JP2613035B2 - Substrate suction fixing device - Google Patents
Substrate suction fixing deviceInfo
- Publication number
- JP2613035B2 JP2613035B2 JP61290708A JP29070886A JP2613035B2 JP 2613035 B2 JP2613035 B2 JP 2613035B2 JP 61290708 A JP61290708 A JP 61290708A JP 29070886 A JP29070886 A JP 29070886A JP 2613035 B2 JP2613035 B2 JP 2613035B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- suction
- hole
- receiving surface
- fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
本発明は、半導体基板などの種々の基板に微細パター
ンを露光するための露光装置に用いて好適な基板吸着固
定装置に関する。The present invention relates to a substrate suction fixing device suitable for use in an exposure device for exposing a fine pattern to various substrates such as a semiconductor substrate.
従来、第３図を伴なって次に述べる構成を有する基板
吸着固定装置が提案されている。 すなわち、基板吸着固定手段Ａと、基板受渡手段Ｂと
を有する。 基板吸着固定手段Ａは、平らな基板受面２と、その基
板受面２に臨み且つ吸気用連絡孔４及び吸気用外部連結
管５を介して外部の吸気手段（図示せず）に連結される
例えば格子状パターンに形成された吸着用溝３とを有す
る基板吸着固定用板体１を有する。 また、基板受渡手段Ｂは、比較的大きな面積の基板受
面13を有する板状の基板受部12と、その基板受部12から
基板受面13と直交する方向に延長している支持部14とを
有する１つの基板支持体11を有する。 この基板支持体11の基板受部12には、支持部14内にそ
の長さ方向に沿って延長している吸気用孔16を介して外
部の吸気手段（図示せず）に連結される、基板受面13に
臨んでいる吸着用溝15が設けられている。 さらに、上述した基板吸着固定手段Ａを構成している
基板吸着固定用板体１には、基板吸着固定用板体１の基
板受面２の中央部に、基板受面２と直交する方向に延長
し、且つ上述した基板受渡手段Ｂを構成している基板支
持体11の基板受部12の基板受面13を、基板吸着固定用板
体１の基板受面２と平行であるがそれよりも下がってい
る面上と基板吸着固定用板体１の基板受面２と平行であ
るがそれよりも上っている面上とに選択的に持来し得る
ように、基板支持体11を可動自在に配している貫通孔６
が形成されている。 以上が、従来提案されている基板吸着固定装置の構成
である。 このような構成を有する従来の基板吸着固定装置によ
れば、真空吸着機構を有する基板固定用板（基板吸着固
定手段Ａを構成している基板吸着固定用板体１）と、そ
の基板固定用板に設けられた貫通孔（６）を通して上下
する基板支持棒（基板支持体11）からなる基板上下支持
機構（基板受渡手段Ｂ）とを有する、という構成を有し
ているということができるが、第３図Ｂに示すような、
基板受渡手段Ｂを構成している基板支持体11が、その基
板受部12の基板受面13を、基板吸着固定手段Ａを構成し
ている基板吸着固定用板体１の貫通孔６内における基板
受面２と平行であるがそれよりも下がっている面上に持
来たしている、という基板吸着固定用板体１との相対位
置関係を有している状態から、吸着固定させるべき基板
21を、適当な基板搬送手段（図示せず）によって、基板
吸着固定用板体１の上方位置に、その基板受面２と対向
して、持来たし、そして、基板支持体11を、適当な駆動
手段（図示せず）によって、上方に移動させ、それによ
って、基板支持体11の基板受部12を、その基板受面13が
基板吸着固定用板体１の基板受面２と平行な関係を保っ
ている状態で、貫通孔６内に、上方に向って貫通させれ
ば、第３図Ｃに示すように、基板支持体11の基板受部12
の基板受面13によって、基板21を、その下方から受けさ
せることができる。従って、基板21を、上述した基板搬
送手段から、基板支持体11の基板受面13上に受渡すこと
ができる。 この場合、基板支持体11の基板受部12の吸着用溝15
は、基板21によって上方から塞がれた状態になるが、そ
の吸着用溝15に吸気用孔16を介して予め外部の吸気手段
を連結しておき、そして、その吸気手段を予め作動させ
ておけば、その吸気手段によって基板支持体11の吸気用
溝15の排気が行われるので、基板21が基板支持体11の基
板受面13上に受渡されている状態が、基板21が基板支持
体11の基板受面13上に吸着固定されている状態で得られ
る。 また、上述したように、基板21が基板支持体11の基板
受面13上に受渡されている状態から、基板支持体11を、
駆動手段によって、下方に移動させ、それによって、基
板支持体11の基板受部12を、その基板受面13が基板吸着
固定用板体１の基板受面２よりも下っている面上にある
ように持来せば、第３図Ｄに示すように、基板21を、基
板支持体11の基板受面13上から、基板吸着固定用板体１
の基板受面２上に受渡すことができる。 この場合、基板吸着固定用板体１の吸着用溝３は、基
板21によって上方から塞がれた状態になるが、その吸気
用溝３に連通している基板吸着固定用板体１の吸気用外
部連結管５に予め外部の吸気手段を連結しておき、そし
て、その吸気手段を予め作動させておけば、基板吸着固
定用板体１の吸気用溝３の排気が行なわれるので、基板
21が基板吸着固定用板体１の基板受面２上に受渡されて
いる状態が、基板21が基板吸着固定用板体１の基板受面
２上に吸着固定されている状態で得られる。Conventionally, there has been proposed a substrate suction fixing device having the following configuration with reference to FIG. That is, it has a substrate suction fixing means A and a substrate delivery means B. The substrate suction fixing means A is connected to an external suction means (not shown) via a flat substrate receiving surface 2, the substrate receiving surface 2, and via an intake communication hole 4 and an intake external connection pipe 5. For example, a plate 1 for holding and fixing a substrate having suction grooves 3 formed in a lattice pattern. Further, the substrate delivery means B includes a plate-shaped substrate receiving portion 12 having a substrate receiving surface 13 having a relatively large area, and a supporting portion 14 extending from the substrate receiving portion 12 in a direction orthogonal to the substrate receiving surface 13. And one substrate support 11 having: The substrate receiving portion 12 of the substrate support 11 is connected to an external intake means (not shown) through an intake hole 16 extending in the support portion 14 along its length direction. A suction groove 15 facing the substrate receiving surface 13 is provided. Further, the plate 1 for substrate suction and fixing, which constitutes the above-mentioned substrate suction and fixing means A, is provided at the center of the substrate receiving surface 2 of the plate for substrate adsorption and fixing 1 in a direction orthogonal to the substrate receiving surface 2. The substrate receiving surface 13 of the substrate receiving portion 12 of the substrate support 11 which extends and constitutes the above-described substrate delivery means B is parallel to the substrate receiving surface 2 of the substrate 1 for holding and fixing the substrate. Substrate support 11 so that it can be selectively brought on the lower surface and the surface parallel to, but higher than, the substrate receiving surface 2 of the substrate 1 for holding and fixing the substrate. Through hole 6 movably arranged
Are formed. The above is the configuration of the conventionally proposed substrate suction fixing device. According to the conventional substrate suction fixing device having such a configuration, a substrate fixing plate having a vacuum suction mechanism (the substrate suction fixing plate 1 constituting the substrate suction fixing means A) and the substrate fixing plate It can be said that the structure has a substrate vertical support mechanism (substrate delivery means B) composed of a substrate support rod (substrate support 11) that moves up and down through a through hole (6) provided in the plate. , As shown in FIG. 3B,
The substrate support 11 constituting the substrate transfer means B is provided so that the substrate receiving surface 13 of the substrate receiving portion 12 is in the through hole 6 of the substrate suction fixing plate 1 constituting the substrate adsorption fixing means A. The substrate to be sucked and fixed from a state in which it is brought into a position parallel to the substrate receiving surface 2 but lower than the board receiving surface 2 and has a relative positional relationship with the plate 1 for sucking and fixing the substrate.
The substrate 21 is brought into a position above the substrate suction and fixing plate 1 by a suitable substrate transfer means (not shown), facing the substrate receiving surface 2, and the substrate support 11 is moved to an appropriate position. By driving means (not shown), the substrate receiving portion 12 of the substrate support 11 is moved upward by the driving means (not shown), so that the substrate receiving surface 13 is parallel to the substrate receiving surface 2 of the substrate 1 for holding and fixing the substrate. In the state where the substrate holder 11 is held, if it is made to penetrate upward through the through-hole 6, as shown in FIG.
The substrate 21 can be received from below by the substrate receiving surface 13. Therefore, the substrate 21 can be transferred from the above-described substrate transfer means onto the substrate receiving surface 13 of the substrate support 11. In this case, the suction groove 15 of the substrate receiving portion 12 of the substrate support 11 is used.
Is closed from above by the substrate 21, but an external suction means is previously connected to the suction groove 15 through a suction hole 16, and the suction means is actuated in advance. In other words, the suction means exhausts the suction groove 15 of the substrate support 11, so that the substrate 21 is transferred to the substrate receiving surface 13 of the substrate support 11. It is obtained in a state of being adsorbed and fixed on the substrate receiving surface 13 of 11. Further, as described above, the substrate support 11 is moved from the state where the substrate 21 is delivered on the substrate receiving surface 13 of the substrate support 11,
It is moved downward by the driving means, whereby the substrate receiving portion 12 of the substrate support 11 is on a surface where the substrate receiving surface 13 is lower than the substrate receiving surface 2 of the substrate 1 for holding and fixing the substrate. Then, as shown in FIG. 3D, the substrate 21 is moved from the substrate receiving surface 13 of the substrate support 11 to the substrate 1 for adsorbing and fixing the substrate.
On the substrate receiving surface 2. In this case, the suction groove 3 of the substrate suction and fixing plate 1 is closed from above by the substrate 21, but the suction of the substrate suction and fixing plate 1 communicating with the suction groove 3 is performed. If an external suction means is connected to the external connecting pipe 5 in advance and the suction means is operated in advance, the suction groove 3 of the board 1 for sucking and fixing the substrate is exhausted.
