JP2017045816A - Vacuum chuck stage - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow a worker to easily replace only a suction member without touching a vacuum seal member, while preventing the pressure of a suction member for sucking an object from lowering.SOLUTION: A base plate 30 in a vacuum chuck stage includes a first hole (51), formed at a position overlapping a suction member 10 so as to penetrate from the upper surface to the lower surface of the base plate, and vacuum sucking an object (1) to the upper surface of the suction member through the suction member by vacuum drawing, and a second hole (33) formed at a position overlapping the suction member and not overlapping the first hole, and penetrating from the upper surface to the lower surface of the base plate. The suction member is separated from the upper surface of the base plate, by inserting a push-up member into the second hole.SELECTED DRAWING: Figure 2

Description

  The technology disclosed in this specification relates to a vacuum chuck stage, and more particularly to a vacuum chuck stage for fixing an object such as a semiconductor wafer.

  When a semiconductor wafer is adsorbed using a vacuum chuck stage that adsorbs a semiconductor wafer, for example, a foreign material having a size of about several tens of μm to several hundreds of μm between the chuck table of the vacuum chuck stage and the semiconductor wafer. May get caught. In that case, the foreign matter fixed on the chuck table may continuously damage the surface of the semiconductor wafer, and the chuck table may need to be replaced.

  On the other hand, as exemplified in Patent Document 1, for example, there is a type that includes a chuck table that is divided into a first table and a second table in order to reduce the burden of the chuck table replacement work.

JP 2014-093384 A

  Some conventional vacuum chuck stages include an adsorption member that adsorbs a semiconductor wafer and a vacuum seal member that surrounds the adsorption member in plan view. In this configuration, the suction member and the vacuum seal member form one flat surface.

  In the vacuum chuck stage having the above-described configuration, when a problem occurs on the suction surface that sucks the semiconductor wafer, generally, the suction member and the vacuum seal member are replaced at the same time. In some cases, the frequency becomes higher and the frequency of replacement decreases.

  From the viewpoint of reducing the replacement cost, when only the suction member is replaced, the operator may unintentionally contact the vacuum seal member surrounding the outer periphery of the suction member, which may cause scratches or contamination of the vacuum seal member. .

  On the other hand, when the vacuum seal member is removed, outside air flows into the side surface of the adsorption member when the semiconductor wafer is adsorbed, so that the pressure for adsorbing the semiconductor wafer of the adsorption member is reduced. Therefore, there are cases where the semiconductor wafer cannot be properly adsorbed and fixed.

  The technology disclosed in the present specification is for solving the above-described problems, and prevents the operator from touching the vacuum seal member while preventing a decrease in pressure for sucking the object of the suction member. The present invention relates to a vacuum chuck stage in which only the suction member can be easily replaced.

  A vacuum chuck stage according to an aspect of the technology disclosed in this specification includes a base plate, an adsorption member disposed on an upper surface of the base plate, and an upper surface of the base plate so as to surround the adsorption member in a plan view. A vacuum that includes a first seal member and a push-up member disposed below the base plate, wherein the base plate is formed at a position overlapping the adsorption member in plan view and penetrates from the upper surface to the lower surface of the base plate By being pulled, a first hole for vacuum-adsorbing an object on the upper surface of the suction member via the suction member is formed at a position that overlaps the suction member and does not overlap the first hole in plan view. And a second hole penetrating from the upper surface to the lower surface of the base plate, the push-up member being the first By being inserted into the hole, the suction member is separated from the upper surface of the base plate.

  A vacuum chuck stage according to an aspect of the technology disclosed in this specification includes a base plate, an adsorption member disposed on an upper surface of the base plate, and an upper surface of the base plate so as to surround the adsorption member in a plan view. A vacuum that includes a first seal member and a push-up member disposed below the base plate, wherein the base plate is formed at a position overlapping the adsorption member in plan view and penetrates from the upper surface to the lower surface of the base plate By being pulled, a first hole for vacuum-adsorbing an object on the upper surface of the suction member via the suction member is formed at a position that overlaps the suction member and does not overlap the first hole in plan view. And a second hole penetrating from the upper surface to the lower surface of the base plate, the push-up member being the first By being inserted into the hole, the suction member is separated from the upper surface of the base plate.

