CN113394156A - Wafer transmission device and vacuum adsorption manipulator thereof - Google Patents
Wafer transmission device and vacuum adsorption manipulator thereof Download PDFInfo
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- CN113394156A CN113394156A CN202110682648.1A CN202110682648A CN113394156A CN 113394156 A CN113394156 A CN 113394156A CN 202110682648 A CN202110682648 A CN 202110682648A CN 113394156 A CN113394156 A CN 113394156A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
Abstract
The invention relates to the technical field of vacuum adsorption manipulators, and discloses a wafer transmission device and a vacuum adsorption manipulator thereof. This a vacuum adsorption manipulator for wafer transmission, including base, support ring, rotatory backup pad, pillar, revolution mechanic, take off and land structure, extending structure, adsorption structure, be provided with revolution mechanic in the base, take off and land structure, extending structure and adsorption structure set up on the pillar. The rotation of the manipulator is controlled by the rotating structure, the up-down movement of the manipulator is controlled by the lifting structure, the stretching of the manipulator is controlled by the stretching structure, and the wafer is adsorbed and rotated by matching with the adsorption structure, so that the adsorption capacity is good, the posture is flexible and adjustable in the adsorption and transportation process, the space required by transportation is small, and the production line investment is reduced; through the single-point adsorption of flexible adsorption nozzle, not only guarantee that warpage wafer still can be adsorbed on the wafer manipulator, guarantee the quality safety of wafer, can reliably adsorb in the mode of wafer perpendicular ground moreover, the range of application is wide.
Description
Technical Field
The invention relates to the technical field of vacuum adsorption manipulators, in particular to a wafer transmission device and a vacuum adsorption manipulator thereof.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit device structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions. Due to the influence of wafer manufacturing, the quality of the wafers is different, so that the wafers have warping. In many semiconductor processes, a wafer transfer device is used to transfer a wafer. The existing wafer transmission devices comprise vacuum adsorption manipulators, wafers are adsorbed by utilizing the vacuum adsorption principle to be transmitted to required positions, and dynamic control of the vacuum adsorption manipulators mostly adopts a three-axis mechanical arm, a conveyor belt and the like, so that the posture of the wafers in transportation is limited, the space required by the wafers in transportation is large, and the production line investment is increased.
As disclosed in publication No. CN105428290B, when transferring a wafer, the back surface of the wafer is placed on the adsorption insulation boss, and the vacuum device is used to evacuate air in the vacuum air channel, so as to form a negative pressure in the vacuum air channel and adsorb the back surface of the wafer. Then, the vacuum suction robot is moved to transport the wafer to a desired position. Because the hardness of the adsorption insulation boss is smaller than that of the back of the wafer to be conveyed, after the wafer is conveyed to a required position by the vacuum adsorption mechanical arm, marks cannot be formed at the position, in the back of the wafer, contacted with the vacuum adsorption mechanical arm, and the qualification rate of the wafer is improved. However, there are the following problems: the warped wafer exists in the wafer, the wafer may be dropped when the wafer is vacuum-adsorbed, especially when the wafer is perpendicular to the ground, the insufficient adsorption force may cause frequent wafer dropping, the wafer position deviates from the preset position on the mechanical arm or frequent vacuum alarm occurs, so that the quality of the warped wafer in the transmission process cannot be guaranteed, and especially the posture change in the wafer transmission is greatly limited; for adsorbing the warpage wafer to the manipulator, prior art is mostly the angularity that changes the wafer through exerting external force, makes the wafer adsorb the manipulator, nevertheless it is comparatively inconvenient to exert external force to the wafer again after skew or vacuum alarm appear, still needs the warning of artifical elimination equipment, exerts the external force simultaneously and has also increased the work load when transmitting the wafer, has reduced the work efficiency of manipulator.
