CN111498492A - Automatic semiconductor substrate feeding device and method - Google Patents
Automatic semiconductor substrate feeding device and method Download PDFInfo
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- CN111498492A CN111498492A CN202010369126.1A CN202010369126A CN111498492A CN 111498492 A CN111498492 A CN 111498492A CN 202010369126 A CN202010369126 A CN 202010369126A CN 111498492 A CN111498492 A CN 111498492A
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- 239000000758 substrate Substances 0.000 title claims abstract description 87
- 239000004065 semiconductor Substances 0.000 title claims abstract description 86
- 238000000034 method Methods 0.000 title abstract description 7
- 238000011068 loading method Methods 0.000 claims abstract description 17
- 238000001179 sorption measurement Methods 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims description 29
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/914—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems incorporating rotary and rectilinear movements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G59/00—De-stacking of articles
- B65G59/02—De-stacking from the top of the stack
- B65G59/04—De-stacking from the top of the stack by suction or magnetic devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
When the automatic semiconductor substrate feeding device is used, a plurality of layers of semiconductor substrates are manually placed in the limiting grooves, the plurality of layers of semiconductor substrates are limited through the baffle plate, then the first hydraulic cylinder is driven, the plurality of layers of semiconductor substrates can be horizontally moved, the movement is stable, the semiconductor substrates cannot slide off in the moving process, and the risk of damage is reduced; the second hydraulic cylinder is driven to drive the semiconductor substrate at the bottommost end upwards, the adsorption mechanism can be moved to the right upper end of the semiconductor substrate through the driving mechanism, the vacuum suction cup of the vacuum pump is opened to adsorb the semiconductor substrate, the servo motor is driven, the vacuum suction cup transfers the semiconductor substrate, loading is further achieved, and automatic operation is achieved; meanwhile, the semiconductor substrate can rotate by driving the servo motor, the loading position can be adjusted according to field processing equipment, and the application range is wide.
Description
Technical Field
The invention relates to the field of loading of semiconductor processing, in particular to an automatic loading device and an automatic loading method for a semiconductor substrate.
Background
The substrate material is a basic material for manufacturing semiconductor elements and printed circuit boards, such as silicon, gallium arsenide, silicon epitaxial needle garnet and the like used in the semiconductor industry. The high-purity alumina is used as main raw material, and is made up through high-pressure shaping, high-temp. firing, cutting and polishing, and the ceramic substrate is the basic material for making thick-film and thin-film circuits. A copper clad laminate (hereinafter referred to as a "clad laminate") is a substrate material for manufacturing a printed circuit board, and serves to support various components and to realize electrical connection or electrical insulation therebetween.
In the process of processing the semiconductor substrate, the semiconductor substrate needs to be fed, a feeding device used in the conventional semiconductor substrate processing generally rotates through a conveyor belt, the semiconductor substrate is easily rubbed when the conveyor belt rotates, the semiconductor substrate is easily damaged, and the safety of the semiconductor substrate cannot be well ensured. Meanwhile, the motion track of the conveyor belt is limited, and the substrate is easy to slide off and damage during conveying.
Disclosure of Invention
In order to solve the defects mentioned in the background art, the invention aims to provide an automatic semiconductor substrate feeding device and a feeding method thereof, wherein the automatic semiconductor substrate feeding device is provided with a first hydraulic cylinder and a linear guide rail, when the automatic semiconductor substrate feeding device is used, a multilayer semiconductor substrate is manually placed in a limiting groove, the multilayer semiconductor substrate is limited by a baffle, and then the first hydraulic cylinder is driven, so that the multilayer semiconductor substrate can be horizontally moved, the movement is stable, the semiconductor substrate cannot slide off in the moving process, and the risk of damage is reduced;
the automatic feeding device is provided with the driving mechanism and the second hydraulic cylinder, the second hydraulic cylinder is driven to drive the semiconductor substrate at the bottommost end upwards, the adsorption mechanism can be moved to the right upper end of the semiconductor substrate through the driving mechanism, the vacuum chuck of the vacuum pump is opened to adsorb the semiconductor substrate, the servo motor is driven, the vacuum chuck transfers the semiconductor substrate, feeding is further achieved, and automatic operation is achieved;
meanwhile, the device designed by the invention can drive the semiconductor substrate to horizontally and vertically move, the semiconductor substrate can rotate by driving the servo motor, the loading position can be adjusted according to field processing equipment, and the application range is wide.
