JPS63142829A - Substrate attracting and clamping device - Google Patents

Abstract

PURPOSE:To secure a substrate on a substrate bearing surface even if the substrate is warped by composing substrate delivering means of a plurality of substrate supports having substrate bearing surfaces of small area, thereby correcting the warped substrate. CONSTITUTION:Substrate attracting and clamping means A and substrate delivering means B are provided. A flat substrate bearing surface 2 and a substrate attracting and clamping plate 1 having attracting groove formed, for example, in a latticelike pattern to be connected to external sucking means through a suction communication hole 4 and a suction external connection tube 5 near the bearing surface 2 are provided. The means B has, for example, circular substrate bearing surface 13 of small area. An attracting groove 15 disposed near the surface 13 to be connected to external sucking means through sucking hole 16 extended longitudinally in a support 14 is formed at the substrate bearer 12 of a plurality of substrate supports 11. Sealing means 23 is formed between the clamping plate 1 and the plurality of supports 11.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a substrate fixing device suitable for use in an exposure position for exposing fine patterns on various substrates such as semiconductor substrates.

2. Description of the Related Art Conventionally, a substrate suction and fixing device has been proposed having the configuration described below with reference to FIG.

That is, it has a substrate suction/fixing means A and a substrate transfer means B.

The substrate suction and fixing means A has a flat substrate receiving surface 2, and is connected to an external air intake means (not shown) through an air intake communication hole 4 and an air intake external connecting pipe 5, facing the substrate receiving portion 2. The substrate suction/fixing plate 1 has suction grooves 3 formed in, for example, a grid pattern.

Further, the board transfer means B includes a plate-shaped board receiving part 12 having a board receiving part 13 having a relatively large area;
It consists of one substrate support body 11 having a support portion 14 extending from the substrate receiving surface 13 in a direction perpendicular to the substrate receiving surface 13 .

The substrate receiving portion 12 of the substrate support 11 is connected to an external air intake means (not shown) through an air intake hole 16 that extends through the support portion 14 in its length direction. , board receiving i! A suction groove 15 facing 1li73 is provided.

Further, the substrate suction and fixing plate 1 constituting the substrate suction and fixing means A described above has a central part of the substrate receiving part 2 of the substrate suction and fixing plate 1 in a direction perpendicular to the substrate receiving surface 2. The board receiving surface 13 of the board receiving part 12 of the board supporting body 11 which is extended and constitutes the above-mentioned board transfer means B is parallel to the board receiving surface 2 of the board 1 for sucking and fixing the board. The substrate support 11 is placed so that it can be selectively placed on the lowered surface and on the surface of the substrate suction and fixing plate 1 that is parallel to but higher than the substrate receiving surface 2. A movable through hole 6 is formed.

The above is the configuration of the conventionally proposed substrate suction and fixing device.

According to the substrate suction and fixing device having such a configuration, the substrate support 11 constituting the substrate transfer means B as shown in FIG.
The substrate suction and fixation is carried out on a surface parallel to but lower than the substrate receiving surface 2 in the through hole 6 of the substrate suction and fixation plate 1 constituting the substrate suction and fixation means A. As shown in FIG. 3C, the substrate 21 to be suctioned and fixed in a state where it has a relative positional relationship with the plate 1 is suctioned and fixed by an appropriate substrate conveying means (not shown). The substrate support 11 is moved upward by suitable driving means (not shown), thereby causing the substrate The board receiving part 12 of the support body 11 is penetrated upward into the through hole 6 with its board receiving surface 13 maintaining a parallel relationship with the board receiving surface 2 of the board suction and fixing plate 1. Then, as shown in FIG. 3C, the substrate 21 can be received from below by the substrate receiving surface 13 of the substrate receiving portion 12 of the substrate support 11. Therefore, the substrate 21
can be delivered onto the substrate receiving surface 13 of the substrate support 11 from the above-mentioned substrate transport means.

In this case, the suction groove 1 of the substrate receiving portion 12 of the substrate support 11
5 is closed from above by the substrate 21, but if an external suction means is connected to the suction groove 15 in advance and the suction means is activated in advance, the suction means can be closed from above. Since the suction groove 15 of the substrate support 11 is evacuated by It is obtained in a state where it is suctioned and fixed on the top.