  According to such a structure, the fall of the pressure which adsorb | sucks the target object of an adsorption | suction member can be prevented by the 1st seal member arrange | positioned surrounding a adsorption | suction member in planar view. Moreover, since the suction member is separated from the upper surface of the base plate by inserting the push-up member into the second hole, only the suction member can be easily replaced without the operator touching the first seal member.

  The objectives, features, aspects, and advantages of the technology disclosed in this specification will become more apparent from the detailed description and the accompanying drawings provided below.

It is a top view which illustrates the composition for realizing a vacuum chuck stage about an embodiment. It is a side view which permeate | transmits the structure for implement | achieving a vacuum chuck stage regarding an embodiment partially, and illustrates. It is a top view which illustrates the composition except the adsorption member of a vacuum chuck stage about an embodiment. It is a bottom view which illustrates the composition except an adsorption member of a vacuum chuck stage about an embodiment. It is a side view which permeate | transmits partially the state which the raising mechanism of the vacuum chuck stage regarding the embodiment act | operated below, and illustrates. It is a side view which permeate | transmits partially the state which the push-up mechanism of the vacuum chuck stage act | operated upward regarding an embodiment, and illustrates. It is a top view which illustrates the composition of the adsorption plate in the adsorption member of the vacuum chuck stage concerning an embodiment. It is a bottom view which illustrates the structure of the suction plate in the suction member of the vacuum chuck stage regarding the embodiment. It is sectional drawing which illustrates the structure of the adsorption member of the vacuum chuck stage regarding embodiment. It is sectional drawing which illustrates the 1st structure of the raising pin and its accommodating part of the vacuum chuck stage regarding embodiment. It is sectional drawing which illustrates the 2nd structure of the raising pin and its accommodating part of the vacuum chuck stage regarding embodiment.

  Embodiments will be described below with reference to the accompanying drawings. Note that the drawings are schematically shown, and the mutual relationship between the size and position of images shown in different drawings is not necessarily described accurately, and can be changed as appropriate. Moreover, in the description shown below, the same code | symbol is attached | subjected and shown in the same component, and it is the same also about those names and functions. Therefore, the detailed description about them may be omitted.

  In the explanation given below, terms that mean a specific position and direction such as “top”, “bottom”, “side”, “bottom”, “front” or “back” may be used. However, these terms are used for convenience in order to facilitate understanding of the contents of the embodiment, and are not related to the direction in which they are actually implemented.

<First Embodiment>
Hereinafter, the vacuum chuck stage according to this embodiment will be described.

<Configuration>
FIG. 1 is a plan view illustrating a configuration for realizing a vacuum chuck stage according to this embodiment. FIG. 2 is a side view illustrating the configuration for realizing the vacuum chuck stage according to the present embodiment with a partial transmission.

  FIG. 3 is a plan view illustrating the configuration excluding the suction member of the vacuum chuck stage according to this embodiment. FIG. 4 is a bottom view illustrating the configuration excluding the suction member of the vacuum chuck stage according to this embodiment.

  As illustrated in FIGS. 1 and 2, the suction member 10 and the vacuum seal member 20 are disposed on the upper surface of the base plate 30. A plurality of holes 10 a are formed in the suction surface that sucks the base plate 30 of the suction member 10. The hole 10a may be, for example, a groove shape. A plurality of holes 10b are formed in the suction surface of the suction member 10 that sucks the semiconductor wafer 1. The hole 10b may have a groove shape, for example.

  As illustrated in FIG. 1, the vacuum seal member 20 is disposed so as to surround the suction member 10 in a plan view.

  Further, as illustrated in FIG. 2, a groove 32 for fixing the vacuum seal member 20 is formed on the upper surface of the base plate 30 on which the suction member 10 and the vacuum seal member 20 are arranged. A groove 31 for adsorbing the adsorbing member 10 is formed on the upper surface of the base plate 30 on the inner side in a plan view of a region where the groove 32 is formed. By evacuating the inside of the groove 31, the base plate 30 and the suction member 10 are fixed. The groove 31 may have a hole shape.

  Further, as illustrated in FIG. 2, a through hole 33 into which a push-up pin described later is inserted is formed inside the base plate 30 in a plan view of a region where the groove 32 is formed. The through hole 33 is a hole that penetrates from the upper surface of the base plate 30 to the lower surface of the base plate 30. As illustrated in FIG. 3, the groove 31 and the through hole 33 are formed at positions that do not overlap in a plan view. The through hole 33 is not located in the groove 31 on the upper surface of the base plate 30.