The purpose of the invention can be realized by the following technical scheme:
the utility model provides an automatic loading attachment of semiconductor substrate, includes first workstation and second workstation, the bottom of first workstation and second workstation all is fixed with the support column, the top of first workstation is provided with the limiting plate, and the bottom of limiting plate is provided with the bracing piece, and the bracing piece is fixed on first workstation, and the central point of limiting plate puts to open and has dodge the groove.
The upper end of first workstation is provided with puts the flitch, puts the flitch and is located between first workstation and limiting plate, and the bottom mounting who puts the flitch has a plurality of backup pads, and the bottom of backup pad all fixes the supporting shoe, supporting shoe and slider fixed connection, and the slider slides and sets up on linear guide.
The bottom mounting of first workstation has the second pneumatic cylinder, and the upper end of second pneumatic cylinder is provided with the connecting plate of fixing in first workstation upper end, and the second hydraulic stem top on the second pneumatic cylinder is fixed with the lifter plate, and the lifter plate setting is in the below of putting the flitch.
The upper end of the material placing plate is provided with a plurality of limiting grooves distributed in an array mode, the limiting grooves and the avoiding grooves are identical in structure, a plurality of layers of semiconductor substrates are arranged in the limiting grooves, the height of each layer of semiconductor substrate is smaller than the distance between the material placing plate and the limiting plate, and through holes are formed in the center positions of the limiting grooves.
The upper end of the second workbench is provided with a driving mechanism, the driving mechanism comprises a motor shell fixed on the second workbench, a base is arranged above the motor shell, and the base is connected with the output end of a servo motor arranged in the motor shell.
A first connecting rod is fixed in the middle of the upper end of the base, the top end of the first connecting rod is rotatably connected with a second connecting rod, the top end of the second connecting rod is rotatably connected with a third connecting rod, and the top end of the third connecting rod is rotatably connected with a fourth connecting rod.
The side of actuating mechanism is provided with adsorption apparatus, and adsorption apparatus includes vacuum chuck, and vacuum chuck's upper end is provided with first breather pipe, and the upper end of first breather pipe is provided with the second breather pipe, and first breather pipe and second breather pipe are all fixed in the connecting hole, second breather pipe and vacuum pump connection.
Further, linear guide is provided with two, and linear guide all fixes the upper end at first workstation.
Furthermore, a first hydraulic cylinder is arranged between the two linear guide rails, a connecting block is fixed at the end part of a first hydraulic rod on the first hydraulic cylinder, and the connecting block is fixedly connected with the bottom of the material placing plate.
Furthermore, the outer side ends of four sides of the limiting groove are provided with positioning holes distributed in an array mode, positioning pins are arranged in the positioning holes and penetrate through the positioning plate, the positioning plate is arranged at the upper end portion of the material placing plate, and the side ends of the positioning plate are provided with baffle plates.
Furthermore, a first connecting piece and a second connecting piece are fixed at the upper end of the base respectively, the first connecting piece and the second connecting piece are arranged on two sides of the first connecting rod respectively, a third connecting piece is arranged at the bottom end of the second connecting rod, and a fourth connecting piece and a fifth connecting piece which are arranged in parallel are arranged at the side end of the second connecting rod respectively.
Furthermore, both sides end of the third connecting rod is provided with a sixth connecting piece and a seventh connecting piece respectively, one end of the fourth connecting rod is provided with an eighth connecting piece, the bottom end of the eighth connecting piece is fixed with a connecting block, and the upper end of the connecting block is provided with a through connecting hole.
Furthermore, a first air cylinder is rotatably connected between the first connecting piece and the third connecting piece, a second air cylinder is rotatably connected between the second connecting piece and the fourth connecting piece, a third air cylinder is rotatably connected between the fifth connecting piece and the sixth connecting piece, and a fourth air cylinder is rotatably connected between the seventh connecting piece and the eighth connecting piece.
