CN217114320U - Height packaging table for welding head capable of shortening length of swing arm - Google Patents
Height packaging table for welding head capable of shortening length of swing arm Download PDFInfo
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- CN217114320U CN217114320U CN202123218754.9U CN202123218754U CN217114320U CN 217114320 U CN217114320 U CN 217114320U CN 202123218754 U CN202123218754 U CN 202123218754U CN 217114320 U CN217114320 U CN 217114320U
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- bonding tool
- swing arm
- transport mechanism
- welding head
- board
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Abstract
The utility model discloses a shorten height encapsulation platform of swing arm length bonding tool, it includes board, brilliant round platform, bonding tool mechanism and transport mechanism, transport mechanism with brilliant round platform all sets up the board top, transport mechanism follows the length direction of board arranges, just the wafer platform is located one side of transport mechanism, transport mechanism's top is higher than the top of brilliant round platform, be provided with the mounting bracket on the board, bonding tool mechanism sets up on the mounting bracket, bonding tool mechanism includes slide and bonding tool, the slide is connected the bottom of mounting bracket, the bonding tool can be dismantled the connection and be in on the slide, the bonding tool is used for carrying the product on the wafer bench transport mechanism is last. The utility model discloses it is low to compare in prior art can solve bonding tool swing arm length overlength, subsides dress precision, leads to reducing the problem that production efficiency is low.
Description
Technical Field
The utility model relates to a chip package technical field especially relates to a shorten height encapsulation platform of swing arm length bonding tool.
Background
In the current chip packaging equipment, the movement of the chip mounting welding head mechanism is generally controlled by a motor to complete the processes of taking out the wafer and mounting the chip. However, in the process of carrying the chip, because different stations are positioned at the same height, the length of the swing arm is increased, the problem of mounting is caused, and the production efficiency is seriously influenced, so that the chip is developed and applied in a novel high-low packaging table mode of a welding head for shortening the length of the swing arm.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a: the height packaging table for the welding head with the shortened swing arm length is provided in order to solve the problem that the production efficiency is reduced due to the fact that the welding head swing arm is too long and low in mounting precision.
In order to realize the purpose, the utility model adopts the following technical scheme: the utility model provides a shorten height encapsulation platform of swing arm length bonding tool, its includes board, brilliant round platform, bonding tool mechanism and transport mechanism, transport mechanism with the brilliant round platform all sets up the board top, transport mechanism follows the length direction of board arranges, just the wafer platform is located one side of transport mechanism, transport mechanism's top is higher than the top of brilliant round platform, be provided with the mounting bracket on the board, bonding tool mechanism sets up on the mounting bracket, bonding tool mechanism includes slide and bonding tool, the slide is connected the bottom of mounting bracket, the bonding tool is used for carrying the product of wafer bench to transport mechanism is last.
As a further description of the above technical solution:
the sliding seat comprises an XY-axis sliding table and a Z-axis servo driving mechanism, the XY-axis sliding table is connected to the bottom of the mounting frame, the Z-axis servo driving mechanism is vertically connected to the XY-axis sliding table, and the welding head is detachably connected to the Z-axis servo driving mechanism.
As a further description of the above technical solution:
the Z-axis servo driving mechanism comprises a servo motor, the servo motor drives a Z-direction moving device through a speed reducer, and the Z-direction moving device is a motor cam.
As a further description of the above technical solution:
the Z-axis servo driving mechanism is provided with a connecting plate, the connecting plate is provided with a connecting rod, and the connecting rod is provided with a detection camera.
As a further description of the above technical solution:
the connecting rod is rotatably connected with a connecting seat, and the detection camera is detachably connected to the connecting seat.
As a further description of the above technical solution:
and a locking rod is arranged on the connecting seat.
As a further description of the above technical solution:
the transmission mechanism is a linear module transmission line.
To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that: the height of the top of the wafer platform is lower than that of the top of the conveying mechanism, so that the swing arm welding heads can be shortened in the process of taking and loading wafers by the welding heads, production efficiency can be improved, particularly, after the welding heads take the wafers from the wafer platform, the Z-axis servo driving mechanism moves upwards to drive the welding heads to move upwards, then the Z-axis servo driving mechanism directly translates to the upper side of the conveying mechanism, and after assembly is completed, the Z-axis servo driving mechanism translates to the upper side of the wafer platform and then moves downwards to take the wafers to complete a working cycle.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a high-low packaging table of a welding head for shortening the length of a swing arm.
Fig. 2 is a schematic structural diagram of a welding head mechanism in a high-low packaging table of a welding head with a shortened swing arm length.
Fig. 3 is a top view of a high and low encapsulation station for a swing arm length shortened horn.
Illustration of the drawings:
1. a machine platform; 2. a wafer stage; 3. a welding head mechanism; 31. a slide base; 311. a welding head; 312. a Z-axis servo drive mechanism; 32. a welding head; 4. a transport mechanism; 5. a mounting frame; 6. a connecting plate; 7. a connecting rod; 8. detecting a camera; 9. a connecting seat; 10. a locking lever.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides a shorten height encapsulation platform of swing arm length bonding tool, includes board 1, brilliant round platform 2, bonding tool mechanism 3 and transport mechanism 4, transport mechanism 4 with brilliant round platform 2 all sets up 1 top of board, transport mechanism 4 is followed the length direction of board 1 arranges, just brilliant round platform 2 is located one side of transport mechanism 4, the top of transport mechanism 4 is higher than the top of brilliant round platform 2, be provided with mounting bracket 5 on the board 1, bonding tool mechanism 3 sets up on the mounting bracket 5, bonding tool mechanism 3 includes slide 31 and bonding tool 32, slide 31 is connected the bottom of mounting bracket 5, the bonding tool can be dismantled the connection and be in on the slide 31, bonding tool 32 is used for carrying the product on the brilliant round platform 2 to transport mechanism 4 is last.
