CN102569151B - Silicon wafer mechanical hand - Google Patents
Silicon wafer mechanical hand Download PDFInfo
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- CN102569151B CN102569151B CN201010618308.4A CN201010618308A CN102569151B CN 102569151 B CN102569151 B CN 102569151B CN 201010618308 A CN201010618308 A CN 201010618308A CN 102569151 B CN102569151 B CN 102569151B
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- silicon chip
- transmission mechanism
- mechanical hand
- bearing plate
- chip mechanical
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Abstract
The invention provides a silicon wafer mechanical hand, which comprises a base plate, a driving mechanism, a transmission mechanism and a carrying plate, wherein the carrying plate is used for carrying a silicon wafer, the driving mechanism and the transmission mechanism are fixedly arranged on the base plate, the driving mechanism drives the carrying plate through the transmission mechanism, and the transmission mechanism passes through the center position of the driving mechanism. Through the silicon wafer mechanical hand provided by the invention, the force outlet directions of the transmission mechanism and the driving mechanism are identical, the driving force loss is avoided, and the transmission efficiency is improved.
Description
Technical field
The present invention relates to lithographic equipment field, particularly a kind of silicon chip mechanical hand for picking and placeing silicon chip.
Background technology
Along with the development of semicon industry, increasing advanced technology has been applied in the middle of this industry.Because the requirement of production to cleanliness factor of integrated circuit and semiconductor device is very high, therefore the work of a lot of link all can not by manually having come.So manipulator is just employed very widely in this field.
In semiconductor lithography process, a kind of silicon chip mechanical hand can be used, by described silicon chip mechanical hand silicon chip is sent on the silicon wafer bearing table in lithographic equipment, then complete a series of exposure actions, realize the transfer of light mask image to silicon chip.
Please refer to Fig. 1, it is the schematic diagram of existing silicon chip mechanical hand.As shown in Figure 1, silicon chip mechanical hand 1 comprises: base plate 10, driving mechanism 11, transmission mechanism 12 and the bearing plate 13 in order to accept silicon chip, described driving mechanism 11 and transmission mechanism 12 are fixed on described base plate 10, described driving mechanism 11 drives described bearing plate 13 by described transmission mechanism 12, and described transmission mechanism 12 is positioned at the lateral location of described driving mechanism 11 and described bearing plate 13.Further, described bearing plate 13 being also fixed with several contact pin hand 130, when transmitting silicon chip, accepting silicon chip by described several contact pin hand 130.
Because described transmission mechanism 12 is positioned at the lateral location of described driving mechanism 11 and described bearing plate 13, silicon chip mechanical hand 1 is made to have following shortcoming:
One, cause transmission mechanism 12, driving mechanism 11 to go out force direction inconsistent, thus a part of actuating force that loss driving mechanism 11 provides; Its two, cause the centroid position of transmission mechanism 12 and motion parts bearing plate 13 not overlap, thus produce eccentric moment, significantly reduce transmission efficiency; Its three, cause the distance of described several contact pin hand 130 to transmission mechanism 12 unequal, thus cause several contact pin hand 130 in uphill process can not be positioned at same level accurately, accept silicon chip time, be easy to damage silicon chip.
In addition; existing transmission mechanism 12 is spherical guide; because spherical guide needs to adopt lubricant grease to lubricate; when silicon chip mechanical hand 1 transmits in silicon chip to lithographic equipment; having a little lubricant grease particle evaporates in lithographic equipment, because the purity requirements of lithographic equipment is very high, even if only have a little lubricant grease particle volatilization; also can have a huge impact lithographic equipment, thus reduce the reliability of lithographic equipment.
Moreover, the material of existing transmission mechanism 12 is the metal magnetic conducting materials such as iron, and driving mechanism 11 will produce certain electromagnetism in the process driving described bearing plate 13, and, silicon chip mechanical hand 1 is in the process transmitting silicon chip, also be usually in certain electromagnetic field environment, thus, electromagnetism is by having magnetic conductivity
Metal transmission mechanism 12 brings certain interference, thus affects the reliability of silicon chip mechanical hand 1.
Summary of the invention
The object of the present invention is to provide a kind of silicon chip mechanical hand, to solve existing silicon chip mechanical hand loss part actuating force, reduce the problem of transmission efficiency.
For solving the problems of the technologies described above, the invention provides a kind of silicon chip mechanical hand, described silicon chip mechanical hand comprises: base plate, driving mechanism, transmission mechanism and the bearing plate in order to accept silicon chip, described driving mechanism and transmission mechanism are fixed on described base plate, described driving mechanism drives described bearing plate by described transmission mechanism, and described transmission mechanism is through the center of described driving mechanism.
Optionally, described transmission mechanism is through the centroid position of described bearing plate.
Optionally, described transmission mechanism is air-float guide rail.
Optionally, described air-float guide rail comprises standing part, motion parts and Compressed Gas joint, and described standing part is fixed on described base plate, and described Compressed Gas joint is fixed on described motion parts.
Optionally, the material of described transmission mechanism is non-magnet material.
Optionally, the shape of described transmission mechanism is prism.
Optionally, described bearing plate is fixed with several contact pin hand, described contact pin hand is equal to the distance of described transmission mechanism.
Optionally, the quantity of described contact pin hand is three, and the shape of described transmission mechanism is tri-prismoid or hexagonal prism.
Optionally, described silicon chip mechanical hand also comprises the vacuum adapter passing into vacuum gas, and described vacuum adapter is fixed on described bearing plate, and is communicated with described contact pin hand.
Optionally, described driving mechanism is voice coil motor.
Optionally, several spring is connected with between described bearing plate and described base plate.
Optionally, described silicon chip mechanical hand also comprises coded scale and coded scale read head, and described coded scale is fixed on described bearing plate, and described coded scale read head is connected with described coded scale.
Silicon chip mechanical hand provided by the invention, described transmission mechanism through the center of described driving mechanism, thus, described drive mechanism and driving mechanism to go out force direction consistent, avoid the loss of actuating force, improve transmission efficiency.
In addition, when described transmission mechanism passes the centroid position of described bearing plate, the centroid position of transmission mechanism and motion parts bearing plate is overlapped, thus no longer produces eccentric moment, further increase transmission efficiency.
Especially, when described transmission mechanism is air-float guide rail, transmission mechanism will not need lubricant grease to lubricate, thus avoid lubricant grease particle and evaporate in lithographic equipment, further, ensure that the reliability of lithographic equipment.
In addition, when the material of described transmission mechanism is non-magnet material, avoids electromagnetism that driving mechanism produces and the interference that electromagnetic field environment residing for silicon chip mechanical hand brings transmission mechanism, thus improve the reliability of silicon chip mechanical hand.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of existing silicon chip mechanical hand;
Fig. 2 is the schematic diagram of the silicon chip mechanical hand of the embodiment of the present invention;
Fig. 3 is the internal structure schematic diagram of the silicon chip mechanical hand of the embodiment of the present invention.
Embodiment
Below in conjunction with the drawings and specific embodiments, silicon chip mechanical hand provided by the invention is described in further detail.According to the following describes and claims, advantages and features of the invention will be clearer.It should be noted that, accompanying drawing all adopts the form that simplifies very much and all uses non-ratio accurately, only in order to object that is convenient, the aid illustration embodiment of the present invention lucidly.
Please refer to Fig. 2, it is the schematic diagram of the silicon chip mechanical hand of the embodiment of the present invention.As shown in Figure 2, silicon chip mechanical hand 2 comprises: base plate 20, driving mechanism 21, transmission mechanism 22 and the bearing plate 23 in order to accept silicon chip, described driving mechanism 21 and transmission mechanism 22 are fixed on described base plate 20, described driving mechanism 21 drives described bearing plate 23 by described transmission mechanism 22, and described transmission mechanism 22 is through the center of described driving mechanism 21.
Silicon chip mechanical hand 2 provided by the invention, described transmission mechanism 22 through the center of described driving mechanism 21, thus, described drive mechanism 22 and driving mechanism 21 to go out force direction consistent, avoid the loss of actuating force, improve transmission efficiency.
Further, described transmission mechanism 22 is through the centroid position of described bearing plate 23.When described transmission mechanism 22 passes the centroid position of described bearing plate 23, the centroid position of transmission mechanism 22 and motion parts bearing plate 23 is overlapped, thus no longer produces eccentric moment, further increase transmission efficiency.
In the present embodiment, described transmission mechanism 22 is air-float guide rail.Because described transmission mechanism 22 is air-float guide rail, lubricant grease will not be needed to lubricate, thus avoid lubricant grease particle and evaporate in lithographic equipment, further, ensure that the reliability of lithographic equipment.
As shown in Figure 3, it is the internal structure schematic diagram of the silicon chip mechanical hand of the embodiment of the present invention.Please refer to Fig. 2 and Fig. 3, further, described air-float guide rail comprises standing part 222, motion parts 221 and Compressed Gas joint 223, and described standing part 222 is fixed on described base plate 20, and described Compressed Gas joint 232 is fixed on described motion parts 221.When described silicon chip mechanical hand 2 works, Compressed Gas joint 223 is utilized to pass into Compressed Gas, thus between described standing part 222 and motion parts 221, form the air film of certain rigidity, avoid producing friction between standing part 222 and motion parts 221, thus prevent the generation of friction particles, further, ensure that the reliability of lithographic equipment.
Further, the material of described transmission mechanism 22 is non-magnet material.Because the material of described transmission mechanism 22 is non-magnet material, avoid electromagnetism that driving mechanism 22 produces and the interference that electromagnetic field environment residing for silicon chip mechanical hand 2 brings transmission mechanism 22, thus improve the reliability of silicon chip mechanical hand 2.Such as, the material of described transmission mechanism 22 can be pottery, Austenitic stainless steel etc.
Further, the shape of described transmission mechanism 22 is prism, concrete as triangular prism, quadrangular, pentagonal prism, six prisms etc.When the centroid position of described transmission mechanism 22 through the center of described driving mechanism 21 and described bearing plate 23, if described transmission mechanism 22 is cylinder, then described driving mechanism 21 and described bearing plate 23 are easy to occurred level rotation, thus cause on bearing plate 23 accept silicon chip damage or bearing plate 23 on accept silicon chip and base plate 20 not parallel, affect follow-up photoetching process.Therefore, in the present embodiment, preferably, the shape of described transmission mechanism 22 is prism, avoids described driving mechanism 21 and described bearing plate 23 occurred level to rotate, thus improves the reliability of silicon chip mechanical hand 2.
In the present embodiment, described bearing plate 23 is fixed with several contact pin hand 230, described contact pin hand 230 is equal to the distance of described transmission mechanism 22.When transmitting silicon chip, accept silicon chip by described several contact pin hand 230.When described contact pin hand 230 is equal to the distance of described transmission mechanism 22, can make silicon chip mechanical hand 2 rise accept silicon chip process in, several contact pin hand 230 can be positioned at same level accurately, thus when accepting silicon chip, the damage problem of silicon chip can not occur.
As one embodiment of the present of invention, the quantity of described contact pin hand 230 is three, and the shape of described transmission mechanism 22 is tri-prismoid or hexagonal prism.
In the present embodiment, described silicon chip mechanical hand 2 also comprises the vacuum adapter 231 passing into vacuum gas, and described vacuum adapter 231 is fixed on described bearing plate 23, and is communicated with described contact pin hand 230.Thus realize the vacuum suction of described contact pin hand 230 pairs of silicon chips, further, ensure that the reliability of lithographic equipment.
In the present embodiment, described Drive Structure 21 is voice coil motor.Specifically please refer to Fig. 3, voice coil motor comprises voice coil motor stator 210 and voice coil motor mover 211, described voice coil motor stator 210 is fixed on described base plate 20, and described voice coil motor mover 211 is connected with described air-float guide rail, thus drives loading plate 23 along described air-float guide rail.
Further, between described bearing plate 23 and described base plate 20, be connected with several spring 24, by described spring 24, make silicon chip mechanical hand 2 have a buffer structure in the vertical, prevent silicon chip at the play of longitudinal direction, improve the reliability that silicon chip transmits.
Further, described silicon chip mechanical hand 2 also comprises coded scale 25 and coded scale read head 26, and described coded scale 25 is fixed on described bearing plate 23, and described coded scale read head 26 is connected with described coded scale 25.By described coded scale 25 and coded scale read head 26, accurately can control the rise and fall height of described silicon chip mechanical hand 2 in silicon chip crawl process, thus improve the reliability of silicon chip crawl.
Foregoing description is only the description to present pre-ferred embodiments, any restriction not to the scope of the invention, and any change that the those of ordinary skill in field of the present invention does according to above-mentioned disclosure, modification, all belong to the protection range of claims.
Claims (8)
1. a silicon chip mechanical hand, comprise: base plate, driving mechanism, transmission mechanism and the bearing plate in order to accept silicon chip, described driving mechanism and transmission mechanism are fixed on described base plate, described driving mechanism drives described bearing plate by described transmission mechanism, described transmission mechanism is through the center of described driving mechanism, described transmission mechanism is through the centroid position of described bearing plate, the shape of described transmission mechanism is prism, described bearing plate is fixed with several contact pin hand, described contact pin hand is equal to the distance of described transmission mechanism, it is characterized in that, described silicon chip mechanical hand also comprises coded scale and coded scale read head, described coded scale is fixed on described bearing plate, described coded scale read head is connected with described coded scale.
2. silicon chip mechanical hand as claimed in claim 1, it is characterized in that, described transmission mechanism is air-float guide rail.
3. silicon chip mechanical hand as claimed in claim 2, it is characterized in that, described air-float guide rail comprises standing part, motion parts and Compressed Gas joint, and described standing part is fixed on described base plate, and described Compressed Gas joint is fixed on described motion parts.
4. silicon chip mechanical hand as claimed in claim 1, it is characterized in that, the material of described transmission mechanism is non-magnet material.
5. silicon chip mechanical hand as claimed in claim 1, it is characterized in that, the quantity of described contact pin hand is three, and the shape of described transmission mechanism is tri-prismoid or hexagonal prism.
6. silicon chip mechanical hand as claimed in claim 1, it is characterized in that, described silicon chip mechanical hand also comprises the vacuum adapter passing into vacuum gas, and described vacuum adapter is fixed on described bearing plate, and is communicated with described contact pin hand.
7. the silicon chip mechanical hand as described in any one in Claims 1-4, is characterized in that, described driving mechanism is voice coil motor.
8. the silicon chip mechanical hand as described in any one in Claims 1-4, is characterized in that, is connected with several spring between described bearing plate and described base plate.
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CN201010618308.4A CN102569151B (en) | 2010-12-30 | 2010-12-30 | Silicon wafer mechanical hand |
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CN201010618308.4A CN102569151B (en) | 2010-12-30 | 2010-12-30 | Silicon wafer mechanical hand |
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CN102569151A CN102569151A (en) | 2012-07-11 |
CN102569151B true CN102569151B (en) | 2015-06-17 |
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Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103901735B (en) * | 2012-12-28 | 2016-02-03 | 上海微电子装备有限公司 | Silicon chip penetrating mechanism |
CN103901732B (en) * | 2012-12-28 | 2016-08-24 | 上海微电子装备有限公司 | Silicon chip connection device |
CN105538776A (en) * | 2015-12-16 | 2016-05-04 | 安徽黄山恒久链传动有限公司 | Elastic rack for automatic feeding mechanical arm of press |
CN106783721B (en) * | 2017-03-24 | 2023-07-21 | 张家港市德昶自动化科技有限公司 | Silicon wafer suction device and automatic inserting device |
CN109597279B (en) * | 2017-09-30 | 2023-09-29 | 上海微电子装备(集团)股份有限公司 | Vacuum adsorption hand, substrate handing-over device and photoetching machine |
CN110067811B (en) * | 2019-05-30 | 2024-03-26 | 中国工程物理研究院机械制造工艺研究所 | Air-floating rotary table |
CN111037580B (en) * | 2019-12-30 | 2021-05-04 | 武汉大学 | Multi-purpose carborundum wafer transmission machinery hand |
CN113496931B (en) * | 2020-04-03 | 2023-06-02 | 上海微电子装备(集团)股份有限公司 | Silicon wafer handover device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN201282136Y (en) * | 2008-10-24 | 2009-07-29 | 陈百捷 | Manipulator for fetching and delivery silicon chip |
CN201380488Y (en) * | 2009-03-06 | 2010-01-13 | 上海微电子装备有限公司 | Silicon-chip mechanical hand |
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FR2932717B1 (en) * | 2008-06-24 | 2011-03-25 | Dubuit Mach | PRINTING MACHINE. |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN201282136Y (en) * | 2008-10-24 | 2009-07-29 | 陈百捷 | Manipulator for fetching and delivery silicon chip |
CN201380488Y (en) * | 2009-03-06 | 2010-01-13 | 上海微电子装备有限公司 | Silicon-chip mechanical hand |
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Address after: 201203 Pudong New Area East Road, No. 1525, Shanghai Co-patentee after: Shanghai Micro And High Precision Mechine Engineering Co., Ltd. Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Pudong New Area East Road, No. 1525, Shanghai Co-patentee before: Shanghai Micro And High Precision Mechine Engineering Co., Ltd. Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |