CN106783721B - Silicon wafer suction device and automatic inserting device - Google Patents
Silicon wafer suction device and automatic inserting device Download PDFInfo
- Publication number
- CN106783721B CN106783721B CN201710183347.8A CN201710183347A CN106783721B CN 106783721 B CN106783721 B CN 106783721B CN 201710183347 A CN201710183347 A CN 201710183347A CN 106783721 B CN106783721 B CN 106783721B
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- silicon wafer
- supporting plate
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- support
- transmission
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 130
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 130
- 239000010703 silicon Substances 0.000 title claims abstract description 130
- 230000005540 biological transmission Effects 0.000 claims abstract description 65
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000007921 spray Substances 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 abstract description 99
- 238000000926 separation method Methods 0.000 abstract description 2
- 230000000670 limiting effect Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 230000009471 action Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 230000007306 turnover Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application discloses piece device and automatic inserted sheet device are inhaled to silicon chip, this piece device is inhaled to silicon chip includes the support, the support bottom has the working face of personally submitting certain contained angle with the level, at least one gas pocket has been seted up on the working face, three guide pulley is installed to the both sides of support respectively symmetry, three guide pulley that is located one side is triangle-shaped and arranges, the outside of three guide pulley that is located same one side is around being equipped with the conveyer belt, the piece device is inhaled to the silicon chip still includes a motor, be connected with the transmission shaft between the guide pulley that is located both sides, the motor is connected in the transmission shaft and can drive its rotation, the relatively low one end of support is provided with a plurality of bearings in parallel, this a plurality of bearings rotate and set up on the support, the relatively low one end of support still is provided with the lantern ring that can float from top to bottom, still be provided with travel switch on the support, this travel switch sets up in the top of lantern ring. The silicon wafer suction device provided by the invention realizes the separation of upper and lower silicon wafers through water flow, and simultaneously controls the upward moving speed of the silicon wafers through the cooperation of the lantern ring and the travel switch.
Description
Technical Field
The application belongs to the field of semiconductor silicon wafer processing and solar cell silicon wafer processing, and particularly relates to a silicon wafer suction device and an automatic inserting device.
Background
In the production process of solar cell silicon wafers, one procedure is to insert the silicon wafers into a special wafer box one by one, in the prior art, people usually adopt manual operation to finish the wafer inserting operation, so that the labor intensity is high, the efficiency is low, and the silicon wafers are extremely damaged in the wafer inserting process.
Chinese patent CN203932088U discloses a full-automatic silicon chip inserting machine, and it includes the organism, the organism on be equipped with silicon chip output device, silicon chip conveyer and dress box, silicon chip output device pass through the sucking disc and be connected with silicon chip conveyer's silicon chip entering end, silicon chip conveyer's silicon chip sending end meets with the dress box, the dress box on be connected with the dress box cylinder that drives its relative organism oscilaltion, this structure can realize the full-automatic cartridge operation of silicon chip, compares prior art's manual operation, has improved the cartridge efficiency of silicon chip by a wide margin. It still has the following problems:
1. the silicon wafer plugging device cannot adapt to the silicon wafer plugging of different sizes;
2. the silicon chip in the silicon chip output device is easy to adhere up and down;
3. after the silicon wafer is loaded, the silicon wafer still needs to be carried and transferred manually, and the degree of automation is still low.
Disclosure of Invention
The invention aims to provide a silicon wafer suction device and an automatic inserting device, which are used for overcoming the defects in the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions:
the embodiment of the application discloses piece device is inhaled to silicon chip, which comprises a bracket, the support bottom has the working face of personally submitting certain contained angle with the level, at least one gas pocket has been seted up on the working face, and this gas pocket is connected with negative pressure getter device, the both sides of support are the symmetry respectively and are installed three guide pulley, and the three guide pulley that is located one side is triangle-shaped and arranges, wherein two guide pulleys that are located the below place straight line be on a parallel with the working face, and the bottom surface of these two guide pulleys protruding stretch in the below of working face, the outside of three guide pulley that is located same one side is around being equipped with the conveyer belt, the piece device is inhaled to the silicon chip still includes a motor, is connected with the transmission shaft between the guide pulley that is located the both sides, the motor is connected with the transmission shaft and can drive its rotation, the relatively low one end of support is provided with a plurality of bearings in parallel, and this a plurality of bearings rotate and set up on the support, the bottom of bearing stretch in the below of working face, the relatively low one end of support height still is provided with the lantern ring that can float from top to bottom, still be provided with travel switch on the support.
