CN216528817U - Vacuum chuck suitable for various wafer sizes - Google Patents
Vacuum chuck suitable for various wafer sizes Download PDFInfo
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- CN216528817U CN216528817U CN202122858173.5U CN202122858173U CN216528817U CN 216528817 U CN216528817 U CN 216528817U CN 202122858173 U CN202122858173 U CN 202122858173U CN 216528817 U CN216528817 U CN 216528817U
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- vacuum chuck
- annular boss
- inner annular
- positioning holes
- wafer sizes
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Abstract
The utility model provides a vacuum chuck suitable for various wafer sizes, which comprises a vacuum chuck made of alumina ceramics, wherein the bottom of the vacuum chuck is provided with an inner annular boss, an outer annular boss and a vacuumizing air hole arranged in the center of the inner annular boss, supporting columns and positioning holes arranged around the vacuumizing air hole are uniformly distributed in the inner annular boss, the opening parts of the positioning holes are respectively provided with an annular platform, and the positioning holes are distributed between the inner annular boss and the outer annular boss in a surrounding manner.
Description
Technical Field
The utility model relates to the field of wafer grabbing equipment, in particular to a vacuum chuck suitable for various wafer sizes.
Background
The main structure of the existing vacuum chuck is shown in fig. 1, a middle hole is a vacuumizing air channel, a wafer is adsorbed on the chuck due to negative pressure, and small convex points on the chuck play a supporting role to prevent the wafer from deforming under the negative pressure. Each different wafer size requires a separate custom-made ceramic chuck of the corresponding size. The ceramic sucker with the structure of the supporting column has high processing cost, large defective rate and long construction period, and the production cost is increased by customizing the size of each single wafer.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problems, an object of the present invention is to provide a vacuum chuck suitable for various wafer sizes, which can reliably grip wafers of various sizes.
The technical scheme adopted by the utility model for solving the technical problems is as follows:
this vacuum chuck suitable for multiple wafer size includes the vacuum chuck who is made by the alumina ceramics, vacuum chuck's bottom is provided with interior annular boss, outer annular boss and sets up the evacuation gas pocket at its center, the equipartition has the support column and encircles in the interior annular boss the locating hole that the evacuation gas pocket set up, the oral area of locating hole all is provided with annular platform, ring cloth between interior annular boss and the outer annular boss the locating hole, vacuum chuck's top is provided with fixed slot.
Preferably, the flatness error between the inner annular boss, the outer annular boss, the annular land and the support post is less than 5 μm.
The utility model has the advantages that:
the utility model can cover the clamping of wafers with various sizes, and the vacuum chuck with one size can be processed by adopting the design of the utility model to cope with the working conditions of all wafer sizes, thereby greatly reducing the cost and the construction period required by customizing various chucks.
Compared with the existing vacuum chuck, the outer ring part between the inner ring-shaped boss and the outer ring-shaped boss is added, the platform of the positioning hole opening part in the outer ring part can play a role of supporting the outer ring wafer part, and because the negative pressure is limited to the inner ring part only, the outer ring part does not need a large number of supporting columns to ensure that the wafer cannot deform under the negative pressure.
Drawings
Fig. 1 is a schematic diagram of a vacuum chuck suitable for single gauge wafer size.
FIG. 2 is a schematic view of the bottom of the vacuum chuck for various wafer sizes.
Fig. 3 is an enlarged partial view of the embodiment of fig. 2 of the present vacuum chuck for various wafer sizes.
Fig. 4 is a top view of the vacuum chuck for various wafer sizes.
Detailed Description
The utility model is further illustrated with reference to the following figures and examples:
in this embodiment, referring to fig. 2, fig. 3 and fig. 4, the vacuum chuck suitable for various wafer sizes includes a vacuum chuck 10 made of alumina ceramic, an inner annular boss 120, an outer annular boss 130 and a vacuum hole 200 formed in the center of the inner annular boss 120 are disposed at the bottom of the vacuum chuck 10, support pillars 110 and positioning holes 100 surrounding the vacuum hole 200 are uniformly distributed in the inner annular boss 120, annular platforms are disposed at the mouths of the positioning holes 100, the positioning holes 100 are circumferentially distributed between the inner annular boss 120 and the outer annular boss 130, and a fixing slot 300 is disposed at the top of the vacuum chuck 10.
The flatness error between the inner annular boss 120, the outer annular boss 130, the annular land and the support post 110 is less than 5 μm.
The utility model is not to be considered as limited to the particular embodiments shown, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (2)
1. A vacuum chuck suitable for various wafer sizes is characterized in that: the vacuum chuck comprises a vacuum chuck (10) made of alumina ceramic, wherein an inner annular boss (120), an outer annular boss (130) and a vacuumizing air hole (200) formed in the center of the vacuum chuck (10) are formed in the bottom of the vacuum chuck (10), supporting columns (110) and surrounding positioning holes (100) formed in the vacuumizing air hole (200) are uniformly distributed in the inner annular boss (120), annular platforms are arranged at the opening parts of the positioning holes (100), the inner annular boss (120) and the outer annular boss (130) are distributed in an annular mode in the positioning holes (100), and a fixing clamping groove (300) is formed in the top of the vacuum chuck (10).
2. The vacuum chuck as claimed in claim 1, wherein: the flatness errors among the inner annular boss (120), the outer annular boss (130), the annular platform and the support column (110) are less than 5 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122858173.5U CN216528817U (en) | 2021-11-22 | 2021-11-22 | Vacuum chuck suitable for various wafer sizes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122858173.5U CN216528817U (en) | 2021-11-22 | 2021-11-22 | Vacuum chuck suitable for various wafer sizes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216528817U true CN216528817U (en) | 2022-05-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122858173.5U Active CN216528817U (en) | 2021-11-22 | 2021-11-22 | Vacuum chuck suitable for various wafer sizes |
Country Status (1)
| Country | Link |
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| CN (1) | CN216528817U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115295474A (en) * | 2022-08-10 | 2022-11-04 | 苏州天准科技股份有限公司 | Wafer supporting device |
-
2021
- 2021-11-22 CN CN202122858173.5U patent/CN216528817U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115295474A (en) * | 2022-08-10 | 2022-11-04 | 苏州天准科技股份有限公司 | Wafer supporting device |
| CN115295474B (en) * | 2022-08-10 | 2023-11-21 | 苏州天准科技股份有限公司 | Wafer supporting device |
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