the back surface of the workpiece 30 and realize the pre-leveling treatment of the workpiece 30 .

In yet another embodiment, the adjustment member 20 is a porous ceramic structure, and the second adsorption unit 21 may include a plurality of second air holes 212 of the porous ceramic structure. Since the porous ceramic is an insulating material, the adjustment member 20 of the porous ceramic structure adsorbs the workpiece 30 During the pre-leveling process, the static electricity characteristic can be dissipated to avoid damage or contamination of the workpiece 30 when the adjustment member 20 is pre-leveled.

Specifically, the adjustment member 20 ensures that the flatness of the workpiece 30 is within a preset range by adjusting the pressure in the second adsorption unit 21 . For example, assuming that the preset flatness range is [0.01mm, 0.5mm], the pressure of the second adsorption unit 21 is adjusted to a negative pressure by the air suction device, when the flatness of the workpiece 30 is [0.01mm, 0.5mm] within the range, at this time, stop adjusting the pressure of the second adsorption unit 21; when the flatness of the workpiece 30 is not within the range of [0.01mm, 0.5mm], continue to adjust the pressure of the second adsorption unit 21 until the workpiece 30 is The flatness is adjusted within the range of [0.01mm, 0.5mm], and the flatness of the workpiece 30 is maintained within the preset range. The flatness of the workpiece is within the range of [0.01mm, 0.5mm], which is acceptable for the equipment. If the flatness is greater than 0.5mm, the inspection equipment needs to refocus when detecting different areas of the workpiece to obtain the desired results. It will seriously affect the work efficiency, which is not conducive to production needs, and the flatness is less than 0.01mm, which requires precise electrical control components, which will increase the cost of testing equipment. After the flatness of the workpiece 30 is kept within the preset range, the adjustment member 20 can be moved upward, and the suction force generated by the first adsorption unit 13 of the carrier 10 can stably adsorb the workpiece 30 on the carrier 10 , and The flatness of the workpiece 30 can be guaranteed to remain within a preset range. At this time, the processing device 200 (shown in FIG. 8 ) of the semiconductor processing equipment 1000 (shown in FIG. 8 ) can perform inspection or processing on the workpiece 30 .

In some embodiments, the carrier 10 and the adjustment element 20 are arranged coaxially, which can reduce the movement of the adjustment element 20. When the adjustment element 20 moves, it only needs to be aligned with the carrier 10 to lift and lower. In this way, the second adsorption unit 21 can generate a uniform adsorption force, so as to uniformly adsorb the workpiece 30 and thereby efficiently adjust the flatness of the workpiece 30 within a preset range.

Referring to FIG. 6 , when the workpiece 30 is sandwiched between the carrier 10 and the adjustment element 20 , a sealed cavity 40 is formed between the workpiece 30 and the carrier 10 , when the workpiece 30 is placed facing the bottom wall 110 of the groove 11 . At the time, the cavity 40 can avoid the process pattern on the front side of the workpiece 30 to ensure the integrity of the process pattern on the front side of the workpiece 30 . At this time, the second adsorption unit 21 of the adjusting member 20 is turned on and the flatness of the workpiece 30 is adjusted within a preset range for the processing device 200 (shown in FIG. 8 ) of the semiconductor processing equipment 1000 (shown in FIG. 8 ) to The workpiece 30 is processed to improve the processing accuracy of the workpiece 30 .

Further, referring to FIG. 7 , the carrying device 100 may further include a first driving member 50 for driving the adjusting member 20 to move and/or rotate. Specifically, the first driving member 50 may be a driving device such as a motor, a cylinder, or a hydraulic pressure, which can drive the adjusting member 20 to move or rotate along at least one of the X-axis, Y-axis, and Z-axis shown in FIG. 7 . The first driving member 50 drives the adjusting member 20 to move and/or rotate, so that the adjusting member 20 is coaxial with the carrier member 10 . In this way, the second adsorption unit 21 can generate a uniform adsorption force to uniformly adsorb the workpiece 30 and thus achieve high efficiency. The flatness of the workpiece 30 is adjusted within a preset range. At the same time, the adjustment member 20 is coaxial with the carrier member 10, so that the first adsorption unit 13 can accurately and uniformly adsorb the first area 31 of the workpiece 30. After the adjustment member 20 is removed, the adsorption generated by the first adsorption unit 13 The force can still stably adsorb the workpiece 30 on the carrier 10, and can ensure that the flatness of the workpiece 30 is kept within a preset range.