  A pin 35 for positioning the suction member 10 is formed on the upper surface of the base plate 30 on the inner side in a plan view of the region where the groove 32 is formed. The pin 35 is formed at a position where the groove 31 and the through hole 33 do not overlap with each other in plan view.

  Further, as illustrated in FIG. 2, a vacuum pipe 51 penetrating from the lower surface to the upper surface of the base plate 30 is formed. The vacuum pipe 51 is located in the groove 31.

  The vacuum seal member 20 is a low-rebound elastic body that is disposed in contact with the outer peripheral portion of the semiconductor wafer 1 and has a ring shape. As a material of the vacuum seal member 20, for example, a fluorine rubber sponge having a relatively low hardness is used. The semiconductor wafer 1 with which the vacuum seal member 20 contacts is, for example, 8 inches in diameter or 6 inches in diameter. Further, the outer peripheral portion of the semiconductor wafer 1 with which the vacuum seal member 20 contacts corresponds to a device invalid area. The vacuum seal member 20 has a width corresponding to the width in the diameter direction of the device invalid region of the semiconductor wafer 1.

  As illustrated in FIG. 2, a plurality of holes 10 a are formed in the suction surface that sucks the base plate 30 of the suction member 10 that is disposed so as to be surrounded by the vacuum seal member 20 in plan view. Further, as illustrated in FIG. 1, a plurality of holes 10 b are formed on the suction surface of the suction member 10 that sucks the semiconductor wafer 1.

  A plurality of positioning recesses 13 corresponding to the arrangement of the push-up pins 42 and a positioning recess 14 for positioning the base plate corresponding to the base plate 30 are formed on the suction surface of the suction member 10 that sucks the base plate 30. . The plurality of positioning recesses 13 are recesses for positioning the push-up pins 42.

  The adsorbing member 10 may be, for example, a porous porous body formed by innumerable pores. When the adsorbing member 10 is formed of the material, the semiconductor wafer 1 can be adsorbed and fixed while suppressing the warp generated in the thin semiconductor wafer 1.

  Further, the suction surface of the suction member 10 that sucks the semiconductor wafer 1 may be disposed lower than the upper surface of the vacuum seal member 20. When the suction surface for sucking the semiconductor wafer 1 of the suction member 10 is disposed lower than the upper surface of the vacuum seal member 20, the height of the upper surface of the vacuum seal member 20 is determined when the semiconductor wafer 1 is sucked. The inactive area of the semiconductor wafer 1 is pushed down to the height of the suction surface of the suction member 10 that sucks the semiconductor wafer 1. Therefore, the degree of adhesion between the outer peripheral portion of the semiconductor wafer 1 and the vacuum seal member 20 is increased by the elastic force of the vacuum seal member 20.

  As illustrated in FIGS. 2 and 4, a push-up mechanism 40 is disposed below the base plate 30. The push-up mechanism 40 includes a holding plate 41 of the push-up pin 42, a plurality of push-up pins 42, a knob 43, a guide clamp 44 of the holding plate 41 of the push-up pin 42, and a plurality of guides 45 of the holding plate 41.

  The plurality of push-up pins 42 are fixed vertically upward to the holding plate 41 so that the tips 42a have the same height. As illustrated in FIGS. 2, 3, and 4, the position of the push-up pin 42 in plan view is equal to the position of the through hole 33 formed in the base plate 30 in plan view. As illustrated in FIGS. 2 and 3, the push-up pin 42 is inserted into the through hole 33 formed in the base plate 30.

  The plurality of guides 45 are fixed vertically downward on the lower surface of the base plate 30. Then, as illustrated in FIG. 4, each guide 45 penetrates, for example, four corners of the holding plate 41, and a guide clasp 44 is attached at the lower end. The holding plate 41 can operate in the vertical direction along the guide 45.

  The operating range of the holding plate 41 is a position where the upper end is in contact with the lower surface of the base plate 30, and the lower end is a position in contact with the guide clasp 44 attached to the lower end of the guide 45. A knob 43 for controlling the operation of the holding plate 41 is attached to the side surface of the holding plate 41 so that the operator can easily operate the push-up mechanism 40 up and down.

  A support column 50 is disposed below the base plate 30. The support column 50 fixes at least the base plate 30 and the push-up mechanism 40 while maintaining a predetermined parallelism.