A loading method of an automatic semiconductor substrate loading device comprises the following steps:
manually placing the multilayer semiconductor substrate in a limiting groove, wherein the semiconductor substrate is arranged in the limiting groove, then adjusting different positioning holes to be matched with positioning pins, adjusting the distance between baffles, and limiting the multilayer semiconductor substrate;
driving a first hydraulic cylinder, wherein a first hydraulic rod on the first hydraulic cylinder drives a material placing plate to horizontally move in the direction of the linear guide rail until the lifting plate and the through hole are coaxially arranged, and at the moment, the limiting groove is positioned under the avoiding groove;
driving a second hydraulic cylinder, wherein a lifting plate is fixed at the top of a second hydraulic rod on the second hydraulic cylinder, the lifting plate penetrates through the through hole to jack upwards, the lifting plate is contacted with the semiconductor substrate at the bottommost end and continues to be driven upwards, and the semiconductor substrate at the topmost end penetrates through the avoidance groove;
driving a servo motor to drive the base to rotate, so that the adsorption mechanism is positioned right above the limiting plate;
fifthly, driving the first cylinder, the second cylinder, the third cylinder and the fourth cylinder, and enabling the second connecting rod, the third connecting rod and the fourth connecting rod to rotate to enable the bottom end of the adsorption mechanism to be in contact with the uppermost semiconductor substrate;
and sixthly, opening a vacuum pump connected with the second vent pipe, adsorbing the semiconductor substrate by using the vacuum chuck, driving the servo motor, and transferring the semiconductor substrate by using the vacuum chuck so as to realize feeding.
The invention has the beneficial effects that:
1. the multi-layer semiconductor substrate horizontal moving device is provided with the first hydraulic cylinder and the linear guide rail, when the multi-layer semiconductor substrate horizontal moving device is used, a plurality of layers of semiconductor substrates are manually placed in the limiting groove, the plurality of layers of semiconductor substrates are limited through the baffle, then the first hydraulic cylinder is driven, the multi-layer semiconductor substrates can be horizontally moved, the movement is stable, the semiconductor substrates cannot slide off in the moving process, and the risk of damage is reduced;
2. the automatic feeding device is provided with the driving mechanism and the second hydraulic cylinder, the second hydraulic cylinder is driven to drive the semiconductor substrate at the bottommost end upwards, the adsorption mechanism can be moved to the right upper end of the semiconductor substrate through the driving mechanism, the vacuum chuck of the vacuum pump is opened to adsorb the semiconductor substrate, the servo motor is driven, the vacuum chuck transfers the semiconductor substrate, feeding is further achieved, and automatic operation is achieved;
3. the device designed by the invention can drive the semiconductor substrate to horizontally and vertically move, the semiconductor substrate can rotate by driving the servo motor, the loading position can be adjusted according to field processing equipment, and the application range is wide.
Drawings
The invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the upper end structure of the first worktable according to the present invention;
FIG. 3 is a schematic view of the upper end structure of the first worktable of the present invention;
FIG. 4 is a schematic view of a material placing plate structure according to the present invention;
FIG. 5 is a schematic view of a connection structure of the positioning plate of the present invention;
FIG. 6 is a schematic view of the drive mechanism of the present invention;
FIG. 7 is a schematic view of the adsorption mechanism of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "opening," "upper," "lower," "thickness," "top," "middle," "length," "inner," "peripheral," and the like are used in an orientation or positional relationship that is merely for convenience in describing and simplifying the description, and do not indicate or imply that the referenced component or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present invention.
An automatic semiconductor substrate feeding device is shown in fig. 1 and comprises a first workbench 1 and a second workbench 2, wherein supporting columns 11 are fixed at the bottom ends of the first workbench 1 and the second workbench 2. The top of first workstation 1 is provided with limiting plate 12, and the bottom of limiting plate 12 is provided with bracing piece 121, and bracing piece 121 fixes on first workstation 1, and the central point of limiting plate 12 puts and opens and dodge groove 122.
As shown in fig. 1 and 2, a material placing plate 3 is disposed at an upper end of the first working table 1, and the material placing plate 3 is located between the first working table 1 and the limiting plate 12. Put flitch 3's bottom mounting and have a plurality of backup pads 31, backup pad 31's bottom all fixes supporting shoe 311, supporting shoe 311 and slider 32 fixed connection, and slider 32 slides and sets up on linear guide 321, and linear guide 321 is provided with two, and linear guide 321 all fixes the upper end at first workstation 1.
A first hydraulic cylinder 33 is arranged between the two linear guide rails 321, a connecting block 331 is fixed at the end of a first hydraulic rod on the first hydraulic cylinder 33, the connecting block 331 is fixedly connected with the bottom of the material placing plate 3, and the material placing plate 3 can horizontally move in the direction of the linear guide rails 321 by driving the first hydraulic cylinder 33.
