CN107689403B - Centralized processing equipment for sheet bodies - Google Patents
Centralized processing equipment for sheet bodies Download PDFInfo
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- CN107689403B CN107689403B CN201710892028.4A CN201710892028A CN107689403B CN 107689403 B CN107689403 B CN 107689403B CN 201710892028 A CN201710892028 A CN 201710892028A CN 107689403 B CN107689403 B CN 107689403B
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- 238000001514 detection method Methods 0.000 claims abstract description 31
- 238000005520 cutting process Methods 0.000 claims abstract description 20
- 230000000903 blocking effect Effects 0.000 claims description 10
- 230000009471 action Effects 0.000 claims description 9
- 230000007246 mechanism Effects 0.000 claims description 6
- 230000001105 regulatory effect Effects 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 4
- 230000005484 gravity Effects 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 55
- 229910052710 silicon Inorganic materials 0.000 abstract description 55
- 239000010703 silicon Substances 0.000 abstract description 55
- 235000012431 wafers Nutrition 0.000 description 55
- 238000004519 manufacturing process Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 10
- 238000007599 discharging Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 238000001179 sorption measurement Methods 0.000 description 6
- 210000000078 claw Anatomy 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 238000010606 normalization Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000033764 rhythmic process Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention provides a centralized processing device for sheet bodies, which comprises: the device comprises a first device, a second device and a third device, wherein the first device is used for detecting a sheet body; the second device is used for cutting the silicon wafer which is detected to be qualified by the first device; and the third device is used for removing the silicon chip cut by the second device. In the invention, the first device, the second device and the third device are arranged in a centralized way, and the detection and the cutting of the sheet body are automatically finished, so that the detection and the cutting of the sheet body are integrated and the automation level is greatly improved.
Description
Technical Field
The present invention relates generally to automated battery production lines, and more particularly to a sheet centralized processing apparatus.
Background
At present, the demand of batteries is increasing, and in the battery production process, the technological processes of regulation, detection, cutting and the like are required to be carried out on silicon wafers or battery pieces and the like. However, the conventional processes of silicon wafer and battery piece, such as trimming, detecting and cutting, are carried out independently, so that the automation rate of battery production is affected, and the efficiency of battery production is greatly reduced. In addition, the process of partial manual intervention is adopted, so that the production efficiency is greatly reduced, the safety problem and the working strength problem are caused, and along with the improvement of the labor cost, the overall cost of battery production is objectively raised.
Therefore, how to improve the integration and automation level of the regulation, detection and cutting of the silicon chip, the battery piece and the like, thereby improving the production efficiency of the battery, reducing the labor cost and avoiding the occurrence of safety problems is an urgent problem to be solved in the industry.
Disclosure of Invention
It is a primary object of the present invention to overcome at least one of the above-mentioned drawbacks of the prior art and to provide a centralized processing device for sheets that is very highly integrated and automated.
In order to achieve the aim of the invention, the invention adopts the following technical scheme:
a sheet body centralized processing apparatus, the sheet body centralized processing apparatus comprising:
a first device for detecting the sheet;
the second device is used for cutting the sheet body which is detected to be qualified by the first device;
and the third device is used for removing the sheet body cut by the second device.
According to an embodiment of the present invention, the sheet centralized processing apparatus further includes a fourth device for regularizing sheets;
the first device is used for detecting the sheet body after the fourth device is regular.
According to an embodiment of the present invention, the sheet centralized processing apparatus further includes a turntable, and the fourth device, the first device, the second device, and the third device are sequentially disposed around the turntable, and the handling device is configured to move the sheet between the fourth device, the first device, the second device, and the third device.
According to an embodiment of the present invention, the handling device includes four carrying tables, the four carrying tables are located at a first position, a second position, a third position and a fourth position, the four positions are in one-to-one correspondence with the four devices, the turntable drives the four carrying tables to rotate among the four positions in sequence, and each carrying table is provided with a suction cup, and the suction cup is used for adsorbing the sheet on the corresponding carrying table.
