JPH06196381A - Holding device of substrate - Google Patents

Holding device of substrate

Info

Publication number
JPH06196381A
JPH06196381A JP35704992A JP35704992A JPH06196381A JP H06196381 A JPH06196381 A JP H06196381A JP 35704992 A JP35704992 A JP 35704992A JP 35704992 A JP35704992 A JP 35704992A JP H06196381 A JPH06196381 A JP H06196381A
Authority
JP
Japan
Prior art keywords
substrate
substrate holding
flatness
holding device
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP35704992A
Other languages
Japanese (ja)
Inventor
Hiroyoshi Kubo
Takeshi Ogata
Sumimasa Yamamoto
博義 久保
全 尾形
純正 山本
Original Assignee
Canon Inc
キヤノン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc, キヤノン株式会社 filed Critical Canon Inc
Priority to JP35704992A priority Critical patent/JPH06196381A/en
Publication of JPH06196381A publication Critical patent/JPH06196381A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To prevent the flatness of a wafer on a wafer chuck from being spoiled by dust particles or the like. CONSTITUTION:A wafer chuck 1 in which a wafer W1 has been sucked to its surface 1a is provided with a plurality of pin-shaped back protrusions 3 on its back 1b, and the top part of each back protrusion 3 comes into contact with a support face 2a on a support plate 2 for an aligner or the like. Even when foreign bodies such as dust particles or the like exist between the wafer chuck 1 and the support plate 2, a fear that the flatness of the wafer W1 is spoiled due to them is reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus used for manufacturing semiconductors, and more particularly to a substrate holding apparatus for a reduction projection type exposure apparatus.

[0002]

2. Description of the Related Art In recent years, as semiconductor elements have been miniaturized and highly integrated, a highly accurate semiconductor exposure apparatus has become necessary.
Recently, a reduction projection type exposure apparatus equipped with a projection lens system having a depth of focus of about 2 μm (hereinafter referred to as “stepper”).
Is the mainstream. A substrate such as a wafer (hereinafter, referred to as “substrate”) exposed by such a highly accurate stepper is adsorbed by a substrate holding plate mounted on a substrate stage such as a 6-axis drive table, and the substrate stage is moved to the substrate stage. By advancing and retracting in the direction along the optical axis of the projection lens system (hereinafter, referred to as “Z direction”), the position is adjusted to the focal position of the projection lens system. The surface of the substrate holder that contacts the substrate has a high flatness, and the flatness of the substrate adsorbed by the surface is corrected.

As described above, the projection lens system has a depth of focus of about 2 μm and requires highly accurate focusing, so that the surface of the substrate is required to have extremely high flatness.
As shown in FIG. 6A, when the foreign matter M 1 is sandwiched between the substrate holding plate 21 and the substrate stage 22, the substrate holding plate 21
Is tilting, or as shown in (b) of the figure, the uplink prime the surface of the substrate W 0 substrate holding plate 21 itself is bent for foreign matter M 2, it is significantly flatness of the substrate W 0 Sonware hand,
Defocus occurs in the fine pattern transferred to this.
Similarly, when a foreign substance is sandwiched between the substrate and the substrate holder, the surface of the substrate rises and the flatness thereof is impaired, resulting in defocusing of the fine pattern. Therefore, a method has been developed in which a plurality of pin-shaped (or ring-shaped) protrusions are provided on the surface of the substrate holding board and the substrate is attracted to the protrusions.

[0004]

However, according to the above-mentioned conventional technique, when the substrate holding plate is placed on the substrate stage, fine foreign matters such as dust are interposed between the substrate holding plate and the substrate stage. Is difficult to prevent, and thus it is difficult to prevent defocusing due to this.

Further, a method of preventing the flatness of the substrate from being impaired by a foreign substance interposed between the substrate and the substrate holding plate by adsorbing the substrate to a plurality of protrusions provided on the substrate holding plate is described below. Since the contact area of the substrate holding board is insufficient, if the substrate has a local swelling S or a dent R as shown in FIG. 6C, the flatness of the substrate is insufficiently corrected. Tend.

The present invention has been made in view of the above-mentioned unsolved problems of the prior art, and provides a substrate holding device in which the flatness of the substrate is less likely to be impaired by the inclusion of foreign matter such as dust. The purpose is to do.

[0007]

In order to achieve the above object, the apparatus of the present invention comprises a substrate holding plate for sucking a substrate,
A substrate holding device comprising a support plate for supporting this,
At least one of the substrate holding plate and the support plate,
It is characterized in that it has a protruding portion on the surface on the side that contacts the other.

