CN111933555B - Efficient multi-station synchronous die bonding device and method - Google Patents
Efficient multi-station synchronous die bonding device and method Download PDFInfo
- Publication number
- CN111933555B CN111933555B CN202010971527.4A CN202010971527A CN111933555B CN 111933555 B CN111933555 B CN 111933555B CN 202010971527 A CN202010971527 A CN 202010971527A CN 111933555 B CN111933555 B CN 111933555B
- Authority
- CN
- China
- Prior art keywords
- rod
- mounting plate
- suction nozzle
- movable
- dispensing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
Abstract
The invention relates to a high-efficiency multi-station synchronous die bonder which comprises a bracket, a manipulator and a wafer positioning jig, wherein a mounting plate is arranged at the movable end of the manipulator, and a plurality of rotating shafts are arranged on the mounting plate in a penetrating manner; the mounting plate is provided with a driving assembly; a glue dispensing rod and a suction nozzle rod are respectively arranged on two sides of the lower end of the rotating shaft in a longitudinally sliding manner; the upper end of the dispensing rod is connected with a first connecting rod, and the upper end of the suction nozzle rod is connected with a second connecting rod; the middle part of the rotating shaft is provided with a transverse through hole and a movable rod penetrating through the through hole, two ends of the movable rod are provided with movable holes, longitudinal movable rings penetrate through the movable holes, and the two movable rings are respectively and fixedly connected with the upper ends of the first connecting rod and the second connecting rod; the lower surface of the mounting plate is fixedly provided with a positioning sleeve sleeved on the rotating shaft, and the edge of the bottom end of the positioning sleeve is processed with a convex cambered surface; by adopting the mode, the efficiency of die bonding production can be greatly improved, equipment is less, and the purchase cost and the development cost of a control system are greatly saved.
Description
Technical Field
The invention relates to the technical field of die bonding, in particular to a high-efficiency multi-station synchronous die bonding device and method.
Background
Die Bond or Die attach. Die bonding, i.e., bonding the wafer to a designated area of the support through a colloid (generally conductive adhesive or insulating adhesive for an LED), to form a thermal or electrical path, and provide conditions for subsequent wire bonding; at present, the die bonding operation is performed one by one, and the dispensing and wafer placing operation in each operation is also performed independently, so that the processing efficiency is extremely low, more equipment is required, and the equipment cost is higher.
Disclosure of Invention
The invention aims to solve the technical problem of providing an efficient multi-station synchronous die bonding device and method aiming at the defects in the prior art.
The technical scheme adopted by the invention for solving the technical problems is as follows:
the efficient multi-station synchronous die bonder comprises a support, a manipulator and a wafer positioning jig, wherein a transverse mounting plate is arranged at the movable end of the manipulator, and a plurality of longitudinal rotating shafts capable of rotating horizontally penetrate through the mounting plate; the mounting plate is provided with a driving assembly for driving the rotating shafts to synchronously rotate; a dispensing rod and a suction nozzle rod are respectively arranged on two sides of the lower end of the rotating shaft in a longitudinally sliding manner, and the dispensing rod and the suction nozzle rod are symmetrically distributed around the axis of the rotating shaft; the upper end of the dispensing rod is connected with a first connecting rod, and the upper end of the suction nozzle rod is connected with a second connecting rod; the middle part of the rotating shaft is provided with a transverse through hole and a movable rod penetrating through the through hole; a rotating shaft which is rotatably connected with the middle part of the movable rod is arranged in the through hole; two ends of the movable rod are provided with movable holes, longitudinal movable rings penetrate through the movable holes, and the two movable rings are fixedly connected with the upper ends of the first connecting rod and the second connecting rod respectively; the movable rod is positioned below the mounting plate, a positioning sleeve sleeved on the rotating shaft is fixedly arranged on the lower surface of the mounting plate, and a raised cambered surface for downwards abutting and limiting one end of the movable rod is machined at the edge of the bottom end of the positioning sleeve; and the rotating shaft is provided with an elastic component which keeps elastic pressing force on the movable rod.