Preferably, in the silicon wafer suction device, two bearings are arranged in parallel at one end of the relatively low height of the support, and the collar is arranged between the two bearings.
Correspondingly, the application also discloses an automatic inserting device, including the frame, and install first hoisting device, burst device in the frame the piece device is inhaled to the silicon chip, silicon chip transmission and second hoisting device, first hoisting device and second hoisting device are located the both ends of silicon chip transmission at transmission direction respectively, first hoisting device includes first layer board, slide bar, second power device and slider, first layer board has horizontal holding surface, the slide bar is vertical installs in the frame, the slider cover is located on the slide bar, second power device is connected in the slider and can drive its removal in vertical direction, fixed mutually between slider and the first layer board, the piece device is inhaled to the silicon chip sets up in the direct top of first layer board, burst device sets up in the below of piece device is inhaled to the silicon chip, and is located between first hoisting device and the silicon chip transmission, burst device has seted up a plurality of holes towards the side direction of silicon chip, transmission device includes a plurality of transmission guide pulleys that set up along transmission direction and the water spray bar of the silicon chip. The second lifting device comprises a bracket, a second supporting plate and a second power device, wherein the second supporting plate can slide on the bracket along the vertical direction, and the second power device is connected with the second supporting plate and can drive the second supporting plate to move in the vertical direction.
Preferably, in the automatic inserting device, a silicon wafer enclosure is supported on the supporting surface of the first support plate, the silicon wafer enclosure and the first support plate are detachably fixed, a plurality of positioning portions protrude from the upper surface of the first support plate, and a groove is concavely formed in the bottom of the silicon wafer enclosure in cooperation with the positioning portions.
Preferably, in the automatic inserting device, the second power device comprises a screw and a motor, the motor is connected to the screw and can drive the screw to rotate, the screw and the sliding rod are arranged in parallel, and the sliding block is matched with the screw through threads.
Preferably, in the automatic tab inserting apparatus, the second lifting device includes a bracket, a second supporting plate and a second power device, the second supporting plate is slidable on the bracket along a vertical direction, and the second power device is connected to the second supporting plate and can drive the second supporting plate to move in the vertical direction.
Preferably, in the automatic inserting device, a groove for positioning a side face of the basket is concavely formed on the top face of the second supporting plate, and after the basket is positioned, an opening of the basket faces to the tail end of the silicon wafer transmission device.
Compared with the prior art, the invention has the advantages that: according to the wafer dividing device, water is continuously sprayed to the side face of the upper silicon wafer through the water spraying holes, adjacent silicon wafers are separated through water under the action of water pressure, and after the top silicon wafer is adsorbed, the silicon wafer below the top silicon wafer is not easy to adhere, so that the transportation of single silicon wafers at each time is realized. In addition, in the process of upward movement of the silicon wafer, as the working surface is positioned at one end of the lantern ring and is lower, the lantern ring is firstly contacted with the upper surface of the silicon wafer, the lantern ring moves upward and triggers the travel switch, the first lifting device stops moving upward, the silicon wafer positioned on the top surface is transferred under the adsorption action, the set bearing limits the upward movement amplitude of the lantern ring on one side and plays a guiding role on the moving silicon wafer on the other side.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic perspective view of an automatic tab inserting apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic perspective view of a wafer suction device according to an embodiment of the present invention;
FIG. 3 is a schematic perspective view of a first lifting device, a wafer suction device and a wafer transmission device according to an embodiment of the present invention;
FIG. 4 is a schematic perspective view of a first lifting device according to an embodiment of the present invention;
FIG. 5 is a schematic perspective view of a wafer suction device according to an embodiment of the present invention;
FIG. 6 is a schematic perspective view of a second lifting device, a vertical turning device and a horizontal turning device according to an embodiment of the present invention;
FIG. 7 is a schematic perspective view of a horizontal turning device according to an embodiment of the present invention;
FIG. 8 is a schematic view of an alternate perspective of an automatic tab inserting apparatus according to an embodiment of the present invention;
FIG. 9 is a schematic top view of an automatic tab device according to an embodiment of the invention;
fig. 10 is a schematic structural view of a first guard bar and a second guard bar according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
The automatic inserting device comprises a frame 1, a first lifting device 2, a slicing device 3, a silicon wafer sucking device 4, a silicon wafer transmission device 5 and a second lifting device 6 which are arranged on the frame 1, wherein the first lifting device 2 and the second lifting device 6 are respectively positioned at two ends of the silicon wafer transmission device 5 in the transmission direction.