Further, there is provided a substrate holding device comprising a substrate holding plate for sucking a substrate and a supporting plate for supporting the substrate holding plate, wherein the substrate holding plate is formed by a projecting portion of a surface on the side for sucking the substrate. A plurality of independent recesses, flatness measuring means for measuring the flatness of the adsorbed substrate, and pressure control means for individually increasing or decreasing the pressure of the air in each recess based on the output of the flatness measuring means. It is characterized by

[0009]

According to the above apparatus, the substrate holding plate and the support plate are
Since the protruding portions of the substrate holding plate come into contact with each other, the contact area between them is reduced. As a result, even if foreign matter such as dust intervenes between the two, the probability that the substrate holding plate will be deformed or tilted can be reduced.

Further, a plurality of independent recesses formed by projecting portions of the surface of the substrate holding plate for sucking the substrate, and flatness measuring means for measuring the flatness of the substrate sucked by the projecting portions, If the pressure control means for individually increasing / decreasing the air pressure in each recess based on the output of the plane measuring means is provided, the position and size of the unevenness of the substrate are measured by the plane measuring means, Since the flatness of the substrate can be corrected by individually increasing / decreasing the air pressure, even if a substrate with a partially uneven flat surface is adsorbed, the flatness of the substrate holding plate cannot be corrected sufficiently. There is no fear of becoming.

[0011]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic cross-sectional view showing an embodiment, in which a wafer chuck 1 which is a substrate holding plate adsorbs a wafer W 1 which is a substrate on a front surface 1a facing upward in the figure, and a back surface 1b on the opposite side. 1B has a pin-shaped rear surface projection 3 which is a plurality of projecting portions, as shown in an upside-down state in FIG. 1B, and a support plate 2 having a 6-axis drive table mechanism (not shown).
Is placed on the support surface 2a facing upward in the figure.

Each back projection 3 has a cylindrical outer shape, and has a diameter of 0.5 mm and a height of 0.3 mm.
The top surface of each back protrusion 3 has a high flatness, and when the wafer chuck 1 is placed on the support plate 2, the top portion of each back protrusion 3 comes into close contact with the support surface 2a of the support plate 2. The wafer chuck 1 is configured to be supported in parallel with the support surface 2a of the support plate 2. The number of backside projections 3 provided on the backside 1b of the wafer chuck 1 and the size of the top surface of each backside projection 3 depend on the wafer chuck 1 and the support plate 2.
The wafer chuck 1 can be supported in parallel with the supporting surface 2a of the supporting plate 2 when mounted on, and the probability that foreign matter such as dust is caught between each back protrusion 3 and the supporting plate 2 is minimized. To be selected. Note that, instead of the pin-shaped back surface projection 3, a ring-shaped back surface projection 13 as shown in FIG. 2 or a grid-shaped projection (not shown) may be used.

Further, instead of providing the back surface protrusion 3 on the back surface 1b of the wafer chuck 1, a protruding portion similar to this may be provided on the support surface 2a of the support plate 2. Further, both the wafer chuck 1 and the support plate 2 may be provided with protruding portions.

As shown in FIG. 3, the surface 1a of the wafer chuck 1 has surface protrusions 4 which are lattice-like protruding portions composed of a plurality of rod-shaped portions 4a orthogonal to each other. The top of 4a has a surface finished to a high degree of flatness and, as shown in an enlarged view in FIG. 4, a long groove 5 which is a suction groove arranged in the center of the width, and the long groove 5 is an internal suction pipe. It is connected to an adsorption exhaust line 5b for generating a vacuum adsorption force via 5a. Further, a plurality of independent recesses 4b formed between the rod-shaped portions 4a of the surface protrusions 4 are controlled by a controller 6 which is a control means via a pair of internal pipes 4c and 4d, respectively, and an air supply / exhaust device 7 is provided. Connected to. The air supply / exhaust device 7 is composed of the same number of supply / exhaust means as the internal pipes 4c, 4d, which are individually connected to them.

The controller 6 individually controls the air supply / exhaust means of the air supply / exhaust device 7 based on the output of the flat surface measuring device 8 which is the flat surface measuring device for measuring the flatness of the wafer W 1 . 8 consists of a photo sensor 8b for receiving a light source 8a for irradiating the surface of the wafer W 1 and the reflected light. A pressure sensor 9 for detecting the pressure of air in the recess 4b is arranged at the bottom of each recess 4b, and each pressure sensor 9 is stored in a storage circuit 10 which is a storage means provided in the controller 6. When connected, the memory circuit 10 stores the relationship between the output of the flat surface measuring device 8 and the output of each pressure sensor 9.