Specifically, when the workpiece 30 is processed, the carrier 10 is spaced apart from the adjustment element 20 , that is, the adjustment element 20 is in a high position relative to the carrier 10 , and the first side 33 (back) of the workpiece 30 is first directed toward The adjustment member 20 is placed on the carrier member 10. Due to the existence of the groove 11, only the first area 31 of the workpiece 30 is in contact with the bearing surface 121, the second area 32 of the workpiece 30 corresponds to the groove 11, and the second side 34 of the workpiece 30 (Front) areas with process graphics remain non-contact. At this time, the adjusting member 20 is moved along the axial direction of the workpiece 30 to the direction of the carrier 10 by the first driving member 50. Since the first side 33 (back surface) of the workpiece 30 faces the adjusting member 20, at the same time, the second The first area 31 of the side 34 (front) is carried on the bearing surface 121 of the carrier 10 so that when the workpiece 30 is sandwiched between the carrier 10 and the adjustment member 20, a sealed cavity is formed between the workpiece 30 and the carrier 10 body 40. At this time, turn on the vacuum adsorption switch of the second adsorption unit 21 of the adjustment member 20, adjust the pressure of the second adsorption unit 21 to a negative pressure, completely adsorb the workpiece 30 on the adjustment member 20 and adjust the flatness of the workpiece 30. Within the preset range, the warpage of the workpiece 30 due to its own process and gravity can be corrected and leveled. Then, the vacuum adsorption switch of the first adsorption unit 13 is turned on, and the pressure of the first adsorption unit 13 is adjusted to a negative pressure, so that the first area 31 of the second side 34 (front side) of the workpiece 30 is simultaneously adsorbed on the bearing surface 121 . At this time, since the workpiece 30 has been pre-calibrated to a flat state by the adjusting member 20, and in the flat state, the second side 34 (front) and the first area 31 of the workpiece 30 are evenly adsorbed on the bearing surface 121, so when the second adsorption is turned off When the vacuum suction of the unit 21 is switched on and off, the workpiece 30 can still be kept flat. Finally, the first driving member 50 drives the adjusting member 20 to move in a direction away from the carrier member 10 , so that subsequent processing work can be performed on the workpiece 30 .