The state in which the substrate 21 is transferred to the substrate receiving surface 2 of the substrate 1 for holding and fixing the substrate is obtained in a state where the substrate 21 is fixed by suction on the substrate receiving surface 2 of the plate 1 for holding and fixing the substrate.
第３図に示す従来の基板吸着固定装置によれば、基板
21を、基板吸着固定用板体１の基板受面２上に吸着して
固定させることができるので、基板21を、それに反りを
有していても、それを矯正して、基板吸着固定用板体１
の基板受面２上に固定させることができる。 しかしながら、第３図に示す基板吸着固定装置の場
合、基板吸着固定用板体１が、その貫通孔６を吸気用溝
３に連通させている構成を有さず、また、基板21が基板
吸着固定用板体１の基板受面２上に吸着固定されている
状態において、貫通孔６が基板21によって上方から塞が
れているとしても、その貫通孔６が排気される、という
構成を有していないので、基板21が基板吸着固定用板体
１の基板受面２上に吸着固定されている状態において、
基板21の貫通孔６に臨んでいる領域が、基板吸着固定用
板体１側に吸着されず、また、貫通孔６が大きな断面積
を有するので、上述においては、基板21がそれに反りを
有していても、それが矯正されて、基板吸着固定用板体
１の基板受面２上に固定させることができると述べた
が、それが不十分であり、実際上は、基板21を基板吸着
固定用板体１の基板受面２上に固定させている状態にお
いて、その基板21の貫通孔６に臨んでいる領域が、第３
図Ｄで点線に示すように、基板吸着固定用板体１の基板
受面２と同じ面から浮き上っている状態になっていたり
している。 例えば、第３図に示す従来の基板吸着固定装置を、例
えば半導体基板に微細パターンを露光するための露光装
置に適用した場合において、基板21が、直径150mm、厚
さ0.6〜0.7mmのシリコンウェハでなり、また、基板吸着
固定用板体１の貫通孔６が直径30mmの貫通孔である場
合、基板21の貫通孔６に臨んでいる領域が、中央部にお
いて、３〜10μｍも浮き上っている状態になっていたり
している。 従って、第３図に示す従来の基板吸着固定装置の場
合、基板21を、その全域に亘って、平らに、基板吸着固
定用板体１の基板受面２上に固定させることができず、
よって、例えば、半導体基板に微細パターンを露光する
ための露光装置に適用した場合、微細パターンを半導体
基板の全域に亘り、高精度に露光することができないな
ど、という欠点を有していた。 さらに述べれば、従来の基板吸着固定装置は、上述し
たように、真空吸着機構を有する基板固定用板（基板吸
着固定手段Ａを構成している基板吸着固定用板体１）
と、その基板固定用板に設けられた貫通孔（６）を通し
て上下する基板支持棒（基板支持体11）からなる基板上
下支持機構（基板受渡手段Ｂ）とを有する構成を有する
が、基板上下支持機構（基板受渡手段Ｂ）と基板固定用
板（基板吸着固定手段Ａを構成している基板吸着固定用
板体１）との間で気密が保たれるような構造を有してい
ないため、基板21を基板固定用板に吸着固定した場合、
十分な真空が保てず、その結果、基板の平面度矯正が不
十分で、焦点深度が１〜２μｍ程度しかない縮小投影露
光装置を使ってLSIパタンを形成した場合、パタンの解
像度不良、パタン寸法精度劣化、パタン重ね合わせ精度
の劣化等を引き起こして、LSIの歩留りを悪くする、と
いう欠点を有していた。 よって、本発明は上述した欠点のない、新規な基板吸
着固定装置を提案せんとするものである。According to the conventional substrate suction fixing device shown in FIG.
Since the substrate 21 can be attracted and fixed on the substrate receiving surface 2 of the substrate 1 for substrate adsorption and fixing, even if the substrate 21 has a warp, it is corrected and the substrate 21 is fixed. Plate 1
On the substrate receiving surface 2. However, in the case of the substrate suction fixing device shown in FIG. 3, the substrate body 1 does not have a configuration in which the through hole 6 communicates with the suction groove 3 and the substrate 21 does not support the substrate suction. In a state where the fixing plate 1 is suction-fixed on the substrate receiving surface 2, even if the through-hole 6 is closed from above by the substrate 21, the through-hole 6 is exhausted. In the state where the substrate 21 is fixed by suction on the substrate receiving surface 2 of the substrate 1 for fixing the substrate by suction,
Since the area of the substrate 21 facing the through hole 6 is not attracted to the substrate 1 for holding and fixing the substrate, and the through hole 6 has a large cross-sectional area, the substrate 21 has a warp in the above. Although it has been described that it can be corrected and fixed on the substrate receiving surface 2 of the substrate body 1 for adsorbing and fixing the substrate, it is insufficient, and in practice, the substrate 21 is In a state where the plate 21 for adsorption and fixation is fixed on the substrate receiving surface 2, the region facing the through hole 6 of the substrate 21 is the third region.
As shown by the dotted line in FIG. D, the board may be floating from the same surface as the board receiving surface 2 of the board for fixing and holding the board 1. For example, when the conventional substrate suction fixing device shown in FIG. 3 is applied to, for example, an exposure device for exposing a fine pattern to a semiconductor substrate, the substrate 21 has a silicon wafer having a diameter of 150 mm and a thickness of 0.6 to 0.7 mm. When the through-hole 6 of the plate 1 for holding and fixing the substrate is a through-hole having a diameter of 30 mm, the area facing the through-hole 6 of the substrate 21 rises by 3 to 10 μm at the center. It is in a state where it is. Therefore, in the case of the conventional substrate suction fixing device shown in FIG. 3, the substrate 21 cannot be fixed flatly on the substrate receiving surface 2 of the substrate suction fixing plate 1 over the entire area thereof.
Therefore, for example, when the present invention is applied to an exposure apparatus for exposing a fine pattern on a semiconductor substrate, there has been a defect that the fine pattern cannot be exposed with high accuracy over the entire area of the semiconductor substrate. More specifically, as described above, the conventional substrate suction fixing device is a substrate fixing plate having a vacuum suction mechanism (the substrate suction fixing plate 1 constituting the substrate suction fixing means A).
And a substrate vertical support mechanism (substrate transfer means B) comprising a substrate support rod (substrate support 11) which moves up and down through a through hole (6) provided in the substrate fixing plate. It does not have a structure that maintains airtightness between the support mechanism (substrate delivery means B) and the substrate fixing plate (substrate suction fixing plate 1 constituting the substrate suction fixing means A). When the substrate 21 is fixed by suction to the substrate fixing plate,
Insufficient vacuum can be maintained, and as a result, when the LSI pattern is formed using a reduced projection exposure apparatus that has insufficient correction of the flatness of the substrate and a focal depth of only about 1 to 2 μm, poor pattern resolution and pattern This has the disadvantage that the dimensional accuracy is degraded, the pattern overlay accuracy is degraded, and the yield of the LSI is deteriorated. Therefore, the present invention is to propose a novel substrate suction fixing device which does not have the above-mentioned disadvantages.
本発明による基板吸着固定装置は、（ａ）基板受面
と、その基板受面側に設けられた吸気用溝を含み且つ吸
気手段に連通する真空吸着機構と、貫通孔とを有し、且
つ基板が前記基板受面上に固定して配される基板固定用
板と、（ｂ）前記貫通孔を貫通して上下する基板支持棒
を有する基板上下支持機構とを有し、そして、（ｃ）前
記貫通孔と前記真空吸着機構とは、前記基板支持棒の上
下の位置にかかわらず、互いに連通し、（ｄ）前記基板
支持棒は、それが下に位置しているとき、前記貫通孔を
その延長途上で気密封止するが、上に位置していると
き、前記貫通孔を気密封止せず、（ｅ）前記基板固定用
板とその前記基板受面上に固定して配された前記基板と
前記基板支持棒とは、前記基板支持棒が下に位置してい
るとき、前記真空吸着機構を介して前記吸気手段に連通
する気密空間を形成するが、前記基板支持棒が上に位置
しているとき、前記真空吸着機構を介して前記吸気手段
に連通する気密空間を形成しないことを特徴とする。こ
の場合、前記基板支持棒の先端形状が前記貫通孔と気密
整合する形状であるのを可とする。 また、本発明による基板吸着固定装置は、（ａ）基板
受面と、その基板受面側に設けられた吸気用溝と、それ
に連通している第１の吸気用連絡孔と、第１の貫通孔と
を有し、且つ基板が前記基板受面上に固定して配される
基板固定用板と、（ｂ）第２の吸気用連絡孔と第２の貫
通孔とを有し、且つ前記基板固定用板によって蓋される
ケース状体と、（ｃ）気密封止用板を有し且つ前記第１
及び第２の貫通孔を貫通して上下する基板支持棒を有す
る基板上下支持機構とを有し、そして、（ｄ）前記第１
及び第２の吸気用連絡孔は、前記基板支持棒の上下の位
置にかかわらず、吸気手段に連通し、（ｅ）前記気密封
止用板は、前記基板支持棒が下に位置しているとき、前
記第２の貫通孔を気密封止するが、前記基板支持棒が上
に位置しているとき、前記第２の貫通孔を気密封止せ
ず、（ｆ）前記基板固定用板とその前記基板受面上に固
定して配された前記基板と前記ケース状体と前記気密封
止用板とは、前記基板支持棒が下に位置しているとき、
前記第１及び第２の吸気用連絡孔を介して前記吸気手段
に連通する気密空間を形成するが、前記基板支持棒が上
に位置しているとき、前記第１及び第２の吸気用連絡孔
を介して前記吸気手段に連通する気密空間を形成しない
ことを特徴とする。A substrate suction fixing device according to the present invention includes: (a) a substrate receiving surface, a vacuum suction mechanism including a suction groove provided on the substrate receiving surface side and communicating with a suction unit, and a through hole; A substrate fixing plate having a substrate fixedly disposed on the substrate receiving surface, and (b) a substrate vertical supporting mechanism having a substrate supporting rod that goes up and down through the through hole, and (c) And (d) the through-hole and the vacuum suction mechanism communicate with each other irrespective of the vertical position of the substrate support rod. (D) When the substrate support rod is located below the through-hole, Is sealed in the middle of its extension, but when it is positioned above, the through-hole is not hermetically sealed, and (e) is fixedly disposed on the substrate fixing plate and the substrate receiving surface. The substrate and the substrate support rod, when the substrate support rod is located below, the vacuum suction machine Forming an airtight space that communicates with the air intake means through the air suction means, but does not form an airtight space that communicates with the air suction means through the vacuum suction mechanism when the substrate support rod is positioned above. And In this case, the tip shape of the substrate support rod may be a shape that is airtightly aligned with the through hole. In addition, the substrate suction fixing device according to the present invention comprises: (a) a substrate receiving surface, an intake groove provided on the substrate receiving surface side, a first intake communication hole communicating therewith, A substrate fixing plate having a through hole, and a substrate fixedly disposed on the substrate receiving surface; and (b) having a second suction communication hole and a second through hole. A case-like body covered by the substrate fixing plate, and (c) a hermetic sealing plate,
And a substrate up-down support mechanism having a substrate support rod that goes up and down through the second through-hole, and (d) the first
And the second suction communication hole communicates with the suction means irrespective of the vertical position of the substrate support rod, and (e) the airtight sealing plate has the substrate support rod positioned below. When the second through hole is hermetically sealed, the second through hole is not hermetically sealed when the substrate support rod is positioned above, and (f) the substrate fixing plate and its The substrate and the case-shaped body and the hermetic sealing plate fixedly arranged on the substrate receiving surface, when the substrate support rod is located below,
An airtight space communicating with the suction means through the first and second suction communication holes is formed. When the substrate support rod is positioned above, the first and second suction communication holes are formed. It is characterized in that no airtight space communicating with the intake means through a hole is formed.