According to an embodiment of the present invention, the fourth device includes a leveling platform, a pushing plate and a blocking plate, where the leveling platform is used for carrying the sheet body, the pushing plate is disposed corresponding to a first direction of the leveling platform and is used for pushing the sheet body to move on the leveling platform, and the blocking plate is disposed corresponding to a second direction of the leveling platform and is used for limiting a moving position of the sheet body on the leveling platform, and the second direction is opposite to the first direction.
According to one embodiment of the invention, the leveling table is connected with a guide post and a telescopic cylinder, the telescopic cylinder drives the leveling table to extend up and down along the guide post, a through hole is formed in the bearing table, the leveling table is higher than the bearing table when leveling sheets, and the leveling table passes through the through hole and is lower than the bearing table after leveling is completed, so that the leveled sheets on the bearing table are adsorbed on the bearing table under the action of gravity and suction of suction cups on the bearing table.
According to an embodiment of the present invention, the first device includes an upper detection camera and a lower detection camera, where the upper detection camera and the lower detection camera are disposed above and below the carrying platform corresponding to the position.
According to an embodiment of the present invention, a dust-proof glass is further disposed between the lower detection camera and the second position of the carrying platform.
According to an embodiment of the present invention, the second device includes a laser head for cutting the sheet body after the first device is qualified.
According to an embodiment of the present invention, the third device includes a rotary blanking mechanism that removes the sheet on the carrying table at the fourth position from the sheet centralized processing apparatus.
According to the technical scheme, the centralized sheet processing equipment has the advantages and positive effects that:
in the invention, the first device, the second device and the third device are arranged in a centralized way, and the detection and the cutting of the sheet body are automatically finished, so that the detection and the cutting of the sheet body are integrated and the automation level is greatly improved.
Drawings
Various objects, features and advantages of the present invention will become more apparent from the following detailed description of the preferred embodiments of the invention, when taken in conjunction with the accompanying drawings. The drawings are merely exemplary illustrations of the invention and are not necessarily drawn to scale. In the drawings, like reference numerals refer to the same or similar parts throughout. Wherein:
fig. 1 is a schematic view showing the structure of a sheet centralized processing apparatus of the present invention in an exemplary embodiment.
Fig. 2 is a schematic structural view of a fourth device in the sheet centralized processing apparatus of the present invention shown in an exemplary embodiment.
Fig. 3 is a schematic view showing the structure of a first device in the sheet centralized processing apparatus of the present invention in an exemplary embodiment.
Fig. 4 is a schematic view showing the structure of a second device in the sheet centralized processing apparatus of the present invention in an exemplary embodiment.
Fig. 5 is a schematic view showing the structure of a third device in the sheet centralized processing apparatus of the present invention in an exemplary embodiment.
Wherein reference numerals are as follows:
1. fourth means; 10. a base; 11. a telescopic cylinder; 111. a cylinder; 112. a piston; 121. 122, a guide post; 13. a lifting frame; 141. 142, a normalization platform; 15. a support post; 161. 162, pushing plate; 17. a pushing cylinder; 18. a blocking plate; 2. a first device; 21. a detection frame; 22. a top detection camera; 23. a lower detection camera; 24. dust-proof glass; 3. a second device; 31. a lifting device; 32. a traversing device; 33. a laser head; 4. a third device; 401. a lifting cylinder; 402. a grabbing frame; 403. a suction cup; 41. a first rotating arm; 410. a first grasping structure; 42. a second rotating arm; 420. a second grasping structure; 43. a driving device; 44. a rotating shaft; 5. a turntable; 51. a rotating plate; 52. a turntable; 61. 62, 63, 64, a carrying table; 7. a first discharging position; 8. a second discharging position; 9. and (3) a silicon wafer.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus detailed descriptions thereof will be omitted.
In the following description of different examples of the invention, reference is made to the accompanying drawings, which form a part hereof, and in which are shown by way of illustration different exemplary structures, systems, and steps in which aspects of the invention may be practiced. It is to be understood that other specific arrangements of parts, structures, example devices, systems, and steps may be utilized and structural and functional modifications may be made without departing from the scope of the present invention. Moreover, although the terms "top," "bottom," "front," "rear," "side," and the like may be used herein to describe various example features and elements of the invention, these terms are used herein for convenience only, e.g., according to the orientation of the examples depicted in the figures. Nothing in this specification should be construed as requiring a particular three-dimensional orientation of the structure in order to fall within the scope of the invention.