As shown in fig. 1 and 3, a second hydraulic cylinder 4 is fixed at the bottom end of the first workbench 1, a connecting plate 41 fixed at the upper end of the first workbench 1 is arranged at the upper end of the second hydraulic cylinder 4, a lifting plate 42 is fixed at the top of the second hydraulic cylinder 4, and the lifting plate 42 is arranged below the material placing plate 3.
As shown in fig. 1 and 4, the upper end of the material placing plate 3 is provided with a plurality of limiting grooves 34 distributed in an array, the structure of the limiting grooves 34 is the same as that of the avoiding grooves 122, a plurality of layers of semiconductor substrates 37 are arranged in the limiting grooves 34, the height of the plurality of layers of semiconductor substrates 37 is smaller than the distance between the material placing plate 3 and the limiting plate 12, and the limiting grooves 34 serve the purpose of limiting. Through holes 35 are formed in the center positions of the limiting grooves 34, and when the lifting plate is used, the through holes 35 and the lifting plate 42 are concentrically distributed. The locating hole 36 that the array distributes is all opened to the four sides outside end of spacing groove 34, as shown in fig. 5, is provided with locating pin 381 in the locating hole 36, and locating pin 381 runs through locating plate 38, and locating plate 38 sets up the upper end at putting flitch 3, and the side of locating plate 38 is provided with baffle 39, cooperatees through adjusting different locating hole 36 and locating pin 381, can adjust the distance between baffle 39, is convenient for carry on spacingly to the base plate of different specifications.
As shown in fig. 1 and 6, a driving mechanism 5 is disposed at the upper end of the second worktable 2, the driving mechanism 5 includes a motor housing 51 fixed on the second worktable 2, a base 52 is disposed above the motor housing 51, the base 52 is connected with a servo motor output end disposed inside the motor housing 51, and the driving servo motor can drive the base 52 to rotate.
A first connecting rod 521 is fixed at the middle position of the upper end of the base 52, a second connecting rod 53 is rotatably connected to the top end of the first connecting rod 521, a third connecting rod 54 is rotatably connected to the top end of the second connecting rod 53, and a fourth connecting rod 55 is rotatably connected to the top end of the third connecting rod 54.
The upper end of the base 52 is fixed with a first connecting piece 522 and a second connecting piece 523 respectively, and the first connecting piece 522 and the second connecting piece 523 are arranged at two sides of the first link 521 respectively. The bottom end of the second link 53 is provided with a third connector 531, the side ends of the second link 53 are respectively provided with a fourth connector 532 and a fifth connector 533 which are arranged in parallel, the two side ends of the third link 54 are respectively provided with a sixth connector 541 and a seventh connector 542, one end of the fourth link 55 is provided with an eighth connector 551, the bottom end of the eighth connector 551 is fixed with a connecting block 552, and the upper end of the connecting block 552 is provided with a through connecting hole 553.
A first cylinder 56 is rotatably connected between the first connector 522 and the third connector 531, a second cylinder 57 is rotatably connected between the second connector 523 and the fourth connector 532, a third cylinder 58 is rotatably connected between the fifth connector 533 and the sixth connector 541, and a fourth cylinder 59 is rotatably connected between the seventh connector 542 and the eighth connector 551.
The first cylinder 56 and the second cylinder 57 are driven, and the second connecting rod 53 can rotate; the third air cylinder 58 is driven, and the third connecting rod 54 can rotate; the fourth cylinder 59 is driven, and the fourth link 55 is rotated.
As shown in fig. 6 and 7, the suction mechanism 6 is disposed on a side of the driving mechanism 5, the suction mechanism 6 includes a vacuum chuck 60, a first vent pipe 61 is disposed at an upper end of the vacuum chuck 60, a second vent pipe 62 is disposed at an upper end of the first vent pipe 61, the first vent pipe 61 and the second vent pipe 62 are both fixed in the connection hole 553, and the second vent pipe 62 is connected to the vacuum pump.