As shown in fig. 3 and 4, the first lifting device 2 includes a first supporting plate 201, a sliding rod 202, a second power device and a sliding block 203, the first supporting plate 201 has a horizontal supporting surface, the sliding rod 202 is vertically installed on the frame 1, the sliding block 203 is sleeved on the sliding rod 202, the second power device is connected to the sliding block 203 and can drive the sliding block 203 to move in the vertical direction, and the sliding block 203 is fixed with the first supporting plate 201.
Further, a silicon wafer enclosure 204 is supported on the supporting surface of the first supporting plate 201, the silicon wafer enclosure 204 and the first supporting plate 201 are detachably fixed, a plurality of positioning portions 2011 protrude from the upper surface of the first supporting plate 201, and a groove is concavely formed at the bottom of the silicon wafer enclosure 204 in cooperation with the positioning portions 2011.
In one embodiment, the second power device comprises a screw 205 and a motor, the motor is connected to the screw and can drive the screw to rotate, the screw 205 is arranged in parallel with the slide bar 202, and the slide block 203 is matched with the screw through threads.
In other embodiments, the second power device may further use a telescopic cylinder as a power source, where an output end of the telescopic cylinder directly drives the slider to move in a vertical direction.
In the technical scheme, the motor drives the screw rod to rotate through the belt, so that the sliding block and the first supporting plate are driven to move up and down along the sliding rod; one side (the side facing the water spraying hole) of the silicon wafer surrounding baffle taking piece is opened, and the silicon wafer surrounding baffle taking piece can be rapidly positioned and installed with the first supporting plate through the matching of the positioning part and the groove.
As shown in fig. 2 and fig. 5, the silicon wafer suction device 4 is disposed right above the first supporting plate 201, the silicon wafer suction device 4 includes a support 401, a working surface 4011 having a certain included angle with a horizontal plane is disposed at the bottom of the support 401, one end of the working surface close to the first lifting device is lower than one end of the working surface close to the silicon wafer transmission device, at least one air hole 4012 is formed in the working surface 4011, the air hole 4012 is connected with the negative pressure suction device, three guide wheels 402 are symmetrically mounted on two sides of the support 401, three guide wheels 402 on one side are arranged in a triangle shape, wherein two guide wheels on the lower side are located in a straight line parallel to the working surface, the bottom surfaces of the two guide wheels are protruded below the working surface 4011, a conveyor belt 403 is wound around the outer sides of the three guide wheels 402 on the same side, a motor 404 is connected between the guide wheels on two sides, and the motor 404 is connected with the transmission shaft 405 and can drive the transmission shaft 405 to rotate.
In the technical scheme, the first lifting device drives the basket carrying the silicon wafers to rise and approach the working surface 4011, under the action of negative pressure, the silicon wafers at the uppermost end are adsorbed on the working surface and supported by the conveying belt, under the action of the conveying belt, the adsorbed silicon wafers move to the position above the silicon wafer transmission device 5 and then are further conveyed to the position of the second lifting device.
Further, a plurality of bearings 4014 are arranged at one end of the support 401 away from the silicon wafer transmission device 5 in parallel, the bearings 4014 are rotatably arranged on the support 401, and bottom ends of the bearings 4014 protrude below the working surface 4011.
Further, a collar 4015 capable of floating up and down is further disposed at one end of the support 401 away from the silicon wafer transmission device 5, and a travel switch 4016 is further disposed on the support 401 and is disposed above the collar 4015.
In this technical scheme, in the silicon chip shift-up process, because the working face is located the one end of lantern ring lower, the lantern ring at first takes place to contact with the silicon chip upper surface, and the lantern ring shifts up and triggers travel switch, and first hoisting device stops to shift up, and the silicon chip that is located the top surface shifts under the adsorption, and the bearing 4014 that sets up carries out spacingly to the range of shifting up of lantern ring on one side, plays the guide effect to the silicon chip that removes on the other side.