Disclosure of Invention
Technical problem to be solved
The wafer conveying device and the vacuum adsorption manipulator thereof have the advantages that the wafer conveying device can well adsorb the warped wafer, the wafer is prevented from falling due to insufficient adsorption force at the warped part of the warped wafer, and the wafer can be conveyed in various postures according to working condition requirements, for example, the posture of the wafer perpendicular to the ground, so that the flexibility of wafer conveying is improved, the space requirement of wafer conveying is saved, and the problem that the wafer can not be well adsorbed and the wafer falls due to insufficient adsorption force at the warped part of the warped wafer is solved.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a vacuum adsorption manipulator for wafer transmission, includes base, support ring, swivel support plate, pillar, revolution mechanic, take off and land structure, extending structure, adsorption structure, base top surface fixed mounting has the support ring, movable mounting has swivel support plate in the support ring swivel support plate top surface fixed mounting has the pillar, be provided with revolution mechanic in the base, be provided with the take off and land structure on the pillar, be provided with extending structure on the pillar, be provided with adsorption structure on the pillar, revolution mechanic is used for controlling the manipulator and rotates, the take off and land structure is used for controlling the manipulator and reciprocates, extending structure is used for controlling the manipulator flexible, adsorption structure is used for controlling the manipulator and adsorbs the wafer.
Preferably, revolution mechanic includes fixed mounting and is in servo motor in the base, fixed mounting has the bull stick in servo motor's the pivot, the upper end fixed mounting of bull stick has the external gear, the bottom surface fixed mounting of rotatory backup pad has the internal gear, the internal gear with the external gear meshing is in the same place, and revolution mechanic is used for controlling the manipulator and rotates to make the manipulator can carry out work to there being the direction.
Preferably, the lifting structure comprises a limiting chute arranged on the pillar, a movable platform is movably arranged in the limiting chute, the movable platform extends to the outside of the pillar, a stepping motor is fixedly arranged on the movable platform, a first bevel gear is fixedly arranged on a rotating shaft of the stepping motor, two sides of the first bevel gear are respectively meshed with a second bevel gear, a first transmission rod is fixedly arranged on the second bevel gear, a third bevel gear is fixedly arranged at one end of the first transmission rod, a fourth bevel gear is fixedly arranged on the third bevel gear, a second transmission rod is fixedly arranged on the fourth bevel gear, a wide gear is fixedly arranged on one side face of one end of the second transmission rod, straight gears are fixedly arranged at two sides of the pillar, the wide gear is meshed with the straight gears, and the lifting structure is used for controlling the manipulator to move up and down, so that the robot can work at any height.
Preferably, extending structure is including offering flat spout on the pillar, movable mounting has the slider in the flat spout, fixed mounting has the hydraulic stem on the slider, fixed mounting has the connector on the push rod of hydraulic stem, fixed mounting has the circulator on one side of connector, circulator one end fixed mounting has the wafer to adsorb the hand, the connector with the circulator communicates with each other, the circulator with the wafer adsorbs the hand and communicates with each other, and extending structure is used for controlling the manipulator flexible to make the manipulator get the wafer and put.
Preferably, the both sides of connector with the equal fixed mounting in moving platform's both sides has the fixed block, moving platform is last movable mounting has first connection rotary rod on the fixed block, on the connector movable mounting has the second to connect the rotary rod on the fixed block, first connection rotary rod with rotary rod movable mounting is connected together to the second, makes extending structure and take off and land the structure and links to each other to let the structure of taking off and land can drive extending structure together to take off and land.
Preferably, the adsorption structure comprises a vacuum air pump fixedly installed in the base, an air pipe is fixedly installed on the vacuum air pump, the air pipe penetrates through the inside of the strut, and one end of the air pipe is fixedly installed together with the connector and used for extracting air to form vacuum so as to provide vacuum adsorption force.
Preferably, the wafer adsorbs and has seted up the warpage on hand and adsorb the mouth, the wafer adsorbs and has seted up a plurality of wafers on hand and adsorb the mouth, the wafer adsorbs a mouthful evenly distributed and is in the edge that the mouth was adsorbed to the warpage, fixed mounting has the fixed plate on the circulator, fixed mounting has high accuracy plane moving platform on the fixed plate, high accuracy plane moving platform with the warpage adsorbs the mouth relative, fixed mounting has flexible absorption mouth on the high accuracy plane moving platform, fixed mounting has the connection siphunculus on the flexible absorption mouth, the one end of connecting the siphunculus with circulator fixed mounting is in the same place for adsorb the wafer on hand, carry out the single-point through flexible absorption mouth to the warped position on the warpage wafer and adsorb simultaneously.
Preferably, the wafer adsorbs to go up fixed mounting with spacing piece, spacing piece is used for injecing the wafer and places the position on the wafer adsorbs the hand, fixed mounting has ray sensor on the circulator, ray sensor is used for detecting the position of warping on the warping wafer.