Please continue to refer to FIG. 7 , the carrying device 100 may further include a second driving member 60 , and the second driving member 60 is used for driving the carrying member 10 to move and/or rotate. Specifically, the second driving member 60 may be a driving device such as a motor, an air cylinder, or a hydraulic pressure, which can drive the bearing member 10 to move or rotate along at least one of the X, Y, and Z axes shown in FIG. 7 . The second driving member 60 drives the bearing member 10 to move and/or rotate, so that the bearing member 10 and the adjusting member 20 are coaxial, so that the second suction unit 21 can generate a uniform suction force, so as to uniformly absorb the workpiece 30 and thus achieve high efficiency The flatness of the workpiece 30 is adjusted within a preset range. At the same time, the carrier 10 is coaxial with the adjustment member 20 , so that the first adsorption unit 13 can accurately and uniformly adsorb the first area 31 of the workpiece 30 . After the carrier 10 is removed, the adsorption generated by the first adsorption unit 13 The force can still stably adsorb the workpiece 30 on the carrier 10, and can ensure that the flatness of the workpiece 30 remains within a preset range for the processing device 200 (shown in FIG. 8) to process and ensure the processing accuracy of the workpiece 30. . Specifically, when the workpiece 30 is processed, the carrier 10 is spaced apart from the adjustment element 20 , that is, the adjustment element 20 is in a high position relative to the carrier 10 , and the first side 33 (back) of the workpiece 30 is first directed toward The adjustment member 20 is placed on the carrier member 10. Due to the existence of the groove 11, only the first area 31 of the workpiece 30 is in contact with the bearing surface 121, the second area 32 of the workpiece 30 corresponds to the groove 11, and the second side 34 of the workpiece 30 (Front) areas with process graphics remain non-contact. At this time, the carrier 10 is moved along the axial direction of the workpiece 30 to the direction of the adjusting member 20 by the second driving member 60. Since the first side 33 (back surface) of the workpiece 30 faces the adjusting member 20, at the same time, the second The first area 31 of the side 34 (front) is carried on the bearing surface 121 of the carrier 10 so that when the workpiece 30 is sandwiched between the carrier 10 and the adjustment member 20, a sealed cavity is formed between the workpiece 30 and the carrier 10 body 40. At this time, turn on the vacuum adsorption switch of the second adsorption unit 21 of the adjustment member 20, adjust the pressure of the second adsorption unit 21 to a negative pressure, completely adsorb the workpiece 30 on the adjustment member 20 and adjust the flatness of the workpiece 30. Within the preset range, the warpage of the workpiece 30 due to its own process and gravity can be corrected and leveled. Then, the vacuum adsorption switch of the first adsorption unit 13 is turned on, and the pressure of the first adsorption unit 13 is adjusted to a negative pressure, so that the first area 31 of the second side 34 (front side) of the workpiece 30 is simultaneously adsorbed on the bearing surface 121 . At this time, since the workpiece 30 has been pre-calibrated to a flat state by the adjusting member 20, and in the flat state, the second side 34 (front) and the first area 31 of the workpiece 30 are evenly adsorbed on the bearing surface 121, so when the second adsorption is turned off When the vacuum suction of the unit 21 is switched on and off, the workpiece 30 can still be kept flat. Finally, the second driving member 60 drives the carrier 10 to move away from the adjusting member 20 . At this time, the first adsorption unit 13 still adsorbs the workpiece 30 , so that the second driving member 60 can drive the carrier 10 and the workpiece 30 together. After moving, the workpiece 30 can be subsequently processed.

Please also refer to FIG. 7 , the carrying device 100 may further include the first driving member 50 and the second driving member 60 at the same time. The first driving member 50 is used for driving the adjusting member 20 to move and/or rotate, and the second driving member 60 is used for driving the carrier 10 to move and/or rotate. Specifically, the first driving member 50 and the second driving member 60 can be both motor, cylinder, hydraulic and other driving devices, and can respectively drive the adjusting member 20 and the bearing member 10 along the X-axis, Y-axis, and Z-axis shown in FIG. 7 . At least one of the axes moves or rotates. The first driving member 50 and the second driving member 60 can be opened at the same time, that is, while the first driving member 50 drives the adjusting member 20 to move and/or rotate, the second driving member 60 drives the carrier 10 to move and/or rotate, and The control and adjustment member 20 and the carrier member 10 are coaxial, so that the second adsorption unit 21 can generate a uniform adsorption force to uniformly adsorb the workpiece 30 and thus efficiently adjust the flatness of the workpiece 30 within a preset range. At the same time, the adjustment member 20 is coaxial with the carrier member 10, so that the first adsorption unit 13 can accurately and uniformly adsorb the first area 31 of the workpiece 30. After the adjustment member 20 is removed, the adsorption generated by the first adsorption unit 13 The force can still stably adsorb the workpiece 30 on the carrier 10, and can ensure that the flatness of the workpiece 30 is kept within a preset range.