The sheet centralized processing apparatus of the present invention may be applied to various occasions, and for convenience of description herein, only the specific embodiment of the sheet centralized processing apparatus in the battery production line will be described, but the structure of the sheet centralized processing apparatus is not limited to the battery production line.
Fig. 1 is a schematic view showing the structure of a sheet centralized processing apparatus of the present invention in an exemplary embodiment. As shown in fig. 1, the sheet body centralized processing apparatus of this embodiment is used for centralized processing of sheet bodies, and is applicable to centralized processing of silicon wafers and battery sheets in the field of battery production. The operations of trimming, inspecting, and cutting the wafer 9 are collectively described in detail below.
The sheet centralized processing apparatus of this embodiment includes a fourth device 1, a first device 2, a second device 3, and a third device 4. The fourth device 1 is used for regulating the silicon wafer 9; the first device 2 is used for detecting the silicon wafer 9 regulated by the fourth device 1; the second device 3 is used for cutting the silicon wafer 9 which is qualified by the first device 2; the third device 4 is used for removing the silicon wafer 9 cut by the second device 3 from the wafer body centralized processing equipment.
In this embodiment, as shown in fig. 3 and 4 in combination with fig. 1, the sheet centralized processing apparatus further includes a turntable 5, and the fourth device 1, the first device 2, the second device 3, and the third device 4 are sequentially disposed around the turntable 5. The turntable 5 includes a turntable 51 and a turntable 52, and the turntable 52 drives the turntable 51 to rotate. The rotating plate 51 has a square structure, and four sides thereof correspond to the fourth device 1, the first device 2, the second device 3 and the third device 4, respectively. The four sides of the rotating plate are respectively provided with structures for bearing the silicon wafers 9, namely bearing tables 61, 62, 63 and 64, and under the rotating action of the rotating disc 52, the four bearing tables 61, 62, 63 and 64 are sequentially switched at positions corresponding to the fourth device 1, the first device 2, the second device 3 and the third device 4. Suction cups are provided on each of the carrying tables 61, 62, 63, 64 to suck the silicon wafer 9 thereon and sequentially convey the silicon wafer 9 to positions corresponding to the fourth apparatus 1, the first apparatus 2, the second apparatus 3, and the third apparatus 4 when the rotary plate 51 rotates. The position corresponding to the fourth device 1 is the first position, the position corresponding to the first device 2 is the second position, the position corresponding to the second device 3 is the third position, and the position corresponding to the third device 4 is the fourth position. In practice, the adsorption holes may be directly opened in the stages 61, 62, 63, 64, so that the silicon wafer 9 may be directly adsorbed through the adsorption holes.
Fig. 2 is a schematic structural view of a fourth device in the sheet centralized processing apparatus of the present invention shown in an exemplary embodiment. As shown in fig. 2, the fourth apparatus 1 in this embodiment includes a base 10, a telescopic cylinder 11, guide posts 121, 122, an elevator 13, leveling tables 141, 142, a column 15, pushing plates 161, 162, a pushing cylinder 17, and a blocking plate 18.
In this embodiment, the base 10 is fixedly arranged for mounting the telescopic cylinder 11 and the guide posts 121, 122, and the base 10 is not necessarily required, but the above mechanism may be mounted in other ways. The telescopic cylinder 11 comprises a cylinder body 111 and a piston 112, wherein the cylinder body 111 is fixedly arranged on the base 10, and a telescopic part of the piston 112 is connected with the lifting frame 13 so as to drive the lifting frame 13 to move up and down. The telescopic cylinder 111 can be a cylinder or a hydraulic cylinder, and can be actually replaced by a motor driving a screw nut. In this embodiment, two guide posts 121, 122 are symmetrically arranged left and right, and the number of the guide posts can be determined according to the strength requirement in practical application. The lower part of the lifting frame 13 is connected with the piston 112 and guided to move up and down by the guide posts 121 and 122, and the upper part of the lifting frame 13 is used for installing the gauge leveling tables 141 and 142, the pushing plates 161 and 162, the pushing cylinder 17 and the blocking plate 18.