Further, as described above, from the state in which the substrate 1 is transferred onto the substrate receiving surface 13 of the substrate support 11, the substrate support 11 is moved downward by the driving means as shown in the third diagram. , whereby the substrate receiving part 1 of the substrate support 11
2 so that its substrate receiving surface 13 is on a surface lower than the substrate receiving surface 2 of the substrate suction and fixing plate 1, the substrate 21 is The substrate can be transferred from the substrate receiving surface 13-H of the support 11 onto the substrate receiving surface 2 of the board 1 for adsorbing and fixing the substrate.

In this case, the suction groove 3 of the substrate suction and fixing plate 1 is blocked from above by the substrate 27, but the air intake of the substrate suction and fixation plate 1 communicating with the suction groove 3 is An external intake means is connected to the connecting pipe 5 in advance, and
If the suction means is activated in advance, the suction groove 3 of the substrate suction and fixing plate 1 will be evacuated.
A state is obtained in which the substrate 21 is suctioned and fixed onto the substrate receiving surface 2 of the board 1 for sucking and fixing a substrate.

the problem that the invention seeks to solve.

According to the conventional substrate suction and fixing device shown in FIG.
can be suctioned and fixed onto the board receiving surface 2 of the board 1 for board suction and fixation, so even if the board 1 has a warp, it can be corrected and the board for suction and fixation of the board 1 can be fixed. It can be fixed on the substrate receiving surface 2 of the body 1.

However, in the case of the substrate suction and fixing device shown in FIG.
The plate body 1 for sucking and fixing a substrate does not have a configuration in which its through hole 6 is communicated with the air intake groove 3, and the substrate 21 is fixed by suction on the board receiving part 2 of the plate body 1 for sucking and fixing a substrate. In this state, even if the through hole 6 is blocked from above by the substrate 21, the through hole 6 is not configured to be evacuated. In the state where it is suctioned and fixed on the board receiving part 2 of 1,
Since the area of the substrate 21 facing the through hole 6 is not attracted to the board 1 side for adsorbing and fixing the substrate, and the through hole 6 has a large cross-sectional area, the substrate 21 is not warped in the above description. Although it has been stated that even if the board 21 is fixed on the board receiving surface 2 of the board 1 for adsorbing and fixing the board, this is not sufficient and in reality, the board 21 can be fixed on the board receiving surface 2 of the board 1 When the suction-fixing plate 1 is fixed on the board receiving surface 2, the area facing the d through hole 6 of the board 21 is as shown by the dotted line in the third diagram. body 1
It may be in a state where it is floating from the same surface as the board receiving part 2.

For example, when the conventional substrate suction and fixing device shown in FIG.
1 is made of a silicon wafer with a thickness of 0.6 to 0°7IIIl, and the through hole 6 of the plate 1 for adsorbing and fixing the substrate has a diameter of 3Qm.
In the case of a through-hole of 3.0 m, the region of the substrate 21 facing the negative through-hole 6 is raised by 3 to 10 μm at the center.

Therefore, in the case of the conventional substrate suction and fixing device not shown in FIG.
It is not possible to flatly fix the substrate 21 over the entire area on the substrate receiving surface 2 of the substrate suction/fixing plate 1. Therefore, for example, an exposure apparatus for exposing a fine pattern to a semiconductor substrate When applied to a semiconductor substrate, the fine pattern can be spread over the entire area of the semiconductor substrate. It had the disadvantage that it could not be exposed to light at three times.

Therefore, the present invention aims to propose a novel substrate suction and fixing device that does not have the above-mentioned drawbacks.

Substrate absorption according to the present invention! The y-fixing device, as in the case of the conventional substrate suction and fixing device described above in FIG. a substrate suction and fixing means having the above-mentioned substrate suction and fixing means, and a substrate transfer means for delivering the substrate brought to the substrate opposite to the substrate receiving surface of the substrate suction and fixing means onto the substrate receiving surface of the substrate suction and fixing means. .

However, in the substrate suction and fixing device according to the present invention, in the substrate suction and fixing device having such a configuration, the substrate transfer means is composed of a plurality of substrate supports each having a substrate receiving surface with a small area, and The suction fixing means has a substrate receiving surface extending in a direction perpendicular to the substrate receiving surface thereof and communicating with the suction groove, and connecting the substrate receiving surface of the substrate receiving portion of the plurality of substrate supports to the substrate receiving surface of the substrate suction fixing means. The plurality of substrate supports are arranged movably so that they can be selectively brought to a surface below the surface and a surface above the substrate receiving surface of the substrate suction and fixing means. A plurality of through holes are formed between the substrate suction and fixing means and the support part of the substrate transfer means, and the substrate receiving surface of the substrate receiving part of the plurality of substrate supports is arranged between the substrate suction and fixation means and the support part of the substrate transfer means. When the substrate is placed on a surface lower than the substrate receiving surface, the plurality of through holes are communicated with the suction groove on the substrate receiving surface side of the substrate suction and fixing means. However, on the side opposite to the substrate receiving surface side of the substrate suction and fixing means, an airtight sealing means is provided to prevent communication with the outside air.

