JP2014093384A - Chuck table - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chuck table capable of reducing a burden relating to replacement work.SOLUTION: A chuck table (4) is divided into a first table (41) and a second table (42) in a thickness direction. The first table includes: a base part (411); a holding part (412); a first contact surface (B1) which contacts with the second table; and a first suction hole (H1) which penetrates from the first contact surface to the holding part. The second table includes: a second contact surface (A2) which contacts with the first contact surface; a support surface (B2) which contacts with a chuck table base (31); a second suction hole (H2) which penetrates from the support surface to the second contact surface; a groove (D4) which is formed on the second contact surface; and a third suction hole (H3) which penetrates from the groove to the support surface.

Description

  The present invention relates to a chuck table that holds a workpiece such as a wafer.

  A workpiece such as a wafer having a device formed on the surface is processed by a processing apparatus such as a cutting apparatus or a laser processing apparatus. These processing apparatuses include a processing unit for processing a workpiece and a chuck table that holds the workpiece during processing (see, for example, Patent Document 1). The chuck table has a holding portion made of a porous ceramic material, and the workpiece is sucked and held by the holding portion. By moving the chuck table holding the workpiece relative to the machining unit, the workpiece can be machined by changing the machining position of the machining unit.

JP 2011-165932 A

  In the above-described processing apparatus, the chuck table can be replaced in accordance with problems such as breakage and deterioration over time. However, since the chuck table has a certain thickness in order to maintain rigidity necessary for holding the workpiece, for example, a large-diameter chuck table capable of holding a workpiece having a diameter of 450 mm (caliber), etc. However, the weight was increased, and the burden on the replacement work was also increased.

  The present invention has been made in view of this point, and an object thereof is to provide a chuck table that can reduce the burden associated with replacement work.

  The chuck table of the present invention is a chuck table that is supported by a chuck table base disposed in a processing apparatus and holds a workpiece on the upper surface, and the chuck table is a thin plate that matches the outer shape of the workpiece. The first table is divided into a first table and a second table in the thickness direction. The first table has a holding part for holding a workpiece, and a base having the holding part arranged on the upper side. A first contact surface that is a lower surface of the base portion opposite to the base portion and the holding portion and contacts the second table; and the first contact surface formed on the base portion from the first contact surface A first suction hole penetrating the holding portion, and the second table includes a second contact surface that contacts the first contact surface, and a second contact surface opposite to the second contact surface. A support surface supported at a predetermined position of the chuck table base, and the second contact from the support surface A second suction hole penetrating to the groove, a groove formed at a location other than the location where the second suction hole is formed on the contact surface, and a third suction hole penetrating from the groove to the support surface; The first table and the second contact surface are connected to the first contact surface and the second contact surface so that the first suction hole and the second suction hole are connected to each other. A first positioning portion for positioning the tables, and a second surface for positioning the second table and the chuck table between the support surface of the second table and the chuck table base. The chuck table base is provided with a positioning portion. When the second table is positioned and supported by the second positioning portion, the chuck table base is connected to the second suction hole and the third suction hole. A supply port from the pressure generation source is formed, and the first table and the second table are formed. It Bull are each detachable, characterized by.

  According to this configuration, since the chuck table is divided into the first table and the second table in the thickness direction so as to have a weight suitable for handling, it is possible to reduce the burden on the replacement work of the chuck table. .

  In the chuck table of the present invention, the second table has a notch for holding the first surface of the first table when the first table is peeled off from the second table. It is preferable to provide two or more on the outer periphery. According to this configuration, since the outer periphery of the second table has a notch, the first table can be easily grasped even when the first table and the second table are in contact with each other. Can be separated from the table.

  In the chuck table of the present invention, the outer diameter of the chuck table base may be smaller than the outer diameter of the chuck table. According to this configuration, the chuck table is divided into the first table and the second table in the thickness direction so as to have a weight suitable for handling, so that the outer diameter of the chuck table base is outside the chuck table. Even when the diameter is smaller than the diameter, the rigidity of the chuck table can be maintained without increasing the burden associated with the replacement work.

  ADVANTAGE OF THE INVENTION According to this invention, the chuck table which can reduce the burden concerning exchange work can be provided.