In this embodiment, the leveling plates 141, 142 are two rectangular plates to facilitate the passage of two rectangular holes on the bearing tables 61, 62, 63, 64, and in other applications, the shapes of the holes on the leveling plates and the bearing tables can be changed according to actual needs, and the number of the holes on the leveling plates and the bearing tables can be one, two, three or more. In this embodiment, the lower parts of the regulated platforms 141, 142 are fixedly mounted on the lifting frame 13 through the supporting columns 15, and the connection mode can be bolt connection or plug-in connection and welding. In this embodiment, the pushing plates 161, 162 have a two-plate structure, the pushing surfaces of which are perpendicular to each other, and the lower portions of which are mounted on the pushing cylinder 17. The pushing cylinder 17 can be an air cylinder or a hydraulic cylinder, and the movement direction is along the diagonal direction of the lifting frame 13, and the pushing plates 161 and 162 are driven to move along the diagonal direction of the lifting frame 13 when in action, so that the pushing plates 161 and 162 push the silicon wafer 9 to move on the leveling tables 141 and 142 from two directions. The lower part of the blocking plate 18 is arranged above the lifting frame 13, and the positions of the blocking plate 18 correspond to the pushing plates 161 and 162 so as to achieve the function of thrust, wherein the thrust can be a combination of mechanical function and electronic function, so that the silicon wafer 9 achieves the regular function on the regular leveling tables 141 and 142.
Fig. 3 is a schematic view showing the structure of a first device in the sheet centralized processing apparatus of the present invention in an exemplary embodiment. As shown in fig. 3, the first device in this embodiment includes a detection frame 21, an upper detection camera 22, and a lower detection camera 23. Wherein, the detection frame 21 is vertically arranged for installing an upper detection camera 22 and a lower detection camera 23, and the detection frame 21 is also provided with an electronic processing structure for processing detection information. The upper detecting camera 22 is mounted on the upper part of the detecting frame 21 and corresponds to the upper part of the silicon wafer 9 on the bearing table 62 at the second position, and is used for detecting the upper information condition of the silicon wafer 9 by shooting, and a light emitting structure can be further arranged on the upper detecting camera 22 to assist shooting. The lower detecting camera 23 is mounted on the lower part of the detecting frame 21 and corresponds to the lower part of the silicon wafer 9 on the bearing table 62 at the second position, and is used for detecting the condition of the lower information of the silicon wafer 9 by shooting, and a light emitting structure can be further arranged on the lower detecting camera 23 to assist shooting. In addition, in this embodiment, a dust-proof glass 24 is further disposed between the lower detection camera 23 and the carrying table 62 at the second position, so as to prevent dust or impurities from directly falling onto the lower detection camera 23, and to protect the lower detection camera 23.
Fig. 4 is a schematic view showing the structure of a second device in the sheet centralized processing apparatus of the present invention in an exemplary embodiment. As shown in fig. 4, the second device 3 in this embodiment includes a traversing device 32, and a laser head 33 is mounted on the traversing device 32, and the traversing device 32 drives the first device 2 to cut the silicon wafer 9 after being qualified. The second device 3 may further comprise a lifting device 31, a traversing device 32 and a laser head 33. The second device 3 may also only comprise a rotating device, the laser head 33 is mounted on the rotating device, and rotates along a preset direction under the drive of the rotating device, so as to cut the silicon wafer 9 after the first device 2 is qualified. Wherein, elevating gear 31 vertical setting, lower part fixed setting is provided with the lifting rail on the vertical face, and sideslip device 32 installs on elevating gear 31 to drive along lifting rail reciprocates through devices such as motor. The traversing device 32 is horizontally arranged, the first end of the traversing device is installed on the lifting device 31, the second end of the traversing device is provided with the laser head 33, and the traversing device 32 drives the laser head 33 to move back and forth through a cylinder, a hydraulic cylinder or a motor and the like. The laser head 33 is used for cutting the silicon wafer 9 after the first device 2 is qualified, and the laser head 33 corresponds to the silicon wafer 9 on the bearing table 63 at the third position by adjusting the lifting device 31 and the traversing device 32, so as to perform cutting action on the silicon wafer 9, wherein the cutting can comprise slicing, etching, slotting, scoring and the like.