The efficient multi-station synchronous die bonder is characterized in that the upper surface of the mounting plate is connected with a driving mounting plate for mounting the driving assembly through a plurality of connecting columns; a driven wheel is coaxially fixed at the upper end of the rotating shaft; a plurality of driving shafts penetrate through the driving mounting plate and are rotatably connected with the driving mounting plate; the lower end of the driving shaft is detachably connected with a driving wheel for driving the driven wheel, and the upper end of the driving shaft is provided with a synchronizing wheel; and the driving mounting plate is also provided with a speed reducing motor for driving the synchronous wheels to synchronously rotate.
The efficient multi-station synchronous die bonder is characterized in that a plurality of synchronous wheels are connected through synchronous belts.
The efficient multi-station synchronous die bonder is characterized in that sliding blocks are arranged on the glue dispensing rod and the suction nozzle rod, and sliding grooves which are in sliding connection with the sliding blocks correspondingly are arranged on the rotating shaft.
The efficient multi-station synchronous die bonder comprises an elastic assembly, a sliding block and a movable rod, wherein the elastic assembly comprises a spring sleeved on the rotating shaft, the lower end of the spring acts on the sliding block, and the upper end of the spring acts on the movable rod.
The efficient multi-station synchronous die bonder is characterized in that a first sliding ring is coaxially fixed at the upper end of the spring, the first sliding ring is longitudinally connected with the rotating shaft in a sliding mode, and the first sliding ring is tightly attached to the movable rod.
The efficient multi-station synchronous die bonder is characterized in that the lower surface of the movable rod is provided with an annular positioning groove corresponding to the first sliding ring.
The efficient multi-station synchronous die bonder is characterized in that a second sliding ring is coaxially fixed at the lower end of the spring, the second sliding ring is longitudinally connected with the rotating shaft in a sliding mode, and the second sliding ring acts on the higher sliding block.
The efficient multi-station synchronous die bonder is characterized in that a V-shaped positioning groove corresponding to the second sliding ring is formed in the sliding block.
A high-efficiency multi-station synchronous die bonding method comprises the following steps:
the first step is as follows: the manipulator drives the mounting plate to move to the wafer positioning jig, the driving assembly drives the plurality of rotating shafts to synchronously rotate in the moving process, so that one end of the movable rod, which is connected with the suction nozzle rod, is extruded by the convex cambered surface at the bottom end of the positioning sleeve, the suction nozzle rod slides downwards, and the dispensing rod moves upwards;
the second step is that: a plurality of suction nozzle rods synchronously suck the wafer from the wafer positioning jig;
the third step: the manipulator drives the mounting plate to move to the support, the driving assembly drives the rotating shafts to synchronously rotate 180 degrees in the moving process, the positions of the suction nozzle rod and the dispensing rod are exchanged, meanwhile, one end, connected with the dispensing rod, of the movable rod is extruded by the convex cambered surface at the bottom end of the positioning sleeve, the dispensing rod slides downwards, and the suction nozzle rod moves upwards;
the fourth step: the plurality of glue dispensing rods are used for synchronously dispensing glue on the support, the manipulator drives the mounting plate to move upwards for a certain distance after the glue dispensing is finished, the driving assembly drives the plurality of rotating shafts to synchronously rotate for 180 degrees, the positions of the suction nozzle rod and the glue dispensing rods are exchanged, meanwhile, one end, connected with the suction nozzle rod, of the movable rod is extruded by the convex cambered surface at the bottom end of the positioning sleeve, the suction nozzle rod slides downwards, and the glue dispensing rods move upwards;
the fifth step: the manipulator drives the mounting plate to move downwards, and the suction nozzle rod places the wafer on the dispensing position.
The invention has the beneficial effects that: the manipulator drives the mounting plate to move to the wafer positioning jig, the driving assembly drives the plurality of rotating shafts to synchronously rotate in the moving process, so that one end of the movable rod, which is connected with the suction nozzle rod, is extruded by the convex cambered surface at the bottom end of the positioning sleeve, the suction nozzle rod slides downwards, and the dispensing rod moves upwards; a plurality of suction nozzle rods synchronously suck the wafer from the wafer positioning jig; the manipulator drives the mounting plate to move to the support, the driving assembly drives the rotating shafts to synchronously rotate 180 degrees in the moving process, the positions of the suction nozzle rod and the dispensing rod are exchanged, meanwhile, one end, connected with the dispensing rod, of the movable rod is extruded by the convex cambered surface at the bottom end of the positioning sleeve, the dispensing rod slides downwards, and the suction nozzle rod moves upwards; the plurality of glue dispensing rods are used for synchronously dispensing glue on the support, the manipulator drives the mounting plate to move upwards for a certain distance after the glue dispensing is finished, the driving assembly drives the plurality of rotating shafts to synchronously rotate for 180 degrees, the positions of the suction nozzle rod and the glue dispensing rods are exchanged, meanwhile, one end, connected with the suction nozzle rod, of the movable rod is extruded by the convex cambered surface at the bottom end of the positioning sleeve, the suction nozzle rod slides downwards, and the glue dispensing rods move upwards; the manipulator drives the mounting plate to move downwards, and the suction nozzle rod places the wafer on the dispensing position; by adopting the mode of the application, the multi-station die bonding operation can be synchronously carried out, only one mechanical arm is needed, the moving stroke of the mechanical arm is extremely short, the operation of dispensing and placing the wafer only needs one-time positioning, so that the efficiency of die bonding production can be greatly improved, equipment is less, and the purchase cost and the development cost of a control system are greatly saved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described with reference to the accompanying drawings and embodiments, wherein the drawings in the following description are only part of the embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive efforts according to the accompanying drawings:
FIG. 1 is a schematic structural diagram of an efficient multi-station synchronous die bonder in accordance with a preferred embodiment of the present invention;
FIG. 2 is a partially enlarged view of the high-efficiency multi-station synchronous die bonder in accordance with the preferred embodiment of the present invention;
FIG. 3 is a flow chart of the method for high-efficiency multi-station synchronous die bonding according to the preferred embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without inventive step, are within the scope of the present invention.
The efficient multi-station synchronous die bonder in the preferred embodiment of the invention is shown in fig. 1 and comprises a bracket 1, a manipulator 2 and a wafer positioning jig 3, wherein a transverse mounting plate 4 is arranged at the movable end of the manipulator 2, and a plurality of longitudinal rotating shafts 5 which can horizontally rotate are arranged on the mounting plate 4 in a penetrating manner; the mounting plate 4 is provided with a driving assembly 6 for driving a plurality of rotating shafts to synchronously rotate; a dispensing rod 7 and a suction nozzle rod 8 are respectively arranged on two sides of the lower end of the rotating shaft 5 in a longitudinally sliding manner, and the dispensing rod 7 and the suction nozzle rod 8 are symmetrically distributed around the axis of the rotating shaft 5; the upper end of the glue dispensing rod 7 is connected with a first connecting rod 70, and the upper end of the suction nozzle rod 8 is connected with a second connecting rod 80; a transverse through hole and a movable rod 50 penetrating through the through hole are formed in the middle of the rotating shaft 5; a rotating shaft rotatably connected with the middle part of the movable rod 50 is arranged in the through hole; two ends of the movable rod 50 are respectively provided with a movable hole 500, a longitudinal movable ring 501 penetrates through the movable hole 500, and the two movable rings 501 are respectively and fixedly connected with the upper ends of the first connecting rod 70 and the second connecting rod 80; the movable rod 50 is positioned below the mounting plate 4, the lower surface of the mounting plate 4 is fixedly provided with a positioning sleeve 40 which is sleeved on the rotating shaft 5, and the edge of the bottom end of the positioning sleeve 40 is provided with a convex cambered surface which is used for downwards abutting and limiting one end of the movable rod 50; the rotating shaft 5 is provided with an elastic component 9 which keeps elastic pressing force on the movable rod 50;
the manipulator 2 drives the mounting plate 4 to move to the wafer positioning jig 3, the driving assembly drives the plurality of rotating shafts 5 to synchronously rotate in the moving process, so that one end of the movable rod 50 connected with the suction nozzle rod 8 is extruded by the convex cambered surface at the bottom end of the positioning sleeve 40, the suction nozzle rod 8 slides downwards, and the dispensing rod 7 moves upwards; a plurality of suction nozzle rods 8 synchronously suck the wafer from the wafer positioning jig 3; the manipulator 2 drives the mounting plate 4 to move to the support 1, the driving assembly 6 drives the rotating shafts 5 to synchronously rotate 180 degrees in the moving process, the positions of the suction nozzle rod 8 and the dispensing rod 7 are exchanged, meanwhile, one end, connected with the dispensing rod 7, of the movable rod 50 is extruded by the convex cambered surface at the bottom end of the positioning sleeve 40, the dispensing rod 7 slides downwards, and the suction nozzle rod 8 moves upwards; the dispensing rod 7 is used for synchronously dispensing the bracket 1, the manipulator 2 drives the mounting plate 4 to move upwards for a certain distance after dispensing is finished, the driving assembly 6 drives the rotating shafts 5 to synchronously rotate for 180 degrees, the positions of the suction nozzle rod 8 and the dispensing rod 7 are exchanged, meanwhile, one end of the movable rod 50 connected with the suction nozzle rod 8 is extruded by the convex cambered surface at the bottom end of the positioning sleeve 40, the suction nozzle rod 8 slides downwards, and the dispensing rod 7 moves upwards; the manipulator 2 drives the mounting plate 4 to move downwards, and the suction nozzle rod 8 places the wafer on the dispensing position; by adopting the mode, the multi-station die bonding operation can be synchronously carried out, only one manipulator is needed, the moving stroke of the manipulator is extremely short, and the dispensing and wafer placing operation only needs one-time positioning, so that the die bonding production efficiency can be greatly improved, equipment is less, and the purchase cost and the development cost of a control system are greatly saved;
when different positions need to be processed synchronously, the mounting plate of the rotating shaft with the corresponding position set can be adopted, and the universality and the usability are strong.
Preferably, the upper surface of the mounting plate 4 is connected with a driving mounting plate 42 for mounting the driving assembly 6 through a plurality of connecting columns 41; a driven wheel 51 is coaxially fixed at the upper end of the rotating shaft 5; a plurality of driving shafts 60 penetrate through the driving mounting plate 42, and the driving shafts 60 are rotatably connected with the driving mounting plate 42; the lower end of the driving shaft 60 is detachably connected with a driving wheel 61 for driving the driven wheel 51, and the upper end of the driving shaft 60 is provided with a synchronous wheel 62; the driving mounting plate 42 is also provided with a speed reducing motor 63 for driving a plurality of synchronous wheels to synchronously rotate; the plurality of synchronous wheels 62 are connected through a synchronous belt; the driving assembly 6 consists of a driving shaft, a driving wheel, a synchronizing wheel and a speed reducing motor;
when the synchronous driving device runs, the speed reducing motor drives the synchronous belt to move, so that the synchronous wheels are driven to rotate, the driving shaft and the driving wheel are driven to synchronously rotate, and the driven wheel and the rotating shaft are driven to synchronously rotate; overall structure is simple, simple to operate, and synchronous operation's precision is higher.
Preferably, the dispensing rod 7 and the nozzle rod 8 are both provided with a slide block 52, and the rotating shaft 5 is provided with a slide groove which is in sliding connection with the slide block 52 correspondingly; the operation stability is good, and the precision is high.
