JP2557433B2 - Pellet mounter - Google Patents

Description

TECHNICAL FIELD The present invention relates to a mounting device for mounting a pellet of a semiconductor element or the like on a stem, a lead frame or the like.

[Conventional technology]

Conventionally, the one shown in FIG. 3 has been proposed as one of devices for mounting a pellet of a semiconductor element or the like on a stem or a lead frame. This is because a plurality of pellets P obtained by cutting a semiconductor placement wafer as shown in FIG.
The pellet Pa placed on the pellet ring 10 driven by the Y-direction moving table and positioned at the pickup position A is conveyed to the positioning position B by the first pickup tool 21. Then, at the positioning position B, the pellets Pa are sandwiched and positioned by the position correcting claws 22 in the four directions, and the pellets Pa are transported to the mounting position C of the stem 11 by the second pickup tool 23 and mounted. There is.

Another mount device shown in FIG. 4 has also been proposed. As shown in the figure, this device employs a collet 24 as a pickup and mounting tool, and the pellet P is adsorbed to the taper surface 24a of the inner periphery of the tip of the collet 24 to perform positioning, thereby positioning the device in FIG. The position B can be dispensed with, and can be directly transported to the stem for mounting.

[Problems to be solved by the invention]

The above-described conventional mount devices have the following problems, respectively.

First, in the apparatus shown in FIG. 3, since the positioning position B of the pellet P is required, the apparatus becomes complicated, and the first and second pickup tools 21, 23 contact the pellet P twice, so that the pellet P is contacted. P is likely to be damaged,
It was a cause of defective pellets.

Further, in the apparatus of FIG. 4, when the pellets P are picked up, the pellets P arranged on the pellet ring are positioned and adsorbed by the tapered surface 24a of the inner circumference of the tip of the collet 24 so that the pellets P are arranged adjacent to each other. A gap is needed between them. For example, when the taper surface 24a is formed at 120 ° and a pellet P having a thickness t is adsorbed on the taper surface 24a, the distance from the bottom surface of the pellet P to the tip of the collet 24 is t / 2, and from the side surface of the pellet P to the side surface of the collet 24. Since the distance is 0.87t,
Greater spacing is required between pellets. For this reason,
It is necessary to rearrange the pellets obtained by cutting the semiconductor wafer so as to obtain this gap, which complicates the work.

The present invention is intended to improve such various problems, and provides a pellet mount device capable of simplifying the device, preventing damage to pellets, and achieving simplification of work. Is intended.

[Means for solving problems]

The pellet mounting device of the present invention is attached to a block of a mounting head that is moved in a plane direction and a vertical direction, a mount collet having a tapered surface at its lower end, and is vertically moved at the central axis position of this mount collet, and A tubular pickup tool whose inside is evacuated, and a packing which seals at least the peripheral surface of the pickup tool and the tubular inner surface of the mount collet when the pickup tool is moved upward. The pickup tool vacuum-adsorbs the pellet at a position where the lower end of the pickup tool is projected below the taper surface of the mount collet when the pickup tool is moved downward, and the pellet is brought into contact with the taper surface when moved upward. In addition, the inside of the cylinder of the mount collet is evacuated through the inside of the pickup tool and the pellet It is configured to vacuum suction mount collet.

〔Example〕

 Next, the present invention will be described with reference to the drawings.

FIG. 1 is a partially broken perspective view of an embodiment of the present invention, and FIGS. 2 (a) and 2 (b) are sectional views thereof. In these figures, the X,
Directional movement table (not shown) that moves in three directions of Y and Z
The mounting head 1 is attached to the tip of the arm 2 directly connected to
Is composed. The mounting head 1 has a vertical hole formed in a block 3 fixed to the arm 2, and a rectangular-shaped mount collet 4 is inserted into the hole. A load spring 5 is inserted between the mount collet 4 and the block 3 to apply a downward spring force to the collet 4. The lower surface of the mount collet 4 is formed as a taper surface 4a, and a thin cylindrical pickup tool 6 is inserted through the center axis of the mount collet 4.

The pickup tool 6 is supported by a cylinder 7 attached to the block 3 and is moved up and down in the mount collet 4 by the cylinder 7. A tube 8 is connected to the upper end of the pickup tool 6 and is connected to a vacuum source (not shown). A ring-shaped packing 9 is fitted to a part of the outer circumference of the pickup tool 6 in the mount collet 4.

According to the mounting device having this configuration, the semiconductor element pellets P are aligned on the pellet ring 10 in a state where the wafer is cut, and the pellet ring 10 is placed on an XY-direction moving table (not shown) to move the pellet ring 1. Two pellets
Position Pa at pickup position A.