Likewise, when the workpiece 30 is processed, the carrier 10 is separated from the adjustment element 20, ie, the adjustment element 20 is in a high position relative to the carrier 10, the first side 33 (back) of the workpiece 30 can be first The facing adjustment member 20 is placed on the carrier 10. Due to the existence of the groove 11, only the first area 31 of the workpiece 30 is in contact with the bearing surface 121, the second area 32 of the workpiece 30 corresponds to the groove 11, and the second side of the workpiece 30 34 (Front) The area with the process pattern remains non-contact. At this time, while the first drive member 50 drives the adjustment member 20 to move and/or rotate, the second drive member 60 drives the carrier member 10 to move and/or rotate, which saves time for coaxial adjustment, improves the efficiency of coaxial adjustment, and shortens the The time of the whole processing process is improved, and the processing efficiency is improved. Since the first side 33 (back) of the workpiece 30 faces the adjustment member 20, and at the same time, the first area 31 of the second side 34 (front) of the workpiece 30 is carried on the bearing surface 121 of the carrier 10, so that the workpiece 30 is clamped on the carrier When the part 10 and the adjusting part 20 are installed, a sealed cavity 40 is formed between the workpiece 30 and the carrier part 10 . At this time, turn on the vacuum adsorption switch of the second adsorption unit 21 of the adjustment member 20, adjust the pressure of the second adsorption unit 21 to a negative pressure, completely adsorb the workpiece 30 on the adjustment member 20 and adjust the flatness of the workpiece 30. Within the preset range, the warpage of the workpiece 30 due to its own process and gravity can be corrected and leveled. Then, the vacuum adsorption switch of the first adsorption unit 13 is turned on, and the pressure of the first adsorption unit 13 is adjusted to a negative pressure, so that the first area 31 of the second side 34 (front side) of the workpiece 30 is simultaneously adsorbed on the bearing surface 121 . At this time, since the workpiece 30 has been pre-calibrated to a flat state by the adjusting member 20, and in the flat state, the second side 34 (front) and the first area 31 of the workpiece 30 are evenly adsorbed on the bearing surface 121, so when the second adsorption is turned off When the vacuum suction of the unit 21 is switched on and off, the workpiece 30 can still be kept flat. Finally, the first driving member 50 drives the adjusting member 20 to move away from the carrier 10 and/or the second driving member 60 drives the carrier 10 to move away from the adjusting member 20, so as to facilitate the processing device 200 (shown in FIG. 8 ). ) to process the workpiece 30; at the same time, the second driving member 60 can drive the carrier 10 to move, so that when the semiconductor processing equipment 1000 (shown in FIG. 8 ) processes the workpiece 30 (for example, optical detection), it is located in the focus position, increasing the The processing accuracy of the workpiece 30; or the second driving member 60 can drive the carrier 10 to rotate, so as to realize the rotation processing (eg detection, coating, etching, cutting) of the workpiece 30.

Referring to FIG. 8 , the present application further provides a semiconductor processing apparatus 1000 . The semiconductor processing apparatus 1000 includes a processing apparatus 200 and the carrier apparatus 100 of any of the above-mentioned embodiments. The workpiece 30 on the carrier device 100 is processed.

In one embodiment, the processing device 200 may be a tester, and the tester may be used to detect defects of the workpiece 30 carried on the carrier device 100 . In one embodiment, the processing apparatus 200 may be an etching apparatus, and the etching apparatus may be used to etch the workpiece 30 carried on the carrier apparatus 100 . In another embodiment, the processing device 200 may also be a coating device, and the coating device may be used to perform vapor deposition, sputtering, etc. on the workpiece 30 carried on the carrier device 100 . The processing device 200 may also be of other types, which all belong to the protection scope of the present application, and are not listed one by one here.

Please refer to FIG. 8 and FIG. 10 , the present application further provides a method of using the carrying device 100 , and the method of using includes:

01: Place the workpiece 30 on the carrier 10, so that the first area 31 of the workpiece 30 is located on the bearing surface 121 of the carrier 10, and the second area 32 of the workpiece 30 corresponds to the groove 11 of the carrier 10 and is opposite to the groove 11. The bottom wall 110 is spaced;

02: Move the adjustment member 20 to the first side 33 of the workpiece 30 away from the carrier 10, and form a sealed cavity 40 between the second side 34 of the workpiece 30 and the carrier 10, and the first side 33 of the workpiece 30 and The second side 34 of the workpiece 30 is opposite;

03: Using the second adsorption unit 21 of the adjustment member 20 to adsorb the workpiece 30 so that the flatness of the workpiece 30 is within a preset range;

04: Using the first adsorption unit 13 on the bearing surface 121 to adsorb the first area 31 of the workpiece 30; and

05 : Turn off the second adsorption unit 21 and remove the adjusting member 20 . The first adsorption unit 13 keeps the first area 31 of the workpiece 30 adsorbed on the bearing surface 121 .