本発明による基板吸着固定装置によれば、基板上下支
持機構と基板固定用板との間で気密が構成されるような
構造を有しているため、基板を基板固定用板に吸着固定
した場合、十分な真空が保ち得、その結果、基板の平面
度矯正が不十分で、焦点深度が１〜２μｍ程度しかない
縮小投影露光装置等を使ってLSIパタンを形成した場合
でも、パタンの解像度不良、パタン寸法精度劣化、パタ
ン重ね合わせ精度の劣化等を引き起こして、LSIの歩留
りを悪くする、ということを有効に回避することができ
る。According to the substrate suction fixing device according to the present invention, the substrate is fixed by suction to the substrate fixing plate because the device has a structure in which airtightness is formed between the substrate vertical support mechanism and the substrate fixing plate. Even if an LSI pattern is formed using a reduction projection exposure apparatus or the like in which the flatness of the substrate is insufficiently corrected and the depth of focus is only about 1 to 2 μm, a sufficient vacuum can be maintained. Thus, it is possible to effectively avoid deterioration of the LSI yield due to deterioration of pattern dimensional accuracy, deterioration of pattern overlay accuracy, and the like.
【実施例１】 次に、第１図を伴って、本発明による基板吸着固定装
置の第１の実施例を述べよう。 第１図において、第３図との対応部分には同一符号を
付す。 第１図に示す本発明による基板吸着固定装置は、第３
図で上述した従来の基板吸着固定装置の場合と同様に、
基板吸着固定手段Ａと、基板受渡手段Ｂとを有する。 基板吸着固定手段Ａは、第３図で上述した従来の基板
吸着固定装置の場合と同様に、平らな基板受面２と、そ
の基板受面２に臨み且つ吸気用連絡孔４及び吸気用外部
連結管５を介して外部の吸気手段（図示せず）に連結さ
れる例えば格子状パターンに形成された吸着用溝３とを
有する基板吸着固定用板体１を有する。 また、基板受渡手段Ｂは、小さな面積の例えば円形の
基板受面13を有する、その基板受面13下にそれと同じ形
状に延長している基板受部12と、その基板受部12から基
板受面13側とは反対側に且つ基板受面13と直交する方向
に延長している基板受部12に比し小さな断面を有する支
持部14とを有する複数例えば３つの基板支持体11からな
る。 これら複数の基板支持体11は、上述した基板吸着固定
手段Ａを構成している基板吸着固定用板体１の厚さに比
し十分長い長さを有している。 また、複数を基板支持体11の基板受部12には、支持部
14内にその長さ方向に延長している吸気用孔16を介して
外部の吸気手段（図示せず）に連結される、基板受面13
に臨んでいる吸着用溝15が設けられている。さらに、基
板受部12の支持部14側は、支持部14側に至るに従い、支
持部14との連接位置において支持部14と同じ断面になる
ように、徐々に小さくなる断面を有し、従って、基板受
部12はその支持部14側において、逆錐状体面17でなる外
面を有している。 さらに、上述した基板吸着固定装置Ａを構成している
基板吸着固定用板体１には、その基板受面２の中心を中
心とする同心円上に基板受面２と直交する方向に延長し
ている、上述した基板受渡手段Ｂの基板支持体11の数と
同じ数の貫通孔６が形成されている。 この場合、複数の貫通孔６は、基板受面２側におけ
る、基板支持体11の基板受部12がその基板受面13を基板
受面２と平行にしている状態で可動自在な、基板受部12
よりも僅かに長い長さを有する孔部6aと、基板受面２側
とは反対側における、基板支持体11の基板受部13な可動
できないが基板支持体11の支持部14が可動自在な、支持
部14よりも短い長さを有する孔部6bとからなる。 また、複数の貫通孔６の基板受面２側の孔部6aの孔部
6b側は、上述した基板支持体11の基板受部12の支持部14
側の外面を構成している逆錐状体面に17に対応してい
る、逆錐状体面18でなる内面になるように、孔部6b側に
至るに従い、孔部6bとの連接位置において孔部6bと同じ
断面になるように、徐々に小さくなる断面を有してい
る。 そして、上述した基板受渡手段Ｂを構成している複数
の基板支持体11の支持部14が、複数の貫通孔６内に、基
板受部12を貫通孔６の孔部6a側にして、貫通され、そし
て、常時は、基板受部12の支持部14側の逆錐状体面17の
外面と孔部6aの孔部6b側の逆錐状体面18の内面とが接触
し、そして、基板受部12の基板受面13が貫通孔６の孔部
6a内に在る状態で、基板支持体11が基板吸着固定用板体
１上に配されている。 また、複数の基板支持体11は、それらが上述したよう
に基板吸着固定手段１上に配されている状態で、例え
ば、それらの支持部14の遊端に付された螺子19とそれに
螺合するナット20とを用いて、それら複数の基板支持体
11に対して共通な連繋板24によって、連繋されている。 さらに、複数の基板支持体11が、上述したように連繋
板24によって互に連繋されて、基板吸着固定用板体１上
に配されている状態で、連繋板24と基板吸着固定用板体
１との間に、例えば複数の基板支持体11のそれぞれの周
りにおいて、それぞれ発条22が介挿され、よって、複数
の基板支持体11の基板受部12の支持部14側の逆錐状体面
17でなる外面のそれぞれが、それに対応している貫通孔
６の孔部6aの孔部6b側の逆錐状体面18でなる内面に圧接
され、それによって、貫通孔６が、基板吸着固定用板体
１の基板受面２側において吸着用溝３と連通している状
態を保っているが、基板受面２側とは反対側において外
気に連通していない状態が得られている。 なお、上述した複数の基板支持体11の基板受部12の支
持部14側の逆錐状体面17でなる外面のそれぞれと、それ
に対応している貫通孔６の孔部6aの孔部6b側の逆錐状体
面18でなる内面とは、基板支持体11の基板受部12の基板
受面13が基板吸着固定用板体１の基板受面２よりも下っ
ている面上に持来たされたときに、複数の貫通孔６を、
それらの基板吸着固定用板体１の基板受面側において吸
着用溝４に連通されているが、基板吸着固定用板体１の
基板受面２側とは反対側において外気に連通させていな
い、基板吸着固定用板体１と複数の基板支持体11との間
の気密封止手段23を構成している。 以上が、本発明による基板吸着固定装置の第１の実施
例の構成である。 このような構成を有する本発明による基板吸着固定装
置によれば、（ａ）基板受面（２）と、その基板受面
（２）側に設けられた吸気用溝を含み且つ吸気手段に連
通する真空吸着機構（３、４、５）と、貫通孔（６）と
を有し、且つ基板（21）が前記基板受面（２）上に固定
して配される基板固定用板（１）と、（ｂ）前記貫通孔
（６）を貫通して上下する基板支持棒（基板支持体11）
を有する基板上下支持機構（基板受渡手段Ｂ）とを有
し、そして、（ｃ）前記貫通孔（６）と前記真空吸着機
構（３、４、５）とは、前記基板支持棒の上下の位置に
かかわらず、互いに連通し、（ｄ）前記基板支持棒は、
それが下に位置しているとき、前記貫通孔をその延長途
上で気密封止するが、上に位置しているとき、前記貫通
孔（６）を気密封止せず、（ｅ）前記基板固定用板
（１）とその前記基板受面（２）上に固定して配された
前記基板（21）と前記基板支持棒とは、前記基板支持棒
が下に位置しているとき、前記真空吸着機構（３、４、
５）を介して前記吸気手段に連通する気密空間を形成す
るが、前記基板支持棒が上に位置しているとき、前記真
空吸着機構（３、４、５）を介して前記吸気手段に連通
する気密空間を形成しない、という構成を有するという
ことができるが、第３図で従来の基板吸着固定装置につ
いて上述した場合に準じて、第１図Ｂに示すような、基
板受渡手段Ｂを構成している複数の基板支持体11が、そ
れらの基板受部12の基板受面13を、基板吸着固定手段Ａ
を構成している基板吸着固定用板体１の貫通孔６内にお
ける基板受面２と平行であるがそれよりも下っている面
上に持たしている、という基板吸着固定用板体１との相
対関係を有している状態から、基板21を、第３図で上述
した従来の基板吸着固定装置の場合と同様に、適当な搬
送手段（図示せず）を用いて、基板吸着固定用板体１の
上方位置に、その基板受面２と対向して、持来たし、そ
して、複数の基板支持体11を、駆動手段としての例えば
カム機構によって、連繋板24を、発条22に抗して、基板
吸着固定用板体１側に移動させれば、これに応じて、複
数の基板支持体11が上方に移動し、このため、第１図Ｃ
に示すように、基板21を、その下方から、複数の基板支
持体11の基板受部12の基板受面13によって受けさせるこ
とができる。従って、基板21を、基板搬送手段から、複
数の基板支持体11の基板受面13上に受渡すことができ
る。 この場合、複数の基板支持体11の基板受部12の吸着用
溝15は、基板21によって上方から塞がれた状態になる
が、その吸着用溝15に吸着用孔16を介して予め外部の吸
気手段を連結しておき、そして、その吸気手段を予め作
動しておけば、その吸気手段によって、複数の基板支持
体11の吸着用溝15の排気が行なわれるので、基板21が複
数の支持体11の基板受面13上に受け渡されている状態
が、基板21が複数の基板支持体11の基板受面13上に吸着
固定されている状態で得られる。 また、上述したように、基板１が複数の基板支持体11
の基板受面13上に受渡されている状態から、複数の基板
支持体11を、上述したカム機構によって、下方に移動さ
せ、それによって、複数の基板支持体11の基板受部12
を、それらの基板受面13が基板吸着固定用板体１の基板
受面２よりも下っている面にあるように持来たせば、基
板21を、第３図で上述した従来の基板吸着固定装置の場
合に準じて、第１図Ｄに示すように、複数の基板支持体
11の基板受面13上から、基板吸着固定用板体１の基板受
面２上に受渡すことができる。 この場合、基板吸着固定用板体１の吸着用溝３は、基
板21によって上方から塞がれた状態になるが、その吸着
用溝３に連通している基板吸着固定用板体１の吸気用連
結管５に予め外部の吸気手段を連結しておき、そして、
その吸気手段を予め作動させておけば、その吸気手段に
よって、基板吸着固定用板体１の吸着用溝３の排気が行
なわれるので、基板21が基板吸着固定用板体１の基板受
面２上に受渡されている状態が、第３図で上述した従来
の基板吸着固定装置の場合と同様に、基板21が基板吸着
固定用板体１の基板受面２上に吸着固定されている状態
で得られる。 また、第１図に示す本発明による基板吸着固定装置に
よれば、基板21を、第３図で上述した従来の基板吸着固
定装置の場合と同様に、基板吸着固定用板体１の基板受
面２上に吸着して固定させることができるので、第３図
で上述した従来の基板吸着固定装置の場合と同様に、基
板21を、それに反りを有していても、それを矯正して、
基板吸着固定用板体１の基板受面２上に固定させること
ができる。 しかしながら、第１図に示す本発明による基板吸着固
定装置の場合、基板吸着固定用板体１が、それに設けら
れている複数の貫通孔６を吸着用溝３に連通させている
構成を有し、また、基板吸着固定用板体１と複数の基板
支持体11との間に、気密封止手段23が設けられ、そし
て、基板21が基板吸着固定用板体１の基板受面２上に吸
着固定されている状態にあるとき、貫通孔６が、気密封
止手段23によって、基板吸着固定用板体１の基板受面２
側において吸着用溝３に連結されている状態を保ってい
るが、基板吸着固定用板体１の基板受面２側と反対側に
おいて外気に連通していないので、基板21が基板吸着固
定用板体１の基板受面２上に吸着固定されている状態に
あるとき、基板21の複数の貫通孔６に臨んでいる領域
も、基板吸着固定用板体１の基板受面２側に吸着されて
いる。このため、基板21を、それに反りを有していて
も、基板21の全域に亘って、平らに、基板吸着固定用板
体１の基板受面２上に固定させることができる。Embodiment 1 Next, a first embodiment of a substrate suction fixing apparatus according to the present invention will be described with reference to FIG. In FIG. 1, parts corresponding to those in FIG. 3 are denoted by the same reference numerals. The substrate suction fixing device according to the present invention shown in FIG.
As in the case of the conventional substrate suction fixing device described above in the drawing,
It has a substrate suction fixing means A and a substrate delivery means B. As in the case of the conventional substrate suction-fixing device described above with reference to FIG. 3, the substrate suction-fixing means A includes a flat substrate receiving surface 2, a suction hole 4 facing the substrate receiving surface 2, and a suction communication hole 4. There is provided a plate 1 for substrate suction and fixing having suction grooves 3 formed in a lattice pattern, for example, connected to an external suction means (not shown) via a connection pipe 5. The substrate transfer means B includes a substrate receiving portion 12 having a small area, for example, a circular substrate receiving surface 13, extending below the substrate receiving surface 13 in the same shape as the substrate receiving portion 13, and a substrate receiving portion 12 from the substrate receiving portion 12. It comprises a plurality of, for example, three substrate supports 11 having a support portion 14 having a cross section smaller than the substrate receiving portion 12 extending in a direction opposite to the surface 13 and perpendicular to the substrate receiving surface 13. The plurality of substrate supports 11 have a length that is sufficiently longer than the thickness of the substrate 1 for holding and fixing the substrate, which constitutes the above-described substrate suction and fixing means A. In addition, a plurality of support portions are provided on the substrate receiving portion 12 of the substrate support 11.