The sliding seat 31 comprises a groove 311 and a Z-axis servo driving mechanism 312, the XY-axis sliding table 311 is connected to the bottom of the mounting frame 5, the Z-axis servo driving mechanism 312 is vertically connected to the XY-axis sliding table 311, and the welding head 32 is detachably connected to the Z-axis servo driving mechanism 312. The XY axis sliding table can realize the front-back and left-right movement of the welding head, thereby improving the welding quality.
The Z-axis servo driving mechanism 312 includes a servo motor, and the servo motor drives a Z-direction moving device, which is a motor cam, through a speed reducer. The Z-axis servo driving mechanism is the prior art and is not described in detail, and the Z-axis servo driving mechanism drives the welding head to move up and down to realize the up-and-down transfer of products.
Set up connecting plate 6 on the servo actuating mechanism 312 of Z axle, be provided with connecting rod 7 on the connecting plate 6, be provided with on the connecting rod 7 and detect camera 8. The product can be detected, so that the abnormity can be found in time, and the production quality is improved.
The connecting rod 7 is rotatably connected with a connecting seat 9, and the detection camera 8 is detachably connected to the connecting seat 9. The camera is convenient to install, maintain and detect.
The connecting seat 9 is provided with a locking rod 10. Can be after adjusting the connecting seat, the connecting seat is avoided the connecting seat to remove to the fixed connection seat.
The conveying mechanism 4 is a linear module conveying line.
The working principle is as follows: through the height that is less than the transport mechanism top with the top height setting of brilliant round platform, get the brilliant at the bonding tool, the in-process of loading, swing arm length bonding tool can shorten, thereby can improve production efficiency, it is concrete, the bonding tool gets the material back from brilliant round platform, Z axle servo drive mechanism goes upward to drive the bonding tool and goes upward, then direct translation is to the transport mechanism top, the back is accomplished in the equipment, in translation to brilliant round platform top, get down again and expect to accomplish a duty cycle, the bonding tool only need go upward once and a descending action in a duty cycle, and current bonding tool need go upward earlier, down, go upward again at last, therefore, the utility model discloses can shorten the swing arm bonding tool.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. The utility model provides a shorten height encapsulation platform of swing arm length bonding tool, a serial communication port, including board (1), wafer platform (2), bonding tool mechanism (3) and transport mechanism (4), transport mechanism (4) with wafer platform (2) all set up board (1) top, transport mechanism (4) are followed the length direction of board (1) arranges, just wafer platform (2) are located one side of transport mechanism (4), the top of transport mechanism (4) is higher than the top of wafer platform (2), be provided with mounting bracket (5) on board (1), bonding tool mechanism (3) set up on mounting bracket (5), bonding tool mechanism (3) include slide (31) and bonding tool (32), slide (31) are connected the bottom of mounting bracket (5), the bonding tool can dismantle the connection on slide (31), the welding head (32) is used for conveying the products on the wafer platform (2) to the conveying mechanism (4).
2. The high-low encapsulation station of the swing arm length shortened welding head according to claim 1, characterized in that the sliding seat (31) comprises an XY-axis sliding table (311) and a Z-axis servo driving mechanism (312), the XY-axis sliding table (311) is connected to the bottom of the mounting frame (5), the Z-axis servo driving mechanism (312) is vertically connected to the XY-axis sliding table (311), and the welding head (32) is detachably connected to the Z-axis servo driving mechanism (312).
3. The encapsulation station for the welding head with the shortened swing arm length is characterized in that a connecting plate (6) is arranged on the Z-axis servo driving mechanism (312), a connecting rod (7) is arranged on the connecting plate (6), and a detection camera (8) is arranged on the connecting rod (7).
4. The encapsulation station for the welding head with the shortened length of the swing arm according to claim 3, wherein the connecting rod (7) is rotatably connected with a connecting seat (9), and the detection camera (8) is detachably connected with the connecting seat (9).
5. The encapsulation station for the welding head with the shortened length of the swing arm according to claim 4, wherein the connecting seat (9) is provided with a locking rod (10).
6. The high-low encapsulation station for a shortened swing arm length bonding tool of claim 1, wherein the transfer mechanism (4) is a linear die set transfer line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123218754.9U CN217114320U (en) | 2021-12-20 | 2021-12-20 | Height packaging table for welding head capable of shortening length of swing arm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123218754.9U CN217114320U (en) | 2021-12-20 | 2021-12-20 | Height packaging table for welding head capable of shortening length of swing arm |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217114320U true CN217114320U (en) | 2022-08-02 |
Family
ID=82591035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123218754.9U Active CN217114320U (en) | 2021-12-20 | 2021-12-20 | Height packaging table for welding head capable of shortening length of swing arm |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217114320U (en) |
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2021
- 2021-12-20 CN CN202123218754.9U patent/CN217114320U/en active Active
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