Preferably, the elastic assembly 9 comprises a spring 90 sleeved on the rotating shaft 5, the lower end of the spring 90 acts on the sliding block 52, and the upper end of the spring 90 acts on the movable rod 50; the structure is simple, the assembly is convenient, the movement stability of the movable rod can be improved, and the shake is reduced;
preferably, a first sliding ring 91 is coaxially fixed at the upper end of the spring 90, the first sliding ring 91 is longitudinally and slidably connected with the rotating shaft 5, and the first sliding ring 91 is tightly attached to the movable rod 50; the lower surface of the movable rod 50 is provided with an annular positioning groove 502 corresponding to the first sliding ring 91; the stability is good, and can provide comparatively reliable elastic force for the movable rod 50.
Preferably, a second sliding ring 92 is coaxially fixed at the lower end of the spring 90, the second sliding ring 92 is longitudinally and slidably connected with the rotating shaft 5, and the second sliding ring 92 acts on the higher one of the sliding blocks 52; the slide block 52 is provided with a V-shaped positioning groove 520 corresponding to the second sliding ring 92; the stability is good, can provide comparatively reliable elastic force for slider 52.
A high-efficiency multi-station synchronous die bonding method comprises the following steps:
s01: the manipulator drives the mounting plate to move to the wafer positioning jig, the driving assembly drives the plurality of rotating shafts to synchronously rotate in the moving process, so that one end of the movable rod, which is connected with the suction nozzle rod, is extruded by the convex cambered surface at the bottom end of the positioning sleeve, the suction nozzle rod slides downwards, and the dispensing rod moves upwards;
s02: a plurality of suction nozzle rods synchronously suck the wafer from the wafer positioning jig;
s03: the manipulator drives the mounting plate to move to the support, the driving assembly drives the rotating shafts to synchronously rotate 180 degrees in the moving process, the positions of the suction nozzle rod and the dispensing rod are exchanged, meanwhile, one end, connected with the dispensing rod, of the movable rod is extruded by the convex cambered surface at the bottom end of the positioning sleeve, the dispensing rod slides downwards, and the suction nozzle rod moves upwards;
s04: the plurality of glue dispensing rods are used for synchronously dispensing glue on the support, the manipulator drives the mounting plate to move upwards for a certain distance after the glue dispensing is finished, the driving assembly drives the plurality of rotating shafts to synchronously rotate for 180 degrees, the positions of the suction nozzle rod and the glue dispensing rods are exchanged, meanwhile, one end, connected with the suction nozzle rod, of the movable rod is extruded by the convex cambered surface at the bottom end of the positioning sleeve, the suction nozzle rod slides downwards, and the glue dispensing rods move upwards;
s05: the manipulator drives the mounting plate to move downwards, and the suction nozzle rod places the wafer on the dispensing position;
by adopting the mode of the application, the multi-station die bonding operation can be synchronously carried out, the moving stroke of the manipulator is extremely short only by one manipulator, the operation of dispensing and placing the wafer only needs one-time positioning, so that the efficiency of die bonding production can be greatly improved, equipment is less, and the purchase cost and the development cost of a control system are greatly saved.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (8)
1. A high-efficiency multi-station synchronous die bonder comprises a bracket, a manipulator and a wafer positioning jig, and is characterized in that a transverse mounting plate is arranged at the movable end of the manipulator, and a plurality of longitudinal rotating shafts capable of rotating horizontally penetrate through the mounting plate; the mounting plate is provided with a driving assembly for driving the rotating shafts to synchronously rotate; a dispensing rod and a suction nozzle rod are respectively arranged on two sides of the lower end of the rotating shaft in a longitudinally sliding manner, and the dispensing rod and the suction nozzle rod are symmetrically distributed around the axis of the rotating shaft; the upper end of the dispensing rod is connected with a first connecting rod, and the upper end of the suction nozzle rod is connected with a second connecting rod; the middle part of the rotating shaft is provided with a transverse through hole and a movable rod penetrating through the through hole; a rotating shaft which is rotatably connected with the middle part of the movable rod is arranged in the through hole; two ends of the movable rod are provided with movable holes, longitudinal movable rings penetrate through the movable holes, and the two movable rings are fixedly connected with the upper ends of the first connecting rod and the second connecting rod respectively; the movable rod is positioned below the mounting plate, a positioning sleeve sleeved on the rotating shaft is fixedly arranged on the lower surface of the mounting plate, and a raised cambered surface for downwards abutting and limiting one end of the movable rod is machined at the edge of the bottom end of the positioning sleeve; the rotating shaft is provided with an elastic component which keeps elastic pressing force on the movable rod; the dispensing rod and the suction nozzle rod are both provided with sliding blocks, and the rotating shaft is provided with sliding chutes correspondingly connected with the sliding blocks in a sliding manner; the elastic component comprises a spring which is sleeved on the rotating shaft, the lower end of the spring acts on the sliding block, and the upper end of the spring acts on the movable rod.