The substrate receiving surface 13 is connected to an external intake means (not shown) through an intake hole 16 extending in the longitudinal direction of the substrate receiving surface 13.
A suction groove 15 is provided. Furthermore, the support portion 14 side of the substrate receiving portion 12 has a cross section that becomes gradually smaller so as to reach the support portion 14 side, so that it becomes the same cross section as the support portion 14 at a position of connection with the support portion 14, and The substrate receiving portion 12 has an outer surface formed of an inverted conical body surface 17 on the support portion 14 side. Further, the board 1 for substrate suction and fixing constituting the above-described substrate suction and fixing apparatus A is provided on a concentric circle centered on the center of the substrate receiving surface 2 by extending in a direction orthogonal to the substrate receiving surface 2. The same number of through holes 6 as the number of the substrate supports 11 of the substrate delivery means B described above are formed. In this case, the plurality of through-holes 6 are movable on the substrate receiving surface 2 side in a state where the substrate receiving portion 12 of the substrate support 11 has its substrate receiving surface 13 parallel to the substrate receiving surface 2. Part 12
The hole 6a having a slightly longer length than the hole 6a and the substrate receiving portion 13 of the substrate support 11 on the side opposite to the substrate receiving surface 2 are not movable but the support 14 of the substrate support 11 is movable. And a hole 6b having a length shorter than that of the support portion 14. Also, the holes of the holes 6a of the plurality of through holes 6 on the substrate receiving surface 2 side.
The support portion 14b of the substrate receiving portion 12 of the substrate support 11 described above
Corresponding to the inverted conical body surface 17 that constitutes the outer surface of the side, so that it becomes the inner surface formed by the inverted conical body surface 18, as it reaches the hole 6b side, the hole at the connecting position with the hole 6b It has a gradually decreasing cross section so as to have the same cross section as the portion 6b. Then, the support portions 14 of the plurality of substrate supports 11 constituting the above-described substrate delivery means B are inserted into the plurality of through holes 6 with the substrate receiving portion 12 facing the hole 6 a of the through hole 6. Normally, the outer surface of the inverted conical surface 17 on the support portion 14 side of the substrate receiving portion 12 and the inner surface of the inverted conical surface 18 on the hole 6b side of the hole 6a come into contact with each other, and The substrate receiving surface 13 of the part 12 is a hole part of the through hole 6.
The substrate support 11 is disposed on the substrate suction fixing plate 1 in the state of being inside 6a. In the state where the plurality of substrate supports 11 are disposed on the substrate suction fixing means 1 as described above, for example, the screws 19 attached to the free ends of the support portions 14 are screwed together with the screws 19. The nuts 20 and the plurality of substrate supports
It is linked to 11 by a common linking plate 24. Further, in a state where the plurality of substrate supports 11 are connected to each other by the connecting plate 24 as described above and are disposed on the substrate 1 for holding and fixing the substrate, the connecting plate 24 and the plate for fixing and holding the substrate are fixed. For example, an ridge 22 is interposed around each of the plurality of substrate supports 11, for example, around each of the plurality of substrate supports 11, and thus the inverted conical body surface of the plurality of substrate supports 11 on the support portion 14 side of the substrate receiving portion 12 is provided.
Each of the outer surfaces 17 is pressed against the corresponding inner surface of the inverted conical body surface 18 on the side of the hole 6b of the hole 6a of the through hole 6 corresponding thereto, whereby the through hole 6 is A state where the plate body 1 is in communication with the suction groove 3 on the substrate receiving surface 2 side but is not communicated with the outside air on the opposite side to the substrate receiving surface 2 side is obtained. In addition, each of the outer surfaces of the inverted conical body surface 17 on the support portion 14 side of the substrate receiving portion 12 of the plurality of substrate supports 11 and the corresponding hole 6a side of the hole 6a of the through hole 6 corresponding thereto. The inner surface formed by the inverted conical body surface 18 of the substrate support 11 is brought on a surface where the substrate receiving surface 13 of the substrate receiving portion 12 of the substrate support 11 is lower than the substrate receiving surface 2 of the substrate 1 for sucking and fixing the substrate. When a plurality of through holes 6 are formed,
The substrate suction-fixing plate 1 is connected to the suction groove 4 on the substrate receiving surface side, but is not connected to the outside air on the opposite side of the substrate suction-fixing plate 1 from the substrate receiving surface 2 side. The hermetic sealing means 23 is provided between the substrate 1 for holding and fixing the substrate and the plurality of substrate supports 11. The above is the configuration of the first embodiment of the substrate suction fixing apparatus according to the present invention. According to the substrate suction fixing device of the present invention having such a configuration, (a) includes the substrate receiving surface (2) and the intake groove provided on the substrate receiving surface (2) side, and communicates with the intake means. A substrate fixing plate (1) having a vacuum suction mechanism (3, 4, 5, 5) and a through hole (6), and a substrate (21) fixedly disposed on the substrate receiving surface (2). And (b) a substrate support rod (substrate support 11) that goes up and down through the through hole (6).