Effects and Effects According to the substrate suction and fixing device according to the present invention having the above-described configuration, the substrate to be suctioned and fixed is transported by an appropriate substrate transfer method in the same manner as described above for the conventional substrate suction and fixation device in FIG. Using means, the substrate suction and fixing means is brought opposite the substrate receiving surface of the substrate suction and fixing means, and the plurality of substrate supports of the substrate transfer means are transferred to the substrate transfer means of the conventional substrate suction and fixation device described above in FIG. If the substrate supports are moved toward the substrate side using an appropriate driving means, the substrate receiving surfaces of the plurality of substrate supports can perform the conventional substrate suction as described above in FIG. Fixed! Similarly to the case of the second substrate support, it is possible to receive the substrate, and therefore, a plurality of substrates can be transferred from the substrate Wi transport means in accordance with the case of the conventional substrate suction and fixing device described above in FIG. The substrate can be transferred onto the substrate receiving surface of the substrate support.

In addition, from such a state, the plurality of substrate supports may be moved to the third
Similar to the case of the substrate support of the conventional substrate suction and fixing device described above in the figure, if it is moved toward the side opposite to the substrate side,
The substrate is fixed using one of the conventional substrate suction and fixing devices described above in FIG.
Depending on the case, the substrate can be transferred from a plurality of substrate supports onto the substrate receiving surface of the substrate suction and fixing means. In this case, as in the case described above with reference to FIG. The state in which the substrate is transferred onto the substrate receiving surface of the fixing means is the state in which the substrate is suctioned and fixed on the substrate receiving surface of the substrate suction and fixing means, as in the case of the conventional substrate suction and fixing device described above in FIG. can get.

Further, according to the substrate suction and fixing device according to the present invention, the substrate can be suctioned and fixed onto the substrate receiving surface of the substrate suction and fixing means, as in the case of the conventional substrate suction and fixation device described above in FIG. Therefore, as in the case of the conventional substrate suction and fixing device described above in FIG. It can be fixed.

However, in the case of the substrate suction and fixing device according to the present invention,
The substrate suction and fixing means has a configuration in which a plurality of through holes provided therein communicate with the suction groove, and between the substrate suction and fixation means and the plurality of substrate supports of the substrate transfer means,
When the airtight sealing means is provided and the substrate is suction-fixed on the substrate receiving surface of the substrate suction-fixing means, the plurality of through holes are formed by the air-tight sealing means to close the substrate of the substrate suction-fixing means. The board remains in communication with the suction groove on the receiving surface side, but is not communicated with the outside air on the opposite side of the board suction and fixing means from the board receiving surface side, so the board does not connect to the suction groove of the board suction and fixing means. When the substrate is suction-fixed on the surface, the area facing the plurality of through holes of the substrate is also suctioned to the substrate receiving surface side of the substrate suction-fixing means.

Therefore, even if the substrate is warped, it can be flatly fixed over the entire area of the substrate on the substrate receiving surface of the substrate suction and fixing means.

Embodiment 1 Next, a first embodiment of the substrate suction and fixing device according to the present invention will be described with reference to FIG.

In FIG. 1, parts corresponding to those in FIG. 3 are given the same reference numerals.

The substrate suction and fixing device according to the present invention shown in FIG. 1 includes substrate suction and fixing means A and substrate transfer means B, as in the case of the conventional substrate suction and fixing device described above in FIG.

As in the case of the conventional substrate suction and fixing device described above in FIG. The substrate suction/fixing plate 1 has suction grooves formed in, for example, a grid pattern and is connected to an external suction means (not shown) via an external connecting pipe 5.

Further, the board transfer means B includes a board receiving part 12 having a small area, for example, a circular board receiving part 13, and extending below the board receiving surface 13 in the same shape as the board receiving part 13;
from the side opposite to the board receiving surface 13 side and from the board receiving surface 13 side.
The substrate supporting body 11 is composed of a plurality of, for example, three, substrate supports 11 having a supporting portion 14 having a smaller cross section than the substrate receiving portion 12 extending in a direction perpendicular to the substrate receiving portion 12 .

These plurality of substrate supports 11 have a length that is sufficiently longer than the thickness of the substrate suction and fixation plate 1 constituting the substrate suction and fixation means A described above.

In addition, the board receiving parts 12 of the plurality of board supports 11 are connected to an external air intake means (not shown) through intake holes 16 extending in the length direction within the support part 14. , suction grooves 15 facing the substrate receiving surface 13 are provided.

Furthermore, the support part 14 side of the board receiving part 12 has a cross section that gradually becomes smaller as it reaches the support part 14 side so that it becomes the same cross section as the support part 14 at the connection with the support part 14,
Therefore, the board receiving part 12 has, on its supporting part 14 side,
It has an outer surface consisting of an inverted conical surface 17.

Furthermore, the board suction and fixing plate 1 constituting the above-mentioned substrate suction and fixing device A has a concentric circle centered on the center of the substrate receiving surface 2 extending in a direction perpendicular to the substrate receiving part 2. The same number of through holes 6 as the number of substrate supports 11 of the above-described substrate transfer means B are formed.

In this case, the plurality of through holes 6 are formed on the substrate receiving surface 2 side.
A hole 6a having a length slightly longer than the board receiving part 12, which is movable with the board receiving part 12 of the board supporting body 11 having its board receiving surface 13 parallel to the board receiving surface 2; A hole 6b having a length shorter than the support part 14 on the side opposite to the receiving surface 2 side, where the board support part 13 of the board support body 11 cannot move but the support part 14 of the board support body 11 can move.
It consists of.

Further, the hole portion 6b side of the hole portion 6a on the substrate receiving surface 2 side of the plurality of through holes 6 has an inverted conical shape that constitutes the outer surface on the support portion 14 side of the substrate receiving portion 12 of the substrate support 11 described above. Gradually, as you reach the hole 6b side, so that the inner surface is an inverted conical surface 18 corresponding to the body surface 17, the cross section becomes the same as that of the hole 6b at the position where it connects with the hole 6b. It has a smaller cross section.

Therefore, the support parts 14 of the plurality of substrate supports 11 constituting the above-mentioned board transfer means B are placed in the plurality of through holes 6 with the substrate receiving parts 12 on the hole part 6a side of the n through hole 6. , and the outer surface of the inverted conical surface 17 of the substrate receiving section 12 on the side of the support section 14 is in constant contact with the inner surface of the inverted conical surface 18 of the hole 6a on the side of the hole 6b. , the substrate support 11 is placed on the board 1 for sucking and fixing a substrate, with the substrate receiving surface 13 of the substrate receiving part 12 being in the hole 6a of the through hole 6.

Further, while the plurality of substrate supports 11 are disposed on the substrate suction and fixing means 1 as described above, for example, the plurality of substrate supports 11 are engaged with the screws 19 attached to the free ends of the support portions 14. The plurality of substrate supports 11 are connected to each other by a common connecting plate 21 using a nut 2o.

Further, the plurality of substrate supports 11 are connected to each other by the connecting plate 21 as described above, and the board suction and fixing plate 1
In the state in which the connecting plates 21 and the substrate adsorption/fixing plate 1 are placed on top of each other, for example, springs 22 are inserted around each of the plurality of substrate supports 11. Each of the outer surfaces formed by the inverted conical surface 17 on the support section 14 side of the substrate receiving section 12 of the substrate support 11 is the corresponding inverted conical surface on the hole section 6b side of the hole section 6a of the through hole 6. 18, thereby keeping the through hole 6 in communication with the suction R3 on the board receiving surface 2 side of the board suction and fixing plate 1, but not on the board receiving surface 2 side. A state in which there is no communication with the outside air is obtained on the opposite side.

In addition, each of the outer surfaces formed by the inverted pyramidal surfaces 17 on the supporting part 14 side of the board receiving surfaces 12 of the plurality of board supports 11 described above and the corresponding hole part 6b side of the hole part 6a of the through hole 6 The inner surface formed by the inverted conical surface 18 means that the substrate receiving surface 13 of the substrate receiving portion 12 of the substrate support 11 is brought to a surface lower than the substrate receiving surface 2 of the board suction and fixing plate 1. When it is done,
The plurality of through holes 6 are communicated with the suction grooves 4 on the board receiving surface side of the board 1 for sucking and fixing a board, but on the side opposite to the board receiving surface 2 of the board 1 for sucking and fixing a board. , an airtight sealing means 23 between the substrate suction and fixing plate 1 and the plurality of substrate supports 11, which is not communicated with the outside air, is constituted.