It is a perspective view which shows the structural example of the cutting device which concerns on this Embodiment. It is a perspective view which shows the structural example of the chuck table which concerns on this Embodiment. It is a plane schematic diagram which shows the structural example of the chuck table which concerns on this Embodiment. It is a cross-sectional schematic diagram which shows the state with which the chuck table which concerns on this Embodiment was mounted | worn with the chuck table base.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a perspective view illustrating a configuration example of a cutting device (processing device) 1 including a chuck table 4 according to the present embodiment. The cutting apparatus 1 according to the present embodiment is configured so as to cut a disk-shaped wafer (workpiece, not shown) held on the chuck table 4.

  As shown in FIG. 1, the cutting device 1 includes a rectangular parallelepiped housing 2 in which a space is formed. A cutting unit (not shown) including a cutting blade is accommodated in the housing 2. A movable table 3 that can move between the inside and the outside of the housing 2 is disposed below the housing 2. A chuck table 4 is provided above the moving table 3. FIG. 1 shows a state in which the moving table 3 and the chuck table 4 are positioned outside the housing 2.

  A loading / unloading unit 5 for loading / unloading a wafer is provided in front of the housing 2 so as to be adjacent to the moving table 3 and the chuck table 4. A push-pull arm 6 and a pick-up arm 7 are provided on the front surface 2 a of the housing 2 to transfer a wafer between the carry-in / carry-out unit 5 and the chuck table 4. A temporary placement mechanism 8 for temporarily placing the wafer is provided at a position slightly higher than the chuck table 4. Further, a touch panel type monitor 9 for setting various processing conditions in the cutting device 1 is provided on the side surface 2 b of the housing 2.

  The carry-in / carry-out unit 5 includes a cassette elevator 51 on which a cassette (not shown) for housing wafers is placed. The cassette elevator 51 is configured to be movable up and down, and adjusts the position of the wafer accommodated in the cassette in the height direction (Z-axis direction). The push-pull arm 6 pulls out the wafer whose height is adjusted by raising and lowering the cassette elevator 51 from the cassette and places the wafer on the temporary placement mechanism 8. Further, the wafer placed on the temporary placement mechanism 8 is pushed into the cassette and accommodated.

  The temporary placement mechanism 8 includes a pair of guide rails 81 and 82. The guide rails 81 and 82 have an L-shaped cross-sectional shape and are configured to be separated from each other. When the wafer is pulled out from the cassette by the push-pull arm 6, the guide rails 81 and 82 move to an approach position close to each other and support the wafer. The wafer is aligned above the chuck table 4 along the guide rails 81 and 82. When the wafer is moved from the guide rails 81 and 82, the guide rails 81 and 82 move to the separated positions separated from each other.

  The pickup arm 7 picks up the wafer placed on the guide rails 81 and 82. When the wafer is picked up, the guide rails 81 and 82 move to the separated positions separated from each other as described above. The pick-up arm 7 places the wafer on the chuck table 4 in a state where the wafer passes between the guide rail 81 and the guide rail 82 so as to have a gap through which the wafer passes.

  The pickup arm 7 picks up the processed wafer placed on the chuck table 4. When the wafer is picked up, the guide rails 81 and 82 move to the approach positions close to each other. When the wafer can be held by the guide rails 81 and 82 moved to the approach position, the pickup arm 7 places the wafer on the guide rails 81 and 82.

  The moving table 3 is moved in the front-rear direction (X-axis direction) by a moving mechanism (not shown) provided in the lower part. A cylindrical chuck table base 31 is provided on the moving table 3 (not shown in FIG. 1, see FIG. 4). The chuck table base 31 includes a rotation mechanism (not shown), and rotates around a vertical axis (Z axis). A chuck table 4 for attracting and holding the wafer is detachably attached to the upper portion of the chuck table base 31. The wafer held on the chuck table 4 is relatively moved and rotated relative to the cutting unit in the housing 2 by the movement of the moving table 3 and the rotation of the chuck table base 31.

  Next, with reference to FIGS. 2-4, the detail of the chuck table 4 with which the cutting device 1 is provided is demonstrated. 2 is a perspective view showing a configuration example of the chuck table 4 according to the present embodiment, FIG. 3 is a schematic plan view showing a configuration example of the chuck table 4 according to the present embodiment, and FIG. 2 is a schematic cross-sectional view showing a state where the chuck table 4 according to the present embodiment is mounted on a chuck table base 31. FIG. FIG. 4 schematically shows a cross section corresponding to the cross section taken along the arrow IV-IV in FIG.

  As shown in FIGS. 2 to 4, the chuck table 4 includes a disk-shaped first table 41 and a second table 42 corresponding to the shape of the wafer. The first table 41 and the second table 42 are fixed to the chuck table base 31 on the second table 42 side in a state where the first table 41 is stacked above the second table 42. Each of the first table 41 and the second table 42 includes disk-shaped base parts 411 and 421 formed of a metal material such as stainless steel.