And (c) the through-hole (6) and the vacuum suction mechanism (3, 4, 5) are provided above and below the substrate support rod. Irrespective of the position, they communicate with each other;
When it is located below, the through-hole is hermetically sealed on its way, but when it is located above, the through-hole (6) is not hermetically sealed, and Plate (1) and the substrate (21) and the substrate support bar fixedly arranged on the substrate receiving surface (2), when the substrate support bar is positioned below, the vacuum Suction mechanism (3, 4,
5) forming an airtight space communicating with the suction means through the vacuum suction mechanism (3, 4, 5) when the substrate support rod is positioned above; However, according to the case described above with reference to the conventional substrate suction and fixing device in FIG. 3, the substrate delivery means B as shown in FIG. The plurality of substrate supports 11, the substrate receiving surfaces 13 of the substrate receiving portions 12, the substrate suction fixing means A
The plate 1 for holding and fixing the substrate, which is parallel to the substrate receiving surface 2 in the through hole 6 of the plate 1 for fixing and holding the substrate and is provided on a surface lower than that. From the state of having the relative relationship shown in FIG. 3, the substrate 21 is fixed to the substrate by using a suitable transport means (not shown) in the same manner as in the case of the conventional substrate suction and fixing apparatus described above with reference to FIG. It is brought to a position above the plate body 1 so as to face the substrate receiving surface 2, and the plurality of substrate supports 11 are brought into contact with the connecting plate 24 by the cam mechanism as a driving means. Then, if the substrate is moved toward the substrate 1 for holding and fixing the substrate, the plurality of substrate supports 11 are moved upward accordingly.
As shown in the figure, the substrate 21 can be received from below by the substrate receiving surfaces 13 of the substrate receiving portions 12 of the plurality of substrate supports 11. Therefore, the substrate 21 can be transferred from the substrate transfer means onto the substrate receiving surfaces 13 of the plurality of substrate supports 11. In this case, the suction grooves 15 of the substrate receiving portions 12 of the plurality of substrate supports 11 are closed from above by the substrate 21, and the suction grooves 15 are externally inserted through the suction holes 16 in advance. If the suction means is connected, and the suction means is operated in advance, the suction means exhausts the suction grooves 15 of the plurality of substrate supports 11, so that the substrate 21 The state in which the substrate 21 is transferred onto the substrate receiving surface 13 of the support 11 is obtained in a state in which the substrate 21 is fixed by suction onto the substrate receiving surfaces 13 of the plurality of substrate supports 11. Further, as described above, the substrate 1 is provided with a plurality of substrate supports 11.
The plurality of substrate supports 11 are moved downward by the above-described cam mechanism from the state of being transferred onto the substrate receiving surface 13 of the
Are brought in such a way that their substrate receiving surfaces 13 are on a surface lower than the substrate receiving surface 2 of the substrate 1 for holding and fixing the substrate. According to the case of the fixing device, as shown in FIG.
From the substrate receiving surface 13 of the substrate 11, the substrate can be transferred to the substrate receiving surface 2 of the substrate 1 for substrate suction and fixing. In this case, the suction groove 3 of the substrate suction fixing plate 1 is closed from above by the substrate 21, but the suction of the substrate suction fixing plate 1 communicating with the suction groove 3 is performed. An external air intake means is connected to the connecting pipe 5 in advance, and
If the suction means is operated in advance, the suction means 3 exhausts the suction groove 3 of the board 1 for sucking and fixing the substrate. The state in which the substrate 21 is transferred above is a state in which the substrate 21 is fixed by suction on the substrate receiving surface 2 of the substrate 1 for substrate suction and fixing similarly to the case of the conventional substrate suction and fixing device described above with reference to FIG. Is obtained. In addition, according to the substrate suction and fixing device of the present invention shown in FIG. 1, the substrate 21 is transferred to the substrate receiving and fixing plate 1 in the same manner as the conventional substrate suction and fixing device described above with reference to FIG. Since the substrate 21 can be sucked and fixed on the surface 2, similarly to the case of the conventional substrate suction fixing device described above with reference to FIG. ,
It can be fixed on the substrate receiving surface 2 of the substrate for adsorption and fixing plate 1. However, in the case of the substrate suction fixing apparatus according to the present invention shown in FIG. 1, the substrate body 1 has a configuration in which the plurality of through holes 6 provided therein communicate with the suction grooves 3. Airtight sealing means 23 is provided between the substrate 1 for holding and fixing the substrate and the plurality of substrate supports 11, and the substrate 21 is placed on the substrate receiving surface 2 of the plate 1 for holding and fixing the substrate. When in the state of being fixed by suction, the through-hole 6 is formed by the air-tight sealing means 23 so that the substrate receiving surface 2
Side is connected to the suction groove 3, but the side opposite to the substrate receiving surface 2 side of the substrate 1 for holding and fixing the substrate does not communicate with the outside air. When the plate 1 is fixed on the substrate receiving surface 2 by suction, the region facing the plurality of through holes 6 of the substrate 21 is also adsorbed on the substrate receiving surface 2 side of the substrate suction fixing plate 1. Have been. For this reason, even if the substrate 21 has a warp, the substrate 21 can be fixed on the substrate receiving surface 2 of the substrate 1 for substrate adsorption and fixing flat over the entire area of the substrate 21.
【実施例２】 次に、第２図を伴って本発明による基板吸着固定装置
の第２の実施例を述べよう。 第２図において、第１図との対応部分には同一符号を
付して示す。 第２図に示す本発明による基板吸着固定装置は、第１
図で上述した本発明による基板吸着固定装置の場合と同
様に、基板吸着固定手段Ａと、基板受渡手段Ｂとを有す
る。 基板吸着固定手段Ａは、平らな基板受面２と、その基
板受面２に臨み且つ基板受面２と対向している他の面上
に臨んでいる吸気用連絡孔4aに連通している、例えば格
子状パターンを有する吸気用溝３とを有する基板吸着固
定用板体1aと、その基板吸着固定用板体1aによって気密
に蓋されているケース状体1bとからなる。この場合、ケ
ース状体1b内が、その側壁に設けられた吸気用連絡孔4b
を介して、外部の吸気手段（図示せず）に連結される吸
気用連結管５に連通している。従って、基板吸着固定用
板体1aの吸気用溝３が、基板吸着固定用板体1aの吸気連
絡孔4aと、ケース状体1b内と、吸気用連絡孔4bと、吸気
用連絡管５とを介して、外部の吸気手段に連結されるよ
うになされている。 また、基板受渡手段Ｂが、例えば基板吸着固定用板体
1aの基板受面２の中心を中心とする２つの同心円弧線を
２つの相対向している辺としているストライプ状の基板
受面13を有する、その基板受面13下にそれと同じ形状に