A loading method of an automatic semiconductor substrate loading device comprises the following steps:
manually placing the multilayer semiconductor substrate 37 in the limiting groove 34, wherein the semiconductor substrate 37 is arranged in the limiting groove 34, adjusting different positioning holes 36 to be matched with positioning pins 381, adjusting the distance between the baffles 39, and limiting the multilayer semiconductor substrate 37;
driving a first hydraulic cylinder 33, wherein a first hydraulic rod on the first hydraulic cylinder 33 drives a material placing plate 3 to horizontally move in the direction of a linear guide rail 321 until a lifting plate 42 and a through hole 35 are coaxially arranged, and at the moment, a limiting groove 34 is positioned under an avoiding groove 122;
driving a second hydraulic cylinder 4, wherein a lifting plate 42 is fixed at the top of the second hydraulic cylinder 4, the lifting plate 42 penetrates through the through hole 35 to jack up upwards, the lifting plate 42 is in contact with the semiconductor substrate 37 at the bottom and continues to be driven upwards, and the semiconductor substrate 37 at the top penetrates through the avoiding groove 122;
driving a servo motor to drive the base 52 to rotate, so that the adsorption mechanism 6 is positioned right above the limiting plate 12;
fifthly, driving the first cylinder 56, the second cylinder 57, the third cylinder 58 and the fourth cylinder 59, and enabling the second connecting rod 53, the third connecting rod 54 and the fourth connecting rod 55 to rotate so as to enable the bottom end of the adsorption mechanism 6 to be in contact with the uppermost semiconductor substrate 37;
sixthly, a vacuum pump connected with the second vent pipe 62 is turned on, the vacuum chuck 60 adsorbs the semiconductor substrate 37, the servo motor is driven, and the vacuum chuck 60 transfers the semiconductor substrate 37, so that feeding is realized.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.
Claims (8)
1. The automatic semiconductor substrate feeding device comprises a first workbench (1) and a second workbench (2), wherein supporting columns (11) are fixed at the bottom ends of the first workbench (1) and the second workbench (2), and is characterized in that a limiting plate (12) is arranged above the first workbench (1), a supporting rod (121) is arranged at the bottom end of the limiting plate (12), the supporting rod (121) is fixed on the first workbench (1), and an avoiding groove (122) is formed in the center position of the limiting plate (12);
the upper end of the first workbench (1) is provided with a material placing plate (3), the material placing plate (3) is located between the first workbench (1) and the limiting plate (12), the bottom end of the material placing plate (3) is fixedly provided with a plurality of supporting plates (31), the bottom ends of the supporting plates (31) are respectively fixedly provided with a supporting block (311), the supporting blocks (311) are fixedly connected with the sliding block (32), and the sliding block (32) is arranged on the linear guide rail (321) in a sliding manner;
a second hydraulic cylinder (4) is fixed at the bottom end of the first workbench (1), a connecting plate (41) fixed at the upper end of the first workbench (1) is arranged at the upper end of the second hydraulic cylinder (4), a lifting plate (42) is fixed at the top of a second hydraulic rod on the second hydraulic cylinder (4), and the lifting plate (42) is arranged below the material placing plate (3);
the upper end of the material placing plate (3) is provided with a plurality of limiting grooves (34) distributed in an array manner, the structures of the limiting grooves (34) and the avoiding grooves (122) are the same, a plurality of layers of semiconductor substrates (37) are arranged in the limiting grooves (34), the height of each layer of semiconductor substrate (37) is smaller than the distance between the material placing plate (3) and the limiting plate (12), and through holes (35) are formed in the center positions of the limiting grooves (34);
the upper end of the second workbench (2) is provided with a driving mechanism (5), the driving mechanism (5) comprises a motor shell (51) fixed on the second workbench (2), a base (52) is arranged above the motor shell (51), and the base (52) is connected with the output end of a servo motor arranged in the motor shell (51);
a first connecting rod (521) is fixed in the middle of the upper end of the base (52), the top end of the first connecting rod (521) is rotatably connected with a second connecting rod (53), the top end of the second connecting rod (53) is rotatably connected with a third connecting rod (54), and the top end of the third connecting rod (54) is rotatably connected with a fourth connecting rod (55);
the side of actuating mechanism (5) is provided with adsorption device (6), and adsorption device (6) includes vacuum chuck (60), and the upper end of vacuum chuck (60) is provided with first breather pipe (61), and the upper end of first breather pipe (61) is provided with second breather pipe (62), and first breather pipe (61) and second breather pipe (62) are all fixed in connecting hole (553), and second breather pipe (62) and vacuum pump connection.
2. The automatic loading device for the semiconductor substrates as claimed in claim 1, wherein there are two linear guides (321), and the linear guides (321) are fixed on the upper end of the first worktable (1).
3. The automatic loading device for the semiconductor substrates as claimed in claim 2, wherein a first hydraulic cylinder (33) is disposed between the two linear guide rails (321), a connection block (331) is fixed at an end of a first hydraulic rod of the first hydraulic cylinder (33), and the connection block (331) is fixedly connected with the bottom of the material placing plate (3).