  A circular opening O1 is formed on the upper surface A1 of the base part 411 constituting the first table 41. A disc-shaped holding portion 412 with which the wafer comes into contact is disposed in the opening O1. The holding part 412 is made of a porous ceramic material, and a suction force is generated on the surface 412a of the holding part 412 according to a negative pressure from a negative pressure generating source (not shown) as will be described later. By generating a suction force in a state where the wafer is in contact with the surface 412 a of the holding unit 412, the wafer is sucked and held by the holding unit 412.

  As shown in FIGS. 3A and 4, a groove D <b> 1 is provided on the lower surface (first contact surface) B <b> 1 of the base portion 411. This groove D1 has a shape in which a circular groove D2a and two annular grooves D2b, D2c formed concentrically are connected by four linear grooves D3a, D3b, D3c, D3d extending radially. . In a region surrounded by the circular groove D2a, the annular groove D2b, and the linear grooves D3a and D3b, a suction hole (first hole) that penetrates the base portion 411 from the lower surface B1 toward the upper surface A1 (the bottom portion of the opening O1). (Suction hole) H1 is formed.

  As shown in FIGS. 3B and 4, a groove D <b> 4 is provided on the upper surface (second contact surface) A <b> 2 of the base portion 421 that contacts the lower surface B <b> 1 of the base portion 411. The groove D4 is formed at a position corresponding to the groove D1 formed on the lower surface B1 of the base portion 411. Specifically, the groove D4 has a shape in which a circular groove D5a and two annular grooves D5b, D5c formed concentrically are connected by four linear grooves D6a, D6b, D6c, D6d extending radially. Have.

  In the base portion 421, the region surrounded by the circular groove D 5 a, the annular groove D 5 b, and the linear grooves D 6 a, D 6 b is directed from the upper surface A 2 to the lower surface (support surface) B 2 that comes into contact with the chuck table base 31. A suction hole (second suction hole) H2 penetrating the base portion 421 is formed. Further, a suction hole (third suction hole) H3 penetrating the base portion 421 from the bottom of the circular groove D5a toward the lower surface B2 side is formed in the circular groove D5a.

  A groove D7 (see FIG. 4) is provided on the lower surface B2 of the base portion 421. A groove D8 is provided on the upper surface A3 of the chuck table base 31. The groove D7 of the base portion 421 is formed at a position corresponding to the groove D8 of the chuck table base 31. The grooves D7 and D8 are formed in a shape in which a circular groove and a linear groove are combined, for example, like the grooves D1 and D4.

  The chuck table base 31 is provided with suction holes (supply ports) H4 and H5 at positions corresponding to the suction holes H2 and H3. At the bottom of the groove D8 of the chuck table base 31, a suction hole H6 is formed. The suction holes H4, H5, H6 are each connected to a negative pressure generation source such as a vacuum pump. The suction holes H4, H5, and H6 may be connected to a common negative pressure generation source, or may be connected to different negative pressure generation sources.

  The outer diameter of the chuck table base 31 is smaller than the outer diameter of the chuck table 4. That is, the outer diameter of the chuck table base 31 is smaller than the outer diameters of the first table 41 and the second table 42. For example, the chuck table 4 designed for a 450 mm diameter (caliber) wafer can be placed on the chuck table base 31 designed for a 300 mm diameter (caliber) wafer. However, the outer diameter of the chuck table base 31 may be approximately the same as the outer diameter of the chuck table 4.

  As shown in FIG. 2 and FIG. 3, two notches C are formed on the outer periphery of the base part 421 so that a part of the side surface S <b> 2 of the base part 421 is recessed. In contrast, no notch is formed on the outer periphery of the base part 411, and the side surface S <b> 1 of the base part 411 is not recessed at a position corresponding to the notch C of the base part 421. For this reason, if the operator's hand or finger is inserted into the notch C, the first table 41 can be easily grasped and separated even when the first table 41 and the second table 42 overlap. (See FIG. 2B). Although it is desirable to form two or more notches C on the outer periphery of the base portion 421, the configuration of the chuck table 4 is not limited to this. The size, number, shape, etc. of the cutouts are arbitrary. For example, only one notch C may be formed, or the notch C may not be formed. Moreover, the large notch C may be formed, or many notches C may be formed, and the weight of the 2nd table 42 may be reduced.