Here, the mounting head 1 is lowered, and as shown in FIG. 2 (a), the pellet Pa is adsorbed to the lower end of the pickup tool 6 protruding below the mount collet 4 by vacuum. Next, the mounting head 1 is raised while adsorbing the pellets Pa, and the cylinder 7 is operated to raise only the pickup tool 6 on the inner surface of the mount collet 4. This allows the second
As shown in FIG. 6B, when the tip of the pickup tool 6 is moved above the lower end of the mount collet 4, the pellet Pa is pressed against the tapered surface 4a of the mount collet 4, and the taper is used. Positioning is performed.

When the positioning is completed, the lower end of the pickup tool 6 further rises, and the pellet Pa is transferred to the mount collet 4. At this time, the pickup tool 6
As the packing rises, the packing 9 comes into contact with the upper surface of the inside of the mount collet 4 to seal the inside, and the inside of the collet 4 becomes a vacuum state through the pickup tool 6, and the pellet Pa
Can be supported by the taper surface 4a of the mount collet 4.

Next, the mounting head 1 is conveyed to the mounting position C, and is lowered to bring the pellet into contact with the stem 11, and mounting with an adhesive material or eutectic solder is performed.

After that, the mounting head 1 is raised, the cylinder 7 is operated, and the pickup tool 6 is lowered to return to the initial state.

Hereinafter, by repeating the above operation, it becomes possible to sequentially mount a plurality of pellets.

Therefore, according to this mounting device, since the pellets can be positioned when the pellets Pa are held on the tapered surface 4a of the mount collet 4, the positioning position is not required and the structure can be simplified. Further, since the pickup tool 6 is used for picking up the pellets, it is possible to pick up from a state where the wafer is cut, and a gap is provided between adjacent pellets mounted on the pellet ring 10. It is not necessary to keep it, and the work can be simplified. Furthermore, since the pellet is only brought into contact with the taper surface of the mount collet 4 once, it is possible to prevent damage to the pellet.

〔The invention's effect〕

As described above, the present invention includes a mount collet having a tapered surface at the lower end and a pickup tool which is moved up and down inside the mount collet, and the lower end of the pickup tool is located below the tapered surface of the mount collet. Since the pellet is vacuum-sucked at the protruding position and the pellet is brought into contact with the tapered surface to perform positioning and transfer when it is drawn above the tapered surface, the positioning position of the pellet is unnecessary. This simplifies the configuration. In addition, the pellet pick-up operation can be performed once, and damage to the pellet can be prevented. Further, since it is possible to pick up wafers or the like in an aligned state while being completely cut, and there is no need to provide a space between adjacent pellets, there is an effect that the work can be simplified.

Further, in the present invention, when the pickup tool is moved upward, the pellet is brought into contact with the taper surface of the mount collet, and the inside of the mount collet cylinder is evacuated through the inside of the pickup tool to vacuum the pellet to the mount collet. Since it is adsorbed, pellet bonding can be performed in that state, and it is not necessary to provide a plurality of vacuum evacuation paths or perform switching operation of vacuum evacuation operation, and pellet bonding can be realized with a small number of work steps with a simple configuration. .

[Brief description of drawings]

FIG. 1 is a partially cutaway perspective view of an embodiment of the pellet mounting apparatus of the present invention, FIGS. FIG. 4 is a perspective view of a mounting device, and FIG. 4 is a partial cross-sectional view of a collet used in another conventional mounting device. 1 ... mounting head, 2 ... arm, 3 ... block, 4 ... mount collet, 4a ... tapered surface, 5
...... Load spring, 6 ...... Pickup tool, 7
...... Cylinder, 8 ...... Tube, 9 ...... Packing, 10 ...
… Pellet ring, 11 …… Stem, 21 …… First pick-up tool, 22 …… Position adjusting claw, 23 …… Second pick-up tool, 24 …… Collet, 24a …… Tapered surface, P, Pa…
…pellet.

Claims (1)

(57) [Claims] 1. A mount collet attached to a block of a mounting head which is moved in a plane direction and a vertical direction, and a mount collet having a taper surface at its lower end, and a mount collet which is moved up and down at a central axis position of the mount collet and has a vacuum inside. A tubular pickup tool that is pulled, and a packing that seals between at least the peripheral surface of the pickup tool and the tubular inner surface of the mount collet when the pickup tool is moved upward, The pick-up tool vacuum-adsorbs the pellet at the position where the lower end of the pick-up tool is projected below the taper surface of the mount collet, and when the tool is moved up, the pellet is brought into contact with the taper surface, and the pickup tool is picked up. Vacuum the inside of the mount collet cylinder through the inside of the tool to transfer the pellet to the mount collet. Pellet mounting apparatus characterized by being configured so as to empty adsorption.