JP2001185607A5 - - Google Patents
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- JP2001185607A5 JP2001185607A5 JP1999370883A JP37088399A JP2001185607A5 JP 2001185607 A5 JP2001185607 A5 JP 2001185607A5 JP 1999370883 A JP1999370883 A JP 1999370883A JP 37088399 A JP37088399 A JP 37088399A JP 2001185607 A5 JP2001185607 A5 JP 2001185607A5
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- substrate
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- shaped convex
- negative pressure
- holding device
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- 239000000758 substrate Substances 0.000 description 74
- 238000007789 sealing Methods 0.000 description 34
- 238000001179 sorption measurement Methods 0.000 description 20
- 235000012431 wafers Nutrition 0.000 description 13
- 230000002093 peripheral effect Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 2
- 230000004304 visual acuity Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Description
【特許請求の範囲】
【請求項１】基板の吸着時に負圧となる負圧領域に均等に配置され、前記基板の支持面を構成する複数のピン状凸部と、前記ピン状凸部が配置される位置よりも基板の外周側に離れて配置され、前記負圧領域を外気からシールしてその内側に構成するためのシール用縁堤部とを備え、このシール用縁堤部の上面は前記支持面より低いことを特徴とする基板吸着保持装置。
【請求項２】各隣接ピン状凸部間の平均間隔をＮとすれば、前記シール用縁堤部と、それに直近の前記ピン状凸部との間の距離は、０．３〜０．４×Ｎであることを特徴とする請求項１に記載の基板吸着保持装置。
【請求項３】基板の吸着時に負圧となる負圧領域に均等に配置され、前記基板の支持面を構成する複数のピン状凸部と、前記ピン状凸部が配置される位置よりも基板の外周側に離れて配置され、前記負圧領域を外気からシールしてその内側に構成するためのシール用縁堤部とを備え、このシール用縁堤部の外側に、前記基板の支持面を構成する１または２以上のピン状凸部を有することを特徴とする基板吸着保持装置。
【請求項４】前記シール用縁堤部の上面は前記支持面より低いことを特徴とする請求項３に記載の基板吸着保持装置。
【請求項５】前記シール用縁堤部内側の各隣接ピン状凸部間の平均間隔をＮとすれば、前記シール用縁堤部と、その内側でかつ直近の前記ピン状凸部との間の距離は、０．５〜０．７×Ｎであることを特徴とする請求項３または４に記載の基板吸着保持装置。
【請求項６】前記シール用縁堤部内側の各隣接ピン状凸部間の平均間隔をＮとすれば、前記外側のピン状凸部と、前記シール用縁堤部の内側でかつそれに直近の前記ピン状凸部との間の距離は２×Ｎ以下であることを特徴とする請求項３〜５のいずれか１項に記載の基板吸着保持装置。
【請求項７】前記外側と内側のピン状凸部は、上面の面積が等しいことを特徴とする請求項３〜６のいずれか１項に記載の基板吸着保持装置。
【請求項８】前記基板の吸着時には、前記基板と前記シール用縁堤部の上面は接触しないものであることを特徴とする請求項１または２または４〜７のいずれか１項に記載の基板吸着保持装置。
【請求項９】前記基板の吸着時には、前記基板と前記シール用縁堤部の上面は接触するものであることを特徴とする請求項１または２または４〜７のいずれか１項に記載の基板吸着保持装置。
【請求項１０】基板の吸着時に負圧となる負圧領域に均等に配置され、前記基板の支持面を構成する複数のピン状凸部と、前記負圧領域において開口した１または２以上の前記基板のリフトピン用の穴部と、前記ピン状凸部と離れて配置され、前記穴部と前記負圧領域との間をシールするシール用縁堤部とを備え、このシール用縁堤部の上面は前記支持面より低く、かつ前記基板の吸着時に前記基板と接触しないものであることを特徴とする基板吸着保持装置。
【請求項１１】基板の吸着時に負圧となる負圧領域に均等に配置され、前記基板の支持面を構成する複数のピン状凸部と、前記負圧領域において開口した１または２以上の前記基板のリフトピン用の穴部と、前記ピン状凸部と離れて配置され、前記穴部と前記負圧領域との間をシールするシール用縁堤部とを備え、このシール用縁堤部よりも前記穴部側に、前記基板の支持面を構成する１または２以上のピン状凸部を有することを特徴とする基板吸着保持装置。
【請求項１２】前記シール用縁堤部の上面は前記支持面より低いことを特徴とする請求項１１に記載の基板吸着保持装置。
【請求項１３】前記基板の吸着時には、前記基板と前記シール用縁堤部の上面は接触しないものであることを特徴とする請求項１２に記載の基板吸着保持装置。
【請求項１４】前記基板の吸着時には、前記基板と前記シール用縁堤部の上面は接触するものであることを特徴とする請求項１２に記載の基板吸着保持装置。
【請求項１５】前記基板の吸着時において前記基板の裏面と、前記ピン状凸部または前記ピン状凸部および前記シール用縁堤部とが接触する部分の面積の、前記基板の裏面の面積に対する割合は１％以下であることを特徴とする請求項１〜１４のいずれか１項に記載の基板吸着保持装置。
【請求項１６】前記基板の吸着時において前記基板の裏面と前記負圧領域に配置されたピン状凸部とが接触する部分の面積をＭとし、前記負圧領域に配置された各隣接ピン状凸部間の平均間隔をＮとすれば、Ｍ／Ｎ＾２＜０．０１となる関係を有することを特徴とする請求項１〜１４のいずれか１項に記載の基板吸着保持装置。