The above is the configuration of the first embodiment of the substrate suction and fixing device according to the present invention.

According to the substrate suction and fixing device according to the present invention having such a configuration, the substrate transfer means B is configured as shown in FIG. The plurality of substrate supports 11 that have
The board suction and fixing plate 1 is held on a surface that is parallel to, but is lower than, the board receiving surface 2 in the through hole 6 of the board suction and fixing plate 1 constituting the board. As shown in FIG. 1B, the substrate 21 is transferred from a state having a relative relationship of ) to the board receiving surface 2 at the upper position of the board 1 for adsorbing and fixing the board.
and a plurality of substrate supports 11
If the connecting plate 21 is moved toward the substrate suction and fixing plate 1 side against the spring 22 by a cam mechanism serving as a driving means, the plurality of substrate supports 11 will be moved upward accordingly. Therefore, as shown in FIG. 1C, the substrate 21 can be received from below by the substrate receiving surfaces 13 of the substrate receiving portions 12 of the plurality of substrate supports 11. Therefore, the substrate 21 can be delivered onto the substrate receiving surfaces 13 of the plurality of substrate supports 11 from the substrate conveyance means.

In this case, the suction grooves 15 of the substrate receivers 12 of the plurality of substrate supports 11 are closed from above by the substrates 21, but an external suction means is connected to the suction grooves 15 in advance. If the suction means is operated in advance, the suction grooves 15 of the plurality of substrate supports 11 are evacuated by the suction means. A state in which the board 21 is placed on the surface 13 is obtained when the board 21 is suctioned and fixed onto the board receiving surface 13 of the plurality of board supports 11.

In addition, as described above, the substrate 1 has a plurality of substrate supports 11
As shown in the first diagram, the plurality of substrate supports 11 are moved downward by the above-mentioned cam mechanism from the state where the plurality of substrate supports 11 are transferred onto the substrate receiving surface 13 of The board receiving parts 12 of
3 is on the surface lower than the substrate receiving surface 2 of the board 1 for suctioning and fixing the substrate, then the board 21 can be held in the same manner as in the case of the conventional substrate suction and fixing device described above in FIG. As shown in the first diagram, the substrate can be transferred from the substrate receiving surface B of the plurality of substrate supports 11 to the substrate receiving surface 2 of the board 1 for adsorbing and fixing the substrate.

In this case, the suction grooves 3 of the substrate suction and fixing plate 1 are blocked from above by the substrate 21, but the suction grooves 3 of the substrate suction and fixation plate 1 are in communication with the suction grooves 3. An external intake means is connected to the connecting pipe 5 in advance, and
If the suction means is operated in advance, the suction grooves 3 of the substrate suction and fixation plate 1 are evacuated by the suction means, so that the substrate 21 is moved to the substrate receiving surface 2 of the substrate suction and fixation plate 1. The state in which the board 21 is transferred above is the state in which the board 21 is suctioned and fixed on the board receiving surface 2 of the board 1 for board suction and fixation, as in the case of the conventional board suction and fixing device described above in FIG. It can be obtained with

Further, according to the substrate suction and fixing device according to the present invention shown in FIG. Since the substrate 21 can be sucked and fixed onto the surface 2, even if the substrate 21 has a warp, it can be corrected as in the case of the conventional substrate suction and fixing device described above in FIG. Thus, it can be fixed onto the substrate receiving surface 2 of the board 1 for adsorbing and fixing the substrate.

However, in the case of the substrate suction and fixing device according to the present invention,
The board 1 for sucking and fixing a substrate has a configuration in which a plurality of through holes 6 provided therein communicate with the grooves 3 for sucking, and the plate 1 for sucking and fixing a substrate and a plurality of substrate supports 11 An airtight sealing means 23 is provided between the substrate 21 and the substrate 21.
is suction-fixed on the substrate receiving surface 2 of the substrate suction-fixing plate 1, the through-hole 6 is connected to the airtight sealing means 23.
As a result, the board holding surface 2 side of the board suction/fixing plate 1 remains connected to the suction groove 3, but the side opposite to the board receiving surface 2 of the board suction/fixing plate 1 remains connected to the suction groove 3. Since it is not connected to the outside air, when the board 21 is suctioned and fixed on the board receiving surface 2 of the board 1 for board suction and fixation, the area facing the plurality of through holes 6 of the board 21 also
It is attracted to the substrate receiving surface 2 side of the board 1 for adsorbing and fixing the substrate. Therefore, even if the substrate 21 has a warp,
The entire area of the board 21 can be flatly fixed onto the board receiving surface 2 of the board 1 for adsorbing and fixing the board.

Embodiment 2 Next, a second embodiment of the substrate suction and fixing device according to the present invention will be described with reference to FIG.

In FIG. 2, parts corresponding to those in FIG. 1 are designated by the same reference numerals.

The substrate suction and fixing device according to the present invention shown in FIG. 2 includes substrate suction and fixing means A and substrate transfer means B, as in the case of the substrate suction and fixing device according to the present invention described above in FIG.

The board suction fixing means A communicates with a flat board receiving surface 2 and an air intake communication hole 4a facing the board receiving surface 2 and facing the other surface facing the board receiving surface 2. It consists of a substrate suction/fixing plate 1a having intake grooves 3 having, for example, a grid pattern, and a case-like body 1b hermetically covered by the substrate suction/fixing plate 1a.

In this case, the inside of the case-like body 1b communicates with an intake connecting pipe 5 connected to an external intake means (not shown) via an intake communication hole 4a provided in a side wall of the case-like body 1b. Therefore, the air intake groove 3 of the substrate suction and fixing plate 1a is connected to the air intake communication hole 4a of the substrate suction and fixation plate 1a, the inside of the case-like body 1b, the air intake communication hole 4b, and the air intake communication pipe. 5 and is connected to an external intake means.

Further, the substrate transfer means B may be configured such that, for example, the board suction and fixing plate 1
It has a striped board receiving part 13 having two concentric arc lines centered on the center of the board receiving surface 2 of a as two opposing sides, and extends below the board receiving part 13 in the same shape as the striped board receiving part 13. For example, the board receiving part 12 has the same cross section as the board receiving part 12 extending from the board receiving part 12 in a direction opposite to the board receiving part 13 side and in a direction orthogonal to the board receiving surface 13. The substrate support body 11 includes, for example, four substrate supports 11 each having a support portion 14 .

These plurality of substrate supports 11 have a length that is sufficiently longer than the distance between the substrate receiving surface 2 of the substrate suction and fixing plate 1a described above and the outer surface of the case-like body 1b.

In addition, the plurality of substrate supports 110 and the substrate receiving portion 12 include a first
As in the case of the substrate suction and fixing device according to the present invention described above in the figures, the support part 14 is connected to an external suction means (not shown) through the suction hole 16 extending in the length direction thereof. , an intake @15 facing the board receiving surface 13 is provided.

Further, the substrate suction and fixing plate 1a constituting the substrate suction and fixing means Δ described above has a substrate receiving surface 2, as in the case of the substrate sucking and fixing device according to the present invention described above in FIG.
The same number of through-holes 6a as the number of substrate supports 11 constituting the above-mentioned substrate transfer means B are formed on a patent circle extending in a direction perpendicular to the substrate receiving surface 2, In addition, a substrate adsorption/fixing plate 1a is attached to the bottom wall of the case-like body 1b.
Through holes 6b extending in a direction perpendicular to the substrate receiving surface 2 of the substrate suction/fixing plate 1a are formed at positions corresponding to the respective through holes 6a.

In this case, the through hole 6a of the board 1 for sucking and fixing the board allows the board receiving part 12 of the board support 11 and the supporting part go 4 to be movable while keeping the board receiving surface 13 parallel to the board receiving surface 2. Consists of holes of any size.

On the other hand, a case-like body 1 constituting a substrate suction and fixing means
An airtight sealing ring 51 is disposed around the plurality of through holes 6b on the inner surface of the bottom wall of the substrate b, and a plurality of substrates constituting the substrate transfer means B are arranged. The support part 14 of the support body 11 has an airtight sealing plate 52 that cooperates with an airtight sealing ring 51 disposed on the case-like body 1b to seal the through hole 6b of the case-like body 1b. installed. In this case, when the airtight sealing plate 52 is in contact with the airtight sealing ring 51 from above, the substrate receiving surface 13 of the substrate support 11 is connected to the substrate of the board suction and fixing plate 1. It has a position on the support part 14 such that a certain relationship on a surface lower than the receiving surface 2 is obtained.

