CN219759536U

CN219759536U - Annular die bonder

Info

Publication number: CN219759536U
Application number: CN202321102172.0U
Authority: CN
Inventors: 邓应铖; 陆元鹏; 吴勇
Original assignee: Shenzhen Zhuoxing Semiconductor Technology Co ltd
Current assignee: Shenzhen Zhuoxing Semiconductor Technology Co ltd
Priority date: 2023-05-10
Filing date: 2023-05-10
Publication date: 2023-09-26
Anticipated expiration: 2033-05-10

Abstract

The utility model belongs to the field of die bonders, and particularly relates to an annular die bonder, which comprises: a frame; the die bonding support is provided with an annular track; the die bonding platform is arranged on the frame, the number of the die bonding platforms is two, and the die bonding platforms are respectively positioned below the annular track; the die bonding device is arranged on the annular track and is in sliding connection with the annular track. According to the utility model, the annular track is provided with the die bonding device, the die bonding device can move along the circumferential direction of the annular track, when the die bonding device moves to the position above the die picking table, the die bonding device takes out the die on the die picking table, and when the die bonding device moves to the position above the die bonding table, the die bonding device places the die obtained by the die bonding device at the corresponding position on the substrate, so that the movement of the substrate is reduced, the working efficiency is improved, and the production requirement of a large-scale substrate is met.

Description

Annular die bonder

Technical Field

The utility model belongs to the field of die bonders, and particularly relates to an annular die bonder.

Background

As is known in the art, die bonding is an extremely important step in the packaging of semiconductor devices such as ICs and LEDs. The process of die bonding is as follows: firstly, dispensing is performed on a die bonding station of a substrate by a dispensing mechanism, and then a die picking swing arm of a die bonding head is used for taking out a semiconductor crystal grain from a wafer, and then the semiconductor crystal grain is transferred to the die bonding station after dispensing. At present, a chip bonder on the market generally moves a substrate continuously in the operation process, so that a wafer on a chip bonding head is placed at a preset position. However, in the above-described solution, when working on a large substrate, the movement speed is slow because the large substrate is heavy, and the production efficiency is low, so that the production requirement cannot be satisfied.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model provides the annular die bonder, which has the advantages of simple structure, convenient operation and high working efficiency, and can meet the production requirement of a large substrate, and solves the problems that the existing die bonder has low moving speed and low production efficiency and cannot meet the production requirement when aiming at the operation of the large substrate.

In order to solve the technical problems, the utility model provides the following technical scheme:

an annular die bonder, comprising:

a frame;

the die bonding support is arranged at the top of the frame and is provided with an annular track;

the die bonding platform is arranged on the frame, is in sliding connection with the frame and is positioned below the annular track;

the number of the crystal taking tables is two, the two crystal taking tables are respectively arranged at two sides of the crystal fixing platform, and the crystal taking tables are respectively positioned below the annular track;

the die bonding device is arranged on the annular track and is in sliding connection with the annular track;

the die bonding device circularly moves along the circumferential direction of the annular track on the die bonding support, when the die bonding device moves to the corresponding position of the die picking platform, the die bonding device takes out the die on the die picking platform, and when the die bonding device moves to the corresponding position of the die bonding platform, the die bonding device places the die picking device at the corresponding position.

Further, the number of the die bonding devices is multiple, and the die bonding devices are uniformly arranged along the circumferential direction of the annular track.

Further, the die bonding device comprises a first driving mechanism, the output end of the first driving mechanism is connected with the annular track, a second driving mechanism is arranged on the first driving mechanism, the output end of the second driving mechanism faces the direction of the frame, and a die bonding head is arranged at the output end of the second driving mechanism.

Further, the die bonding platform comprises a linear drive, the output end of the linear drive is fixedly connected with a die bonding bottom plate, the die bonding bottom plate is in sliding connection with the frame, a rotary drive is arranged on the die bonding bottom plate, the output end of the rotary drive is provided with a die bonding seat, and the die bonding seat is located between the rotary drive and the annular track.

Further, get brilliant platform includes getting brilliant support, get and be provided with on the brilliant support and get brilliant portion, get brilliant below and be provided with the thimble assembly.

Further, the thimble assembly comprises a thimble body, and a crystal taking lens is arranged on the crystal fixing support corresponding to the thimble body.

Further, the number of the thimble bodies is multiple, the number of the crystal taking lenses is the same as that of the thimble bodies, and the crystal taking lenses are respectively positioned at the positions corresponding to the thimble bodies.

Further, the die-bonding support is further provided with two die-bonding lens assemblies, and the die-bonding lens assemblies are respectively arranged at corresponding positions on two sides of the die-bonding support.