In addition, the invention also provides a wafer transmission device which comprises the vacuum adsorption manipulator for wafer transmission.
(III) advantageous effects
Compared with the prior art, the invention provides a vacuum adsorption manipulator for wafer transmission, which has the following beneficial effects:
1. according to the vacuum adsorption manipulator for wafer transmission, the rotation of the manipulator is controlled through the rotating structure, the up-down movement of the manipulator is controlled through the lifting structure, the stretching structure controls the stretching of the manipulator, and the adsorption structure is matched to adsorb and rotate a wafer, so that the adsorption capacity is good, the posture is flexible and adjustable in the adsorption and transportation process, the space required by transportation is small, and the production line investment is reduced; through single-point adsorption of the telescopic adsorption nozzle, the warped wafer can still be adsorbed on the wafer manipulator, the quality safety of the wafer is guaranteed, the wafer can be reliably adsorbed in a mode that the wafer is vertical to the ground, and the application range is wide;
2. according to the vacuum adsorption manipulator for wafer transmission, the wafer is placed on the front end of the wafer manipulator to slide to the fixed position instead of vertically placing the wafer to the fixed position through the arrangement of the limiting piece when the wafer is placed and taken, so that the wafer is accurately placed on the fixed position where the wafer is adsorbed on the wafer adsorption manipulator through the limiting of the limiting piece, the situation that the wafer is not adsorbed stably due to the fact that the position where the wafer is placed on the manipulator is not accurate is avoided, the wafer drops and the like, and the safety of the wafer when the wafer is placed and taken is guaranteed;
3. this a vacuum adsorption manipulator for wafer transmission, through ray sensor's setting, utilize the ray principle to detect out warping position of warpage wafer accurately, avoid using other detection methods and lead to detecting the warping position inaccurate, prevent that flexible adsorption nozzle from fixing a position inaccurately, ensured the high efficiency of adsorbing the warpage wafer, increased the work efficiency of manipulator.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a cross-sectional structural view of the base of the present invention;
FIG. 3 is a schematic view of a rotary structure of the present invention;
FIG. 4 is a schematic view of a take-off and landing structure of the present invention;
FIG. 5 is a schematic diagram of a mobile platform according to the present invention;
FIG. 6 is a schematic view of the telescopic structure of the present invention;
FIG. 7 is a schematic view of an adsorption structure of the present invention;
FIG. 8 is a schematic view of a rotational fixing structure according to the present invention.
In the figure: 1. a base; 2. a support ring; 3. rotating the support plate; 4. a pillar; 5. a servo motor; 6. a rotating rod; 7. an outer gear; 8. an internal gear; 9. a limiting chute; 10. a mobile platform; 11. a stepping motor; 12. a first bevel gear; 13. a second bevel gear; 14. a first drive lever; 15. a third bevel gear; 16. a fourth bevel gear; 17. a second transmission rod; 18. a wide gear; 19. a spur gear; 20. a flat chute; 21. a slider; 22. a hydraulic lever; 23. a connector; 24. a rotator; 25. a wafer adsorption hand; 26. a fixed block; 27. a first connecting rotating rod; 28. a second connecting rotating rod; 29. a vacuum air extractor; 30. an air tube; 31. a warped adsorption port; 32. a wafer suction port; 33. a fixing plate; 34. a high-precision planar mobile station; 35. a telescopic adsorption nozzle; 36. connecting a through pipe; 37. a limiting sheet; 38. and a radiation sensor.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As described in the background, the prior art has shortcomings, and in order to solve the above technical problems, the present application provides a vacuum chuck robot for wafer transfer.
In a typical embodiment of the present application, as shown in fig. 1-8, a vacuum adsorption manipulator for wafer transmission, including base 1, support ring 2, swivel support plate 3, pillar 4, revolution mechanic, take-off and landing structure, a telescopic structure, an adsorption structure, base 1 top surface fixed mounting has support ring 2, movable mounting has swivel support plate 3 in support ring 2, 3 top surfaces fixed mounting of swivel support plate has pillar 4, be provided with revolution mechanic in the base 1, be provided with the take-off and landing structure on pillar 4, be provided with the telescopic structure on pillar 4, be provided with the adsorption structure on pillar 4, revolution mechanic is used for controlling the manipulator to rotate, the take-off and landing structure is used for controlling the manipulator to reciprocate, the telescopic structure is used for controlling the manipulator to stretch out and draw back, the adsorption structure is used for controlling the manipulator to adsorb the wafer.