  A vacuum pipe 51 is disposed inside the support column 50. The vacuum pipe 51 is a pipe that penetrates the base plate 30 and the push-up mechanism 40. The vacuum pipe 51 is formed at a position overlapping the suction member 10 in plan view. Furthermore, the vacuum pipe 51 reaches into the groove 31. In the case illustrated in FIG. 3, it reaches the inside of the groove 31 formed near the center of the upper surface of the base plate 30.

  The vacuum pipe 51 connects the inside of the groove 31 on the upper surface of the base plate 30 to an external vacuum source (not shown here). Then, the vacuum piping 51 is evacuated using an electromagnetic valve (not shown here) of a vacuum source, so that the semiconductor wafer 1 is vacuum-sucked on the upper surface of the suction member 10 via the suction member 10.

<Action>
FIG. 5 is a side view illustrating the state in which the push-up mechanism 40 of the vacuum chuck stage according to the present embodiment is operated downward, partially transmissively. FIG. 6 is a side view illustrating the state in which the push-up mechanism 40 of the vacuum chuck stage according to the present embodiment is operated upward, partially transmissively. For simplicity, in FIGS. 5 and 6, the holes 10 a and the holes 10 b in the adsorption member 10 are not shown.

  As illustrated in FIGS. 5 and 6, the holding plate 41 moves in the vertical direction along the guide 45 by the operation of an operator (not shown here). In conjunction with this, the push-up pin 42 enters and exits from the through hole 33 on the upper surface of the base plate 30.

  When the tip 42a of the push-up pin 42 protruding from the upper surface of the base plate 30 pushes up the suction member 10 vertically upward, as shown in FIG. 6, the distance between the vacuum seal member 20 and the suction member 10 is larger than a predetermined distance. Also spread. Conversely, when the tip 42a of the push-up pin 42 on the upper surface of the base plate 30 lowers the suction member 10 vertically downward, the distance between the vacuum seal member 20 and the suction member 10 is predetermined as illustrated in FIG. It becomes narrower than the interval. When the distance between the vacuum seal member 20 and the suction member 10 is narrower than a predetermined distance, the vacuum seal member 20 and the suction member 10 can fix the surface of the semiconductor wafer 1.

  In this case, if the position of the suction member 10 is adjusted to a position where the tip 42a of the push-up pin 42 fits in the positioning recess 13 of the suction member 10, that is, a position where the positioning recess 13 and the through hole 33 overlap in plan view. When the push-up pin 42 is lowered, the suction member 10 and the vacuum seal member 20 can be prevented from contacting each other. Further, when the suction member 10 is positioned on the upper surface of the base plate 30, the pin 35 is fitted into the positioning recess 14, so that the suction member 10 is accurately placed at a predetermined position on the upper surface of the base plate 30.

  Since the push-up pin 42 pushes up the suction member 10 vertically upward, the distance between the vacuum seal member 20 and the suction member 10 becomes wider than a predetermined interval. Therefore, when the operator replaces the suction member 10, Without touching, the vacuum seal member 20 can be suppressed. Therefore, only the suction member 10 can be removed without causing scratches or contamination on the vacuum seal member 20 surrounding the suction member 10 in plan view.

  Further, when the suction member 10 is disposed again at a predetermined position on the upper surface of the base plate 30, if the suction member 10 is adjusted to a position where the tip 42 a of the push-up pin 42 fits in the positioning recess 13 of the suction member 10, the push-up is pushed up. When the suction member 10 is disposed with the pin 42 lowered, the vacuum seal member 20 and the suction member 10 can be prevented from contacting each other. Therefore, it is possible to prevent the vacuum seal member 20 or the suction member 10 from being scratched or contaminated.

  Furthermore, since the suction member 10 is surrounded by the vacuum seal member 20 in the vacuum chuck stage according to this embodiment, the outside air flows into the side surface of the suction member 10 and the pressure at which the suction member 10 sucks the semiconductor wafer 1 is reduced. This can be prevented.

  As described above, the components are arranged so that the suction member 10 is in contact with the vicinity of the center of the semiconductor wafer 1 that is the device effective region and the vacuum seal member 20 is in contact with the outer peripheral portion of the semiconductor wafer 1 that is the device ineffective region. For example, it is possible to easily replace only the suction member 10 that contacts the device effective area. Therefore, the cost effectiveness between the replacement cost and the product yield is improved.

  Here, a lock mechanism may be provided on the knob 43 and the guide 45 so that the push-up pin 42 is temporarily fixed in a state where the suction member 10 is pushed upward vertically.

  Further, the support column 50 may be connected to, for example, an external rotational power unit (not shown here) and rotate the vacuum chuck stage.

  Further, the operation of the push-up mechanism 40 in the vertical direction is not limited to manual operation by an operator, and may be mechanical power driven by electric power.

  Further, the vacuum chuck stage according to the present embodiment is used in a processing apparatus for grinding the semiconductor wafer 1 or a cleaning apparatus for cleaning the semiconductor wafer 1 with dry air, which requires the semiconductor wafer 1 to be firmly fixed. preferable.

  Further, the semiconductor wafer 1 is placed on the vacuum chuck stage by a semiconductor wafer transfer unit (not shown here). As a suction method of the semiconductor wafer 1 in the semiconductor wafer transfer unit, a general vacuum suction method can be assumed. Here, it is desirable that the adjustment is performed by the semiconductor wafer transfer unit so that the center position of the semiconductor wafer 1 coincides with the center position of the vacuum chuck stage.

  The semiconductor wafer transfer unit faces the surface of the suction member 10 with the holding plate 41 of the push-up mechanism 40 lowered as illustrated in FIG. Position them apart by a distance. Thereafter, the suction of the semiconductor wafer 1 by the semiconductor wafer transfer unit is released, and further, the suction at the vacuum chuck stage is started, whereby the semiconductor wafer 1 is transferred from the semiconductor wafer transfer unit to the vacuum chuck stage.

Second Embodiment
A vacuum chuck stage according to this embodiment will be described. In the following, the same components as those described in the above embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted as appropriate.

<Configuration>
FIG. 7 is a plan view illustrating the configuration of the suction plate in the suction member of the vacuum chuck stage according to this embodiment. FIG. 8 is a bottom view illustrating the configuration of the suction plate in the suction member of the vacuum chuck stage according to this embodiment.

  FIG. 9 is a cross-sectional view illustrating the configuration of the suction member of the vacuum chuck stage according to this embodiment.

  The adsorption member 110 used in the present embodiment includes an adsorption plate 11 that adsorbs the base plate 30 to the lower surface 11a, and a porous sheet 12 that adsorbs the semiconductor wafer 1 to the upper surface 12b.

  As illustrated in FIGS. 7 and 9, a through hole 11 c that penetrates from the upper surface 11 b of the suction plate 11 to the lower surface 11 a and a groove 11 d are formed on the upper surface 11 b of the suction plate 11. The through hole 11c reaches into the groove 11d. The groove 11d may have a shape that extends over the entire upper surface 11b of the suction plate 11.

  As shown in FIGS. 8 and 9, the lower surface 11 a of the suction plate 11 includes a through hole 11 c that penetrates from the upper surface 11 b to the lower surface 11 a of the suction plate 11 and a plurality of positioning recesses for positioning the push-up pins 42. 11e is formed. The through hole 11c and the positioning recess 11e are arranged at positions that do not overlap in plan view. A positioning recess 14 is formed on the lower surface 11 a of the suction plate 11.

  By fitting the pin 35 in the positioning recess 14, the suction plate 11 is accurately arranged at a predetermined position on the upper surface of the base plate 30. At this time, the through hole 11 c provided in the suction plate 11 and the groove 31 of the base plate 30 overlap.

  The porous porous sheet 12 including innumerable pores is disposed on the upper surface 11 b of the suction plate 11. And the groove | channel 11d and the lower surface 12a of the porous sheet 12 are vacuum-connected. The upper surface 11b of the suction plate 11 and the lower surface 12a of the porous sheet 12 are fixed to each other by being partly bonded with a double-sided tape (not shown here) having a thickness of about several tens of μm. May be.

  The operation of the vacuum chuck stage is the same as in the first embodiment. That is, the suction member 110 including the suction plate 11 and the porous sheet 12 is configured such that when the tip 42a of the push-up pin 42 protruding from the upper surface of the base plate 30 pushes the suction member 110 vertically upward, the vacuum seal member 20 and the suction member The distance to 110 is wider than a predetermined interval. Conversely, when the tip 42a of the push-up pin 42 lowers the suction member 110 downward, the distance between the vacuum seal member 20 and the suction member 110 is narrowed, and the surface of the semiconductor wafer 1 can be fixed on the vacuum chuck stage. An adsorption surface is formed.

  Since the adsorption member 110 includes the adsorption plate 11 and the porous sheet 12, for example, only the porous sheet 12 can be exchanged, and the exchange cost of the adsorption member can be further suppressed.

<Third Embodiment>
A vacuum chuck stage according to this embodiment will be described. In the following, the same components as those described in the above embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted as appropriate.

<Configuration>
FIG. 10 is a cross-sectional view illustrating a first structure of the push-up pin and its storage portion of the vacuum chuck stage according to this embodiment. FIG. 11 is a cross-sectional view illustrating a second structure of the push-up pin and its storage portion of the vacuum chuck stage according to this embodiment.

  In FIG. 10, a groove 36 into which the vacuum seal member 21 is fitted is formed on the inner wall of the through hole 133 of the base plate 30a. Then, the vacuum seal member 21 is fitted in the groove 36.

  The diameter of the push-up pin 42 is smaller than the diameter of the through-hole 133 and larger than the interval between the vacuum seal members 21 arranged to face each other. When the push-up pin 42 is inserted into the through hole 133, the push-up pin 42 elastically deforms the vacuum seal member 21.

  In the case illustrated in FIG. 10, the push-up pin 42 moves up and down in the through-hole 133 while causing friction with the vacuum seal member 21. Therefore, it is possible to more effectively suppress the outside air from flowing into the vacuum path of the vacuum chuck stage through the gap between the push-up pin 42 and the through hole 133.

  In FIG. 11, a groove 34 in which the push-up pin 142 is accommodated is formed on the inner wall of the through hole 233 of the base plate 30b. The groove 34 is opened to the upper surface side of the base plate 30b. That is, the groove 34 forms a groove width 34 a that is a width in the surface layer of the base plate 30 b in the through hole 233. The groove width 34a is larger than the hole width 33a. A vacuum seal member 21b is disposed at the bottom of the groove 34 on the lower surface side of the base plate 30b. The bottom of the groove 34 on the lower surface side of the base plate 30 b corresponds to the inner wall along the radial direction of the through hole 233.

  The width 42b at the tip 142a of the push-up pin 142 is larger than the width 42d of the other part of the push-up pin 142. In addition, the width 42 b at the tip end portion 142 a of the push-up pin 142 is larger than the hole width 33 a of the through hole 233 and smaller than the groove width 34 a of the groove 34. The height 42c of the tip end portion 142a of the push-up pin 142 is assumed to be smaller than the groove depth 34b of the groove 34 from the upper surface of the base plate 30b. The height 42c is a height obtained by adding the thickness of the tip 142a of the push-up pin 142 and the thickness of the vacuum seal member 21b. When the push-up mechanism is lowered, the tip 42a of the push-up pin 142 is positioned below the upper surface of the base plate 30b. That is, the tip end portion 142a of the push-up pin 142 is accommodated in the groove 34 in the surface layer of the base plate 30b.

  In FIG. 11, the vacuum seal member 21 b is elastically deformed in a state where the tip 42 a of the push-up pin 142 is accommodated in the groove 34.

  According to the above configuration, when the push-up pin 142 is moved up and down, the outside air is vacuum chucked through the gap between the push-up pin 142 and the through-hole 233 while suppressing friction between the push-up pin 142 and the inner wall of the through-hole 233. Inflow into the vacuum path of the stage can be more effectively suppressed.

<Effect>
Below, the effect by said embodiment is illustrated. In the following, effects based on the specific configuration exemplified in the above-described embodiment will be described. However, other similar configurations exemplified in the present specification may be substituted within a range where the similar effect is generated. May be. In addition, the replacement may be performed across a plurality of embodiments. In other words, the configurations exemplified in different embodiments may be combined to produce the same effect.

  According to the above embodiment, the vacuum chuck stage includes the base plate 30, the suction member 10, the vacuum seal member 20 corresponding to the first seal member, and the push-up pin 42 corresponding to the push-up member.

  The suction member 10 is disposed on the upper surface of the base plate 30. The vacuum seal member 20 is disposed on the upper surface of the base plate 30 so as to surround the suction member 10 in plan view. The push-up pin 42 is disposed below the base plate 30.

  The base plate 30 is formed at a position overlapping the suction member 10 in a plan view, and corresponds to a first hole penetrating from the upper surface to the lower surface of the base plate 30, and overlaps the suction member 10 in a plan view and a vacuum pipe. A through hole 33 is formed at a position that does not overlap with 51 and corresponds to a second hole that penetrates from the upper surface to the lower surface of the base plate 30.

  The vacuum pipe 51 is a pipe for vacuum-sucking the semiconductor wafer 1 corresponding to the object on the upper surface of the suction member 10 through the suction member 10 by being evacuated.

  Then, the suction pin 10 is separated from the upper surface of the base plate 30 by inserting the push-up pin 42 into the through hole 33.

  According to such a configuration, it is possible to prevent a decrease in pressure for adsorbing the semiconductor wafer 1 of the adsorption member 10 by the vacuum seal member 20 disposed so as to surround the adsorption member 10 in plan view. Further, since the suction member 10 is separated from the upper surface of the base plate 30 by inserting the push-up pin 42 into the through hole 33, the operator can easily replace only the suction member 10 without touching the vacuum seal member 20. Can do.

  Other configurations exemplified in the present specification other than these configurations can be omitted as appropriate. That is, the above effect can be produced only with these configurations. However, when at least one of the other configurations exemplified in this specification is appropriately added to the above configuration, that is, other configurations exemplified in this specification that are not described as the above configuration Even when added to the above configuration, the above-described effects can be similarly produced.

  Further, according to the above embodiment, the groove 31 is formed on the upper surface of the base plate 30. The vacuum pipe 51 is located in the groove 31 on the upper surface of the base plate 30.

  On the other hand, the through hole 33 is not located in the groove 31 on the upper surface of the base plate 30.

  According to such a configuration, the inside of the groove 31 is evacuated through the vacuum pipe 51 when the semiconductor wafer 1 is vacuum-sucked. On the other hand, the inside of the through hole 33 is not evacuated.

  Further, according to the above embodiment, the suction member 110 includes the suction plate 11 disposed on the upper surface of the base plate 30 and the porous sheet 12 disposed on the upper surface of the suction plate 11.

  According to such a configuration, since the porous sheet 12 having a relatively small thickness can be provided on the upper surface of the suction plate 11, for example, only the porous sheet 12 can be replaced, and the replacement cost of the suction member Is suppressed.

  Further, according to the above embodiment, the positioning recess 13 is formed on the lower surface of the adsorption member 10. The positioning recess 13 is formed at a position overlapping the through hole 33 of the base plate 30 in plan view.

  According to such a configuration, the push-up pin 42 inserted into the through-hole 33 is further fitted into the positioning recess 13, so that the relative position between the base plate 30 and the suction member 10 is accurately fixed. Therefore, it is possible to prevent the suction member 10 and the vacuum seal member 20 fixed to the upper surface of the base plate 30 from coming into contact when the push-up pin 42 is lowered.

  According to the above embodiment, the vacuum chuck stage includes the vacuum seal member 21 corresponding to the second seal member attached to the inner wall of the through hole 133 corresponding to the second hole.

  According to such a configuration, it is possible to more effectively suppress the outside air from flowing into the vacuum path of the vacuum chuck stage through the gap between the push-up pin 42 and the through hole 133.

  Moreover, according to said embodiment, the through-hole 233 corresponding to a 2nd hole has the groove width 34a corresponding to the diameter in the surface layer of the baseplate 30b larger than the hole width 33a corresponding to the diameter in another part. Moreover, the width 42b of the front-end | tip part 142a in which the push-up pin 142 corresponding to a push-up member is inserted in the through-hole 233 is larger than the width 42d in another part.

  And the front-end | tip part 142a of the raising pin 142 is accommodated in the through-hole 233 in the surface layer of the baseplate 30b.

  According to such a configuration, it is possible to suppress friction between the inner wall of the through hole 233 when the push-up pin 142 moves up and down. Further, since the width 42b of the tip 142a of the push-up pin 142 is larger than the hole width 33a of the through-hole 233, the tip 142a of the push-up pin 142 is caught by the bottom of the groove 34, and the push-up pin 142 is inserted into the through-hole 233. Can be fixed. Therefore, the operation of inserting the push-up pin 142 into the through hole 233 can be omitted.

  Moreover, according to said embodiment, a vacuum chuck stage is provided with the vacuum seal member 21b corresponding to the 2nd seal member attached to the inner wall along the radial direction of the through-hole 233. FIG.