延長している基板受部12と、その基板受部12からその基
板受面13側とは反対側に且つ基板受面13と直交する方向
に延長している基板受部12と例えば同じ断面を有る支持
部14とを有する例えば４つの基板支持体11からなる。 これら複数の基板支持体11は、上述した基板吸着固定
用板体1aの基板受面２とケース状体1bの外側の面との間
の間隔に比し十分長い長さを有している。 また、複数の基板支持体11の基板受部12には、第１図
で上述した本発明による基板吸着固定装置の場合と同様
に、支持部14内にその長さ方向に延長している吸気孔16
を介して外部の吸気手段（図示せず）に連結される、基
板受面13に臨んでいる吸気用溝15が設けられている。 さらに、上述した基板吸着固定手段Ａを構成している
基板吸着固定用板体1aには、第１図で上述した本発明に
よる基板吸着固定装置の場合と同様に、その基板受面２
を中心とする同心円上に基板受面２と直交する方向に延
長している、上述した基板受渡手段Ｂを構成している基
板支持体11の数と同じ数の貫通孔6aが形成され、また、
ケース状体1bの底壁に、基板吸着固定用板体1aの各貫通
孔6aに対応している位置において、基板吸着固定用板体
1aの基板受面２と直交する方向に延長している貫通孔6b
が形成されている。 この場合、基板吸着固定用板体１の貫通孔6aは、基板
支持体11の基板受部12及び支持部14が、基板受面13を基
板受面２と平行に保たせた状態で可動自在な大きさの孔
でなる。 一方、基板吸着固定手段Ａを構成しているケース状体
1bの底壁の内面には、その複数の貫通孔6bの周りにおい
て、それを取囲むように、気密封止用環51が配され、ま
た、基板受渡手段Ｂを構成している複数の基板支持体11
の支持部14には、ケース状体1bに配されている気密封止
用環51と共働して、ケース状体1bの貫通孔6bを封止する
気密封止用板52が取付けられている。この場合、気密封
止用板52は、気密封止用環51とその上方から接触してい
る状態にあるときに、基板支持体11の基板受面13が基板
吸着固定用板体１の基板受面２よりも下がっている面上
にある関係が得られるような、支持部14上の位置を有し
ている。 そして、上述した基板受渡手段Ｂを構成している複数
の基板支持体11が、複数の貫通孔6a及び6bの組内に、基
板受部12を貫通孔6a側にし、また、気密封止用板52をケ
ース状体1b内に配されている状態で配され、そして、気
密封止用板52が気密封止用環51にその上方から接触し、
また、基板受部12の基板受面13が貫通孔6a内に在る状態
で、基板支持体11が、基板吸着固定手段Ａ上に配されて
いる。 また、複数の基板支持体11は、それらのケース状体1b
下に延長している支持部14の遊端において、それら複数
の基板支持体11に対して共通の連繋板24によって連繋さ
れている。 以上が、本発明による基板吸着固定装置の第１の実施
例の構成である。 このような構成を有する本発明による基板吸着固定装
置によれば、（ａ）基板受面（２）と、その基板受面
（２）側に設けられた吸気用溝（３）と、それに連通し
ている第１の吸気用連絡孔（4a）と、第１の貫通孔（6
a）とを有し、且つ基板（21）が前記基板受面（２）上
に固定して配される基板固定用板（1a）と、（ｂ）第２
の吸気用連絡孔（4b）と第２の貫通孔（6b）とを有し、
且つ前記基板固定用板（1a）によって蓋されるケース状
体（1b）と、（ｃ）気密封止用板（52）を有し且つ前記
第１及び第２の貫通孔（6a、6b）を貫通して上下する基
板支持棒（基板支持体11）を有する基板上下支持機構
（基板受渡手段Ｂ）とを有し、そして、（ｄ）前記第１
及び第２の吸気用連絡孔（4a、4b）は、前記基板支持棒
の上下の位置にかかわらず、吸気手段に連通し、（ｅ）
前記気密封止用板（52）は、前記基板支持棒が下に位置
しているとき、前記第２の貫通孔（6a）を気密封止する
が、前記基板支持棒が上に位置しているとき、前記第２
の貫通孔（6a）を気密封止せず、（ｆ）前記基板固定用
板（1a）とその前記基板受面（２）上に固定して配され
た前記基板（21）と前記ケース状体（1b）と前記気密封
止用板（52）とは、前記基板支持棒が下に位置している
とき、前記第１及び第２の吸気用連絡孔（4a、4b）を介
して前記吸気手段に連通する気密空間を形成するが、前
記基板支持棒が上に位置しているとき、前記第１及び第
２の吸気用連絡孔（4a、4b）を介して前記吸気手段に連
通する気密空間を形成しない、という構成を有するとい
うことができるが、第１図で上述した本発明による基板
吸着固定装置の場合と同様に、第２図Ｂに示すような、
基板受渡手段Ｂを構成している複数の基板支持体11が、
それらの基板受部12の基板受面13を、基板吸着固定手段
Ａを構成している基板吸着固定用板体1aの貫通孔6a内に
おける基板受面２と平行であるがそれよりも下っている
面上に持たしている、という基板吸着固定用板体1aとの
相対関係を有している状態から、基板21を、第１図で上
述した本発明による基板吸着固定装置の場合と同様に、
適当な搬送手段（図示せず）を用いて、基板吸着固定用
板体1aの上方位置に、その基板受面２と対向して、持来
たし、そして、駆動手段としての例えばカム機構によっ
て、連繋板24を基板吸着固定用板体1b側に移動させれ
ば、これに応じて、複数の基板支持体11が上方に移動
し、このため、第２図Ｃに示すように、複数の基板支持
体11の基板受部12の基板受面13によって、基板21を、そ
の下方から受けさせることができる。従って、基板21
を、第１図で上述した本発明による基板吸着固定装置の
場合と同様に、基板搬送手段から、複数の基板支持体11
の基板受面13上に受渡すことができる。 この場合、第１図で上述した本発明による基板吸着装
置の場合と同様に、複数の基板支持体11の基板受部12の
吸着用溝15は、基板21によって上方から塞がれた状態に
なるが、その吸着用溝15に吸気用孔16を介して予め外部
の吸気手段を連結しておき、そして、その吸気手段を予
め作動しておけば、その吸気手段によって、複数の基板
支持体11の吸着用溝15の排気が行なわれるので、基板21
が複数の基板支持体11の基板受面13上に受渡されている
状態が、基板21が複数の基板支持体11の基板受面13上に
吸着固定されている状態で得られる。 また、第１図で上述した本発明による基板吸着固定装
置の場合と同様に、基板１が複数の基板支持体11の基板
受面13上に受渡されている状態から、複数の基板支持体
11を、上述したカム機構によって、下方に移動させ、そ
れによって、複数の基板支持体11の基板受部12を、それ
らの基板受面13が基板吸着固定用板体1aの基板受面２よ
りも下っている面にあるように持来たせば、基板21を、
第２図Ｄに示すように、複数の基板支持体11の基板受面
13上から、基板吸着固定用板体１の基板受面２上に受渡
すことができる。 この場合、第１図で上述した本発明による基板吸着固
定装置の場合と同様に、基板吸着固定用板体1aの吸着用
溝３は、基板21によって上方から塞がれた状態になる
が、その吸着用溝３に連通している基板吸着固定用板体
1aの吸気用連結管５に予め外部の吸気手段を連結してお
き、そして、その吸気手段を予め作動させておけば、基
板吸着固定用板体１の吸着用溝３の排気が行なわれるの
で基板21が基板吸着固定用板体1aの基板受面２上に受渡
されている状態が、第１図で上述した本発明による基板
吸着固定装置の場合と同様に、基板21が基板吸着固定用
板体1aの基板受面２上に吸着固定されている状態で得ら
れる。 また、第２図に示す本発明による基板吸着固定装置に
よれば、基板21を、第１図で上述した本発明による基板
吸着固定装置の場合と同様に、基板吸着固定用板体1aの
基板受面２上に吸着して固定させることができるので、
第１図で上述した本発明による基板吸着固定装置の場合
と同様に、基板21を、それに反りを有していても、それ
を矯正して、基板吸着固定用板体1aの基板受面２上に固
定させることができる。 さらに、第２図に示す本発明による基板吸着固定装置
の場合、基板吸着固定用板体1aが、それに設けられてい
る複数の貫通孔6aを吸着用溝３に連通させている構成を
有し、また、基板吸着固定手段Ａを構成しているケース
状体1bと複数の基板支持体11との間に、気密封止手段23
が設けられ、そして、基板21が基板吸着固定用板体1aの
基板受面２上に吸着固定されている状態にあるとき、貫
通孔6aが、気密封止手段23によって、吸着用溝３に連結
されている状態を保っているが、貫通孔6aが、外気に連
通していないので、基板吸着固定用板体1aの基板受面２
上に吸着固定されている状態にあるとき、基板21の複数
の貫通孔6aに臨んでいる領域も、基板吸着固定用板体1a
の基板受面２側に吸着される。このため、基板21を、そ
れに反りを有していても、基板21の全域に亘って、平ら
に、基板吸着固定用板体１の基板受面２上に固定させる
ことができる。 なお、上述においては、本発明による基板吸着固定装
置の２つの実施例を示したに留まり、本発明の精神を脱
することなしに、種々の変型、変更をなし得るであろ
う。Second Embodiment Next, a second embodiment of the substrate suction fixing apparatus according to the present invention will be described with reference to FIG. 2, parts corresponding to those in FIG. 1 are denoted by the same reference numerals. The substrate suction fixing apparatus according to the present invention shown in FIG.
As in the case of the substrate suction fixing device according to the present invention described above with reference to the drawing, it has a substrate suction fixing means A and a substrate delivery means B. The substrate suction fixing means A communicates with the flat substrate receiving surface 2 and the intake communication hole 4a facing the substrate receiving surface 2 and facing the other surface facing the substrate receiving surface 2. For example, it is composed of a substrate 1a for substrate suction and fixing having an intake groove 3 having a lattice pattern, and a case 1b airtightly covered by the substrate 1a for substrate suction and fixing. In this case, the inside of the case-like body 1b is formed with an intake communication hole 4b provided on the side wall thereof.
Through a connecting pipe 5 for intake connected to an external intake means (not shown). Accordingly, the intake groove 3 of the board 1a is fixed to the intake communication hole 4a of the board 1a, the inside of the case 1b, the intake communication hole 4b, and the intake communication pipe 5. Is connected to an external intake means via Further, the substrate delivery means B is, for example, a substrate
1a has a strip-shaped substrate receiving surface 13 having two concentric arc lines centered on the center of the substrate receiving surface 2 as two opposing sides. A support having the same cross section as the substrate receiving portion 12 extending from the substrate receiving portion 12 to the opposite side to the substrate receiving surface 13 side and in a direction perpendicular to the substrate receiving surface 13, for example. For example, the substrate support 11 has four parts. The plurality of substrate supports 11 have a length sufficiently longer than the distance between the substrate receiving surface 2 of the above-described substrate suction and fixing plate 1a and the outer surface of the case-like body 1b. In addition, the substrate receiving portions 12 of the plurality of substrate supports 11 have the suction portions extending in the length direction thereof in the support portions 14 similarly to the case of the substrate suction and fixing device according to the present invention described above with reference to FIG. Hole 16
An intake groove 15 facing the substrate receiving surface 13 is provided, which is connected to an external intake means (not shown) through the air inlet. Further, as in the case of the substrate suction and fixing apparatus according to the present invention described above with reference to FIG. 1, the substrate receiving surface 2 is provided on the substrate suction and fixing plate 1a constituting the above-mentioned substrate suction and fixing means A.