Specifically, when the workpiece 30 is processed, the carrier 10 is spaced apart from the adjustment element 20 , that is, the adjustment element 20 is in a high position relative to the carrier 10 , and the first side 33 (back) of the workpiece 30 is first directed toward The adjusting member 20 is placed on the bearing member 10. Due to the existence of the groove 11, only the first area 31 of the workpiece 30 is in contact with the bearing surface 121, and the second area 32 of the workpiece 30 corresponds to the groove 11 and is in contact with the bottom wall of the groove 11. 110 spacing, the second side 34 (front side) of the workpiece 30 with the area of the process pattern remains non-contact. At this time, the adjusting member 20 is moved to the first side 33 of the workpiece 30 by the first driving member 50. Since the first side 33 (back side) of the workpiece 30 faces the adjusting member 20, at the same time, the second side 34 (front side) of the workpiece 30 is facing the adjusting member 20. ) is carried on the bearing surface 121 of the carrier 10 , so that when the workpiece 30 is sandwiched between the carrier 10 and the adjustment element 20 , a sealed cavity 40 is formed between the workpiece 30 and the carrier 10 . At this time, turn on the vacuum adsorption switch of the second adsorption unit 21 of the adjustment member 20, adjust the pressure of the second adsorption unit 21 to a negative pressure, completely adsorb the workpiece 30 on the adjustment member 20 and adjust the flatness of the workpiece 30. Within the preset range, the warpage of the workpiece 30 due to its own process and gravity can be corrected and leveled. Then, the vacuum adsorption switch of the first adsorption unit 13 is turned on, and the pressure of the first adsorption unit 13 is adjusted to a negative pressure, so that the first area 31 of the second side 34 (front side) of the workpiece 30 is simultaneously adsorbed on the bearing surface 121 . At this time, since the workpiece 30 has been pre-calibrated to a flat state by the adjusting member 20 , and in the flat state, the first adsorption unit 13 maintains uniform adsorption of the second side 34 (front) of the workpiece 30 and the first area 31 on the bearing surface 121 , so when the vacuum suction switch of the second suction unit 21 is turned off, the workpiece 30 can still maintain a flat state. Finally, the adjusting member 20 can be driven by the first driving member 50 to move in a direction away from the carrier member 10 , and the processing device 200 can perform subsequent processing work on the workpiece 30 .

Referring to FIG. 8 and FIG. 11 , in one embodiment, the processing order of 02 and 04 in the using method of the carrying device 100 can be adjusted, that is, the using method can include:

01: Place the workpiece 30 on the carrier 10, so that the first area 31 of the workpiece 30 is located on the bearing surface 121 of the carrier 10, and the second area 32 of the workpiece 30 corresponds to the groove 11 of the carrier 10 and is opposite to the groove 11. The bottom wall 110 is spaced;

04: Using the first adsorption unit 13 on the bearing surface 121 to adsorb the first area 31 of the workpiece 30;

02: Move the adjustment member 20 to the first side 33 of the workpiece 30 away from the carrier 10, and form a sealed cavity 40 between the second side 34 of the workpiece 30 and the carrier 10, and the first side 33 of the workpiece 30 and The second side 34 of the workpiece 30 is opposite;

03: Using the second adsorption unit 21 of the adjusting member 20 to adsorb the workpiece 30 so that the flatness of the workpiece 30 is within a preset range; and

05 : Turn off the second adsorption unit 21 and remove the adjusting member 20 . The first adsorption unit 13 keeps the first area 31 of the workpiece 30 adsorbed on the bearing surface 121 .