【請求項１７】前記負圧領域に配置された各隣接ピン状凸部間の平均間隔をＮとすれば、前記シール用縁堤の幅は０．２×Ｎ以下であることを特徴とする請求項１〜１６のいずれか１項に記載の基板吸着保持装置。
【請求項１８】請求項１〜１７のいずれか１項の基板吸着保持装置により基板を吸着保持する工程と、この吸着保持された基板に対して露光を行う工程とを具備することを特徴とするデバイス製造方法。
[Claims]
1. A plurality of pin-shaped convex portions that are evenly arranged in a negative pressure region that becomes a negative pressure when the substrate is attracted and constitute a support surface of the substrate, and a position where the pin-shaped convex portions are arranged. It is arranged apart from the outer peripheral side of the substrate, and is provided with a sealing edge portion for sealing the negative pressure region from the outside air and forming the inside thereof, and the upper surface of the sealing edge portion is lower than the supporting surface. A substrate adsorption and holding device characterized by this.
2. Assuming that the average distance between the adjacent pin-shaped convex portions is N, the distance between the sealing edge bank portion and the pin-shaped convex portion closest thereto is 0.3 to 0. The substrate adsorption holding device according to claim 1, wherein the substrate is 4 × N.
3. A plurality of pin-shaped convex portions that are evenly arranged in a negative pressure region that becomes a negative pressure when the substrate is attracted and constitute a support surface of the substrate, and a position where the pin-shaped convex portions are arranged. It is provided on the outer peripheral side of the substrate and is provided with a sealing rim portion for sealing the negative pressure region from the outside air and forming the inside thereof, and the substrate is supported on the outside of the sealing rim portion. A substrate adsorption holding device having one or more pin-shaped convex portions constituting a surface.
4. The substrate adsorption and holding device according to claim 3, wherein the upper surface of the sealing edge bank portion is lower than the support surface.
5. Assuming that the average distance between the adjacent pin-shaped convex portions inside the sealing edge bank portion is N, the sealing edge bank portion and the pin-shaped convex portion inside and closest to the sealing edge bank portion are located. The substrate adsorption holding device according to claim 3 or 4, wherein the distance between them is 0.5 to 0.7 × N.
6. Assuming that the average distance between the adjacent pin-shaped convex portions on the inside of the sealing edge bank portion is N, the outer pin-shaped convex portion and the inside and closest to the outer pin-shaped convex portion and the sealing edge bank portion. The substrate adsorption holding device according to any one of claims 3 to 5, wherein the distance between the pin-shaped convex portion and the above-mentioned pin-shaped convex portion is 2 × N or less.