Further, as shown in fig. 2 and 3, the rotating structure includes a servo motor 5 fixedly installed in the base 1, a rotating rod 6 is fixedly installed on a rotating shaft of the servo motor 5, an outer gear 7 is fixedly installed at an upper end of the rotating rod 6, an inner gear 8 is fixedly installed on a bottom surface of the rotating support plate 3, the inner gear 8 is meshed with the outer gear 7, and the rotating structure is used for controlling the manipulator to rotate so that the manipulator can work in a certain direction.
Further, as shown in fig. 2, 4 and 5, the lifting structure includes a limiting chute 9 provided on the pillar 4, a moving platform 10 is movably installed in the limiting chute 9, the moving platform 10 extends to the outside of the pillar 4, a stepping motor 11 is fixedly installed on the moving platform 10, a first bevel gear 12 is fixedly installed on a rotating shaft of the stepping motor 11, two sides of the first bevel gear 12 are respectively engaged with a second bevel gear 13, a first transmission rod 14 is fixedly installed on each second bevel gear 13, one end of each first transmission rod 14 is respectively fixedly installed with a third bevel gear 15, each third bevel gear 15 is respectively engaged with a fourth bevel gear 16, each fourth bevel gear 16 is respectively fixedly installed with a second transmission rod 17, a wide gear 18 is fixedly installed on a side surface of one end of each second transmission rod 17, two sides of the pillar 4 are respectively fixedly installed with a straight gear 19, the wide gear 18 is engaged with the straight gear 19, the lifting structure is used for controlling the manipulator to move up and down, so that the manipulator can work at any height.
Further, as shown in fig. 2 and 4, the telescopic structure includes a flat chute 20 formed on the pillar 4, a slider 21 is movably installed in the flat chute 20, a hydraulic rod 22 is fixedly installed on the slider 21, a connector 23 is fixedly installed on a push rod of the hydraulic rod 22, a rotator 24 is fixedly installed on one side of the connector 23, a wafer adsorption hand 25 is fixedly installed at one end of the rotator 24, the connector 23 is communicated with the rotator 24, the rotator 24 is communicated with the wafer adsorption hand 25, and the telescopic structure is used for controlling the manipulator to stretch and retract so as to take and place a wafer.
Further, as shown in fig. 2 and fig. 6, fixed blocks 26 are fixedly mounted on both sides of the connector 23 and both sides of the mobile platform 10, a first connecting rotating rod 27 is movably mounted on the fixed block 26 on the mobile platform 10, a second connecting rotating rod 28 is movably mounted on the fixed block 26 on the connector 23, and the first connecting rotating rod 27 and the second connecting rotating rod 28 are movably mounted together, so that the telescopic structure is connected with the lifting structure, and the lifting structure can drive the telescopic structure to lift and land together.
Further, as shown in fig. 2 and 7, the suction structure includes a vacuum air pump 29 fixedly installed in the base 1, an air pipe 30 is fixedly installed on the vacuum air pump 29, the air pipe 30 penetrates through the inside of the pillar 4, and one end of the air pipe 30 is fixedly installed with the connector 23 for drawing air to form vacuum, so as to provide vacuum suction force.
Further, as shown in fig. 2 and 8, a warpage adsorption port 31 is formed in the wafer adsorption hand 25, a plurality of wafer adsorption ports 32 are formed in the wafer adsorption hand 25, the wafer adsorption ports 32 are uniformly distributed at the edge of the warpage adsorption port 31, a fixing plate 33 is fixedly mounted on the rotator 24, a high-precision plane moving table 34 is fixedly mounted on the fixing plate 33, the high-precision plane moving table 34 is opposite to the warpage adsorption port 31, a telescopic adsorption nozzle 35 is fixedly mounted on the high-precision plane moving table 34, a connection through pipe 36 is fixedly mounted on the telescopic adsorption nozzle 35, one end of the connection through pipe 36 is fixedly mounted with the rotator 24, and is used for adsorbing a wafer onto the wafer adsorption hand 25, and meanwhile, single-point adsorption is performed on the warpage position of the warped wafer through the telescopic adsorption nozzle 35.
Further, as shown in fig. 2 and 8, a position limiting sheet 37 is fixedly mounted on the wafer suction hand 25, the position limiting sheet 37 is used for limiting the position of the wafer placed on the wafer suction hand 25, a radiation sensor 38 is fixedly mounted on the rotator 24, and the radiation sensor 38 is used for detecting the warping position of the warped wafer.
The working principle of the invention is as follows: when wafer transmission is carried out, the servo motor 5 is started firstly, the servo motor 5 drives the external gear 7 to rotate, the external gear 7 drives the internal gear 8 to rotate, the internal gear 8 drives the rotary support plate 3 to rotate, the rotary support plate 3 drives the strut 4 to rotate, so that the manipulator faces towards the wafer direction, then the stepping motor 11 is started, the stepping motor 11 drives the first bevel gear 12 to rotate, the first bevel gear 12 drives the second bevel gear 13 to rotate, the second bevel gear 13 drives the first transmission rod 14 to rotate, the first transmission rod 14 drives the third bevel gear 15 to rotate, the third bevel gear 15 drives the fourth bevel gear 16 to rotate, the fourth bevel gear 16 drives the second transmission rod 17 to rotate, the second transmission rod 17 drives the wide gear 18 to rotate, so that the wide gear 18 moves on the straight gear 19, and the manipulator moves up and down through the connection effect of the first connection rotating rod 27 and the second connection rotating rod 28, make manipulator and wafer be located the coplanar, restart hydraulic stem 22, hydraulic stem 22 drives connector 23 and removes, connector 23 drives circulator 24 and removes, circulator 24 drives wafer absorption hand 25 and removes, make the wafer slide to wafer absorption hand 25 on, pass through spacing piece 37's restriction, fix a position the wafer to the top of warpage absorption mouth 31, then start vacuum air extractor 29, through trachea 30, connector 23, the inside route of circulator 24, adsorb hand 25 and bleed to the wafer, then adsorb the mouth 32 through the wafer, adsorb the processing to the edge of wafer.
Meanwhile, the ray sensor 38 detects the wafer to determine the warping position on the warped wafer, then the high-precision plane moving table 34 is started to move the telescopic adsorption nozzle 35 to the lower side of the warping position, then the telescopic adsorption nozzle 35 is extended out to be attached to the wafer, then air suction is performed through the connecting pipe 36, the telescopic adsorption nozzle 35 performs single-point adsorption treatment on the warping position, and then the edge adsorption of the non-warping position is matched to adsorb the warped wafer onto the wafer adsorption hand 25.
In addition, the invention also provides a wafer transmission device which comprises the vacuum adsorption manipulator for wafer transmission.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. The utility model provides a vacuum adsorption manipulator for wafer transmission, includes base (1), support ring (2), swivel support plate (3), pillar (4), revolution mechanic, take off and land structure, extending structure, adsorption structure, its characterized in that: base (1) top surface fixed mounting has support ring (2), movable mounting has swivel support plate (3) in support ring (2) top surface fixed mounting has pillar (4), be provided with revolution mechanic in base (1), take off and land structure, extending structure and adsorption structure set up on pillar (4), revolution mechanic is used for controlling the manipulator and rotates, the structure of taking off and land is used for controlling the manipulator and reciprocates, extending structure is used for controlling the manipulator flexible, adsorption structure is used for controlling the manipulator and adsorbs the wafer.
2. A vacuum adsorption robot for wafer transfer as claimed in claim 1, wherein: the adsorption structure comprises a vacuum air pump (29) fixedly installed in the base (1), an air pipe (30) is fixedly installed on the vacuum air pump (29), the air pipe (30) penetrates through the inside of the supporting column (4), and one end of the air pipe (30) is fixedly installed together with the connector (23).
3. A vacuum adsorption robot for wafer transfer as claimed in claim 2, wherein: wafer adsorbs and has seted up warpage on hand (25) and adsorb mouth (31), a plurality of wafers have been seted up on wafer adsorbs hand (25) and have adsorbed mouth (32), wafer adsorbs mouth (32) evenly distributed is in the edge that the warpage adsorbs mouth (31), fixed mounting has fixed plate (33) on circulator (24), fixed mounting has high accuracy plane moving platform (34) on fixed plate (33), high accuracy plane moving platform (34) with the warpage adsorbs mouth (31) relatively, fixed mounting has flexible absorption mouth (35) on high accuracy plane moving platform (34), fixed mounting has connection siphunculus (36) on flexible absorption mouth (35), connect the one end of siphunculus (36) with circulator (24) fixed mounting is in the same place.