Referring to fig. 2, the wafer dividing device 3 is disposed below the wafer suction device 4 and between the first lifting device 2 and the wafer transmission device 5, and a plurality of water spray holes 301 are formed in a lateral direction of the wafer facing the wafer dividing device 3.
In the technical scheme, the wafer dividing device sprays water to the side face of the silicon wafer above through the water spraying holes continuously, adjacent silicon wafers are separated through water under the action of water pressure, and after the top silicon wafer is adsorbed, the silicon wafer below the silicon wafer is not easy to adhere, so that the transportation of single silicon wafers at each time is realized.
The silicon wafer driving device 5 includes a plurality of guide rollers 501 arranged along the silicon wafer conveying direction, and a conveying bar 502 driven by the guide rollers 501.
As shown in fig. 6, the second lifting device 6 includes a bracket 601, a second pallet 602, and a second power device, the second pallet 602 being slidably mounted on the bracket 601 in a vertical direction, the second power device being coupled to the second pallet 602 and being capable of driving the second pallet to move in the vertical direction.
The top surface of the second supporting plate 602 is concavely provided with a groove 6021 for positioning the side surface of the basket, and after the basket is positioned, the opening of the basket faces the tail end of the silicon wafer transmission device 5.
In the technical scheme, the opening of the flower basket faces the outlet of the silicon wafer transmission device 5, the clamping groove in the flower basket corresponds to the height of the supporting surface of the silicon wafer transmission device, in the working process, the silicon wafer transmission device drives the silicon wafer to move into the flower basket and support the silicon wafer in the corresponding clamping groove, then the second power device drives the flower basket to lift the displacement of the thickness of one clamping groove, and when the next silicon wafer moves into the corresponding clamping groove, the second power device continues to drive the flower basket to move upwards until the silicon wafer in the flower basket is full.
As shown in fig. 1, the frame 1 is further provided with an empty basket transmission device 7, and the empty basket transmission device 7 is arranged in parallel with the silicon wafer transmission device 5. The first manipulator 8 is arranged above the empty basket transmission device 7, and the first manipulator 8 can grab an empty basket positioned at the tail end of the empty basket transmission device 7 and can be placed on the second supporting plate 602.
In this technical scheme, after the empty basket on the second supporting plate 602 completes the inserting sheet and transfers, the empty basket on the empty basket transmission device 7 is transferred to the second supporting plate by the first manipulator to continue the inserting sheet operation.
Referring to fig. 6, a vertical turnover device 9 is further provided on the frame 1, the vertical turnover device 9 is disposed on one side of the second lifting device 6, the vertical turnover device 9 includes a bracket 901 and a bracket 902, the bracket 902 is mounted on the bracket 901, the bracket 902 includes two support plates perpendicular to each other, an opening 9021 for protruding from the support edge of the bottom of the basket is provided in the support plates, the opening 9021 extends to the edge of the support plates, the bracket 902 can turn by 90 ° in the vertical plane relative to the bracket 901, after the turning is completed, the basket opening is upward, and the bracket 902 can move along the bracket toward the horizontal rotation device 10.
Further, a second manipulator 11 is further disposed above the second lifting device 6, and the second manipulator 11 can grab and place the flower basket above the second supporting plate 602 on the bracket 902.
Further, the first and second robots are synchronized, and the first robot moves the basket on the second pallet to the tray 902 while the first robot moves the basket on the empty basket drive to the second pallet.
According to the technical scheme, when the empty flower basket is inserted, the opening of the empty flower basket faces to the silicon wafer transmission device, namely the flower basket is equivalent to side placement, and the flower basket is turned by 90 degrees through the turning device, so that the opening of the flower basket is upward.
As shown in fig. 7, the frame 1 is further provided with a horizontal rotation device 10, where the horizontal rotation device 10 includes a support frame 1001, a first support block 1002 and a second support block 1003, the first support block 1002 is mounted on the support frame 1001 and can move in a vertical direction along the support frame 1001, and the second support block 1003 is supported on the first support block 1002 and can rotate by 90 ° in a horizontal plane relative to the first support block 1002.