The same number of through holes 6a as the number of the substrate supports 11 constituting the above-described substrate delivery means B, which extend in a direction perpendicular to the substrate receiving surface 2 on a concentric circle centered on ,
At the bottom wall of the case-like body 1b, at a position corresponding to each through hole 6a of the board 1
Through hole 6b extending in a direction orthogonal to substrate receiving surface 2 of 1a
Are formed. In this case, the through-hole 6a of the plate 1 for holding and fixing the substrate is movable in a state where the substrate receiving portions 12 and 14 of the substrate support 11 keep the substrate receiving surface 13 parallel to the substrate receiving surface 2. The size of the hole is large. On the other hand, a case-like body constituting the substrate suction fixing means A
On the inner surface of the bottom wall of 1b, a hermetic sealing ring 51 is arranged around the plurality of through holes 6b so as to surround it, and a plurality of substrates constituting a substrate delivery means B are provided. Support 11
The support portion 14 is provided with a hermetic sealing plate 52 that seals the through hole 6b of the case-like body 1b in cooperation with the hermetic sealing ring 51 provided on the case-like body 1b. I have. In this case, when the hermetic sealing plate 52 is in contact with the hermetic sealing ring 51 from above, the substrate receiving surface 13 of the substrate support 11 is It has a position on the support 14 such that a relationship on a surface lower than the receiving surface 2 is obtained. Then, the plurality of substrate supports 11 constituting the above-described substrate delivery means B have the substrate receiving portion 12 on the side of the through hole 6a in the set of the plurality of through holes 6a and 6b. The plate 52 is disposed in a state of being disposed in the case-like body 1b, and the hermetic sealing plate 52 contacts the hermetic sealing ring 51 from above,
Further, the substrate support 11 is disposed on the substrate suction fixing means A in a state where the substrate receiving surface 13 of the substrate receiving portion 12 is in the through hole 6a. In addition, the plurality of substrate supports 11 are
At the free ends of the supporting portions 14 extending downward, the supporting portions 14 are connected to the plurality of substrate supports 11 by a common connecting plate 24. The above is the configuration of the first embodiment of the substrate suction fixing apparatus according to the present invention. According to the substrate suction and fixing apparatus of the present invention having such a configuration, (a) the substrate receiving surface (2), the intake groove (3) provided on the substrate receiving surface (2) side, and the communication therewith. The first communication hole (4a) for intake and the first through hole (6
a) and a substrate fixing plate (1a) having a substrate (21) fixedly disposed on the substrate receiving surface (2);
Having a communication hole for intake (4b) and a second through hole (6b),
And a case-like body (1b) covered by the substrate fixing plate (1a); and (c) a hermetic sealing plate (52), and the first and second through holes (6a, 6b). And a substrate supporting mechanism (substrate delivery means B) having a substrate supporting rod (substrate supporting body 11) that goes up and down through the substrate.
And the second communication holes for suction (4a, 4b) communicate with the suction means irrespective of the upper and lower positions of the substrate support rod, and (e)
The hermetic sealing plate (52) hermetically seals the second through-hole (6a) when the substrate support bar is positioned below, but the substrate support bar is positioned above. When the second
(F) the substrate fixing plate (1a), the substrate (21) fixedly disposed on the substrate receiving surface (2), and the case-like body. (1b) and the airtight sealing plate (52), when the substrate support rod is located below, the air intake through the first and second air intake communication holes (4a, 4b). Forming an airtight space communicating with the suction means, when the substrate support rod is positioned above, the airtight space communicating with the suction means via the first and second suction communication holes (4a, 4b); Although it can be said that a space is not formed, as in the case of the substrate suction fixing apparatus according to the present invention described above with reference to FIG. 1, as shown in FIG.
The plurality of substrate supports 11 constituting the substrate delivery means B are
The substrate receiving surface 13 of the substrate receiving portion 12 is parallel to, but lower than, the substrate receiving surface 2 in the through hole 6a of the substrate 1a for substrate adsorption and fixing constituting the substrate adsorption and fixing means A. From the state of having a relative relationship with the substrate 1a for holding and fixing the substrate, that is, holding the substrate 21 in the same manner as in the case of the substrate suction and fixing apparatus according to the present invention described above with reference to FIG. To
Using a suitable transporting means (not shown), it is brought to a position above the substrate suction fixing plate 1a, facing the substrate receiving surface 2, and is linked by a driving mechanism, for example, a cam mechanism. When the plate 24 is moved to the side of the substrate 1b for holding and fixing the substrate, the plurality of substrate supports 11 move upward accordingly, and as shown in FIG. The substrate 21 can be received from below by the substrate receiving surface 13 of the substrate receiving portion 12 of the body 11. Therefore, the substrate 21
In the same manner as in the case of the substrate suction and fixing device according to the present invention described above with reference to FIG.
On the substrate receiving surface 13. In this case, as in the case of the substrate suction device according to the present invention described above with reference to FIG. 1, the suction grooves 15 of the substrate receiving portions 12 of the plurality of substrate supports 11 are closed by the substrate 21 from above. However, external suction means is connected to the suction groove 15 through a suction hole 16 in advance, and if the suction means is actuated in advance, a plurality of substrate support members are provided by the suction means. Since the suction groove 15 of 11 is evacuated, the substrate 21
Is transferred onto the substrate receiving surfaces 13 of the plurality of substrate supports 11 in a state where the substrate 21 is fixed by suction onto the substrate receiving surfaces 13 of the plurality of substrate supports 11. Further, as in the case of the substrate suction and fixing apparatus according to the present invention described above with reference to FIG. 1, the state in which the substrate 1 is delivered on the substrate receiving surface 13 of the plurality of substrate supports 11 is changed to the plurality of substrate supports.
11 is moved downward by the cam mechanism described above, whereby the substrate receiving portions 12 of the plurality of substrate supports 11 are moved from the substrate receiving surface 2 of the substrate 1a for substrate suction and fixing. If you bring it as if it is on the lower surface,
As shown in FIG. 2D, the substrate receiving surfaces of the plurality of substrate supports 11
From above, it can be delivered to the substrate receiving surface 2 of the substrate 1 for substrate adsorption and fixing. In this case, as in the case of the substrate suction fixing device according to the present invention described above with reference to FIG. 1, the suction groove 3 of the substrate suction fixing plate 1a is closed by the substrate 21 from above. A plate for fixing and fixing the substrate, which communicates with the groove 3 for suction.
If an external suction means is connected to the suction connection pipe 5a in advance and the suction means is operated in advance, the suction groove 3 of the substrate suction fixing plate 1 is evacuated. The state in which the substrate 21 is transferred on the substrate receiving surface 2 of the substrate 1 for holding and fixing the substrate is similar to the case of the apparatus for fixing and holding a substrate according to the present invention described above with reference to FIG. It is obtained in a state where it is fixed by suction on the substrate receiving surface 2 of the plate 1a. In addition, according to the substrate suction and fixing apparatus of the present invention shown in FIG. 2, the substrate 21 is formed on the substrate 1 of the substrate suction and fixing plate Since it can be fixed by absorbing on the receiving surface 2,
As in the case of the substrate suction-fixing device according to the present invention described above with reference to FIG. 1, even if the substrate 21 has a warp, it is corrected and the substrate receiving surface 2 of the substrate 1a is fixed. Can be fixed on top. Further, in the case of the substrate suction fixing device according to the present invention shown in FIG. 2, the substrate suction fixing plate 1a has a configuration in which a plurality of through holes 6a provided therein communicate with the suction grooves 3. Further, between the case-like body 1b constituting the substrate suction fixing means A and the plurality of substrate supports 11, an airtight sealing means 23 is provided.
Is provided, and when the substrate 21 is in a state of being suction-fixed on the substrate receiving surface 2 of the substrate 1 a for suction-fixing, the through hole 6 a is formed in the suction groove 3 by the hermetic sealing means 23. Although the connected state is maintained, since the through-hole 6a does not communicate with the outside air, the substrate receiving surface 2
When the substrate 21 is in a state of being suction-fixed thereon, the region facing the plurality of through holes 6a of the substrate 21 is also the substrate suction-fixing plate 1a.
Is attracted to the substrate receiving surface 2 side. Therefore, even if the substrate 21 has a warp, the substrate 21 can be fixed flatly on the substrate receiving surface 2 of the substrate 1 for holding and fixing the substrate over the entire area of the substrate 21. In the above description, only two embodiments of the substrate suction fixing device according to the present invention have been shown, and various modifications and changes may be made without departing from the spirit of the present invention.