7. The substrate adsorption holding device according to claim 3, wherein the outer and inner pin-shaped convex portions have the same area on the upper surface.
8. The invention according to claim 1, wherein the substrate and the upper surface of the sealing edge bank do not come into contact with each other when the substrate is adsorbed. Substrate adsorption and holding device.
9. The invention according to claim 1, wherein the substrate and the upper surface of the sealing edge bank are in contact with each other when the substrate is adsorbed. Substrate adsorption and holding device.
10. A plurality of pin-shaped protrusions that are evenly arranged in a negative pressure region that becomes a negative pressure when the substrate is attracted and constitutes a support surface of the substrate, and one or two or more openings in the negative pressure region. A hole for a lift pin of the substrate and a sealing edge portion which is arranged apart from the pin-shaped convex portion and seals between the hole and the negative pressure region are provided, and the sealing edge portion is provided. The substrate adsorption holding device is characterized in that the upper surface of the substrate is lower than the support surface and does not come into contact with the substrate when the substrate is adsorbed.
11. A plurality of pin-shaped protrusions that are evenly arranged in a negative pressure region that becomes a negative pressure when the substrate is attracted and constitutes a support surface of the substrate, and one or two or more openings in the negative pressure region. A hole for a lift pin of the substrate and a sealing edge portion which is arranged apart from the pin-shaped convex portion and seals between the hole and the negative pressure region are provided, and the sealing edge portion is provided. A substrate adsorption holding device, characterized in that it has one or more pin-shaped convex portions forming a support surface of the substrate on the hole side.
12. The substrate adsorption and holding device according to claim 11, wherein the upper surface of the sealing edge bank portion is lower than the support surface.
13. The substrate adsorption holding device according to claim 12, wherein the substrate and the upper surface of the sealing edge bank do not come into contact with each other when the substrate is adsorbed.
14. The substrate adsorption holding device according to claim 12, wherein when the substrate is adsorbed, the substrate and the upper surface of the sealing edge bank are in contact with each other.
15. The area of the back surface of the substrate, which is the area of the back surface of the substrate and the pin-shaped convex portion or the portion where the pin-shaped convex portion and the sealing edge bank portion come into contact with each other when the substrate is adsorbed. The substrate adsorption holding device according to any one of claims 1 to 14, wherein the ratio to the amount of the substrate is 1% or less.
16. Adjacent pins arranged in the negative pressure region, where M is the area of a portion where the back surface of the substrate and the pin-shaped convex portion arranged in the negative pressure region come into contact with each other when the substrate is adsorbed. The substrate adsorption holding device according to any one of claims 1 to 14, wherein if the average distance between the convex portions is N, the relationship is such that M / N ^ 2 <0.01.
17. The width of the sealing edge bank is 0.2 × N or less, where N is the average distance between the adjacent pin-shaped protrusions arranged in the negative pressure region. The substrate adsorption holding device according to any one of claims 1 to 16.
18. A feature is characterized by comprising a step of sucking and holding a substrate by the substrate suction and holding device according to any one of claims 1 to 17, and a step of exposing the suction-held substrate. Device manufacturing method.
【０００２】
【従来の技術】
近年、半導体素子製造に用いられる縮小投影露光装置は、素子の微細化に対応するため、レンズの高ＮＡ化が進んでいる。しかし、高ＮＡ化によって解像力は向上するものの、有効な焦点深度は逆に減少してしまう。そこで、解像力は維持し、かつ十分な実用深度を確保するために、投影光学系の像面湾曲の軽減や、基板の厚みムラ改善や、チャック（基盤吸着保持装置）の平面精度の向上などの種々の改善が図られつつある。
0002.
[Conventional technology]
In recent years, in the reduction projection exposure apparatus used for manufacturing semiconductor devices, the NA of the lens has been increased in order to cope with the miniaturization of the device. However, although the resolving power is improved by increasing the NA, the effective depth of focus is conversely reduced. Therefore, in order to maintain the resolving power and secure a sufficient practical depth, the curvature of field of the projection optical system is reduced, the thickness unevenness of the substrate is improved, and the plane accuracy of the chuck (base adsorption holding device) is improved. Various improvements are being made.