Further, the die-bonding lens assembly comprises a lens support, a lens body is arranged on the lens support, the lens body is in sliding connection with the lens support, a lens drive is further arranged on the lens support, and an output end of the lens drive is connected with the lens body.

By the technical scheme, the utility model provides the annular die bonder, which at least comprises the following components

The beneficial effects are that:

this solid brilliant machine of annular is through setting up solid brilliant support, is provided with the annular track on the solid brilliant support, is provided with solid brilliant device on the annular track, and solid brilliant device and annular track sliding connection to make solid brilliant device can follow the orbital circumferencial direction motion of annular, when solid brilliant device removes to get brilliant bench side, solid brilliant device will get the wafer that brilliant bench and take out, when solid brilliant device removes to solid brilliant bench side, solid brilliant device puts the wafer that it obtained to the substrate on the corresponding position, thereby reduces the removal of substrate, improves work efficiency, satisfies the production demand of large-scale substrate.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model, illustrate and together with the description serve to explain a part of the utility model:

FIG. 1 is a schematic view of a first angle structure of a ring-shaped die bonder according to an embodiment of the present utility model;

FIG. 2 is a schematic diagram of a second angle structure of the annular die bonder according to the embodiment of the utility model;

fig. 3 is a schematic view of a third angle structure of the annular die bonder according to the embodiment of the utility model.

In the figure: 100. a frame; 200. a die bonding bracket; 300. an endless track; 400. a die bonding platform; 410. driving linearly; 420. a die bonding bottom plate; 430. rotationally driving; 440. a crystal fixing seat; 500. a crystal taking table; 600. a die bonding device; 700. a thimble assembly; 800. taking a crystal lens; 900. a die attach lens assembly; 910. a lens holder; 920. a lens body; 930. and (5) driving the lens.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1 to 3, the annular die bonder provided in the embodiment of the utility model mainly includes a frame 100, a die bonding support 200, a die bonding platform 400, a die picking platform 500 and a die bonding device 600. Wherein a table is provided on top of the frame 100. The die bonding support 200 is fixedly connected to the top of the workbench at the top of the frame 100, and the die bonding support 200 is provided with an annular track 300. The die bonding platform 400 is used for placing a substrate to be die bonded, the die bonding platform 400 is arranged on a workbench at the top of the frame 100, the die bonding platform 400 is in sliding connection with the frame 100, and the die bonding platform 400 is located below the annular track 300. The wafer taking tables 500 are used for providing wafers, the number of the wafer taking tables 500 is two, the two wafer taking tables 500 are respectively arranged at two sides of the die bonding table 400, and the wafer taking tables 500 are respectively arranged below the annular track 300.

When the die bonding device 600 moves along the circumferential direction of the annular track 300 on the die bonding support 200, when the die bonding device 600 moves to the corresponding position above the die bonding table 500 on one side, the die bonding device 600 removes the die on the die bonding table 500, then the die bonding device 600 continues to move along the circumferential direction of the annular track 300, when the die bonding device 600 moves to the corresponding position above the die bonding table 400, the die bonding device 600 places the die obtained by the die bonding device 600 at the corresponding position on the substrate on the die bonding device 600, thereby completing one die bonding, then the die bonding device 600 continues to move along the circumferential direction of the annular track 300, so that the die bonding device 600 moves to the corresponding position above the die bonding table 500 on the other side for the second time, after the second die bonding is completed, the die bonding device 600 continues to move, and the die obtained by the die bonding device is placed on the substrate again when the die bonding device moves to the corresponding position above the die bonding table 400 again, the die bonding device returns to the initial position again, the die bonding of the next round is realized, the die bonding device 600 moves along the circumferential direction of the annular track 300, thereby reducing the number of times of cycle movement of the substrate, and greatly meeting the requirement of production.

The number of the die bonding devices 600 is plural, and the die bonding devices 600 are uniformly arranged along the circumferential direction of the annular track 300, so that the die bonding devices 600 work synchronously, and the working efficiency is improved.

Illustratively, the die bonding apparatus 600 includes a first driving mechanism, an output end of the first driving mechanism is connected to the annular track 300, a second driving mechanism is disposed on the first driving mechanism, an output end of the second driving mechanism faces the direction of the frame 100, and a die bonding head is disposed at an output end of the second driving mechanism, and is used for picking and placing the die. It should be noted that, the first driving mechanism drives the second driving mechanism through the output end thereof to drive the die bonding head to move along the circumferential direction of the annular track 300.

The die bonding platform 400 includes a branch line driver, an output end of the branch line driver is fixedly connected with a die bonding bottom plate 420, the die bonding bottom plate 420 is slidably connected with the frame 100, a rotation driver 430 is further disposed on the die bonding bottom plate 420, an output end of the rotation driver 430 is provided with a die bonding seat 440, the die bonding seat 440 is located between the rotation driver 430 and the annular track 300, the die bonding seat 440 is used for placing a substrate, the substrate is die bonded on the die bonding seat 440, an output end of the linear driver 410 is used for driving the substrate to move linearly, and an output end of the rotation driver 430 is used for driving the substrate to move rotationally.