2. The efficient multi-station synchronous die bonder of claim 1, wherein the upper surface of the mounting plate is connected with a driving mounting plate for mounting the driving assembly through a plurality of connecting columns; a driven wheel is coaxially fixed at the upper end of the rotating shaft; a plurality of driving shafts penetrate through the driving mounting plate and are rotatably connected with the driving mounting plate; the lower end of the driving shaft is detachably connected with a driving wheel for driving the driven wheel, and the upper end of the driving shaft is provided with a synchronizing wheel; and the driving mounting plate is also provided with a speed reducing motor for driving the synchronous wheels to synchronously rotate.
3. An efficient multi-station synchronous die bonder as claimed in claim 2, wherein said plurality of synchronizing wheels are connected by a synchronous belt.
4. An efficient multi-station synchronous die bonder as claimed in claim 1, wherein a first sliding ring is coaxially fixed at the upper end of the spring, the first sliding ring is longitudinally and slidably connected with the rotating shaft, and the first sliding ring is tightly attached to the movable rod.
5. An efficient multi-station synchronous die bonder as claimed in claim 4, wherein the lower surface of the movable rod is provided with an annular positioning groove corresponding to the first sliding ring.
6. An efficient multi-station synchronous die bonder as claimed in claim 4, wherein a second sliding ring is coaxially fixed at the lower end of the spring, the second sliding ring is longitudinally and slidably connected with the rotating shaft, and the second sliding ring acts on a higher one of the slide blocks.
7. An efficient multi-station synchronous die bonder as claimed in claim 6, wherein a V-shaped positioning groove corresponding to the second sliding ring is arranged on the sliding block.
8. An efficient multi-station synchronous die bonding method according to any one of claims 1 to 7, which is characterized by comprising the following steps:
the first step is as follows: the manipulator drives the mounting plate to move to the wafer positioning jig, the driving assembly drives the plurality of rotating shafts to synchronously rotate in the moving process, so that one end of the movable rod, which is connected with the suction nozzle rod, is extruded by the convex cambered surface at the bottom end of the positioning sleeve, the suction nozzle rod slides downwards, and the dispensing rod moves upwards;
the second step is that: a plurality of suction nozzle rods synchronously suck the wafer from the wafer positioning jig;
the third step: the manipulator drives the mounting plate to move to the support, the driving assembly drives the rotating shafts to synchronously rotate 180 degrees in the moving process, the positions of the suction nozzle rod and the dispensing rod are exchanged, meanwhile, one end, connected with the dispensing rod, of the movable rod is extruded by the convex cambered surface at the bottom end of the positioning sleeve, the dispensing rod slides downwards, and the suction nozzle rod moves upwards;
the fourth step: the plurality of glue dispensing rods are used for synchronously dispensing glue on the support, the manipulator drives the mounting plate to move upwards for a certain distance after the glue dispensing is finished, the driving assembly drives the plurality of rotating shafts to synchronously rotate for 180 degrees, the positions of the suction nozzle rod and the glue dispensing rods are exchanged, meanwhile, one end, connected with the suction nozzle rod, of the movable rod is extruded by the convex cambered surface at the bottom end of the positioning sleeve, the suction nozzle rod slides downwards, and the glue dispensing rods move upwards;