【０００６】
【発明が解決しようとする課題】
半導体製造工程の中でも基板上に微細なパターンを露光転写するリソグラフィ工程では素子の微細化に伴って焦点深度が減少してきており、その実用深度は１μｍ以下の世代に突入しつつある。素子製造のプロセスマージンを考慮すると、ウェハチャック（基盤吸着保持装置）上で平面矯正されるウェハは少なくとも焦点深度の１／５〜１／１０程度の平面度に平坦化する必要がある。特に重要となるチャックの機能は、プロセスを経てそりの発生したウェハであっても、ウェハ外周周辺まで全面にわたって平面矯正することである。現状は、ベアウェハで１００μｍ、薄膜を形成した処理ウェハにおいては２００μｍを超えるそりをもつものも存在する。真空チャックのそりウェハに対する平面矯正は、そり上がったウェハの上面から押し付ける大気圧力の作用によって達成する。特に外周部に反りの発生しやすいプロセスウェハの場合、チャック外周部の真空度を確保することが重要となる。従来のチャックでは、この外周部における矯正能力が十分でない。
0006
[Problems to be Solved by the Invention]
Among the semiconductor manufacturing processes, in the lithography process of exposing and transferring a fine pattern on a substrate, the depth of focus is decreasing with the miniaturization of elements, and the practical depth is entering the generation of 1 μm or less. Considering the process margin of device manufacturing, the wafer to be flattened on the wafer chuck (base adsorption holding device) needs to be flattened to at least 1/5 to 1/10 of the depth of focus. A particularly important function of the chuck is to straighten the entire surface up to the periphery of the outer periphery of the wafer, even if the wafer is warped through the process. At present, some bare wafers have a warp of 100 μm, and some processed wafers on which a thin film is formed have a warp of more than 200 μm. The plane straightening of the vacuum chuck against the warped wafer is achieved by the action of atmospheric pressure pressed from the top surface of the warped wafer. In particular, in the case of a process wafer in which the outer peripheral portion is likely to warp, it is important to secure the degree of vacuum on the outer peripheral portion of the chuck. The conventional chuck does not have sufficient straightening ability at this outer peripheral portion.
【００１０】
【課題を解決するための手段】
上述の課題を解決するため、本発明の基板吸着保持装置は、基板の吸着時に負圧となる負圧領域に均等に配置され、前記基板の支持面を構成する複数のピン状凸部と、前記ピン状凸部が配置される位置よりも基板の外周側に離れて配置され、前記負圧領域を外気からシールしてその内側に構成するためのシール用縁堤部とを備え、このシール用縁堤部の上面は前記支持面より低いことを特徴とする。
0010
[Means for solving problems]
In order to solve the above-mentioned problems, the substrate suction holding device of the present invention is uniformly arranged in a negative pressure region that becomes a negative pressure when the substrate is sucked, and has a plurality of pin-shaped convex portions constituting the support surface of the substrate. The pin-shaped convex portion is arranged farther from the outer peripheral side of the substrate than the position where the pin-shaped convex portion is arranged, and is provided with a sealing edge bank portion for sealing the negative pressure region from the outside air and forming the inside thereof. The upper surface of the edge bank portion is lower than the support surface.
さらに本発明の基板吸着保持装置は、基板の吸着時に負圧となる負圧領域に均等に配置され、前記基板の支持面を構成する複数のピン状凸部と、前記ピン状凸部が配置される位置よりも基板の外周側に離れて配置され、前記負圧領域を外気からシールしてその内側に構成するためのシール用縁堤部とを備え、このシール用縁堤部の外側に、前記基板の支持面を構成する１または２以上のピン状凸部を有することを特徴とする。 Further, the substrate suction holding device of the present invention is evenly arranged in a negative pressure region that becomes a negative pressure when the substrate is sucked, and a plurality of pin-shaped convex portions constituting the support surface of the substrate and the pin-shaped convex portions are arranged. It is arranged on the outer peripheral side of the substrate from the position where it is formed, and is provided with a sealing rim portion for sealing the negative pressure region from the outside air and forming the inside thereof, and is provided on the outside of the sealing rim portion. It is characterized by having one or more pin-shaped convex portions constituting the support surface of the substrate.
さらに本発明の基板吸着保持装置は、基板の吸着時に負圧となる負圧領域に均等に配置され、前記基板の支持面を構成する複数のピン状凸部と、前記負圧領域において開口した１または２以上の前記基板のリフトピン用の穴部と、前記ピン状凸部と離れて配置され、前記穴部と前記負圧領域との間をシールするシール用縁堤部とを備え、このシール用縁堤部の上面は前記支持面より低く、かつ前記基板の吸着時に前記基板と接触しないものであることを特徴とする。 Further, the substrate suction holding device of the present invention is evenly arranged in a negative pressure region that becomes a negative pressure when the substrate is sucked, and is opened in a plurality of pin-shaped convex portions constituting the support surface of the substrate and in the negative pressure region. It is provided with one or more holes for lift pins of the substrate, and a sealing edge portion that is arranged apart from the pin-shaped convex portion and seals between the holes and the negative pressure region. The upper surface of the sealing edge bank portion is lower than the support surface and does not come into contact with the substrate when the substrate is adsorbed .
さらに本発明の基板吸着保持装置は、基板の吸着時に負圧となる負圧領域に均等に配置され、前記基板の支持面を構成する複数のピン状凸部と、前記負圧領域において開口した１または２以上の前記基板のリフトピン用の穴部と、前記ピン状凸部と離れて配置され、前記穴部と前記負圧領域との間をシールするシール用縁堤部とを備え、このシール用縁堤部よりも前記穴部側に、前記基板の支持面を構成する１または２以上のピン状凸部を有することを特徴とする。 Further, the substrate suction holding device of the present invention is evenly arranged in a negative pressure region that becomes a negative pressure when the substrate is sucked, and is opened in a plurality of pin-shaped convex portions constituting the support surface of the substrate and in the negative pressure region. It is provided with one or more holes for lift pins of the substrate, and a sealing edge portion that is arranged apart from the pin-shaped convex portion and seals between the holes and the negative pressure region. It is characterized by having one or more pin-shaped convex portions forming a support surface of the substrate on the hole portion side of the sealing edge bank portion.
［ウェハチャックの実施形態］
図３は、チャック５の第１の実施形態を示す平面図である。図１は、このチャック５の外周部付近の断面図である。ウェハ２を載置する支持面は、複数のピン状凸部５１ａで構成され、ピン状凸部５１ａの先端面は、高精度のラップ加工によって超平面を形成している。ピン状凸部５１ａは、ピン径がφ０．２ｍｍであり、配列ピッチ２ｍｍで格子状に並んでいる。また、この格子状に並んだピン状凸部の他にも、後述するシール用土手部（縁堤部）５３の内側に沿って環状にピン状凸部が配列されている。チャックの上面側には、真空源に連通する真空吸着用の穴５２が少なくとも１個設けられている。ピン状凸部５１ａの配列としてはこの例に限らず、図４のように円周状に配置したり、６０度千鳥格子配置や、平均ピンピッチが一定のランダムなピン配置であってもよい。ただしいずれの場合にも、平均ピンピッチが２ｍｍ程度となるものが、吸着時のウェハたわみ（負圧力によるウェハ変形）が少なく、良好な結果を示している。
[Wafer chuck embodiment]
FIG. 3 is a plan view showing a first embodiment of the chuck 5. FIG. 1 is a cross-sectional view of the vicinity of the outer peripheral portion of the chuck 5. The support surface on which the wafer 2 is placed is composed of a plurality of pin-shaped convex portions 51a, and the tip surface of the pin-shaped convex portions 51a forms a hyperplane by high-precision lapping. The pin-shaped convex portions 51a have a pin diameter of φ0.2 mm and are arranged in a grid pattern with an arrangement pitch of 2 mm. Further, in addition to the pin-shaped convex portions arranged in a grid pattern, pin-shaped convex portions are arranged in an annular shape along the inside of the sealing bank portion (edge bank portion) 53, which will be described later. At least one hole 52 for vacuum suction that communicates with the vacuum source is provided on the upper surface side of the chuck. The arrangement of the pin-shaped convex portions 51a is not limited to this example, and may be arranged in a circumferential shape as shown in FIG. 4, a 60-degree houndstooth arrangement, or a random pin arrangement in which the average pin pitch is constant. .. However, in each case, when the average pin pitch is about 2 mm, the wafer deflection at the time of adsorption (wafer deformation due to negative pressure) is small, and good results are shown.