Two raised strips 1004 are arranged in parallel on the surface of the second supporting block 1003 in a protruding mode, the two raised strips are matched with the inner sides of two supporting edges at the bottom of the flower basket respectively, a vertically arranged limiting plate 1005 is arranged on one side of the second supporting block 1003, and the top surface of the limiting plate 1005 protrudes from the surface of the second supporting block 1003.
In this technical scheme, bracket 902 drives the basket of flowers and removes to the top of second supporting shoe 1003, first supporting shoe drives the second supporting shoe and reciprocates, until two supporting edges of basket of flowers bottom support in the surface of second supporting shoe, two sand strips set up side by side and are located the inboard of two supporting edges simultaneously with the supporting edge, thereby realize the spacing effect to the basket of flowers, limiting plate 1005 is located the one side that is close to vertical turning device this moment, its side blocks the supporting edge of basket of flowers, the bracket retreats in-process, the basket of flowers is kept on the surface of second supporting shoe under the limiting plate blocking effect, then the second supporting shoe drives the basket of flowers and rotates 90.
Referring to fig. 8, a tooling transmission arrangement device 12 is further disposed on one side of the horizontal rotation device 10, a guide wheel and a conveyor belt driven by the guide wheel are disposed on the tooling transmission arrangement device 12 along the transmission direction, a cross beam 121 is disposed above the horizontal rotation device 11, a pulling piece 122 is slidably disposed on the cross beam, and the pulling piece 122 is movable in the transmission direction of the tooling transmission arrangement device.
In this technical scheme, the plectrum is located the basket of flowers and deviates from frock transmission arrangement device's one side, and the second supporting shoe drives the basket of flowers and rotates the back of accomplishing, and the holding surface of second supporting shoe is coplanar with frock transmission arrangement device's holding surface, and the plectrum promotes the basket of flowers and removes to frock transmission arrangement device on and by conveying, returns to initial position after the propelling movement of basket of flowers is accomplished to the plectrum.
And a third manipulator 13 is further arranged above the tool transmission arrangement device 12, and after the flower basket is arranged on the tool transmission arrangement device, the whole row of flower baskets are transferred to the next procedure through the third manipulator.
The following specifically describes the workflow of the full-automatic inserting device in the scheme:
(1) Placing a silicon wafer enclosure 204 loaded with silicon wafers on the first supporting plate 201 by a manual or mechanical arm, wherein the silicon wafers are overlapped up and down;
(2) The empty basket transmission device 7 drives the empty basket to move to the side surface of the second lifting device 6;
(3) The second power device drives the overlapped silicon wafers to move upwards, the lantern ring is firstly contacted with the upper surface of the silicon wafers, the silicon wafers move upwards against the lantern ring and trigger the travel switch, the first lifting device stops moving upwards, the silicon wafers on the top surface are transferred to the silicon wafer transmission device under the adsorption action, the wafer separation device 3 continuously sprays water on the side surfaces of the silicon wafers, so that the upper silicon wafers and the lower silicon wafers are separated through water flow, the first supporting plate moves upwards continuously, and the conveying of a lower silicon wafer is completed;
(4) The silicon wafer enters the empty basket of the second supporting plate under the conveying of the silicon wafer transmission device, and after the inserting piece of the silicon wafer is completed, the second supporting plate moves upwards by the height of one slot to continue the inserting piece of the next silicon wafer;
(5) After the flower basket inserting sheets are completed, the first manipulator moves the flower basket full of silicon wafers to the bracket 902, and meanwhile, the second manipulator moves the flower basket on the empty flower basket transmission device to the second supporting plate;
(6) The tray 902 is flipped 90 ° so that the basket opening is up;
(7) The bracket drives the flower basket to move to the upper part of the second supporting block 1003, the first supporting block drives the second supporting block to move upwards until two supporting edges at the bottom of the flower basket are supported on the surface of the second supporting block, meanwhile, two convex strips are arranged in parallel with the supporting edges and are positioned on the inner sides of the two supporting edges, so that the limiting effect on the flower basket is realized, at the moment, the limiting plate 1005 is positioned on one side close to the vertical turning device, the side surface of the limiting plate blocks the supporting edge of the flower basket, in the backward process of the bracket, the flower basket stays on the surface of the second supporting block under the blocking effect of the limiting plate, and then the second supporting block drives the flower basket to rotate by 90 degrees, so that the top edge of the flower basket faces to two sides;
(8) After the second supporting block drives the flower basket to rotate, the supporting surface of the second supporting block is coplanar with the supporting surface of the tool transmission arrangement device, the plectrum pushes the flower basket to move to the tool transmission arrangement device and be transmitted, and the plectrum returns to the initial position after pushing the flower basket;
(9) And after the flower baskets are arranged on the tool transmission arrangement device, transferring the whole row of flower baskets to the next working procedure through a third manipulator.