4. The automatic loading device for the semiconductor substrate according to claim 1, wherein the outer ends of four sides of the limiting groove (34) are respectively provided with a positioning hole (36) distributed in an array, a positioning pin (381) is arranged in the positioning hole (36), the positioning pin (381) penetrates through the positioning plate (38), the positioning plate (38) is arranged at the upper end of the material placing plate (3), and a baffle plate (39) is arranged at the side end of the positioning plate (38).
5. The automatic feeding device of claim 1, wherein the base (52) has a first connecting member (522) and a second connecting member (523) respectively fixed to the upper end thereof, the first connecting member (522) and the second connecting member (523) are respectively disposed at two sides of the first connecting rod (521), the bottom end of the second connecting rod (53) is provided with a third connecting member (531), and the side end of the second connecting rod (53) is provided with a fourth connecting member (532) and a fifth connecting member (533) which are disposed in parallel.
6. The automatic feeding device of claim 5, wherein both side ends of the third link (54) are respectively provided with a sixth connecting member (541) and a seventh connecting member (542), one end of the fourth link (55) is provided with an eighth connecting member (551), the bottom end of the eighth connecting member (551) is fixed with a connecting block (552), and the upper end of the connecting block (552) is provided with a through connecting hole (553).
7. The automatic feeding device of claim 6, wherein a first air cylinder (56) is rotatably connected between the first connector (522) and the third connector (531), a second air cylinder (57) is rotatably connected between the second connector (523) and the fourth connector (532), a third air cylinder (58) is rotatably connected between the fifth connector (533) and the sixth connector (541), and a fourth air cylinder (59) is rotatably connected between the seventh connector (542) and the eighth connector (551).
8. A loading method of an automatic semiconductor substrate loading device is characterized by comprising the following steps:
manually placing the multilayer semiconductor substrate (37) in a limiting groove (34), arranging the semiconductor substrates (37) in the limiting groove (34), then adjusting different positioning holes (36) to be matched with positioning pins (381), adjusting the distance between baffles (39) and limiting the multilayer semiconductor substrate (37);
driving a first hydraulic cylinder (33), wherein a first hydraulic rod on the first hydraulic cylinder (33) drives a material placing plate (3) to horizontally move in the direction of a linear guide rail (321) until a lifting plate (42) and a through hole (35) are coaxially arranged, and at the moment, a limiting groove (34) is positioned under an avoiding groove (122);
driving a second hydraulic cylinder (4), wherein a lifting plate (42) is fixed at the top of a second hydraulic rod on the second hydraulic cylinder (4), the lifting plate (42) penetrates through the through hole (35) to be lifted upwards, the lifting plate (42) is contacted with the semiconductor substrate (37) at the bottommost end and is driven upwards continuously, and the semiconductor substrate (37) at the topmost end penetrates through the avoiding groove (122);
driving a servo motor to drive a base (52) to rotate, so that the adsorption mechanism (6) is positioned right above the limiting plate (12);
fifthly, driving a first cylinder (56), a second cylinder (57), a third cylinder (58) and a fourth cylinder (59), and enabling a second connecting rod (53), a third connecting rod (54) and a fourth connecting rod (55) to rotate so as to enable the bottom end of the adsorption mechanism (6) to be in contact with the semiconductor substrate (37) at the uppermost end;
and sixthly, opening a vacuum pump connected with the second vent pipe (62), adsorbing the semiconductor substrate (37) by the vacuum sucker (60), driving a servo motor, and transferring the semiconductor substrate (37) by the vacuum sucker (60) so as to realize feeding.
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CN202010369126.1A CN111498492A (en) | 2020-05-03 | 2020-05-03 | Automatic semiconductor substrate feeding device and method |
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CN202010369126.1A CN111498492A (en) | 2020-05-03 | 2020-05-03 | Automatic semiconductor substrate feeding device and method |
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CN112061759A (en) * | 2020-09-23 | 2020-12-11 | 深圳市三联盛科技股份有限公司 | Diode packaging feeding device |
CN112193827A (en) * | 2020-10-21 | 2021-01-08 | 深圳长城开发精密技术有限公司 | Automatic hard disk substrate placing machine |
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CN112794089A (en) * | 2020-12-30 | 2021-05-14 | 苏州富强科技有限公司 | Loading and unloading device with dual purposes of loading and tray recovery |
CN112794087A (en) * | 2020-12-30 | 2021-05-14 | 苏州富强科技有限公司 | Unloader on binary channels |
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