Illustratively, the wafer taking table 500 includes a wafer taking support, a wafer taking part is disposed on the wafer taking support, the wafer taking part is used for placing a wafer, a thimble assembly 700 is disposed at the bottom of the wafer taking part, and the thimble assembly 700 is used for jacking up the wafer so that the wafer is taken out by the die bonding head.

Specifically, the ejector pin assembly 700 comprises an ejector pin body, the die attach bracket 200 is further provided with a die taking lens 800 at a position corresponding to the ejector pin body, the die taking lens 800 is convenient for positioning the die, and the die taking accuracy of the die attach head is improved.

The die bonding support 200 is further provided with two die bonding lens assemblies 900, and the two die bonding lens assemblies 900 are respectively arranged at corresponding positions on two sides of the die bonding support 200, so that the positions of the die bonding lens for placing the die bonding head are confirmed, and the accuracy of die bonding is improved.

The die-attach lens assembly 900 includes a lens holder 910, a lens body 920 is disposed on the lens holder 910, the lens body 920 is slidably connected with the lens holder 910, a lens driver 930 is further disposed on the lens holder 910, and an output end of the lens driver 930 is connected with the lens body 920.

It should be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An annular die bonder, comprising:

a frame (100);

the die bonding support (200) is arranged at the top of the frame (100), and an annular track (300) is arranged on the die bonding support (200);

the die bonding platform (400) is arranged on the frame (100), the die bonding platform (400) is connected with the frame (100) in a sliding manner, and the die bonding platform (400) is positioned below the annular track (300);

the number of the crystal taking tables (500) is two, the two crystal taking tables (500) are respectively arranged at two sides of the crystal fixing platform (400), and the crystal taking tables (500) are respectively arranged below the annular track (300);

the die bonding device (600), the die bonding device (600) is arranged on the annular track (300), and the die bonding device (600) is connected with the annular track (300) in a sliding manner;

the die bonding device (600) circularly moves along the circumferential direction of the annular track (300) on the die bonding support (200), when the die bonding device (600) moves to the corresponding position of the die picking table (500), the die bonding device (600) takes out the die on the die picking table (500), and when the die bonding device (600) moves to the corresponding position of the die bonding platform (400), the die bonding device (600) places the die picking device to the corresponding position.

2. The annular die bonder according to claim 1, wherein the number of die bonding devices (600) is plural, and the die bonding devices (600) are uniformly arranged along the circumferential direction of the annular track (300).

3. The annular die bonder according to claim 2, wherein the die bonder (600) comprises a first driving mechanism, an output end of the first driving mechanism is connected with the annular track (300), a second driving mechanism is arranged on the first driving mechanism, an output end of the second driving mechanism faces the direction of the frame (100), and a die bonder head is arranged at an output end of the second driving mechanism.

4. The annular die bonder according to claim 1, wherein the die bonding platform (400) comprises a linear drive (410), an output end of the linear drive (410) is fixedly connected with a die bonding base plate (420), the die bonding base plate (420) is slidably connected with the frame (100), a rotary drive (430) is arranged on the die bonding base plate (420), a die bonding seat (440) is arranged at an output end of the rotary drive (430), and the die bonding seat (440) is located between the rotary drive (430) and the annular track (300).

5. The annular die bonder according to claim 1, wherein the die-picking stage (500) comprises a die-picking support, a die-picking part is arranged on the die-picking support, and a thimble assembly (700) is arranged below the die-picking part.

6. The annular die bonder according to claim 5, wherein the ejector pin assembly (700) comprises an ejector pin body, and a die pick-up lens (800) is disposed on the die bonding bracket (200) at a position corresponding to the ejector pin body.

7. The annular die bonder according to claim 6, wherein the number of the ejector pin bodies is plural, the number of the die taking lenses (800) is the same as the number of the ejector pin bodies, and the die taking lenses (800) are respectively located at the positions corresponding to the ejector pin bodies.

8. The annular die bonder according to claim 1, wherein die bonder bracket (200) is further provided with die bonder lens assemblies (900), the number of die bonder lens assemblies (900) is two, and die bonder lens assemblies (900) are respectively arranged at corresponding positions on two sides of die bonder bracket (200).

9. The annular die bonder according to claim 8, wherein the die bonder lens assembly (900) comprises a lens holder (910), a lens body (920) is disposed on the lens holder (910), the lens body (920) is slidably connected with the lens holder (910), a lens drive (930) is further disposed on the lens holder (910), and an output end of the lens drive (930) is connected with the lens body (920).