Thus, the plurality of substrate supports 11 constituting the above-mentioned substrate transfer means B are placed in the set of the plurality of through holes 6a and 6b, with the substrate receiving portion 12 facing the through hole 6a side, and hermetically sealed. The air-tight sealing plate 52 is placed in the case-like body 1b, and the air-tight sealing plate 52 contacts the air-tight sealing ring 51 from above, and the air-tight sealing plate 52 contacts the air-tight sealing ring 51 from above. Face 13
The substrate support 11 is arranged on the substrate suction and fixing means A in a state where the substrate support 11 is located in the through hole 6a.

In addition, the plurality of substrate supports 11 are arranged in their case-like bodies 1.
The plurality of substrate supports 11 are connected to each other by a common connection plate 21 at the free end of the support portion 14 extending downward.

The above is the configuration of the second embodiment of the substrate suction and fixing device according to the present invention.

According to the substrate suction and fixing device according to the present invention having such a configuration, as in the case of the substrate suction and fixing device according to the present invention described above in FIG. The plurality of substrate supports 11 that constitute the substrate support portions 13 of the substrate support portions 12 are connected to the substrate suction and rotation means A.
The board suction and fixing plate 1 is held on a surface that is parallel to the board receiving part 2 in the through hole 6a of the board suction and fixing plate 1a, but is lower than the board receiving part 2. As shown in FIG. 2B, the substrate 21 is moved by a suitable conveyor, as in the case of the substrate suction and fixing device according to the present invention described above in FIG. A (not shown) is used to bring the board suction and fixing plate 1a to a position above the board 1a, facing the board receiving surface 2. 21,
When the substrate suction and fixing plate 1 (Ill) is moved against the spring 22, the plurality of substrate supports 11 move upward accordingly, as shown in FIG. 2C. , the substrate 21 can be received from below by the substrate receiving surfaces 13 of the substrate receiving portions 12 of the plurality of substrate supports 11.

Therefore, the substrate 21 can be transferred from the substrate transfer means onto the substrate receiving surfaces 13 of the plurality of substrate supports 11, as in the case of the substrate suction and fixing device according to the present invention described above with reference to FIG.

In this case, as in the case of the substrate suction and fixing device according to the present invention described above with reference to FIG. However, if an external suction means is connected to the suction V415 in advance and the suction means is activated in advance, the suction grooves 15 of the plurality of substrate supports 11 can be opened by the suction means. Since the exhaust is performed, the board 2
1 is transferred onto the substrate receiving portions 13 of the plurality of substrate supports 11 in a state in which the substrates 21 are suctioned and fixed onto the substrate receiving surfaces 13 of the plurality of substrate supports 11.

Further, as in the case of the substrate suction and fixing device according to the present invention described above in FIG. Then, the plurality of substrate supports 11 are moved downward by the above-mentioned cam mechanism, whereby the substrate receiving portions 12 of the plurality of substrate supports 11 are moved so that their substrate receiving surfaces 13 are aligned with the substrate suction and fixing plate. If the board 21 is brought to the surface lower than the board receiving surface 2 of 1a, the board 21 is fixed by suction from above the board receiving surface B of the plurality of board supports 11, as shown in the second diagram. It can be delivered onto the board receiving surface 2 of the board 1 for use.

In this case, as in the case of the substrate suction and fixation device according to the present invention described above with reference to FIG. Board suction and fixing plate 1 communicating with the suction groove 3
If an external suction means is connected in advance to the suction connecting pipe 5 of a, and the suction means is activated in advance, the suction groove 3 of the substrate suction and fixing plate 1 can be evacuated. The state in which the substrate 21 is transferred onto the substrate receiving surface 2 of the board 1 for sucking and fixing a substrate is similar to the case of the substrate sucking and fixing device according to the present invention described above in FIG. 17 while being sucked and fixed onto the substrate receiving surface 2 of the plate 1.

Further, according to the substrate suction and fixing device according to the present invention shown in FIG. 2, the substrate 21 can be fixed to the substrate 21 of the substrate suction and fixing plate 1 in the same manner as in the case of the substrate suction and fixation device according to the present invention described above in FIG. Since it can be adsorbed and fixed on the receiving surface 2,
As in the case of the substrate suction and fixing device according to the present invention described above with reference to FIG. It can be fixed on top.