第１図Ａ及びＢは、本発明による基板吸着固定装置の第
１の実施例を示す略線的平面図及びそのＢ−Ｂ線上の一
部を断面とした正面図、第１図Ｃ及びＤは、第１図Ａ及
びＢに示す本発明による基板吸着固定装置の第１の実施
例を用いて、吸着固定されるべき基板が複数の基板支持
体の基板受面上に受渡される状態及び基板が基板吸着固
定用板体の基板受面上に吸着固定される状態を示す一部
を断面とした正面図である。 第２図Ａ及びＢは、本発明による基板吸着固定装置の第
２の実施例を示す略線的平面図及びそのＢ−Ｂ線上の一
部を断面とした正面図、第２図Ｃ及びＤは、第２図Ａ及
びＢに示す本発明による基板吸着固定装置の第２の実施
例を用いて、吸着固定されるべき基板が複数の基板支持
体の基板受面上に受渡される状態及び基板が基板吸着固
定用板体の基板受面上に吸着固定される状態を示す一部
を断面とした正面図である。 第３図Ａ及びＢは、従来の基板吸着固定装置を示す略線
的平面図及びそのＢ−Ｂ線上の一部を断面とした正面
図、第３図Ｃ及びＤは、第３図Ａ及びＢに示す従来の基
板吸着固定装置を用いて、吸着固定されるべき基板が複
数の基板支持体の基板受面上に受渡される状態及び基板
が基板吸着固定用板体の基板受面上に吸着固定される状
態を示す一部を断面とした正面図である。 Ａ……基板吸着固定手段 Ｂ……基板受渡手段 １、1a……基板吸着固定用板体 1b……ケース状体 ２……基板受面 ３……吸着用溝 ４、4a、4b……吸気用連絡孔 ５……吸気用外部連結管 ６、6a、6b……貫通孔 11……基板支持体 12……基板受部 13……基板受面 14……支持部 15……吸着用溝 16……吸気用孔 17、18……逆錐状体面 19……螺子 20……ナット 21……基板 22……発条 23……気密封止手段 24……連繋板 51……気密封止用環 52……気密封止用板1A and 1B are a schematic plan view showing a first embodiment of a substrate suction and fixing apparatus according to the present invention, and a front view in which a part thereof is cut along a line BB, and FIGS. FIG. 1 shows a state in which a substrate to be suction-fixed is transferred onto a substrate receiving surface of a plurality of substrate supports by using the first embodiment of the substrate suction-fixing device according to the present invention shown in FIGS. FIG. 4 is a front view, partially in section, showing a state in which a substrate is suction-fixed on a substrate receiving surface of a substrate for fixing a substrate by suction. 2A and 2B are a schematic plan view showing a second embodiment of the substrate suction and fixing apparatus according to the present invention, a front view in which a part thereof is cut along a line BB, and FIGS. 2C and 2D. FIG. 2 shows a state in which a substrate to be suction-fixed is transferred onto a substrate receiving surface of a plurality of substrate supports using a second embodiment of the substrate suction-fixing device according to the present invention shown in FIGS. FIG. 4 is a front view, partially in section, showing a state in which a substrate is suction-fixed on a substrate receiving surface of a substrate for fixing a substrate by suction. 3A and 3B are a schematic plan view showing a conventional substrate suction and fixing device and a front view in which a part of the device is taken along a line BB, and FIGS. 3C and 3D are FIGS. The state in which the substrate to be suction-fixed is transferred onto the substrate receiving surfaces of the plurality of substrate supports and the substrate is placed on the substrate receiving surface of the substrate for substrate adsorption and fixing using the conventional substrate suction fixing device shown in FIG. It is the front view which made the cross section a part which shows the state adsorbed and fixed. A: board suction fixing means B: board delivery means 1, 1a: board body for board suction fixing 1b: case-like body 2: board receiving surface 3: suction groove 4, 4a, 4b ... suction Connection hole 5 ... External intake pipe 6 for intake 6, 6a, 6b ... Through hole 11 ... Board support 12 ... Board receiving part 13 ... Board receiving surface 14 ... Support part 15 ... Suction groove 16 … Intake holes 17, 18… Inverted conical body surface 19… Screw 20… Nut 21… Board 22… Spring 23… Airtight sealing means 24… Connecting plate 51… Airtight sealing ring 52 ... Hermetically sealed plate
───────────────────────────────────────────────────── フロントページの続き (72)発明者 島田 信幸 厚木市森の里若宮３番１号 日本電信電 話株式会社厚木電気通信研究所内 (72)発明者 三村 義昭 武蔵野市吉祥寺南町１丁目27番１号 エ ヌ・ティ・ティ・技術移転株式会社内 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Nobuyuki Shimada 3-1 Morinosato Wakamiya, Atsugi-shi Nippon Telegraph and Telephone Corporation Atsugi Telecommunications Research Institute Co., Ltd. (72) Inventor Yoshiaki Mimura 1-27-17-1 Kichijoji Minamicho, Musashino City NTT Technology Transfer Co., Ltd.
Claims (3)
吸気用溝を含み且つ吸気手段に連通する真空吸着機構
と、貫通孔とを有し、且つ基板が前記基板受面上に固定
して配される基板固定用板と、 前記貫通孔を貫通して上下する基板支持棒を有する基板
上下支持機構とを有し、前記貫通孔と前記真空吸着機構
とは、前記基板支持棒の上下の位置にかかわらず、互い
に連通し、 前記基板支持棒は、それが下に位置しているとき、前記
貫通孔をその延長途上で気密封止するが、上に位置して
いるとき、前記貫通孔を気密封止せず、 前記基板固定用板とその前記基板受面上に固定して配さ
れた前記基板と前記基板支持棒とは、前記基板支持棒が
下に位置しているとき、前記真空吸着機構を介して前記
吸気手段に連通する気密空間を形成するが、前記基板支
持棒が上に位置しているとき、前記真空吸着機構を介し
て前記吸気手段に連通する気密空間を形成しないことを
特徴とする基板吸着固定装置。1. A substrate receiving surface, a vacuum suction mechanism including a suction groove provided on the substrate receiving surface side and communicating with a suction means, and a through hole, wherein the substrate is provided on the substrate receiving surface. A substrate fixing plate fixedly disposed on the substrate, and a substrate up-down support mechanism having a substrate support rod that goes up and down through the through-hole. The through-hole and the vacuum suction mechanism are provided on the substrate support. Regardless of the upper and lower positions of the rod, they communicate with each other, and when the substrate supporting rod is located below, the substrate supporting rod hermetically seals the through hole in the middle of its extension, but when it is located above The hermetic sealing of the through-hole, the substrate fixing plate and the substrate and the substrate supporting rod fixedly arranged on the substrate receiving surface are located below the substrate supporting rod. At this time, an airtight space communicating with the suction means through the vacuum suction mechanism is formed. When the substrate support rods is located at the top, the substrate chucking apparatus characterized by not forming a gas-tight space communicating with the inlet means through the vacuum suction mechanism.
装置において、前記基板支持棒は、その先端が前記貫通
孔と気密整合する形状を有することを特徴とする基板吸
着固定装置。2. The substrate suction fixing device according to claim 1, wherein said substrate support rod has a shape in which a tip thereof is airtightly aligned with said through hole.
吸気用溝と、それに連通している第１の吸気用連絡孔
と、第１の貫通孔とを有し、且つ基板が前記基板受面上
に固定して配される基板固定用板と、 第２の吸気用連絡孔と第２の貫通孔とを有し、且つ前記
基板固定用板によって蓋されるケース状体と、 気密封止用板を有し且つ前記第１及び第２の貫通孔を貫
通して上下する基板支持棒を有する基板上下支持機構と
を有し、 前記第１及び第２の吸気用連絡孔は、前記基板支持棒の
上下の位置にかかわらず、吸気手段に連通し、 前記気密封止用板は、前記基板支持棒が下に位置してい
るとき、前記第２の貫通孔を気密封止するが、前記基板
支持棒が上に位置しているとき、前記第２の貫通孔を気
密封止せず、 前記基板固定用板とその前記基板受面上に固定して配さ
れた前記基板と前記ケース状体と前記気密封止用板と
は、前記基板支持棒が下に位置しているとき、前記第１
及び第２の吸気用連絡孔を介して前記吸気手段に連通す
る気密空間を形成するが、前記基板支持棒が上に位置し
ているとき、前記第１及び第２の吸気用連絡孔を介して
前記吸気手段に連通する気密空間を形成しないことを特
徴とする基板吸着固定装置。3. A substrate having a substrate receiving surface, an intake groove provided on the substrate receiving surface side, a first intake communication hole communicating with the intake groove, and a first through hole. Having a substrate fixing plate fixedly disposed on the substrate receiving surface, a second suction communication hole and a second through hole, and being covered by the substrate fixing plate. And a substrate vertical support mechanism having a substrate for hermetic sealing and having a substrate support rod that goes up and down through the first and second through-holes, wherein the first and second suction connections are provided. The hole communicates with the suction means regardless of the position of the substrate support bar above and below, and the hermetic sealing plate draws the second through hole when the substrate support bar is located below. Although the hermetic sealing is performed, the second through hole is not hermetically sealed when the substrate supporting rod is positioned on the upper side. The said substrate disposed in fixed onto the plate receiving face and the case-like body the hermetic sealing plate, when the substrate support rods is positioned below the first
And a hermetic space communicating with the suction means through the second suction communication hole is formed, but when the substrate support rod is located at the upper side, the airtight space is formed through the first and second suction communication holes. Wherein no airtight space communicating with the suction means is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61290708A JP2613035B2 (en) | 1986-12-05 | 1986-12-05 | Substrate suction fixing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61290708A JP2613035B2 (en) | 1986-12-05 | 1986-12-05 | Substrate suction fixing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63142829A JPS63142829A (en) | 1988-06-15 |
| JP2613035B2 true JP2613035B2 (en) | 1997-05-21 |
Family
ID=17759488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61290708A Expired - Lifetime JP2613035B2 (en) | 1986-12-05 | 1986-12-05 | Substrate suction fixing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2613035B2 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2763222B2 (en) * | 1991-12-13 | 1998-06-11 | 三菱電機株式会社 | Chemical vapor deposition method, chemical vapor deposition processing system and chemical vapor deposition apparatus therefor |
| KR100197649B1 (en) * | 1995-09-29 | 1999-06-15 | 김영환 | Thin film depositing apparatus |
| JP4275769B2 (en) * | 1998-06-19 | 2009-06-10 | 株式会社渡辺商行 | Substrate transfer device |
| JP4260630B2 (en) * | 2001-10-16 | 2009-04-30 | 東京エレクトロン株式会社 | Elevating mechanism for workpiece and processing apparatus using the same |
| JP2012151407A (en) * | 2011-01-21 | 2012-08-09 | Ushio Inc | Work stage and exposure device using work stage |
| JP6112474B2 (en) * | 2013-05-09 | 2017-04-12 | 信越半導体株式会社 | Wafer lifting apparatus and epitaxial wafer manufacturing method |
| CN105934715B (en) * | 2014-01-20 | 2019-01-01 | Asml荷兰有限公司 | Substrate holder, the supporting table for lithographic equipment, lithographic equipment and device making method |
| JP6513527B2 (en) * | 2015-08-26 | 2019-05-15 | 三菱電機株式会社 | Vacuum chuck stage |
| CN107527848B (en) * | 2016-06-20 | 2020-12-18 | 上海新昇半导体科技有限公司 | Mechanical arm and substrate grabbing method |
| WO2021070265A1 (en) * | 2019-10-08 | 2021-04-15 | 株式会社日立ハイテク | Sample stage and optical inspection device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61207035U (en) * | 1985-06-17 | 1986-12-27 |
-
1986
- 1986-12-05 JP JP61290708A patent/JP2613035B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63142829A (en) | 1988-06-15 |
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| EXPY | Cancellation because of completion of term |