Referring to fig. 9 and 10, in order to accommodate different sizes of flower baskets, the silicon wafer transmission device 5 is provided with a first guard bar 503 and a second guard bar 504 at both sides thereof, a screw 505 is connected between the first guard bar 503 and the second guard bar 504, the screw 505 is connected to a motor 506, and the screw 505 is rotated to adjust the distance between the first guard bar 503 and the second guard bar 504.
The third guard bar 701 and the fourth guard bar 702 are respectively arranged on two sides of the basket transmission device 7, and the distance between the third guard bar 701 and the fourth guard bar 702 is adjustable.
The two sides of the tool transmission arrangement device 12 are respectively provided with a fifth guard bar 123 and a sixth guard bar 124, and the distance between the fifth guard bar 123 and the sixth guard bar 124 is adjustable.
In the technical scheme, the flower basket with different widths is adapted through the spacing-adjustable guard bars.
It should be noted that the automatic inserting device is designed aiming at a standard silicon wafer inserting flower basket, and the overturning device is changed according to actual needs, such as one overturning action is reduced for a nonstandard flower basket.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.
Claims (6)
1. An automatic inserting device is characterized by comprising a frame, a first lifting device, a slicing device, a silicon wafer sucking device, a silicon wafer transmission device and a second lifting device which are arranged on the frame, wherein the first lifting device and the second lifting device are respectively positioned at two ends of the silicon wafer transmission device in the transmission direction,
the silicon wafer suction device comprises a bracket, the bottom of the bracket is provided with a working surface with a certain included angle with the horizontal surface, the working surface is provided with at least one air hole, the air hole is connected with a negative pressure suction device, two sides of the bracket are respectively symmetrically provided with three guide wheels, the three guide wheels positioned at one side are arranged in a triangle, wherein the straight line of the two guide wheels positioned at the lower part is parallel to the working surface, the bottom surfaces of the two guide wheels are protruded below the working surface, the outer sides of the three guide wheels positioned at the same side are wound with a conveying belt, the silicon wafer suction device also comprises a motor, a transmission shaft is connected between the guide wheels positioned at the two sides, the motor is connected with the transmission shaft and can drive the transmission shaft to rotate, one end with relatively low height of the bracket is provided with a plurality of bearings in parallel, the bottom ends of the bearings are rotatably arranged on the bracket, one end with relatively low height of the bracket is also provided with a lantern ring capable of floating up and down, the bracket is also provided with a travel switch, the travel switch is arranged above the lantern ring,
the first lifting device comprises a first supporting plate, a sliding rod, a second power device and a sliding block, wherein the first supporting plate is provided with a horizontal supporting surface, the sliding rod is vertically arranged on the frame, the sliding block is sleeved on the sliding rod, the second power device is connected with the sliding block and can drive the sliding block to move in the vertical direction, the sliding block is fixed with the first supporting plate,
the silicon wafer suction device is arranged right above the first supporting plate, the wafer dividing device is arranged below the silicon wafer suction device and is positioned between the first lifting device and the silicon wafer transmission device, the wafer dividing device is provided with a plurality of water spray holes facing the side direction of the silicon wafer, the silicon wafer transmission device comprises a plurality of guide wheels arranged along the conveying direction of the silicon wafer and conveying strips driven by the guide wheels, the second lifting device comprises a bracket, a second supporting plate and a second power device, the second supporting plate can slide on the bracket along the vertical direction, the second power device is connected with the second supporting plate and can drive the second supporting plate to move in the vertical direction,
the frame is also provided with an empty basket transmission device which is arranged in parallel with the silicon wafer transmission device.
2. The automatic tab device of claim 1, wherein: the silicon wafer fence is supported on the supporting surface of the first supporting plate, the silicon wafer fence and the first supporting plate are detachably fixed, a plurality of positioning parts are convexly extended on the upper surface of the first supporting plate, and a groove is concavely formed in the bottom of the silicon wafer fence in cooperation with the positioning parts.
3. The automatic tab device of claim 1, wherein: the second power device comprises a screw and a motor, the motor is connected to the screw and can drive the screw to rotate, the screw and the slide rod are arranged in parallel, and the slide block is matched with the screw through threads.
4. The automatic tab device of claim 1, wherein: the second lifting device comprises a bracket, a second supporting plate and a second power device, wherein the second supporting plate can slide on the bracket along the vertical direction, and the second power device is connected with the second supporting plate and can drive the second supporting plate to move in the vertical direction.
5. The automatic tab device of claim 4 wherein: the top surface of the second supporting plate is concavely provided with a groove for positioning the side surface of the flower basket, and after the flower basket is positioned, the opening of the flower basket faces the tail end of the silicon wafer transmission device.
6. The automatic tab device of claim 1, wherein: two bearings are arranged at one end of the support, which is relatively low in height, in parallel, and the lantern ring is arranged between the two bearings.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710183347.8A CN106783721B (en) | 2017-03-24 | 2017-03-24 | Silicon wafer suction device and automatic inserting device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710183347.8A CN106783721B (en) | 2017-03-24 | 2017-03-24 | Silicon wafer suction device and automatic inserting device |
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| CN106783721A CN106783721A (en) | 2017-05-31 |
| CN106783721B true CN106783721B (en) | 2023-07-21 |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107634024B (en) * | 2017-07-27 | 2023-11-10 | 罗博特科智能科技股份有限公司 | Silicon wafer batch transfer device |
| CN110391149A (en) * | 2018-04-19 | 2019-10-29 | 无锡喆创科技有限公司 | The method that silicon wafer fragment and suction piece film advance mechanism and silicon wafer fragment suction piece send piece |
| CN109065486B (en) * | 2018-07-05 | 2023-11-17 | 天长市百盛半导体科技有限公司 | Crystalline silicon inserting sheet device of solar cell |
| CN109545889A (en) * | 2018-11-12 | 2019-03-29 | 上海釜川自动化设备有限公司 | 90 degree of steering slicing apparatus of dry type and its implementation method |
| CN109545724B (en) * | 2018-12-20 | 2024-04-09 | 天津中环领先材料技术有限公司 | Basket inserting equipment in silicon wafer cleaning water |
| CN112201728A (en) * | 2020-10-09 | 2021-01-08 | 张言言 | Silicon wafer arrangement mechanism for solar panel processing |
| CN114373698B (en) * | 2021-12-16 | 2023-08-08 | 上海磐云科技有限公司 | Automatic silicon wafer slicing device |
| CN117690849A (en) * | 2023-12-06 | 2024-03-12 | 张家港市超声电气有限公司 | Material taking assembly of inserting machine |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102569151B (en) * | 2010-12-30 | 2015-06-17 | 上海微电子装备有限公司 | Silicon wafer mechanical hand |
| CN102653859A (en) * | 2012-05-10 | 2012-09-05 | 中国电子科技集团公司第四十八研究所 | Lifting and delivering device for automatic wafer loading and unloading of graphite boat |
| CN103199044B (en) * | 2013-03-06 | 2015-06-24 | 北京自动化技术研究院 | Silicon slice conveying device |
| CN203910836U (en) * | 2014-06-19 | 2014-10-29 | 温州海旭科技有限公司 | Full-automatic silicon wafer inserting machine |
| CN206584910U (en) * | 2017-03-24 | 2017-10-24 | 张家港市德昶自动化科技有限公司 | Silicon chip suction piece device and automatic inserting piece device |
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Effective date of registration: 20231101 Address after: No. 1001 Jingang Avenue, Yangshe Town, Zhangjiagang City, Suzhou City, Jiangsu Province, 215600 Patentee after: ZHANGJIAGANG ULTRASONIC & ELECTRIC Co.,Ltd. Address before: Room 1, Lixiang village, yangshe Town, Zhangjiagang City, Suzhou City, Jiangsu Province Patentee before: ZHANGJIAGANG DECHANG AUTOMATIC TECHNOLOGY CO.,LTD. |
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