  As shown in FIG. 4, a first positioning portion P1 for aligning the first table 41 and the second table 42 is provided on the lower surface B1 of the base portion 411 and the upper surface A2 of the base portion 421. Is provided. The first positioning portion P1 includes a concave portion P1a on the base portion 411 side and a convex portion P1b on the base portion 421 side, and the concave portion P1a and the convex portion P1b are engaged with each other. The first positioning part P1 aligns the suction hole H1 of the base part 411 and the suction hole H2 of the base part 421, and positions the groove D1 of the base part 411 and the groove D4 of the base part 421. It is formed to match.

  A second positioning portion P2 for aligning the second table 42 and the chuck table base 31 is provided on the lower surface B2 of the base portion 421 and the upper surface A3 of the chuck table base 31. The second positioning portion P2 includes a concave portion P2a on the base portion 421 side and a convex portion P2b on the chuck table base 31 side, and the concave portion P2a and the convex portion P2b are engaged with each other. The second positioning part P2 aligns the suction holes H2 and H3 of the base part 421 and the suction holes H4 and H5 of the chuck table base 31, respectively, and also aligns the groove D7 of the base part 421 and the chuck table base 31. It is formed so as to align with the groove D8.

  When the concave portion P1a and the convex portion P1b constituting the first positioning portion P1 are engaged with each other, and the concave portion P2a and the convex portion P2b constituting the second positioning portion P2 are mutually engaged, the first table 41, the second table 42, and the chuck table base 31 are aligned with each other. As a result, the suction holes H1, H2, and H4 are connected to each other. A holding portion 412 is disposed in the opening O1 located above the suction hole H1, and a negative pressure generation source is connected to the suction hole H4. For this reason, when the negative pressure generation source is operated, a suction force is generated on the surface 412a of the holding portion 412 by the negative pressure of the negative pressure generation source.

  Further, as described above, when the first table 41, the second table 42, and the chuck table base 31 are aligned, the suction holes H3 and H5 are connected to each other, and a space is formed by the grooves D1 and D4. The The suction hole H3 is connected to the space formed by the grooves D1 and D4, and a negative pressure generating source is connected to the suction hole H5. For this reason, when the negative pressure generating source is operated, the space formed by the grooves D1 and D4 is decompressed, and the first table 41 is adsorbed by the second table 42.

  When the second table 42 and the chuck table base 31 are aligned, a space is formed by the grooves D7 and D8. The suction hole H6 is connected to the space formed by the grooves D7 and D8, and a negative pressure generation source is connected to the suction hole H6. For this reason, when the negative pressure generation source is operated, the space formed by the grooves D7 and D8 is decompressed, and the second table 42 is adsorbed to the chuck table base 31.

  As described above, the chuck table 4 is mounted on the chuck table base 31 by operating the negative pressure generation source after the first positioning portion P1 and the second positioning portion P2 are aligned. Further, if the wafer is placed on the chuck table 4 in this state, the wafer can be sucked and held on the chuck table 4. If the suction by the negative pressure generating source is stopped, the suction of the wafer by the chuck table 4 and the chuck table 4 by the chuck table base 31 can be released. Thereby, the chuck table 4 can be removed from the chuck table base 31 and replaced.

  As described above, the chuck table 4 of the present embodiment is divided into the first table 41 and the second table 42 in the thickness direction so as to have a weight suitable for handling. Without changing the total weight, the weight related to the handling of the operator can be reduced. Thereby, the burden concerning replacement work can be reduced while maintaining the rigidity of the chuck table 4.

  Further, in the chuck table 4 of the present embodiment, two notches C are formed on the outer periphery of the base part 421 constituting the second table 42 so that a part of the side surface S2 of the base part 421 is recessed. Therefore, even when the first table 41 and the second table 42 are in contact with each other, the first table 41 can be easily gripped and separated from the second table 42. Thereby, the burden concerning exchange work can be reduced.

  In addition, the chuck table 4 of the present embodiment is divided into the first table 41 and the second table 42 in the thickness direction so as to have a weight suitable for handling. For example, the chuck table 4 has a diameter of 450 mm (caliber). Even when the outer diameter of the chuck table base 31 is smaller than the outer diameter of the chuck table 4 as in the case where the corresponding chuck table 4 is placed on the chuck table base 31 corresponding to the 300 mm diameter (portion), the burden associated with the replacement work The rigidity of the chuck table 4 can be maintained without increasing the value.