Fig. 5 is a schematic view showing the structure of a third device in the sheet centralized processing apparatus of the present invention in an exemplary embodiment. As shown in fig. 5, the third device 4 in this embodiment is a rotary blanking mechanism that removes the silicon wafer 9 on the carrier 64 at the fourth position from the wafer centralized processing apparatus. In practical applications, the use of the rotary blanking mechanism is not limited to the realization of the blanking effect of the silicon wafer 9.
In this embodiment, the third device 4 comprises a first swivel arm 41, a second swivel arm 42 and a drive device 43. Wherein the first rotating arm 41 and the second rotating arm 42 have the same rotation center, are in an integrated structure in the embodiment, and are in transmission connection with the driving device 43 through the rotating shaft 44, and the driving device 43 is a motor or an air cylinder or a hydraulic cylinder, so that the first rotating arm 41 and the second rotating arm 42 are driven to be switched between two positions respectively. In this embodiment, the center lines of the first rotating arm 41 and the second rotating arm 42 are perpendicular to each other, the first rotating arm 41 is switched between the material taking position and the first material placing position 7, the second rotating arm 42 is switched between the second material placing position 8 and the material taking position, specifically, when the first rotating arm 41 is located at the material taking position, the second rotating arm 42 is located at the second material placing position 8, and when the first rotating arm 41 is located at the first material placing position 7, the material taking position in this embodiment is the fourth position corresponding to the carrying table 64.
In addition, in this embodiment, the first rotating arm 41 is provided with a first grasping structure 410 at an end opposite to the position of the rotating shaft 44. The second swivel arm 42 is provided with a second gripping formation 420 at an end opposite the location of the swivel shaft 44. In this embodiment, the first gripping structure 410 and the second gripping structure 420 have the same structure, but are not limited to the same structure in actual operation, as long as reliable gripping of the silicon wafer 9 can be achieved.
The first grabbing structure 410 and the second grabbing structure 420 in this embodiment each comprise a lifting cylinder 401, a grabbing frame 402 and a sucker 403. The lifting cylinder 401 is mounted at the end of the first rotating arm 41 and the second rotating arm 42, and may be a cylinder or a hydraulic cylinder, and lifting is achieved by piston movement. The gripping frame 402 is connected to the piston of the lifting cylinder 401 in the form of a claw, in this embodiment four claws in total, in practice two, three or more, even only one. The suction cups 403 are mounted at the tail ends of the claws of the gripping frame 402, and are used for gripping the silicon wafer 9 through vacuum adsorption, and then the silicon wafer 9 is respectively conveyed to the first discharging position 7 and the second discharging position 8 from the material taking position through the driving of the driving device 43.
In this embodiment, the suction cup 403 is controlled by gas to adsorb and release the silicon wafer 9, the lifting of the gripping frame 402 is realized by the lifting action of the lifting cylinder 401, and then the movement of the silicon wafer 9 is realized by the driving device 43. Because the first rotating arm 41 and the second rotating arm 42 are linked in the embodiment, the blanking efficiency of the silicon wafer 9 can be doubled, the efficiency and the rhythm of the whole battery production line are accelerated, and the requirements of modern automatic production are met.
The working procedure of the sheet centralized processing apparatus of this embodiment is as follows:
firstly, the silicon wafer 9 is placed on the bearing table 61 at the first position by a manual or mechanical arm, the telescopic cylinder 11 acts and extends upwards, the leveling tables 141 and 142 move upwards by the driving of the lifting frame 13 and the supporting column 15, and finally the silicon wafer 9 is jacked to a position higher than the bearing table 61 until stopping after penetrating through corresponding holes on the bearing table 61. The pushing cylinder 17 acts to drive the pushing plates 161 and 162 to move, so that the silicon wafer 9 is gradually pushed to move in the diagonal direction until the silicon wafer is finally propped against the blocking plate 18 to stop. After finishing the regulation, the pushing cylinder 17 acts reversely to drive the pushing plates 161 and 162 to return, the telescopic cylinder 11 retracts, and the silicon wafer 9 is driven to move downwards through the lifting frame 13, the supporting column 15 and the leveling tables 141 and 142 until the silicon wafer 9 is put back on the bearing table 61. The telescopic cylinder 11 continues to retract until the components are brought back to the rest, waiting for the next cycle.
Then, the chuck on the stage 61 is operated to adsorb the silicon wafer 9 to the stage 61 by vacuum adsorption. The turntable 52 acts to drive the rotating plate 51 to rotate, so that the carrying table 61 rotates to the second position, and at this time, the silicon wafer 9 moves to the second position as the carrying table 62, and the upper detecting camera 22 and the lower detecting camera 23 detect and collect upper information and lower information of the silicon wafer 9 respectively, process the upper information and the lower information, and send the processed information to the information processing device.
Similarly, the silicon wafer 9 is moved to the third position and is placed on the stage 63. At this time, the laser head 33 is enabled to correspond to the position of the silicon wafer 9 to be cut by adjusting the lifting device 31 and the traversing device 32, and the laser head 33 is started to perform the set cutting action on the silicon wafer. After all cutting actions on the silicon wafer 9 are completed, the laser head 33, the lifting device 31 and the traversing device 32 can be selectively reset.
Likewise, the silicon wafer 9 is again moved to the fourth position and is located on the carrier 64. At this time, the sucking disc on the carrying table 64 acts to cancel the adsorption to the silicon wafer 9, so that the silicon wafer 9 is released. The lifting cylinder 401 drives the grabbing frame 402 to descend until the sucker 403 contacts the silicon wafer 9, the silicon wafer 9 is grabbed through vacuum adsorption, then the lifting cylinder 401 drives the grabbing frame 402 to ascend, then the driving device 43 drives the first rotating arm 41 and the second rotating arm 42 to rotate, one of the two rotating arms moves the grabbed silicon wafer to the first discharging position 7 or the second discharging position 8, at the moment, the other rotating arm 41 or 42 moves to the material taking position (namely the fourth position) to carry out the next discharging action of grabbing the silicon wafer 9, and the driving device 43 drives the integrated fork-shaped structure of the first rotating arm 41 and the second rotating arm 42 to swing left and right, so that double discharging speed is realized, and the efficiency is very high.
The embodiment has high automation degree, no personnel participation in the whole process, and realizes the centralized treatment of the silicon wafer 9 in the process of regulation, detection and cutting, thereby realizing the continuity of the production line and greatly improving the efficiency of battery production. In addition, the third device 4 adopts a rotary blanking mechanism, and double blanking speed can be realized through swinging switching, so that the device is very efficient. The invention has very high market value and great popularization prospect.
In addition, it should be noted that the different structures of the above embodiments may be mutually cross-combined, so that the description will not be given here, and all cross-combined schemes are intended to be included in the protection scope of the present invention.
It will be appreciated by persons skilled in the art that the particular structures and processes shown in the above detailed description are illustrative only and not limiting. Moreover, those skilled in the art to which the invention pertains will appreciate that various features described above may be combined in any number of possible ways to form new embodiments, or that other modifications are within the scope of the invention.
Claims (4)
1. A sheet body centralized processing apparatus, characterized in that the sheet body centralized processing apparatus includes:
a first device for detecting the sheet;
the second device is used for cutting the sheet body which is detected to be qualified by the first device;
a third device for removing the sheet cut by the second device;
the sheet centralized processing equipment further comprises a fourth device, wherein the fourth device is used for regulating the sheets;
the first device is used for detecting the sheet body regulated by the fourth device;
the sheet centralized processing equipment further comprises a rotary table and a carrying device, wherein the fourth device, the first device, the second device and the third device are sequentially arranged around the rotary table, and the carrying device is used for moving sheets among the fourth device, the first device, the second device and the third device;
the carrying device comprises four bearing tables, the four bearing tables are respectively located at a first position, a second position, a third position and a fourth position, the four positions are respectively corresponding to the fourth device, the first device, the second device and the third device one by one, the turntable drives the four bearing tables to rotate among the four positions in sequence, and each bearing table is provided with a sucker which is used for adsorbing a sheet body on the corresponding bearing table;
the fourth device comprises a regular platform, a pushing plate and a blocking plate, wherein the regular platform is used for bearing the sheet body, the pushing plate is arranged corresponding to a first direction of the regular platform and used for pushing the sheet body to move on the regular platform, the blocking plate is arranged corresponding to a second direction of the regular platform and used for limiting the moving position of the sheet body on the regular platform, and the second direction is opposite to the first direction;
the leveling table is connected with a guide post and a telescopic cylinder, the telescopic cylinder drives the leveling table to stretch up and down along the guide post, a perforation is arranged on the bearing table, the leveling table is higher than the bearing table when leveling sheets, and the leveling table passes through the perforation to be lower than the bearing table after leveling is finished, so that the leveled sheets on the bearing table are adsorbed on the bearing table under the action of gravity and suction force of suction cups on the bearing table;
the first device comprises an upper detection camera and a lower detection camera, and the upper detection camera and the lower detection camera are respectively arranged up and down on the bearing table corresponding to the corresponding positions.
2. The sheet body centralized processing apparatus of claim 1, wherein a dust-proof glass is further disposed between the lower detection camera and the second position of the carrying platform.
3. The sheet body centralized processing apparatus as claimed in claim 1, wherein the second device includes a laser head for cutting the sheet body after the first device is inspected to be acceptable.
4. The sheet body centralized processing apparatus of claim 1, wherein the third means comprises a rotary blanking mechanism that removes a sheet body located on a carrying table at the fourth position from the sheet body centralized processing apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710892028.4A CN107689403B (en) | 2017-09-27 | 2017-09-27 | Centralized processing equipment for sheet bodies |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710892028.4A CN107689403B (en) | 2017-09-27 | 2017-09-27 | Centralized processing equipment for sheet bodies |
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| Publication Number | Publication Date |
|---|---|
| CN107689403A CN107689403A (en) | 2018-02-13 |
| CN107689403B true CN107689403B (en) | 2024-03-01 |
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| CN201710892028.4A Active CN107689403B (en) | 2017-09-27 | 2017-09-27 | Centralized processing equipment for sheet bodies |
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| CN111933555B (en) * | 2020-09-16 | 2021-02-19 | 深圳平晨半导体科技有限公司 | Efficient multi-station synchronous die bonding device and method |
| CN116124796A (en) * | 2023-02-15 | 2023-05-16 | 苏州天准科技股份有限公司 | Appearance detection equipment for photovoltaic cell assembly |
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| JP2002178291A (en) * | 2000-12-14 | 2002-06-25 | Fuji Photo Film Co Ltd | Sheet body cutting method and device |
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| JP2002178291A (en) * | 2000-12-14 | 2002-06-25 | Fuji Photo Film Co Ltd | Sheet body cutting method and device |
| JP2005219134A (en) * | 2004-02-03 | 2005-08-18 | Fuji Photo Film Co Ltd | Detecting method, detector and cutting apparatus |
| WO2015172408A1 (en) * | 2014-05-16 | 2015-11-19 | 深圳市华星光电技术有限公司 | Veneer glass substrate cutting method |
| CN204286343U (en) * | 2014-12-10 | 2015-04-22 | 缙云县先锋工具有限公司 | A kind of saw blade end surface flatness detecting device |
| CN107052590A (en) * | 2017-01-05 | 2017-08-18 | 湖北工业大学 | A kind of multifunctional solar energy battery piece laser scribing means |
| CN106876650A (en) * | 2017-03-21 | 2017-06-20 | 无锡奥特维智能装备有限公司 | Cell polar ear leveling, detection and cutting system |
| CN207474485U (en) * | 2017-09-27 | 2018-06-08 | 无锡奥特维科技股份有限公司 | Sheet body focuses on equipment |
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