Specifically, when the workpiece 30 is processed, the carrier 10 is spaced apart from the adjustment element 20 , that is, the adjustment element 20 is in a high position relative to the carrier 10 , and the first side 33 (back) of the workpiece 30 is first directed toward The adjusting member 20 is placed on the bearing member 10. Due to the existence of the groove 11, only the first area 31 of the workpiece 30 is in contact with the bearing surface 121, and the second area 32 of the workpiece 30 corresponds to the groove 11 and is in contact with the bottom wall of the groove 11. 110 spacing, the second side 34 (front side) of the workpiece 30 with the area of the process pattern remains non-contact. At this time, the vacuum adsorption switch of the first adsorption unit 13 is turned on, and the pressure of the first adsorption unit 13 is adjusted to a negative pressure, so that the first area 31 of the second side 34 (front side) of the workpiece 30 is simultaneously adsorbed on the bearing surface 121 . Then, the adjustment member 20 can be moved to the first side 33 of the workpiece 30 by the first drive member 50, since the first side 33 (back side) of the workpiece 30 faces the adjustment member 20, and at the same time, the second side 34 (front side) of the workpiece 30 ) is carried on the bearing surface 121 of the carrier 10 , so that when the workpiece 30 is sandwiched between the carrier 10 and the adjustment element 20 , a sealed cavity 40 is formed between the workpiece 30 and the carrier 10 . At this time, turn on the vacuum adsorption switch of the second adsorption unit 21 of the adjustment member 20, adjust the pressure of the second adsorption unit 21 to a negative pressure, completely adsorb the workpiece 30 on the adjustment member 20 and adjust the flatness of the workpiece 30. Within the preset range, the warpage of the workpiece 30 due to its own process and gravity can be corrected and leveled. At this time, since the workpiece 30 has been pre-calibrated to a flat state by the adjusting member 20, and in the flat state, the first adsorption unit 13 still maintains uniform adsorption of the second side 34 (front) of the workpiece 30 to the first area 31 on the bearing surface 121 Therefore, when the vacuum suction switch of the second suction unit 21 is turned off, the workpiece 30 can still maintain a flat state. Finally, the adjusting member 20 can be driven by the first driving member 50 to move in a direction away from the carrier member 10 , and the processing device 200 can perform subsequent processing work on the workpiece 30 .

In the methods from 01 to 05, the workpiece 30 is first carried on the carrier 10 by the first adsorption unit 13, and then the adjustment member 20 is moved to the position of the carrier 10, and the workpiece 30 is pre-leveled, and the flatness reaches a preset range. The first area 31 of the workpiece 30 can be aligned with the bearing surface 121 without adjusting the position of the workpiece 30, which reduces the position adjustment of the workpiece 30 and prevents the process pattern of the second side 34 (front side) of the workpiece 30 from being scratched during the position adjustment process. .

Referring to FIG. 9 and FIG. 12, in another embodiment, the using method may further include:

06: Place the workpiece 30 on the adjustment piece 20;

07: Use the second adsorption unit 21 of the adjustment member 20 to make the flatness of the workpiece 30 within a preset range;

08: Move the adjustment member 20 to the first side 33 of the workpiece 30 away from the carrier 10 , and make the first area 31 of the workpiece 30 located on the bearing surface 121 of the carrier 10 , and the second area 32 of the workpiece 30 and the carrier 10 The groove 11 corresponding to and spaced from the bottom wall 110 of the groove 11, a sealed cavity 40 is formed between the workpiece 30 and the carrier 10, and the first side 33 of the workpiece 30 is opposite to the second side 34 of the workpiece;

09: Using the first adsorption unit 13 on the bearing surface 121 to adsorb the first area 31 of the workpiece 30; and

010 : Turn off the second adsorption unit 21 and remove the adjusting member 20 , and the first adsorption unit 13 keeps the first area 31 of the workpiece 30 adsorbed on the bearing surface 121 .