When the wafer W 1 is placed on the wafer chuck 1 and the long groove 5 at the top of the rod-shaped portion 4a of the surface protrusion 4 is exhausted by the suction exhaust line 5b, the wafer W 1 is sucked at the top of each rod-shaped portion 4a. The recesses 4b are sealed by the sucked wafer W 1 . The wafer W 1 has local unevenness, and even if the wafer W 1 is attracted to the top of each rod-shaped portion 4 a of the surface protrusion 4 of the wafer chuck 1, each rod-shaped portion 4
If it is not possible to correct swells, dents, etc. located between a, the position and size of these irregularities should be
Measurement is performed by the flat surface measuring device 8, and the measured value is input to the controller 6 to control the air supply / exhaust device 7, thereby increasing or decreasing the pressure of the air in the recess 4b, thereby correcting the unevenness.

When the unevenness of the wafer W 1 is measured by the flatness measuring device 8, the pressure of the air in each recess 4b is measured by each pressure sensor 9, and the relation between the measured value and the measurement value of the flatness measuring device 8 is measured. Is stored in the memory circuit 10, and thereafter, each time a new wafer is attracted to the wafer chuck 1, the surface roughness of the wafer chuck is measured by the flatness measuring device 8, and the measured value of each pressure sensor 9 is controlled by the controller. By inputting in 6, the flatness of the wafer W 1 can be corrected and the control response time can be shortened as described above.

Further, instead of the lattice-shaped surface protrusions 4 formed by the rod-shaped portions 4a intersecting with each other, as shown in FIG. 5, a plurality of ring-shaped surface protrusions 14a concentric with the central axis of the wafer chuck. May be provided. Similar to the rod-shaped portion 4a of the surface protrusion 4, the top surface of each ring-shaped surface protrusion 14a is finished to have high flatness, and an annular groove 15 serving as a suction groove is provided at the center of the width thereof. A plurality of independent annular recesses 14b are formed between the surface protrusions 14a adjacent to each other, a pressure sensor 19 is disposed in each recess 14b, and a pair of internal pipes 14c, 14c are provided on both sides thereof. 14d are opened and are individually connected to the air supply / exhaust device having a controller (not shown). Since the other points are the same as those of the apparatus in FIG. 3, description thereof is omitted.

According to the present embodiment, the flatness of the wafer is less likely to be impaired by the tilt or deformation of the wafer chuck due to the foreign matter between the wafer and the substrate stage. In addition, the foreign matter between the wafer and the wafer chuck is less likely to impair the flatness of the wafer, and the flatness may be insufficiently corrected by adhering the wafer to the surface of the wafer chuck. Absent.

[0021]

Since the present invention is configured as described above, it has the following effects. (EN) A substrate holding device in which flatness of a substrate is less likely to be impaired by foreign matter such as dust being sandwiched between the substrate holding plate and its support plate or between the substrate holding plate and the substrate.

According to the first aspect of the present invention, the flatness of the substrate is prevented from being impaired by foreign matter such as dust sandwiched between the substrate holding plate and its supporting plate.

In each of the inventions described in claims 3 to 5, the flatness of the substrate is prevented from being impaired by foreign matter such as dust sandwiched between the substrate holding plate and the substrate. Insufficient correction of the flatness of the substrate can be avoided.

As a result, high-precision focusing is easy, and fine pattern transfer and printing without defocusing can be realized.

[Brief description of drawings]

1A and 1B are schematic cross-sectional views showing one embodiment of the present invention, and FIG. 1B is a perspective view showing only a wafer chuck with the vertical direction reversed.

FIG. 2 is a perspective view showing a modified example of the wafer chuck of FIG.

3 is a partially cutaway perspective view showing the wafer chuck of FIG. 1. FIG.

FIG. 4 is an explanatory diagram for enlarging and explaining a portion surrounded by a circle A of the apparatus of FIG.

5 is a partially cutaway perspective view showing a modified example of the surface protrusions of the wafer chuck of FIG.

6A and 6B are diagrams for explaining a conventional example, in which FIG. 6A shows a state in which a foreign substance is sandwiched between a substrate holding plate and a substrate stage to incline the substrate holding plate, and FIG. FIG. 6C is an explanatory diagram showing a deformed state, and FIG. 7C is a diagram showing a case where the flatness is insufficiently corrected due to local unevenness of the substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wafer chuck 2 Support plate 3,13 Backside protrusion 4,14a Surface protrusion 4a Rod-shaped portions 4b, 14b Recesses 4c, 4d, 14c, 14d Internal piping 5 Long groove 6 Controller 8 Planar measuring device 9, 19 Pressure sensor 10 Memory circuit 15 Annular groove

Claims (5)