  According to such a configuration, when the push-up pin 142 is moved up and down, outside air is vacuumed through the gap between the push-up pin 142 and the through-hole 233 while suppressing friction between the inner wall of the through-hole 233. It is possible to more effectively suppress the flow into the vacuum path of the chuck stage.

  Moreover, according to said embodiment, the vacuum chuck stage is provided with the support pillar 50 corresponding to the pillar member which supports the baseplate 30 rotatably.

  According to such a configuration, a desired process can be performed on the semiconductor wafer 1 by rotating the support pillar 50 in a state where the semiconductor wafer 1 is attracted to the attracting member 10.

<Modification>
In the above-described embodiment, the material, material, dimension, shape, relative arrangement relationship, or implementation condition of each component may be described. However, these are examples in all aspects, and are described in this specification. It is not limited to what has been described. Accordingly, innumerable modifications not illustrated are envisaged within the scope of the technology disclosed in this specification. For example, when transforming, adding or omitting at least one component, further includes extracting at least one component in at least one embodiment and combining it with the components of other embodiments. It is.

  In addition, as long as no contradiction arises, “one or more” components described as being provided with “one” in the above-described embodiment may be provided. Furthermore, each component is a conceptual unit, and one component consists of a plurality of structures, one component corresponds to a part of the structure, and a plurality of components. And the case where the component is provided in one structure. Each component includes a structure having another structure or shape as long as the same function is exhibited.

  Also, the descriptions in this specification are referred to for all purposes related to the present technology, and none of them is admitted to be prior art.

  Further, in the above embodiment, when a material name or the like is described without being particularly specified, the material includes other additives, for example, an alloy or the like unless a contradiction arises. .

  DESCRIPTION OF SYMBOLS 1 Semiconductor wafer 10,110 Adsorption member, 10a, 10b hole, 11 Adsorption plate, 11a, 12a Lower surface, 11b, 12b Upper surface, 11c, 33,133,233 Through-hole, 11d, 31,32,34,36 Groove, 11e, 13, 14 Positioning recess, 12 Porous sheet, 20, 21, 21b Vacuum seal member, 30, 30a, 30b Base plate, 33a Hole width, 34a Groove width, 34b Groove depth, 35 pins, 40 Push-up mechanism, 41 Holding plate, 42, 142 push-up pin, 42a tip, 42b, 42d width, 42c height, 45 guide, 50 support pillar, 51 vacuum pipe, 142a tip.

Claims (8)

A base plate;
A suction member disposed on an upper surface of the base plate;
A first seal member disposed on the upper surface of the base plate so as to surround the adsorption member in plan view;
A push-up member disposed below the base plate,
The base plate is
In order to vacuum-suck an object on the upper surface of the suction member through the suction member by being evacuated by being formed in a position overlapping the suction member in plan view and penetrating from the upper surface to the lower surface of the base plate A first hole of
A second hole penetrating from the upper surface to the lower surface of the base plate is formed at a position that overlaps the suction member and does not overlap the first hole in plan view;
The suction member is separated from the upper surface of the base plate by inserting the push-up member into the second hole.
Vacuum chuck stage. A groove is formed on the upper surface of the base plate,
The first hole is located in the groove on the upper surface of the base plate,
The second hole is not located in the groove on the upper surface of the base plate;
The vacuum chuck stage according to claim 1. The adsorption member is
A suction plate disposed on an upper surface of the base plate;
A porous sheet disposed on the upper surface of the adsorption plate,
The vacuum chuck stage according to claim 1 or 2. A depression is formed on the lower surface of the adsorption member,
The recess is formed at a position overlapping the second hole of the base plate in plan view.
The vacuum chuck stage according to any one of claims 1 to 3. A second seal member attached to the inner wall of the second hole;
The vacuum chuck stage according to any one of claims 1 to 4. The second hole has a diameter in the surface layer of the base plate larger than the diameter in the other part,
The push-up member has a tip width inserted into the second hole that is larger than the width of the other portion.
The tip of the push-up member is accommodated in the second hole in the surface layer of the base plate.
The vacuum chuck stage according to any one of claims 1 to 4. A second seal member attached to the inner wall along the radial direction of the second hole;
The vacuum chuck stage according to claim 6. A column member that rotatably supports the base plate;
The vacuum chuck stage according to any one of claims 1 to 7.

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