Specifically, when the workpiece 30 is processed, the carrier 10 is spaced apart from the adjustment element 20 , that is, the adjustment element 20 is located in a low position relative to the carrier 10 , and the first side 33 (back) of the workpiece 30 is oriented first. The adjustment member 20 is placed on the adjustment member 20. At this time, the vacuum suction switch of the second suction unit 21 of the adjustment member 20 is turned on, the pressure of the second suction unit 21 is adjusted to a negative pressure, and the workpiece 30 is completely absorbed and flattened on the adjustment member. 20 and adjust the flatness of the workpiece 30 to within a preset range. At this time, the warpage of the workpiece 30 due to its own process and gravity can be corrected and flattened. Then, the adjusting member 20 can be moved to the position where the carrier 10 is located by the first driving member 50 (shown in FIG. 8 ). The first area 31 of the two sides 34 (front) is located on the bearing surface 121 of the carrier 10, and the second area 32 of the workpiece 30 corresponds to the groove 11, so that when the workpiece 30 is sandwiched between the carrier 10 and the adjustment member 20, A sealed cavity 40 is formed between the workpiece 30 and the carrier 10 . At this time, the vacuum adsorption switch of the first adsorption unit 13 is turned on, and the pressure of the first adsorption unit 13 is adjusted to a negative pressure, so that the first area 31 of the second side 34 (front side) of the workpiece 30 is simultaneously adsorbed on the bearing surface 121 . At this time, since the workpiece 30 has been pre-calibrated to a flat state by the adjusting member 20, and in the flat state, the first adsorption unit 13 still maintains uniform adsorption of the second side 34 (front) of the workpiece 30 to the first area 31 on the bearing surface 121 Therefore, when the vacuum suction switch of the second suction unit 21 is turned off, the workpiece 30 can still maintain a flat state. Finally, the adjusting member 20 can be driven by the first driving member 50 (shown in FIG. 8 ) to move away from the carrier member 10 , and the processing device 200 can perform subsequent processing work on the workpiece 30 .

In the methods from 06 to 010, the workpiece 30 is pre-leveled first, and then the adjustment member 20 is controlled to be coaxial with the carrier 10, and the pre-leveled workpiece 30 is stably placed on the carrier 10 to avoid warping. When the workpiece 30 is placed on the carrier 10 , the workpiece 30 will fall into the groove 11 , and the first adsorption unit 13 can better adsorb the first area 31 of the workpiece 30 .

Referring to FIG. 8 , in the carrier device 100 , the semiconductor processing equipment 1000 and the method for using the carrier device 100 of the present application, the first adsorption unit 13 of the carrier 10 adsorbs the first area 31 of the workpiece 30 , and the adjustment member 20 can be moved to the carrier The position of the part 10 is adjusted to sandwich the workpiece 30 between the carrier 10 and the adjustment part 20, and the workpiece 30 is pre-leveled by the second adsorption unit 21 (shown in FIG. 4) of the adjustment part 20 to ensure that the subsequent processing The flatness of the workpiece 30 is required to ensure that the flatness of the semiconductor workpiece 30 is within a preset range.

In the description of this specification, reference is made to the terms "some embodiments," "one embodiment," "some embodiments," "exemplary embodiments," "examples," "specific examples," or "some examples." Described means that a particular feature, structure, material, or characteristic described in connection with the described embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features delimited with "first", "second" may expressly or implicitly include at least one of said features. In the description of the present application, "plurality" means at least two, such as two, three, unless expressly and specifically defined otherwise.

Although the embodiments of the present application have been shown and described above, it should be understood that the above embodiments are exemplary and should not be construed as limitations to the present application. Variations, modifications, substitutions, and alterations are made to the embodiments, and the scope of the present application is defined by the claims and their equivalents.