[Claims]
1. A substrate holding device comprising a substrate holding plate for sucking a substrate and a supporting plate for supporting the substrate, wherein at least one of the substrate holding plate and the supporting plate is in contact with the other. A substrate holding device having a protrusion on the surface of the substrate.
2. The substrate holding device according to claim 1, wherein the protruding portion is a plurality of pin-shaped or ring-shaped projections.
3. A substrate holding device comprising a substrate holding plate for sucking a substrate and a supporting plate for supporting the substrate holding plate, wherein the substrate holding plate is formed by a protruding portion of a surface on the side for sucking the substrate. A plurality of independent recesses, a flatness measuring means for measuring the flatness of the substrate adsorbed to the protruding portion, and a pressure for individually increasing or decreasing the pressure of the air in the recesses based on the output of the flatness measuring means. A substrate holding device having a control means.
4. The substrate according to claim 3, wherein the pressure control means has an air supply / exhaust means individually connected to the plurality of recesses by an internal pipe, and a control means for individually controlling these. Holding device.
5. A pressure sensor is arranged in each recess, and the pressure control means has a storage means for storing the relationship between the output of each pressure sensor and the output value of the plane measuring means. 4. The substrate holding device according to item 4.
JP35704992A 1992-12-22 1992-12-22 Holding device of substrate Pending JPH06196381A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP35704992A JPH06196381A (en) 1992-12-22 1992-12-22 Holding device of substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35704992A JPH06196381A (en) 1992-12-22 1992-12-22 Holding device of substrate

Publications (1)

Publication Number Publication Date
JPH06196381A true JPH06196381A (en) 1994-07-15

Family

ID=18452123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP35704992A Pending JPH06196381A (en) 1992-12-22 1992-12-22 Holding device of substrate

Country Status (1)

Country Link
JP (1) JPH06196381A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001326270A (en) * 2000-03-10 2001-11-22 Canon Inc Substrate holder, semiconductor manufacturing apparatus and method of manufacturing semiconductor device
US7557905B2 (en) 2005-04-14 2009-07-07 Samsung Electronics Co., Ltd. Wafer loading apparatus
JP2009302149A (en) * 2008-06-10 2009-12-24 Nikon Corp Exposure device, and device manufacturing method
JP2012242725A (en) * 2011-05-23 2012-12-10 Konica Minolta Advanced Layers Inc Method for manufacturing lens unit
JP2013126302A (en) * 2011-12-14 2013-06-24 Nissan Motor Co Ltd Apparatus and method of manufacturing magnet body for field pole
CN103943488A (en) * 2013-01-21 2014-07-23 株式会社迪思科 Method for processing wafer
JP2017515148A (en) * 2014-05-06 2017-06-08 エーエスエムエル ネザーランズ ビー.ブイ. Substrate support, method for mounting a substrate on a substrate support location, lithographic apparatus, and device manufacturing method
JP2017212343A (en) * 2016-05-25 2017-11-30 日本特殊陶業株式会社 Substrate holding apparatus
CN108398857A (en) * 2017-02-06 2018-08-14 佳能株式会社 The manufacturing method of lithographic equipment and article

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001326270A (en) * 2000-03-10 2001-11-22 Canon Inc Substrate holder, semiconductor manufacturing apparatus and method of manufacturing semiconductor device
JP4700819B2 (en) * 2000-03-10 2011-06-15 キヤノン株式会社 Substrate holding apparatus, semiconductor manufacturing apparatus, and semiconductor device manufacturing method
US7557905B2 (en) 2005-04-14 2009-07-07 Samsung Electronics Co., Ltd. Wafer loading apparatus
JP2009302149A (en) * 2008-06-10 2009-12-24 Nikon Corp Exposure device, and device manufacturing method
JP2012242725A (en) * 2011-05-23 2012-12-10 Konica Minolta Advanced Layers Inc Method for manufacturing lens unit
JP2013126302A (en) * 2011-12-14 2013-06-24 Nissan Motor Co Ltd Apparatus and method of manufacturing magnet body for field pole
CN103943488A (en) * 2013-01-21 2014-07-23 株式会社迪思科 Method for processing wafer
JP2017515148A (en) * 2014-05-06 2017-06-08 エーエスエムエル ネザーランズ ビー.ブイ. Substrate support, method for mounting a substrate on a substrate support location, lithographic apparatus, and device manufacturing method
JP2017212343A (en) * 2016-05-25 2017-11-30 日本特殊陶業株式会社 Substrate holding apparatus
CN108398857A (en) * 2017-02-06 2018-08-14 佳能株式会社 The manufacturing method of lithographic equipment and article

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