  Further, the chuck table 4 of the present embodiment includes a lower surface B1 and an upper surface A2 where the first table 41 and the second table 42 are in contact, and a lower surface B2 where the second table 42 and the chuck table base 31 are in contact. In addition, grooves D1, D4, D7, and D8 are formed in the upper surface A3. For this reason, the first table 41, the second table 42, and the chuck table base 31 can be attracted and fixed to each other, and the mutual contact area can be reduced to suppress the adhesion of dust and dust.

  In addition, this invention is not limited to description of the said embodiment, It can implement by changing variously. For example, although the cutting device has been described in the above embodiment, the processing device to which the chuck table according to the present invention is applied is not limited to the cutting device. For example, the chuck table of the present invention may be applied to a laser processing apparatus or the like.

  Moreover, in the said embodiment, although the chuck table of the structure divided | segmented into the 1st table and the 2nd table is shown, a chuck table may be divided | segmented into three or more tables. In the above embodiment, the first table and the second table constituting the chuck table are shown as being fixed by suction with a negative pressure from a negative pressure generation source. It may be fixed by a method such as stopping.

  Moreover, the negative pressure of an equivalent magnitude | size may be supplied to each suction hole of the said embodiment, and the negative pressure of a different magnitude | size may be supplied. For example, the negative pressure for mounting the chuck table on the chuck table base may be different from the negative pressure for attracting and holding the wafer on the chuck table. Further, the shape and size of the grooves formed in the first table, the second table, and the chuck table base can be arbitrarily selected.

  Moreover, in the said embodiment, although the 1st positioning part and the 2nd positioning part of the structure which combined the recessed part and the convex part are used, the structure of a 1st positioning part and a 2nd positioning part is this. Not limited to. The first positioning unit and the second positioning unit may be configured so that the first table, the second table, and the chuck table base can be aligned with each other.

  In addition, the configurations, methods, and the like according to the above-described embodiments can be changed as appropriate without departing from the scope of the object of the present invention.

  The chuck table of the present invention is useful when holding a workpiece such as a large-diameter (large-diameter) wafer.

1 Cutting equipment (processing equipment)
3 Moving Table 4 Chuck Table 31 Chuck Table Base 41 First Table 42 Second Table 411, 421 Base 412 Holding Section 412a Surface A1, A3 Upper Surface A2 Upper Surface (Second Abutting Surface)
B1 bottom surface (first contact surface)
B2 Lower surface (support surface)
C Notch D1, D4, D7, D8 Groove D2a, D5a Circular groove D2b, D2c, D5b, D5c Annular groove D3a, D3b, D3c, D3d, D6a, D6b, D6c, D6d Linear groove H1 Suction hole (first Suction hole)
H2 suction hole (second suction hole)
H3 suction hole (third suction hole)
H4, H5 suction hole (supply port)
H6 suction hole O1 opening P1 first positioning portion P1a, P2a concave portion P1b, P2b convex portion P2 second positioning portion S1, S2 side surface

Claims (3)

A chuck table that is supported by a chuck table base disposed in a processing apparatus and holds a workpiece on the upper surface,
The chuck table is formed in a thin plate shape that matches the outer shape of the workpiece, and is divided into a first table and a second table in the thickness direction,
The first table is a holding part for holding a workpiece, a base part having the holding part disposed on the upper side, and a lower surface of the base part opposite to the holding part, and the second table A first abutting surface that abuts, and a first suction hole penetrating from the first abutting surface formed in the base portion to the holding portion,
The second table is a second contact surface that contacts the first contact surface and a surface opposite to the second contact surface, and is supported at a predetermined position of the chuck table base. A support surface, a second suction hole penetrating from the support surface to the second contact surface, and a groove formed at a location other than the location where the second suction hole of the contact surface is formed, A third suction hole penetrating from the groove to the support surface,
The first table and the second table are positioned so that the first suction hole and the second suction hole are connected to the first contact surface and the second contact surface. Comprising a first positioning part for
The support surface of the second table and the chuck table base include a second positioning portion for positioning the second table and the chuck tables,
When the second table is positioned and supported by the second positioning portion, the chuck table base has a negative pressure generating source connected to the second suction hole and the third suction hole. A supply port is formed,
A chuck table, wherein the first table and the second table are detachable.   The second table is provided with two or more notches on the outer periphery for holding the first surface of the first table when the first table is peeled from the second table. The chuck table according to claim 1.   The chuck table according to claim 1, wherein an outer diameter of the chuck table base is smaller than an outer diameter of the chuck table.

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