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP37088399A JP2001185607A (en) | 1999-12-27 | 1999-12-27 | Substrate suction holding device and device manufacturing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP37088399A JP2001185607A (en) | 1999-12-27 | 1999-12-27 | Substrate suction holding device and device manufacturing method |
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| Publication Number | Publication Date |
|---|---|
| JP2001185607A JP2001185607A (en) | 2001-07-06 |
| JP2001185607A5 true JP2001185607A5 (en) | 2007-11-29 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100804006B1 (en) * | 2000-01-28 | 2008-02-18 | 히다치 도쿄 에렉트로닉스 가부시키가이샤 | Wafer chuck, exposure system, and method of manufacturing semiconductor device |
| JP4288694B2 (en) * | 2001-12-20 | 2009-07-01 | 株式会社ニコン | Substrate holding apparatus, exposure apparatus, and device manufacturing method |
| KR100533586B1 (en) * | 2002-10-14 | 2005-12-06 | 주식회사 테라세미콘 | Wafer holder for supporting semiconductor wafer |
| JP2005175016A (en) * | 2003-12-08 | 2005-06-30 | Canon Inc | Substrate holding device, exposure device using the same, and method of manufacturing device |
| KR100818842B1 (en) * | 2006-12-27 | 2008-04-01 | 주식회사 실트론 | Wafer support pin in capable of preventing slip during thermal treatment to wafer and thermal treatment method to wafer |
| JP4899879B2 (en) * | 2007-01-17 | 2012-03-21 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing method, and storage medium |
| JP5126662B2 (en) * | 2007-10-31 | 2013-01-23 | Ｔｏｔｏ株式会社 | Electrostatic chuck |
| JP2009212344A (en) * | 2008-03-05 | 2009-09-17 | Nsk Ltd | Work chuck, aligner, and process for producing flat panel |
| JP2009212345A (en) * | 2008-03-05 | 2009-09-17 | Nsk Ltd | Work chuck, aligner, and process for producing flat panel |
| US8913230B2 (en) * | 2009-07-02 | 2014-12-16 | Canon Nanotechnologies, Inc. | Chucking system with recessed support feature |
| JP5656392B2 (en) * | 2009-11-27 | 2015-01-21 | キヤノン株式会社 | Substrate holding apparatus, exposure apparatus using the same, and device manufacturing method |
| EP2927947B1 (en) * | 2012-11-28 | 2020-05-06 | Kyocera Corporation | Placement member and method for manufacturing same |
| JP5538613B1 (en) * | 2013-11-13 | 2014-07-02 | 東京エレクトロン株式会社 | Joining apparatus and joining system |
| KR101885750B1 (en) * | 2014-01-20 | 2018-08-06 | 에이에스엠엘 네델란즈 비.브이. | Substrate holder and support table for lithography |
| US11104057B2 (en) * | 2015-12-11 | 2021-08-31 | Canon Kabushiki Kaisha | Imprint apparatus and method of imprinting a partial field |
| JP6588367B2 (en) * | 2016-03-22 | 2019-10-09 | 日本特殊陶業株式会社 | Substrate support member |
| WO2018145866A1 (en) | 2017-02-10 | 2018-08-16 | Asml Holding N.V. | Reticle clamping device |
| US20220351951A1 (en) * | 2021-04-29 | 2022-11-03 | Applied Materials, Inc. | Substrate support apparatus, methods, and systems having elevated surfaces for heat transfer |
| WO2023144993A1 (en) * | 2022-01-28 | 2023-08-03 | 株式会社ニコン | First holding device, third holding device, fifth holding device, conveyance system, exposure system, exposure method, and method for manufacturing device |
-
1999
- 1999-12-27 JP JP37088399A patent/JP2001185607A/en not_active Withdrawn
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