4. A vacuum adsorption robot for wafer transfer as claimed in claim 3, wherein: wafer adsorbs on hand (25) fixed mounting have spacing piece (37), spacing piece (37) are used for injecing the wafer and place position on wafer adsorption hand (25), fixed mounting has ray sensor (38) on circulator (24), ray sensor (38) are used for detecting the position of warping on the warping wafer.
5. A vacuum adsorption robot for wafer transfer as claimed in claim 1, wherein: revolution mechanic includes fixed mounting and is in servo motor (5) in base (1), fixed mounting has bull stick (6) in the pivot of servo motor (5), the upper end fixed mounting of bull stick (6) has outer gear (7), the bottom surface fixed mounting of rotatory backup pad (3) has inner gear (8), inner gear (8) with outer gear (7) meshing is in the same place.
6. A vacuum adsorption robot for wafer transfer as claimed in claim 1, wherein: the lifting structure comprises a limiting sliding groove (9) arranged on the support column (4), a moving platform (10) is movably arranged in the limiting sliding groove (9), the moving platform (10) extends to the outside of the support column (4), a stepping motor (11) is fixedly arranged on the moving platform (10), a first bevel gear (12) is fixedly arranged on a rotating shaft of the stepping motor (11), second bevel gears (13) are respectively meshed with two sides of the first bevel gear (12), a first transmission rod (14) is respectively and fixedly arranged on the second bevel gears (13), a third bevel gear (15) is respectively and fixedly arranged at one end of the first transmission rod (14), a fourth bevel gear (16) is respectively meshed with the third bevel gear (15), a second transmission rod (17) is respectively and fixedly arranged on the fourth bevel gear (16), and a wide gear (18) is respectively and fixedly arranged on one end side surface of the second transmission rod (17), both sides on pillar (4) all fixed mounting have spur gear (19), wide gear (18) with spur gear (19) meshing together.
7. A vacuum adsorption robot for wafer transfer as claimed in claim 2, wherein: the telescopic structure is including seting up flat spout (20) on pillar (4), movable mounting has slider (21) in flat spout (20), fixed mounting has hydraulic stem (22) on slider (21), fixed mounting has connector (23) on the push rod of hydraulic stem (22), fixed mounting has circulator (24) on one side of connector (23), circulator (24) one end fixed mounting has wafer to adsorb hand (25), connector (23) with circulator (24) communicate with each other, circulator (24) with wafer adsorbs hand (25) and communicates with each other.
8. A vacuum adsorption robot for wafer transfer as claimed in claim 7, wherein: the both sides of connector (23) with the equal fixed mounting in both sides of moving platform (10) has fixed block (26), moving platform (10) is last movable mounting has first connection rotary rod (27) on fixed block (26), on connector (23) movable mounting has second connection rotary rod (28) on fixed block (26), first connection rotary rod (27) with second connection rotary rod (28) movable mounting is in the same place.
9. A wafer transfer device, comprising: a vacuum adsorption robot for wafer transfer comprising one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110682648.1A CN113394156A (en) | 2021-06-21 | 2021-06-21 | Wafer transmission device and vacuum adsorption manipulator thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110682648.1A CN113394156A (en) | 2021-06-21 | 2021-06-21 | Wafer transmission device and vacuum adsorption manipulator thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113394156A true CN113394156A (en) | 2021-09-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110682648.1A Withdrawn CN113394156A (en) | 2021-06-21 | 2021-06-21 | Wafer transmission device and vacuum adsorption manipulator thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113394156A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115332142A (en) * | 2022-10-12 | 2022-11-11 | 无锡宇邦半导体科技有限公司 | Non-blocking wafer processing, transferring and adsorbing mechanical arm and processing method thereof |
-
2021
- 2021-06-21 CN CN202110682648.1A patent/CN113394156A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115332142A (en) * | 2022-10-12 | 2022-11-11 | 无锡宇邦半导体科技有限公司 | Non-blocking wafer processing, transferring and adsorbing mechanical arm and processing method thereof |
| CN115332142B (en) * | 2022-10-12 | 2023-03-24 | 无锡宇邦半导体科技有限公司 | Non-blocking wafer processing, transferring and adsorbing mechanical arm and processing method thereof |
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Application publication date: 20210914 |
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| WW01 | Invention patent application withdrawn after publication |