Claims (11)

1. A load bearing device, comprising:

the bearing part is provided with a groove, the side wall of the groove comprises a bearing surface, the bearing surface is provided with a first adsorption unit, the first adsorption unit is used for adsorbing a first area of a workpiece on the bearing surface, the groove corresponds to a second area of the workpiece, and the bottom wall of the groove is spaced from the second area of the workpiece; and

the adjusting piece comprises a second adsorption unit, the second adsorption unit is used for adsorbing the workpiece so that the flatness of the workpiece is within a preset range, and the adjusting piece can move so that the workpiece is clamped between the bearing piece and the adjusting piece.

2. The carrier as claimed in claim 1, wherein the adjustment member is disposed coaxially with the carrier.

3. The carrier of claim 1, wherein a sealed cavity is formed between the workpiece and the carrier when the workpiece is sandwiched between the carrier and the conditioning element.

4. The carrier device of claim 1, wherein the first adsorption unit comprises an annular first air groove disposed on the carrying surface; or the first adsorption unit comprises a plurality of first air holes which are mutually spaced and uniformly distributed on the bearing surface.

5. The carrier as claimed in claim 1, wherein the carrier comprises:

the first driving piece is used for driving the adjusting piece to move and/or rotate; and/or

And the second driving piece is used for driving the bearing piece to move and/or rotate.

6. The carrier device according to claim 1, wherein the second adsorption unit comprises a plurality of annular second air grooves provided in the conditioning member, each of the second air grooves being concentric; or

The second adsorption unit comprises a plurality of second air holes which are mutually spaced and uniformly distributed; or

The adjusting piece is of a porous ceramic structure, and the second adsorption unit comprises a plurality of second air holes of the porous ceramic structure.

7. The carrier as claimed in claim 1, wherein the recess is circular and the bearing surface corresponds to the first region of the workpiece.

8. The carrying device as claimed in claim 1, wherein the number of the grooves is plural, a plurality of the grooves with gradually increasing sizes are formed in sequence from the center to the periphery of the carrying device, the workpieces with different sizes can be carried on the carrying surfaces of the plurality of the grooves, and the groove with the largest size is located at the bottom surface of the groove with the larger size; the number of the adjusting pieces is multiple, and each adjusting piece corresponds to one bearing surface of the groove.

9. A semiconductor processing apparatus, comprising:

a processing device; and

the carrier of any of claims 1-8, wherein the processing device corresponds to the carrier and is configured to process a workpiece carried on the carrier.

10. A method for using a carrier, comprising:

placing a workpiece on a bearing piece, enabling a first area of the workpiece to be located on a bearing surface of the bearing piece, and enabling a second area of the workpiece to correspond to a groove of the bearing piece and be spaced from the bottom wall of the groove;

moving an adjusting piece to a first side of the workpiece, which is far away from the bearing piece, and forming a sealed cavity between a second side of the workpiece and the bearing piece, wherein the first side of the workpiece is opposite to the second side of the workpiece;

adsorbing the workpiece by using a second adsorption unit of the adjusting piece so that the flatness of the workpiece is within a preset range;

adsorbing a first region of the workpiece with a first adsorption unit on the bearing surface; and

and closing the second adsorption unit and moving away the adjusting piece, wherein the first adsorption unit keeps adsorbing the first area of the workpiece on the bearing surface.

11. A method for using a carrier, comprising:

placing a workpiece on the adjusting member;

adsorbing the workpiece by using a second adsorption unit of the adjusting piece and enabling the flatness of the workpiece to be within a preset range;

moving an adjusting piece to a first side of the workpiece, which is far away from the bearing piece, and enabling a first area of the workpiece to be located on a bearing surface of the bearing piece, and a second area of the workpiece to correspond to the groove of the bearing piece and be spaced from the bottom wall of the groove, wherein a sealed cavity is formed between the workpiece and the bearing piece, and the first side of the workpiece is opposite to the second side of the workpiece;

adsorbing a first region of the workpiece with a first adsorption unit on the bearing surface; and

and closing the second adsorption unit and moving away the adjusting piece, wherein the first adsorption unit keeps adsorbing the first area of the workpiece on the bearing surface.

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