Furthermore, in the case of the substrate suction and fixing device according to the present invention shown in FIG. 2, the substrate suction and fixation plate 1a has a configuration in which a plurality of through holes 6a provided therein are communicated with the suction grooves 3. In addition, an airtight sealing means 23 is provided between the case-like body 1b and the plurality of substrate supports 11 constituting the substrate suction and fixing means AQ, and the substrate 21 is attached to the substrate suction and fixing plate. When the substrate 1a is suctioned and fixed onto the substrate receiving part 2, the through hole 6a remains connected to the suction groove 3 by the airtight sealing means 23, but the through hole 6a remains connected to the suction groove 3. , since it is not connected to the outside air, the board 21
is suction-fixed on the substrate receiving surface 2 of the substrate suction-fixing plate 1a, the plurality of through-holes 6a of the substrate 21
The area facing the substrate is also attracted to the substrate receiving surface 2 side of the substrate suction and fixing plate 1a. Therefore, even if the substrate 21 is warped, the entire area of the substrate 21 can be flattened.
It can be fixed on the substrate receiving surface 2 of the board 1 for adsorbing and fixing the substrate.

The above description merely shows two embodiments of the present invention, and various modifications and changes may be made without departing from the spirit of the present invention.

[Brief explanation of the drawing]

FIGS. 1A and 1B are a schematic plan view showing a first embodiment of the substrate suction and fixing device according to the present invention, and a partially sectional front view taken along the line B-8, and FIGS. 1C and D are , a state in which a substrate to be suctioned and fixed is transferred onto the substrate receiving surfaces of a plurality of substrate supports using the first embodiment of the substrate suction and fixing device according to the present invention shown in FIGS. FIG. 3 is a front view, partially in cross section, showing a state in which the substrate is suctioned and fixed onto the substrate receiving surface of the board for sucking and fixing the substrate. FIGS. 2A and 2B are a schematic plan view showing a second embodiment of the substrate suction and fixing device according to the present invention, and a partially sectional front view on B-8tlA, and FIGS. 2C and D are , a state in which a substrate to be suctioned and fixed is transferred onto the substrate receiving surfaces of a plurality of substrate supports using the second embodiment of the substrate suction and fixing device according to the present invention shown in FIGS. FIG. 3 is a partially cutaway front view showing the state in which the substrate is sucked and fixed onto the substrate receiving surface of the board for sucking and fixing the substrate. 3A and 3B are a line plan view showing a conventional glue board suction and fixing device, and a front view with a part of the cross section taken along line B-8, and 3C and D are 3A and 3B Using the conventional board @ mounting and fixing device shown in Fig. 2, a state in which a board to be suction-fixed is transferred onto the board-receiving surfaces of a plurality of substrate supports, and a board is placed on the board-receiving surface of the board for board suction-fixing. FIG. 3 is a front view, partially in cross section, showing a state in which the device is fixed by suction. 1.1a... Plate for board suction and fixation 1b... Case-like body 2.13... Board receiving surface 3... Groove for suction 4.4a14b......Intake connection hole 5...
......External connecting pipes 6.6a, 6b for intake air...Through hole 11...Base support 12...・・・
..... Board receiving part 14 .....
・Support part 15......Adsorption groove 16...
・・・・・・Intake sealing hole 17.18・・・Inverted pyramidal surface

Claims (1)

[Scope of Claims] A substrate suction/fixing means having a flat substrate receiving surface for receiving a substrate, a suction groove facing the substrate receiving surface and connected to a suction means, and a substrate receiving surface of the substrate suction/fixing means; A substrate suction and fixing device having a substrate transfer means for transferring a substrate brought oppositely onto the substrate receiving surface of the substrate suction and fixing means, the substrate transfer means having a substrate receiving surface with a small area. It consists of a plurality of board supports having a board receiving part and a supporting part extending from the board receiving part to the side opposite to the board receiving surface side, and the board suction and fixing means has a structure that is perpendicular to the board receiving surface. and communicates with the suction groove, and connects the substrate receiving surface of the substrate receiving portion of the plurality of substrate supports to a surface that is lower than the substrate receiving surface of the substrate suction fixing means and the substrate suction groove. A plurality of movably arranged through holes are formed in the plurality of substrate supports so that the substrate can be selectively brought to a surface above the substrate receiving surface of the fixing means, and the substrate suction Between the fixing means and the support portions of the plurality of substrate supports of the substrate transfer means, the substrate receiving surfaces of the substrate receiving portions of the plurality of substrate supports are lower than the substrate receiving surface of the substrate suction and fixing means. When the substrate is brought onto the surface, the plurality of through holes are kept in communication with the suction grooves on the substrate receiving surface side of the substrate suction and fixing means, but the substrate suction and fixation is A substrate suction and fixing device characterized in that an airtight sealing means that does not allow communication with outside air is provided on the opposite side of the means from the substrate receiving surface side.