the fifth step: the manipulator drives the mounting plate to move downwards, and the suction nozzle rod places the wafer on the dispensing position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010971527.4A CN111933555B (en) | 2020-09-16 | 2020-09-16 | Efficient multi-station synchronous die bonding device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010971527.4A CN111933555B (en) | 2020-09-16 | 2020-09-16 | Efficient multi-station synchronous die bonding device and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111933555A CN111933555A (en) | 2020-11-13 |
| CN111933555B true CN111933555B (en) | 2021-02-19 |
Family
ID=73333769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010971527.4A Active CN111933555B (en) | 2020-09-16 | 2020-09-16 | Efficient multi-station synchronous die bonding device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111933555B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112563214B (en) * | 2020-12-11 | 2022-08-09 | 深圳平晨半导体科技有限公司 | Chip is spread to glue and is shaken even device |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204272590U (en) * | 2014-12-14 | 2015-04-15 | 李涛涛 | The full-automatic apparatus for assembling of a kind of circuit board |
| CN110402621B (en) * | 2017-03-08 | 2021-08-03 | 株式会社富士 | Three-dimensional mounting device and three-dimensional mounting method |
| CN107249295B (en) * | 2017-06-01 | 2020-07-10 | 广东天机工业智能系统有限公司 | Copper foil pasting device |
| CN207320151U (en) * | 2017-07-27 | 2018-05-04 | 深圳市新益昌自动化设备有限公司 | A kind of die bond mechanism of LED bonders |
| CN107689403B (en) * | 2017-09-27 | 2024-03-01 | 无锡奥特维科技股份有限公司 | Centralized processing equipment for sheet bodies |
| TWI666972B (en) * | 2017-09-29 | 2019-07-21 | 美商科斯莫燈飾公司 | Lighting circuit with time control function |
| US20200075364A1 (en) * | 2018-09-05 | 2020-03-05 | Ke Huang Corporation | Glue dispensing apparatus |
| CN210778668U (en) * | 2019-12-10 | 2020-06-16 | 深圳新益昌科技股份有限公司 | Horizontal 180-degree double-swing-arm die bonding structure |
-
2020
- 2020-09-16 CN CN202010971527.4A patent/CN111933555B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN111933555A (en) | 2020-11-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3813022A (en) | Wire bonder apparatus | |
| CN111933555B (en) | Efficient multi-station synchronous die bonding device and method | |
| CN110165038B (en) | Novel LED die bonder and die bonder method thereof | |
| CN105345199A (en) | Multi-station automatic cutting and feeding mechanism for tin pieces | |
| US11410870B2 (en) | Die attach systems, and methods of attaching a die to a substrate | |
| CN113458762A (en) | Assembly equipment with automatic pressure maintaining function | |
| CN112894825A (en) | Industrial robot visual identification control system and method | |
| KR102068358B1 (en) | Semiconductor die detachment apparatus | |
| CN105789101B (en) | Chip supply mechanism and chip bonding machine | |
| CN216402686U (en) | Workpiece conveying device | |
| CN115172217A (en) | Die bonder with single-head four swing arms of semiconductor die bonder | |
| CN214602855U (en) | Positioning tool for ball welding processing | |
| CN216070880U (en) | Silica gel sucking disc pastes and signs device | |
| CN216039285U (en) | Positioning and cutting tool for special-shaped optical lens | |
| CN106787480B (en) | Lead wire shaping assembly device | |
| CN215617797U (en) | Pressure maintaining carrier for adjusting and assembling earphone flat cable | |
| CN210778672U (en) | Horizontal rotation double-swing-arm die bonder | |
| CN2675355Y (en) | Double degree of freedom moveable parallel robot mechanism | |
| CN2700064Y (en) | Two freedom degree moving plane parallel mechanism | |
| CN111933562A (en) | High-precision intelligent sorting equipment | |
| CN219759536U (en) | Annular die bonder | |
| CN111828581A (en) | Waiting mechanism for upper station and lower station and control mode thereof | |
| CN220341190U (en) | Transmission device for chip bonding | |
| CN211469992U (en) | Material moving device | |
| CN219293222U (en) | Fan assembling device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |